Method for determining improvement sequence of machine process, determination device and processing system

Abstract

This application provides a method, apparatus, and processing system for determining the improvement sequence of machine tool processes. The method includes: within a first predetermined time period, detecting the time consumed by each process when a target machine tool processes multiple wafer sets, obtaining multiple sets of processing times, where a wafer set is one or more wafers in a wafer cassette, and each set of processing times includes the processing time of each process corresponding to a wafer set; determining the shortest processing time for each process based on the multiple sets of processing times; calculating the differences between the multiple processing times corresponding to each process and the corresponding shortest processing time, obtaining multiple first differences; calculating the average of the multiple first differences to obtain a first average overrun time, where each set of processing times includes a processing time corresponding to a process; and determining the improvement sequence of multiple processes based on the first average overrun time of each process. This method solves the problem in the prior art of difficulty in determining the degree of impact of each process in machine tool processing on work efficiency.

Description

Technical Field

[0001] The present application relates to the field of machine technology, and more specifically, to a method for determining an improvement sequence of a machine process, a determination device, a computer-readable storage medium, a processor, and a processing system. Background Art

[0002] In the semiconductor manufacturing process, for small machines, the processing unit is a wafer, that is, a single wafer. For non-small machines, the processing unit is a lot. A lot is a plurality of wafers in a wafer box. The processing unit is recorded as a ceil, that is, a wafer group. The ceil is the most basic processing unit of the machine, which can be a lot or a wafer. Each ceil undergoes multiple processes in the machine. In the prior art, engineers can only observe the residence time of a certain wafer group ceil in different processes to determine which process has a problem of slow transmission or processing, infer the performance bottleneck based on experience, and make improvement suggestions. The existing machine work efficiency analysis method has the following problems: 1. It relies too much on manual experience and requires high skills of engineers; 2. It is highly accidental to spot check a single wafer or a single lot for analysis, and it is impossible to grasp the problem of machine transmission efficiency in an overall way; 3. When the processes that the wafer passes through are many and complex, even if the machine efficiency bottleneck is found, it is still difficult to find an effective way to improve efficiency; 4. The work efficiency problems of different machines of the same model are difficult to compare and analyze.

[0003] The above information disclosed in the background technology section is only used to enhance the understanding of the background technology of the technology described in this article. Therefore, the background technology may contain certain information that does not form the prior art known in this country for those skilled in the art. Summary of the invention

[0004] The main purpose of the present application is to provide a method, a determination device, a computer-readable storage medium, a processor and a processing system for determining the improvement sequence of machine processes, so as to solve the problem in the prior art that it is difficult to judge the degree of influence of each process of machine processing on work efficiency.

[0005] According to one aspect of an embodiment of the present invention, a method for determining an improvement order of a machine process is provided, comprising: within a first predetermined time, detecting the time consumed by each process when a target machine processes a plurality of wafer groups respectively, to obtain a plurality of groups of processing times, wherein the wafer group is one or more wafers in a wafer box, and a group of the processing times includes the processing time of each process corresponding to the wafer group; determining a shortest processing time for each of the processes according to the plurality of groups of the processing times; calculating the difference between a plurality of the processing times corresponding to each of the processes and the corresponding shortest processing time, to obtain a plurality of first differences, calculating an average of the plurality of the first differences, to obtain a first average excess time, wherein each group of the processing times includes a processing time corresponding to the process; determining an improvement order for the plurality of processes according to the first average excess time of each of the processes.

[0006] Optionally, before detecting the processing time of each process of processing multiple wafer groups by the target machine within the first predetermined time and obtaining multiple groups of processing time, the method also includes: detecting the processing time of the machine for the multiple wafer groups within the second predetermined time to obtain a group of turnaround time, the turnaround time is the sum of the processing time of the group, and the turnaround time corresponds to the wafer group one-to-one; determining the shortest turnaround time according to the group of turnaround times, the shortest turnaround time is the shortest turnaround time in the group of turnaround times; calculating the difference between a group of turnaround times and the shortest turnaround time to obtain multiple second differences, calculating the average of the multiple second differences to obtain a second average excess time, the second difference corresponds to the wafer group one-to-one; when there are multiple machines, determining the target machine according to the multiple second average excess times, the target machine is the machine with the largest second average excess time, and the second average excess time corresponds to the machine one-to-one.

[0007] Optionally, within a first predetermined time, the processing time of each process performed by the target machine on multiple wafer groups is detected, and before obtaining multiple groups of processing time, the method also includes: when the processing parameter groups corresponding to at least two of the wafer groups are different, calculating the average value of the second difference of at least one of the wafer groups corresponding to the processing parameter group to obtain a third average excess time, and the third average excess time corresponds one-to-one to the processing parameter group; calculating the excess time based on the multiple third average excess times, and the excess time is the sum of the products of the third average excess time and the corresponding weights, and the weights are the ratio of the number of the wafer groups corresponding to the processing parameter group to the total number of the wafer groups; when there are multiple machines, determining the target machine based on the multiple excess times, and the target machine is the machine with the largest excess time, and the excess time corresponds one-to-one to the machine.

[0008] Optionally, the improvement order of each of the processes is the order from long to short of the first average excess time of each of the processes.

[0009] Optionally, after determining the improvement order of each of the processes according to the first average excess time of each of the processes, the method further includes: when there are multiple target machines, calculating the difference between the first time and the second time to obtain a performance difference, the first time being the first average excess time corresponding to the target process of the first target machine, and the second time being the first average excess time corresponding to the target process of the second target machine; when the performance difference is greater than a predetermined value, improving the rank of the target process in the improvement order in the first target machine, the predetermined value being greater than 0.

[0010] Optionally, the first predetermined time and the second predetermined time are both greater than any of the turnaround times.

[0011] According to another aspect of an embodiment of the present invention, a device for determining an improvement sequence of a machine process is provided, comprising: a detection unit, for detecting, within a first predetermined time, the time consumed by each process when a target machine processes a plurality of wafer groups respectively, to obtain a plurality of groups of processing times, wherein the wafer group is one or more wafers in a wafer box, and a group of the processing times includes the processing time of each process corresponding to the wafer group; a first determination unit, for determining a shortest processing time for each of the processes based on the plurality of groups of the processing times; a calculation unit, for calculating the difference between the plurality of processing times corresponding to each of the processes and the corresponding shortest processing time, to obtain a plurality of first differences, and calculating an average of the plurality of the first differences to obtain a first average excess time, wherein each group of the processing times includes a processing time corresponding to the process; and a second determination unit, for determining an improvement sequence for the plurality of processes based on the first average excess time for each of the processes.

[0012] According to yet another aspect of the embodiments of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium includes a stored program, wherein the program executes any one of the methods described.

[0013] According to yet another aspect of an embodiment of the present invention, a processor is provided, wherein the processor is used to run a program, wherein any one of the methods is executed when the program is run.

[0014] According to another aspect of the embodiments of the present invention, there is further provided a processing system, comprising at least one machine and a device for determining an improvement sequence of machine processes, wherein the device for determining an improvement sequence of machine processes is used to execute any one of the methods described.

[0015] In an embodiment of the present invention, in a method for determining an improvement sequence of the above-mentioned machine processes, first, within a first predetermined time, the time consumed by each process when the target machine processes a plurality of wafer groups respectively is detected to obtain a plurality of groups of processing times, wherein the wafer group is one or more wafers in a wafer box, and a group of the above-mentioned processing times includes processing times of each process corresponding to the above-mentioned wafer group; then, the shortest processing time of each of the above-mentioned processes is determined according to the plurality of groups of the above-mentioned processing times; then, the difference between the plurality of the above-mentioned processing times corresponding to each of the above-mentioned processes and the corresponding shortest processing time is calculated to obtain a plurality of first differences, and the average value of the plurality of the above-mentioned first differences is calculated to obtain a first average excess time, wherein each group of the above-mentioned processing times includes a processing time corresponding to the above-mentioned process; finally, the improvement sequence of the plurality of the above-mentioned processes is determined according to the first average excess time of each of the above-mentioned processes. The method processes multiple wafer groups through a target machine, and records the processing time of each process, determines the shortest processing time of each of the above processes, and calculates the first average excess time of each of the above processes, that is, calculates the difference between the multiple processing times corresponding to each of the above processes and the corresponding shortest processing time to obtain multiple first difference values, and calculates the average value of the multiple first difference values ​​to obtain the first average excess time, thereby sorting the first average excess time of each of the above processes according to the length, thereby determining the improvement order of each of the above processes, and can accurately judge the influence of each process of machine processing on work efficiency, give priority to improving the process with a longer first average excess time, and improve the work efficiency of each process in turn, thereby solving the problem in the prior art that it is difficult to judge the influence of each process of machine processing on work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 A flow chart showing a method for determining an improvement sequence of a machine process according to an embodiment of the present application;

[0018] Figure 2 A bar chart showing the average processing time of each process when a machine processes a wafer group according to an embodiment of the present application;

[0019] Figure 3 A bar graph showing the turnaround time of a wafer group processed by a tool according to an embodiment of the present application;

[0020] Figure 4 A bar graph showing the ratio of turnaround time to the number of wafer groups according to an embodiment of the present application is shown;

[0021] Figure 5 A bar chart showing the processing time of each process of machine 1 and machine 2 according to an embodiment of the present application;

[0022] Figure 6 A schematic diagram of a device for determining an improvement sequence of machine processes according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0026] It should be understood that when an element (such as a layer, film, region, or substrate) is described as being "on" another element, the element may be directly on the other element, or there may be intermediate elements. Moreover, in the specification and claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element, or "connected" to the other element through a third element.

[0027] For the convenience of description, some nouns or terms involved in the embodiments of the present application are explained below:

[0028] A processing parameter group, namely a recipe, is a recipe in industrial automation manufacturing, and its content may include multiple processes in the process of technological processing, as well as the process parameter values ​​of each process and the duration of the process.

[0029] As mentioned in the background technology, it is difficult to determine the impact of each process of machine processing on work efficiency in the prior art. In order to solve the above problem, in a typical embodiment of the present application, a method for determining the improvement sequence of machine processes, a determination device, a computer-readable storage medium, a processor and a processing system are provided.

[0030] According to an embodiment of the present application, a method for determining an improvement sequence of machine processes is provided.

[0031] Figure 1 FIG. 1 is a flow chart of a method for determining an improvement sequence of a machine process according to an embodiment of the present application. Figure 1 As shown, the method comprises the following steps:

[0032] Step S101, within a first predetermined time, detecting the consumption time of each process when a target machine processes a plurality of wafer groups respectively, and obtaining a plurality of groups of processing time, wherein the wafer group is one or more wafers in a wafer box, and a group of the processing time includes the processing time of each process corresponding to one of the wafer groups;

[0033] Step S102, determining the shortest processing time of each of the above steps according to the multiple groups of the above processing time;

[0034] Step S103, calculating the difference between the plurality of processing times corresponding to the processes and the corresponding shortest processing time to obtain a plurality of first differences, calculating the average of the plurality of first differences to obtain a first average excess time, wherein each group of processing times includes a processing time corresponding to the process;

[0035] Step S104, determining an improvement order of the plurality of processes according to the first average excess time of each of the processes.

[0036] In the method for determining the improvement order of the above-mentioned machine processes, first, within a first predetermined time, the consumed time of each process when the target machine processes multiple wafer groups respectively is detected to obtain multiple groups of processing time, the above-mentioned wafer group is one or more wafers in a wafer box, and one group of the above-mentioned processing time includes the processing time of each process corresponding to the above-mentioned wafer group; then, the shortest processing time of each of the above-mentioned processes is determined according to the multiple groups of the above-mentioned processing time; then, the difference between the multiple processing times corresponding to each of the above-mentioned processes and the corresponding shortest processing time is calculated to obtain multiple first differences, and the average value of the multiple first differences is calculated to obtain the first average excess time, each group of the above-mentioned processing time includes a processing time corresponding to the above-mentioned process; finally, the improvement order of the multiple above-mentioned processes is determined according to the first average excess time of each of the above-mentioned processes. The method processes multiple wafer groups through a target machine, and records the processing time of each process, determines the shortest processing time of each of the above processes, and calculates the first average excess time of each of the above processes, that is, calculates the difference between the multiple processing times corresponding to each of the above processes and the corresponding shortest processing time to obtain multiple first difference values, and calculates the average value of the multiple first difference values ​​to obtain the first average excess time, thereby sorting the first average excess time of each of the above processes according to the length, thereby determining the improvement order of each of the above processes, and can accurately judge the influence of each process of the machine processing on the work efficiency, give priority to improving the process with a longer first average excess time, and improve the work efficiency of each process in turn, thereby solving the problem of judging the influence of each process of the machine processing on the work efficiency.

[0037] It should be noted that the processes shown in the flowcharts of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and that, although a logical order is shown in the flowcharts, in some cases, the processes shown or described can be executed in an order different from that shown here.

[0038] It should also be noted that the above improvement sequence is the sequence of process optimization and improvement. For example, if the process includes the first process, the second process and the third process, the improvement sequence may be to improve the second process, the first process and the third process in sequence, or the improvement sequence may be to improve the third process, the second process and the first process in sequence. Of course, other sequences are also possible, such as Figure 2 As shown, processes 1 to 8 correspond to the eight bars of the bar graph, the blank part of the bar corresponds to the shortest processing time of the wafer group processed by the machine, and the shaded part of the bar corresponds to the first average excess time of the wafer group processed by the machine. The above shortest processing time and the above first average excess time are recorded in Table 1. As shown in Table 1, according to the size of the first average excess time, the improvement order of the processes can be determined as process 1, process 4, process 2, process 3, process 7, process 8, process 6 and process 5.

[0039] Table 1

[0040] The first average exceeding time / s Shortest processing time / s Process 1 1077.77 573 Process 4 846.81 329 Process 2 127.79 341 Process 3 98.04 340 Process 7 47.84 472 Process 8 47.47 65 Process 6 9.84 332 Process 5 0.61 322

[0041] In one embodiment of the present application, before detecting the processing time of each process performed by a target machine on a plurality of wafer groups within a first predetermined time and obtaining a plurality of groups of processing time, the method further includes: detecting the processing time of the machine on the plurality of wafer groups within a second predetermined time and obtaining a group of turnaround times, the turnaround time being the sum of a group of processing times, and the turnaround time corresponding to the wafer groups one-to-one; determining a shortest turnaround time according to a group of turnaround times, the shortest turnaround time being the shortest turnaround time in a group of turnaround times; calculating the difference between a group of turnaround times and the shortest turnaround time respectively, obtaining a plurality of second differences, calculating the average of the plurality of second differences, obtaining a second average excess time, the second difference corresponding to the wafer groups one-to-one; in the case where there are a plurality of the machines, determining the target machine according to the plurality of second average excess times, the target machine being the machine having the largest second average excess time, and the second average excess time corresponding to the machines one-to-one. Specifically, the above-mentioned turnaround time is the sum of a group of the above-mentioned processing times, which is the sum of the time for the above-mentioned wafer group to complete all processing steps. The processing time of the detection machine for multiple wafer groups can obtain a group of turnaround times, and the above-mentioned turnaround time corresponds to the above-mentioned wafer groups one by one. The shortest turnaround time of a group of the above-mentioned turnaround times is determined by comparison, which is the shortest time for the above-mentioned wafer group to complete all processing steps. The difference between a group of the above-mentioned turnaround times and the above-mentioned shortest turnaround time is calculated to obtain multiple second differences, that is, the timeout time of the turnaround time of each wafer group compared with the shortest time. The average of the multiple second differences is calculated to obtain the average timeout time of the machine processing the wafer group, so that the machine with the longest average timeout time is used as the target machine, such as Figure 3 As shown, machines 1 to 8 correspond to the eight bars of the bar graph, the blank part of the bar corresponds to the shortest turnaround time of the machine processing the wafer group, and the shaded part of the bar corresponds to the average timeout time of the machine processing the wafer group. Machine 2 has the longest average timeout time and can be used as the target machine. Of course, after the improvement order of the process of the above target machine, after the average timeout time is reduced, the machine with the longest average timeout time among the other machines is used as the target machine and improved in turn.

[0042] It should be noted that the ratio of the turnaround time of each wafer group to the shortest turnaround time is calculated to obtain the turnaround time ratio, such as Figure 4 As shown, the distribution of the turnover time ratio of the wafer group is displayed in the form of a bar graph. The horizontal axis corresponds to multiple turnover time ratio intervals, and the vertical axis is the number of wafer groups. It can be seen that the number of wafer groups with turnover time ratios in each interval is the same. The closer to the left, the shorter the turnover time and the higher the work efficiency.

[0043] In one embodiment of the present application, within a first predetermined time, the processing time of each step of processing a plurality of wafer groups by a target machine is detected, and before obtaining a plurality of groups of processing time, the method further includes: when at least two of the wafer groups correspond to different processing parameter groups, calculating the average value of the second difference of at least one of the wafer groups corresponding to the processing parameter group to obtain a third average excess time, wherein the third average excess time corresponds one-to-one to the processing parameter group; calculating the excess time according to the plurality of the third average excess times, wherein the excess time is the sum of the products of the third average excess time and the corresponding weights, wherein the weights are the ratio of the number of the wafer groups corresponding to the processing parameter group to the total number of the wafer groups; when there are a plurality of the machines, determining the target machine according to the plurality of excess times, wherein the target machine is the machine with the largest excess time, and the excess time corresponds one-to-one to the machines. Specifically, different wafer groups may correspond to different processing parameter groups. By calculating the average value of the second difference of the wafer group corresponding to each processing parameter group, the third average excess time corresponding to the processing parameter group can be obtained. The proportion of the above-mentioned wafer group corresponding to the processing parameter group in all wafer groups is the weight of the processing parameter group. The sum of the products of the above-mentioned third average excess time and the corresponding weight is calculated to obtain the excess time, so that the above-mentioned machine with the largest excess time is taken as the target machine. Of course, after the improvement order of the process of the above-mentioned target machine, after the timeout time is reduced, the machine with the longest timeout time among the other machines is taken as the target machine, and improved in turn.

[0044] In one embodiment of the present application, the improvement order of each of the above-mentioned processes is the order of the above-mentioned first average overtime of each of the above-mentioned processes from long to short. Specifically, the longer the above-mentioned first average overtime of the process is, the greater the room for improving the work efficiency, and the more significant the improvement of the machine work efficiency after the improvement, so the processes are improved in the order of the first average overtime from long to short, so as to quickly improve the work efficiency of the machine and improve the production capacity of the machine.

[0045] In one embodiment of the present application, after determining the improvement order of each of the above-mentioned processes according to the first average overtime of each of the above-mentioned processes, the above-mentioned method further includes: in the case where there are multiple above-mentioned target machines, calculating the difference between the first time and the second time to obtain a performance difference, the above-mentioned first time is the above-mentioned first average overtime corresponding to the target process of the first target machine, and the above-mentioned second time is the above-mentioned first average overtime corresponding to the target process of the second target machine; in the case where the above-mentioned performance difference is greater than a predetermined value, improving the order of the above-mentioned target process in the above-mentioned improvement order in the above-mentioned first target machine, and the above-mentioned predetermined value is greater than 0. Specifically, calculating the difference between the first time and the second time to obtain the performance difference, that is, calculating the difference between the above-mentioned first average overtime corresponding to the above-mentioned target process of the first target machine and the second target machine, in the case where the above-mentioned performance difference is greater than the predetermined value, it indicates that the working efficiency of the target process corresponding to the above-mentioned performance difference of the two machines is relatively different, that is, the working efficiency of the target process of the above-mentioned first target machine has a large room for improvement, therefore, improving the order of the above-mentioned target process in the above-mentioned improvement order in the above-mentioned first target machine, so as to further quickly improve the working efficiency of the machine, such as Figure 5 As shown, both machine 1 and machine 2 can be the first target. The processing time of each process of machine 1 and machine 2 is compared, and the performance difference corresponding to processes 1 to 8 is calculated to determine whether processes 1 to 8 need to be improved.

[0046] In one embodiment of the present application, the first predetermined time and the second predetermined time are both greater than any of the above-mentioned turnaround times. Specifically, the first predetermined time and the second predetermined time may be the same or different, and the first predetermined time and the second predetermined time are both greater than any of the above-mentioned turnaround times to ensure that at least one wafer group completes the processing of all processes of the machine. Of course, the larger the first predetermined time and the second predetermined time, the more data collected from the wafer group processing, the more accurate the first average excess time calculated, and the greater the improvement in work efficiency after improvement.

[0047] It should be noted that, of course, multiple processes can also be divided into multiple process units, the above-mentioned process units include multiple processes, the above-mentioned process units are the objects of improving efficiency, the above-mentioned processing time is the processing time of the process unit corresponding to the above-mentioned wafer group, and the improvement order of the multiple process units is determined according to the first average excess time of each of the above-mentioned process units. Technical personnel in this field can also compare the processing time of each process or process unit of each wafer group, more deeply investigate the root causes affecting the working efficiency of the machine, and further optimize the improvement order.

[0048] The embodiment of the present application also provides a device for determining the improvement sequence of a machine process. It should be noted that the device for determining the improvement sequence of a machine process in the embodiment of the present application can be used to execute the method for determining the improvement sequence of a machine process provided in the embodiment of the present application. The device for determining the improvement sequence of a machine process provided in the embodiment of the present application is introduced below.

[0049] Figure 6 Schematic diagram of a device for determining an improvement sequence of a machine process according to an embodiment of the present application. Figure 6 As shown, the device comprises:

[0050] The detection unit 10 is used to detect the consumption time of each process when the target machine processes multiple wafer groups respectively within a first predetermined time, and obtain multiple groups of processing time, wherein the wafer group is one or more wafers in a wafer box, and a group of the processing time includes the processing time of each process corresponding to one of the wafer groups;

[0051] A first determining unit 20, configured to determine the shortest processing time of each of the above-mentioned processes according to the plurality of groups of the above-mentioned processing times;

[0052] The calculation unit 30 is used to calculate the difference between the plurality of processing times corresponding to the processes and the corresponding shortest processing time to obtain a plurality of first differences, and calculate the average of the plurality of first differences to obtain a first average excess time, wherein each group of processing times includes a processing time corresponding to the process;

[0053] The second determining unit 40 is used to determine the improvement sequence of the plurality of processes according to the first average exceeding time of each of the processes.

[0054] In the device for determining the improvement sequence of the above-mentioned machine processes, a detection unit detects the consumed time of each process when the target machine processes multiple wafer groups respectively within a first predetermined time to obtain multiple groups of processing time, wherein the above-mentioned wafer group is one or more wafers in a wafer box, and one group of the above-mentioned processing time includes the processing time of each process corresponding to the above-mentioned wafer group; a first determination unit determines the shortest processing time of each of the above-mentioned processes based on the multiple groups of the above-mentioned processing time; a calculation unit calculates the difference between the multiple processing times corresponding to each of the above-mentioned processes and the corresponding shortest processing time to obtain multiple first differences, calculates the average value of the multiple first differences to obtain a first average excess time, and each group of the above-mentioned processing time includes a processing time corresponding to the above-mentioned process; a second determination unit determines the improvement sequence of the multiple above-mentioned processes based on the first average excess time of each of the above-mentioned processes. The device processes multiple wafer groups through a target machine, and records the processing time of each process, determines the shortest processing time of each of the above processes, and calculates the first average excess time of each of the above processes, that is, calculates the difference between the multiple processing times corresponding to each of the above processes and the corresponding shortest processing time to obtain multiple first difference values, and calculates the average value of the multiple first difference values ​​to obtain the first average excess time, thereby sorting the first average excess time of each of the above processes according to the length, thereby determining the improvement order of each of the above processes, and can accurately judge the influence of each process of machine processing on work efficiency, give priority to improving the process with a longer first average excess time, and improve the work efficiency of each process in turn, thereby solving the problem of judging the influence of each process of machine processing on work efficiency.

[0055] It should be noted that the above improvement sequence is the sequence of process optimization and improvement. For example, if the process includes the first process, the second process and the third process, the improvement sequence may be to improve the second process, the first process and the third process in sequence, or to improve the third process, the second process and the first process in sequence. Of course, other sequences are also possible, such as Figure 2 As shown, processes 1 to 8 correspond to the eight bars of the bar graph, the blank part of the bar corresponds to the shortest processing time of the wafer group processed by the machine, and the shaded part of the bar corresponds to the first average excess time of the wafer group processed by the machine. The above shortest processing time and the above first average excess time are recorded in Table 1. As shown in Table 1, according to the size of the first average excess time, the improvement order of the processes can be determined as process 1, process 4, process 2, process 3, process 7, process 8, process 6 and process 5.

[0056] In one embodiment of the present application, the device further includes a third determination unit, which includes a detection module, a first determination module, a first calculation module and a first determination module, wherein the detection module is used to detect the processing time of each process performed by the target machine on the plurality of wafer groups within a first predetermined time, and before obtaining the plurality of groups of processing time, detect the processing time of the machine on the plurality of the wafer groups within a second predetermined time to obtain a group of turnaround time, wherein the turnaround time is the sum of the group of processing time, and the turnaround time corresponds to the wafer groups one by one; the first determination module is used to determine the most efficient turnaround time according to the group of the turnaround time. The shortest turnaround time is the shortest turnaround time in a group of the turnaround times; the first calculation module is used to calculate the difference between a group of the turnaround times and the shortest turnaround time, obtain multiple second differences, calculate the average of the multiple second differences, obtain the second average excess time, and the second difference corresponds to the wafer group one by one; the first determination module is used to determine the target machine according to the multiple second average excess times when there are multiple machines, and the target machine is the machine with the largest second average excess time, and the second average excess time corresponds to the machine one by one. Specifically, the above-mentioned turnaround time is the sum of a group of the above-mentioned processing times, which is the sum of the time for the above-mentioned wafer group to complete all processing steps. The processing time of the detection machine for multiple wafer groups can obtain a group of turnaround times, and the above-mentioned turnaround time corresponds to the above-mentioned wafer groups one by one. The shortest turnaround time of a group of the above-mentioned turnaround times is determined by comparison, which is the shortest time for the above-mentioned wafer group to complete all processing steps. The difference between a group of the above-mentioned turnaround times and the above-mentioned shortest turnaround time is calculated to obtain multiple second differences, that is, the timeout time of the turnaround time of each wafer group compared with the shortest time. The average of the multiple second differences is calculated to obtain the average timeout time of the machine processing the wafer group, so that the machine with the longest average timeout time is used as the target machine, such as Figure 3 As shown, machines 1 to 8 correspond to the eight bars of the bar graph, the blank part of the bar corresponds to the shortest turnaround time of the machine processing the wafer group, and the shaded part of the bar corresponds to the average timeout time of the machine processing the wafer group. Machine 2 has the longest average timeout time and can be used as the target machine. Of course, after the improvement order of the process of the above target machine, after the average timeout time is reduced, the machine with the longest average timeout time among the other machines is used as the target machine and improved in turn.

[0057] It should be noted that the ratio of the turnaround time of each wafer group to the shortest turnaround time is calculated to obtain the turnaround time ratio, such as Figure 4 As shown, the distribution of the turnover time ratio of the wafer group is displayed in the form of a bar graph. The horizontal axis corresponds to multiple turnover time ratio intervals, and the vertical axis is the number of wafer groups. It can be seen that the number of wafer groups with turnover time ratios in each interval is the same. The closer to the left, the shorter the turnover time and the higher the work efficiency.

[0058] In one embodiment of the present application, before detecting the processing time of each process of processing a plurality of wafer groups by a target machine within a first predetermined time and obtaining a plurality of groups of processing time, the apparatus further comprises a fourth determination unit, the fourth determination unit comprising a second calculation module, a third calculation module and a second determination module, wherein the second calculation module is used for the second calculation module to calculate the average value of the second difference of at least one wafer group corresponding to the processing parameter group when the processing parameter groups corresponding to at least two of the wafer groups are different, to obtain a third average excess time, the third average excess time corresponding to the processing parameter group one-to-one; the third calculation module is used for calculating the excess time according to the plurality of the third average excess times, the excess time being the sum of the products of the third average excess time and the corresponding weight, the weight being the ratio of the number of the wafer groups corresponding to the processing parameter group to the total number of the wafer groups; the second determination module is used for determining the target machine according to the plurality of excess times when there are a plurality of the machines, the target machine being the machine with the largest excess time, the excess time corresponding to the machine one-to-one. Specifically, different wafer groups may correspond to different processing parameter groups. By calculating the average value of the second difference of the wafer group corresponding to each processing parameter group, the third average excess time corresponding to the processing parameter group can be obtained. The proportion of the above-mentioned wafer group corresponding to the processing parameter group in all wafer groups is the weight of the processing parameter group. The sum of the products of the above-mentioned third average excess time and the corresponding weight is calculated to obtain the excess time, so that the above-mentioned machine with the largest excess time is taken as the target machine. Of course, after the improvement order of the process of the above-mentioned target machine, after the timeout time is reduced, the machine with the longest timeout time among the other machines is taken as the target machine, and improved in turn.

[0059] In one embodiment of the present application, the improvement order of each of the above-mentioned processes is the order of the above-mentioned first average overtime of each of the above-mentioned processes from long to short. Specifically, the longer the above-mentioned first average overtime of the process is, the greater the room for improving the work efficiency, and the more significant the improvement of the machine work efficiency after the improvement, so the processes are improved in the order of the first average overtime from long to short, so as to quickly improve the work efficiency of the machine and improve the production capacity of the machine.

[0060] In one embodiment of the present application, after determining the improvement order of each of the above-mentioned processes according to the first average excess time of each of the above-mentioned processes, the above-mentioned device also includes an adjustment unit, and the above-mentioned adjustment unit includes a fourth calculation module and an adjustment module, wherein the above-mentioned fourth calculation module is used to calculate the difference between the first time and the second time when there are multiple above-mentioned target machines to obtain a performance difference, the above-mentioned first time is the above-mentioned first average excess time corresponding to the target process of the first target machine, and the above-mentioned second time is the above-mentioned first average excess time corresponding to the above-mentioned target process of the second target machine; the above-mentioned adjustment module is used to improve the rank of the above-mentioned target process in the above-mentioned improvement order in the above-mentioned first target machine when the above-mentioned performance difference is greater than a predetermined value, and the above-mentioned predetermined value is greater than 0. Specifically, the difference between the first time and the second time is calculated to obtain the performance difference, that is, the difference between the first average excess time corresponding to the target process of the first target machine and the second target machine is calculated. When the performance difference is greater than a predetermined value, it indicates that the working efficiency of the target process corresponding to the performance difference of the two machines is relatively different, that is, there is a large room for improving the working efficiency of the target process of the first target machine. Therefore, the order of the target process in the improvement sequence of the first target machine is improved to further quickly improve the working efficiency of the machine, such as Figure 5 As shown, both machine 1 and machine 2 can be the first target. The processing time of each process of machine 1 and machine 2 is compared, and the performance difference corresponding to processes 1 to 8 is calculated to determine whether processes 1 to 8 need to be improved.

[0061] In one embodiment of the present application, the first predetermined time and the second predetermined time are both greater than any of the above-mentioned turnaround times. Specifically, the first predetermined time and the second predetermined time may be the same or different, and the first predetermined time and the second predetermined time are both greater than any of the above-mentioned turnaround times to ensure that at least one wafer group completes the processing of all processes of the machine. Of course, the larger the first predetermined time and the second predetermined time, the more data collected from the wafer group processing, the more accurate the first average excess time calculated, and the greater the improvement in work efficiency after improvement.

[0062] It should be noted that, of course, multiple processes can also be divided into multiple process units, the above-mentioned process units include multiple processes, the above-mentioned process units are the objects of improving efficiency, the above-mentioned processing time is the processing time of the process unit corresponding to the above-mentioned wafer group, and the improvement order of the multiple process units is determined according to the first average excess time of each of the above-mentioned process units. Technical personnel in this field can also compare the processing time of each process or process unit of each wafer group, more deeply investigate the root causes affecting the working efficiency of the machine, and further optimize the improvement order.

[0063] An embodiment of the present application further provides a processing system, including at least one machine and a device for determining an improvement sequence of the machine processing procedures, wherein the device for determining an improvement sequence of the machine processing procedures is used to execute any one of the above methods.

[0064] The above-mentioned processing system includes at least one machine and a device for determining the improvement order of the machine processing procedures. The detection unit detects the consumed time of each procedure when the target machine processes multiple wafer groups respectively within a first predetermined time to obtain multiple groups of processing time. The above-mentioned wafer group is one or more wafers in a wafer box, and one group of the above-mentioned processing time includes the processing time of each procedure corresponding to the above-mentioned wafer group; the first determination unit determines the shortest processing time of each of the above-mentioned procedures based on the multiple groups of the above-mentioned processing time; the calculation unit calculates the difference between the multiple processing times corresponding to each of the above-mentioned procedures and the corresponding shortest processing time, respectively, to obtain multiple first differences, calculates the average value of the multiple first differences, and obtains the first average excess time, each group of the above-mentioned processing time includes a processing time corresponding to the above-mentioned procedure; the second determination unit determines the improvement order of the multiple above-mentioned procedures based on the first average excess time of each of the above-mentioned procedures. The device processes multiple wafer groups through a target machine, and records the processing time of each process, determines the shortest processing time of each of the above processes, and calculates the first average excess time of each of the above processes, that is, calculates the difference between the multiple processing times corresponding to each of the above processes and the corresponding shortest processing time to obtain multiple first difference values, and calculates the average value of the multiple first difference values ​​to obtain the first average excess time, thereby sorting the first average excess time of each of the above processes according to the length, thereby determining the improvement order of each of the above processes, and can accurately judge the influence of each process of machine processing on work efficiency, give priority to improving the process with a longer first average excess time, and improve the work efficiency of each process in turn, thereby solving the problem of judging the influence of each process of machine processing on work efficiency.

[0065] The device for determining the improvement sequence of the above-mentioned machine processing procedures includes a processor and a memory. The above-mentioned detection unit, first determination unit, calculation unit, second determination unit, etc. are all stored in the memory as program units, and the processor executes the above-mentioned program units stored in the memory to realize corresponding functions.

[0066] The processor contains a kernel, which retrieves the corresponding program unit from the memory. One or more kernels can be set, and the problem of determining the degree of influence of each process of machine processing on work efficiency can be solved by adjusting the kernel parameters.

[0067] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0068] An embodiment of the present invention provides a computer-readable storage medium on which a program is stored. When the program is executed by a processor, the above method is implemented.

[0069] An embodiment of the present invention provides a processor, and the processor is used to run a program, wherein the method is executed when the program is run.

[0070] An embodiment of the present invention provides a device, the device including a processor, a memory, and a program stored in the memory and executable on the processor, and when the processor executes the program, at least the following steps are implemented:

[0071] Step S101, within a first predetermined time, detecting the consumption time of each process when a target machine processes a plurality of wafer groups respectively, and obtaining a plurality of groups of processing time, wherein the wafer group is one or more wafers in a wafer box, and a group of the processing time includes the processing time of each process corresponding to one of the wafer groups;

[0072] Step S102, determining the shortest processing time of each of the above steps according to the multiple groups of the above processing time;

[0073] Step S103, calculating the difference between the plurality of processing times corresponding to the processes and the corresponding shortest processing time to obtain a plurality of first differences, calculating the average of the plurality of first differences to obtain a first average excess time, wherein each group of processing times includes a processing time corresponding to the process;

[0074] Step S104, determining an improvement order of the plurality of processes according to the first average excess time of each of the processes.

[0075] The devices in this article can be servers, PCs, PADs, mobile phones, etc.

[0076] The present application also provides a computer program product, which, when executed on a data processing device, is suitable for executing a program for initializing at least the following method steps:

[0077] Step S101, within a first predetermined time, detecting the consumption time of each process when a target machine processes a plurality of wafer groups respectively, and obtaining a plurality of groups of processing time, wherein the wafer group is one or more wafers in a wafer box, and a group of the processing time includes the processing time of each process corresponding to one of the wafer groups;

[0078] Step S102, determining the shortest processing time of each of the above steps according to the multiple groups of the above processing time;

[0079] Step S103, calculating the difference between the plurality of processing times corresponding to the processes and the corresponding shortest processing time to obtain a plurality of first differences, calculating the average of the plurality of first differences to obtain a first average excess time, wherein each group of processing times includes a processing time corresponding to the process;

[0080] Step S104, determining an improvement order of the plurality of processes according to the first average excess time of each of the processes.

[0081] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0082] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the above-mentioned units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0083] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0084] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0085] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a computer-readable storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the above-mentioned methods of each embodiment of the present invention. The aforementioned computer-readable storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes.

[0086] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0087] 1) In the method for determining the improvement order of the machine process of the present application, first, within a first predetermined time, the consumption time of each process when the target machine processes multiple wafer groups respectively is detected to obtain multiple groups of processing time, the above-mentioned wafer group is one or more wafers in a wafer box, and one group of the above-mentioned processing time includes the processing time of each process corresponding to the above-mentioned wafer group; then, the shortest processing time of each of the above-mentioned processes is determined according to the multiple groups of the above-mentioned processing time; then, the difference between the multiple processing times corresponding to each of the above-mentioned processes and the corresponding shortest processing time is calculated to obtain multiple first differences, and the average value of the multiple first differences is calculated to obtain a first average excess time, each group of the above-mentioned processing time includes a processing time corresponding to the above-mentioned process; finally, the improvement order of the multiple above-mentioned processes is determined according to the first average excess time of each of the above-mentioned processes. The method processes multiple wafer groups through a target machine, and records the processing time of each process, determines the shortest processing time of each of the above processes, and calculates the first average excess time of each of the above processes, that is, calculates the difference between the multiple processing times corresponding to each of the above processes and the corresponding shortest processing time to obtain multiple first difference values, and calculates the average value of the multiple first difference values ​​to obtain the first average excess time, thereby sorting the first average excess time of each of the above processes according to the length, thereby determining the improvement order of each of the above processes, and can accurately judge the influence of each process of the machine processing on the work efficiency, give priority to improving the process with a longer first average excess time, and improve the work efficiency of each process in turn, thereby solving the problem of judging the influence of each process of the machine processing on the work efficiency.

[0088] 2) In the device for determining the improvement sequence of the machine process of the present application, the detection unit detects the consumed time of each process when the target machine processes multiple wafer groups respectively within a first predetermined time to obtain multiple groups of processing time, wherein the wafer group is one or more wafers in a wafer box, and one group of the processing time includes the processing time of each process corresponding to the wafer group; the first determination unit determines the shortest processing time of each of the above processes according to the multiple groups of the processing time; the calculation unit calculates the difference between the multiple processing times corresponding to each of the above processes and the corresponding shortest processing time to obtain multiple first differences, calculates the average of the multiple first differences to obtain a first average excess time, wherein each group of the processing time includes a processing time corresponding to the above process; the second determination unit determines the improvement sequence of the multiple processes according to the first average excess time of each of the above processes. The device processes multiple wafer groups through a target machine, and records the processing time of each process, determines the shortest processing time of each of the above processes, and calculates the first average excess time of each of the above processes, that is, calculates the difference between the multiple processing times corresponding to each of the above processes and the corresponding shortest processing time to obtain multiple first difference values, and calculates the average value of the multiple first difference values ​​to obtain the first average excess time, thereby sorting the first average excess time of each of the above processes according to the length, thereby determining the improvement order of each of the above processes, and can accurately judge the influence of each process of machine processing on work efficiency, give priority to improving the process with a longer first average excess time, and improve the work efficiency of each process in turn, thereby solving the problem of judging the influence of each process of machine processing on work efficiency.

[0089] 3) The processing system of the present application includes at least one machine and a device for determining the improvement order of the machine processing procedures. The detection unit detects the consumed time of each procedure when the target machine processes multiple wafer groups respectively within a first predetermined time to obtain multiple groups of processing time. The above-mentioned wafer group is one or more wafers in a wafer box, and one group of the above-mentioned processing time includes the processing time of each procedure corresponding to the above-mentioned wafer group; the first determination unit determines the shortest processing time of each of the above-mentioned procedures according to the multiple groups of the above-mentioned processing time; the calculation unit calculates the difference between the multiple processing times corresponding to each of the above-mentioned procedures and the corresponding shortest processing time, respectively, to obtain multiple first differences, calculates the average value of the multiple first differences, and obtains the first average excess time, each group of the above-mentioned processing time includes a processing time corresponding to the above-mentioned procedure; the second determination unit determines the improvement order of the multiple above-mentioned procedures according to the first average excess time of each of the above-mentioned procedures. The device processes multiple wafer groups through a target machine, and records the processing time of each process, determines the shortest processing time of each of the above processes, and calculates the first average excess time of each of the above processes, that is, calculates the difference between the multiple processing times corresponding to each of the above processes and the corresponding shortest processing time to obtain multiple first difference values, and calculates the average value of the multiple first difference values ​​to obtain the first average excess time, thereby sorting the first average excess time of each of the above processes according to the length, thereby determining the improvement order of each of the above processes, and can accurately judge the influence of each process of machine processing on work efficiency, give priority to improving the process with a longer first average excess time, and improve the work efficiency of each process in turn, thereby solving the problem of judging the influence of each process of machine processing on work efficiency.

[0090] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for determining the improvement sequence of a machine process, characterized in that: include: Within a first predetermined time, detecting the consumption time of each process when the target machine processes a plurality of wafer groups respectively, and obtaining a plurality of groups of processing time, wherein the wafer group is one or more wafers in a wafer box, and a group of the processing time includes the processing time of each process corresponding to one of the wafer groups; Determine the shortest processing time of each of the steps according to the plurality of groups of processing times; Calculate the differences between the plurality of processing times corresponding to each process and the corresponding shortest processing time to obtain a plurality of first differences, calculate the average of the plurality of first differences to obtain a first average excess time, each group of processing times includes a processing time corresponding to the process; Determining an improvement order of the plurality of processes according to the first average excess time of each of the processes; After determining the improvement order of each process according to the first average excess time of each process, the method further includes: if there are multiple target machines, calculating the difference between the first time and the second time to obtain a performance difference, the first time is the first average excess time corresponding to the target process of the first target machine, and the second time is the first average excess time corresponding to the target process of the second target machine; if the performance difference is greater than a predetermined value, improving the order of improvement of the target process in the first target machine, and the predetermined value is greater than 0.

2. The method according to claim 1, characterized in that Before detecting the processing time of each process performed by the target machine on the plurality of wafer groups within the first predetermined time and obtaining the plurality of groups of processing time, the method further comprises: Within a second predetermined time, detecting the processing time of the plurality of wafer groups by the machine to obtain a set of turnaround time, wherein the turnaround time is the sum of the processing time of the set, and the turnaround time corresponds to the wafer group one by one; Determine a shortest turnaround time according to a group of the turnaround times, wherein the shortest turnaround time is the shortest turnaround time among the group of the turnaround times; Calculate the difference between a group of the turnaround time and the shortest turnaround time to obtain a plurality of second differences, calculate the average of the plurality of the second differences to obtain a second average excess time, wherein the second differences correspond to the wafer groups one by one; There are multiple machines, and the target machine is determined according to multiple second average excess times. The target machine is the machine with the largest second average excess time, and the second average excess time corresponds to the machine in a one-to-one manner.

3. The method according to claim 1, characterized in that Before detecting the processing time of each process performed by the target machine on the plurality of wafer groups within the first predetermined time and obtaining the plurality of groups of processing time, the method further comprises: Within a second predetermined time, detecting the processing time of the plurality of wafer groups by the machine to obtain a set of turnaround time, wherein the turnaround time is the sum of the processing time of the set, and the turnaround time corresponds to the wafer group one by one; Determine a shortest turnaround time according to a group of the turnaround times, wherein the shortest turnaround time is the shortest turnaround time among the group of the turnaround times; Calculate a group of differences between the turnaround time and the shortest turnaround time to obtain a plurality of second differences; When at least two of the wafer groups correspond to different processing parameter groups, an average value of the second difference of at least one of the wafer groups corresponding to the processing parameter group is calculated to obtain a third average excess time, wherein the third average excess time corresponds to the processing parameter group one by one; Calculating an excess time according to the plurality of third average excess times, the excess time being the sum of products of the third average excess times and corresponding weights, the weight being a ratio of the number of wafer groups corresponding to the processing parameter group to the total number of wafer groups; There are multiple machines, and the target machine is determined according to the multiple exceeding times. The target machine is the machine with the largest exceeding time, and the exceeding time corresponds to the machine one by one.

4. The method according to claim 1, characterized in that: The improvement order of each of the processes is the order from long to short of the first average excess time of each of the processes.

5. The method according to claim 2, characterized in that: The first predetermined time and the second predetermined time are both greater than any of the turnaround times.

6. A device for determining the improvement sequence of a machine process, characterized in that: include: A detection unit is used to detect the consumption time of each process when the target machine processes multiple wafer groups respectively within a first predetermined time, and obtain multiple groups of processing time, wherein the wafer group is one or more wafers in a wafer box, and a group of processing time includes the processing time of each process corresponding to one wafer group; A first determining unit, configured to determine the shortest processing time of each of the processes according to the plurality of groups of processing times; a calculation unit, configured to calculate the differences between the plurality of processing times corresponding to each of the processes and the corresponding shortest processing time to obtain a plurality of first differences, calculate the average of the plurality of first differences to obtain a first average excess time, wherein each group of processing times includes a processing time corresponding to the process; The second determining unit is used to determine the improvement order of multiple processes according to the first average excess time of each process; the device also includes an adjusting unit, and the adjusting unit includes a fourth calculating module and an adjusting module, wherein the fourth calculating module is used to calculate the difference between the first time and the second time after determining the improvement order of each process according to the first average excess time of each process, and obtain a performance difference value, wherein the first time is the first average excess time corresponding to the target process of the first target machine, and the second time is the first average excess time corresponding to the target process of the second target machine; the adjusting module is used to improve the rank of the target process in the improvement order in the first target machine when the performance difference value is greater than a predetermined value, and the predetermined value is greater than 0.

7. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored program, wherein the program executes the method of any one of claims 1 to 5.

8. A processor, characterized in that: The processor is used to run a program, wherein the program executes the method according to any one of claims 1 to 5 when running.

9. A processing system, comprising at least one machine and a device for determining an improvement sequence of machine processes, characterized in that: The device for determining the improvement sequence of machine processes is used to execute the method according to any one of claims 1 to 5.

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