Thin plate loop heat pipe

Abstract

The present invention relates to the technical field of heat dissipation devices, and in particular to a thin-plate loop heat pipe, comprising a shell, the shell comprising a first shell plate and a second shell plate that are relatively covered and sealed at the edges, an evaporation chamber, a vapor channel, a condensation chamber, a liquid channel, a compensation chamber, and an auxiliary fluid channel formed between the first shell plate and the second shell plate, a liquid working medium stored in the compensation chamber, a first capillary structure that separates the evaporation chamber into a first vapor chamber and a second vapor chamber is provided in the evaporation chamber, the second vapor chamber is located between the first vapor chamber and the compensation chamber, the second vapor chamber and the compensation chamber are separated by the first capillary structure, the first vapor chamber and the second vapor chamber are connected to the condensation chamber via the vapor channel and the auxiliary fluid channel, respectively, and the condensation chamber is connected to the compensation chamber via the liquid channel. The various components of the loop heat pipe are integrated between the two shell plates, making the manufacturing process simpler and more efficient. The addition of the second vapor chamber and the auxiliary fluid channel can reduce the heat transfer temperature difference of the loop heat pipe.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices, and in particular to a thin-plate loop heat pipe. Background Art

[0002] In recent years, many electronic devices have developed towards ultra-thin and compact designs, and their heat generation has increased. Traditional heat pipes are increasingly unable to meet the heat dissipation needs of electronic devices.

[0003] The loop heat pipe is an advanced phase change heat transfer technology. The loop heat pipe consists of five basic components: an evaporator (including a capillary wick), a vapor line, a condenser, a liquid line, and a compensator. These five parts are connected in sequence to form a closed loop, inside which a working fluid circulates. The working principle of the loop heat pipe is as follows: the evaporator contacts the heat source, the liquid working fluid vaporizes on the surface of the capillary wick in the evaporator, the vaporized vapor working fluid enters the condenser along the vapor line, releases heat in the condenser and condenses into a liquid working fluid, then flows along the liquid line to the compensator, infiltrates the capillary wick in the evaporator, and the liquid working fluid is heated and evaporates again, entering the next cycle. Compared with traditional heat pipes, loop heat pipes have greater heat transfer capacity, a longer heat transfer distance, and a more flexible layout.

[0004] However, existing loop heat pipes are relatively thick, and their main components are usually arranged separately and connected by welding, which makes the process complicated. In addition, since the pressure and temperature of the evaporator are higher than those of the compensator when the loop heat pipe is operating normally, there is a heat load that leaks from the evaporator to the compensator, which is called heat leakage. According to the working principle of the loop heat pipe, this heat leakage needs to be offset by increasing the subcooling of the liquid working medium returning from the condenser to maintain the thermal balance of the compensator. The greater the heat leakage, the greater the subcooling of the returning liquid working medium. This leads to a large heat transfer temperature difference between the hot and cold ends of the loop heat pipe, affecting the heat transfer performance of the loop heat pipe. When the loop heat pipe is miniaturized, the problem of heat leakage from the evaporator to the compensator becomes more prominent, resulting in a significant reduction in the heat transfer efficiency of the loop heat pipe. Therefore, existing loop heat pipes cannot meet the heat dissipation requirements of ultra-thin, compact, high-heat flux electronic devices. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a thin plate type loop heat pipe with simple and efficient manufacturing process and small heat transfer temperature difference, so as to overcome the above-mentioned defects of the prior art.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solution: a thin-plate loop heat pipe, including a shell, the shell including a first shell plate and a second shell plate that are relatively covered and sealed at the edges, an evaporation chamber, a vapor channel, a condensation chamber, a liquid channel, a compensation chamber and an auxiliary fluid channel are formed between the first shell plate and the second shell plate, the compensation chamber stores liquid working medium, the evaporation chamber is provided with a first capillary structure that divides the evaporation chamber into a first vapor chamber and a second vapor chamber, the second vapor chamber is located between the first vapor chamber and the compensation chamber, the second vapor chamber and the compensation chamber are separated by the first capillary structure, the first vapor chamber is connected to the condensation chamber through the vapor channel, the condensation chamber is connected to the compensation chamber through the liquid channel, and the auxiliary fluid channel connects the second vapor chamber and the liquid channel.

[0007] Preferably, a flow channel is provided in the condensation chamber.

[0008] Preferably, two ends of the auxiliary fluid channel are connected to the second steam chamber and the liquid channel respectively.

[0009] Preferably, both ends of the auxiliary fluid channel are connected to the second steam chamber and the condensation chamber respectively.

[0010] Preferably, a recessed area is etched on the inner wall of the first shell plate and / or the second shell plate, and an evaporation chamber, a vapor channel, a condensation chamber, a liquid channel, a compensation chamber and an auxiliary fluid channel are formed in the recessed area between the first shell plate and the second shell plate.

[0011] Preferably, the shell is annular, and the evaporation chamber, the gas channel, the condensation chamber, the liquid channel and the compensation chamber are arranged in sequence along the circumference of the shell to form a closed loop.

[0012] Preferably, the auxiliary fluid channel is located at one side of the gas channel and shares a sealing edge of the housing with the gas channel, or the auxiliary fluid channel is located at one side of the liquid channel and shares a sealing edge of the housing with the liquid channel.

[0013] Preferably, the auxiliary fluid channel has a sealing edge independent of the gas channel and the liquid channel.

[0014] Preferably, the first capillary structure and the housing are separate structures, and the first capillary structure is a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, foam metal and laminated perforated metal sheets.

[0015] Preferably, a concave structure is provided on one end of the first capillary structure close to the compensation chamber, and a second steam chamber is formed between the concave structure and the housing.

[0016] Preferably, the first capillary structure and the shell are an integrated structure, a plurality of first micro-grooves are etched on the inner wall of the first shell plate at the evaporation chamber, and a plurality of second micro-grooves are etched on the inner wall of the second shell plate at the evaporation chamber, and the first micro-grooves and the second micro-grooves are cross-arranged to form the first capillary structure.

[0017] Preferably, a groove is further etched on the inner wall of the second shell plate at the evaporation chamber, the groove and the second micro-groove are separated and independent from each other, one end of the first micro-groove is arranged to intersect with the second micro-groove, and the other end of the first micro-groove extends to intersect with the groove, and the groove, the second shell plate, the first micro-groove and the first shell plate together form a second steam chamber.

[0018] Preferably, a second capillary structure is provided in the condensation chamber, and the second capillary structure extends to the evaporation chamber through one or more of the vapor channel, the liquid channel and the auxiliary fluid channel and contacts or connects with the first capillary structure.

[0019] Preferably, the second capillary structure is a third micro-channel etched on the inner wall of the first shell plate and / or the second shell plate, or the second capillary structure is a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, foam metal and laminated perforated metal sheets.

[0020] Preferably, a third capillary structure is provided in one or more of the condensation chamber, the vapor channel, the liquid channel and the auxiliary fluid channel.

[0021] Preferably, the third capillary structure is a fourth micro-channel etched on the inner wall of the first shell plate and / or the second shell plate, or the third capillary structure is a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, foam metal and laminated perforated metal sheets.

[0022] Preferably, the shell is bent into a bent shape at any one or more locations except the evaporation chamber.

[0023] Compared with the prior art, the present invention has significant improvements:

[0024] On the one hand, the thin plate type loop heat pipe of the present invention adopts a structure in which two shell plates are relatively covered and sealed at the edges, and an evaporation chamber, a vapor channel, a condensation chamber, a liquid channel, a compensation chamber and an auxiliary fluid channel are formed between the two shell plates. The various components of the loop heat pipe are integrated between the two shell plates, which greatly simplifies the structure and can significantly reduce the overall thickness of the thin plate type loop heat pipe. The manufacturing process is simpler and more efficient. On the other hand, compared with the existing loop heat pipe, the thin plate type loop heat pipe of the present invention adds a second steam chamber and an auxiliary fluid channel, so that the heat leakage from the evaporation chamber to the compensation chamber is thermally isolated by the second steam chamber. That is, the heat leakage causes part of the working medium to vaporize in the second steam chamber. The vaporized working medium in the second steam chamber flows into the liquid channel through the auxiliary fluid channel and finally returns to the compensation chamber to complete the cycle. The vaporization of the working medium in the second steam chamber absorbs most of the heat leakage from the evaporation chamber to the compensation chamber, which can significantly reduce the heat leaking into the compensation chamber, thereby effectively reducing the heat transfer temperature difference of the thin plate type loop heat pipe and ensuring the heat transfer performance of the thin plate type loop heat pipe. Therefore, the thin-plate loop heat pipe of the present invention can well meet the heat dissipation requirements of ultra-thin, compact electronic devices with high heat flux density. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the split structure of the first embodiment of the thin-plate loop heat pipe of the present invention.

[0026] Figure 2 yes Figure 1 A local enlarged schematic diagram in .

[0027] Figure 3 This is a schematic diagram of the use of the first embodiment of the thin-plate loop heat pipe of the present invention.

[0028] Figure 4 It is a structural schematic diagram of a second embodiment of the thin plate loop heat pipe of the present invention.

[0029] Figure 5 This is a schematic diagram of the split structure of the first capillary structure in the third embodiment of the thin-plate loop heat pipe of the present invention.

[0030] Figure 6 It is a structural schematic diagram of the fourth embodiment of the thin plate loop heat pipe of the present invention.

[0031] Figure 7 This is a schematic diagram of the use of the fourth embodiment of the thin-plate loop heat pipe of the present invention.

[0032] Figure 8 It is a structural schematic diagram of the fifth embodiment of the thin plate loop heat pipe of the present invention.

[0033] Figure 9 It is a structural schematic diagram of a sixth embodiment of the thin plate loop heat pipe of the present invention.

[0034] The description of the accompanying drawings is as follows:

[0035] 100 Thin Plate Loop Heat Pipe

[0036] 1 Housing

[0037] 11 First shell plate

[0038] 11a First micro-groove

[0039] 12 Second shell plate

[0040] 12a Second micro-groove

[0041] 12b groove

[0042] 12c groove

[0043] 2 Evaporation chamber

[0044] 21 First capillary structure

[0045] 22. First steam chamber

[0046] 23 Second steam chamber

[0047] 3 Gas channel

[0048] 4 Condensation chamber

[0049] 41 runner

[0050] 42 Second capillary structure

[0051] 5 Liquid Channel

[0052] 6 Compensation cavity

[0053] 7 Auxiliary fluid channel

[0054] 8 Third capillary structure

[0055] 200 Electronic Equipment

[0056] 201 housing

[0057] 202, 203, 204 heat sources DETAILED DESCRIPTION

[0058] The following is a further detailed description of the specific embodiments of the present invention in conjunction with the accompanying drawings. These embodiments are only used to illustrate the present invention, and are not intended to limit the present invention.

[0059] In the description of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," and "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0060] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0061] Furthermore, in the description of the present invention, unless otherwise specified, “plurality” means two or more.

[0062] like Figures 1 to 9 FIG. 1 shows an embodiment of the thin plate type loop heat pipe of the present invention.

[0063] See also Figure 1 、 Figure 2 and Figure 9The thin-plate loop heat pipe 100 of this embodiment includes a housing 1, which includes a first shell plate 11 and a second shell plate 12. The first shell plate 11 and the second shell plate 12 are relatively covered, and the edges of the first shell plate 11 and the second shell plate 12 are sealed together to form a sealed edge of the housing 1, thereby forming an internal sealed space of the housing 1 between the first shell plate 11 and the second shell plate 12. An evaporation chamber 2, a vapor channel 3, a condensation chamber 4, a liquid channel 5, a compensation chamber 6, and an auxiliary fluid channel 7 are formed between the first shell plate 11 and the second shell plate 12. A first capillary structure 21 is provided within the evaporation chamber 2. The first capillary structure 21 divides the evaporation chamber 2 into a first vapor chamber 22 and a second vapor chamber 23. The second vapor chamber 23 is located between the first vapor chamber 22 and the compensation chamber 6. The second vapor chamber 23 is separated from the compensation chamber 6 by the first capillary structure 21, and the second vapor chamber 23 is also separated from the first vapor chamber 22 by the first capillary structure 21. First capillary structure 21 is permeable to liquid-phase working fluid and prevents vapor-phase working fluid from flowing between second vapor chamber 23 and compensation chamber 6, and between second vapor chamber 23 and first vapor chamber 22. First vapor chamber 22 is connected to condensation chamber 4 via vapor channel 3, which in turn is connected to compensation chamber 6 via liquid channel 5. Auxiliary fluid channel 7 connects second vapor chamber 23 and liquid channel 5. Liquid-phase working fluid is stored in compensation chamber 6, and this fluid can penetrate and infiltrate first capillary structure 21 within evaporation chamber 2.

[0064] See also Figure 3 The thin plate loop heat pipe 100 of this embodiment can be housed in a housing 201 of an electronic device 200 when in use. The housing 201 of the electronic device 200 has a heat source 202. The evaporation chamber 2 of the thin plate loop heat pipe 100 contacts the heat source 202. Its working principle is as follows: the evaporation chamber 2 contacts the heat source 202 to absorb the heat of the heat source 202. The liquid phase working medium in the first vapor chamber 22 vaporizes on the surface of the first capillary structure 21. The vaporized vapor phase working medium enters the condensation chamber 4 through the vapor channel 3. After the condensation chamber 4 releases heat and condenses, it returns to the compensation chamber 6 and the evaporation chamber 2 through the liquid channel 5, thereby completing the process of heat dissipation. One cycle; at the same time, since the temperature and pressure in the evaporation chamber 2 are higher than the temperature and pressure of the working fluid in the compensation chamber 6, the evaporation chamber 2 begins to transfer heat to the compensation chamber 6. When the heat is transferred to the second steam chamber 23, the liquid-phase working fluid in the second steam chamber 23 is heated and vaporized, absorbing most of the heat transferred from the evaporation chamber 2 to the compensation chamber 6, thereby significantly reducing the heat leaking into the compensation chamber 6. The vaporized vapor-phase working fluid in the second steam chamber 23 flows into the liquid channel 5 through the auxiliary fluid channel 7, and returns to the compensation chamber 6 and the evaporation chamber 2 through the liquid channel 5, thereby completing another cycle; the two cycles are carried out in parallel and simultaneously.

[0065] On the one hand, the thin-plate loop heat pipe 100 of this embodiment adopts a structure in which two shell plates are relatively covered, the edges are sealed and connected, and an evaporation chamber 2, a gas channel 3, a condensation chamber 4, a liquid channel 5, a compensation chamber 6 and an auxiliary fluid channel 7 are formed between the two shell plates. The various components of the loop heat pipe are integrated between the two shell plates, which greatly simplifies the structure, can significantly reduce the overall thickness of the thin-plate loop heat pipe 100, and the manufacturing process is simpler and more efficient. On the other hand, compared to existing loop heat pipes, the thin-plate loop heat pipe 100 of this embodiment is additionally provided with a second steam chamber 23 and an auxiliary fluid channel 7, so that the heat leakage from the evaporation chamber 2 to the compensation chamber 6 is thermally isolated by the second steam chamber 23. That is, the heat leakage causes part of the working fluid to vaporize in the second steam chamber 23. The vaporized working fluid in the second steam chamber 23 flows into the liquid channel 5 through the auxiliary fluid channel 7 and finally returns to the compensation chamber 6, completing the cycle. The vaporization of the working fluid in the second steam chamber 23 absorbs the vast majority of the heat leakage from the evaporation chamber 2 to the compensation chamber 6, which can significantly reduce the amount of heat leaking into the compensation chamber 6, thereby effectively reducing the heat transfer temperature difference of the thin-plate loop heat pipe 100 and ensuring the heat transfer performance of the thin-plate loop heat pipe 100. Therefore, the thin-plate loop heat pipe 100 of this embodiment can well meet the heat dissipation requirements of ultra-thin, compact, high heat flux density electronic devices.

[0066] In this embodiment, the manner in which the auxiliary fluid channel 7 connects the second steam chamber 23 and the liquid channel 5 is not limited.

[0067] See also Figure 1 、 Figure 4 、 Figure 6 and Figure 8 In one embodiment, the two ends of the auxiliary fluid channel 7 are connected to the second steam chamber 23 and the condensing chamber 4, respectively, and the condensing chamber 4 is connected to the liquid channel 5. Thus, the auxiliary fluid channel 7 connects the second steam chamber 23 and the liquid channel 5. The vapor-phase working medium vaporized in the second steam chamber 23 enters the condensing chamber 4 through the auxiliary fluid channel 7. After releasing heat and condensing in the condensing chamber 4, it returns to the compensation chamber 6 through the liquid channel 5 along with the condensed working medium flowing through the vapor channel 3.

[0068] See also Figure 9 In another embodiment, the two ends of the auxiliary fluid channel 7 are connected to the second vapor chamber 23 and the liquid channel 5, respectively. That is, the auxiliary fluid channel 7 is directly connected to the liquid channel 5. The vapor-phase working medium evaporated in the second vapor chamber 23 directly enters the liquid channel 5 through the auxiliary fluid channel 7. Because this portion of the vapor-phase working medium is relatively small, it gradually releases heat and condenses while flowing along the auxiliary fluid channel 7 and the liquid channel 5, and eventually returns to the compensation chamber 6.

[0069] In this embodiment, preferably, a recessed area is etched on the inner wall of the first shell plate 11 and / or the second shell plate 12, and the evaporation chamber 2, the vapor channel 3, the condensation chamber 4, the liquid channel 5, the compensation chamber 6, and the auxiliary fluid channel 7 are formed in the recessed area between the first shell plate 11 and the second shell plate 12. That is, the recessed area can be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12, while the inner wall of the other shell plate is a flat surface. The recessed area on one shell plate and the flat surface on the other shell plate are relatively overlapped to form the internal sealed space of the housing 1, and the evaporation chamber 2, the vapor channel 3, the condensation chamber 4, the liquid channel 5, the compensation chamber 6, and the auxiliary fluid channel 7 are formed in this sealed space. Alternatively, the recessed area can be etched on the inner wall of both the first shell plate 11 and the inner wall of the second shell plate 12, and the recessed areas on the two shell plates are relatively overlapped to form the internal sealed space of the housing 1, and the evaporation chamber 2, the vapor channel 3, the condensation chamber 4, the liquid channel 5, the compensation chamber 6, and the auxiliary fluid channel 7 are formed in this sealed space. Herein, the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12 refer to the opposite wall surfaces of the first shell plate 11 and the second shell plate 12 .

[0070] See also Figure 1 In this embodiment, preferably, a flow channel 41 is provided in the condensing chamber 4. After the vapor-phase working medium vaporized in the evaporation chamber 2 enters the condensing chamber 4 through the vapor channel 3 and the auxiliary fluid channel 7, it flows along the flow channel 41 in the condensing chamber 4 and releases heat to the outside to condense. There can be multiple flow channels 41, and multiple flow channels 41 are arranged in parallel. The flow channel 41 can be formed by etching on the inner wall of the first shell plate 11 and / or the second shell plate 12 at the location of the condensing chamber 4. That is, the flow channel 41 can be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12, or the flow channel 41 can be etched on the inner wall of both the first shell plate 11 and the inner wall of the second shell plate 12.

[0071] See also Figure 1 In this embodiment, the housing 1 is preferably annular, with the evaporation chamber 2, vapor passage 3, condensation chamber 4, liquid passage 5, and compensation chamber 6 arranged sequentially along the circumference of the housing 1 to form a closed loop. Thus, the sealing edge of the housing 1 includes an outer peripheral sealing edge and an inner peripheral sealing edge, with the evaporation chamber 2, vapor passage 3, condensation chamber 4, liquid passage 5, and compensation chamber 6 all formed between the outer and inner peripheral sealing edges of the housing 1.

[0072] The arrangement position of the auxiliary fluid channel 7 is not limited. For example, see Figure 1 、 Figure 6 and Figure 8, the auxiliary fluid channel 7 can be located on one side of the gas channel 3 and share the sealing edge of the shell 1 with the gas channel 3, that is, the auxiliary fluid channel 7 can be arranged in parallel with the gas channel 3 and formed between the outer peripheral sealing edge and the inner peripheral sealing edge of the shell 1. Alternatively, the auxiliary fluid channel 7 can be located on one side of the liquid channel 5 and share the sealing edge of the shell 1 with the liquid channel 5, that is, the auxiliary fluid channel 7 can be arranged in parallel with the liquid channel 5 and formed between the outer peripheral sealing edge and the inner peripheral sealing edge of the shell 1. Alternatively, see Figure 4 and Figure 9 The auxiliary fluid channel 7 can have a sealing edge independent of the vapor channel 3 and the liquid channel 5, so that a separation space can be formed between the auxiliary fluid channel 7 and the vapor channel 3, and between the auxiliary fluid channel 7 and the liquid channel 5. In actual application, the layout of the auxiliary fluid channel 7 can be selected and determined based on the usage and installation location of the electronic device 200, so as to better adapt to different electronic devices 200 and usage environments.

[0073] In this embodiment, the shape and structural form of the first capillary structure 21 are not limited.

[0074] See also Figure 2 In one embodiment, the first capillary structure 21 and the housing 1 can be separate structures. The first capillary structure 21 can be bonded to the inner wall of the first shell plate 11 or the inner wall of the second shell plate 12 by sintering or welding. The first capillary structure 21 can be a combination of one or more of a wire mesh, a powder sintered material, a metal felt, a fiber bundle, a foam metal, and a laminated perforated metal sheet. Preferably, a concave structure can be provided at the end of the first capillary structure 21 near the compensation chamber 6, forming a second steam chamber 23 between the concave structure and the housing 1.

[0075] See also Figure 5In another embodiment, the first capillary structure 21 and the shell 1 can be an integrated structure. A plurality of first micro-grooves 11a are etched on the inner wall of the first shell plate 11 at the evaporation chamber 2, and a plurality of second micro-grooves 12a are etched on the inner wall of the second shell plate 12 at the evaporation chamber 2. The first micro-grooves 11a and the second micro-grooves 12a are both extremely narrow, allowing them to penetrate liquid-phase working fluids while blocking vapor-phase working fluids. The first micro-grooves 11a and the second micro-grooves 12a are arranged in an intersecting manner. By intersecting the first micro-grooves 11a and the second micro-grooves 12a, a structure with an extremely small pore size and capillary force is formed, namely, the first capillary structure 21. At the same time, a first vapor chamber 22 is formed between the first capillary structure 21 and the first shell plate 11 and the second shell plate 12. Preferably, a groove 12c is formed on the inner wall of the second shell plate 12 at the evaporation chamber 2, and the groove 12c is connected to the second micro groove 12a. A first steam chamber 22 is formed between the groove 12c and the first shell plate 11. The vaporized vapor phase working medium can escape along the groove 12c and be collected into the vapor channel 3. Preferably, a groove 12b is also etched on the inner wall of the second shell plate 12 at the evaporation chamber 2. The groove 12b and the second micro groove 12a are separated and independent from each other, and the groove 12b and the groove 12c are also separated and independent from each other. One end of the first micro groove 11a is arranged to intersect with the second micro groove 12a, and the other end of the first micro groove 11a extends to intersect with the groove 12b. Through the intersection of the first micro groove 11a and the groove 12b, the groove 12b, the second shell plate 12, and the first micro groove The second steam chamber 23 is formed between the groove 11a and the first shell 11. Since the groove 12b and the second micro-groove 12a are separated and independent from each other, the groove 12b and the groove 12c are also separated and independent from each other, and the first micro-groove 11a that crosses and connects with the groove 12b is part of the first capillary structure 21, the first micro-groove 11a itself has the characteristics of permeating liquid-phase working fluid and blocking vapor-phase working fluid. Therefore, the second steam chamber 23 and the first steam chamber 22 are separated by the first capillary structure 21. Therefore, the first capillary structure 21 is part of the shell 1. Preferably, the width of the first micro-groove 11a and the width of the second micro-groove 12a are both less than 0.3 mm. The second micro-groove 12a is preferably arranged at intervals to form a channel, which is conducive to the escape of the working fluid after vaporization.

[0076] In this embodiment, see Figure 1 Preferably, a second capillary structure 42 may be provided in the condensation chamber 4. The second capillary structure 42 may extend to the evaporation chamber 2 through one or more of the vapor channel 3, the liquid channel 5, and the auxiliary fluid channel 7 and contact or connect with the first capillary structure 21. Figure 1The figure only shows the second capillary structure 42 extending through the vapor channel 3 to the evaporation chamber 2 and contacting or connecting with the first capillary structure 21. The second capillary structure 42 can guide the liquid working medium in the condensation chamber 4 to the first capillary structure 21 in the evaporation chamber 2, causing it to soak into the first capillary structure 21. This prevents the first capillary structure 21 from drying out before the thin-plate loop heat pipe 100 of this embodiment starts up, ensuring that the thin-plate loop heat pipe 100 can start up normally.

[0077] In this embodiment, the shape and structural form of the second capillary structure 42 are not limited.

[0078] In one embodiment, the second capillary structure 42 and the housing 1 can be an integral structure, and the second capillary structure 42 is a third micro-groove etched on the inner wall of the first shell plate 11 and / or the second shell plate 12. That is, the third micro-groove can be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12 to form the second capillary structure 42, or the third micro-groove can be etched on the inner wall of both the first shell plate 11 and the inner wall of the second shell plate 12 to form the second capillary structure 42. Preferably, the width of the third micro-groove is less than 0.3 mm. Thus, the second capillary structure 42 is part of the housing 1.

[0079] In another embodiment, the second capillary structure 42 and the shell 1 can be a split structure, and the second capillary structure 42 can be combined with the inner wall of the first shell plate 11 or the inner wall of the second shell plate 12 by sintering or welding. The second capillary structure 42 can also be a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, foam metal and laminated perforated metal sheet.

[0080] In this embodiment, see Figure 6 Preferably, a third capillary structure 8 is provided in one or more of the condensation chamber 4 , the vapor channel 3 , the liquid channel 5 and the auxiliary fluid channel 7 . Figure 6 Only the case where the third capillary structure 8 is provided in the condensation chamber 4 and the liquid channel 5 is shown. Figure 7Compact electronic devices 200 such as smartphones, tablet computers, laptop computers, wearable electronic devices, etc. usually have multiple heat sources 202, 203, and 204 dispersed in different locations. When the thin-plate loop heat pipe 100 of this embodiment is used, the evaporation chamber 2 can contact the heat source 202 with the highest heat generation in the electronic device 200, and the third capillary structure 8 provided in the condensation chamber 4, the vapor channel 3, the liquid channel 5, and the auxiliary fluid channel 7 can contact other heat sources 203 and 204 with relatively lower heat generation in the electronic device 200 according to the corresponding installation position. The evaporation chamber 2 absorbs the heat of the heat source 202, and the liquid phase working medium in the first steam chamber 22 and the second steam chamber 23 is vaporized by the heat. The vaporized vapor phase working medium flows along the vapor channel 3 and the auxiliary fluid channel 7 respectively. During the flow process, it releases heat to the outside through the shell 1 and the shell 201 of the electronic device 200 in thermal contact with it, so that part of the vapor phase working medium condenses into a liquid phase. During the flow of this part of the liquid phase working medium along the vapor channel 3 and the auxiliary fluid channel 7, it passes through the third capillary structure 8 provided in the vapor channel 3 and the auxiliary fluid channel 7 and is adsorbed. It can be vaporized again by absorbing the heat of the heat source corresponding thereto, and continues to flow forward along the circulation loop and recirculates. The above-mentioned process of condensing by releasing heat externally and then re-evaporating upon encountering a heat source is repeated until it enters the condensing chamber 4. The liquid phase working medium condensed in the condensing chamber 4 is adsorbed by the third capillary structure 8 provided in the condensing chamber 4 and the liquid channel 5 when flowing in the condensing chamber 4 and the liquid channel 5. It can be vaporized by absorbing heat from the corresponding heat source there, so that part of the liquid phase working medium is in the vapor phase. This part of the vapor phase working medium will release heat externally through the housing 1 and the housing 201 of the electronic device 200 in thermal contact with it during the process of flowing along the liquid channel 5, and condense again. It continues to flow forward along the circulation loop and repeats the above-mentioned process of vaporizing upon encountering a heat source, releasing heat externally, and then re-condensing until it enters the compensation chamber 6. Therefore, the thin-plate loop heat pipe 100 of this embodiment can simultaneously dissipate heat from multiple heat sources of the electronic device 200 in its circulation loop, and has a very strong heat dissipation capacity.

[0081] It should be noted that, during operation, the heat source position and heat dissipation position of the compact electronic device 200 are not limited to Figure 7 As shown in the figure, the positions of the heat sources 202, 203, and 204 are actually located. Due to the compact and miniaturized structure of the electronic device 200 and the thin-plate loop heat pipe 100, the heat source and heat dissipation of the electronic device 200 may exist at any position on the entire circulation loop of the thin-plate loop heat pipe 100, and it is also possible that the heat dissipation part of the electronic device 200 covers the entire thin-plate loop heat pipe 100.

[0082] Therefore, it should be noted that when the thin-plate loop heat pipe 100 of this embodiment is in use, the vapor-phase working medium vaporized in the first vapor chamber 22 and the second vapor chamber 23 enters the vapor channel 3 and the auxiliary fluid channel 7, respectively. As the vapor-phase working medium flows along the vapor channel 3 and the auxiliary fluid channel 7, it releases heat to the outside through the housing 1 and the outer shell 201 of the electronic device 200 in thermal contact therewith, causing part of the vapor-phase working medium to condense into a liquid phase. If this liquid-phase working medium does not pass through the heat dissipation portion of the electronic device 200 while flowing along the vapor channel 3 and the auxiliary fluid channel 7, it will flow directly into the condensation chamber 4. If it passes through the heat dissipation portion of the electronic device 200, it will absorb heat and vaporize again, continuing to flow forward along the circulation loop, repeating the aforementioned heat release, condensation, heat absorption, and re-vaporization process until it enters the condensation chamber 4. Therefore, the vapor channel 3 and the auxiliary fluid channel 7 actually also have a condensation function. The condensed liquid working medium in the condensing chamber 4 enters the liquid channel 5. As it flows along the liquid channel 5, if it does not pass through the heat dissipation area of the electronic device 200, it will flow directly into the compensation chamber 6. If it passes through the heat dissipation area of the electronic device 200, it will absorb heat and vaporize, causing part of the liquid working medium to be in the vapor phase. This vapor working medium will release heat to the outside through the housing 1 and the outer shell 201 of the electronic device 200 in thermal contact with it as it flows along the liquid channel 5, and condense again. It will continue to flow forward along the circulation loop, repeating the above heat absorption, vaporization, heat release, and recondensation process until it enters the compensation chamber 6. Therefore, the liquid channel 5 actually also has a condensation function. Therefore, in the circulation loop of the thin-plate loop heat pipe 100 of this embodiment, the gas channel 3, auxiliary fluid channel 7, condensing chamber 4, and liquid channel 5 as a whole can be considered the condensation area. The working medium flowing in the area of the circulation loop outside the evaporation chamber 2 can undergo multiple cycles of condensation, vaporization, and recondensation, ultimately flowing into the compensation chamber 6 as a liquid working medium.

[0083] In this embodiment, the shape and structural form of the third capillary structure 8 are not limited.

[0084] In one embodiment, the third capillary structure 8 and the housing 1 can be an integral structure, and the third capillary structure 8 is a fourth micro-groove etched on the inner wall of the first shell plate 11 and / or the second shell plate 12. That is, the fourth micro-groove can be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12 to form the third capillary structure 8, or the fourth micro-groove can be etched on the inner wall of both the first shell plate 11 and the inner wall of the second shell plate 12 to jointly form the third capillary structure 8. Preferably, the width of the fourth micro-groove is less than 0.3 mm. Thus, the third capillary structure 8 is part of the housing 1.

[0085] In another embodiment, the third capillary structure 8 and the shell 1 can be a split structure, and the third capillary structure 8 can be combined on the inner wall of the first shell plate 11 or the inner wall of the second shell plate 12 by sintering or welding. The third capillary structure 8 can also be a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, foam metal and laminated perforated metal sheets.

[0086] See also Figure 1 、 Figure 4 、 Figure 6 and Figure 9 The shell 1 of the thin plate type loop heat pipe 100 of this embodiment can be in the shape of a flat plate. Figure 8 The shell 1 of the thin plate type loop heat pipe 100 of this embodiment can also be bent into a curved shape at any one or more locations other than the evaporation chamber 2. Figure 8 Only the bending shapes at the condensing chamber 4 and the liquid channel 5 are shown. Thus, the thin plate-type loop heat pipe 100 of this embodiment can match the compact spatial layout of the electronic device 200, and can be flexibly arranged within the housing 201 of the electronic device 200 according to the compact spatial layout of the electronic device 200.

[0087] The material of the shell 1 of the thin-plate loop heat pipe 100 of this embodiment is not limited. For example, the first shell plate 11 and the second shell plate 12 can both be made of metal sheets, such as copper sheets with excellent thermal conductivity, and the two can be connected by diffusion welding. The shell 1 can also be made of non-metallic materials.

[0088] In this embodiment, preferably, the first shell plate 11 and the second shell plate 12 are both thin plates, and the thickness of the thin plates can be 0.2 mm to 3 mm. The thickness of the first shell plate 11 and the second shell plate 12 can be the same or different.

[0089] The working medium in the thin plate loop heat pipe 100 of this embodiment can be reasonably selected according to the working temperature requirements.

[0090] Six specific implementations of the thin-plate loop heat pipe 100 of this embodiment are provided below.

[0091] See also Figures 1 to 3, which is the first implementation of the thin-plate loop heat pipe 100 of this embodiment. In this first implementation, a first shell plate 11 and a second shell plate 12 are relatively covered and sealed at their edges to form an annular shell 1, which is flat. A recessed area is etched on the inner wall of the first shell plate 11 and / or the second shell plate 12. An evaporation chamber 2, a vapor channel 3, a condensation chamber 4, a liquid channel 5, a compensation chamber 6, and an auxiliary fluid channel 7 are formed in the recessed area between the first shell plate 11 and the second shell plate 12. The evaporation chamber 2, vapor channel 3, condensation chamber 4, liquid channel 5, and compensation chamber 6 are arranged sequentially along the circumference of the shell 1 and are interconnected to form a closed loop. A first capillary structure 21 is provided within the evaporation chamber 2, dividing the evaporation chamber 2 into a first steam chamber 22 and a second steam chamber 23. The first capillary structure 21 is separate from the housing 1. A concave structure is provided at one end of the first capillary structure 21, near the compensation chamber 6. This concave structure forms the second steam chamber 23 between the housing 1 and the second capillary structure. The second steam chamber 23 is separated from the compensation chamber 6 by the first capillary structure 21, and the second steam chamber 23 is also separated from the first steam chamber 22 by the first capillary structure 21. The first steam chamber 22 is connected to the condensation chamber 4 via the vapor channel 3, and the second steam chamber 23 is connected to the condensation chamber 4 via the auxiliary fluid channel 7. The auxiliary fluid channel 7 is located to one side of the vapor channel 3 and shares the sealing edge of the housing 1 with the vapor channel 3. Multiple flow channels 41 are provided within the condensation chamber 4. A second capillary structure 42 is also provided within the condensing chamber 4. This second capillary structure 42 extends through one or more of the vapor channel 3, the liquid channel 5, and the auxiliary fluid channel 7 to the evaporation chamber 2, where it contacts or connects with the first capillary structure 21. The figure only illustrates the second capillary structure 42 extending through the vapor channel 3 to the evaporation chamber 2 and contacting or connecting with the first capillary structure 21. The second capillary structure 42 and the housing 1 may be integral or separate. During use, the thin-plate loop heat pipe 100 is housed within the housing 201 of the electronic device 200, with the evaporation chamber 2 contacting the heat source 202 of the electronic device 200.

[0092] See also Figure 4 , which is a second embodiment of the thin-plate loop heat pipe 100 of this embodiment. The second embodiment is substantially the same as the first embodiment, and the similarities are not repeated here. The difference is that in the second embodiment, the auxiliary fluid channel 7 has a sealing edge independent of the vapor channel 3 and the liquid channel 5, and a separation space is formed between the auxiliary fluid channel 7 and the vapor channel 3, and between the auxiliary fluid channel 7 and the liquid channel 5.

[0093] See also Figure 5, which is the third embodiment of the thin-plate loop heat pipe 100 of this embodiment. The third embodiment is substantially the same as the first embodiment described above, and the similarities are not repeated here. The difference is that, in the third embodiment, the first capillary structure 21 and the housing 1 are integrally formed. A plurality of first microgrooves 11a are etched on the inner wall of the first housing 11 at the evaporation chamber 2, and a plurality of second microgrooves 12a are etched on the inner wall of the second housing 12 at the evaporation chamber 2. The first microgrooves 11a and the second microgrooves 12a are arranged in an intersecting manner to form the first capillary structure 21. Simultaneously, a first vapor chamber 22 is formed between the first capillary structure 21 and the first and second housing plates 11, 12. A groove 12b is also etched on the first capillary structure 21, forming a second vapor chamber 23 between the groove 12b and the housing 1.

[0094] See also Figure 6 and Figure 7 , which is the fourth embodiment of the thin-plate loop heat pipe 100 of this embodiment. The fourth embodiment is substantially the same as the first embodiment described above, and the similarities are not repeated here. The difference is that, in the fourth embodiment, a third capillary structure 8 is provided within one or more of the condensing chamber 4, vapor channel 3, liquid channel 5, and auxiliary fluid channel 7. The figure only shows the case where the third capillary structure 8 is provided within the condensing chamber 4 and liquid channel 5. During use, the evaporation chamber 2 contacts the heat source 202 with the highest heat output in the electronic device 200, while the third capillary structures 8 provided within the condensing chamber 4, vapor channel 3, liquid channel 5, and auxiliary fluid channel 7 contact other heat sources 203 and 204 of the electronic device 200 with relatively lower heat output, depending on their installation positions. The third capillary structure 8 and the housing 1 can be either an integral structure or a separate structure.

[0095] See also Figure 8 , which is the fifth embodiment of the thin-plate loop heat pipe 100 of this embodiment. The fifth embodiment is substantially the same as the first embodiment described above, and the similarities are not repeated here. The difference is that, in the fifth embodiment, the shell 1 can be bent into a curved shape at any one or more locations other than the evaporation chamber 2. The figure only shows the bending into a curved shape at the condensation chamber 4 and the liquid channel 5.

[0096] See also Figure 9 , which is the sixth embodiment of the thin-plate loop heat pipe 100 of this embodiment. This sixth embodiment is essentially the same as the first embodiment, and the similarities are not repeated here. The difference is that, in this sixth embodiment, the auxiliary fluid channel 7 has a sealing edge independent of the vapor channel 3 and the liquid channel 5, and a separation space is formed between the auxiliary fluid channel 7 and the vapor channel 3, and between the auxiliary fluid channel 7 and the liquid channel 5. Furthermore, the auxiliary fluid channel 7 is directly connected to the liquid channel 5.

[0097] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A thin plate loop heat pipe, characterized in that: The invention comprises a shell (1), wherein the shell (1) comprises a first shell plate (11) and a second shell plate (12) which are relatively covered and sealed at their edges, an evaporation chamber (2), a vapor channel (3), a condensation chamber (4), a liquid channel (5), a compensation chamber (6) and an auxiliary fluid channel (7) are formed between the first shell plate (11) and the second shell plate (12), a liquid phase working medium is stored in the compensation chamber (6), a first capillary structure (21) is provided in the evaporation chamber (2) for dividing the evaporation chamber (2) into a first vapor chamber (22) and a second vapor chamber (23), and the second vapor chamber (23) is located between the first vapor chamber (22) and the compensation chamber (6). ), the second steam chamber (23) and the compensation chamber (6) are separated by the first capillary structure (21), the first steam chamber (22) is connected to the condensation chamber (4) through the vapor channel (3), the condensation chamber (4) is connected to the compensation chamber (6) through the liquid channel (5), the auxiliary fluid channel (7) connects the second steam chamber (23) and the liquid channel (5), the evaporation chamber (2) leaks heat to the compensation chamber (6), the heat leakage causes part of the working medium to vaporize in the second steam chamber (23), and the vaporized working medium in the second steam chamber (23) enters the auxiliary fluid channel (7).

2. The thin plate type loop heat pipe according to claim 1, characterized in that: A flow channel (41) is provided in the condensation chamber (4).

3. The thin plate loop heat pipe according to claim 1, characterized in that: Both ends of the auxiliary fluid channel (7) are connected to the second steam chamber (23) and the liquid channel (5) respectively.

4. The thin plate loop heat pipe according to claim 1, characterized in that: Both ends of the auxiliary fluid channel (7) are respectively connected to the second steam chamber (23) and the condensation chamber (4).

5. The thin plate loop heat pipe according to claim 1, characterized in that: A recessed area is etched on the inner wall of the first shell plate (11) and / or the second shell plate (12), and the evaporation chamber (2), the vapor channel (3), the condensation chamber (4), the liquid channel (5), the compensation chamber (6) and the auxiliary fluid channel (7) are formed between the first shell plate (11) and the second shell plate (12) at the recessed area.

6. The thin plate loop heat pipe according to claim 1, characterized in that: The shell (1) is annular, and the evaporation chamber (2), the vapor channel (3), the condensation chamber (4), the liquid channel (5) and the compensation chamber (6) are arranged in sequence along the circumference of the shell (1) to form a closed loop.

7. The thin plate loop heat pipe according to claim 6, characterized in that: The auxiliary fluid channel (7) is located on one side of the gas channel (3) and shares the sealing edge of the shell (1) with the gas channel (3), or the auxiliary fluid channel (7) is located on one side of the liquid channel (5) and shares the sealing edge of the shell (1) with the liquid channel (5).

8. The thin plate loop heat pipe according to claim 6, characterized in that: The auxiliary fluid channel (7) has a sealing edge that is independent of the gas channel (3) and the liquid channel (5).

9. The thin plate loop heat pipe according to claim 1, characterized in that: The first capillary structure (21) and the housing (1) are of a separate structure, and the first capillary structure (21) is a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, foam metal and laminated perforated metal sheets.

10. The thin plate loop heat pipe according to claim 9, characterized in that: A concave structure is provided on one end of the first capillary structure (21) close to the compensation chamber (6), and the second steam chamber (23) is formed between the concave structure and the housing (1).

11. The thin plate loop heat pipe according to claim 1, characterized in that: The first capillary structure (21) and the shell (1) are an integrated structure; a plurality of first micro-grooves (11a) are etched on the inner wall of the first shell plate (11) at the evaporation chamber (2); a plurality of second micro-grooves (12a) are etched on the inner wall of the second shell plate (12) at the evaporation chamber (2); the first micro-grooves (11a) and the second micro-grooves (12a) are cross-arranged to form the first capillary structure (21).

12. The thin plate loop heat pipe according to claim 11, characterized in that: A groove (12b) is further etched on the inner wall of the second shell plate (12) at the evaporation chamber (2); the groove (12b) and the second micro-channel (12a) are separated and independent from each other; one end of the first micro-channel (11a) is arranged to intersect with the second micro-channel (12a), and the other end of the first micro-channel (11a) extends to intersect with the groove (12b); the groove (12b), the second shell plate (12), the first micro-channel (11a), and the first shell plate (11) together form the second steam chamber (23).

13. The thin plate loop heat pipe according to claim 1, characterized in that: A second capillary structure (42) is provided in the condensation chamber (4), and the second capillary structure (42) extends to the evaporation chamber (2) through one or more of the vapor channel (3), the liquid channel (5) and the auxiliary fluid channel (7) and contacts or connects with the first capillary structure (21).

14. The thin plate loop heat pipe according to claim 13, characterized in that: The second capillary structure (42) is a third micro-groove etched on the inner wall of the first shell plate (11) and / or the second shell plate (12), or the second capillary structure (42) is a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, foam metal and laminated perforated metal sheets.

15. The thin plate loop heat pipe according to claim 1, characterized in that: A third capillary structure (8) is provided in one or more of the condensation chamber (4), the vapor channel (3), the liquid channel (5) and the auxiliary fluid channel (7).

16. The thin plate loop heat pipe according to claim 15, characterized in that: The third capillary structure (8) is a fourth micro-groove etched on the inner wall of the first shell plate (11) and / or the second shell plate (12), or the third capillary structure (8) is a combination of one or more of wire mesh, powder sintered material, metal felt, fiber bundle, foam metal and laminated perforated metal sheets.

17. The thin plate loop heat pipe according to claim 1, characterized in that: The shell (1) is bent into a bent shape at any one or more locations except the evaporation chamber (2).

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