Processing method of a housing, the housing, and an electronic device

Abstract

Embodiments of the present application provide a method for processing a housing, the housing, and an electronic device. The processing method specifically includes: injection molding using a plastic material to obtain a housing body; using a laser direct structuring technology to laser engrave a recessed antenna circuit on the housing body; preparing a conductive layer embedded in the antenna circuit on the housing body to form an antenna on the housing body; and spraying a paint layer on the surfaces of the housing body and the antenna to obtain the housing. In the embodiments of the present application, the housing body has excellent mechanical properties, and moreover, the layout flexibility of the antenna on the housing body can be improved.

Description

Technical Field

[0001] This application belongs to the field of communication technologies, and particularly relates to a method for processing a housing, a housing, and an electronic device. Background Art

[0002] With the development of communication technologies, the performance of electronic devices such as mobile phones and tablet computers has been continuously improved. The number of antennas and operating frequency bands on electronic devices is also increasing. To facilitate the layout of antennas, it is usually necessary to integrate the antennas on the housing of the electronic device.

[0003] In the existing technology, to facilitate the integration of antennas on the housing, a plastic material added with metal powder is usually used to make the housing, and then a laser direct structuring technology is used to laser engrave an antenna on the housing. However, the housing made of the plastic material added with metal powder has low strength and is brittle, which greatly reduces the mechanical properties of the housing. Moreover, when using the laser direct structuring technology to laser engrave an antenna on the housing, an uneven surface will be formed. To avoid affecting the appearance, the antenna can only be formed on the inner side of the housing, which greatly affects the layout of the antenna on the housing. Summary of the Invention

[0004] This application aims to provide a method for processing a housing, a housing, and an electronic device to solve the problems that the existing housing has poor mechanical properties and the layout of the antenna on the housing is limited.

[0005] To solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, this application discloses a method for processing a housing. The processing method specifically includes:

[0007] Injection molding is performed using a plastic material to obtain a housing body;

[0008] A sunken antenna circuit is laser engraved on the housing body by using a laser direct structuring technology;

[0009] A conductive layer embedded in the antenna circuit is prepared on the housing body to form an antenna on the housing body;

[0010] A paint layer is sprayed on the surfaces of the housing body and the antenna to obtain the housing.

[0011] In a second aspect, this application also discloses a housing, which is made by using the above processing method.

[0012] In a third aspect, this application also discloses an electronic device, which includes: the housing according to any one of the above.

[0013] In the embodiments of the present application, the frame body can be made of a plastic material. A sunken antenna circuit is provided on the frame body, and the antenna is embedded in the antenna circuit. The paint layer covers the frame body and the antenna. Since the antenna is embedded in the frame body, there is no need to directly perform the operation of laser engraving the antenna on the frame body. Therefore, the frame body can be made of a plastic material, avoiding the operation of adding metal powder, and the mechanical properties of the frame body are relatively excellent. Moreover, since the antenna is embedded in the sunken antenna circuit on the frame body, the surface of the frame is relatively flat. Therefore, the antenna can be arranged at any position on the frame body according to actual needs, improving the layout flexibility of the antenna on the frame body.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 is a flowchart showing the steps of a processing method of a frame according to an embodiment of the present application;

[0017] Figure 2 is a schematic structural diagram of a frame according to an embodiment of the present application;

[0018] Figure 3 is Figure 2 a schematic cross-sectional structure diagram of the frame shown.

[0019] Reference numerals: 10 - side frame, 101 - through hole, 11 - receiving cavity, 20 - antenna, A - outer surface of the side frame, B - inner surface of the side frame. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0021] The terms "first", "second" in the description and claims of this application may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0022] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0024] Refer to Figure 1 , a step flow chart of a processing method of a frame body described in an embodiment of this application is shown. As Figure 1 described, the processing method may specifically include:

[0025] Step 101: Injection molding is performed using a plastic material to obtain a frame body.

[0026] In an embodiment of this application, an injection molding machine may be used to perform injection molding on the plastic material to obtain a frame body. The plastic material may include polycarbonate (PC), PC + glass fiber, etc. The specific type of the plastic material is not limited in the embodiment of this application. The plastic material may be colored plastic particles.

[0027] Specifically, the injection molding process may specifically include: First, bake the plastic material in a high-temperature environment for a period of time. For example, bake it in an environment of 120°C for 4 hours. Then, use an injection molding machine to perform injection molding on the heated plastic material. Specifically, the mold temperature of the injection molding machine can be set first. For example, the front mold can be set to 100°C, the rear mold can be set to 90°C, and the material temperature can be set to 315°C. When the mold temperature of the injection molding machine reaches the set conditions, the baked plastic material can be added to the injection molding machine. Finally, the plastic material can be injection molded according to the set temperature to obtain the middle frame body.

[0028] Referring to Figure 2 , a schematic structural diagram of a frame body according to an embodiment of the present application is shown. Referring to Figure 3 , shows Figure 2 A schematic cross-sectional structure diagram of the frame body shown. Specifically, the frame body may include a side frame 10 and a receiving cavity 11 formed by enclosing the side frame 10; wherein, a through hole 101 penetrating the inner and outer surfaces of the side frame 10 is provided on the side frame 10.

[0029] Specifically, in order to increase the surface area of the through hole 101, the through hole 101 may be at least one of a single conical hole or a double conical hole. For the convenience of processing, the aperture of the through hole 101 may be greater than or equal to 5 millimeters. Moreover, when the through hole 101 is a single conical hole, the wall thickness of the single conical hole is not greater than the aperture, and when the through hole 101 is a double conical hole, the aperture of the double conical hole is less than 2 times the aperture, so as to facilitate the formation of the through hole 101.

[0030] In the embodiment of the present application, since the through hole 101 is designed on the side frame 10 of the middle frame body, after injection molding, the middle frame body needs to be sliced and microscopically examined to determine that the size of the through hole 101 meets the requirements.

[0031] Step 102: Use laser direct structuring technology to laser engrave a sunken antenna line on the frame body.

[0032] In the embodiment of the present application, laser direct structuring technology can be used to laser engrave a sunken antenna line on the frame body so that the antenna 20 can be embedded in the antenna line in a subsequent process. Specifically, the antenna line can be set at any required position according to actual needs. For example, the outer surface A or the inner surface B of the side frame 10, etc. The embodiment of the present application does not limit the specific position of the antenna line.

[0033] Specifically, a filter laser engraving machine can be used to engrave the antenna circuit on the middle frame body. For example, the laser engraving power can be 5W - 30W, the adjustable pulse width can be 0 - 400ns, the frequency can be 40 - 80hz, and the power can be 70% - 90%. In actual applications, after laser engraving is completed, it is necessary to microscopically inspect whether the antenna circuit is continuous.

[0034] Optionally, the step of using the laser direct structuring technology to engrave a recessed antenna circuit on the frame body may specifically include: using the laser direct structuring technology to engrave antenna circuits on the inner and outer surfaces of the side frame 10 of the middle frame body respectively, wherein the antenna circuit on the inner surface B of the side frame 10 is connected to the antenna circuit on the outer surface A through a via hole 101.

[0035] In actual applications, when the antenna circuits are provided on both the outer surface A and the inner surface B of the side frame 10, antennas can be formed on the antenna circuits on the outer surface A and the inner surface B, so that antennas 20 can be provided on both the outer surface A and the inner surface B of the side frame 10. In this way, not only can the number of antennas 20 on the frame body be increased, but also, by arranging the antenna 20 on the outer surface A of the side frame 20, the radiation performance of the antenna 20 can be improved. Especially when the antenna 20 is a millimeter-wave antenna, arranging the millimeter-wave antenna on the outer surface A of the side frame 10 can ensure that the radiation of the millimeter-wave antenna is basically unobstructed, and can significantly improve the performance of the millimeter-wave antenna.

[0036] Step 103: Prepare a conductive layer embedded in the antenna circuit on the frame body to form an antenna on the frame body.

[0037] In the embodiment of the present application, since the antenna circuit is recessed on the frame body, a conductive layer embedded in the antenna circuit can be prepared on the frame body, and the conductive layer can be used as the antenna.

[0038] Specifically, the conductive layer can be a metal plating layer, a metal sheet, or other conductive structures. The specific content of the conductive layer in the embodiment of the present application may not be limited.

[0039] Optionally, the step of preparing a conductive layer embedded in the antenna circuit on the frame body may include the following sub-steps:

[0040] Sub-step S11: Remove impurities and roughen the antenna circuit on the frame body.

[0041] In the embodiments of the present application, the frame body after laser engraving can be placed in an acidic liquid to remove impurities and roughen the antenna circuit formed by the laser engraving. Specifically, there may be impurities that have not completely fallen off in the antenna circuit formed by laser engraving. By placing the frame body after laser engraving in an acidic liquid, the acidic liquid can react with the impurities in the antenna circuit and the surface of the antenna circuit, removing the impurities in the antenna circuit and roughening the surface of the antenna circuit.

[0042] Specifically, the acidic liquid can be a mixed liquid of phosphoric acid and sulfuric acid, and the volume ratio of phosphoric acid to sulfuric acid can be set according to actual conditions. To facilitate the full reaction of the acidic liquid with the impurities and surface inside the antenna circuit, the reaction time can be controlled within 3 to 8 minutes.

[0043] In the embodiments of the present application, since the subsequent chemical plating process requires an alkaline environment, after the frame body is placed in the acidic liquid and reacts fully, the frame body can be put into an alkaline liquid for a neutralization reaction to remove the acidic liquid on the surface of the frame body and form an alkaline environment on the surface of the frame body. For example, the alkaline liquid can be a sodium hydroxide solution with a molar concentration of 0.5 mol / L.

[0044] Specifically, after the neutralization reaction of the frame body, the frame body can be washed with water and dried in sequence to obtain a middle frame body with a clean surface.

[0045] Sub-step S12: Deposit palladium ions on the surface of the antenna circuit.

[0046] In the embodiments of the present application, after roughening the antenna circuit on the frame body, palladium ions can be deposited on the surface of the antenna circuit to facilitate subsequent chemical plating on the antenna circuit.

[0047] Specifically, the antenna circuit on the frame body can be subjected to stannous ion sensitization treatment and palladium ion activation treatment in sequence. Then, the frame body is placed in a reduction furnace and reduced at 200 - 550 °C for a period of time to facilitate the full deposition of palladium ions on the surface of the antenna circuit.

[0048] Sub-step S13: Perform chemical plating treatment on the antenna circuit to form a conductive layer embedded in the antenna circuit.

[0049] In the embodiments of the present application, chemical plating treatment can be performed on the antenna circuit to deposit a metal plating layer on the surface of the antenna circuit, preparing a conductive layer embedded in the antenna circuit. The conductive layer is embedded in the antenna circuit and can form an antenna.

[0050] Optionally, the step of chemically plating the antenna circuit to prepare a conductive layer embedded in the antenna circuit may include the following sub-steps:

[0051] Sub-step S131: Perform pre-copper plating treatment on the surface of the antenna circuit to form a pre-copper plating layer on the surface of the antenna circuit.

[0052] In the embodiment of the present application, pre-copper plating treatment can be performed on the surface of the antenna circuit to form a pre-copper plating layer on the surface of the antenna circuit. Specifically, since copper ions can undergo a displacement reaction with the palladium ions, by allowing copper ions to react with the palladium ions on the surface of the antenna circuit, the palladium ions can be displaced and the copper ions can be deposited on the surface of the antenna circuit, forming a pre-copper plating layer on the surface of the antenna circuit.

[0053] Sub-step S132: Immerse the antenna circuit in a sulfuric acid solution to form a thickened copper layer on the surface of the pre-copper plating layer.

[0054] In the embodiment of the present application, after the pre-copper plating layer is formed on the surface of the antenna circuit, the antenna circuit can be immersed in a sulfuric acid solution to form a thickened copper layer on the surface of the pre-copper plating layer. Specifically, the frame body can be placed in a sulfuric acid solution for immersion treatment, and the treatment duration is about 2-8 minutes to further deposit a copper layer on the surface of the pre-copper plating layer to obtain a thickened copper layer.

[0055] In practical applications, after the immersion treatment of the antenna circuit, the frame body can be cleaned with deionized water and then dried to obtain a frame body with a clean surface.

[0056] Sub-step S133: Perform stannous ion sensitization treatment and palladium ion activation treatment on the thickened copper layer of the antenna circuit in sequence.

[0057] In the embodiment of the present application, in order to facilitate the subsequent process of further forming a protective coating on the thickened copper layer, after the thickened copper layer is formed, stannous ion sensitization treatment and palladium ion activation treatment can be performed on the thickened copper layer of the antenna circuit in sequence to deposit palladium ions on the surface of the thickened copper layer.

[0058] In practical applications, when performing stannous ion sensitization treatment and palladium ion activation treatment on the thickened copper layer of the antenna circuit in sequence, the middle frame body can be washed and dried in sequence to obtain a clean middle frame body.

[0059] Sub-step S134: Form a protective coating on the surface of the thickened copper layer by means of chemical plating process.

[0060] In the embodiment of the present application, after the thickened copper layer is formed on the surface of the antenna line, in order to protect the thickened copper layer, a chemical plating process can be used to form a protective coating on the surface of the thickened copper layer, so as to prevent the thickened coating from directly contacting the air and oxidizing, which may affect the performance of the antenna.

[0061] In an alternative embodiment of the present application, the step of forming a protective coating on the surface of the thickened copper layer by using a chemical plating process may include the following sub-steps:

[0062] Sub-step S1341: Perform nickel plating on the surface of the thickened copper layer by using a chemical plating process to form a nickel plating layer on the surface of the thickened copper layer.

[0063] In the embodiment of the present application, a chemical plating process can be used to perform nickel plating on the surface of the thickened copper layer, and nickel ions are used to displace palladium ions on the surface of the thickened copper layer to form a nickel plating layer on the surface of the thickened copper layer. Since nickel is harder than copper, the nickel plating layer can effectively protect the thickened copper layer. Moreover, since nickel has the advantages of high hardness and low cost, using the nickel plating layer as the protective layer can achieve both good protection effect and low cost.

[0064] In practical applications, after the nickel plating layer is formed on the surface of the thickened copper layer, the frame body can be washed several times with water to obtain a clean middle frame body.

[0065] Sub-step S1342: Passivate the nickel plating layer to obtain a protective coating.

[0066] In the embodiment of the present application, after the nickel plating layer is formed, the nickel plating layer can be passivated to form a protective coating on the surface of the nickel plating layer, and improve the antioxidant and corrosion resistance of the nickel plating layer.

[0067] In practical applications, after the nickel plating layer is passivated, the frame body can be washed 3 times with clean water, then ultrasonically washed strongly in hot water for a period of time, and finally dried to obtain a clean conductive layer, which can be embedded in the antenna line to form the antenna.

[0068] Optionally, the step of forming a protective coating on the surface of the thickened copper layer by using a chemical plating process may include the following sub-steps:

[0069] Sub-step S1343: Perform silver plating on the surface of the thickened copper layer by using a chemical plating process to form a silver plating layer for protecting the thickened copper layer.

[0070] In the embodiment of the present application, a silver plating process can be used to perform silver plating on the surface of the thickened copper layer, and silver ions are used to replace the palladium ions on the surface of the thickened copper layer to form a silver plating layer on the surface of the thickened copper layer. Since silver has the advantages of being safe and non-toxic, using the silver plating layer as the protective layer can make the frame have higher safety performance and meet higher environmental protection requirements.

[0071] In practical applications, after the silver plating layer is formed on the surface of the thickened copper layer, the frame body can be washed with water several times to obtain a clean middle frame body.

[0072] Sub-step S1344: Perform an antioxidant treatment on the silver plating layer to obtain a protective coating.

[0073] In the embodiment of the present application, after the silver plating layer is formed, a potassium dichromate solution can be used to perform an antioxidant treatment on the silver plating layer to form a protective coating on the surface of the silver plating layer, improving the antioxidant and corrosion resistance performance of the nickel plating layer.

[0074] In practical applications, after the antioxidant treatment on the silver plating layer, the frame body can be washed with clean water several times, then subjected to ultrasonic shock in hot water for a period of time, and finally dried at 60 - 80 °C to obtain a clean conductive layer, which can be embedded in the antenna circuit to form the antenna.

[0075] Step 104: Spray a paint layer on the surfaces of the frame body and the antenna to obtain the frame.

[0076] In the embodiment of the present application, after the antenna is formed on the surface of the frame body, a paint layer can be sprayed outside the frame body and the antenna. The paint layer can be used to cover the antenna on the frame body, showing a good appearance effect.

[0077] Optionally, the step of spraying a paint layer on the surfaces of the frame body and the antenna may specifically include the following sub-steps:

[0078] Sub-step S21: Spray a first primer outside the frame body and the antenna to form a first primer layer on the surfaces of the frame body and the antenna, where the first primer is a polyurethane coating.

[0079] In the embodiments of the present application, since the housing body is made of plastic material and the antenna is made of metal material, there will be significant differences in the surface characteristics of the two. Moreover, due to the different materials between the housing body and the antenna, there is likely to be a gap between the two. Therefore, before spraying paint on the surface of the housing body, it is necessary to first spray a first primer on the surfaces of the housing body and the antenna. The first primer can be used to modify the surface characteristics of the housing body and the antenna to facilitate the adhesion of coatings in subsequent processes.

[0080] Specifically, the first primer can be a polyurethane coating (PU-type paint). Since the hydroxyl acrylic resin in the polyurethane coating has polar adhesion and generates chemical bonds at the interface, the chemically reactive groups combine on the surface of the antenna, which can facilitate the adhesion of coatings on the surface of the antenna in subsequent processes. Moreover, the polyurethane coating can also effectively fill the gap between the housing body and the antenna to obtain a relatively flat surface.

[0081] Exemplarily, the thickness of the first primer layer can be 2 - 4 μm, and the baking temperature can be 80 ± 25 °C.

[0082] Sub-step S22: Form a masking layer on the surface of the first primer layer.

[0083] In the embodiments of the present application, since the antenna is disposed on the surface of the housing body and the materials of the antenna and the housing body are different, there will accordingly be a color difference between the antenna and the housing body. To eliminate the color difference between the antenna and the housing body and improve the appearance consistency of the housing, it is necessary to mask the antenna and the housing body, that is, to form a masking layer on the first primer layer that can be used to mask the antenna and the housing body.

[0084] Specifically, the masking layer can be a black paint layer or a black ink layer, and the embodiments of the present application may not limit the specific content of the masking layer.

[0085] In an alternative embodiment of the present application, the step of forming a masking layer on the surface of the first primer layer may specifically include the following sub-steps:

[0086] Sub-step S221: Spray a second primer on the surface of the first primer layer to form a second primer layer on the surface of the first primer layer, where the second primer is a photosensitive coating.

[0087] In the embodiments of the present application, a second primer can be sprayed on the surface of the first primer layer to fill the step difference between the antenna and the frame body, and a second primer layer is formed on the surface of the first primer layer, making the surface of the entire product relatively smooth. In this way, the trace problem between the antenna and the frame body does not need to be considered in subsequent laminations.

[0088] Specifically, the second primer is a photosensitive coating. Since the photosensitive coating has high viscosity and good fluidity, using the photosensitive coating as the second primer can better level the outer surface of the frame body, making the surface of the entire product relatively smooth.

[0089] Exemplarily, the thickness of the second primer layer can be 30 - 40 μm, the energy of the photosensitive coating can be 1100 - 1600 mj / cm 2 , and the baking temperature can be 80 ± 25 °C.

[0090] Sub-step S222: Spray a polyurethane coating wrapped with black carbon powder on the surface of the second primer layer to form a shielding layer on the surface of the second primer layer.

[0091] In the embodiments of the present application, when the second primer layer is formed on the surface of the frame body, a polyurethane coating wrapped with black carbon powder can be sprayed on the surface of the second primer layer to form a shielding layer on the surface of the second primer layer. Since the shielding layer contains black carbon powder, the shielding layer can shield the colors of the antenna and the frame body. When the shielding layer is formed on the surfaces of the frame body and the antenna, the entire product presents the color of the shielding layer.

[0092] Specifically, to achieve the shielding effect, the proportion of the black carbon powder in the polyurethane coating should be greater than or equal to 30%. For example, the proportion of the black carbon powder in the polyurethane coating can be 35%, 40% or 42%, etc. The embodiments of the present application do not specifically limit the specific proportion of the black carbon powder in the polyurethane coating.

[0093] Exemplarily, the thickness of the shielding layer can be 40 μm - 50 μm, and the baking temperature can be 80 ± 25 °C.

[0094] In another alternative embodiment of the embodiments of the present application, the step of forming a shielding layer on the surface of the first primer layer may include: spraying a polyurethane coating wrapped with black carbon powder on the surface of the first primer layer multiple times to form a shielding layer on the surface of the first primer layer.

[0095] In the embodiment of the present application, the polyurethane coating wrapped with black carbon powder can be sprayed on the surface of the first primer layer multiple times to form a shielding layer on the surface of the first primer layer. For example, the polyurethane coating wrapped with black carbon powder can be sprayed on the surface of the first primer layer to form a first shielding for the antenna and the frame body, and then the polyurethane coating wrapped with black carbon powder can be sprayed again to form a second shielding for the antenna and the frame body, so that the entire product presents the color of the shielding layer.

[0096] Specifically, in order to achieve the shielding effect, the proportion of the black carbon powder in the polyurethane coating should be greater than or equal to 30%. For example, the proportion of the black carbon powder in the polyurethane coating can be 35%, 40% or 42%, etc. The specific proportion of the black carbon powder in the polyurethane coating is not specifically limited in the embodiment of the present application.

[0097] Sub-step S23: forming a silver primer layer, a color paint layer and a top paint layer in sequence on the surface of the shielding layer.

[0098] In the embodiment of the present application, after the shielding layer is formed on the surfaces of the antenna and the frame body, a silver primer layer, a color paint layer and a topcoat layer may be sequentially formed on the surface of the shielding layer.

[0099] Specifically, the silver powder primer layer can be a polyurethane coating wrapped with nano silver paste. At high temperature, the silver powder in the nano silver paste can be regularly arranged, and the silver powder primer layer can present the texture of vacuum non-conductive electroplating to improve the appearance of the frame.

[0100] For example, the thickness of the silver primer layer may be 9um-15um, and the baking temperature may be 80±25°C.

[0101] Specifically, the color paint layer may be a color effect paint layer sprayed on the silver powder primer layer. With the support of the underlying silver powder primer layer, the color paint layer may show a metallic luster.

[0102] For example, the thickness of the color paint layer may be 9um-15um, and the baking temperature may be 80±25°C.

[0103] Specifically, the topcoat layer can be a high-gloss photosensitive protective optical film. In practical applications, aliphatic polyurethane acrylic can be used to increase the surface hardness to 3 hours without scratches, enhance the front side's anti-scratch and corrosion by other liquids, and solvent-based modified polyurethane acrylic resin can be used to increase the adhesion to the underlying color paint layer.

[0104] Optionally, the thickness of the topcoat layer can be 21 - 35 μm, the energy can be 1000 - 1200 mj / cm2, and the baking temperature can be 80 ± 25 °C.

[0105] In summary, the processing method of the frame described in the embodiments of the present application can at least include the following advantages:

[0106] In the embodiments of the present application, a plastic material is used for injection molding to obtain a frame body; a laser direct forming technology is used to laser engrave a recessed antenna circuit on the frame body; a conductive layer embedded in the antenna circuit is prepared on the frame body to form an antenna on the frame body; a paint layer is sprayed on the frame body and the antenna to obtain the frame. Since the antenna is embedded in the frame body, there is no need to perform an operation of directly laser engraving an antenna on the frame body. Therefore, the frame body can be made of a plastic material, avoiding the operation of adding metal powder, and the mechanical properties of the frame body are relatively excellent. Moreover, since the antenna is embedded in the recessed antenna circuit on the frame body, the surface of the frame is relatively flat. Therefore, the antenna can be set at any position on the frame body according to actual needs, improving the layout flexibility of the antenna on the frame body.

[0107] The embodiments of the present application also provide a frame, which can be processed by the above processing method.

[0108] In the embodiments of the present application, the frame body can be made of a plastic material, a recessed antenna circuit is provided on the frame body, the antenna is embedded in the antenna circuit, and the paint layer covers the frame body and the antenna. Since the antenna is embedded in the frame body, there is no need to perform an operation of directly laser engraving an antenna on the frame body. Therefore, the frame body can be made of a plastic material, avoiding the operation of adding metal powder, and the mechanical properties of the frame body are relatively excellent. Moreover, since the antenna is embedded in the recessed antenna circuit on the frame body, the surface of the frame is relatively flat. Therefore, the antenna can be set at any position on the frame body according to actual needs, improving the layout flexibility of the antenna on the frame body.

[0109] Optionally, the frame body includes a side frame 10 and a receiving cavity 11 formed by enclosing the side frame 10; wherein, a through hole 101 penetrating the inner and outer surfaces of the side frame 10 is provided on the side frame 10; the antenna circuit is disposed on the inner surface A and the outer surface B of the side frame 10, and the antenna circuit on the inner surface B is communicated with the antenna circuit on the outer surface A through the through hole 101.

[0110] In practical applications, when the antenna lines are provided on both the outer surface A and the inner surface B of the side frame 10, antennas can be formed on the antenna lines of the outer surface A and the inner surface B, so that antennas 20 can be provided on both the outer surface A and the inner surface B of the side frame 10. In this way, not only can the number of antennas 20 on the frame body be increased, but also, by providing the antenna 20 on the outer surface A of the side frame 20, the radiation performance of the antenna 20 can be improved. Especially when the antenna 20 is a millimeter-wave antenna, setting the millimeter-wave antenna on the outer surface A of the side frame 10 can ensure that the radiation of the millimeter-wave antenna is basically unobstructed, significantly improving the performance of the millimeter-wave antenna.

[0111] In summary, the frame body described in the embodiments of the present application has at least the following advantages:

[0112] In the embodiments of the present application, the frame body can be made of a plastic material. The frame body is provided with recessed antenna lines, the antenna is embedded in the antenna lines, and the paint layer covers the frame body and the antenna. Since the antenna is embedded in the frame body, there is no need to directly perform the operation of laser engraving the antenna on the frame body. Therefore, the frame body can be made of a plastic material, avoiding the operation of adding metal powder, and the mechanical properties of the frame body are relatively good. Moreover, since the antenna is embedded in the recessed antenna lines on the frame body, the surface of the frame is relatively flat. Therefore, the antenna can be set at any position on the frame body according to actual needs, improving the layout flexibility of the antenna on the frame body.

[0113] The embodiments of the present application also provide an electronic device, which specifically may include the frame body described in any of the above embodiments. The frame body can be used as the structural main body of the electronic device to fix the display screen, the rear cover and various functional components of the electronic device. The electronic device may include, but is not limited to, any one of a mobile phone, a tablet computer, and a wearable device. The embodiments of the present application do not specifically limit the specific content of the electronic device.

[0114] In the embodiments of the present application, the structure of the middle frame is the same as that of the middle frames in the foregoing embodiments, and its beneficial effects are similar, which will not be elaborated here.

[0115] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0116] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A processing method for a frame body, characterized in that, The specific processing method includes: Using plastic materials for injection molding to obtain the frame body; Adopting the laser direct forming technology to laser-engrave the recessed antenna circuit on the frame body; Preparing a conductive layer embedded in the antenna circuit on the frame body to form an antenna on the frame body; Spraying a paint layer on the surfaces of the frame body and the antenna to obtain the frame; The step of preparing a conductive layer embedded in the antenna circuit on the frame body includes: Removing impurities and roughening the antenna circuit on the frame body; Depositing palladium ions on the surface of the antenna circuit; Performing chemical plating treatment on the antenna circuit to form a conductive layer embedded in the antenna circuit; The step of spraying a paint layer on the surfaces of the frame body and the antenna includes: Spraying a first primer on the surfaces of the frame body and the antenna to form a first primer layer on the surfaces of the frame body and the antenna, wherein the first primer is a polyurethane coating; Forming a masking layer on the surface of the first primer layer; Sequentially forming a silver primer layer, a color paint layer, and a topcoat layer on the masking layer; The step of forming a masking layer on the surface of the first primer layer includes: Spraying a second primer on the surface of the first primer layer to form a second primer layer on the surface of the first primer layer, wherein the second primer is a photosensitive coating; Spraying a PU-type polyester paint wrapped with black carbon powder on the surface of the second primer layer to form a masking layer on the surface of the second primer layer, wherein the proportion of the black carbon powder in the PU-type polyester paint is greater than 30%, and the thickness of the masking layer is 40um - 50um.

2. The processing method according to claim 1, wherein The step of performing chemical plating treatment on the antenna circuit to form a conductive layer embedded in the antenna circuit includes: Performing pre-copper plating treatment on the surface of the antenna circuit to form a pre-copper plating layer on the surface of the antenna circuit; Performing impregnation treatment on the antenna circuit with a sulfuric acid solution to form a thickened copper layer on the surface of the pre-copper plating layer; Sequentially performing stannous ion sensitization treatment and palladium ion activation treatment on the thickened copper layer of the antenna circuit; Forming a protective coating on the surface of the thickened copper layer by using the process of chemical plating.

3. The processing method according to claim 2, wherein The step of forming a protective coating on the surface of the thickened copper layer by using the process of chemical plating includes: Performing nickel plating treatment on the surface of the thickened copper layer by using the process of chemical plating to form a nickel plating layer on the surface of the thickened copper layer; Performing passivation treatment on the nickel plating layer to obtain a protective coating.

4. The processing method according to claim 2, wherein, The step of forming a protective coating on the surface of the thickened copper layer by using the process of chemical plating includes: Performing silver plating treatment on the surface of the thickened copper layer by using the process of chemical plating to form a silver plating layer for protecting the thickened copper layer; Performing antioxidant treatment on the silver plating layer to obtain a protective coating.

5. The processing method according to claim 1, characterized in that, The step of forming a masking layer on the surface of the first primer layer includes: Spraying a polyurethane paint wrapped with black carbon powder on the surface of the first primer layer multiple times to form a masking layer on the surface of the first primer layer.

6. The processing method according to claim 1, characterized in that, The frame body includes side frames and a receiving cavity formed by enclosing with the side frames, and through holes penetrating the inner and outer surfaces of the side frames are provided on the side frames; The step of using laser direct structuring technology to laser engrave a sunken antenna circuit on the frame body includes: Using laser direct structuring technology to laser engrave antenna circuits on the inner and outer surfaces of the side frames of the frame body respectively, wherein the antenna circuit on the inner surface of the side frame is communicated with the antenna circuit on the outer surface through the through holes.

7. A housing, characterized in that, The frame is made by the processing method according to any one of claims 1 to 6.

8. An electronic device, characterized in that, The electronic device includes: the frame according to claim 7.

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