A diode and a method of manufacturing the same

Abstract

A diode includes a housing, a bonding wire, a chip, a housing base, a housing lead, and a current discharge module. The current discharge module and the chip are located inside the housing and are arranged sequentially from top to bottom on the housing base. One end of the bonding wire is connected to the current discharge module, and the other end is connected to the housing lead. The projected area of ​​the current discharge module on the chip is larger than the projected area of ​​the bonding wire on the chip. The diode is fabricated by: fixing one side of the chip to the housing base; fixing one end of the current discharge module to the other side of the chip; connecting one end of the bonding wire to the other end of the current discharge module, and connecting the other end of the bonding wire to the housing lead, thus completing the diode fabrication. This diode fabrication is rapid. The current discharge module between the bonding wire and the chip effectively alleviates concentrated current, disperses current density, and significantly improves the diode's surge current resistance.

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