Heating assembly and aerosol generating device

Abstract

The present application provides a heating component and an aerosol generating device. The heating component includes a substrate, an infrared layer and a heating element; wherein the substrate is used to accommodate an aerosol generating substrate; the infrared layer is arranged on the surface of the substrate and / or the infrared layer, and is used to radiate infrared rays when heated to heat and atomize the aerosol generating substrate; the heating element is arranged on the substrate, and is used to heat the infrared layer when powered; wherein the heating element has a temperature coefficient of resistance characteristic and can be used as a temperature sensor. The heating component is not only easy to set up, but also occupies less space.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomization devices, and in particular to a heating component and an aerosol generating device. Background Art

[0002] Heat Not Burning (HNB) aerosol generating devices are gaining more and more attention and favor due to their advantages such as safety, convenience, health and environmental protection.

[0003] Existing heat-not-burn aerosol generating devices generally include a heating component and a power supply component; wherein the heating component is used to heat and atomize the aerosol generating matrix when powered on, and the power supply component is connected to the heating component to supply power to the heating component. During the specific heating process, it is often necessary to monitor the temperature of the heating component or the aerosol generating matrix in the heating component in real time to adjust the temperature field at any time to meet different temperature requirements. At present, the heating component is generally measured in real time by adding external temperature measuring elements such as thermocouple temperature sensors to facilitate the adjustment of the heating temperature at any time.

[0004] However, measuring temperature by adding a separate temperature sensor or temperature measuring element not only takes up a large space but also is inconvenient to install. Summary of the invention

[0005] The present application provides a heating component and an aerosol generating device, which can solve the problem that the existing temperature measurement is performed by adding a separate temperature sensor or a temperature measuring element, which not only occupies a large space but is also inconvenient to install.

[0006] In a first aspect, the present application provides a heating component. The heating component includes a substrate, an infrared layer, and a heating element; wherein the substrate is used to accommodate an aerosol generating substrate; the infrared layer is disposed on the surface of the substrate and / or the infrared layer, and is used to radiate infrared rays when heated to heat and atomize the aerosol generating substrate; the heating element is disposed on the substrate, and is used to heat the infrared layer when powered; wherein the heating element has a temperature coefficient of resistance (TCR) characteristic and can be used as a temperature sensor.

[0007] The heating element is a heating layer, and the heating layer is arranged on a surface of the infrared layer away from the substrate.

[0008] Among them, the heating element is arranged on the surface of the substrate and is spaced apart from the infrared layer.

[0009] The heating element is a heating layer, which is arranged on the surface of the substrate and located between the substrate and the infrared layer.

[0010] In a second aspect, the present application provides a heating component. The heating component includes a substrate, an infrared layer, a heating element, and a temperature measuring layer; wherein the substrate is used to accommodate an aerosol generating matrix; the infrared layer is disposed on the surface of the substrate, and is used to radiate infrared rays when heated, so as to heat and atomize the aerosol generating matrix; the heating element is disposed on the substrate, and is used to heat the infrared layer when powered on; the temperature measuring layer is disposed on the surface of the substrate and / or the infrared layer, and is spaced apart from the heating element; wherein the temperature measuring layer has a temperature coefficient of resistance (TCR) characteristic.

[0011] The temperature measuring layer is arranged on the surface of the substrate, and the temperature measuring layer and the infrared layer are located on the same surface of the substrate and are spaced apart from each other.

[0012] The temperature measuring layer is arranged on a surface of the infrared layer facing away from the substrate, and the temperature measuring layer is spaced apart from the heating element.

[0013] The temperature measuring layer is arranged around the substrate in a circumferential direction.

[0014] The temperature measuring layer is located at the end of the substrate.

[0015] The substrate is a hollow column, the infrared layer is arranged on the outer surface of the hollow column, and the heating element is a heating layer arranged on the surface of the infrared layer on one side away from the substrate.

[0016] The substrate is a hollow column, the infrared layer is arranged on the inner surface of the substrate of the hollow column, and the heating element is a heating layer arranged on the surface of the infrared layer on one side away from the substrate.

[0017] The heating layer is located in the middle of the substrate and is distributed in a wave-like manner along the circumferential direction of the substrate.

[0018] Wherein, the matrix is ​​quartz.

[0019] Among them, the infrared layer, the heating element and the temperature measuring layer are all arranged on the outer surface of the substrate by silk screen printing or coating, and the area of ​​the temperature measuring layer is smaller than that of the infrared layer.

[0020] In a third aspect, the present application provides an aerosol generating device. The aerosol generating device includes: a heating component, a power supply component and a controller; wherein the heating component is used to heat and atomize an aerosol generating matrix when powered on; the heating component is the heating component mentioned above; the power supply component is connected to the heating component and is used to supply power to the heating component; the controller is used to control the power supply component to supply power to the heating component, and to detect the resistance value of the heating element or the temperature measuring layer in real time and monitor the temperature of the heating component according to the resistance value.

[0021] The heating assembly and aerosol generating device provided by the present application. The heating assembly is provided with a substrate to accommodate the aerosol generating matrix through the substrate. At the same time, an infrared layer is provided on the surface of the substrate to radiate infrared rays when the infrared layer is heated, so that the aerosol generating matrix is ​​heated and atomized by the radiated infrared rays, thereby improving the heating efficiency, and the heating uniformity is good. In addition, a heating element is provided on the substrate and / or the infrared layer to heat the infrared layer when the heating element is energized, so that the infrared layer radiates infrared rays. In addition, the heating element can be used as a temperature sensor by having a temperature coefficient of resistance (TCR) characteristic, so that the heating assembly can monitor the temperature value of the heating assembly by detecting the resistance value of the heating element. Compared with the prior art, since the heating element is in the form of a film, it can be directly deposited on the surface of the substrate and / or the infrared layer, and there is no need to provide a mounting groove on the surface of the substrate and / or the infrared layer or to use screws or other fixings to install and fix it, so that the heating element is not only easy to set, but also occupies less space. In addition, since the heating element can choose to cover certain specific positions of the substrate and / or the infrared layer and choose to cover a larger area of ​​the substrate and / or the infrared layer surface according to actual needs, it is possible to measure the temperature of specific areas on the substrate and / or the infrared layer surface with high temperature measurement accuracy, and it is possible to measure the temperature of most areas of the substrate and / or the infrared layer, effectively expanding the temperature measurement range of the heating component. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a heating assembly provided in the first embodiment of the present application;

[0023] Figure 2 for Figure 1 A schematic structural diagram of the corresponding heating assembly;

[0024] Figure 3 A schematic diagram of the structure of a heating assembly provided in the second embodiment of the present application;

[0025] Figure 4 for Figure 3 A cross-sectional view of the heating assembly shown in FIG.

[0026] Figure 5 A schematic diagram of the structure of a heating assembly provided in the third embodiment of the present application;

[0027] Figure 6 for Figure 5 A schematic structural diagram of the corresponding heating assembly;

[0028] Figure 7 A schematic diagram of the structure of a heating assembly provided in a fourth embodiment of the present application;

[0029] Figure 8 for Figure 7 A schematic structural diagram of the corresponding heating assembly;

[0030] Fig. 9 A schematic structural diagram of an aerosol generating device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The terms "first", "second" and "third" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0033] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0034] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0035] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of a heating assembly provided in the first embodiment of the present application; Figure 2 for Figure 1A schematic structural diagram of the corresponding heating component; In this embodiment, a heating component 10 is provided, which is specifically used to heat and atomize an aerosol generating matrix to form an aerosol when powered on. The heating component 10 can be used in different fields, such as electronic atomization and other fields. The heating component 10 includes a substrate 11, an infrared layer 12 and a heating element 13. Among them, the heating element 13 is used to generate heat when powered on.

[0036] Among them, the substrate 11 can be in the shape of a hollow column, and the hollow structure of the substrate 11 is formed into a receiving cavity 111, and the receiving cavity 111 is used to receive the aerosol generating matrix. Among them, the aerosol generating matrix can be a plant grass leaf matrix or a paste matrix, etc. The substrate 11 is made of an insulating material, and the substrate 11 can be a high-temperature resistant insulating material such as quartz glass, ceramics or mica to prevent the two electrodes from short-circuiting. Preferably, the substrate 11 can be transparent quartz. Of course, the substrate 11 can also be made of a conductive material, in which case an insulating layer can be coated on the surface of the substrate 11. In a specific embodiment, the substrate 11 is a cylindrical ceramic tube. It should be noted that the inner surface of the substrate 11 involved in the following embodiments refers to the inner wall surface of the receiving cavity 111, and the outer surface of the substrate 11 refers to the outer wall surface of the receiving cavity 111.

[0037] The infrared layer 12 is arranged on the surface of the substrate 11, and is used to radiate infrared rays when heated to heat and atomize the aerosol generating matrix. Specifically, the infrared layer 12 can be formed on the inner or outer surface of the substrate 11 by silk screen printing, sputtering, coating, printing, etc. The infrared rays radiated by the infrared layer 12 are used to heat the aerosol generating matrix, and the heating efficiency is high, and the baking of the aerosol generating matrix is ​​more uniform. In a specific embodiment, the infrared layer 12 can be an infrared heating film, such as an infrared ceramic coating. The thickness and area of ​​the infrared heating film are not limited and can be selected as needed.

[0038] The infrared layer 12 may be a metal layer, a conductive ceramic layer or a conductive carbon layer. The shape of the infrared layer 12 may be a continuous film, a porous mesh or a strip. The material, shape and size of the infrared layer 12 may be set as required. In a specific embodiment, the infrared layer 12 radiates infrared rays when powered on to heat the aerosol in the receiving cavity 111 to generate a matrix. The infrared heating wavelength is 2.5um to 20um. In view of the characteristics of heating the aerosol to form a matrix, the heating temperature usually needs to be above 350°C, and the energy radiation extreme value is mainly in the 3~5um band.

[0039] In one embodiment, see Figure 1The infrared layer 12 is specifically arranged on the outer surface of the substrate 11, and the entire outer surface of the substrate 11 can be formed with the infrared layer 12, so as to achieve uniform heating while preventing the heat generated by the heating element 13 from being lost after being conducted through the substrate 11, resulting in a large error in the temperature measurement result; at the same time, the infrared layer 12 is prevented from being scratched by the aerosol generating matrix. The following embodiments are all taken as an example. Of course, in other embodiments, see Figure 3 and Figure 4 ,in, Figure 3 A schematic diagram of the structure of a heating assembly provided in the second embodiment of the present application; Figure 4 for Figure 3 The AA cross-sectional view of the heating assembly is shown. The infrared layer 12 can also be formed on the inner surface of the substrate 11, and the present application does not limit this.

[0040] The heating element 13 is arranged on the surface of the substrate 11 and / or the infrared layer 12, and is used to heat the infrared layer 12 when power is turned on. It can be understood that in this embodiment, the infrared layer 12 itself does not generate heat, and the temperature of the infrared layer 12 changes after the heating element 13 transfers heat to the infrared layer 12 after power is turned on and the heating element 13 generates heat. Specifically, the heating element 13 can also be formed by screen printing, sputtering, coating, printing, etc. Among them, the heating element 13 can be a heating film; for example, a copper film or an aluminum film or other conductive film.

[0041] Furthermore, the heating element 13 has a temperature coefficient of resistance (TCR) characteristic and can be used as a temperature sensor. That is, the resistance value of the heating element 13 has a monotonous one-to-one correspondence with its own temperature value. For example, the resistance value of the heating element 13 increases as its temperature value increases; or, the resistance value of the heating element 13 decreases as its temperature value increases. In this way, the heating component 10 can monitor the temperature value of the heating component 10 by detecting the resistance value of the heating element 13, and then adjust the temperature field of the heating component 10 to achieve the best effect of the suction taste. Compared with the solution in the prior art that requires a temperature measuring element such as a temperature measuring sensor, since the heating element 13 is in a film shape, it can be directly deposited on the surface of the substrate 11 and / or the infrared layer 12, without the need to set a mounting groove on the surface of the substrate 11 and / or the infrared layer 12 or to use screws or other fixings to install and fix it, so that the heating element 13 is not only easy to set, but also occupies less space. In addition, since the heating element 13 can choose to cover certain specific positions of the substrate 11 and / or the infrared layer 12 and choose to cover a larger area of ​​the substrate 11 and / or the infrared layer 12 surface according to actual needs, it is possible to measure the temperature of specific areas on the surface of the substrate 11 and / or the infrared layer 12 with high temperature measurement accuracy, and it is possible to measure the temperature of most areas of the substrate 11 and / or the infrared layer 12, effectively expanding the temperature measurement range of the heating component 10.

[0042] In a specific embodiment, the heating element 13 may at least cover the highest temperature area of ​​the heating component 10 to avoid the problem of excessively high local temperature affecting the heated taste of the aerosol-generating substrate. It is understandable that in a specific embodiment, if the highest temperature area of ​​the heating component 10 corresponds to a certain area of ​​the substrate 11, the heating element 13 at least covers the position of the substrate 11; if the highest temperature area of ​​the heating component 10 corresponds to a certain position of the infrared layer 12, the heating element 13 at least covers the position of the infrared layer 12.

[0043] like Figure 1 As shown, the heating element 13 can be arranged in a circle along the circumferential direction of the substrate 11. In this embodiment, two electrodes can be arranged at two preset positions of the heating element 13, and the two electrodes are respectively used to connect the positive lead and the negative lead to detect the resistance value of the heating element 13. Of course, in other embodiments, the heating element 13 can also be in an arc shape with a notch along the circumferential direction of the substrate 11, and the two ends of the heating element 13 where the notch is located can be formed into two electrodes to connect with the positive lead and the negative lead, and the present application does not limit this.

[0044] Specifically, the heating elements 13 may be distributed in a wave shape along the circumferential direction of the substrate 11 to cover different areas of the heating assembly 10 as much as possible, and then sense the temperature of different positions of the heating assembly 10 to monitor the temperature of different areas of the heating assembly 10. For example, when the substrate 11 is tubular, the heating element 13 is arranged in the middle of the substrate 11 and fluctuates along the length direction of the substrate 11, so as to cover different areas in the length direction of the substrate 11. Of course, in other embodiments, the heating elements 13 may also be distributed in a linear, bent, dotted, etc. manner along the circumferential direction of the substrate 11; the present application does not impose any restrictions on this, and the specific distribution position of the heating elements 13 may be selected according to actual needs, as long as the temperature value of the heating assembly 10 can be detected in real time.

[0045] In a specific embodiment, the infrared layer 12 and the heating element 13 can be arranged on the same surface of the substrate 11, or on different surfaces of the substrate 11, for example, one is arranged on the inner surface of the substrate 11, and the other is arranged on the outer surface of the substrate 11. The heating element 13 can be arranged only on the surface of the infrared layer 12, or only on the surface of the substrate 11, or on the surfaces of the infrared layer 12 and the substrate 11 at the same time, for example, one part is arranged on the surface of the infrared layer 12, and the other part is arranged on the surface of the substrate 11. The temperature measuring layer can be arranged on the side surface of the infrared layer 12 away from the substrate 11, or on the side surface of the infrared layer 12 close to the substrate 11.

[0046] In one embodiment, see Figure 1 and Figure 4, the heating element 13 is only arranged on the surface of the infrared layer 12 away from the substrate 11. The infrared layer 12 can cover the entire surface of the substrate 11, and when the infrared layer 12 is arranged on the outer surface of the substrate 11, the specific structure of the heating component 10 is as follows: Figure 1 When the infrared layer 12 is disposed on the inner surface of the substrate 11, the specific structure of the heating assembly 10 is as shown in Figure 3 and Figure 4 In this embodiment, after the heating element 13 is powered on, the temperature of the heating element 13 itself continues to rise, and its resistance value changes with the change of its own temperature, so that the temperature value of the heating component 10 is detected by detecting the resistance value of the heating element 13 itself, and then the temperature field of the heating component 10 is adjusted to achieve the best effect of the smoking taste.

[0047] In this embodiment, since the passive infrared layer 12 itself has a heat conduction function, the non-overlapping parts of the infrared layer 12 and the heating element 13 can be heat-conducted; therefore, the area of ​​the heating element 13 can be close to or smaller than the area of ​​the infrared layer 12.

[0048] Specifically, in this embodiment, the heating element 13 may be located in the middle of the base 11 along the axial direction thereof, and distributed in a wave-like manner around the outer surface of the base 11 .

[0049] In another embodiment, the heating element 13 is only disposed on the surface of the substrate 11 and is in the same plane as the infrared layer 12, so that after the heating element 13 is powered on and generates heat, the heat is transferred to the substrate 11, and then transferred to the infrared layer 12 through the substrate 11, so that the infrared layer 12 is heated and radiates infrared rays. In this embodiment, the heating element 13 can be spaced apart from the infrared layer 12; or, the heating element 13 is located between the substrate 11 and the infrared layer 12, and the present application does not limit this.

[0050] Of course, in other embodiments, the heating element 13 and the infrared layer 12 are both disposed on the substrate 11 and are located on different surfaces of the substrate 11. For example, the heating element 13 is disposed on the inner surface of the substrate 11, and the infrared layer 12 is disposed on the outer surface of the substrate 11. After the heating element 13 is powered on, the temperature generated by the heating element 13 is transferred to the substrate 11, and the temperature of the substrate 11 is further transferred to the infrared layer 12, so that the infrared layer 12 is heated and radiates infrared rays. Alternatively, the heating element 13 is disposed on the outer surface of the substrate 11, and the infrared layer 12 is disposed on the inner surface of the substrate 11.

[0051] The heating assembly 10 provided in this embodiment is provided with a substrate 11 so as to accommodate the aerosol generating matrix through the substrate 11. At the same time, by providing an infrared layer 12 on the surface of the substrate 11, the infrared layer 12 radiates infrared rays when being heated, so as to heat and atomize the aerosol generating matrix through the radiated infrared rays, thereby improving the heating efficiency, and the heating uniformity is good. In addition, by providing a heating element 13 on the substrate 11 and / or the infrared layer 12, the infrared layer 12 is heated when the heating element 13 is energized, so that the infrared layer 12 radiates infrared rays. In addition, by making the heating element 13 have a temperature coefficient of resistance (TCR) characteristic, the heating assembly 10 can monitor the temperature value of the heating assembly 10 by detecting the resistance value of the heating element 13. Compared with the prior art, the heating element 13 is not only easy to set up, but also occupies less space. In addition, since the heating element 13 can choose to cover certain specific positions of the substrate 11 and / or the infrared layer 12 and choose to cover a larger area of ​​the substrate 11 and / or the infrared layer 12 surface according to actual needs, it is possible to measure the temperature of specific areas on the surface of the substrate 11 and / or the infrared layer 12 with high temperature measurement accuracy, and it is possible to measure the temperature of most areas of the substrate 11 and / or the infrared layer 12, effectively expanding the temperature measurement range of the heating component 10.

[0052] See also Figure 5 and Figure 6 ,in, Figure 5 A schematic diagram of the structure of a heating assembly provided in the third embodiment of the present application; Figure 6 for Figure 5 A schematic diagram of the structure of the corresponding heating component. In the present embodiment, another heating component 10 is provided, which is different from the heating component 10 provided in the first embodiment described above in that: the heating component 10 also includes a temperature measuring layer 14. The temperature measuring layer 14 has a temperature coefficient of resistance (TCR) characteristic. That is, the resistance value of the temperature measuring layer 14 has a monotonous one-to-one correspondence with its own temperature value. For example, the resistance value of the temperature measuring layer 14 increases as its temperature value increases; or, the resistance value of the temperature measuring layer 14 decreases as its temperature value increases. In this embodiment, the heating component 10 can specifically monitor the temperature value of the heating component 10 by detecting the resistance value of the temperature measuring layer 14, and then adjust the temperature field of the heating component 10 to achieve the best effect of the smoking taste. Compared with the solution in the prior art that requires a separate temperature measuring element such as a temperature measuring sensor, since the temperature measuring layer 14 is in a film shape, it can be directly deposited on the surface of the substrate 11 and / or the infrared layer 12, and there is no need to set a mounting groove on the surface of the substrate 11 and / or the infrared layer 12 or to use screws or other fixings to install and fix it, so that the temperature measuring layer 14 is not only easy to set up, but also occupies less space.

[0053] Of course, in a specific embodiment, the resistance value of the heating element 13 can also be detected simultaneously to monitor the temperature value of the heating component 10 to improve the accuracy of the temperature value monitoring result. Of course, in this embodiment, the heating element 13 may not have a temperature coefficient of resistance (TCR) characteristic, and this embodiment does not limit this.

[0054] The temperature measuring layer 14 can be formed on the surface of the substrate 11 and / or the infrared layer 12 by screen printing, sputtering, coating, printing, etc., and is spaced apart from the heating element 13. Since the temperature measuring layer 14 can cover certain specific positions of the substrate 11 and / or the infrared layer 12 and cover a larger area of ​​the substrate 11 and / or the infrared layer 12 according to actual needs, the temperature of a specific area on the surface of the substrate 11 and / or the infrared layer 12 can be measured, the temperature measurement accuracy is high, and the temperature of most areas of the substrate 11 and / or the infrared layer 12 can be measured, which effectively expands the temperature measurement range of the heating component 10.

[0055] Specifically, the temperature measuring layer 14 may at least cover the highest temperature area of ​​the heating component 10 to avoid the problem of excessively high local temperature affecting the heated taste of the aerosol-generating substrate. It is understood that, in a specific embodiment, if the highest temperature area of ​​the heating component 10 corresponds to a certain area of ​​the substrate 11, the temperature measuring layer 14 at least covers the position of the substrate 11; if the highest temperature area of ​​the heating component 10 corresponds to a certain position of the infrared layer 12, the temperature measuring layer 14 at least covers the position of the infrared layer 12.

[0056] In one embodiment, the square resistance of the temperature measuring layer 14 is 1Ω / □~5Ω / □, and the resistance temperature coefficient of the temperature measuring layer 14 is 300 ppm / ℃~3500 ppm / ℃. Further, the square resistance of the temperature measuring layer 14 is 2Ω / □~4Ω / □, and the resistance temperature coefficient of the temperature measuring layer 14 is 700ppm / ℃~2000ppm / ℃.

[0057] Among them, since the resistance of the temperature measuring layer 14 is relatively large and the temperature measuring layer 14 only realizes the temperature measuring function, therefore, in a specific embodiment, the area of ​​the temperature measuring layer 14 can be smaller than the area of ​​the infrared layer 12, which can not only reduce energy consumption, but also does not affect the heating effect of the infrared layer 12; at the same time, the overall temperature field of the infrared layer 12 can be consistent. Specifically, the area ratio of the temperature measuring layer 14 to the infrared layer 12 can range from 1:5 to 1:10.

[0058] Specifically, the resistor paste for preparing the temperature measuring layer 14 includes an organic carrier, an inorganic binder and a conductive agent. In terms of mass percentage, the organic carrier accounts for 10 to 20 parts, the inorganic binder accounts for 30 to 45 parts, and the conductive agent accounts for 30 to 50 parts. The inorganic binder includes glass powder, and the conductive agent is selected from at least one of silver and palladium.

[0059] In one embodiment, the organic carrier is selected from at least one of terpineol, ethyl cellulose, butyl carbitol, polyvinyl butyral, tributyl citrate and polyamide wax.

[0060] In one embodiment, the inorganic binder includes glass powder having a melting point of 700° C. to 780° C.

[0061] like Figure 5 As shown, the temperature measuring layer 14 can be arranged in a circle along the circumferential direction of the substrate 11. In this embodiment, two electrodes can be arranged at two preset positions of the temperature measuring layer 14, and the two electrodes are respectively used to connect the positive lead and the negative lead to detect the resistance value of the temperature measuring layer 14. Of course, in other embodiments, the temperature measuring layer 14 can also be in an arc shape with a notch along the circumferential direction of the substrate 11, and the two ends of the notch of the temperature measuring layer 14 can be formed into two electrodes to connect to the positive lead and the negative lead, and the present application does not limit this.

[0062] Specifically, the temperature measuring layer 14 may be distributed in a linear manner along the circumferential direction of the substrate 11 to detect the temperature of a specific area of ​​the heating assembly 10. Of course, in other embodiments, the temperature measuring layer 14 may also be distributed in a linear manner, a connected "Z" shape, a U shape, a bending shape, a dot shape, etc. along the circumferential direction of the substrate 11.

[0063] Specifically, the temperature measuring layer 14 and the heating element 13 may be made of the same material. The power of the temperature measuring layer 14 is greater than the power of the heating element 13 .

[0064] In a specific embodiment, the temperature measuring layer 14 and the infrared layer 12 can be arranged on the same surface of the substrate 11, or on different surfaces of the substrate 11, for example, one is arranged on the inner surface of the substrate 11, and the other is arranged on the outer surface of the substrate 11. The temperature measuring layer 14 can be arranged only on the surface of the infrared layer 12, or only on the surface of the substrate 11, or on the surfaces of the infrared layer 12 and the substrate 11 at the same time, for example, one part is arranged on the surface of the infrared layer 12, and the other part is arranged on the surface of the substrate 11. The temperature measuring layer 14 can be arranged on the side surface of the infrared layer 12 away from the substrate 11, or on the side surface of the infrared layer 12 close to the substrate 11.

[0065] In a first specific embodiment, if Figure 5 and Figure 6As shown, the infrared layer 12 is disposed on the outer surface of the substrate 11, and the temperature measuring layer 14 is only disposed on the surface of the infrared layer 12 on one side away from the substrate 11. After the heating element 13 is powered on, the temperature of the heating element 13 rises, and the heat generated by the heating element 13 is transferred to the infrared layer 12, and then transferred to the temperature measuring layer 14 through the infrared layer 12, so that the temperature of the temperature measuring layer 14 increases with the increase of the temperature of the infrared layer 12, and the resistance value of the temperature measuring layer 14 changes with the change of its temperature, and then the temperature value of the heating component 10 is monitored in real time by detecting the resistance value of the temperature measuring layer 14.

[0066] like Figure 5 As shown, the substrate 11 is a hollow cylinder, and the infrared layer 12 covers the entire outer surface of the substrate 11. This can prevent the temperature of the heating element 13 from being lost after the substrate 11 conducts heat, resulting in a large error in the temperature measurement result; at the same time, it can prevent the heating layer from being scratched by the aerosol-generating matrix. In this embodiment, the heating element 13 can be specifically located in the middle position of the substrate 11 along its axial direction, and is arranged in a wave shape around the outer surface of the substrate 11 to improve the uniformity of heating; the temperature measuring layer 14 is arranged near the end of the infrared layer 12 to detect the temperature of a specific area of ​​the heating component 10. Of course, in other embodiments, the infrared layer 12 can also be arranged on the inner surface of the substrate 11, and the present application does not limit this.

[0067] In the second specific embodiment, see Figure 7 and Figure 8 , Figure 7 A schematic diagram of the structure of a heating assembly provided in a fourth embodiment of the present application; Figure 8 for Figure 7 A schematic diagram of the structure of the corresponding heating component. The temperature measuring layer 14 is arranged on the surface of the substrate 11, and is located on the same surface of the substrate 11 as the infrared layer 12 and is arranged at intervals. In this specific embodiment, the heating element 13 generates heat after being energized, and the temperature of the heating element 13 is transmitted to the infrared layer 12, and then transmitted to the surface of the substrate 11 through the infrared layer 12. The temperature of the temperature measuring layer 14 arranged on the surface of the substrate 11 changes with the temperature of the substrate 11, and the resistance value of the temperature measuring layer 14 changes with the temperature thereof, so that the temperature value of the heating component 10 is monitored in real time by detecting the resistance value of the temperature measuring layer 14.

[0068] In this embodiment, the position of the temperature measuring layer 14 is specifically selected to be set at any position of the substrate 11 or to cover any position of the substrate 11 according to actual needs. For example, if the temperature of the first end of the substrate 11 is to be monitored, the temperature measuring layer 14 can be set at the first end. If the temperature of the middle of the substrate 11 is to be monitored, the temperature measuring layer 14 can be set at the middle position of the substrate 11, such as Figure 1As shown. If the temperatures of the first end and the second end of the substrate 11 are to be monitored simultaneously, a plurality of temperature measuring layers 14 may be provided, with one temperature measuring layer 14 covering the first end and another temperature measuring layer 14 covering the second end, so as to monitor the temperatures of the corresponding positions of the substrate 11. Preferably, in a specific embodiment, the infrared layer 12 may be provided at the first end of the outer surface of the substrate 11, and the temperature measuring layer 14 may be provided at the second end of the substrate 11, and may be spaced apart from the infrared layer 12, so as to detect the temperature value of the second end of the substrate 11 by detecting the resistance value of the temperature measuring layer 14.

[0069] See also Figure 7 The substrate 11 is a hollow cylindrical shape, and the infrared layer 12 is arranged on the outer surface of the substrate 11 and only exposes one end of the substrate 11. The temperature measuring layer 14 is arranged in the exposed area of ​​the outer surface of the substrate 11, and is spaced from the infrared layer 12, and the temperature measuring layer 14 is arranged around the circumferential direction of the substrate 11. Among them, the temperature measuring layer 14 can be arranged in a circle along the circumferential direction of the substrate 11, that is, the temperature measuring layer 14 is in a closed loop; of course, the temperature measuring layer 14 can also be arranged in an open loop along the circumferential direction of the substrate 11, that is, the arc corresponding to the temperature measuring layer 14 is less than 360 degrees.

[0070] In the third specific embodiment, the temperature measuring layer 14 is disposed on the surface of the substrate 11, and the temperature measuring layer 14 is specifically located between the substrate 11 and the infrared layer 12. It can be understood that in this embodiment, the temperature measuring layer 14 and the infrared layer 12 are located on the same surface of the substrate 11.

[0071] In the fourth specific embodiment, the temperature measuring layer 14 is located on the surface of the substrate 11, and the temperature measuring layer 14, the infrared layer 12 and the heating element 13 are arranged on different surfaces of the substrate 11. For example, the infrared layer 12 and the heating element 13 are arranged on the inner surface of the substrate 11, and the temperature measuring layer 14 is arranged on the outer surface of the substrate 11. The temperature of the heating element 13 after being energized and heated is sequentially transmitted to the infrared layer 12 and the substrate 11, and the temperature of the substrate 11 is further transmitted to the temperature measuring layer 14, so that the resistance of the temperature measuring layer 14 changes with the change of its temperature. Alternatively, the infrared layer 12 and the heating element 13 are arranged on the outer surface of the substrate 11, and the temperature measuring layer 14 is arranged on the inner surface of the substrate 11.

[0072] In the fifth specific embodiment, the temperature measuring layer 14 and the heating element 13 are located on the same surface of the substrate 11, and the temperature measuring layer 14 can be provided on the surface of the substrate 11 and the infrared layer 12 facing away from the substrate 11. The temperature measuring layer 14 provided on the surface of the substrate 11 and the infrared layer 12 facing away from the substrate 11 can be spaced apart from the heating element 13, and can be arranged around the circumferential direction of the substrate 11 and distributed in a straight line. The temperature measuring layer 14 provided on the substrate 11 and the temperature measuring layer 14 provided on the surface of the infrared layer 12 facing away from the substrate 11 can be spaced apart or integrally formed.

[0073] Among them, by arranging the temperature measuring layer 14 on both the infrared layer 12 and the substrate 11, the temperature measuring layer 14 can sense the temperature of the substrate 11 and the heating element 13 at the same time, so as to ensure that the temperature measuring layer 14 at least covers the highest temperature area of ​​the heating component 10, and avoid the problem that the highest temperature area of ​​the heating component 10 appears in other areas not covered by the temperature measuring layer 14, resulting in large errors in the temperature measurement results.

[0074] The heating component 10 provided in this embodiment is provided with a substrate 11 so as to accommodate the aerosol generating matrix through the substrate 11. At the same time, by providing an infrared layer 12 on the surface of the substrate 11, the infrared layer 12 radiates infrared rays when being heated, so as to heat and atomize the aerosol generating matrix through the radiated infrared rays, thereby improving the heating efficiency and achieving better heating uniformity. In addition, by providing a heating element 13 on the substrate 11, the infrared layer 12 is heated when the heating element 13 is energized, so that the infrared layer 12 radiates infrared rays. In addition, by providing a temperature measuring layer 14 on the surface of the substrate 11 and / or the infrared layer 12, and making the temperature measuring layer 14 have a temperature coefficient of resistance (TCR) characteristic, the heating component 10 can monitor the temperature value of the heating component 10 by detecting the resistance value of the temperature measuring layer 14. Compared with the prior art, the temperature measuring layer 14 is not only easy to set up, but also occupies less space. In addition, since the temperature measuring layer 14 can choose to cover certain specific positions of the substrate 11 and / or the infrared layer 12 and choose to cover a larger area of ​​the substrate 11 and / or the infrared layer 12 surface according to actual needs, it is possible to measure the temperature of specific areas on the surface of the substrate 11 and / or the infrared layer 12 with high temperature measurement accuracy, and it is possible to measure the temperature of most areas of the substrate 11 and / or the infrared layer 12, effectively expanding the temperature measurement range of the heating component 10.

[0075] See also Fig. 9 , Fig. 9 The structure diagram of an aerosol generating device provided in one embodiment of the present application is shown in FIG. 1 . In this embodiment, an aerosol generating device 100 is provided. The aerosol generating device 100 includes a heating component 10 , a power component 20 , and a controller 30 .

[0076] The heating component 10 is used to heat and atomize the aerosol generating substrate to form an aerosol when powered on. The heating component 10 may be any of the heating components 10 described in the above embodiments. The specific structure and function of the heating component 10 may refer to the description of the specific structure and function of the heating component 10 in the above embodiments, and the same or similar technical effects may be achieved. For details, refer to the following.

[0077] The power supply assembly 20 is connected to the heating assembly 10 to supply power to the heating assembly 10. The heating assembly 10 and the power supply assembly 20 may be detachably connected to facilitate replacement of the heating assembly 10 and improve the utilization rate of the power supply assembly 20. Of course, in other embodiments, the power supply assembly 20 and the heating assembly 10 may also be integrally arranged, and the present application does not limit this.

[0078] The controller 30 is used to control the power supply component 20 to supply power to the heating component 10, detect the resistance value of the temperature measuring layer 14 on the heating component 10 in real time, and monitor the temperature of the heating component 10 according to the resistance value, and then adjust the temperature field of the heating component 10 to achieve the best effect of smoking taste.

[0079] In a specific embodiment, the aerosol generating device 100 further includes a housing 40 , and the heating component 10 is specifically accommodated in the housing 40 and connected to the power supply component 20 .

[0080] The aerosol generating device 100 provided in this embodiment, by providing the heating component 10 involved in any of the above embodiments, enables the aerosol generating device 100 to not only utilize the radiated infrared rays to heat and atomize the aerosol generating matrix to improve the heating efficiency and enhance the heating uniformity; and can detect the temperature value of the heating component 10 by detecting the resistance value of the heating element 13 or the temperature measuring layer 14, so as to adjust the temperature field of the heating component 10 and achieve the best effect of the puffing mouthfeel. At the same time, compared with the prior art, since the heating element 13 or the temperature measuring layer 14 is in the form of a film, it can be directly deposited on the surface of the substrate 11 and / or the infrared layer 12, without providing a mounting groove on the surface of the substrate 11 and / or the infrared layer 12 or using screws or other fixings to install and fix it, so that the heating element 13 or the temperature measuring layer 14 is not only easy to set, but also occupies less space. In addition, since the heating element 13 or the temperature measuring layer 14 can choose to cover certain specific positions of the substrate 11 or the infrared layer 12 and choose to cover a larger area of ​​the substrate 11 and / or the infrared layer 12 surface according to actual needs, it is possible to measure the temperature of specific areas on the surface of the substrate 11 and / or the infrared layer 12 with high temperature measurement accuracy, and it is possible to measure the temperature of most areas of the substrate 11 and / or the infrared layer 12, effectively expanding the temperature measurement range of the heating component 10.

[0081] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heating component, characterized in that: include: A substrate for containing an aerosol generating matrix; an infrared layer, disposed on the surface of the substrate, for radiating infrared rays when heated to heat and atomize the aerosol generating substrate; A heating element, disposed on the substrate, for heating the infrared layer when powered; A temperature measuring layer is arranged on the surface of the substrate and / or the infrared layer, and is spaced apart from the heating element; wherein the temperature measuring layer has a temperature coefficient of resistance (TCR) characteristic; the temperature measuring layer is arranged in a circle around the circumferential direction of the substrate; the temperature measuring layer is located at the end of the substrate; the material of the temperature measuring layer is a resistor paste, and the resistor paste includes 10-20 parts by weight of an organic carrier, 30-45 parts by weight of an inorganic binder, and 30-50 parts by weight of a conductive agent; wherein the inorganic binder includes glass powder, the conductive agent includes at least one of silver and palladium, and the organic carrier includes at least one of pine alcohol, ethyl cellulose, butyl carbitol, polyvinyl butyral, tributyl citrate, and polyamide wax; The temperature measuring layer at least covers the highest heating area of ​​the heating component, and the ratio of the area of ​​the temperature measuring layer to the area of ​​the infrared layer is 1:5-1:

10.

2. The heating assembly according to claim 1, characterized in that The temperature measuring layer is arranged on the surface of the substrate, and the temperature measuring layer and the infrared layer are located on the same surface of the substrate and are spaced apart from each other.

3. The heating assembly according to claim 1, characterized in that The temperature measuring layer is arranged on a surface of the infrared layer facing away from the substrate, and the temperature measuring layer is spaced apart from the heating element.

4. The heating assembly according to claim 1, characterized in that The substrate is a hollow column, the infrared layer is arranged on the outer surface of the hollow column, and the heating element is a heating layer arranged on the surface of the infrared layer on one side away from the substrate.

5. The heating assembly according to claim 1, characterized in that The substrate is a hollow columnar body, the infrared layer is arranged on the inner surface of the substrate of the hollow columnar body, and the heating element is a heating layer arranged on a side surface of the infrared layer away from the substrate.

6. The heating assembly according to claim 4 or 5, characterized in that: The heat generating layer is located in the middle of the substrate and is distributed in a wave-like manner along the circumferential direction of the substrate.

7. The heating assembly according to claim 1, characterized in that The substrate is quartz.

8. The heating assembly according to claim 1, characterized in that The infrared layer, the heating element and the temperature measuring layer are all arranged on the outer surface of the substrate by silk-screen printing or coating.

9. An aerosol generating device, characterized in that: include: A heating component, used for heating and atomizing the aerosol-generating substrate when powered on; the heating component is a heating component according to any one of claims 1 to 8; A power supply component, connected to the heating component, and used to supply power to the heating component; The controller is used to control the power supply component to supply power to the heating component, detect the resistance value of the heating element or the temperature measuring layer in real time, and monitor the temperature of the heating component according to the resistance value.

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