Position detection device

Abstract

For example, with respect to a position detection device of an electromagnetic induction method or the like, a position detection device with high reliability that does not mix in noise or emit noise is provided. The position detection sensor comprises a sensor substrate body (1S) and a cable portion (1C) constituting a connection end to a circuit substrate. A shielding layer is provided on the entire second surface of the sensor substrate body (1S) in a manner covering the coil. On the cable portion (1C), a position detection circuit (102) is connected to a surface continuous with the first surface (1C1), and is bent toward the second surface of the sensor substrate body (1S). Thus, the connection portion between the cable portion (1C) and the position detection circuit (102) is not exposed to the outside, thereby preventing the mixing of noise from the outside and the emission of noise to the outside.

Description

Technical Field

[0001] The present invention relates to a position detection device configured using a position detection sensor such as an electromagnetic induction method, for example. Background Art

[0002] As an input device for information processing devices such as personal computers, there is a position detection device called a so-called handwriting tablet that accepts operation input based on a pen-shaped position indicator, i.e., an electronic pen. The position detection device is composed of a position detection sensor and a position detection circuit. The position detection sensor is composed of a sensor substrate body and a cable part (lead-out part). The sensor substrate body is a part equipped with a plurality of X-axis direction electrodes and a plurality of Y-axis direction electrodes. The cable part is a part that leads out and gathers the plurality of X-axis direction electrodes and the plurality of Y-axis direction electrodes arranged on the sensor substrate body in order to facilitate connection to the position detection circuit.

[0003] In the electromagnetic induction position detection sensor, each of the X-axis direction electrode and the Y-axis direction electrode is configured as a ring coil. Furthermore, the electromagnetic induction position detection sensor has a structure in which a transmission period in which power is sequentially supplied to the plurality of coils to generate a magnetic field and a reception period in which power supply is stopped to receive a magnetic field from the outside are alternately provided. The electronic pen corresponding to the position detection sensor has a resonant circuit composed of a coil and a capacitor, and has the following structure: a signal is generated and sent to the position detection sensor by a current flowing through the coil according to a magnetic field from the position detection sensor.

[0004] Thus, the electromagnetic induction position detection device supplies power to the electronic pen during the transmission period, and can drive the electronic pen. In addition, the electromagnetic induction position detection device can detect the indicated position of the electronic pen and the writing pressure applied to the electronic pen by receiving the oscillation signal from the electronic pen during the reception period. In the case of an electromagnetic induction position detection sensor having such a structure, if the position detection sensor and the electronic circuit are arranged close to each other in an overlapping manner, problems may sometimes occur.

[0005] For example, the following problem may occur: during the transmission period, the magnetic field output from the X-axis direction electrode and the Y-axis direction electrode of the position detection sensor, which are configured as a ring coil, to the electronic pen is attenuated by the influence of the metal part of the electronic circuit, and the magnetic field that can be received by the electronic pen becomes weak. In addition, the following problem may occur: the noise generated by the electronic circuit affects the X-axis direction electrode and the Y-axis direction electrode, and the coordinates of the electronic pen cannot be accurately detected.

[0006] Therefore, the invention related to the position detection device etc. which designs the magnetic circuit plate provided between the position detection sensor and the electronic circuit is disclosed in the patent document 1 recorded later. The invention disclosed in the patent document 1 uses the following magnetic circuit plate: the magnetic circuit plate has the performance of an electromagnetic shielding member, does not attenuate the magnetic field generated by the electronic pen, the X-axis direction electrode and the Y-axis direction electrode of the position detection sensor, and is not easily affected by the magnetic noise from the outside. The magnetic circuit plate has an amorphous metal layer and a non-amorphous metal layer.

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Application Publication No. 2009-3796 Summary of the invention

[0010] Problems to be solved by the invention

[0011] Position detection devices are also installed as input devices in portable terminals such as so-called smartphones and tablet PCs (Personal Computers). In recent years, position detection sensors with a structure of a lightweight flexible substrate have been used in position detection devices installed in portable terminals. Figure 6 As shown in (A), in the case of the position detection sensor 300 having a structure of a flexible substrate, a sensor substrate main body 300S and a cable portion 300C are formed integrally.

[0012] For example, when a position detection sensor of a flexible substrate is mounted on a portable terminal equipped with an LCD (Liquid Crystal Display), the sensor substrate body 300S of the position detection sensor 300 is made to correspond to the entire surface of the LCD display screen in order to set the entire surface of the LCD display screen as an indication input area. In addition, operation buttons, a speaker as a receiver, a camera lens, etc. are often arranged in a portion other than the LCD display screen of the portable terminal.

[0013] Therefore, it is difficult to arrange the position detection circuit connected to the position detection sensor under the operation button, speaker, and lens. Figure 6 As shown in FIG. 1B , the cable portion 300C of the position detection sensor 300 is connected to, for example, a circuit substrate 500 having a position detection circuit formed thereon by bending the cable portion 300C at the back side of the sensor substrate body 300S. Therefore, a shielding layer 400 serving as the magnetic circuit plate is provided at the bottom side of the sensor substrate body 300S, the circuit substrate 500 is located at the bottom side thereof, and the cable portion 300C connected to the circuit substrate 500 is located at the bottom layer.

[0014] like Figure 6 As shown in (B), when the cable portion 300C is located at the bottom layer, the connection portion 500C between the cable portion 300C and the circuit substrate 500 is located at the bottom layer, and the connection portion 500C is partially exposed to the outside. In this case, it will become a structure that is easy to mix noise from the outside and release noise to the outside, so it is necessary to cover the connection portion 500C with a shielding member, which is laborious in manufacturing. Moreover, in recent years, in order to improve the performance of portable terminals equipped with position detection devices, more components have been installed, and the miniaturization of the components themselves has been promoted for the purpose of lightweighting. Therefore, with respect to the position detection circuit of the structure set as the circuit substrate, it is also considered to reduce the area of ​​the position detection circuit by changing from a single-sided substrate to a double-sided substrate, and then to a stacked structure such as a 4-layer substrate.

[0015] In this case, the width of the connection portion of the cable unit 300C connected to the circuit board is also narrowed, and the arrangement width of the X-axis direction electrode and the Y-axis direction electrode is also narrower than before. In this way, the arrangement width of the X-axis direction electrode and the Y-axis direction electrode in the cable unit 300C is narrowed, and the electrodes are densely arranged, so there is a possibility that noise from the outside is easily mixed in or conversely, noise is easily released to the outside. Therefore, a simple and reliable measure is sought to prevent the function of the position detection device from being reduced due to noise from the outside or noise from being released to the outside from the position detection device without relying on the method of providing a shield.

[0016] In view of the above circumstances, an object of the present invention is to provide a position detection device of an electromagnetic induction method or the like, which does not mix in noise or emit noise and has high reliability.

[0017] Means for solving problems

[0018] In order to solve the above problems,

[0019] Provided is a position detection device, used together with a position indicator, comprising a position detection sensor and a circuit substrate having a position detection circuit connected to the position detection sensor, wherein the position detection sensor comprises a sensor substrate body having electrodes for receiving indication input from the position indicator and a cable portion for leading out the electrodes, wherein the position detection device is characterized in that:

[0020] The sensor substrate body of the position detection sensor includes an insulating substrate, and conductors constituting the electrodes are formed on a first surface of the insulating substrate on a side indicated by the position indicator and a second surface of the insulating substrate on a side opposite to the first surface.

[0021] A shielding layer is provided on the entire surface of the second surface so as to cover the electrode formed on the second surface.

[0022] The cable portion of the position detection sensor is connected to the circuit board on a surface continuous with the first surface of the sensor substrate body, and is bent toward the second surface of the sensor substrate body so that the circuit board is located at the bottom layer.

[0023] According to the position detection device of the present invention, the position detection device is composed of a position detection sensor and a circuit substrate having a position detection circuit. The position detection sensor includes a sensor substrate body and a cable portion constituting a connection end to the circuit substrate. The sensor substrate body has electrodes formed by conductors on both sides (first side and second side) of an insulating substrate. The first side is the side (front side) indicated by the position indicator, and the second side is the side (back side) opposite to the first side.

[0024] A shielding layer is provided on the entire second surface of the sensor substrate body in a manner covering the electrode. On the other hand, on the cable portion, the circuit substrate is connected to the surface continuous with the first surface and is bent toward the second surface of the sensor substrate body. Thus, the circuit substrate is positioned at the bottom layer. Therefore, the connection portion between the cable portion and the circuit substrate is not located at the bottom layer (not exposed to the outside), and the mixing of noise from the outside and the emission of noise to the outside can be prevented, thereby realizing a position detection device with high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a diagram for explaining a configuration example of an embodiment of a position detection device of the present invention and a configuration example of an electronic pen used for the position detection device.

[0026] Figure 2 This is a diagram for explaining an electromagnetic induction type position detection sensor used in the position detection device according to the embodiment.

[0027] Figure 3 It is a cross-sectional view for explaining a specific configuration example of the position detection device according to the embodiment.

[0028] Figure 4 It is a cross-sectional view for explaining a configuration example of a circuit board constituting the position detection circuit according to the embodiment.

[0029] Figure 5 This is a diagram for explaining a configuration example of an electronic device equipped with the position detection device according to the embodiment.

[0030] Figure 6 This is a diagram for explaining a configuration example of a conventional position detection device. DETAILED DESCRIPTION

[0031] [Configuration Example of Position Detection Device]

[0032] Figure 1 1 is a diagram for explaining a configuration example of an embodiment of a position detection device of the present invention and a configuration example of an electronic pen used for the position detection device. In this embodiment, a position detection device 100 configured by applying an embodiment of the present invention and an electronic pen 200 used for the position detection device 100 are electromagnetic induction type. Figure 1 As shown in the upper left of FIG. , the electronic pen 200 includes a resonant circuit formed by connecting a coil L for transmitting and receiving signals, a writing pressure detection unit Cv which is a variable capacitance capacitor, and a resonant capacitor Cf in parallel.

[0033] The position detection device 100 includes a position detection sensor 1 formed by stacking an X-axis direction loop coil group 12X and a Y-axis direction loop coil group 12Y. The loop coils X1, X2, ..., X 40 and the annular coils Y1, Y2, ..., Y of the Y-axis annular coil group 12Y 30 There are both one-turn and more than two-turn cases. Figure 1 In FIG. 1 , the position detection sensor 1 is simplified and shown, and the detailed structure of the position detection sensor 1 will be described later. The position detection sensor 1 is connected to the position detection circuit 102 to form a position detection device 100 as a whole.

[0034] The position detection circuit 102 is composed of an oscillator 104, a current driver 105, a selection circuit 106, a switching connection circuit 107, a receiving amplifier 108, a position detection circuit 109, a pen pressure detection circuit 110, and a processing control unit 111. Figure 1 As shown, the X-axis direction loop coil group 12X and the Y-axis direction loop coil group 12Y of the position detection sensor 1 are connected to the selection circuit 106. The selection circuit 106 sequentially selects one of the two loop coil groups 12X and 12Y under the control of the processing control unit 111.

[0035] The processing control unit 111 is composed of a microprocessor and controls the selection of the loop coil in the selection circuit 106 and the switching of the switching connection circuit 107 , and controls the processing timing in the position detection circuit 109 and the writing pressure detection circuit 110 .

[0036] The oscillator 104 generates an AC signal of a frequency f0. The oscillator 104 supplies the generated AC signal to the current driver 105 and the pen pressure detection circuit 110. The current driver 105 converts the AC signal supplied from the oscillator 104 into a current and sends it to the switching connection circuit 107. The switching connection circuit 107 switches the connection object (transmission side terminal T, reception side terminal R) connected to the ring coil selected by the selection circuit 106 under the control of the processing control unit 111. The current driver 105 is connected to the transmission side terminal T of the connection object, and the reception amplifier 108 is connected to the reception side terminal R.

[0037] The switching connection circuit 107 is switched to the transmission side terminal T side during the transmission period, and is switched to the reception side terminal R side during the reception period. Thus, during the transmission period, the loop coil that receives the current supplied from the current driver 105 via the transmission side terminal T generates a magnetic field, transmits the magnetic field to the electronic pen 200, and acts on the resonance circuit of the electronic pen 200. In this case, the resonance circuit of the electronic pen 200 generates a position indication signal (radio wave) and transmits it to the position detection sensor 1 side.

[0038] On the other hand, during the reception period, the loop coil selected by the selection circuit 106 is connected to the reception amplifier 108 via the reception-side terminal R. When the loop coil receives the magnetic field from the electronic pen 200, an induced voltage is generated in the loop coil, and the induced voltage is transmitted to the reception amplifier 108 via the selection circuit 106 and the switching connection circuit 107. The reception amplifier 108 amplifies the induced voltage supplied from the loop coil and transmits it to the position detection circuit 109 and the pen pressure detection circuit 110.

[0039] That is, in each loop coil of the X-axis direction loop coil group 12X and the Y-axis direction loop coil group 12Y, an induced voltage is generated by the radio wave transmitted from the electronic pen 200. Therefore, the position detection circuit 109 detects the induced voltage (received signal) generated in the loop coil, converts the detection output signal into a digital signal, and outputs it to the processing control unit 111. The processing control unit 111 calculates the coordinate value of the indicated position of the electronic pen 200 in the X-axis direction and the Y-axis direction based on the digital signal from the position detection circuit 109, that is, the level of the voltage value of the induced voltage generated in each loop coil.

[0040] On the other hand, the pen pressure detection circuit 110 performs synchronous detection on the output signal of the receiving amplifier 108 using the AC signal from the oscillator 104, obtains a signal of a level corresponding to the phase difference (frequency shift) therebetween, converts the signal corresponding to the phase difference (frequency shift) into a digital signal, and outputs it to the processing control unit 111. The processing control unit 111 detects the pen pressure applied to the electronic pen 200 based on the digital signal from the pen pressure detection circuit 110, that is, the level of the signal corresponding to the phase difference (frequency shift) between the transmitted radio wave and the received radio wave.

[0041] In this way, the position detection circuit 102 switches between the signal transmission period and the signal reception period. During the transmission period, the electronic pen 200 is driven by supplying driving power, and during the reception period, the electronic pen 200 receives the signal from the electronic pen 200 to detect the indicated position and the writing pressure. The position detection circuit 102 is configured as a circuit substrate. Thus, by connecting the cable portion 1C of the position detection sensor 1 to the position detection circuit 102 configured as the circuit substrate, a position detection device can be realized, and can be mounted as an input device for a smartphone, a tablet PC (Personal Computer), etc.

[0042] [Configuration example of position detection sensor]

[0043] Figure 2 1 is a diagram for explaining a specific configuration example of a position detection sensor 1 for space saving. Figure 2 (A) is a top view. Figure 2 (B) is the side view of the long side. Figure 2 (C) is a cross-sectional view of the portion including the cable portion on the long side. It should be noted that, as will be described in detail later, the position detection sensor 1 is provided with a so-called shielding layer (equivalent to the above-mentioned magnetic circuit plate) for preventing the attenuation of the magnetic field generated by the electronic pen and the position detection sensor and for preventing the influence of magnetic noise from the outside. However, Figure 2 In order to simplify the description, the shield layer is omitted. Therefore, it can be said that the position detection sensor 1 constitutes a sensor layer with respect to the shield layer.

[0044] The position detection sensor 1 of this embodiment is configured as a so-called flexible substrate, which is thin and flexible, can be repeatedly deformed by a weak force, and can maintain its electrical characteristics even when deformed. Figure 2 As shown in (A), the position detection sensor 1, when viewed from the first surface (operation surface) 1S1 side, which is the side where the electronic pen 200 points the position, is composed of a large rectangular sensor substrate body 1S and a cable portion 1C extending from the sensor substrate body 1S. It should be noted that Figure 2The cable portion 1C shown in (A) is formed in a rectangular shape or a trapezoidal shape, and can be formed in various shapes.

[0045] The sensor substrate body 1S is a part that has a coil for electromagnetic coupling with the electronic pen 200 and receives position instructions from the electronic pen 200. The cable part 1C is formed by gathering the wire parts (connection line parts) of the power supply wires drawn from both ends of the coil body part that functions as a coil provided in the sensor substrate body 1S to connect with the user. Figure 1 The cable portion 1C is a connection end portion of the position detection circuit (circuit board) 102 described above. That is, the line portion of the power supply line drawn from the coil is a portion connected to the selection circuit 106 of the position detection circuit 102 in order to supply the current from the position detection circuit to the coil or to supply the signal from the coil to the position detection circuit. In this way, the cable portion 1C is a portion for facilitating the connection between the coil provided on the sensor substrate body 1S and the position detection circuit 102.

[0046] When the position detection sensor 1 is mounted on a portable terminal such as a smartphone or tablet PC, the sensor substrate body 1S is configured to be slightly larger than the display screen of a display device such as an LCD (Liquid Crystal Display) and to correspond to the entire surface of the display screen. In addition, when the position detection sensor 1 is mounted on a portable terminal, from the perspective of the large screen of the LCD, the miniaturization of the housing, and the securing of a space for the camera unit and the operating unit, the cable unit 1C often cannot be housed in the housing of the portable terminal when it is extended. Therefore, if Figure 2 As shown in (B), the cable portion 1C is bent toward the second surface (back surface) 1S2 of the sensor substrate body 1S opposite to the first surface 1S1 and connected to the position detection circuit 102 (circuit board) at the lower side of the sensor substrate body 1S.

[0047] Therefore, when the position detection sensor 1 is mounted on a portable terminal or the like, the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable portion 1C face each other. Figure 2 In the state shown in (A), the first surface 1S1 of the sensor substrate body 1S and the first surface 1C1 of the cable portion 1C, which are surfaces in the same direction, are folded by the cable portion 1C to become surfaces opposite to each other.

[0048] Thus, in this embodiment, the surface of the sensor substrate body 1S and the surface of the cable portion 1C are distinguished. Figure 2 As shown in (B), the surface of the cable portion 1C connected to the first surface 1S1 of the sensor substrate body 1S is referred to as the first surface 1C1 of the cable portion 1C, and the surface of the cable portion 1C connected to the second surface 1S2 of the sensor substrate body 1S is referred to as the second surface 1C2 of the cable portion 1C.

[0049] If used Figure 1 As described above, the sensor substrate body 1S of the position detection sensor 1 is composed of a stack of the X-axis direction loop coil group 12X and the Y-axis direction loop coil group 12Y. In the portion where the coils are provided, that is, the sensor layer 1X, Figure 2 As shown in FIG. 1 , an X-axis circular coil group 12X is provided on the second surface (lower surface) of the insulating substrate 11, and an Y-axis circular coil group 12Y is provided on the first surface (upper surface). A surface sheet 13 is provided on the Y-axis circular coil group 12Y to protect the Y-axis circular coil group 12Y.

[0050] It should be noted that the cable portion 1C has the same structure as the sensor substrate body 1S in which the X-axis direction annular coil group 12X, the insulating substrate 11, the Y-axis direction annular coil group 12Y, and the surface sheet 13 are stacked in this order from the bottom. However, the wire portions of the power supply wires of each annular coil of the X-axis direction annular coil group 12X and the wire portions of the power supply wires of each annular coil of the Y-axis direction annular coil group 12Y are led outward (toward the first surface 1C1 side of the cable portion 1C) in order to facilitate connection to the position detection circuit 102.

[0051] Therefore, in this embodiment, the wire portions of the power supply wires of each annular coil of the X-axis annular coil group 12X and the wire portions of the power supply wires of each annular coil of the Y-axis direction annular coil group 12Y are led out to the first surface 1C1 side. Figure 2 In the right end of (C), the annular coil of the X-axis annular coil group 12X on the second surface 1C2 side is shortened, indicating that it is led to the first surface 1C1 side. In addition, the portion where the surface sheet 13 does not exist on the first surface 1C1 side of the cable portion 1C is the portion where the wire portion of the power supply wire of each coil connected to the connection portion 102C of the position detection circuit 102 is exposed. The wire portions of the power supply wires of all the annular coils led to the portion of the first surface 1C1 without the surface sheet 13 are connected to the connection portion 102C of the position detection circuit 102.

[0052] Thus, in this embodiment, if Figure 2 As shown in (B), the wire portion of the power supply wire of the coil led out to the first surface 1C1 of the cable unit 1C is connected to the connection portion 102C of the position detection circuit 102 on the first surface 1C1. The connection portion 102C of the position detection circuit 102 with the wire portion of the power supply wire of the coil is not as shown in FIG. Figure 6 (B) is located on the outside of the position detection circuit 102 as in the case of the conventional example. Figure 2As shown in (B), the connection portion 102C of the position detection circuit 102 with the wire portion of the power supply line of the coil is located on the surface of the position detection circuit 102 on the side opposite to the second surface 1S2 of the sensor substrate body 1S. As a result, the connection portion 102C of the position detection circuit 102 with the wire portion of the power supply line of the coil is not exposed to the outside, so that it is possible to prevent noise from the outside from entering from the connection portion 102C or noise from the connection portion 102C to the outside.

[0053] In addition, as will be described in detail later, the structure of the position detection circuit 102 also plays a role in preventing the mixing and emission of noise. Figure 2 As shown in (C), the position detection sensor 1 has a structure in which an X-axis direction annular coil group 12X and a Y-axis direction annular coil group 12Y are stacked. It is necessary to configure a metal part of the electronic circuit nearby to attenuate the magnetic field generated by each annular coil of these annular coil groups 12X and 12Y, and to prevent the mixing of magnetic noise from the outside. Therefore, as described below, on the second surface side (on Figure 2 In the example shown in (C), a shield layer is provided on the lower side of the X-axis annular coil group 12X.

[0054] [Configuration Example of Position Detection Device 100]

[0055] Figure 3 1 is a diagram for explaining a specific structural example of the position detection device 100 of this embodiment, and is a cross-sectional view of a portion where the sensor substrate body 1S and the cable portion 1C of the position detection sensor 1 of the position detection device 100 are connected and cut along the length direction. The thickness of each layer constituting the position detection sensor 1 is actually less than 1 mm. Figure 2 As described in (B), the cable portion 1C is bent toward the second surface 1S2 of the sensor substrate body 1S and fixed to the shield layer on the second surface 1S2. Figure 3 In order to clearly show the stacked structure of the position detection sensor 1 , each main layer is shown with thickness.

[0056] Therefore, in Figure 3 In the figure, the bent portion of the position detection sensor 1 forms a bend, but in reality Figure 2 As shown in (B), it can be folded like a slightly thick paper, so the thickness in the direction intersecting the longitudinal direction does not change significantly. In addition, as mentioned above, the thickness of each layer constituting the position detection sensor 1 is thin, less than 1 mm, so Figure 3 As shown, even when bent, the lengths of the layers in the longitudinal direction do not differ greatly.

[0057] In addition, Figure 3In (A) to (E), the uppermost sensor layer 1X has Figure 2 (C) The stacked structure described. Figure 3 In (A) to (E), the position P indicated by the arrow shows the boundary position between the sensor substrate body 1S and the cable portion 1C. Figure 3 In (A) to (E), the left side of the position P is the sensor substrate main body 1S, and the right side of the position P (the bent portion) is the cable portion 1C.

[0058] <First Example of Position Detection Device 100>

[0059] Figure 3 (A) shows a first example of the position detection device 100. The first example of the position detection device 100 is provided with a magnetic powder material layer 14 as a shielding layer so as to cover the X-axis direction annular coil group 12X formed on the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X. Therefore, the magnetic powder material layer 14 does not cover the second surface 1C2 of the cable part 1C.

[0060] Therefore, when the cable portion 1C is bent toward the second surface 1S2 of the sensor substrate body 1S, as shown in FIG. Figure 3 As shown in (A), the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable portion 1C face each other with the magnetic powder material layer 14 sandwiched therebetween. In addition, on the first surface 1C1 of the cable portion 1C, one end of each of the annular coils of the X-axis direction annular coil group 12X and the Y-axis direction annular coil group 12Y is connected to the selection circuit 106 via the connection portion 102C of the position detection circuit 102, and the other end is grounded.

[0061] The magnetic powder material layer 14 is obtained by mixing a powder of a magnetic body with high magnetic permeability (for example, amorphous alloy powder) with a non-magnetic and non-conductive polymer material (resin in this example). In addition, in this embodiment, the magnetic powder material is configured in a form like a paint, and the magnetic powder material layer can be formed by applying the magnetic powder material in the form of a paint to cover the entire X-axis annular coil group 12X formed on the second surface 1S2 of the sensor layer 1X. In addition, in other examples of the position detection sensor 1 described below, the magnetic powder material layers 14A, 14B, and 14C are configured in the same manner as the above-mentioned magnetic powder material layer 14.

[0062] It should be noted that, as the magnetic powder material constituting the magnetic powder material layer 14, it is also possible to use a powder of Permalloy or ferrite (iron oxide) instead of the powder of the amorphous alloy. In addition, as the polymer material, it is not limited to resins, and any of organic polymer materials and inorganic polymer materials will do. For example, as organic polymer materials, natural polymer materials such as proteins, nucleic acids, polysaccharides (cellulose, starch, etc.), and natural rubber, as well as synthetic polymer materials such as synthetic resins, silicone resins, synthetic fibers, and synthetic rubber can be used. In addition, as inorganic polymer materials, natural polymer materials such as silicon dioxide (crystal, quartz), mica, feldspar, asbestos, and synthetic polymer materials such as glass and synthetic ruby ​​can be used.

[0063] In this way, the magnetic powder material layer 14 is provided on the second surface 1S2 side of the sensor substrate body 1S of the sensor layer 1X so as to cover the X-axis circular coil group 12X of the sensor substrate body 1S of the sensor layer 1X, and the magnetic powder material layer 14 forms a magnetic path that becomes a path of the magnetic field. This can prevent the magnetic field generated by each circular coil of the X-axis circular coil group 12X and the Y-axis direction circular coil group 12Y from being attenuated or from being mixed with external magnetic noise due to the influence of the metal part of the circuit substrate located on the lower side of the sensor substrate body 1S.

[0064] In addition, the first surface 1C1 of the cable portion 1C is connected to the position detection circuit (circuit board) 102 . Figure 4 1 is a cross-sectional view for explaining a structural example of a circuit substrate having the position detection circuit 102. Figure 4 As shown in (A), the position detection circuit 102 of this embodiment is a position detection circuit having a four-layer structure including a first circuit configuration surface 1021 , a ground layer 1022 , a second circuit configuration surface 1023 , and a third circuit configuration surface 1024 .

[0065] The first and third circuit configuration surfaces 1021 and 1024 are each a portion where various circuit parts constituting the position detection circuit (electronic circuit) are arranged. A pattern serving as wiring is arranged on the second circuit configuration surface 1023. In addition, a connection portion (cable connection portion) 102C for connecting the wire portions of the power supply wires of each annular coil of the X-axis annular coil group 12X and the Y-axis direction annular coil group 12Y collected in the cable portion 1C is arranged on the first circuit configuration surface 1021. Therefore, the first circuit configuration surface 1021 also has a function as a cable connection surface. The ground layer 1022 is a portion that provides a reference potential, and is composed of, for example, a metal plate.

[0066] The circuit parts and wiring patterns provided on the first to third circuit configuration surfaces 1021, 1023, 1024 are connected to the circuit parts and wiring patterns on other surfaces as needed through the through holes provided on the first to third circuit configuration surfaces 1021, 1023, 1024 and the ground layer 1022. Thus, the circuit substrate as a whole with a four-layer structure constitutes one position detection circuit 102.

[0067] like Figure 4 As shown in (B), the power supply line of each annular coil of the X-axis direction annular coil group 12X and the Y-direction annular coil group 12Y led out to the first surface 1C1 of the cable part 1C is connected to the connection part 102C of the first circuit configuration surface. Specifically, one end of the line portion of the power supply line of each annular coil of the X-axis direction annular coil group 12X and the Y-direction annular coil group 12Y is connected to the selection circuit 106 of the position detection circuit 102 through the connection part 102C of the first circuit configuration surface 1021. In addition, the other end of the line portion of the power supply line of each annular coil of the X-axis direction annular coil group 12X and the Y-direction annular coil group 12Y is connected to the ground layer 1022 through the connection part 102C of the first circuit configuration surface 1021.

[0068] Therefore, the connection end between the power supply line of each ring coil of the X-axis direction ring coil group 12X and the Y-axis direction ring coil group 12Y and the position detection circuit 102 is formed on the first surface 1C1 side of the cable part 1C and is bent, so that the connection part between the power supply line of each ring coil and the position detection circuit 102 is clamped by the position detection circuit (circuit substrate) 102 and the sensor substrate body 1S and does not expose to the outside. Figure 4 As described above, the position detection circuit 102 having a circuit substrate structure having a four-layer structure has a ground layer 1022. The ground layer 1022 functions to prevent the influence of noise. Therefore, due to the position of the connection portion 102C and the presence of the ground layer 1022, it is possible to prevent noise from being mixed into the connection portion 102C from the outside or to prevent noise from being released from the connection portion 102C to the outside.

[0069] It should be noted that in Figure 3 In the configuration examples shown in (B), (C), (D), and (E), the connection between the power supply line of each annular coil of the X-axis direction annular coil group 12X and the Y-axis direction annular coil group 12Y and the position detection circuit 102 is also performed by using Figure 4 It is carried out in the form of explanation.

[0070] <Second Example of Position Detection Device 100>

[0071] Figure 3 (B) shows a second example of the position detection device 100. The second example of the position detection device 100 is compared with the use of Figure 3 In the first example of the position detection device 100 described in (A), an electromagnetic shielding layer 16 is further provided on the lower side of the magnetic powder material layer 14. That is, a shielding layer having a two-layer structure of the magnetic powder material layer 14 and the electromagnetic shielding layer 16 is provided. In this second example, the electromagnetic shielding layer 16 is provided corresponding to the magnetic powder material layer 14, covers the second surface of the sensor substrate body of the sensor layer 1X, and does not cover the second surface 1C2 of the cable portion 1C.

[0072] Furthermore, it is assumed that the cable portion 1C is bent toward the second surface 1S2 side of the sensor substrate body 1S. Figure 3 As shown in (B), the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable portion 1C face each other with the magnetic powder material layer 14 and the electromagnetic shielding layer 16 interposed therebetween.

[0073] The electromagnetic shielding layer 16 is a non-magnetic material and prevents electromagnetic noise from the IC and various circuits from being mixed into each of the circular coils of the X-axis direction circular coil group 12X and the Y-axis direction circular coil group 12Y of the sensor layer 1X. Therefore, the electromagnetic shielding layer 16 is made of a metal material (aluminum in this example) with low resistance (preferably substantially zero resistance) and high conductivity.

[0074] As a method of covering the electromagnetic shielding layer 16 composed of aluminum with respect to the magnetic powder material layer 14, in addition to the method of bonding using an adhesive, a method based on pressure bonding or a method of vapor deposition of aluminum on the magnetic powder material layer 14 can also be used. In the case of the method based on pressure bonding, the adhesive material can also be impregnated in the magnetic powder material layer 14. In this embodiment, the electromagnetic shielding layer 16 is vapor-deposited with respect to the magnetic powder material layer 14.

[0075] Thus, in the case of the second example, the magnetic powder material layer 14 and the electromagnetic shielding layer 16 are provided on the second surface 1S2 side of the sensor substrate body 1S of the sensor layer 1X in such a manner as to cover the X-axis annular coil group 12X of the sensor substrate body 1S of the sensor layer 1X. Thus, it is possible to more reliably prevent the magnetic field generated by each annular coil of the X-axis annular coil group 12X and the Y-axis direction annular coil group 12Y from leaking to the outside and the magnetic noise and electric noise from the outside from mixing.

[0076] In addition, in this second example, Figure 3 As in the first example shown in (A), the first surface 1C1 of the cable section 1C is connected to the position detection circuit (circuit board) 102. Figure 3 As in the case of the first example shown in (A), the position of the connection portion 102C and the presence of the ground layer 1022 can prevent noise from being introduced into the connection portion 102C from the outside or from being emitted from the connection portion 102C to the outside.

[0077] <Third Example of Position Detection Device 100>

[0078] Figure 3 (C) shows a third example of the position detection device 100. Figure 3 (A) In the first example described above, the magnetic powder material layer 14 is provided only on the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X. In contrast, in this third example, a magnetic powder material in the form of a coating is applied to both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto, thereby providing a magnetic powder material layer 14A.

[0079] Furthermore, it is assumed that the cable portion 1C is bent toward the second surface 1S2 side of the sensor substrate body 1S. Figure 3 As shown in (C), the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable portion 1C face each other with the magnetic powder material layer 14A formed into two layers (twice the thickness) sandwiched therebetween. In addition, the respective annular coils of the X-axis direction annular coil group 12X and the Y-axis direction annular coil group 12Y on the first surface 1C1 of the cable portion 1C are connected to the position detection circuit 102. Figure 3 The situations of the first and second examples shown in (A) and (B) are the same.

[0080] In the case of the third example, as in the case of the first example, the function of the magnetic powder material layer 14A can prevent the magnetic field generated by each loop coil of the X-axis loop coil group 12X and the Y-axis direction loop coil group 12Y from being attenuated or the magnetic noise from the outside from being mixed in. In addition, in the case of the third example, the magnetic powder material layer 14A can be applied to both the second surface of the sensor layer 1X, that is, the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable part 1C, so that the manufacturing process can be simplified.

[0081] In addition, in this third example, Figure 3 As in the first example shown in (A), the first surface 1C1 of the cable section 1C is connected to the position detection circuit (circuit board) 102. Figure 3 As in the case of the first example shown in (A), the position of the connection portion 102C and the presence of the ground layer 1022 can prevent noise from being introduced into the connection portion 102C from the outside or from being emitted from the connection portion 102C to the outside.

[0082] <Fourth Example of Position Detection Device 100>

[0083] Figure 3 (D) shows a fourth example of the position detection device 100. Figure 3(C) The third example of the position detection device 100 described above is similarly provided with a magnetic powder material layer 14B on both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto. As described above, the method of covering with the magnetic powder material layer 14B is performed by applying the magnetic powder material in the form of a coating.

[0084] And, in this fourth example, also with Figure 3 In the case of the second example shown in (B), an electromagnetic shielding layer 16 is further provided on the lower side of the magnetic powder material layer 14B corresponding to the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X. That is, the electromagnetic shielding layer 16 covers the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X, but does not cover the second surface 1C2 of the cable portion 1C. The covering method of the electromagnetic shielding layer 16 is performed by evaporating aluminum on the portion of the magnetic powder material layer 14B corresponding to the second surface 1S2 of the sensor substrate body 1S.

[0085] Furthermore, it is assumed that the cable portion 1C is bent toward the second surface 1S2 side of the sensor substrate body 1S. Figure 3 As shown in (D), the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable portion 1C face each other with the two-layer magnetic powder material layer 14B and the electromagnetic shielding layer 16 sandwiched therebetween. In addition, the first surface 1C1 of the cable portion 1C is connected to the position detection circuit 102 by each of the loop coils of the X-axis direction loop coil group 12X and the Y-axis direction loop coil group 12Y. Figure 3 The first, second and third examples shown in (A), (B) and (C) are the same.

[0086] In the case of the fourth example, the same effect as in the case of the second example can be obtained by the functions of the magnetic powder material layer 14B and the electromagnetic shielding layer 16. That is, it is possible to more reliably prevent the magnetic field generated by each annular coil of the X-axis annular coil group 12X and the Y-axis direction annular coil group 12Y from leaking to the outside and preventing magnetic noise and electric noise from mixing from the outside.

[0087] In addition, in this fourth example, Figure 3 As in the first example shown in (A), the first surface 1C1 of the cable section 1C is connected to the position detection circuit (circuit board) 102. Figure 3 As in the case of the first example shown in (A), the position of the connection portion 102C and the presence of the ground layer 1022 can prevent noise from being introduced into the connection portion 102C from the outside or from being emitted from the connection portion 102C to the outside.

[0088] <Fifth Example of Position Detection Device 100>

[0089] Figure 3 (E) shows a fifth example of the position detection device 100. Figure 3 (D) Similarly to the fourth example of the position detection device 100 described above, a magnetic powder material layer 14C is provided on both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto. The covering method is the same as in the above example, and is performed by applying the magnetic powder material in the form of a coating to both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable portion 1C of the sensor layer 1X connected thereto.

[0090] Moreover, if Figure 3 As shown in FIG. (E), an electromagnetic shielding layer 16A is provided on the lower side of the magnetic powder material layer 14C corresponding to the magnetic powder material layer 14C. That is, the electromagnetic shielding layer 16A is provided on both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable part 1C of the sensor layer 1X connected thereto, similarly to the magnetic powder material layer 14C. The covering method is performed by vapor-depositing aluminum on the magnetic powder material layer 14C provided on both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable part 1C of the sensor layer 1X connected thereto.

[0091] Furthermore, it is assumed that the cable portion 1C is bent toward the second surface 1S2 side of the sensor substrate body 1S. Figure 3 As shown in FIG. 1E, the second surface 1S2 of the sensor substrate body 1S and the second surface 1C2 of the cable portion 1C face each other with the two-layer magnetic powder material layer 14C and the two-layer electromagnetic shielding layer 16A sandwiched therebetween. In addition, the first surface 1C1 of the cable portion 1C is connected to the position detection circuit 102 by each of the annular coils of the X-axis direction annular coil group 12X and the Y-axis direction annular coil group 12Y. Figure 3 The first, second, third, and fourth examples shown in (A) to (D) are the same.

[0092] In the fifth example, the same effect as in the second example can be obtained by the functions of the magnetic powder material layer 14C and the electromagnetic shielding layer 16A. That is, it is possible to more reliably prevent the magnetic field generated by each annular coil of the X-axis annular coil group 12X and the Y-axis direction annular coil group 12Y from leaking to the outside and preventing magnetic noise and electric noise from mixing from the outside.

[0093] In the fifth example, the magnetic powder material layer 14C and the electromagnetic shielding layer 16A can be provided on both the second surface 1S2 of the sensor substrate body 1S of the sensor layer 1X and the second surface 1C2 of the cable portion 1C. Therefore, the manufacturing process can be simplified.

[0094] In addition, in this fifth example, Figure 3 As in the first example shown in (A), the first surface 1C1 of the cable section 1C is connected to the position detection circuit (circuit board) 102. Figure 3 As in the case of the first example shown in (A), the position of the connection portion 102C and the presence of the ground layer 1022 can prevent noise from being introduced into the connection portion 102C from the outside or from being emitted from the connection portion 102C to the outside.

[0095] It should be noted that in Figure 3 In the figure, since the sensor layer 1X and the shielding layer are shown with thickness, it looks like the position detection circuit 102 and the shielding layer on the lower side of the sensor substrate body 1S are separated. However, each layer is extremely thin. Figure 2 As described in (B), the cable portion 1C can be folded toward the second surface 1S2 like folding thick paper. Therefore, the position detection circuit 102 and one or both of the first surface 1C1 of the cable portion 1C are fixed to the shielding layer composed of the magnetic powder material layers 14, 14A, 14B, 14C and the electromagnetic shielding layers 16, 16A.

[0096] Thus, the position detection circuit 102 will not float from the shielding layer and press other parts, and the position detection device 100 of this embodiment can be mounted in the housing of the electronic device in a manner that maintains a suitable state. It should be noted that the method of fixing the position detection circuit 102 and the shielding layer provided on the second surface 1S2 side of the sensor substrate body 1S in one or both directions of the first surface 1C1 of the cable part 1C can be various methods such as using an adhesive or using a tape.

[0097] In addition, if Figure 3 and Figure 4As shown, the position detection device 100 of this embodiment is composed of a sensor substrate body 1S, a shielding layer, a cable unit 1C, and a position detection circuit 102 in order from the top. In addition, the position detection circuit 102 is composed of a first circuit configuration surface 1021, a grounding layer 1022, a second circuit configuration surface 1023, and a third circuit configuration surface 1024 in order from the top. As a whole, it is a seven-layer structure in the order of (1) sensor substrate body 1S, (2) shielding layer, (3) cable unit 1C, (4) first circuit configuration surface 1021, (5) grounding layer 1022, (6) second circuit configuration surface 1023, and (7) third circuit configuration surface 1024. The cable unit 1C, the first circuit configuration surface 1021, and the grounding layer 1022 correspond to the middle part of the seven layers (the third layer, the fourth layer, and the fifth layer). Therefore, it can be seen that the connection portion between the power supply line of each loop coil and the position detection circuit 102 is not exposed to the outside and the ground layer 1022 exists below (outside) the connection portion. It can also be seen that this is a structure that does not cause inconveniences such as noise mixing and noise emission.

[0098] [Configuration Example of Electronic Equipment Incorporating a Position Detection Device]

[0099] Figure 5 1 is a diagram for explaining a configuration example of an electronic device equipped with a position detection device 100 configured by using an electromagnetic induction position detection sensor according to an embodiment. As described above, the position detection device 100 is configured by connecting a position detection circuit 102 to a position detection sensor 1 configured by a sensor substrate body 1S and a cable portion 1C and providing a shielding layer at least on the lower side of the sensor substrate body 1S. Figure 5 As shown in FIG. 1 , the cable portion 1C connected to the position detection circuit 102 is in a state of being folded down toward the lower side of the sensor substrate main body 1S.

[0100] In this embodiment, if Figure 5 As shown, the LCD 2 is located on the upper side and the main board 3 is located on the lower side relative to the position detection device 100, and is housed in a stacked state in the housing 4A and sealed from the top by the front panel 4B. The main board is a so-called printed substrate provided with a power supply circuit, a control circuit, a communication circuit, a display circuit for LCD, an interface circuit, etc. for realizing the original functions of the electronic device.

[0101] like Figure 5As shown, the sensor substrate body 1S of the position detection sensor 1 corresponds to the entire surface of the display screen of the LCD 2, so no matter where on the display screen of the LCD 2 is indicated, the indicated position can be detected. In addition, the position detection circuit 102 is located on the lower side of the sensor substrate body 1S together with the cable part 1C, so that the upper surface of the housing 4A can be used as the display screen of the LCD 2.

[0102] In addition, there is a main board on the lower side of the position detection device 100. However, in the position detection device 100, as described above, the position detection circuit 102 configured as a circuit substrate is closest to the main board. Figure 4 As described above, the connection portion 102C of the position detection circuit 102 and the power supply line of the coil is provided on the first surface 1C1 side of the cable portion 1C, and therefore is not exposed to the main board side. Figure 4 As described above, there is a ground layer 1022 on the lower side (main board side) of the connection portion 102C. Therefore, noise from the circuit portion formed on the main board does not mix in from the connection portion 102C of the position detection circuit 102 with the power supply line of the coil. In addition, noise is not radiated from the connection portion 102C of the position detection circuit 102 with the power supply line of the coil to the circuit of the main board to cause an influence.

[0103] Moreover, if you use Figure 3 As described above, a shielding layer composed of magnetic powder material layers 14, 14A, 14B, 14C, electromagnetic shielding layers 16, 16A, etc. is provided on the lower side (main board 3 side) of the sensor substrate body 1S. Thus, it is possible to prevent the noise from the circuit formed on the main board 3 from affecting the position detection device 100. Of course, the signals from the coils of the position detection circuit 102 will not affect the circuit formed on the main board 3.

[0104] [Effects of Embodiment]

[0105] In the case of the position detection device 100 of this embodiment, the first surface 1C1 of the cable portion 1C is connected to the position detection circuit 102, and the connection portion 102C is not exposed to the outside. In addition, the position detection circuit 102 configured as a circuit substrate is provided with a ground layer 1022. Therefore, it is possible to prevent the connection portion 102C of the position detection circuit 102 from mixing with noise from the outside and emitting noise to the outside. Therefore, it is possible to realize a position detection device suitable for being mounted on electronic devices such as smartphones and tablet PCs.

[0106] In addition, if you use Figure 3As described above, no matter how the shield layer is constructed, the connection form between the cable portion 1C of the position detection sensor 1 and the position detection circuit 102 does not change. Therefore, a position detection device that is resistant to noise (high in resistance) can be realized without being affected by the structure of the shield layer.

[0107] [Modifications]

[0108] In the above-mentioned embodiment, the magnetic powder material layers 14, 14A, 14B, 14C are formed by applying a magnetic powder material in the form of a coating. In addition, the electromagnetic shielding layers 16, 16A are formed by evaporating aluminum. However, this is not limited to this. Whether it is the magnetic powder material layers 14, 14A, 14B, 14C or the electromagnetic shielding layers 16, 16A, as long as they can be set in the intended part, various methods can be used to set them. For example, the magnetic powder material layers 14, 14A, 14B, 14C and the electromagnetic shielding layers 16, 16A formed in sheets can also be set to the position detection sensor 1 in an adhesive manner.

[0109] In addition, the sensor layer 1X can be covered with a magnetic powder material layer and an electromagnetic shielding layer by various methods such as coating, vapor deposition, fusion, and crimping, depending on the form of the material to be covered and the characteristics of the object to be covered. In addition, the magnetic powder material layer and the electromagnetic shielding layer only need not be offset relative to the sensor layer 1X, so the entire surface of the magnetic powder material layer and the electromagnetic shielding layer does not need to be bonded to the object to be covered. Therefore, when a sheet of magnetic powder material or sheet of aluminum is used, the sheet of magnetic powder material or sheet of aluminum can be fixed at some parts such as the end of the object to be covered.

[0110] It should be noted that, in the above-mentioned embodiment, the position detection circuit 102 is described as a 4-layer structure, but it is not limited to this. The position detection circuit 102 may be, for example, a structure having a cable connection surface, a circuit configuration surface, and a ground layer. In addition, the connection portion (cable connection portion) with the wire portion of the power supply line of the coil and the circuit configuration portion may also be formed on the same surface, but in this case, the connection portion with the coil needs to be opposite to the first surface 1C1 of the cable portion 1C and connected to each annular coil. Therefore, the position detection circuit 102 can be set to various structures such as a single-layer structure, a two-layer structure, a three-layer structure, and a four-layer structure.

[0111] In addition, in the above-mentioned embodiment, the case where the position detection device is composed of an electromagnetic induction position detection sensor and a position detection circuit is used as an example, but the invention is not limited thereto. The invention can be applied to a position detection device using an electrostatic capacitance position detection sensor or a position detection device using an active electrostatic coupling position detection sensor.

[0112] It should be noted that the position detection sensor of the electrostatic capacitance method and the active electrostatic coupling method has a sensor part with a plurality of linear conductors (wire electrodes) arranged in each direction of the X-axis direction and the Y-axis direction. And the position detection sensor detects the indicated position based on the change of the electrostatic capacitance (charge) generated in the linear conductor when a finger or an electrostatic pen approaches the sensor part. In this case, the linear conductor is led out to the cable part and connected to the position detection circuit, but the cable part and the position detection circuit part connected thereto can be separated from each other. Figure 2 to Figure 5 The situation is similarly constituted.

[0113] Description of symbols

[0114] 1…position detection sensor, 1S…sensor substrate body, 1C…cable portion, 1S1…first surface of the sensor substrate body, 1S2…second surface of the sensor substrate body, 1C1…first surface of the cable portion, 1C2…second surface of the cable portion, 11…insulating substrate, 12X…X-axis direction annular coil group, 12Y…Y-axis direction annular coil group, 13…surface sheet, 1X…sensor layer, 14, 14A, 14B, 14C…magnetic powder material layer, 16, 16A… Electromagnetic shielding layer, 100…position detection device, 102…position detection circuit, 1021…first circuit configuration surface, 1022…ground layer, 1023…second circuit configuration surface, 1024…third circuit configuration surface, 104…oscillator, 105…electric driver, 106…selection circuit, 107…switching connection circuit, 108…receiving amplifier, 109…position detection circuit, 110…pen pressure detection circuit, 111…processing control unit, 200…electronic pen.

Claims

1. A position detection device, used together with a position indicator, comprising a position detection sensor and a circuit substrate having a position detection circuit connected to the position detection sensor, wherein the position detection sensor comprises a sensor substrate body having electrodes for receiving an indication input from the position indicator and a cable portion for leading out the electrodes, wherein the position detection device is characterized in that: The sensor substrate body of the position detection sensor includes an insulating substrate, and conductors constituting the electrodes are formed on a first surface of the insulating substrate on a side where the position indicator indicates a position and on a second surface of the insulating substrate on a side opposite to the first surface. A shielding layer is provided on the entire surface of the second surface so as to cover the electrode formed on the second surface. The cable portion of the position detection sensor is connected to the circuit board on a surface continuous with the first surface of the sensor substrate body, and is folded toward the second surface of the sensor substrate body so that the circuit board is located at the bottom layer.

2. The position detection device according to claim 1, characterized in that: The circuit board connected to the cable portion is structured to include at least a cable connection surface connected to each of the electrodes of the cable portion and a ground layer for providing a reference potential. The cable connection surface is located on the first surface side of the cable portion and is connected to the cable portion.

3. The position detection device according to claim 1, characterized in that: The sensor substrate main body and the cable portion constituting the position detection sensor are integrally formed with a structure of a flexible substrate.

4. The position detection device according to claim 1, characterized in that: One or both of the cable portion and the circuit board are fixed to the shield layer provided on the second surface side of the sensor substrate body.

5. The position detection device according to claim 1, characterized in that: The shielding layer has a two-layer structure of a magnetic shielding layer and an electromagnetic shielding layer.

6. The position detection device according to claim 1, characterized in that: It is disposed and used on the lower side of the display screen of a thin display device.

7. The position detection device according to claim 1, characterized in that: The position detection device is disposed on the upper side of a circuit portion of an electrical device on which the position detection device is mounted.

8. The position detection device according to claim 1, characterized in that: The electrode receiving the indication input from the position indicator is a ring coil for electromagnetically coupling with the position indicator constituting a resonant circuit, and is composed of a first plurality of ring coils arranged in a first direction and a second plurality of ring coils arranged in a second direction intersecting the first direction. The first plurality of loop coils are arranged on the first surface of the insulating substrate, and the second plurality of loop coils are arranged on the second surface of the insulating substrate.

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