Liquid cooling device and server system

Abstract

The present application belongs to the field of server cooling. Disclosed are a liquid cooling device and a server system. The liquid cooling device comprises: a housing and a heat conduction tube assembly; a cooling liquid is provided in the housing, and is configured to immerse a server assembly; the heat conduction tube assembly is arranged in the housing and has a first end and a second end which are opposite to each other, wherein the first end is located below a liquid level of the cooling liquid, the second end is located above the cooling liquid, and the second end is connected to a cooling assembly; and the cooling assembly transfers a cold source fluid to the second end, the cold source fluid cools the second end, a heat diffusion working medium is placed inside the heat conduction tube assembly, the state of the heat diffusion working medium is changeable, and the states of the heat diffusion working medium include a gaseous state and a liquid state.

Description

Liquid cooling device and server system

[0001] Cross-reference to Related Applications

[0002] This application claims priority to the Chinese patent application No. 202410840606.X, filed on June 26, 2024, and entitled “Liquid cooling device and server system”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application belongs to the field of server cooling, and relates to a liquid cooling device and a server system. BACKGROUND

[0004] With the development of technology, server components are used more and more widely. Through the server components, operations can be performed, and network communication can also be performed. In the process of running the server components, the temperature of the server components rises, which can cause the running speed of the server components to decrease. In the related art, the server components are cooled by immersion, i.e., the server components are immersed in a cooling liquid. However, in the related art, the efficiency of cooling the server components is low. SUMMARY

[0005] The purpose of the present application is to provide a liquid cooling device and a server system, which at least solve the problem of low efficiency of cooling the server components.

[0006] In some embodiments, a liquid cooling device is provided. The liquid cooling device includes a containing shell and a heat pipe assembly.

[0007] The containing shell is provided with a cooling liquid, which is used to immerse the server components. The heat pipe assembly is arranged in the containing shell. The heat pipe assembly has opposite first and second ends. The first end is below the liquid level of the cooling liquid. The second end is above the cooling liquid and is connected to a cooling assembly. The cooling assembly delivers a cold source fluid to the second end, and the cold source fluid cools the second end. The heat pipe assembly has a heat dissipation working medium in the interior. The state of the heat dissipation working medium can change. The state of the heat dissipation working medium includes a gaseous state and a liquid state.

[0008] In some embodiments, the containing shell has a containing cavity and an opening. The opening is in communication with the containing cavity. The containing cavity is fixed with a support assembly. The support assembly includes at least one fixed support.

[0009] The containing shell has a first direction. The fixed supports are spaced apart along the first direction. The fixed supports are used to connect the second ends of the heat pipe assemblies, and the fixed supports are above the liquid level of the cooling liquid.

[0010] In some embodiments, the first end of the heat pipe assembly is provided with a plurality of fins, and the plurality of fins are below the liquid level of the cooling liquid.

[0011] In some embodiments, the second end of the heat pipe assembly is connected with a containing member, the containing member has a cavity, and the containing member is provided with a liquid inlet joint and a liquid outlet joint, the cooling assembly injects the heat sink fluid into the cavity through the liquid inlet joint, and the heat sink fluid flows out of the cavity through the liquid outlet joint, so as to circulate the heat sink fluid in the cavity.

[0012] In some embodiments, the heat pipe assembly comprises a plurality of heat pipe bodies, the plurality of heat pipe bodies are evenly spaced, the first end of the heat pipe body is below the liquid level of the cooling liquid, and the second end of the heat pipe body is above the liquid level of the cooling liquid.

[0013] The second end of the heat pipe body is funnel-shaped, and the second end of the heat pipe body is connected with a containing member, and the containing members connected by adjacent two heat pipe bodies are connected with each other.

[0014] The heat pipe body is provided with a heat dissipation working medium.

[0015] In some embodiments, the second end of the heat pipe body is connected with a connecting plate, the connecting plate has opposite first and second surfaces, the second end of the heat pipe body is connected to the first surface, and the connecting plate seals the second end of the heat pipe body, and the containing member is arranged on the second surface.

[0016] In some embodiments, the lengths of at least two of the plurality of heat pipe bodies are different, and the length of the heat pipe body is the distance from the first end to the second end of the heat pipe body.

[0017] In some embodiments, the inner wall of the heat pipe body is provided with a groove, and / or the inner wall of the heat pipe body is provided with a fin to increase the heat exchange area of the heat pipe body.

[0018] In some embodiments, the liquid inlet joint is connected with a first temperature sensor, and the liquid outlet joint is connected with a second temperature sensor, the first temperature sensor is used to detect the temperature of the heat sink fluid flowing through the liquid inlet joint, and the second temperature sensor is used to detect the temperature of the heat sink fluid flowing through the liquid outlet joint.

[0019] In some embodiments, the liquid cooling device further comprises a controller and an alarm;

[0020] The first temperature sensor and the second temperature sensor are electrically connected with the controller, the controller is electrically connected with the alarm, and the controller is used to control the alarm to issue alarm information when it is determined that the temperature value detected by the first temperature sensor and / or the second temperature sensor is greater than a preset temperature value.

[0021] In some embodiments, in the containing members connected by adjacent two heat pipe bodies, the liquid outlet joint of one containing member is connected with the liquid inlet joint of the other containing member through a flexible bellows.

[0022] In some embodiments, the second surface is provided with at least two protrusions, the containing shell has a containing cavity, the containing cavity is fixed with a support assembly, the support assembly comprises at least one fixed support, the fixed support comprises a first fixed strip and a second fixed strip, the first fixed strip and the second fixed strip are distributed at intervals, and the first fixed strip and the second fixed strip are both fixed to a cavity wall of the containing cavity.

[0023] The heat conduction pipe body is located between the first fixed strip and the second fixed strip, and the at least two protrusions are in abutment with the first fixed strip and the second fixed strip respectively to fix the heat conduction pipe body.

[0024] In some embodiments, the first fixed strip and the second fixed strip are both provided with a fixing member, and the fixing member is connected with the connecting plate.

[0025] In some embodiments, the boiling point of the cooling liquid is greater than the maximum temperature of the server assembly during operation.

[0026] In some embodiments, the boiling point of the heat dissipation working medium is less than the boiling point of the cooling liquid.

[0027] In some embodiments, the dielectric constant of the cooling liquid is less than 2.

[0028] In some embodiments, the containing cavity is provided with a fixing frame, and a sliding rail is arranged on the cavity wall of the containing cavity, the sliding rail is opposite to the fixing frame in position, and the sliding rail is used to mount the server assembly to the fixing frame.

[0029] In some embodiments, the liquid cooling device further comprises a top cover, the top cover is arranged at the opening, and the top cover covers the opening.

[0030] In some embodiments, the containing cavity is provided with a liquid moving member, and the liquid moving member is used to flow the cooling liquid in the containing cavity.

[0031] In some embodiments, the liquid cooling device further comprises a fluid valve, the fluid valve is connected between the cooling assembly and the liquid inlet connector, and the fluid valve is used to adjust the flow of the cooling source fluid flowing into the liquid inlet connector.

[0032] In some embodiments, the containing shell is provided with a through hole, and the through hole is located above the liquid level of the cooling liquid, the through hole is used to pass the cable connected with the server assembly, and the through hole is provided with a sealing member, and the sealing member is used to seal the gap between the cable and the hole wall of the through hole.

[0033] In the second aspect, in some embodiments, a server system is provided, the server system comprising a server assembly and the liquid cooling device of any one of the above first aspect.

[0034] The server assembly is located in the containing shell, and the server assembly is immersed in the cooling liquid.

[0035] In some embodiments, since the cooling liquid is provided in the accommodating shell, the server assembly can be immersed in the cooling liquid, and the server assembly is located below the liquid level of the cooling liquid, i.e. the server is immersed in the cooling liquid, so that the heat generated by the server assembly during operation can be transferred to the cooling liquid, so that the server assembly can be cooled. Since the heat pipe assembly is provided in the accommodating shell, the first end of the heat pipe assembly is located below the liquid level of the cooling liquid, and the second end is located above the liquid level of the cooling liquid, so that the first end of the heat pipe assembly is heated when the cooling liquid receives the heat of the server assembly and the temperature of the cooling liquid rises. Since the heat pipe assembly has a heat dissipation working medium inside, the state of the heat dissipation working medium can change, so that at least part of the heat dissipation medium in the heat pipe assembly changes from liquid state to gaseous state when the first end of the heat pipe assembly is heated, and the gaseous heat dissipation medium moves to the second end, i.e. the heat of the server assembly is finally transferred to the second end of the heat pipe assembly. Since the second end of the heat pipe assembly is connected to the cooling assembly, the cooling assembly transfers the cold source fluid to the second end, and the cold source fluid cools the second end, so that the gaseous heat dissipation medium is liquefied when the gaseous heat dissipation medium is transferred to the second end due to the action of the cooling fluid, i.e. the gaseous heat dissipation medium finally transfers the heat to the cold source fluid, and the cold source fluid flows through the cooling assembly to transfer the heat to other positions. That is, when the server assembly is immersed in the cooling liquid, the heat generated by the server assembly is transferred to the cooling liquid, so that the temperature of the cooling liquid rises, and at least part of the heat dissipation medium in the first end of the heat pipe assembly changes from liquid state to gaseous state, flows to the second end, and the cold source fluid cools the gaseous heat dissipation medium, so that the gaseous heat dissipation medium becomes liquid and returns to the first end, so that the cooling liquid and the heat dissipation medium re-exchange heat to cool the server assembly. In some embodiments, by providing the heat pipe assembly, and the first end of the heat pipe assembly is located below the liquid level of the cooling liquid, and the second end is located above the liquid level of the cooling liquid, so that at least part of the heat dissipation medium in the heat pipe assembly can change from liquid state to gaseous state, so that the temperature of the cooling liquid decreases, and the server assembly immersed in the cooling liquid is effectively cooled, and the cooling efficiency of the server assembly is improved. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 shows a schematic diagram of a liquid cooling device provided in some embodiments;

[0037] Figure 2 shows a schematic diagram of a heat pipe body provided in some embodiments;

[0038] Figure 3 shows a schematic diagram of a heat pipe assembly provided in some embodiments;

[0039] Figure 4 shows a schematic diagram of a heat pipe assembly provided in some embodiments;

[0040] Fig. 5 shows a schematic view of a liquid cooling device according to some embodiments;

[0041] Fig. 6 shows a schematic view of a containing shell according to some embodiments.

[0042] Reference numerals: 001: flexible bellows; 10: containing shell; 20: heat pipe assembly; 21: heat pipe body; 22: connecting plate; 201: fin; 221: protrusion; 30: support assembly; 31: fixed support; 311: first fixed strip; 312: second fixed strip; 40: containing member; 41: liquid inlet connector; 42: liquid outlet connector; 50: top cover; 100: server assembly. DETAILED DESCRIPTION

[0043] In the specification and claims of the present application, the features of the terms "first", "second" can be explicitly or implicitly included one or more features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in a "or" relationship.

[0044] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0045] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0046] As shown in Figs. 1 to 6, the liquid cooling device comprises a containing shell 10 and a heat pipe assembly 20.

[0047] The containment shell 10 is filled with a cooling liquid for submerging the server assembly 100. The heat pipe assembly 20 is disposed in the containment shell 10. The heat pipe assembly 20 has opposite first and second ends. The first end is below the liquid level of the cooling liquid. The second end is above the liquid level of the cooling liquid and is connected to a cooling assembly. The cooling assembly delivers a cold source fluid to the second end and the cold source fluid cools the second end. The heat pipe assembly 20 has an internal heat transfer working substance. The heat transfer working substance has a changeable state. The changeable state includes a gaseous state and a liquid state.

[0048] In some embodiments, when the server assembly 100 is submerged in the cooling liquid, heat generated by the server assembly 100 is transferred to the cooling liquid to increase the temperature of the cooling liquid. At least some of the heat transfer working substance in the first end of the heat pipe assembly 20 changes from the liquid state to the gaseous state and flows to the second end. The cold source fluid cools the gaseous heat transfer working substance to change the gaseous heat transfer working substance to the liquid state and return to the first end.

[0049] In some embodiments, since the cooling liquid is provided in the accommodating shell 10, the server assembly 100 can be immersed in the cooling liquid, and the server assembly 100 is located below the liquid level of the cooling liquid, that is, the server is immersed in the cooling liquid, so that the heat generated by the server assembly 100 during operation can be transferred to the cooling liquid, so that the server assembly 100 can be cooled. Since the heat pipe assembly 20 is provided in the accommodating shell 10, the first end of the heat pipe assembly 20 is located below the liquid level of the cooling liquid, and the second end is located above the liquid level of the cooling liquid, so that the first end of the heat pipe assembly 20 is heated when the cooling liquid receives the heat of the server assembly 100 and the temperature of the cooling liquid rises. Since the heat pipe assembly 20 has a heat dissipation working medium in the inside, the state of the heat dissipation working medium can change, so that at least part of the heat dissipation medium in the heat pipe assembly 20 is converted from liquid state to gaseous state when the first end of the heat pipe assembly 20 is heated, and the gaseous heat dissipation medium moves to the second end, which is equivalent to the heat of the server assembly 100 being finally transferred to the second end of the heat pipe assembly 20. Since the second end of the heat pipe assembly 20 is connected to the cooling assembly, the cooling assembly transfers the cold source fluid to the second end, and the cold source fluid cools the second end, so that the gaseous heat dissipation medium is liquefied when the gaseous heat dissipation medium is transferred to the second end due to the action of the cooling fluid, that is, the gaseous heat dissipation medium finally transfers the heat to the cold source fluid, and the cold source fluid flows through the cooling assembly to transfer the heat to other positions. That is, when the server assembly 100 is immersed in the cooling liquid, the heat generated by the server assembly 100 is transferred to the cooling liquid, so that the temperature of the cooling liquid rises, and at least part of the heat dissipation medium in the first end of the heat pipe assembly 20 is converted from liquid state to gaseous state, flows to the second end, and the cold source fluid cools the gaseous heat dissipation medium, so that the gaseous heat dissipation medium becomes liquid and returns to the first end, so that the cooling liquid and the heat dissipation medium re-exchange heat to cool the server assembly 100. In some embodiments, by providing the heat pipe assembly 20, and the first end of the heat pipe assembly 20 is located below the liquid level of the cooling liquid, and the second end is located above the liquid level of the cooling liquid, so that at least part of the heat dissipation medium in the heat pipe assembly 20 can be converted from liquid state to gaseous state, so that the temperature of the cooling liquid is reduced, and the server assembly 100 immersed in the cooling liquid is effectively cooled, and the cooling efficiency of the server assembly 100 is improved.

[0050] In some embodiments, the cooling assembly can be a power pump with driving function, which can drive the cold source fluid to the second end of the heat pipe assembly 20. Of course, the cooling assembly can also be other types, for example, the cooling assembly can be a cooling tower, and for another example, the cooling assembly can be a component with refrigeration function. The type of the cooling assembly is not limited.

[0051] In addition, in some embodiments, the server assembly 100 can include a server cabinet and a server body located in the server cabinet, and the server cabinet can be provided with liquid flow holes, so that when the server assembly 100 is placed in the cooling liquid, the cooling liquid can flow into the server cabinet through the liquid flow holes and fully contact the server body to cool the server body. Wherein, the server cabinet has an upper top surface and a lower bottom surface, and the liquid flow holes can be provided on the upper top surface and the lower bottom surface, so as to ensure that the cooling liquid flows out of the server cabinet after flowing into the server cabinet, facilitating cooling of the server body.

[0052] In addition, in some embodiments, the containing shell 10 can have a containing cavity and an opening communicating with the containing cavity, and the containing cavity is fixed with a support assembly 30, and the support assembly 30 includes at least one fixed support 31; the containing shell 10 has a first direction, and the fixed supports 31 are spaced apart along the first direction, and the fixed supports 31 are used to connect the second ends of the heat pipe assemblies 20 and are located above the liquid level of the cooling liquid.

[0053] Since the containing cavity is fixed with the support assembly 30, when it is necessary to arrange the heat pipe assemblies 20 in the containing cavity, the heat pipe assemblies 20 can be directly arranged on the support assembly 30, so that the support assembly 30 supports the heat pipe assemblies 20. Since the support assembly 30 includes at least one fixed support 31, the fixed supports 31 are spaced apart along the first direction, and the fixed supports 31 are located above the liquid level of the cooling liquid, the second ends of the heat pipe assemblies 20 can be connected to the fixed supports 31, and multiple heat pipe assemblies 20 can be arranged in the containing cavity, so that the multiple heat pipe assemblies 20 can quickly exchange heat with the cooling liquid to cool the cooling liquid, thereby improving the cooling efficiency of the server assembly 100.

[0054] When multiple fixed supports 31 are arranged in the containing cavity along the first direction, the server assembly 100 can be arranged between two adjacent fixed supports 31 along the first direction, and the server assembly 100 can also be arranged between the fixed supports 31 and the cavity wall of the containing cavity. That is, the server assembly 100 and the fixed supports 31 are alternately arranged in the containing cavity.

[0055] In addition, in some embodiments, the first end of the heat pipe assembly 20 can be provided with multiple fins 201, and the multiple fins 201 are all located below the liquid level of the cooling liquid.

[0056] Since the first end of the heat pipe assembly 20 is provided with the plurality of fins 201, after the first end of the heat pipe assembly 20 is placed below the liquid level of the cooling liquid, the plurality of fins 201 is equivalent to increasing the heat exchange area of the first end, so that the first end of the heat pipe assembly 20 can quickly exchange heat with the cooling liquid, and then the heat dissipation working medium in the heat pipe assembly 20 can quickly convert from liquid to gas to transfer heat. By providing the plurality of fins 201 on the first end of the heat pipe assembly 20, the heat exchange efficiency of the first end of the heat pipe assembly 20 can be improved, and then the cooling efficiency of the server assembly 100 can be improved.

[0057] It should be noted that the plurality of fins 201 can be spaced apart along the axial direction of the heat pipe assembly 20.

[0058] In addition, in some embodiments, the second end of the heat pipe assembly 20 can be connected with a containing member 40, the containing member 40 has a cavity, and the containing member 40 is provided with a liquid inlet joint 41 and a liquid outlet joint 42. The cooling assembly injects the cooling source fluid into the cavity through the liquid inlet joint 41, and the cooling source fluid flows out of the cavity through the liquid outlet joint 42, so as to circulate the cooling source fluid in the cavity.

[0059] Since the second end of the heat pipe assembly 20 can be connected with the containing member 40, and the containing member 40 is provided with the liquid inlet joint 41 and the liquid outlet joint 42, the cooling source fluid can flow into the cavity of the containing member 40 through the liquid inlet joint 41. Once the cooling source fluid enters the cavity, it can exchange heat with the second end of the heat pipe assembly 20, so that the gaseous heat dissipation working medium can quickly exchange heat and liquefy at the second end of the heat pipe assembly 20. In addition, by providing the liquid inlet joint 41, the liquid inlet joint 41 of the heat pipe assembly 20 can be connected to the cooling assembly, so that the cooling assembly can inject the cooling source fluid into the cavity. The existence of the liquid outlet joint 42 can ensure that the cooling source fluid in the cavity flows out, so that the cooling source fluid can continuously flow into the cavity and continuously flow out, so that the cooling source fluid in the cavity can effectively exchange heat with the second end of the heat pipe assembly 20.

[0060] It should be noted that the cooling assembly can be connected with the liquid inlet joint 41, and the liquid outlet joint 42 can also be connected with the cooling assembly.

[0061] In addition, in some embodiments, the heat pipe assembly 20 can include a plurality of heat pipe bodies 21, the plurality of heat pipe bodies 21 are spaced apart and uniformly distributed, the first end of the heat pipe body 21 is below the liquid level of the cooling liquid, and the second end of the heat pipe body 21 is above the liquid level of the cooling liquid; the shape of the second end of the heat pipe body 21 is funnel-shaped, and the second end of the heat pipe body 21 is connected with the containing member 40, and the containing members 40 connected by adjacent two heat pipe bodies 21 are connected with each other; wherein the heat pipe body 21 is provided with a heat dissipation working medium.

[0062] Since the plurality of heat pipe bodies 21 are spaced and uniformly distributed, the first end of the heat pipe body 21 is below the liquid level of the cooling liquid, and the second end of the heat pipe body 21 is above the liquid level of the cooling liquid. Therefore, once the server assembly 100 is immersed in the cooling liquid, when the temperature of the cooling liquid rises due to the heating of the server assembly 100, the heat dissipation working medium in the heat pipe body 21 will change from liquid to gas and flow from the first end to the second end, so that the heat of the cooling liquid is transferred to the second end by the heat dissipation working medium. Since the shape of the second end of the heat pipe body 21 is funnel-shaped, and the second end of the heat pipe body 21 is connected with the containing member 40, once the heat dissipation working medium in the gas state is transferred to the second end, the cold source fluid flows in the containing member 40 of the second end, so that the temperature of the second end is reduced, that is, the second end of the heat pipe body 21 exchanges heat with the cooling fluid in the containing member 40, so that the heat dissipation working medium in the gas state at the second end changes to the heat dissipation working medium in the liquid state, and the shape of the second end is funnel-shaped, so that the heat dissipation working medium in the liquid state flows back to the first end. In addition, the containing members 40 connected by the adjacent two heat pipe bodies 21 are connected with each other, so that the cooling fluid can flow through the containing members 40 on each heat pipe body 21 in the heat pipe assembly 20, so that the second end of each heat pipe body 21 can exchange heat, improve the efficiency of cooling the cooling liquid, and further improve the efficiency of cooling the server assembly 100.

[0063] It should be noted that in the containing members 40 connected by the adjacent two heat pipe bodies 21, the liquid inlet joint 41 on one containing member 40 is connected with the liquid outlet joint 42 on another containing member 40, and the liquid inlet joint 41 of the first containing member 40 in the plurality of containing members 40 connected after connection is connected with the cooling assembly, and the liquid outlet joint 42 of the last containing member 40 in the plurality of containing members 40 connected after connection is connected with the cooling assembly.

[0064] In addition, in some embodiments, the second end of the heat pipe body 21 can be connected with a connecting plate 22, the connecting plate 22 has opposite first and second surfaces, the second end of the heat pipe body 21 is connected to the first surface, and the connecting plate 22 blocks the second end of the heat pipe body 21, and the containing member 40 is arranged on the second surface.

[0065] Since the second end of the heat pipe body 21 can be connected with the connecting plate 22, the connecting plate 22 has opposite first and second surfaces, when the heat pipe body 21 is connected, the second end of the heat pipe body 21 can be directly connected to the first surface of the connecting plate 22, and the second end of the heat pipe body 21 is blocked by the connecting plate 22, avoiding leakage of the heat dissipation working medium from the second end, and the containing member 40 can be directly arranged on the second surface, so that the containing member 40 and the second end of the heat pipe body 21 can quickly exchange heat. By arranging the connecting plate 22, not only can the heat pipe body 21 and the containing member 40 be conveniently connected, but also the efficiency of heat exchange between the containing member 40 and the second end of the heat pipe body 21 is improved.

[0066] It should be noted that the material of the connecting plate 22 can be a metal material with good heat transfer, for example, the material of the connecting plate 22 is copper, and for another example, the material of the connecting plate 22 is silver. No limitation is made thereto.

[0067] In addition, in some embodiments, a meandering flow channel can be arranged in the cavity of the containing member 40, so that after the cold source fluid flows into the cavity of the containing member 40, the cold source fluid flows in the meandering flow channel, so that the time of the cold source fluid flowing in the cavity of the containing member 40 is increased, and the heat exchange efficiency of the heat exchange between the cold source fluid and the second end of the heat conduction pipe body 21 is improved.

[0068] In addition, in some embodiments, the lengths of at least two of the plurality of heat conduction pipe bodies 21 can be different. The length of the heat conduction pipe body 21 is the distance from the first end to the second end of the heat conduction pipe body 21.

[0069] Since the lengths of at least two of the plurality of heat conduction pipe bodies 21 are different, once the first ends of the plurality of heat conduction pipe bodies 21 are placed in the cooling liquid and the server assembly 100 is placed in the cooling liquid, the second ends of the heat conduction pipe bodies 21 of different lengths will correspond to different positions of the server assembly 100, and when the server assembly 100 generates heat, the heat is generated at different positions. Therefore, the second ends of the heat conduction pipe bodies 21 of different lengths will correspond to different positions of the server assembly 100, so that when the heat generated by the server assembly 100 causes the temperature of the cooling liquid around it to rise, the heat of the cooling liquid will be absorbed by the first ends of the heat conduction pipe bodies 21 of different lengths and heat exchange will occur. Therefore, the heat generated at different positions of the server assembly 100 can be quickly transferred to the first ends of the heat conduction pipe assembly 20. That is, by making the lengths of at least two of the plurality of heat conduction pipe bodies 21 different, the heat generated at different positions of the server assembly 100 in the cooling liquid can be quickly transferred to the first ends of the heat conduction pipe bodies 21, thereby effectively improving the efficiency of cooling the server assembly 100. The second end of the heat conduction pipe body 21 is connected to the fixed support 31, so that the second end of the heat conduction pipe body 21 is located in the same plane, and the lengths of the heat conduction pipe bodies 21 are different, so that the depths of the first ends of the different heat conduction pipe bodies 21 extending into the cooling liquid are different, so that the first ends of the different heat conduction pipe bodies 21 can correspond to different positions of the server assembly 100.

[0070] It should be noted that the lengths of adjacent two of the plurality of heat conduction pipe bodies 21 can be different, and of course, the lengths of two of the heat conduction pipe bodies 21 can be different, and the lengths of the remaining heat conduction pipe bodies 21 can be the same. No limitation is made thereto. For example, the number of heat conduction pipe bodies 21 is three, and the lengths of the three heat conduction pipe bodies 21 are different.

[0071] In addition, in some embodiments, the inner wall of the heat conduction pipe body 21 can be provided with grooves, and / or the inner wall of the heat conduction pipe body 21 is provided with fins to increase the heat exchange area of the heat conduction pipe body 21. By providing grooves and / or fins on the inner wall of the heat conduction pipe body 21, the heat exchange area of the heat conduction pipe body 21 can be effectively increased, so that the heat dissipation working medium in the heat conduction pipe body 21 can effectively exchange heat with the cooling liquid.

[0072] It should be noted that the grooves can be provided only on the inner wall of the heat conduction pipe body 21, and the fins can be provided only on the inner wall of the heat conduction pipe body 21, and the grooves and the fins can be provided on the inner wall of the heat conduction pipe body 21 at the same time. This is not limited.

[0073] In addition, the number of grooves and the number of fins can be set according to actual needs. When the number of grooves is multiple, the multiple grooves can be distributed along the axial direction of the heat conduction pipe body 21; when the number of fins is multiple, the multiple fins can be distributed along the axial direction of the heat conduction pipe body 21.

[0074] In addition, in some embodiments, the liquid inlet connector 41 can be connected with a first temperature sensor, and the liquid outlet connector 42 can be connected with a second temperature sensor, the first temperature sensor is used to detect the temperature of the cooling source fluid flowing through the liquid inlet connector 41, and the second temperature sensor is used to detect the temperature of the cooling source fluid flowing through the liquid outlet connector 42.

[0075] Since the liquid inlet connector 41 can be connected with a first temperature sensor, and the liquid outlet connector 42 can be connected with a second temperature sensor, once the cooling source fluid flows through the liquid inlet connector 41 and the liquid outlet connector 42, the first temperature sensor and the second temperature sensor can respectively detect the temperature of the cooling source fluid flowing through the liquid inlet connector 41 and the liquid outlet connector 42, so that the temperature of the cooling source fluid flowing through the liquid inlet connector 41 and the liquid outlet connector 42 can be determined in real time, and then the temperature of the cooling source fluid can be adjusted according to the detected temperature value. That is, by providing the first temperature sensor and the second temperature sensor, the temperature of the cooling source fluid flowing through the liquid inlet connector 41 and the liquid outlet connector 42 can be quickly determined, and then the temperature of the cooling source fluid can be adjusted to improve the cooling efficiency of the server assembly 100.

[0076] In addition, in some embodiments, the liquid cooling device can further include a controller and an alarm; the first temperature sensor and the second temperature sensor are electrically connected with the controller, the controller is electrically connected with the alarm, and the controller is used to control the alarm to issue alarm information when it is determined that the temperature value detected by the first temperature sensor and / or the second temperature sensor is greater than a preset temperature value.

[0077] Since the first temperature sensor and the second temperature sensor are both electrically connected with the controller, and the controller is electrically connected with the alarm, the temperature value of the cold source fluid flowing through the liquid inlet joint 41 detected by the first temperature sensor can be transmitted to the controller, and the temperature value of the cold source fluid flowing through the liquid outlet joint 42 detected by the second temperature sensor can also be transmitted to the controller, so that the controller can determine whether the obtained temperature value is greater than the preset temperature value after obtaining the temperature value, and if it is greater than the preset temperature value, it indicates that the cold source fluid may have a problem, so that the controller controls the alarm to issue alarm information to notify the operator, so that the operator can check the cooling assembly or the cold source fluid. That is, by setting the controller and the alarm, the operator can quickly know the problem of the liquid cooling device during operation, and then the liquid cooling device can be quickly checked.

[0078] It should be noted that the alarm can be a buzzer, of course, the alarm can also be an alarm lamp. The type of alarm is not limited. In addition, the controller can be a programmable logic controller, of course, the controller can also be a control function circuit board. The type of controller is not limited.

[0079] In addition, in some embodiments, the liquid outlet joint 42 of one containing piece 40 and the liquid inlet joint 41 of another containing piece 40 can be connected by a flexible bellows 001 in the containing piece 40 connected with the two adjacent heat-conducting pipe bodies 21. Through such a setting, the length of the flexible bellows 001 can be adjusted when connecting the two containing pieces 40, so that the two containing pieces 40 can be set as required, so that the containing piece 40 is set more reasonably.

[0080] It should be noted that one end of the flexible bellows 001 can be connected to the liquid inlet joint 41 on one containing piece 40, and the other end of the flexible bellows 001 can be connected to the liquid outlet joint 42 on another containing piece 40.

[0081] In addition, in some embodiments, the second surface can be spaced apart from at least two protrusions 221, the containing shell 10 has a containing cavity, the containing cavity is fixed with a support assembly 30, the support assembly 30 includes at least one fixed support 31, the fixed support 31 includes a first fixed strip 311 and a second fixed strip 312, the first fixed strip 311 and the second fixed strip 312 are spaced apart, and the first fixed strip 311 and the second fixed strip 312 are both fixed to the cavity wall of the containing cavity; the heat-conducting pipe body 21 is located between the first fixed strip 311 and the second fixed strip 312, and the at least two protrusions 221 respectively abut against the first fixed strip 311 and the second fixed strip 312 to fix the heat-conducting pipe body 21.

[0082] Since the first fixing strips 311 and the second fixing strips 312 are spaced apart, the first fixing strips 311 and the second fixing strips 312 are fixed to the cavity wall of the accommodating cavity, and therefore, a gap is formed between the first fixing strips 311 and the second fixing strips 312, so that the heat pipe body 21 can be arranged in the gap, and the heat pipe body 21 is preliminarily fixed. Since the second surface of the connecting plate 22 is provided with at least two protrusions 221, and the at least two protrusions 221 respectively abut against the first fixing strips 311 and the second fixing strips 312, the at least two protrusions 221 can further fix the connecting plate 22, and further fix the heat pipe body 21, so that the heat pipe body 21 is limited in the direction of the first fixing strips 311 to the second fixing strips 312, and the problem of easy shaking of the heat pipe body 21 in the direction of the first fixing strips 311 to the second fixing strips 312 is avoided, and therefore, the heat exchange of the heat dissipation working medium in the heat pipe body 21 can be effectively performed, and the server assembly 100 is cooled. That is, by arranging the first fixing strips 311 and the second fixing strips 312, the heat pipe body 21 can be limited, and the cooling efficiency of the server assembly 100 is improved.

[0083] The first fixing strips 311 can be fixed to the cavity wall of the accommodating cavity by bolts, of course, the fixing manner of the first fixing strips 311 to the cavity wall of the accommodating cavity can also be other manners, for example, the first fixing strips 311 are fixed to the cavity wall of the accommodating cavity by welding. This is not limited. In addition, the second fixing strips 312 can be fixed to the cavity wall of the accommodating cavity by bolts, of course, the fixing manner of the second fixing strips 312 to the cavity wall of the accommodating cavity can also be other manners, for example, the second fixing strips 312 are fixed to the cavity wall of the accommodating cavity by welding. This is not limited. Wherein, the opposite ends of the first fixing strips 311 are fixed to the cavity wall of the accommodating cavity, and the opposite ends of the second fixing strips 312 are fixed to the cavity wall of the accommodating cavity.

[0084] In addition, in some embodiments, the first fixing strips 311 and the second fixing strips 312 can be provided with fixing members, and the fixing members are connected with the connecting plate 22.

[0085] Since the first fixing strips 311 and the second fixing strips 312 are provided with the fixing members, when the heat pipe body 21 is arranged between the first fixing strips 311 and the second fixing strips 312, the fixing members can be connected with the connecting plate 22, so that the fixing members can further fix the connecting plate 22, and further fix the heat pipe body 21, and further avoid the problem of shaking of the heat pipe body 21. That is, by arranging the fixing members, the heat pipe body 21 can be further fixed, which is beneficial to the heat exchange of the heat dissipation working medium in the heat pipe body 21, and further improves the cooling efficiency of the server assembly 100.

[0086] It should be noted that the fixing member can be a bolt, and of course, the fixing member can also be of other types, for example, the fixing member is a pin. The type of the fixing member is not limited.

[0087] In addition, in some embodiments, the boiling point of the cooling liquid is greater than the maximum temperature when the server component 100 is running. Through such a setting, the problem that the cooling liquid can boil when the server component 100 is running, resulting in an increase in the evaporation rate of the cooling liquid and in turn causing the cooling liquid to be wasted, can be avoided. That is, by setting the boiling point of the cooling liquid to be greater than the maximum temperature when the server component 100 is running, the cooling liquid can be saved.

[0088] In addition, the cooling liquid can also be non-volatile, have a high liquid thermal conductivity and a low dielectric constant, and in addition, the cooling liquid can also have insulation, non-flammability, environmental friendliness, and non-toxicity and harmlessness to the human body. In addition, in some embodiments, the cooling liquid can be a single-phase cooling liquid such as fluorinated liquid and mineral oil.

[0089] In addition, in some embodiments, the boiling point of the heat dissipation working medium is less than the boiling point of the cooling liquid. Through such a setting, the heat dissipation working medium can quickly boil and evaporate when heated, so that the heat dissipation working medium quickly changes from a liquid state to a gaseous state, improving the heat exchange efficiency of the heat dissipation working medium.

[0090] In addition, in some embodiments, the dielectric constant of the cooling liquid is less than 2. Through such a setting, the electrical conductivity of the cooling liquid can be poor, that is, the insulation of the cooling liquid can be good, avoiding the problem that the server component 100 conducts electricity through the cooling liquid, thereby reducing the safety of the liquid cooling device. That is, by setting the dielectric constant of the cooling liquid to be less than 2, the safety of the liquid cooling device can be effectively improved.

[0091] In addition, in some embodiments, a fixing frame can be arranged in the accommodating cavity, and a slide rail is arranged on the cavity wall of the accommodating cavity, the slide rail is opposite to the fixing frame in position, and the slide rail is used to mount the server component 100 to the fixing frame.

[0092] Since the fixing frame is arranged in the accommodating cavity, and the slide rail is arranged on the cavity wall of the accommodating cavity, the slide rail is opposite to the fixing frame in position, when it is needed to arrange the server component 100 in the accommodating cavity, the server component 100 can be placed on the slide rail, and then the server component 100 is slid to be fixed by the fixing frame. The fixing frame can avoid the problem that the server component 100 is easily shaken in the accommodating cavity, causing the server component 100 to possibly knock against the cavity wall of the accommodating cavity, or the server component 100 to knock against the heat dissipation pipe assembly 20. That is, by arranging the slide rail and the fixing frame, not only can the server component 100 be conveniently mounted in the accommodating cavity, but also the server component 100 can be protected.

[0093] In addition, in some embodiments, the liquid cooling device can further include a top cover 50, which is arranged at the opening and covers the opening.

[0094] Through the above arrangement, the top cover 50 can cover the opening, so that the top cover 50 can effectively prevent the cooling liquid from flowing out of the containing cavity after evaporation, thereby avoiding the problem of waste of the cooling liquid. In addition, through the arrangement of the top cover 50, the top cover 50 can also prevent impurities from entering the cooling liquid, thereby avoiding the problems of damage to the performance of the cooling liquid or reduction of the insulation of the cooling liquid. That is, through the arrangement of the opening, the cooling liquid can not only be saved, but also be protected.

[0095] It should be noted that the top cover 50 can be sealingly connected with the opening, which can further ensure that the problem of loss of the cooling liquid after evaporation does not occur.

[0096] In addition, in some embodiments, the containing cavity can be provided with a liquid moving member, which is used to flow the cooling liquid in the containing cavity.

[0097] Since the containing cavity is provided with the liquid moving member, after the server assembly 100 is placed in the cooling liquid, the liquid moving member can be operated, so that the liquid moving member can flow the cooling liquid in the containing cavity, thereby making the temperature distribution of the cooling liquid more uniform after being heated, thereby avoiding the problem that the local overheating of the cooling liquid is not conducive to the heat exchange of the cooling liquid to cool the server assembly 100. That is, through the arrangement of the liquid moving member, the efficiency of cooling the server assembly 100 can be improved.

[0098] It should be noted that the liquid moving member can be a stirrer, and of course, the liquid moving member can also be a circulating pump. The type of the liquid moving member is not limited.

[0099] In addition, in some embodiments, the liquid cooling device can further include a fluid valve, which is connected between the cooling assembly and the liquid inlet connector 41 and is used to adjust the flow of the cooling source fluid flowing into the liquid inlet connector 41.

[0100] Since the fluid valve is connected between the cooling assembly and the liquid inlet connector 41, in actual application, the opening of the fluid valve can be adjusted according to actual needs, so that the flow of the cooling source fluid flowing through the liquid inlet connector 41 is adjusted, thereby making the cooling source fluid can effectively be cooled by the gaseous heat dissipation working medium of the second end of the heat conduction pipe assembly 20, and the efficiency of cooling the server assembly 100 can be improved. That is, through the arrangement of the fluid valve, the efficiency of cooling the server assembly 100 can be improved.

[0101] It should be noted that the fluid valve can be a solenoid valve, of course, the fluid valve can also be other types of valves, for example, the fluid valve is a butterfly valve. The type of fluid valve is not limited.

[0102] In addition, in some embodiments, the accommodating shell 10 can be provided with a through hole above the liquid level of the cooling liquid, the through hole is used for penetrating the cable connected with the server assembly 100, and a sealing element is arranged in the through hole to seal the gap between the cable and the hole wall of the through hole.

[0103] Since the accommodating shell 10 is provided with a through hole above the liquid level of the cooling liquid, when the server assembly 100 is placed in the cooling liquid, the cable connected with the server assembly 100 can be penetrated in the through hole, so that the cable of the server assembly 100 can normally provide power for the server assembly 100 or make the server assembly 100 communicate. In addition, the sealing element is arranged in the through hole to seal the gap between the cable and the hole wall of the through hole, so that the sealing element not only can avoid the steam formed by the evaporation of the cooling liquid from volatilizing from the gap, and the sealing element can avoid the impurities outside the accommodating shell 10 from entering the accommodating shell 10 through the gap, so that the problem of affecting the performance of the cooling liquid occurs. That is, by arranging the through hole and the sealing element, not only can ensure that the server assembly 100 normally powers or communicates, but also can ensure that the cooling liquid is less polluted by the impurities outside the accommodating shell 10, and avoid the problem of more volatilization loss of the cooling liquid.

[0104] In some embodiments, the sealing element can be a rubber sealing ring, of course, the sealing element can also be other types, for example, the sealing element is a foam, and for example, the sealing element is a sealing rubber strip. The type of sealing element is not limited.

[0105] In some embodiments, since the cooling liquid is arranged in the accommodating shell 10, the server assembly 100 can be immersed in the cooling liquid, and the server assembly 100 is located below the liquid level of the cooling liquid, that is, the server is immersed in the cooling liquid, so that the heat generated by the server assembly 100 during operation can be transferred to the cooling liquid, so that the server assembly 100 can be cooled. Since the heat pipe assembly 20 is arranged in the accommodating shell 10, the first end of the heat pipe assembly 20 is located below the liquid level of the cooling liquid, and the second end is located above the liquid level of the cooling liquid, so that when the cooling liquid receives the heat of the server assembly 100 and the temperature rises, the first end of the heat pipe assembly 20 is heated. Since the heat pipe assembly 20 has a heat dissipation working medium inside, the state of the heat dissipation working medium can change, so that when the first end of the heat pipe assembly 20 is heated, at least part of the heat dissipation medium in the heat pipe assembly 20 changes from liquid state to gaseous state, and the gaseous heat dissipation medium moves to the second end, which is equivalent to the heat of the server assembly 100 being finally transferred to the second end of the heat pipe assembly 20. Since the second end of the heat pipe assembly 20 is connected to the cooling assembly, the cooling assembly transfers the cold source fluid to the second end, and the cold source fluid cools the second end, so that when the gaseous heat dissipation medium is transferred to the second end, the gaseous heat dissipation medium is liquefied due to the action of the cooling fluid, that is, the gaseous heat dissipation medium finally transfers the heat to the cold source fluid, and the cold source fluid flows through the cooling assembly to transfer the heat to other positions. That is, when the server assembly 100 is immersed in the cooling liquid, the heat generated by the server assembly 100 is transferred to the cooling liquid, so that the temperature of the cooling liquid rises, and at least part of the heat dissipation medium in the first end of the heat pipe assembly 20 changes from liquid state to gaseous state, flows to the second end, and the cold source fluid cools the gaseous heat dissipation medium, so that the gaseous heat dissipation medium becomes liquid and returns to the first end, so that the cooling liquid and the heat dissipation medium re-exchange heat to cool the server assembly 100. In some embodiments, by arranging the heat pipe assembly 20, and the first end of the heat pipe assembly 20 being located below the liquid level of the cooling liquid and the second end being located above the liquid level of the cooling liquid, at least part of the heat dissipation medium in the heat pipe assembly 20 can change from liquid state to gaseous state, so that the temperature of the cooling liquid decreases, and the server assembly 100 immersed in the cooling liquid is effectively cooled, and the cooling efficiency of the server assembly 100 is improved.

[0106] In some embodiments, a server system is provided, which includes a server assembly and a liquid cooling device in any of the above embodiments; the server assembly is located in an accommodating shell, and the server assembly is immersed in a cooling liquid.

[0107] In the description of the application, reference has been made to descriptive terms such as "one embodiment", "some embodiments", "an embodiment", "example", "specific example" or "some examples" etc. It is emphasized that each of these terms refers to a specific feature, structure, material or characteristic described in connection with a particular embodiment or example. The descriptive terms are not necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0108] While the embodiments of the application have been shown and described, it is to be understood that the embodiments described are only by way of example and that various changes, modifications, substitutions and alterations can be made thereto without departing from the spirit and scope of the application as defined in the claims and their equivalents.

Claims

1. A liquid cooling device, characterized in that, The liquid cooling device includes: a housing and a heat pipe assembly; The housing contains a coolant for immersing the server components. A heat pipe assembly is disposed within the housing and has a first end and a second end opposite to each other. The first end is located below the surface of the coolant, and the second end is located above the coolant. The second end is connected to a cooling component, which transfers a cold source fluid to the second end and cools the second end. The heat pipe assembly contains a heat dissipation medium whose state is changeable, including gaseous and liquid states.

2. The liquid cooling device according to claim 1, characterized in that, The receiving shell has a receiving cavity and an opening, the opening communicating with the receiving cavity, and a support assembly fixed in the receiving cavity, the support assembly including at least one fixed support; The housing has a first direction, the fixing brackets are spaced apart along the first direction, the fixing brackets are used to connect the second end of the heat pipe assembly, and the fixing brackets are located above the surface of the coolant.

3. The liquid cooling device according to claim 1, characterized in that, The first end of the heat pipe assembly is provided with multiple fins, and all of the multiple fins are located below the liquid surface of the coolant.

4. The liquid cooling device according to claim 1, characterized in that, The second end of the heat pipe assembly is connected to a receiving element, which has a cavity and is provided with an inlet connector and an outlet connector. The cooling assembly injects the cold source fluid into the cavity through the inlet connector, and the cold source fluid flows out of the cavity through the outlet connector, so as to circulate the cold source fluid in the cavity.

5. The liquid cooling device according to claim 4, characterized in that, The heat pipe assembly includes multiple heat pipe bodies, which are evenly spaced apart. The first end of each heat pipe body is located below the surface of the coolant, and the second end of each heat pipe body is located above the surface of the coolant. The second end of the heat-conducting pipe is funnel-shaped, and the second end of the heat-conducting pipe is connected to the receiving element, and the receiving elements connected to two adjacent heat-conducting pipes are interconnected. The heat dissipation medium is disposed inside the heat pipe body.

6. The liquid cooling device according to claim 5, characterized in that, The second end of the heat pipe is connected to a connecting plate, the connecting plate having a first surface and a second surface opposite to each other, the second end of the heat pipe being connected to the first surface, and the connecting plate sealing the second end of the heat pipe, the receiving member being disposed on the second surface.

7. The liquid cooling device according to claim 5, characterized in that, At least two of the multiple heat pipes have different lengths, and the length of the heat pipe is the distance from the first end to the second end of the heat pipe.

8. The liquid cooling device according to claim 5, characterized in that, The inner wall of the heat-conducting pipe is provided with grooves, and / or the inner wall of the heat-conducting pipe is provided with ribs to increase the heat exchange area of ​​the heat-conducting pipe.

9. The liquid cooling device according to claim 4, characterized in that, The inlet connector is connected to a first temperature sensor, and the outlet connector is connected to a second temperature sensor. The first temperature sensor is used to detect the temperature of the cold source fluid flowing through the inlet connector, and the second temperature sensor is used to detect the temperature of the cold source fluid flowing through the outlet connector.

10. The liquid cooling device according to claim 9, characterized in that, The liquid cooling device also includes a controller and an alarm; Both the first temperature sensor and the second temperature sensor are electrically connected to the controller, which is electrically connected to the alarm. The controller is used to control the alarm to issue an alarm message when it determines that the temperature value detected by the first temperature sensor and / or the second temperature sensor is greater than a preset temperature value.

11. The liquid cooling device according to claim 5, characterized in that, In the accommodating components connecting two adjacent heat-conducting tubes, the liquid outlet of one accommodating component is connected to the liquid inlet of the other accommodating component via a flexible corrugated pipe.

12. The liquid cooling device according to claim 6, characterized in that, The second surface is provided with at least two protrusions at intervals. The receiving shell has a receiving cavity. A support assembly is fixed in the receiving cavity. The support assembly includes at least one fixed support. The fixed support includes a first fixed strip and a second fixed strip. The first fixed strip and the second fixed strip are distributed at intervals. The first fixed strip and the second fixed strip are both fixed to the cavity wall of the receiving cavity. The heat-conducting pipe body is located between the first fixing strip and the second fixing strip, and at least two of the protrusions abut against the first fixing strip and the second fixing strip respectively to fix the heat-conducting pipe body.

13. The liquid cooling device according to claim 12, characterized in that, Both the first fixing strip and the second fixing strip are provided with fixing members, and the fixing members are connected to the connecting plate.

14. The liquid cooling device according to claim 1, characterized in that, The boiling point of the coolant is greater than the highest operating temperature of the server component.

15. The liquid cooling device according to claim 1, characterized in that, The boiling point of the heat dissipation medium is lower than that of the coolant.

16. The liquid cooling device according to claim 1, characterized in that, The dielectric constant of the coolant is less than 2.

17. The liquid cooling device according to claim 2, characterized in that, A mounting frame is provided in the receiving cavity, and a slide rail is provided on the cavity wall of the receiving cavity. The slide rail is positioned opposite to the mounting frame and is used to install the server component onto the mounting frame.

18. The liquid cooling device according to claim 2, characterized in that, The liquid cooling device also includes a top cover, which is disposed at the opening and covers the opening.

19. The liquid cooling device according to claim 2, characterized in that, The cavity is provided with a liquid moving part, which is used to allow the coolant in the cavity to flow.

20. The liquid cooling device according to claim 4, characterized in that, The liquid cooling device also includes a fluid valve connected between the cooling assembly and the liquid inlet connector. The fluid valve is used to adjust the flow rate of the cold source fluid flowing into the liquid inlet connector.

21. The liquid cooling device according to claim 1, characterized in that, The housing is provided with a through hole, which is located above the surface of the coolant. The through hole is used to pass through the cable connected to the server component. A seal is provided in the through hole to seal the gap between the cable and the wall of the through hole.

22. A server system, characterized in that, The server system includes server components and the liquid cooling device according to any one of claims 1-21; The server component is located within the housing and is submerged in the coolant.

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