A method and system for processing low-radiation and high-thermal-resistance flexible conductive tape

Abstract

The present invention discloses a method and system for processing a low-radiation, high-thermal-resistance flexible conductive tape. The method comprises: obtaining a standard thermal resistance value of the first flexible conductive tape; obtaining a first associated influencing parameter; obtaining a first thermal resistance value based on the first associated influencing parameter and the standard thermal resistance value; obtaining a second associated influencing parameter; obtaining a standard radiation value of the first flexible conductive tape; obtaining a first radiation value based on the second associated influencing parameter and the standard thermal radiation value; inputting the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; obtaining a first processing parameter table based on the first evaluation result; and processing the first flexible conductive tape according to the first processing parameter table. This method solves the technical problem in the prior art of being unable to intelligently evaluate the thermal resistance and radiation values of flexible conductive tapes, and thus being unable to provide targeted guidance for the processing of flexible conductive tapes.

Description

Technical Field

[0001] The present application relates to the field of computer application technology, and in particular to a method and system for processing a low-radiation, high-thermal-resistance flexible conductive tape. Background Art

[0002] Flexible conductive tape refers to a conductive strip made from flexible conductor materials. Flexible conductors refer to a new type of intelligent electronic material that can maintain good electrical properties even when subjected to large strains. They have very important applications in new intelligent material fields such as wearable electronic devices, electronic skin, intelligent robot swing arms, and deformable electronic components. Flexible conductive materials are like blood vessels and nerves in organisms and are an indispensable and important component of flexible devices. The electrode materials in traditional devices are mainly metals. Since metals are not flexible, they are prone to breakage and failure during stretching, which cannot meet the development needs of flexible devices. With the application of flexible conductive materials in more and more fields, the market has a strong demand for improving the low radiation and high thermal resistance of flexible conductive tapes. Researching and designing a processing method to optimize the comprehensive performance of flexible conductive tapes is of great practical significance.

[0003] In the process of implementing the technical solutions in the embodiments of the present application, the inventors of the present application discovered that the above technology has at least the following technical problems:

[0004] The existing technology has the technical problem of being unable to intelligently evaluate the thermal resistance and radiation values of the flexible conductive tape, and thus being unable to provide targeted guidance for the processing of the flexible conductive tape. Summary of the Invention

[0005] The purpose of this application is to provide a low-radiation and high-thermal-resistance flexible conductive tape processing method and system to solve the technical problem in the prior art that the thermal resistance and radiation values of the flexible conductive tape cannot be intelligently evaluated, and thus the processing of the flexible conductive tape cannot be guided in a targeted manner.

[0006] In view of the above problems, the embodiments of the present application provide a method and system for processing a low-radiation, high-thermal-resistance flexible conductive tape.

[0007] In the first aspect, the present application provides a method for processing a low-radiation and high-thermal-resistance flexible conductive tape, which is implemented by a low-radiation and high-thermal-resistance flexible conductive tape processing system, wherein the method includes: obtaining the standard thermal resistance value of the first flexible conductive tape; obtaining a first associated influencing parameter; obtaining a first thermal resistance value based on the first associated influencing parameter and the standard thermal resistance value; obtaining a second associated influencing parameter; obtaining the standard radiation value of the first flexible conductive tape; obtaining a first radiation value based on the second associated influencing parameter and the standard thermal radiation value; inputting the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; obtaining a first processing parameter table based on the first evaluation result; and processing the first flexible conductive tape according to the first processing parameter table.

[0008] On the other hand, the present application also provides a low-radiation, high-thermal-resistance flexible conductive tape processing system for executing a low-radiation, high-thermal-resistance flexible conductive tape processing method as described in the first aspect, wherein the system includes: a first obtaining unit: the first obtaining unit is used to obtain the standard thermal resistance value of the first flexible conductive tape; a second obtaining unit: the second obtaining unit is used to obtain a first associated influencing parameter; a third obtaining unit: the third obtaining unit is used to obtain the first thermal resistance value based on the first associated influencing parameter and the standard thermal resistance value; a fourth obtaining unit: the fourth obtaining unit is used to obtain the second associated influencing parameter; a fifth obtaining unit: the fifth obtaining unit is used to obtain the standard radiation value of the first flexible conductive tape; a sixth obtaining unit: the sixth obtaining unit is used to obtain the first radiation value based on the second associated influencing parameter and the standard thermal radiation value; a seventh obtaining unit: the seventh obtaining unit is used to input the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; an eighth obtaining unit: the eighth obtaining unit is used to obtain a first processing parameter table based on the first evaluation result; a first execution unit: the first execution unit is used to process the first flexible conductive tape according to the first processing parameter table.

[0009] In a third aspect, an embodiment of the present application also provides a low-radiation, high-thermal-resistance flexible conductive tape processing system, comprising a memory, a processor, and a computer program stored on the memory and runnable on the processor, wherein the processor implements the steps of the method described in the first aspect above when executing the program.

[0010] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0011] 1. Obtaining the standard thermal resistance value of the first flexible conductive tape; obtaining a first associated influencing parameter; obtaining a first thermal resistance value based on the first associated influencing parameter and the standard thermal resistance value; obtaining a second associated influencing parameter; obtaining a standard radiation value of the first flexible conductive tape; obtaining a first radiation value based on the second associated influencing parameter and the standard thermal radiation value; inputting the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; obtaining a first processing parameter table based on the first evaluation result; and processing the first flexible conductive tape according to the first processing parameter table. This achieves the goal of obtaining the thermal resistance value and radiation value of the flexible conductive tape based on the standard thermal resistance value, standard radiation value, and their associated influencing parameters, thereby intelligently evaluating the comprehensive performance of the flexible conductive tape and further guiding the technical effects of the processing and manufacturing of the flexible conductive tape.

[0012] 2. By comprehensively analyzing the impact of various factors on the thermal resistance value, and then based on the standard thermal resistance value of the flexible conductive tape, the actual thermal resistance value of the flexible conductive tape can be calculated, achieving the technical effect of clarifying the actual thermal resistance of the flexible conductive tape and providing more accurate thermal resistance data for subsequent intelligent analysis.

[0013] 3. By performing data training on the flexible conductive tape performance evaluation model, the flexible conductive tape performance evaluation model can process input data more accurately, thereby making the output information of the flexible conductive tape performance evaluation model more accurate, that is, obtaining a more accurate and effective first evaluation result, and ultimately achieving the technical effect of accurately obtaining data information and improving the intelligence of the evaluation results.

[0014] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely exemplary. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0016] Figure 1 This is a schematic flow chart of a method for processing a low-radiation, high-thermal-resistance flexible conductive tape according to an embodiment of the present application;

[0017] Figure 2This is a flow chart of obtaining a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value in a method for processing a low-emissivity and high-thermal-resistance flexible conductive tape according to an embodiment of the present application;

[0018] Figure 3 This is a schematic diagram of a process for obtaining a first radiation value according to the first associated influencing parameter and the standard radiation value in a method for processing a low-radiation and high-thermal-resistance flexible conductive tape according to an embodiment of the present application;

[0019] Figure 4 This is a schematic diagram of a process for obtaining output information of a flexible conductive tape performance evaluation model in a method for processing a low-radiation and high-thermal-resistance flexible conductive tape according to an embodiment of the present application;

[0020] Figure 5 This is a structural schematic diagram of a low-radiation, high-thermal-resistance flexible conductive tape processing system according to an embodiment of the present application;

[0021] Figure 6 This is a schematic diagram of the structure of an exemplary electronic device according to an embodiment of the present application.

[0022] Description of reference numerals:

[0023] First obtaining unit 11 , second obtaining unit 12 , third obtaining unit 13 , fourth obtaining unit 14 , fifth obtaining unit 15 , sixth obtaining unit 16 , seventh obtaining unit 17 , eighth obtaining unit 18 , first execution unit 19 , bus 300 , receiver 301 , processor 302 , transmitter 303 , memory 304 , bus interface 305 . DETAILED DESCRIPTION

[0024] The present invention provides a method and system for processing low-emissivity, high-thermal-resistance flexible conductive tape, resolving the existing technical issues of being unable to intelligently assess the thermal resistance and radiation values of flexible conductive tapes, and thus unable to provide targeted guidance for their processing. The invention achieves the goal of obtaining the thermal resistance and radiation values of flexible conductive tapes based on their standard thermal resistance and radiation values, and their associated influencing parameters, thereby intelligently assessing their overall performance and providing guidance for their processing and manufacturing.

[0025] Below, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. It should also be noted that, for the sake of ease of description, only the parts related to the present application, rather than all of them, are shown in the accompanying drawings.

[0026] Application Overview

[0027] Flexible conductive tape refers to a conductive strip made from flexible conductor materials. Flexible conductors refer to a new type of intelligent electronic material that can maintain good electrical properties even when subjected to large strains. They have very important applications in new intelligent material fields such as wearable electronic devices, electronic skin, intelligent robot swing arms, and deformable electronic components. Flexible conductive materials are like blood vessels and nerves in organisms and are an indispensable and important component of flexible devices. The electrode materials in traditional devices are mainly metals. Since metals are not flexible, they are prone to breakage and failure during stretching, which cannot meet the development needs of flexible devices. With the application of flexible conductive materials in more and more fields, the market has a strong demand for improving the low radiation and high thermal resistance of flexible conductive tapes. Researching and designing a processing method to optimize the comprehensive performance of flexible conductive tapes is of great practical significance.

[0028] The existing technology has the technical problem of being unable to intelligently evaluate the thermal resistance and radiation values of the flexible conductive tape, and thus being unable to provide targeted guidance for the processing of the flexible conductive tape.

[0029] In response to the above technical problems, the overall idea of the technical solution provided by this application is as follows:

[0030] The present application provides a method for processing a low-radiation and high-thermal-resistance flexible conductive tape, which is applied to a low-radiation and high-thermal-resistance flexible conductive tape processing system, wherein the method includes: obtaining a standard thermal resistance value of the first flexible conductive tape; obtaining a first associated influencing parameter; obtaining a first thermal resistance value based on the first associated influencing parameter and the standard thermal resistance value; obtaining a second associated influencing parameter; obtaining a standard radiation value of the first flexible conductive tape; obtaining a first radiation value based on the second associated influencing parameter and the standard thermal radiation value; inputting the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; obtaining a first processing parameter table based on the first evaluation result; and processing the first flexible conductive tape according to the first processing parameter table.

[0031] After introducing the basic principles of the present application, various non-limiting implementation methods of the present application will be specifically introduced in conjunction with the drawings in the specification.

[0032] Example 1

[0033] Please see the attached Figure 1 The present invention provides a method for processing a low-radiation, high-thermal-resistance flexible conductive tape. The method is applied to a low-radiation, high-thermal-resistance flexible conductive tape processing system. The method specifically includes the following steps:

[0034] Step S100: obtaining a standard thermal resistance value of the first flexible conductive tape;

[0035] Specifically, the low-radiation, high-thermal-resistance flexible conductive tape processing method is applied to the low-radiation, high-thermal-resistance flexible conductive tape processing system. Based on the standard thermal resistance value, standard radiation value and related influencing parameters of the flexible conductive tape, the thermal resistance value and radiation value of the flexible conductive tape can be obtained, thereby intelligently evaluating the comprehensive performance of the flexible conductive tape and further guiding the processing and manufacturing of the flexible conductive tape. The first flexible conductive tape refers to any flexible conductive tape that uses the low-radiation, high-thermal-resistance flexible conductive tape processing system for flexible conductive tape processing guidance. The standard thermal resistance value refers to the theoretical resistance value obtained by testing the corresponding material of the first flexible conductive tape. By querying and obtaining the standard thermal resistance value of the first flexible conductive tape, the technical effect of clarifying the basic performance parameters of the first flexible conductive tape and providing data support for subsequent processing design is achieved.

[0036] Step S200: obtaining a first correlation influence parameter;

[0037] Step S300: obtaining a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value;

[0038] Specifically, the first associated influencing parameter refers to a parameter that affects the thermal resistance of the first flexible conductive tape. For example, the roughness of the surfaces of the contacting objects, the hardness of the surfaces, and the pressure between the surfaces all affect the thermal resistance of the material to varying degrees. Theoretically, higher roughness indicates a higher contact thermal resistance. All other conditions being equal, the contact area between two relatively hard surfaces is smaller, resulting in a higher contact thermal resistance, while the contact area between two less hard surfaces, or between one hard and one soft surface, is larger, resulting in a lower contact thermal resistance. Increasing the pressure between contacting surfaces increases the area of direct contact between the two objects, reduces the gap between them, and consequently reduces the contact thermal resistance. The first thermal resistance is calculated based on the first associated influencing parameter and the standard thermal resistance value. This first thermal resistance value represents the actual thermal resistance of the first flexible conductive tape. By comprehensively analyzing the impact of various factors on the thermal resistance value and calculating the actual thermal resistance of the flexible conductive tape, the actual thermal resistance of the flexible conductive tape is clearly determined, providing more accurate thermal resistance data for subsequent intelligent analysis.

[0039] Step S400: obtaining a second correlation influence parameter;

[0040] Step S500: obtaining a standard radiation value of the first flexible conductive tape;

[0041] Specifically, the standard radiation value of the first flexible conductive tape is obtained through query, where the standard radiation value of the first flexible conductive tape refers to the theoretical radiation value obtained by testing the corresponding material of the first flexible conductive tape. The second associated influencing parameter refers to a parameter indicator that may affect the radiation value of the first flexible conductive tape. The second associated influencing parameter includes factors such as material area, temperature, and intermediate medium. For example, in production practice, the corresponding radiation value is often increased by increasing the surface area of the material. This achieves the technical effect of clarifying the basic performance parameters of the first flexible conductive tape and providing data support for subsequent processing design.

[0042] The technical effect of clarifying the basic performance parameters of the first flexible conductive tape and further calculating the actual radiation value of the flexible conductive tape is achieved, thereby providing more accurate radiation value data for subsequent intelligent analysis.

[0043] Step S600: obtaining a first radiation value according to the second associated influencing parameter and the standard thermal radiation value;

[0044] Specifically, using the same principle, the first radiation value can be calculated based on the second associated influencing parameter and the standard thermal radiation value. The first radiation value is the actual radiation value of the first flexible conductive strip. By comprehensively analyzing the impact of various factors on the radiation value and calculating the actual radiation value of the flexible conductive strip, the actual radiation value of the flexible conductive strip is clearly determined, providing more accurate radiation value data for subsequent intelligent analysis.

[0045] Step S700: inputting the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result;

[0046] Specifically, the flexible conductive tape performance evaluation model is a neural network model with the characteristics of a neural network model. This neural network model, as used in machine learning, reflects many fundamental features of human brain function. It is a deep feedforward neural network with local connections and weight sharing, and a highly complex nonlinear dynamic learning system. By inputting the first thermal resistance value and the first radiation value into the flexible conductive tape performance evaluation model, the flexible conductive tape performance evaluation model established based on the neural network model can output an accurate first evaluation result, thereby possessing strong analytical and computational capabilities and achieving accurate and efficient technical results.

[0047] Step S800: obtaining a first processing parameter table according to the first evaluation result;

[0048] Step S900: processing the first flexible conductive tape according to the first processing parameter table.

[0049] Specifically, based on the first evaluation result output by the intelligent analysis model of the flexible conductive tape performance evaluation model, solution parameters guiding the production and processing of the flexible conductive tape are obtained, namely the first processing parameter table. Finally, actual processing guidance for the first flexible conductive tape is provided based on the first processing parameter table. Based on the standard thermal resistance value, standard radiation value, and their associated influencing parameters, the thermal resistance and radiation values of the flexible conductive tape are obtained, thereby intelligently evaluating the comprehensive performance of the flexible conductive tape and further guiding the technical effectiveness of the flexible conductive tape processing and manufacturing.

[0050] Further, as attached Figure 2 As shown, step S300 in this embodiment of the application further includes:

[0051] Step S310: obtaining a property feature database of the first flexible conductive tape;

[0052] Step S320: obtaining a first associated attribute feature set from the attribute feature database, wherein the associated attribute features in the first associated attribute feature set are thermal resistance associated attribute features;

[0053] Step S330: Obtaining a first association influence parameter according to the first association attribute feature set;

[0054] Step S340: obtaining a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value.

[0055] Specifically, the attribute feature database of the first flexible conductive tape refers to a database including attribute feature information corresponding to all attribute indicators of the first flexible conductive tape. For example, the numerical features of thermal resistance-related indicators such as contact surface pressure and contact surface roughness that affect the resistance value of the first flexible conductive tape; and the numerical features of softness-related indicators such as fiber material and production and processing methods that affect the softness of the first flexible conductive tape.

[0056] Furthermore, a first associated attribute feature set is obtained from the attribute feature database. The associated attribute features in the first associated attribute feature set are thermal resistance associated attribute features. Based on the first associated attribute feature set, an influencing parameter index that affects the thermal resistance value of the first flexible conductive tape can be obtained, namely the first associated influencing parameter. For example, parameter indexes such as contact surface pressure and contact surface hardness can be given. Finally, based on the first associated influencing parameter and the standard thermal resistance value, the first thermal resistance value can be calculated. The first thermal resistance value is the actual thermal resistance value of the first flexible conductive tape.

[0057] By comprehensively analyzing the impact of various factors on the thermal resistance value, and then based on the standard thermal resistance value of the flexible conductive tape, the actual thermal resistance value of the flexible conductive tape can be calculated, achieving the technical effect of clarifying the actual thermal resistance of the flexible conductive tape and providing more accurate thermal resistance data for subsequent intelligent analysis.

[0058] Furthermore, step S320 in the embodiment of the present application further includes:

[0059] Step S321: obtaining a thermal resistance value associated attribute feature database;

[0060] Step S322: performing an AND logic operation on the thermal resistance value associated attribute feature database and the attribute feature database to obtain a first initial associated attribute feature set;

[0061] Step S323: obtaining a first environmental impact parameter of the first flexible conductive tape relative to the thermal resistance value;

[0062] Step S324: Obtain the first associated attribute feature set according to the first environmental impact parameter and the first initial associated attribute feature set.

[0063] Specifically, the thermal resistance-related attribute feature database includes a library of all associated attribute indicators that may affect thermal resistance data. The attribute feature database is a database containing indicator feature information corresponding to all attribute indicators of the first flexible conductive tape. An AND logic operation is performed on the thermal resistance-related attribute feature database and the attribute feature database, and the result is the first initial associated attribute feature set. The AND logic operation means that the final result is true only when both operands are true, which is equivalent to the "and" in real life. The result of the "logical AND" operation is "true" only when both conditions are simultaneously met. Furthermore, the first associated attribute feature set can be obtained by combining the first environmental impact parameter. The first environmental impact parameter refers to an environmental parameter that affects the thermal resistance of the first flexible conductive tape. Examples include air humidity and air temperature. By comprehensively analyzing the attribute feature database of the first flexible conductive tape, the associated attribute features in the first initial associated attribute feature set that may affect the thermal resistance are obtained. Ultimately, the first associated attribute feature set is obtained, while providing theoretical support for subsequent analysis of the thermal resistance of the flexible conductive tape.

[0064] Furthermore, step S330 in the embodiment of the present application further includes:

[0065] Step S331: obtaining the correlation degree of each thermal resistance correlation attribute feature in the first correlation attribute feature set;

[0066] Step S332: performing entropy method weight allocation according to the correlation degree of each thermal resistance-related attribute feature to obtain a weight ratio of each thermal resistance-related attribute feature;

[0067] Step S333: obtaining the first correlation influencing parameter according to the weight ratio and the correlation degree of the thermal resistance correlation attribute feature.

[0068] Specifically, based on the degree of correlation between the thermal resistance associated attribute features in the first associated attribute feature set, the entropy method is used to assign weights to the thermal resistance associated attributes, and the weight ratio of the thermal resistance associated attribute features can be obtained after the weight assignment. Among them, the entropy method refers to a mathematical method used to judge the degree of discreteness of a certain indicator. The greater the degree of discreteness, the greater the influence of the indicator on the comprehensive evaluation. Finally, the weight ratio of the thermal resistance associated attribute features and the degree of correlation of the thermal resistance associated attribute features are combined to obtain the main influencing parameter index affecting the thermal resistance value of the first flexible conductive tape, which is the first associated influencing parameter. By analyzing each influencing index and calculating the weight, the index parameter that has a major influencing effect on the thermal resistance value is obtained, providing a more accurate data basis for the subsequent thermal resistance value calculation.

[0069] Further, as attached Figure 3 As shown, step S600 in this embodiment of the application further includes:

[0070] Step S610: obtaining a second associated attribute feature set from the attribute feature database, wherein the associated attribute features in the second associated attribute feature set are radiation associated attribute features;

[0071] Step S620: Obtain a second association influence parameter according to the second association attribute feature set;

[0072] Step S630: Obtain a first radiation value according to the first associated influencing parameter and the standard radiation value.

[0073] Specifically, the attribute feature database of the first flexible conductive tape refers to a database including attribute feature information corresponding to all attribute indicators of the first flexible conductive tape. For example, the numerical features of thermal resistance-related indicators such as contact surface pressure and contact surface roughness that affect the resistance value of the first flexible conductive tape; and the numerical features of softness-related indicators such as fiber material and production and processing methods that affect the softness of the first flexible conductive tape.

[0074] Furthermore, a second set of associated attribute features is obtained from the attribute feature database. The associated attribute features in the second set of associated attribute features are radiation-related attribute features. Based on the second set of associated attribute features, an influencing parameter index that affects the radiation value of the first flexible conductive strip can be obtained, namely the second associated influencing parameter. For example, a parameter index such as the contact surface area can be obtained. Finally, based on the second associated influencing parameter and the standard radiation value, the first radiation value can be calculated. The first radiation value is the actual thermal resistance value of the first flexible conductive strip.

[0075] By comprehensively analyzing the impact of various factors on the radiation value, and then based on the standard radiation value of the flexible conductive tape, the actual radiation value of the flexible conductive tape can be calculated, achieving the technical effect of clarifying the actual radiation of the flexible conductive tape and providing more accurate radiation data for subsequent intelligent analysis.

[0076] Furthermore, step S610 in the embodiment of the present application further includes:

[0077] Step S611: obtaining a radiation value associated attribute feature database;

[0078] Step S612: performing an AND logic operation on the radiation value associated attribute feature database and the attribute feature database to obtain a second initial associated attribute feature set;

[0079] Step S613: Obtaining a second environmental impact parameter of the first flexible carrier tape relative to the radiation value;

[0080] Step S614: obtaining the second associated attribute feature set according to the second environmental impact parameter and the second initial associated attribute feature set.

[0081] Specifically, the radiation value-associated attribute feature database includes a library of all associated attribute indicators that may affect the radiation value data. The attribute feature database is a database containing indicator feature information corresponding to all attribute indicators of the first flexible conductive strip. An AND logic operation is performed on the radiation value-associated attribute feature database and the attribute feature database, and the result is the second initial associated attribute feature set. The AND logic operation means that the final result is true only when both operands are true, which is equivalent to the "and" in real life: the result of the "logical AND" operation is "true" only when both conditions are simultaneously met. Furthermore, the first associated attribute feature set is obtained by combining the second environmental impact parameter. The second environmental impact parameter refers to an environmental parameter that affects the radiation value of the first flexible conductive strip, such as air humidity or air temperature. By comprehensively analyzing the attribute feature database of the first flexible conductive strip, the associated attribute features in the second initial associated attribute feature set that may affect the radiation value are obtained, ultimately achieving the technical effect of obtaining the second associated attribute feature set and providing theoretical support for subsequent analysis of the flexible conductive strip's radiation value.

[0082] Further, as attached Figure 4 As shown, step S700 in this embodiment of the application further includes:

[0083] Step S710: using the first thermal resistance value and the first radiation value as input layer input information and inputting them into the flexible conductive tape performance evaluation model;

[0084] Step S720: The flexible conductive tape performance evaluation model is obtained by training multiple sets of training data until a convergence state, wherein each set of data in the multiple sets of training data includes the first thermal resistance value and the first radiation value and identification information for identifying an evaluation result;

[0085] Step S730: obtaining output information of the flexible conductive tape performance evaluation model, wherein the output information includes the first evaluation result.

[0086] Specifically, a convolutional neural network is a type of feedforward neural network that includes convolution calculations and has a deep structure. It is one of the representative algorithms of deep learning. The flexible conductive tape performance evaluation model is a neural network model and has the characteristics of a neural network model. The flexible conductive tape performance evaluation model established based on the neural network model can output accurate output information of the flexible conductive tape performance evaluation model, thereby having strong analytical and computing capabilities, and achieving accurate and efficient technical effects. In addition, the flexible conductive tape performance evaluation model can continuously perform self-training and learning based on training data. Each set of data in the multiple sets of training data includes the first thermal resistance value and the first radiation value as well as identification information for identifying the evaluation results. The flexible conductive tape performance evaluation model continuously corrects itself. When the output information of the flexible conductive tape performance evaluation model reaches a predetermined accuracy / convergence state, the supervised learning process ends.

[0087] By performing data training on the flexible conductive tape performance evaluation model, the flexible conductive tape performance evaluation model can process input data more accurately, thereby making the output information of the flexible conductive tape performance evaluation model more accurate, that is, obtaining a more accurate and effective first evaluation result, and ultimately achieving the technical effect of accurately obtaining data information and improving the intelligence of the evaluation results.

[0088] In summary, the method for processing a low-radiation, high-thermal-resistance flexible conductive tape provided in the embodiments of the present application has the following technical effects:

[0089] 1. Obtaining the standard thermal resistance value of the first flexible conductive tape; obtaining a first associated influencing parameter; obtaining a first thermal resistance value based on the first associated influencing parameter and the standard thermal resistance value; obtaining a second associated influencing parameter; obtaining a standard radiation value of the first flexible conductive tape; obtaining a first radiation value based on the second associated influencing parameter and the standard thermal radiation value; inputting the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; obtaining a first processing parameter table based on the first evaluation result; and processing the first flexible conductive tape according to the first processing parameter table. This achieves the goal of obtaining the thermal resistance value and radiation value of the flexible conductive tape based on the standard thermal resistance value, standard radiation value, and their associated influencing parameters, thereby intelligently evaluating the comprehensive performance of the flexible conductive tape and further guiding the technical effects of the processing and manufacturing of the flexible conductive tape.

[0090] 2. By comprehensively analyzing the impact of various factors on the thermal resistance value, and then based on the standard thermal resistance value of the flexible conductive tape, the actual thermal resistance value of the flexible conductive tape can be calculated, achieving the technical effect of clarifying the actual thermal resistance of the flexible conductive tape and providing more accurate thermal resistance data for subsequent intelligent analysis.

[0091] 3. By performing data training on the flexible conductive tape performance evaluation model, the flexible conductive tape performance evaluation model can process input data more accurately, thereby making the output information of the flexible conductive tape performance evaluation model more accurate, that is, obtaining a more accurate and effective first evaluation result, and ultimately achieving the technical effect of accurately obtaining data information and improving the intelligence of the evaluation results.

[0092] Example 2

[0093] Based on the same inventive concept as the method for processing a low-radiation and high-thermal-resistance flexible conductive tape in the aforementioned embodiment, the present invention also provides a low-radiation and high-thermal-resistance flexible conductive tape processing system, see the attached Figure 5 , the system comprising:

[0094] A first obtaining unit 11, the first obtaining unit 11 is used to obtain a standard thermal resistance value of the first flexible conductive tape;

[0095] A second obtaining unit 12, the second obtaining unit 12 is used to obtain a first correlation influence parameter;

[0096] a third obtaining unit 13, configured to obtain a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value;

[0097] a fourth obtaining unit 14, configured to obtain a second correlation influence parameter;

[0098] a fifth obtaining unit 15, configured to obtain a standard radiation value of the first flexible conductive tape;

[0099] a sixth obtaining unit 16, configured to obtain a first radiation value according to the second associated influencing parameter and the standard thermal radiation value;

[0100] a seventh obtaining unit 17, configured to input the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result;

[0101] an eighth obtaining unit 18, the eighth obtaining unit 18 being configured to obtain a first processing parameter table according to the first evaluation result;

[0102] The first executing unit 19 is configured to process the first flexible conductive tape according to the first processing parameter table.

[0103] Furthermore, the system further comprises:

[0104] a ninth obtaining unit, configured to obtain a property feature database of the first flexible conductive tape;

[0105] a tenth obtaining unit, configured to obtain a first associated attribute feature set from the attribute feature database, wherein the associated attribute features in the first associated attribute feature set are thermal resistance associated attribute features;

[0106] an eleventh obtaining unit, configured to obtain a first association influence parameter according to the first association attribute feature set;

[0107] A twelfth obtaining unit is configured to obtain a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value.

[0108] Furthermore, the system further comprises:

[0109] a thirteenth obtaining unit, the thirteenth obtaining unit being used to obtain a thermal resistance value associated attribute feature database;

[0110] a fourteenth obtaining unit, configured to perform an AND logic operation on the thermal resistance value associated attribute feature database and the attribute feature database to obtain a first initial associated attribute feature set;

[0111] a fifteenth obtaining unit, configured to obtain a first environmental impact parameter of the first flexible conductive tape relative to the thermal resistance value;

[0112] A sixteenth obtaining unit is configured to obtain the first associated attribute feature set according to the first environmental impact parameter and the first initial associated attribute feature set.

[0113] Furthermore, the system further comprises:

[0114] a seventeenth obtaining unit, configured to obtain a correlation degree of each thermal resistance correlation attribute feature in the first correlation attribute feature set;

[0115] an eighteenth obtaining unit, configured to perform entropy method weight allocation according to the correlation degree of each thermal resistance-related attribute feature to obtain a weight ratio of each thermal resistance-related attribute feature;

[0116] A nineteenth obtaining unit is configured to obtain the first correlation influencing parameter according to the weight ratio and the degree of correlation between the thermal resistance correlation attribute feature.

[0117] Furthermore, the system further comprises:

[0118] a twentieth obtaining unit, configured to obtain a second associated attribute feature set from the attribute feature database, wherein the associated attribute features in the second associated attribute feature set are radiation associated attribute features;

[0119] a twenty-first obtaining unit, configured to obtain a second association influence parameter according to the second association attribute feature set;

[0120] The twenty-second obtaining unit is configured to obtain a first radiation value according to the first associated influencing parameter and the standard radiation value.

[0121] Furthermore, the system further comprises:

[0122] A twenty-second obtaining unit, the twenty-second obtaining unit being configured to obtain a radiation value associated attribute feature database;

[0123] A twenty-third obtaining unit, configured to perform an AND logic operation on the radiation value associated attribute feature database and the attribute feature database to obtain a second initial associated attribute feature set;

[0124] a twenty-fourth obtaining unit, configured to obtain a second environmental impact parameter of the first flexible carrier tape relative to the radiation value;

[0125] The twenty-fifth obtaining unit is configured to obtain the second associated attribute feature set according to the second environmental impact parameter and the second initial associated attribute feature set.

[0126] Furthermore, the system further comprises:

[0127] a first input unit, configured to input the first thermal resistance value and the first radiation value as input layer input information into the flexible conductive tape performance evaluation model;

[0128] a twenty-sixth obtaining unit, configured to obtain the flexible conductive tape performance evaluation model by training multiple sets of training data until a convergence state, wherein each set of data in the multiple sets of training data includes the first thermal resistance value and the first radiation value and identification information for identifying an evaluation result;

[0129] The twenty-seventh obtaining unit is configured to obtain output information of the flexible conductive tape performance evaluation model, where the output information includes the first evaluation result.

[0130] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. Figure 1 The low-radiation, high-thermal-resistance flexible conductive tape processing method and specific examples in Example 1 are also applicable to the low-radiation, high-thermal-resistance flexible conductive tape processing system of this embodiment. Through the above detailed description of the low-radiation, high-thermal-resistance flexible conductive tape processing method, those skilled in the art can clearly understand the low-radiation, high-thermal-resistance flexible conductive tape processing system of this embodiment, so for the sake of brevity of the specification, it will not be described in detail here. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method description.

[0131] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

[0132] Exemplary electronic devices

[0133] Reference below Figure 6 To describe the electronic device of the embodiment of the present application.

[0134] Figure 6 The figure shows a schematic structural diagram of an electronic device according to an embodiment of the present application.

[0135] Based on the inventive concept of a low-radiation, high-thermal-resistance flexible conductive tape processing method in the aforementioned embodiment, the present invention also provides a low-radiation, high-thermal-resistance flexible conductive tape processing system, on which a computer program is stored. When the program is executed by a processor, the steps of any method of the low-radiation, high-thermal-resistance flexible conductive tape processing method described above are implemented.

[0136] Among them, Figure 6 In the embodiment of the present invention, a bus architecture (represented by bus 300) is shown. Bus 300 may include any number of interconnected buses and bridges. Bus 300 links various circuits together, including one or more processors represented by processor 302 and memory represented by memory 304. Bus 300 may also link various other circuits together, such as peripheral devices, voltage regulators, and power management circuits, which are well known in the art and are therefore not described further herein. Bus interface 305 provides an interface between bus 300 and receiver 301 and transmitter 303. Receiver 301 and transmitter 303 may be the same component, namely a transceiver, which provides a means for communicating with various other devices over a transmission medium.

[0137] The processor 302 is responsible for managing the bus 300 and general processing, while the memory 304 may be used to store data used by the processor 302 when performing operations.

[0138] The present application provides a method for processing a low-emissivity, high-thermal-resistance flexible conductive tape. The method is applied to a low-emissivity, high-thermal-resistance flexible conductive tape processing system. The method comprises: obtaining a standard thermal resistance value of the first flexible conductive tape; obtaining a first associated influencing parameter; obtaining a first thermal resistance value based on the first associated influencing parameter and the standard thermal resistance value; obtaining a second associated influencing parameter; obtaining a standard radiation value of the first flexible conductive tape; obtaining a first radiation value based on the second associated influencing parameter and the standard thermal radiation value; inputting the first thermal resistance value and the first radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; obtaining a first processing parameter table based on the first evaluation result; and processing the first flexible conductive tape according to the first processing parameter table. This method solves the technical problem in the prior art of being unable to intelligently evaluate the thermal resistance and radiation values of flexible conductive tapes, thereby failing to provide targeted guidance for the processing of flexible conductive tapes. The method achieves the technical effect of obtaining the thermal resistance and radiation values of the flexible conductive tape based on the standard thermal resistance and radiation values of the flexible conductive tape and their associated influencing parameters, thereby intelligently evaluating the comprehensive performance of the flexible conductive tape and further guiding the processing and manufacturing of the flexible conductive tape.

[0139] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, devices, or computer program products. Therefore, the present application may adopt a complete software embodiment, a complete hardware embodiment, or a combination of software and hardware embodiments. In addition, the present application is in the form of a computer program product that can be implemented on one or more computer-usable storage media containing computer-usable program code. The computer-usable storage medium includes, but is not limited to, various media that can store program code, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a disk storage, a compact disc read-only memory (CD-ROM), and an optical storage device.

[0140] The present invention is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products of the embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as the combination of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A system that specifies the functions of a box or boxes.

[0141] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture including an instruction system that is implemented in the process. Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0142] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 The steps of the functions specified in the block or blocks are described. Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0143] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A method for processing a low-radiation, high-thermal-resistance flexible conductive tape, wherein: The method is used for a low-radiation, high-thermal-resistance flexible conductive tape processing system, and the method comprises: Obtaining a standard thermal resistance value of the first flexible conductive tape; Obtaining a first correlation influence parameter; Obtaining a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value; obtaining a second correlation influence parameter; Obtaining a standard thermal radiation value of the first flexible conductive tape; obtaining a first thermal radiation value according to the second associated influencing parameter and the standard thermal radiation value; Inputting the first thermal resistance value and the first thermal radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; Obtaining a first processing parameter table according to the first evaluation result; Processing the first flexible conductive tape according to the first processing parameter table; The obtaining of a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value includes: Obtaining a property feature database of the first flexible conductive tape; Obtaining a first associated attribute feature set from the attribute feature database, wherein the associated attribute features in the first associated attribute feature set are thermal resistance associated attribute features; Obtaining a first association influence parameter according to the first association attribute feature set; Obtaining a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value; The obtaining of a first associated attribute feature set from the attribute feature database includes: Obtaining a database of attribute characteristics associated with thermal resistance values; Performing an AND logic operation on the thermal resistance value associated attribute feature database and the attribute feature database to obtain a first initial associated attribute feature set; Obtaining a first environmental impact parameter of the first flexible conductive tape relative to the thermal resistance value; The first associated attribute feature set is obtained according to the first environmental impact parameter and the first initial associated attribute feature set.

2. The method according to claim 1, wherein The obtaining of a first association influence parameter according to the first association attribute feature set includes: Obtaining the correlation degree of each thermal resistance correlation attribute feature in the first correlation attribute feature set; Performing entropy weight allocation according to the correlation degree of each thermal resistance-related attribute feature to obtain a weight ratio of each thermal resistance-related attribute feature; The first correlation influencing parameter is obtained according to the weight ratio and the correlation degree of the thermal resistance correlation attribute feature.

3. The method according to claim 1, wherein The obtaining of a first thermal radiation value according to the second associated influencing parameter and the standard thermal radiation value includes: Obtaining a second associated attribute feature set from the attribute feature database, wherein the associated attribute features in the second associated attribute feature set are thermal radiation associated attribute features; Obtaining a second association influence parameter according to the second association attribute feature set; A first thermal radiation value is obtained according to the first associated influencing parameter and the standard thermal radiation value.

4. The method according to claim 3, wherein: The obtaining of a second associated attribute feature set from the attribute feature database includes: Obtaining a database of attribute characteristics associated with thermal radiation values; Performing an AND logic operation on the thermal radiation value associated attribute feature database and the attribute feature database to obtain a second initial associated attribute feature set; Obtaining a second environmental impact parameter of the first flexible carrier tape relative to the thermal radiation value; The second associated attribute feature set is obtained according to the second environmental impact parameter and the second initial associated attribute feature set.

5. The method according to claim 1, wherein Inputting the first thermal resistance value and the first thermal radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result includes: Using the first thermal resistance value and the first thermal radiation value as input layer input information, and inputting them into the flexible conductive tape performance evaluation model; The flexible conductive tape performance evaluation model is obtained by training multiple sets of training data until a convergence state, wherein each set of data in the multiple sets of training data includes the first thermal resistance value and the first thermal radiation value and identification information for identifying an evaluation result; Output information of the flexible conductive tape performance evaluation model is obtained, where the output information includes the first evaluation result.

6. A low-radiation, high-thermal-resistance flexible conductive tape processing system, wherein: The system comprises: First obtaining unit: The first obtaining unit is used to obtain a standard thermal resistance value of the first flexible conductive tape; Second obtaining unit: The second obtaining unit is used to obtain the first correlation influence parameter; A third obtaining unit: the third obtaining unit is configured to obtain a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value; Fourth obtaining unit: the fourth obtaining unit is used to obtain a second correlation influence parameter; A fifth obtaining unit: the fifth obtaining unit is used to obtain a standard thermal radiation value of the first flexible conductive tape; Sixth obtaining unit: the sixth obtaining unit is configured to obtain a first thermal radiation value according to the second associated influencing parameter and the standard thermal radiation value; A seventh obtaining unit: the seventh obtaining unit is configured to input the first thermal resistance value and the first thermal radiation value into a flexible conductive tape performance evaluation model to obtain a first evaluation result; An eighth obtaining unit: the eighth obtaining unit is configured to obtain a first processing parameter table according to the first evaluation result; First execution unit: The first execution unit is used to process the first flexible conductive tape according to the first processing parameter table; The system further comprises: a ninth obtaining unit, configured to obtain a property feature database of the first flexible conductive tape; a tenth obtaining unit, configured to obtain a first associated attribute feature set from the attribute feature database, wherein the associated attribute features in the first associated attribute feature set are thermal resistance associated attribute features; an eleventh obtaining unit, configured to obtain a first association influence parameter according to the first association attribute feature set; a twelfth obtaining unit, configured to obtain a first thermal resistance value according to the first associated influencing parameter and the standard thermal resistance value; a thirteenth obtaining unit, the thirteenth obtaining unit being used to obtain a thermal resistance value associated attribute feature database; a fourteenth obtaining unit, configured to perform an AND logic operation on the thermal resistance value associated attribute feature database and the attribute feature database to obtain a first initial associated attribute feature set; a fifteenth obtaining unit, configured to obtain a first environmental impact parameter of the first flexible conductive tape relative to the thermal resistance value; A sixteenth obtaining unit is configured to obtain the first associated attribute feature set according to the first environmental impact parameter and the first initial associated attribute feature set.

7. A low-radiation, high-thermal-resistance flexible conductive tape processing system, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the steps of the method according to any one of claims 1 to 5 are implemented.

Images