Screen module, electronic device and manufacturing method of screen module

Abstract

The application provides a screen module, an electronic device and a manufacturing method of the screen module. The screen module comprises a display module, a protection plate and a fingerprint module; the protection plate is arranged on the display module; and the fingerprint module is arranged on the protection plate and located between the display module and the protection plate. The screen module provided by the application arranges the fingerprint module on the protection plate, so that the fingerprint module is above the display module. When a user uses the fingerprint module, the fingerprint module cooperates with the human finger, and thus the collection of the fingerprint is realized. When the fingerprint is collected, the protection plate is located between the fingerprint module and the human finger, and the display module is not located between the fingerprint module and the human finger. Therefore, when the fingerprint is collected, the influence of the fingerprint module on the display module is reduced, and the risk of damage of the display module caused by the influence of the fingerprint module is reduced.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more specifically, to a screen module, an electronic device, and a method for manufacturing a screen module. Background Technology

[0002] Currently, in related technologies, the optical fingerprint module is located below the screen module. When the fingerprint module is in use, the screen module is affected by the optical fingerprint module, which can cause a sudden increase in the display brightness of the screen module, increasing the risk of damage to the screen module. Summary of the Invention

[0003] This application aims to at least address the problem of screen modules having a high risk of damage in existing or related technologies.

[0004] Therefore, the first aspect of this application proposes a screen module.

[0005] The second aspect of this application proposes an electronic device.

[0006] The third aspect of this application proposes a method for manufacturing a screen module.

[0007] In view of this, the first aspect of this application provides a screen module, including a display module, a protective plate, and a fingerprint module; the protective plate is disposed on the display module; the fingerprint module is disposed on the protective plate and located between the display module and the protective plate.

[0008] The screen module provided in this application places the fingerprint module on a protective plate, positioning it above the display module. When a user uses the fingerprint module, it works in conjunction with the user's finger to collect the fingerprint. Because the protective plate is located between the fingerprint module and the user's finger, while the display module is not, the impact of the fingerprint module on the display module is reduced, minimizing the risk of damage to the display module due to the fingerprint module's influence.

[0009] Furthermore, placing the fingerprint module between the display module and the protective plate allows the protective plate to safeguard the fingerprint module, eliminating the need for an additional protective plate on the fingerprint module itself. This reduces the thickness of the fingerprint module, and consequently, the thickness of the screen module, facilitating the design of thinner and lighter electronic devices. This is especially beneficial for flexible screen modules, making the fingerprint module easier to bend with the flexible screen, thus making the screen module more suitable for electronic devices with foldable screens.

[0010] A second aspect of this application provides an electronic device that includes a screen module as described in any of the above technical solutions. Therefore, the electronic device possesses all the beneficial effects of the screen module as described in any of the above technical solutions.

[0011] A third aspect of this application provides a method for manufacturing a screen module. The method is used to manufacture a screen module as described in any of the above technical solutions. The method includes: depositing a film on a protective plate to form a film layer on the protective plate; and etching the film layer to form a fingerprint module on the protective plate.

[0012] The screen module manufacturing method provided in this application places the fingerprint module on a protective plate, positioning it above the display module. When a user uses the fingerprint module, it engages with the user's finger to collect the fingerprint. During fingerprint collection, because the protective plate is located between the fingerprint module and the user's finger, while the display module is not, the light emitted by the fingerprint module does not pass through the display module. This reduces the impact of the fingerprint module on the display module during fingerprint collection, minimizing the risk of damage to the display module due to the fingerprint module's influence.

[0013] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 A cross-sectional schematic diagram of a screen module according to an embodiment of this application is shown;

[0016] Figure 2 A schematic diagram of the structure of a screen module according to an embodiment of this application is shown;

[0017] Figure 3 A partial schematic diagram of a screen module according to an embodiment of this application is shown;

[0018] Figure 4 One of the flowcharts illustrates a method for manufacturing a screen module according to an embodiment of this application;

[0019] Figure 5 A second flowchart illustrates a method for manufacturing a screen module according to an embodiment of this application.

[0020] in, Figures 1 to 3 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0021] 100 Display module, 110 Substrate, 120 Light-emitting pixels, 122 Green light-emitting pixels, 124 Blue light-emitting pixels, 126 Red light-emitting pixels, 130 Polarizing film, 140 Optical adhesive, 150 Support layer, 200 Protective board, 300 Fingerprint module, 310 Fingerprint sensor, 320 Lead wire, 330 Flexible circuit board, 340 Connector, 350 Fingerprint driver chip, 400 Ink layer. Detailed Implementation

[0022] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0024] The following reference Figures 1 to 5 This application describes a screen module, an electronic device, and a method of manufacturing a screen module according to some embodiments.

[0025] In one embodiment of this application, such as Figures 1 to 3 As shown, a screen module is provided, including a display module 100, a protective plate 200 and a fingerprint module 300; the protective plate 200 is disposed on the display module 100; the fingerprint module 300 is disposed on the protective plate 200 and is located between the display module 100 and the protective plate 200.

[0026] In this embodiment, such as Figure 1 and Figure 2 As shown, the fingerprint module 300 is positioned on the protective plate 200, above the display module 100. When a user uses the fingerprint module 300, it works in conjunction with the user's finger to collect the fingerprint. During fingerprint collection, because the protective plate 200 is located between the fingerprint module 300 and the user's finger, while the display module 100 is not, the impact of the fingerprint module 300 on the display module 100 is reduced, minimizing the risk of damage to the display module 100 due to the fingerprint module 300.

[0027] And, as Figure 1As shown, the fingerprint module 300 is positioned between the display module 100 and the protective plate 200, allowing the protective plate 200 to protect the fingerprint module 300. This eliminates the need for an additional protective plate 200 on the fingerprint module 300, reducing its thickness and consequently the thickness of the screen module, facilitating the design of thinner and lighter electronic devices. Especially for flexible screen modules, this makes the fingerprint module 300 easier to bend with the flexible screen module, making the screen module more suitable for electronic devices with foldable screens.

[0028] In one embodiment of this application, the fingerprint module 300 is coated and / or etched onto the protective plate 200.

[0029] In this embodiment, the fingerprint module 300 is coated and / or etched onto the protective plate 200, eliminating the need for bonding with optical adhesive 140 (OCA). This reduces the number of OCA layers and further decreases the thickness of the screen module. Furthermore, since bonding with OCA is unnecessary, a bonding step is eliminated, simplifying the screen module manufacturing process and reducing its manufacturing difficulty.

[0030] In one embodiment of this application, such as Figure 1 and Figure 3 As shown, the fingerprint module 300 includes a fingerprint sensor 310 and a lead wire 320; the fingerprint sensor 310 is disposed on the protective plate 200; the lead wire 320 is connected to the fingerprint sensor 310 and extends to the edge of the protective plate 200.

[0031] In this embodiment, the fingerprint module 300 includes a fingerprint sensor 310 and a lead wire 320. The fingerprint sensor 310 can detect the fingerprint information of a human finger and transmit the fingerprint information to the motherboard of the electronic device through the lead wire 320, thereby realizing fingerprint recognition.

[0032] In one embodiment of this application, such as Figure 1 and Figure 2 As shown, the fingerprint module 300 also includes a flexible circuit board 330 and a connector 340; the first end of the flexible circuit board 330 is connected to the lead wire 320; the connector 340 is disposed at the second end of the flexible circuit board 330.

[0033] In this embodiment, the screen module further includes a flexible circuit board 330 and a connector 340. The flexible circuit board 330 is connected to the lead wire 320, thereby enabling the fingerprint information collected by the fingerprint sensor 310 to be transmitted through the lead wire 320 and the flexible circuit board 330. The connector 340 is disposed on the flexible circuit board 330 and can be plugged into the motherboard of the electronic device or the circuit board of the screen module, facilitating the electrical connection between the fingerprint sensor 310 and the motherboard of the electronic device.

[0034] Specifically, connector 340 is plugged into the motherboard of the electronic device, and the fingerprint information detected by fingerprint sensor 310 can be transmitted to the motherboard of the electronic device through lead wire 320, flexible circuit board 330 and connector 340.

[0035] Specifically, connector 340 is plugged into the circuit board of the screen module, and the fingerprint information detected by fingerprint sensor 310 can be transmitted to the motherboard of electronic device through lead wire 320, flexible circuit board 330, connector 340 and circuit board of screen module.

[0036] Specifically, the flexible circuit board 330 is equipped with a fingerprint driver chip 350 and other external devices.

[0037] In one embodiment of this application, such as Figure 3 As shown, the screen module also includes an ink layer 400, which is disposed on the protective plate 200 and along the edge of the protective plate 200; the connection between the flexible circuit board 330 and the lead wire 320 is located at the ink layer 400.

[0038] In this embodiment, the screen module further includes an ink layer 400, which is disposed along the edge of the protective plate 200, forming a black area at the edge of the protective plate 200. Since the connection between the flexible circuit board 330 and the lead wire 320 is located at the ink layer 400, the connection between the flexible circuit board 330 and the lead wire 320 will not obscure the content displayed by the screen module, thus improving the display effect of the screen module.

[0039] In one embodiment of this application, such as Figure 1 As shown, the display module 100 includes a substrate 110, a plurality of light-emitting pixels 120, a polarizer 130, and an optical adhesive 140. The plurality of light-emitting pixels 120 are disposed on the substrate 110; the polarizer 130 is disposed on the plurality of light-emitting pixels 120; and the optical adhesive 140 is disposed on the polarizer 130.

[0040] In this embodiment, the display module 100 includes a substrate 110, a plurality of light-emitting pixels 120, a polarizer 130, and an optical adhesive 140. The plurality of light-emitting pixels 120 are disposed on the substrate 110, and a polarizer 130 is disposed on the plurality of light-emitting pixels 120. The polarizer 130 is then attached to the protective plate 200 by the optical adhesive 140, thereby forming a screen module.

[0041] Specifically, the substrate 110 is a glass substrate, and a support layer 150 is attached to the substrate 110. The support layer 150 is a foam layer or a copper foil layer.

[0042] Specifically, the plurality of light-emitting pixels 120 include green light-emitting pixels 122, blue light-emitting pixels 124 and red light-emitting pixels 126.

[0043] In one embodiment of this application, such as Figure 1 and Figure 3 As shown, in the direction perpendicular to the display module 100, the projection of the fingerprint sensor 310 is located between adjacent light-emitting pixels 120.

[0044] In this embodiment, the gaps between the fingerprint sensor 310 and adjacent light-emitting pixels 120 are relatively set to reduce the impact of the fingerprint sensor 310 on the content displayed by the display module 100, thereby improving the display effect of the display module 100 and enhancing the quality of the screen module.

[0045] Specifically, the location of the light-emitting pixel 120 is the display area, and the gap between adjacent light-emitting pixels 120 is the non-display area.

[0046] In one embodiment of this application, the protective plate 200 includes a glass cover or a cover made of flexible polyimide material.

[0047] In this embodiment, the thickness of the glass cover or the polyimide flexible material cover is less than the maximum penetration capability of the fingerprint sensor 310, thereby enabling the fingerprint sensor 310 to collect fingerprints more accurately and improving the accuracy and response speed of fingerprint collection by the electronic device.

[0048] Specifically, the protective plate 200 is an ultra-thin glass (UTG) cover, a transparent polyimide flexible material (CPI) cover, or a regular glass cover.

[0049] Specifically, the fingerprint sensor 310 has a trace channel of less than 50 micrometers.

[0050] Since the width of the ridges and grooves of human fingers is between 100 and 200 micrometers, the fingerprint sensor 310 has a trace channel of less than 50 micrometers, which can more accurately collect fingerprints.

[0051] The maximum penetration depth of a fingerprint is 200 micrometers, and the thickness of the ultra-thin glass cover is less than 200 micrometers, thereby improving the accuracy of fingerprint sensor 310 in fingerprint acquisition.

[0052] The thickness of the ultra-thin glass cover is less than or equal to 50 micrometers.

[0053] In one embodiment of this application, the display module 100 is a flexible display module 100.

[0054] In this embodiment, the display module 100 is a flexible display module 100. The flexible display module 100 works in conjunction with the fingerprint module 300, making the screen module more suitable for electronic devices with foldable screen modules.

[0055] In one embodiment of this application, the screen module is an organic light-emitting diode (OLED) screen.

[0056] In one embodiment of this application, an electronic device is provided, including a screen module as described in any of the above embodiments. Therefore, the electronic device possesses all the beneficial effects of the screen module of any of the above embodiments.

[0057] Specifically, the electronic device is a foldable screen electronic device, such as a foldable screen phone, a foldable screen laptop, or a foldable screen watch.

[0058] In one embodiment of this application, such as Figure 4 As shown, a method for manufacturing a screen module is provided. The manufacturing method is used to manufacture a screen module as described in any of the above embodiments. The manufacturing method includes:

[0059] Step 402: Apply a coating to the protective plate to form a coating layer on the protective plate;

[0060] Step 404: Etch the coating layer to form a fingerprint module on the protective plate.

[0061] In this embodiment, the fingerprint module is mounted on a protective plate, positioned above the display module. When a user uses the fingerprint module, it works in conjunction with the user's finger to collect the fingerprint. During fingerprint collection, because the protective plate is located between the fingerprint module and the user's finger, while the display module is not, the light emitted by the fingerprint module does not pass through the display module. This reduces the impact of the fingerprint module on the display module during fingerprint collection, minimizing the risk of damage to the display module due to the fingerprint module's influence.

[0062] The fingerprint module is coated and / or etched onto the protective plate, eliminating the need for optical adhesive (OCA) bonding. This reduces the number of OCA layers and further reduces the thickness of the screen module. Furthermore, since no OCA bonding is required, a bonding step is eliminated, simplifying the screen module manufacturing process and reducing its manufacturing complexity.

[0063] The location and size of the fingerprint module can be adjusted according to usage requirements and the layout of electronic devices.

[0064] Specifically, the etching process is photolithography.

[0065] Specifically, the manufacturing method of the screen module must also ensure that the ultra-thin glass will not break during the transportation process, and then it is cut and finally thinned to the thickness we need.

[0066] In one embodiment of this application, etching the coating layer to form a fingerprint module on a protective plate includes: etching the coating layer to form a fingerprint sensor on the protective plate; and etching the coating layer to form leads extending from the fingerprint sensor to the ink layer on the protective plate.

[0067] In this embodiment, a fingerprint sensor is formed on the protective board, which can collect fingerprint information of a human body. Leads extending from the fingerprint module to the ink layer are formed on the protective board. The fingerprint sensor can detect the fingerprint information of a human finger and transmit the fingerprint information to the motherboard of the electronic device through the leads, thereby realizing fingerprint recognition.

[0068] Specifically, such as Figure 5 As shown, the manufacturing method of the screen module includes:

[0069] Step 502: Apply a coating to the protective plate to form a coating layer on the protective plate;

[0070] Step 504: Etch the coating layer to form a fingerprint sensor on the protective plate;

[0071] Step 506: Etch the coating layer to form leads extending from the fingerprint sensor to the ink layer on the protective board.

[0072] In one embodiment of this application, the method for manufacturing a screen module further includes: pressing a flexible circuit board onto an ink layer and connecting the flexible circuit board to leads.

[0073] In this embodiment, since the connection between the flexible circuit board and the lead is located at the ink layer, the connection between the flexible circuit board and the lead will not obscure the content displayed by the screen module, thus improving the display effect of the screen module.

[0074] In the claims, description, and accompanying drawings of this application, the term "plural" refers to two or more objects. Unless otherwise explicitly defined, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this application and simplifying the descriptive process, and are not intended to indicate or imply that the device or element referred to must have the described specific orientation, or be constructed and operated in a specific orientation. Therefore, these descriptions should not be construed as limitations on this application. The terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection between multiple objects, a detachable connection between multiple objects, or an integral connection; it can be a direct connection between multiple objects or an indirect connection between multiple objects through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this application can be understood based on the specific circumstances described above.

[0075] In the claims, description, and accompanying drawings of this application, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In the claims, description, and accompanying drawings of this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A screen module, characterized in that, include: Display module; A protection board is disposed on the display module; A fingerprint module is disposed on the side of the protective plate facing the display module, located between the display module and the protective plate; The fingerprint module includes: A fingerprint sensor, wherein the fingerprint sensor is disposed on the protective plate; A lead wire, which is connected to the fingerprint sensor and extends toward the edge of the protective plate; The fingerprint module is etched onto the protective plate; The display module includes a substrate and a plurality of light-emitting pixels, wherein the plurality of light-emitting pixels are disposed on the substrate; The fingerprint sensor is positioned relative to the gap between adjacent light-emitting pixels among the plurality of light-emitting pixels.

2. The screen module according to claim 1, characterized in that, The fingerprint module also includes: A flexible circuit board, wherein a first end of the flexible circuit board is connected to the lead wire; A connector is disposed at the second end of the flexible circuit board.

3. The screen module according to claim 2, characterized in that, Also includes: An ink layer is disposed on the protective plate and along the edge of the protective plate; The connection between the flexible circuit board and the lead wire is located at the ink layer.

4. The screen module according to claim 1, characterized in that, The display module also includes: A polarizer is disposed on the plurality of light-emitting pixels; Optical adhesive, which is disposed on the polarizer.

5. The screen module according to claim 4, characterized in that, In a direction perpendicular to the display module, the projection of the fingerprint sensor is located between adjacent light-emitting pixels.

6. An electronic device, characterized in that, Includes the screen module as described in any one of claims 1 to 5.

7. A method for manufacturing a screen module, characterized in that, The manufacturing method is used to manufacture a screen module as described in any one of claims 1 to 5, and the manufacturing method includes: A coating is applied to the protective plate to form a coating layer on the protective plate; The coating layer is etched to form a fingerprint module on the protective plate; The etching of the coating layer to form a fingerprint module on the protective plate includes: The coating layer is etched to form a fingerprint sensor on the protective plate; The coating layer is etched to form leads extending from the fingerprint sensor to the ink layer on the protective plate.

8. The method for manufacturing a screen module according to claim 7, characterized in that, Also includes: The flexible circuit board is pressed onto the ink layer, and the flexible circuit board is connected to the lead wire.

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