MEMS devices

Abstract

A MEMS device belongs to the field of electronic technology and can be applied to mobile phones, smart homes, the Internet of Things (IoT), autonomous driving and other fields. The MEMS device includes a tube shell, a base plate and a first inertial component. The first inertial component is located in the packaging space formed by the base plate and the tube shell. The surface of the base plate facing the packaging space has a first alignment portion, and the first inertial component has a first mounting portion. The shape of the first mounting portion matches that of the first alignment portion. That is, the MEMS device has its own installation alignment reference, and the first mounting portion is connected to the first alignment portion, so that the first inertial component can be installed on the base plate at a preset angle. The process is simple and the installation cost is low. In addition, since the bottom of the first inertial component is not directly connected to the base plate, various zero-position errors caused by packaging stress can be reduced.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a micro electromechanical systems (MEMS) device. Background Art

[0002] Accelerometers and gyroscopes made with microelectromechanical systems (MEMS) are sensors based on the principle of inertial sensing and are referred to as inertial devices. A sensing system consisting of three accelerometers and three gyroscopes mounted orthogonally is called an inertial measurement unit (IMU).

[0003] For high-precision inertial measurement units, a single-axis sensitive inertial structure is usually used to ensure the accuracy of inertial force detection in each axis. Specifically, a three-axis assembly is used to orthogonally install three gyroscopes (with the axes of X, Y, and Z) and three accelerometers (with the axes of X, Y, and Z) in a three-axis installation. In this case, the inertial components with the axes of X and Y need to be mounted vertically on the base plate.

[0004] In the prior art, the inertial device is first mounted horizontally in a vertically mountable housing, which is then welded vertically to the baseplate. This vertical mounting method presents two challenges. First, the process is complex and the installation cost is high. Second, installation errors are significant, leading to high costs for subsequent testing, calibration, and compensation. Summary of the Invention

[0005] The present application provides a MEMS device unit, which can solve the problems of high cost and low precision of MEMS devices.

[0006] In one aspect, a MEMS device is provided. The MEMS device includes a housing, a base plate, and a first inertial component. The base plate and the housing form a packaging space, and the first inertial component is located within the packaging space. A surface of the base plate facing the packaging space includes a first alignment portion, and the first inertial component includes a first mounting portion, the first mounting portion matching the shape of the first alignment portion. The first mounting portion is connected to the first alignment portion to mount the first inertial component on the base plate at a preset angle, the preset angle being greater than 0 degrees and less than 180 degrees.

[0007] In the present application, after the first mounting portion in the first inertial component is connected to the first alignment portion on the surface of the base plate facing the packaging space, the first inertial component is mounted on the base plate at a preset angle. That is, the MEMS device in the present application has its own mounting alignment reference, based on which the first inertial component can be mounted at a preset angle on the base plate. The process is simple and the installation cost is low. In addition, since the first inertial component is mounted on the base plate at a preset angle, the bottom of the first inertial component is not directly connected to the base plate, which helps to reduce various zero-position errors caused by packaging stress. At the same time, since the flatness and angle accuracy of the first mounting portion and the first alignment portion are both high, it helps to reduce assembly errors, thereby reducing the cost of subsequent test calibration compensation.

[0008] The first inertial component is a sensor based on the inertial sensing principle, such as an accelerometer or a gyroscope, or a combination of an accelerometer and a gyroscope. The first inertial component can be a single-axis inertial component, such as including at least one of a single-axis gyroscope and a single-axis accelerometer; or the first inertial component can be a multi-axis inertial component, such as including at least one of a multi-axis gyroscope and a multi-axis accelerometer; or the first inertial component can include a single-axis gyroscope and a multi-axis accelerometer; or the first inertial component can include a multi-axis gyroscope and a single-axis accelerometer.

[0009] The shape matching between the first mounting portion and the first alignment portion means that the angles of the corners of the first mounting portion are the same as those of the first alignment portion, and the corners of the first mounting portion and the corners of the first alignment portion are opposite each other in concave and convex configurations, i.e., one of the corners of the first mounting portion and the corners of the first alignment portion is convex and the other is concave. In this way, the corners of the first mounting portion and the corners of the first alignment portion can completely fit together, i.e., the first mounting portion can be precisely aligned and connected to the first alignment portion.

[0010] The corner portion of the first mounting portion refers to the edge of the first mounting portion and the portion connected to the edge. The corner portion of the first mounting portion is generally composed of two adjacent surfaces of the first mounting portion, and the angle of the corner portion of the first mounting portion is the angle between the two surfaces. The corner portion of the first alignment portion refers to the edge of the first alignment portion and the portion connected to the edge. The corner portion of the first alignment portion is generally composed of two adjacent surfaces of the first alignment portion, and the angle of the corner portion of the first alignment portion is the angle between the two surfaces.

[0011] Mounting the first inertial assembly on the base plate at a preset angle means that, after the first inertial assembly is mounted on the base plate, the angle between the stacking surface of the first inertial assembly and the surface of the base plate facing the packaging space is the preset angle. The stacking surface of the first inertial assembly refers to the surface of each layer of the first inertial assembly that is used to stack with adjacent layers.

[0012] The angles of the corners of the first mounting portion and the angles of the corners of the first alignment portion may be the same as or different from the preset angles. In one possible implementation, the angles of the corners of the first mounting portion and the angles of the corners of the first alignment portion are the same as the preset angles. In this implementation, the angles of the corners of the first mounting portion and the angles of the corners of the first alignment portion are the same as the angles of the corners of the first mounting portion. In another possible implementation, the angles of the corners of the first mounting portion and the angles of the corners of the first alignment portion are not necessarily related to the preset angles, that is, no matter how many degrees the angles of the corners of the first mounting portion and the angles of the corners of the first alignment portion are, the first inertia component is installed on the base plate at a fixed preset angle.

[0013] Optionally, the preset angle is 90 degrees, meaning the first inertial assembly is mounted on the base plate at a 90-degree angle. In other words, after the first inertial assembly is mounted on the base plate, the angle between the stacking surface of the first inertial assembly and the surface of the base plate facing the packaging space is 90 degrees, meaning the first inertial assembly is mounted vertically on the base plate.

[0014] The MEMS device further includes a second inertial assembly located within the packaging space. A surface of the base plate facing the packaging space includes a second alignment portion, and the second inertial assembly includes a second mounting portion, the second alignment portion matching the shape of the second mounting portion. The second mounting portion connects to the second alignment portion to mount the second inertial assembly on the base plate at a predetermined angle.

[0015] The second inertial component is a sensor based on the inertial sensing principle, such as an accelerometer or a gyroscope, or a combination of an accelerometer and a gyroscope. The second inertial component can be a single-axis inertial component, such as including at least one of a single-axis gyroscope and a single-axis accelerometer; or the second inertial component can be a multi-axis inertial component, such as including at least one of a multi-axis gyroscope and a multi-axis accelerometer; or the second inertial component can include a single-axis gyroscope and a multi-axis accelerometer; or the second inertial component can include a multi-axis gyroscope and a single-axis accelerometer.

[0016] The axial direction of the first inertial assembly is different from the axial direction of the second inertial assembly. For example, the axial direction of the first inertial assembly can be the horizontal X-axis, and the axial direction of the second inertial assembly can be the horizontal Y-axis. In this way, the second inertial assembly and the first inertial assembly can perform inertial force detection along different axes.

[0017] In the present application, since the first inertial component and the second inertial component are packaged in the same tube shell, the amount of packaging tube shell used is reduced, the packaging cost is significantly reduced, the packaging volume is reduced, and the integration is improved.

[0018] Furthermore, the MEMS device also includes a third inertial component, which is located within the packaging space. The third inertial component is mounted on the base plate, and the stacking surface of the third inertial component is parallel to the surface of the base plate facing the packaging space. In this way, the third inertial component is mounted horizontally on the base plate. In this case, the bottom of the third inertial component is connected to the surface of the base plate facing the packaging space.

[0019] The third inertial component is a sensor based on the inertial sensing principle, such as an accelerometer, a gyroscope, or a combination of an accelerometer and a gyroscope. The third inertial component can be a single-axis inertial component, such as including at least one of a single-axis gyroscope and a single-axis accelerometer; or a multi-axis inertial component, such as including at least one of a multi-axis gyroscope and a multi-axis accelerometer; or the third inertial component can include a single-axis gyroscope and a multi-axis accelerometer; or the third inertial component can include a multi-axis gyroscope and a single-axis accelerometer.

[0020] In one possible scenario, the third inertial component can be a single-axis inertial component, for example, the axis of the third inertial component can be the vertical Z axis. The axis of the first inertial component can be the horizontal X axis, and the axis of the second inertial component can be the horizontal Y axis. This can improve the accuracy of the MEMS device.

[0021] In another possible scenario, the third inertial component can be a multi-axis inertial component, for example, the axial direction of the third inertial component can be the horizontal Y axis and the vertical Z axis, and the axial direction of the first inertial component can be the horizontal X axis. In this way, the packaging volume can be reduced.

[0022] In this application, a system-level package (SIP) is used to assemble multiple inertial components in three dimensions within the same packaging space, thereby improving the integration and reducing the size of the MEMS device in the three directions of the X-axis, Y-axis, and Z-axis. Based on the precise installation and alignment technology, this application reduces the existing multiple packaging shells to only one packaging shell, thereby suppressing the cost and volume while ensuring accuracy. In addition, the precise installation and alignment technology based on the base plate is conducive to reducing the installation error during multi-axis assembly, and then reducing the cross-axis coupling error of the MEMS device, thereby reducing the difficulty of subsequent test calibration compensation, reducing costs, and improving the performance consistency of the MEMS device. In this way, a small-volume, low-cost, high-precision MEMS device can be obtained.

[0023] Optionally, the first inertial assembly includes an inertial device, a flexible substrate, and a processor. The inertial device, the first portion of the flexible substrate, and the processor are stacked and connected in sequence. The inertial device has a first mounting portion, and the second portion of the flexible substrate, excluding the first portion, is connected to the surface of the base plate facing the packaging space. The first electrode of the inertial device is electrically connected to the first output electrode of the processor, the second electrode of the inertial device is electrically connected to the input electrode of the processor, the second output electrode of the processor is electrically connected to the electrode of the first portion, the electrode of the first portion is electrically connected to the electrode of the second portion, and the electrode of the second portion is electrically connected to the electrode on the surface of the base plate facing the packaging space.

[0024] The flexible substrate is bendable and can be formed into a first portion and a second portion. The first portion and the second portion of the flexible substrate are not coplanar, forming a predetermined angle between them. This angle can be the same as or close to a predetermined angle. Thus, the first portion of the flexible substrate is connected to the inertial device and processor stack, while the second portion of the flexible substrate is independent of the first portion and connected to the surface of the base plate facing the packaging space.

[0025] In this case, the inertial signal from the inertial component is output to the processor, which processes the signal and outputs it to the baseplate via the flexible substrate. This allows the inertial signal from the first inertial component to be smoothly output to the baseplate even when the first inertial component is mounted at a preset angle. This simplifies the process and reduces costs.

[0026] Optionally, the inertial device includes a substrate layer, a first insulating layer, an inertial structure layer, a second insulating layer, and a cover layer. The substrate layer, the first insulating layer, the inertial structure layer, the second insulating layer, and the cover layer are stacked and connected in sequence. An input signal of the inertial structure layer is introduced from a first electrode of the first insulating layer, and an output signal of the inertial structure layer is drawn from a second electrode of the first insulating layer. The first electrode of the first insulating layer is electrically connected to a first output electrode of a processor, and the second electrode of the first insulating layer is electrically connected to an input electrode of the processor.

[0027] The first insulating layer has a larger area than the inertial structure layer and includes a first edge region and a second edge region. The remaining regions of the first insulating layer, excluding the first and second edge regions, are stacked and connected to the inertial structure layer. The first electrode and the second electrode of the first insulating layer are both located in the first edge region. The surface of the second edge region near the inertial structure layer and the side surface of the inertial structure layer near the second edge region constitute the corner portion of the first mounting portion.

[0028] Furthermore, the MEMS device also includes a passive device located within the base plate and electrically connected between an electrode on a surface of the base plate facing the packaging space and a pin on a surface of the base plate facing away from the packaging space. Furthermore, an active device is located on a surface of the base plate facing the packaging space and electrically connected between an electrode on a surface of the base plate facing the packaging space and a pin on a surface of the base plate facing away from the packaging space.

[0029] In this application, passive components can be embedded in the baseboard and active components can be surface mounted, so that more components can be integrated in a limited packaging space, more functions can be realized, and the integration level can be further improved.

[0030] On the other hand, a MEMS device is provided. The MEMS device includes a housing, a base plate, and a first inertial component.

[0031] The base plate and the tube shell form a packaging space, and the first inertial component is located in the packaging space; the first inertial component is mounted on the base plate at a preset angle, which is greater than 0 degrees and less than 180 degrees. The first inertial component includes an inertial device, a flexible substrate, and a processor; the inertial device, the first portion of the flexible substrate, and the processor are stacked and connected in sequence, and the second portion of the flexible substrate, excluding the first portion, is connected to the surface of the base plate facing the packaging space. The first electrode of the inertial device is electrically connected to the first output electrode of the processor, the second electrode of the inertial device is electrically connected to the input electrode of the processor, the second output electrode of the processor is electrically connected to the electrode of the first portion, the electrode of the first portion is electrically connected to the electrode of the second portion, and the electrode of the second portion is electrically connected to the electrode on the surface of the base plate facing the packaging space.

[0032] In this application, the inertial signal generated by the inertial device in the first inertial assembly is output to a processor. After processing the inertial signal, the processor can output the processed inertial signal to the base plate via a flexible substrate. This allows the inertial signal from the first inertial assembly to be smoothly output to the base plate even when the first inertial assembly is mounted at a preset angle. This results in a simple process and low cost. Furthermore, since the first inertial assembly is mounted at a preset angle on the base plate, the bottom of the first inertial assembly is not directly connected to the base plate, which helps reduce various zero-position errors caused by packaging stress.

[0033] Optionally, the surface of the base plate facing the packaging space has a first alignment portion, and the inertial device has a first mounting portion, the first mounting portion matches the shape of the first alignment portion; the first mounting portion is connected to the first alignment portion to mount the first inertial component on the base plate at a preset angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic structural diagram of a MEMS device provided in an embodiment of the present application;

[0035] Figure 2 is a top view of a MEMS device provided in an embodiment of the present application;

[0036] Figure 3 This is a bottom view of a MEMS device provided in an embodiment of the present application;

[0037] Figure 4 is a structural diagram of a first inertial component provided in an embodiment of the present application;

[0038] Figure 5 is a structural diagram of an inertial device provided in an embodiment of the present application;

[0039] Figure 6 is a schematic structural diagram of another inertial device provided in an embodiment of the present application;

[0040] Figure 7 This is a schematic diagram of a preparation process of an inertial device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0042] It should be understood that the “multiple” mentioned in this application refers to two or more. In the description of this application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in this article is merely a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of this application, words such as “first” and “second” are used to distinguish between identical or similar items with basically the same functions and effects. Those skilled in the art can understand that words such as “first” and “second” do not limit the quantity and execution order, and words such as “first” and “second” do not necessarily limit them to be different.

[0043] Before explaining the embodiments of the present application in detail, the application scenarios involved in the embodiments of the present application are first explained.

[0044] A sensor that measures the linear acceleration of an object is called an accelerometer. The acceleration signal is integrated once to obtain a velocity signal, and twice to obtain a displacement signal. By mounting three accelerometers orthogonally on an object, the velocity and displacement of the object in space can be measured during its motion. A sensor that measures the rotational rate of an object is called a gyroscope. The integral of the angular rate signal over time is the angle signal. By mounting three gyroscopes orthogonally on an object, the rotation of the object in space during its motion can be measured. MEMS-based accelerometers and gyroscopes are sensors based on the inertial sensing principle and can be called inertial devices. A sensing system consisting of three accelerometers and three gyroscopes mounted orthogonally can be called an inertial measurement unit.

[0045] Inertial measurement units (IMUs) can be applied to mobile phones, smart homes, the Internet of Things (IoT), driverless cars, drones, intelligent robots, logistics robots, pod stabilization platforms, and more. For example, when used in mobile phones, IMUs can enable features such as lens stabilization, augmented reality (AR), and virtual reality (VR). When used in smart homes (such as sweepers and household robots), IMUs can implement features such as path planning to improve cleaning coverage. When used in navigation, IMUs help stabilize posture, enabling autonomous driving in cars, airplanes, and other applications.

[0046] The full-temperature zero-bias stability of the gyroscope of a high-precision inertial measurement unit is less than 30 deg / h (degrees / hour), and the full-temperature zero-bias stability of the accelerometer is less than 1 mg (milligram). The main difference between a high-precision inertial measurement unit and a low-precision inertial measurement unit is that the low-precision inertial measurement unit is generally a single-chip multi-axis integration, that is, a single chip contains a three-axis accelerometer and a three-axis gyroscope, while the high-precision inertial measurement unit usually adopts a single-axis sensitive inertial structure to ensure the inertial force detection accuracy of each axis. Specifically, through three-axis assembly, three gyroscopes (axial directions are X-axis, Y-axis, and Z-axis) are orthogonally installed, and three accelerometers (axial directions are X-axis, Y-axis, and Z-axis) are orthogonally installed.

[0047] With the rise of autonomous vehicle technology, the demand for high-precision inertial measurement units (IMUs) in in-vehicle navigation is growing. High-precision IMUs, used in conjunction with the Global Positioning System (GPS), offer high short-term accuracy and a high refresh rate, which offsets the GPS's low refresh rate.

[0048] On the one hand, GPS on urban roads is often affected by tall buildings, tunnels, overpasses, and dense forests, making it difficult to locate the vehicle. In these situations, a high-precision inertial measurement unit (IMU) can provide short-term (15 seconds to 1 minute) navigation and positioning through dead reckoning. On the other hand, within a GPS update cycle, the time from receiving the GPS signal to calculating position and velocity requires a certain amount of time, which can cause a deviation between the calculated position and velocity and the real-time position and velocity. A high-precision IMU, with its high short-term accuracy, can compensate for GPS delay errors. Furthermore, a high-precision IMU can compensate for the Doppler shift in the data rate measurement caused by vehicle speed, thereby facilitating rapid acquisition of GPS signals.

[0049] Currently, the main challenges with high-precision inertial measurement units are: 1. Large packaging volume and low integration. 2. High packaging costs, with the accelerometer and gyroscope packaging accounting for 60-80% of the total cost. 3. Large assembly errors, resulting in high costs for subsequent testing, calibration, and compensation.

[0050] To this end, embodiments of the present application provide a MEMS device that enables the installation of an inertial component at a specific angle within a package, thereby enabling the three-dimensional assembly of multiple inertial components within the same package. This results in a compact, low-cost, and high-precision inertial measurement unit.

[0051] Figure 1 This is a structural diagram of a MEMS device provided in an embodiment of the present application. Figure 1 Specifically, it is the main cross-sectional view of the MEMS device. Figure 1 The MEMS device includes: a tube shell 1, a base plate 2 and a first inertial component 3.

[0052] The base plate 2 and the housing 1 form a packaging space 4, within which the first inertial assembly 3 is located. The surface of the base plate 2 facing the packaging space 4 has a first alignment portion 21, and the first inertial assembly 3 has a first mounting portion 31. The first mounting portion 31 matches the shape of the first alignment portion 21 and is connected to the first alignment portion 21 to mount the first inertial assembly 3 on the base plate 2 at a predetermined angle greater than 0 degrees and less than 180 degrees.

[0053] The electrodes of the first inertial assembly 3 can be electrically connected to the electrodes on the surface of the base plate 2 facing the packaging space 4, and the electrodes on the surface of the base plate 2 facing the packaging space 4 can be electrically connected to the pins on the surface of the base plate 2 facing away from the packaging space 4. The surface of the base plate 2 facing the packaging space 4 can generally be referred to as the upper surface of the base plate 2, and the surface of the base plate 2 facing away from the packaging space 4 can generally be referred to as the lower surface of the base plate 2.

[0054] The housing 1 is a component used to encapsulate the inertial component. It can be made of an insulating material. It can be a semi-enclosed structure, containing a chamber. In this embodiment of the present application, the base plate 2 can be connected to the bottom surface of the housing 1, that is, connected to the opening of the chamber of the housing 1. In this case, the base plate 2 can seal the chamber of the housing 1, and the sealed chamber becomes the packaging space 4. In this case, the inertial component, mounted on the surface of the base plate 2 facing the packaging space 4, is located within the packaging space 4.

[0055] For example, the edge of one surface of the base plate 2 can be connected to the edge of the bottom surface of the tube shell 1 (e.g., by adhesive or the like). In this case, the rest of the surface of the base plate 2 except the edge is located within the packaging space 4. The inertial assembly installed on the rest of the surface of the base plate 2 except the edge is also located within the packaging space 4.

[0056] The base plate 2 is a component used to support the inertial component and lead out the electrical signals in the inertial component. The base plate 2 can be made of an insulating material, such as ceramic, a printed circuit board (PCB), etc. The surface of the base plate 2 facing the packaging space 4 has electrodes, and the electrodes on the surface of the base plate 2 facing the packaging space 4 can be electrically connected to the electrodes of the inertial component to transmit the electrical signals in the inertial component to the base plate 2. The surface of the base plate 2 facing away from the packaging space 4 has pins, and the pins on the surface of the base plate 2 facing away from the packaging space 4 are electrically connected to the electrodes on the surface of the base plate 2 facing the packaging space 4 (such as electrically connected through connecting wires, etc.). One or more electrodes on the surface of the base plate 2 facing the packaging space 4 are one-to-one connected to one or more pins on the surface of the base plate 2 facing away from the packaging space 4.

[0057] The pins on the surface of the base plate 2 facing away from the packaging space 4 are the output terminals of the MEMS device. After the electrical signals from each inertial component are output to one or more electrodes on the surface of the base plate 2 facing the packaging space 4, they are output through one or more pins on the surface of the base plate 2 facing away from the packaging space 4 that are connected one-to-one with these one or more electrodes.

[0058] The first inertial component 3 is a sensor based on the inertial sensing principle, such as an accelerometer, a gyroscope, or a combination of an accelerometer and a gyroscope. The first inertial component 3 can be a single-axis inertial component, such as including at least one of a single-axis gyroscope and a single-axis accelerometer; or the first inertial component 3 can be a multi-axis inertial component, such as including at least one of a multi-axis gyroscope and a multi-axis accelerometer; or the first inertial component 3 can include a single-axis gyroscope and a multi-axis accelerometer; or the first inertial component 3 can include a multi-axis gyroscope and a single-axis accelerometer.

[0059] The shape matching between the first mounting portion 31 and the first alignment portion 21 means that the angles of the corners of the first mounting portion 31 are the same as those of the first alignment portion 21, and the corners of the first mounting portion 31 and the corners of the first alignment portion 21 are opposite each other in a concave-convex manner. That is, one of the corners of the first mounting portion 31 and the corners of the first alignment portion 21 is convex and the other is concave. In this way, the corners of the first mounting portion 31 and the corners of the first alignment portion 21 can completely fit together, that is, the first mounting portion 31 can be precisely aligned and connected to the first alignment portion 21.

[0060] The corners of the first mounting portion 31 refer to the edge of the first mounting portion 31 and the portion connected to it. The corners of the first mounting portion 31 are generally composed of two adjacent surfaces of the first mounting portion 31, and the angle of the corners of the first mounting portion 31 is the angle between these two surfaces. The corners of the first alignment portion 21 refer to the edge of the first alignment portion 21 and the portion connected to it. The corners of the first alignment portion 21 are generally composed of two adjacent surfaces of the first alignment portion 21, and the angle of the corners of the first alignment portion 21 is the angle between these two surfaces.

[0061] Alternatively, the corners of the first alignment portion 21 may be convex. For example, a groove may be provided on the surface of the base plate 2 facing the packaging space 4. The groove walls and the portion of the base plate 2 surface adjacent to the groove facing the packaging space 4 may constitute the corners of the first alignment portion 21. In this case, the corners of the first mounting portion 31 may be concave. This allows the corners of the first mounting portion 31 to fully mate with the corners of the first alignment portion 21.

[0062] When the first mounting portion 31 is connected to the first alignment portion 21, the first mounting portion 31 can be adhered to the first alignment portion 21. Of course, the connection between the first mounting portion 31 and the first alignment portion 21 can also be achieved by other means, which is not limited in this embodiment of the present application.

[0063] Mounting the first inertial assembly 3 on the base plate 2 at a preset angle means that, after the first inertial assembly 3 is mounted on the base plate 2, the angle between the stacking surface of the first inertial assembly 3 and the surface of the base plate 2 facing the packaging space 4 is the preset angle. The stacking surface of the first inertial assembly 3 refers to the surface of each layer of the first inertial assembly 3 that is used to stack with adjacent layers.

[0064] The angles of the corners of the first mounting portion 31 and the angles of the corners of the first alignment portion 21 may be the same as or different from the preset angles. In one possible implementation, the angles of the corners of the first mounting portion 31 and the angles of the corners of the first alignment portion 21 are the same as the preset angles. In this implementation, the angles of the corners of the first mounting portion 31 and the angles of the corners of the first alignment portion 21 are the same as the angles of the preset angles. In another possible implementation, the angles of the corners of the first mounting portion 31 and the angles of the corners of the first alignment portion 21 are not necessarily related to the preset angles, that is, no matter how many degrees the angles of the corners of the first mounting portion 31 and the angles of the corners of the first alignment portion 21 are, the first inertia component 3 is installed on the base plate 2 at a fixed preset angle.

[0065] Optionally, the preset angle is 90 degrees, that is, the first inertial assembly 3 is installed at a 90-degree angle on the base plate 2. In other words, after the first inertial assembly 3 is installed on the base plate 2, the angle between the stacking surface of the first inertial assembly 3 and the surface of the base plate 2 facing the packaging space 4 is 90 degrees. In this case, the first inertial assembly 3 is installed vertically on the base plate 2.

[0066] In the embodiment of the present application, after the first mounting portion 31 in the first inertial component 3 is connected to the first alignment portion 21 on the surface of the base plate 2 facing the packaging space 4, the first inertial component 3 is mounted on the base plate 2 at a preset angle. That is, the MEMS device in the embodiment of the present application has its own mounting alignment reference, based on which the first inertial component 3 can be mounted on the base plate 2 at a preset angle. The process is simple and the installation cost is low. In addition, since the first inertial component 3 is mounted on the base plate 2 at a preset angle, the bottom of the first inertial component 3 is not directly connected to the base plate 2, which is conducive to reducing various zero-position errors caused by packaging stress. At the same time, since the flatness and angle accuracy of the first mounting portion 31 and the first alignment portion 21 are both high, it is conducive to reducing assembly errors, thereby reducing the cost of subsequent test calibration compensation.

[0067] Further, see Figure 1 The MEMS device may further include a second inertial component 5, which is located within the packaging space 4. The surface of the base plate 2 facing the packaging space 4 has a second alignment portion (not shown), and the second inertial component 5 has a second mounting portion (not shown). The second alignment portion matches the shape of the second mounting portion, and the second mounting portion is connected to the second alignment portion to enable the second inertial component 5 to be mounted on the base plate 2 at a preset angle.

[0068] The electrodes of the second inertial component 5 are electrically connected to the electrodes on the surface of the base plate 2 facing the packaging space 4 , and the electrodes on the surface of the base plate 2 facing the packaging space 4 are electrically connected to the pins on the surface of the base plate 2 facing away from the packaging space 4 .

[0069] The second inertial component 5 is a sensor based on the inertial sensing principle, such as an accelerometer or a gyroscope, or a combination of an accelerometer and a gyroscope. The second inertial component 5 can be a single-axis inertial component, such as including at least one of a single-axis gyroscope and a single-axis accelerometer; or a multi-axis inertial component, such as including at least one of a multi-axis gyroscope and a multi-axis accelerometer; or the second inertial component 5 can include a single-axis gyroscope and a multi-axis accelerometer; or the second inertial component 5 can include a multi-axis gyroscope and a single-axis accelerometer.

[0070] The axial direction of the second inertial assembly 5 is different from that of the first inertial assembly 3. For example, the axial direction of the first inertial assembly 3 can be the horizontal X-axis, and the axial direction of the second inertial assembly 5 can be the horizontal Y-axis. The second inertial assembly 5 has a similar structure to the first inertial assembly 3 and is similarly mounted on the base plate 2, but the two have different axial directions. In this way, the second inertial assembly 5 and the first inertial assembly 3 can perform inertial force detection along different axial directions.

[0071] The axial direction of the first inertial component 3 is the inertial force detection direction of the first inertial component 3. For example, the axial direction of the first inertial component 3 can be Figure 1 The axial direction of the second inertial component 5 is the inertial force detection direction of the second inertial component 5, such as the axial direction of the second inertial component 5 can be Figure 1 The b-axis is shown in .

[0072] The shape matching between the second mounting portion and the second alignment portion means that the angles of the corners of the second mounting portion are the same as those of the second alignment portion, and the corners of the second mounting portion and the corners of the second alignment portion are opposite each other in a concave-convex manner, that is, one of the corners of the second mounting portion and the corners of the second alignment portion is convex and the other is concave. In this way, the corners of the second mounting portion and the corners of the second alignment portion can completely fit together, that is, the second mounting portion can be precisely aligned and connected to the second alignment portion.

[0073] The corner portion of the second mounting portion refers to the edge of the second mounting portion and the portion connected to the edge. The corner portion of the second mounting portion is generally composed of two adjacent surfaces of the second mounting portion, and the angle of the corner portion of the second mounting portion is the angle between these two surfaces. The corner portion of the second alignment portion refers to the edge of the second alignment portion and the portion connected to the edge. The corner portion of the second alignment portion is generally composed of two adjacent surfaces of the second alignment portion, and the angle of the corner portion of the second alignment portion is the angle between these two surfaces.

[0074] Alternatively, the corners of the second alignment portion can be convex. For example, a groove can be provided on the surface of the base plate 2 facing the packaging space 4. The groove wall and the portion of the base plate 2 surface facing the packaging space 4 adjacent to the groove can constitute the corners of the second alignment portion. In this case, the corners of the second mounting portion can be concave. This ensures that the corners of the second mounting portion and the second alignment portion can be fully aligned.

[0075] When the second mounting portion is connected to the second alignment portion, the second mounting portion can be attached to the second alignment portion. Of course, the connection between the second mounting portion and the second alignment portion can also be achieved by other means, which is not limited in this embodiment of the present application.

[0076] Mounting the second inertial assembly 5 on the base plate 2 at a preset angle means that, after the second inertial assembly 5 is mounted on the base plate 2, the angle between the stacking surface of the second inertial assembly 5 and the surface of the base plate 2 facing the packaging space 4 is the preset angle. The stacking surface of the second inertial assembly 5 refers to the surface of each layer of the second inertial assembly 5 that is used to stack with adjacent layers.

[0077] The angles of the corners of the second mounting portion and the angles of the corners of the second alignment portion may be the same as or different from the preset angles. In one possible implementation, the angles of the corners of the second mounting portion and the angles of the corners of the second alignment portion are the same as the preset angles. In this implementation, the angles of the corners of the second mounting portion and the angles of the corners of the second alignment portion are the same as the angles of the corners of the second mounting portion and the angles of the corners of the second alignment portion. In another possible implementation, the angles of the corners of the second mounting portion and the angles of the corners of the second alignment portion are not necessarily related to the preset angles, that is, no matter how many degrees the angles of the corners of the second mounting portion and the angles of the corners of the second alignment portion are, the second inertia component 5 is installed on the base plate 2 at a fixed preset angle.

[0078] Optionally, the preset angle is 90 degrees, that is, the second inertial assembly 5 is installed at a 90-degree angle on the base plate 2. In other words, after the second inertial assembly 5 is installed on the base plate 2, the angle between the stacking surface of the second inertial assembly 5 and the surface of the base plate 2 facing the packaging space 4 is 90 degrees. In this case, the second inertial assembly 5 is installed vertically on the base plate 2.

[0079] In this embodiment of the present application, after the second mounting portion of the second inertial assembly 5 is connected to the second alignment portion on the surface of the base plate 2 facing the packaging space 4, the second inertial assembly 5 is mounted on the base plate 2 at a preset angle. In other words, the MEMS device in this embodiment of the present application has a built-in mounting alignment reference, which allows the second inertial assembly 5 to be mounted on the base plate 2 at a preset angle. This simplifies the process and reduces installation costs. Furthermore, since the second inertial assembly 5 is mounted on the base plate 2 at a preset angle, the bottom of the second inertial assembly 5 is not directly connected to the base plate 2, which helps reduce various zero-position errors caused by packaging stress. Furthermore, the high flatness and angular accuracy of the second mounting portion and the second alignment portion help reduce assembly errors, thereby reducing the cost of subsequent testing, calibration, and compensation. Furthermore, since both the first inertial assembly 3 and the second inertial assembly 5 are encapsulated in the package 1, the number of packaging packages is reduced, significantly reducing packaging costs, reducing the package volume, and improving integration.

[0080] Further, see Figure 1 The MEMS device may further include a third inertial component 6 located in the packaging space 4. The third inertial component 6 is mounted on the base plate 2, and a stacking surface of the third inertial component 6 is parallel to a surface of the base plate 2 facing the packaging space 4.

[0081] The electrodes of the third inertial component 6 are electrically connected to the electrodes on the surface of the base plate 2 facing the packaging space 4 , and the electrodes on the surface of the base plate 2 facing the packaging space 4 are electrically connected to the pins on the surface of the base plate 2 facing away from the packaging space 4 .

[0082] The third inertial component 6 is a sensor based on the inertial sensing principle, such as an accelerometer, a gyroscope, or a combination of an accelerometer and a gyroscope. The third inertial component 6 can be a single-axis inertial component, such as including at least one of a single-axis gyroscope and a single-axis accelerometer; or a multi-axis inertial component, such as including at least one of a multi-axis gyroscope and a multi-axis accelerometer; or the third inertial component 6 can include a single-axis gyroscope and a multi-axis accelerometer; or the third inertial component 6 can include a multi-axis gyroscope and a single-axis accelerometer.

[0083] The third inertial assembly 6 is mounted on the base plate 2, and the stacking surface of the third inertial assembly 6 is parallel to the surface of the base plate 2 facing the packaging space 4, which means that the third inertial assembly 6 is mounted horizontally on the base plate 2. In this case, the bottom of the third inertial assembly 6 is connected to the surface of the base plate 2 facing the packaging space 4.

[0084] The axial direction of the third inertial component 6 can be different from the axial direction of the second inertial component 5 and the axial direction of the first inertial component 3. In this way, the third inertial component 6, the second inertial component 5 and the first inertial component 3 can complete the inertial force detection in different axial directions. The axial direction of the third inertial component 6 is the inertial force detection direction of the third inertial component 6. For example, the axial direction of the third inertial component 6 can be Figure 1 The c-axis is shown in FIG.

[0085] In one possible scenario, the third inertial assembly 6, the second inertial assembly 5, and the first inertial assembly 3 can all be single-axis inertial assemblies. For example, the axial direction of the third inertial assembly 6 can be the vertical Z-axis, the axial direction of the second inertial assembly 5 can be the horizontal Y-axis, and the axial direction of the first inertial assembly 3 can be the horizontal X-axis. This can improve the accuracy of the MEMS device.

[0086] In another possible scenario, the third inertial assembly 6 can be a multi-axis inertial assembly, and the first inertial assembly 3 can be a single-axis inertial assembly. For example, the axial directions of the third inertial assembly 6 can be the horizontal Y-axis and the vertical Z-axis, while the axial direction of the first inertial assembly 3 can be the horizontal X-axis. This can reduce the packaging volume.

[0087] Further, see Figure 2 The top view of the MEMS device shown in FIG. 4 further includes a fourth inertial component 7 located in the packaging space 4. The fourth inertial component 7 is mounted on the base plate 2, and the stacking surface of the fourth inertial component 7 is parallel to the surface of the base plate 2 facing the packaging space 4.

[0088] The electrode of the fourth inertial component 7 is electrically connected to the electrode on the surface of the base plate 2 facing the packaging space 4, and the fourth electrode on the surface of the base plate 2 facing the packaging space 4 is electrically connected to the pin on the surface of the base plate 2 away from the packaging space 4.

[0089] The fourth inertial assembly 7 is mounted on the base plate 2, and the stacking surface of the fourth inertial assembly 7 is parallel to the surface of the base plate 2 facing the packaging space 4. This means that the fourth inertial assembly 7 is mounted horizontally on the base plate 2. In this case, the bottom of the fourth inertial assembly 7 is connected to the surface of the base plate 2 facing the packaging space 4. The fourth inertial assembly 7 is a sensor based on the inertial sensing principle, such as a three-axis inertial assembly.

[0090] Among them, see Figure 3 In the bottom view of the MEMS device shown in FIG. 4 , the electrical signal of each inertial component in the packaging space 4 is led out through one or more pins on the surface of the bottom plate 2 away from the packaging space 4. The surface of the bottom plate 2 away from the packaging space 4 may be formed with a Figure 3 The pin array shown may be a ball grid array (BGA) or the like.

[0091] In one possible scenario, the axial direction of the first inertial component 3 can be the horizontal X-axis. The axial direction of the second inertial component 5 can be the horizontal Y-axis. The axial direction of the third inertial component 6 can be the vertical Z-axis. The axial directions of the fourth inertial component 7 can be the horizontal X-axis, the horizontal Y-axis, and the vertical Z-axis. In this case, the first inertial component 3, the second inertial component 5, and the second inertial component 5 can all be gyroscopes, and the fourth inertial component 7 can be an accelerometer; alternatively, the first inertial component 3, the second inertial component 5, and the second inertial component 5 can all be accelerometers, and the fourth inertial component 7 can be a gyroscope. In this case, the MEMS device can be called an inertial measurement unit.

[0092] In the embodiment of the present application, SIP is used to assemble multiple inertial components in three dimensions within the same packaging space 4, thereby improving the integration and reducing the dimensions of the MEMS device in the three directions of the X-axis, Y-axis, and Z-axis. Based on the precise installation and alignment technology, the embodiment of the present application reduces the existing multiple packaging shells to only one packaging shell, thereby suppressing the cost and volume while ensuring accuracy. In addition, the precise installation and alignment technology based on the base plate 2 is conducive to reducing the installation error during multi-axis assembly, and then reducing the cross-axis coupling error of the MEMS device, thereby reducing the difficulty and cost of subsequent test calibration compensation, and improving the performance consistency of the MEMS device. In this way, a small-volume, low-cost, high-precision MEMS device can be obtained.

[0093] The MEMS device provided in the embodiments of the present application has high precision and can be used as an on-board inertial measurement unit to measure the linear motion and rotation of a vehicle while driving. The accuracy of the on-board inertial measurement unit directly determines the vehicle's positioning accuracy when there is no GPS signal or the GPS signal is weak. The packaging cost and test calibration compensation cost of the inertial measurement unit provided in the embodiments of the present application are both low, and its cost is about 1 / 10 of that of existing inertial measurement units of the same precision.

[0094] The specific structure of the first inertial component 3 is explained below:

[0095] See also Figure 1The first inertial assembly 3 includes an inertial device 32, a flexible substrate 33, and a processor 34. The inertial device 32, the first portion 331 of the flexible substrate 33, and the processor 34 are stacked and connected in sequence. The inertial device 32 has a first mounting portion 31. The second portion 332 of the flexible substrate 33, excluding the first portion 331, is connected to the surface of the base plate 2 facing the packaging space 4. The first electrode of the inertial device 32 is electrically connected to the first output electrode of the processor 34, the second electrode of the inertial device 32 is electrically connected to the input electrode of the processor 34, the second output electrode of the processor 34 is electrically connected to the electrode of the first portion 331 of the flexible substrate 33, the electrode of the first portion 331 of the flexible substrate 33 is electrically connected to the electrode of the second portion 332 of the flexible substrate 33, and the electrode of the second portion 332 of the flexible substrate 33 is electrically connected to the electrode of the surface of the base plate 2 facing the packaging space 4.

[0096] The inertial device 32 is a component based on the inertial sensing principle and can output inertial signals (such as acceleration and angular rate signals). When the inertial device 32 outputs an acceleration signal, the first inertial component 3 is an accelerometer; when the inertial device 32 outputs an angular rate signal, the first inertial component 3 is a gyroscope. When the inertial device 32 outputs both acceleration and angular rate signals, the first inertial component 3 is a combination of an accelerometer and a gyroscope.

[0097] The flexible substrate 33 is bendable, forming a first portion 331 and a second portion 332. The first portion 331 and the second portion 332 of the flexible substrate 333 are not coplanar, forming a predetermined angle between them. This angle can be equal to or close to a predetermined angle. Thus, the first portion 331 of the flexible substrate 33 is stacked and connected to the inertial device 32 and the processor 34, while the second portion 332 of the flexible substrate 333 is independent of the first portion 331 of the flexible substrate 33 and is connected to the surface of the base plate 2 facing the packaging space 4.

[0098] The processor 34 may be a microprocessor (including a central processing unit (CPU), etc.), an application-specific integrated circuit (ASIC), etc. The processor 34 is used to input an excitation signal to the inertial device 32 and process the inertial signal output by the inertial device 32. Under the action of the excitation signal, the inertial device 32 can detect inertial force and obtain an inertial signal, which may include an acceleration signal and / or an angular rate signal. The processor 34 can process the acceleration signal to obtain a velocity signal and a displacement signal, and process the angular rate signal to obtain an angle signal.

[0099] In this case, the processor 34 outputs an excitation signal to the first electrode of the inertial component 32 via its first output electrode. Under the action of the excitation signal, the inertial component 32 detects inertial force, generates an inertial signal, and outputs the inertial signal to the input electrode of the processor 34 via its second electrode. The processor 34 processes the inertial signal and outputs it to the flexible substrate 33 via its second output electrode. The signal is then output to the base plate 2 via the flexible substrate 33. This allows the inertial signal from the first inertial component 3 to be smoothly transmitted to the base plate 2 even when the first inertial component 3 is mounted on the base plate 2 at a predetermined angle. This simplifies the process and reduces costs.

[0100] When the inertial device 32 is stacked and connected with the first portion 331 of the flexible substrate 33, the first portion 331 of the flexible substrate 33 can be attached to the inertial device 32. When the first portion 331 of the flexible substrate 33 is stacked and connected with the processor 34, the processor 34 can be attached to the first portion 331 of the flexible substrate 33. Of course, the sequential stacking and connection of the inertial device 32, the first portion 331 of the flexible substrate 33, and the processor 34 can also be achieved through other methods, and this embodiment of the present application is not limited thereto.

[0101] When the second portion 332 of the flexible substrate 33, excluding the first portion 331, is connected to the surface of the base plate 2 facing the packaging space 4, the second portion 332 of the flexible substrate 33 can be adhered to the surface of the base plate 2 facing the packaging space 4. Of course, the connection between the second portion 332 of the flexible substrate 33 and the surface of the base plate 2 facing the packaging space 4 can also be achieved by other methods, which are not limited in this embodiment of the present application.

[0102] One possible way is Figure 4As shown, a gold wire bonding process can be used to form first and second electrodes on the inertial device 32, electrodes on the first portion 331 of the flexible substrate 33, and electrodes on the second portion 332 of the flexible substrate 33. The electrodes on the first portion 331 and second portion 332 of the flexible substrate 33 are electrically connected. Furthermore, an input electrode, a first output electrode, and a second output electrode are formed on the processor 34. Subsequently, the first portion 331 of the flexible substrate 33 is attached to the inertial device 32, and the processor 34 is attached to the first portion 331 of the flexible substrate 33. Then, a wire bonding process is used to electrically connect the first electrode of the inertial device 32 to the first output electrode of the processor 34, the second electrode of the inertial device 32 to the input electrode of the processor 34, and the second output electrode of the processor 34 to the electrode on the first portion 331 of the flexible substrate 33. Next, the first mounting portion 31 of the inertial device 32 is attached to the first alignment portion 21 on the surface of the base plate 2 facing the packaging space 4, and the second portion 332 of the flexible substrate 33 is attached to the surface of the base plate 2 facing the packaging space 4. Finally, a wire bonding process is used to electrically connect the electrodes of the second portion 332 of the flexible substrate 33 to the electrodes on the surface of the base plate 2 facing the packaging space 4.

[0103] The inertial device 32 can be obtained by wafer-level packaging (WLP). The structure of the inertial device 32 is explained below:

[0104] See also Figure 5 The left figure in the figure shows a top view of the inertial device 32, and the right figure shows a left view of the inertial device 32. The inertial device 32 includes a substrate layer 321, a first insulating layer 322, an inertial structure layer 323, a second insulating layer 324, and a cover layer 325. The substrate layer 321, the first insulating layer 322, the inertial structure layer 323, the second insulating layer 324, and the cover layer 325 are stacked and connected in sequence. The input signal of the inertial structure layer 323 is introduced through the first electrode of the first insulating layer 322, and the output signal of the inertial structure layer 323 is extracted from the second electrode of the first insulating layer 322. The first electrode of the first insulating layer 322 is electrically connected to the first output electrode of the processor 34, and the second electrode of the first insulating layer 322 is electrically connected to the input electrode of the processor 34.

[0105] The substrate layer 321 is used to support the inertial device 32. The material of the substrate layer 321 can be silicon, quartz, silicon-on-insulator (SOI), silicon carbide (SiC), etc. The materials of the first insulating layer 322 and the second insulating layer 324 can be silicon nitride, silicon dioxide, or other insulating materials.

[0106] The inertial structure layer 323 is used to generate an inertial signal. It can be an accelerometer structure layer for generating an acceleration signal, a gyroscope structure layer for generating an angular rate signal, or a combination of the two. The input signal of the inertial structure layer 323 is the excitation signal output by the processor 34 from the first output electrode of the processor 34. The output signal of the inertial structure layer 323 is the inertial signal obtained by the inertial structure layer 323 through inertial force detection under the action of the excitation signal.

[0107] The area of ​​the first insulating layer 322 is larger than that of the inertial structure layer 323. The first insulating layer 322 includes a first edge region 3221 and a second edge region 3222. The remaining regions of the first insulating layer 322, excluding the first edge region 3221 and the second edge region 3222, are stacked and connected to the inertial structure layer 323. The first electrode and the second electrode of the first insulating layer 322 are both located in the first edge region 3221.

[0108] The surface of the second edge region 3222 near the inertial structure layer 323 and the side surfaces of the inertial structure layer 323 near the second edge region 3222 constitute the corner portion of the first mounting portion 31. In other words, the second edge region 3222 has two surfaces that oppose each other vertically and a plurality of side surfaces adjacent to these two surfaces. The inertial structure layer 323 has two stacking surfaces that oppose each other vertically and a plurality of side surfaces adjacent to these two stacking surfaces. Of the two surfaces of the second edge region 3222, one surface that is near the inertial structure layer 323 and of the multiple side surfaces of the inertial structure layer 323, one side surface that is near the second edge region 3222 constitute the corner portion of the first mounting portion 31.

[0109] The structure of the second inertial component 5 is similar to that of the first inertial component 3 , and will not be further described in the embodiment of the present application.

[0110] The structure of the third inertial component 6 is explained below:

[0111] See also Figure 1 The third inertial component 6 includes an inertial device 61 and a processor 62; the inertial device 61 and the processor 62 are stacked and connected, the first electrode of the inertial device 61 is electrically connected to the first output electrode of the processor 62, the second electrode of the inertial device 61 is electrically connected to the input electrode of the processor 62, and the second output electrode of the processor 62 is electrically connected to the electrode on the surface of the base plate 2 facing the packaging space 4.

[0112] Inertial device 61 is a component based on the inertial sensing principle and can output inertial signals (such as acceleration and angular rate signals). When inertial device 61 outputs an acceleration signal, third inertial component 6 is an accelerometer; when inertial device 61 outputs an angular rate signal, third inertial component 6 is a gyroscope. When inertial device 61 outputs both acceleration and angular rate signals, third inertial component 6 is a combination of an accelerometer and a gyroscope.

[0113] The processor 62 can be a microprocessor (including a CPU, etc.), an ASIC, etc. The processor 62 is used to input an excitation signal to the inertial device 61 and process the inertial signal output by the inertial device 61. Under the action of the excitation signal, the inertial device 61 can detect inertial force and generate an inertial signal, which can include an acceleration signal and / or an angular rate signal. The processor 62 can process the acceleration signal to generate a velocity signal and a displacement signal, and process the angular rate signal to generate an angle signal.

[0114] In this case, the processor 62 outputs an excitation signal to the first electrode of the inertial device 61 via its first output electrode. Under the action of the excitation signal, the inertial device 61 can detect inertial force, obtain an inertial signal, and output the inertial signal to the input electrode of the processor 62 via its second electrode. The processor 62 processes the inertial signal and outputs the processed inertial signal to the base plate 2 via its second output electrode.

[0115] When the inertial device 61 and the processor 62 are stacked, the processor 62 can be attached to the inertial device 61. Of course, the stacking connection of the inertial device 61 and the processor 62 can also be achieved in other ways, which is not limited in the embodiment of the present application.

[0116] The inertial device 61 in the third inertial assembly 6 can be obtained by WLP. The structure of the inertial device 61 is explained below:

[0117] See also Figure 6 The left figure shows an attached view of the inertial device 61, and the right figure shows a left view of the inertial device 61. The inertial device 61 includes a substrate layer 611, a first insulating layer 612, an inertial structure layer 613, a second insulating layer 614, and a cover layer 615. The substrate layer 611, the first insulating layer 612, the inertial structure layer 613, the second insulating layer 614, and the cover layer 615 are stacked and connected in sequence. The input signal of the inertial structure layer 613 is introduced from the first electrode of the first insulating layer 612, and the output signal of the inertial structure layer 613 is drawn out from the second electrode of the first insulating layer 612. The first electrode of the first insulating layer 612 is electrically connected to the first output electrode of the processor 62, and the second electrode of the first insulating layer 612 is electrically connected to the input electrode of the processor 62.

[0118] The substrate layer 611 is used to support the inertial device 61. The material of the substrate layer 611 can be silicon, quartz, SOI, SiC, etc. The material of the first insulating layer 612 and the second insulating layer 614 can be silicon nitride, silicon dioxide or other insulating materials.

[0119] The inertial structure layer 613 is used to generate an inertial signal. It can be an accelerometer structure layer for generating an acceleration signal, a gyroscope structure layer for generating an angular rate signal, or a combination of the two. The input signal of the inertial structure layer 613 is the excitation signal output by the processor 62 from the first output electrode of the processor 62. The output signal of the inertial structure layer 613 is the inertial signal obtained by the inertial structure layer 613 through inertial force detection under the action of the excitation signal.

[0120] The area of ​​the first insulating layer 612 is larger than that of the inertial structure layer 613. The first insulating layer 612 includes a first edge region 6121. The remaining regions of the first insulating layer 612, excluding the first edge region 6121, are stacked and connected to the inertial structure layer 613. The first electrode and the second electrode of the first insulating layer 612 are both located in the first edge region 6121.

[0121] The structure of the third inertial assembly 6 is similar to that of the fourth inertial assembly 7 , and will not be further described in the embodiment of the present application.

[0122] Further, see Figure 1 The MEMS device further includes a passive device 8 , which is located inside the base plate 2 and electrically connected between the electrode on the surface of the base plate 2 facing the packaging space 4 and the pin on the surface of the base plate 2 facing away from the packaging space 4 .

[0123] Passive components 8 are used to process electrical signals input from electrodes on the surface of base plate 2 facing packaging space 4, or to support the operation of the inertial component. Passive components 8 may include capacitors, resistors, inductors, crystal oscillators, etc., and can be used to boost the voltage of electrical signals, filter power ripple, and increase the operating voltage of the inertial component.

[0124] Further, see Figure 1 The MEMS device further includes an active device 9, which is located on the surface of the base plate 2 facing the packaging space 4 and is electrically connected between the electrode on the surface of the base plate 2 facing the packaging space 4 and the pin on the surface of the base plate 2 facing away from the packaging space 4. For example, the active device 9 can be electrically connected between the passive device 8 and the pin on the surface of the base plate 2 facing away from the packaging space 4.

[0125] Active devices 9 are used to process electrical signals input from electrodes on the surface of base plate 2 facing packaging space 4, or to support the operation of the inertial component. Active devices 9 may include a microcontroller unit (MCU), voltage regulators, voltage converters, serial port devices, power management devices, etc., and are used to process and calculate the electrical signals output by the inertial component in real time and output them to external systems to provide speed information, attitude information, etc.

[0126] In the embodiment of the present application, passive components 8 and surface-mounted active components 9 can be embedded in the base plate 2, so that more components can be integrated in the limited packaging space 4, more functions can be realized, and the integration level can be further improved.

[0127] The following describes the preparation process of the inertial device in the embodiment of the present application:

[0128] Figure 7 This is a schematic diagram of the manufacturing process of an inertial device provided in an embodiment of the present application. Conventional inertial devices (i.e., the inertial device 61 in the third and fourth inertial assemblies 6 and 7) and inertial devices with a vertical alignment reference (i.e., the inertial device 32 in the first and second inertial assemblies 3 and 5) can be manufactured simultaneously. The manufacturing process of these two inertial devices is as follows:

[0129] A first insulating layer is formed on the substrate layer, and two inertial structure layers are formed on the first insulating layer, with a gap between the two inertial structure layers filled with a sacrificial layer. A second insulating layer is formed on the two inertial structure layers and the sacrificial layer, and a cover layer is formed on the second insulating layer. The sacrificial layer is then removed.

[0130] The cover layer 325 is diced along the plane of the side wall of the first inertial structure layer located in the gap, and the cutting length is less than the thickness of the cover layer 325, that is, the cover layer 325 is not cut through, and a cut 1 is formed.

[0131] The cover layer 325 and the second insulating layer 324 are diced and cut along the plane of the side wall of the second inertial structure layer 323 located in the gap, and cut into the gap to form a cut 2.

[0132] The substrate layer 321 and the first insulating layer 322 are diced and cut along the plane of the sidewall of the first inertial structure layer 323 located in the gap, and the cut is cut into the gap to form a cut 3.

[0133] This results in two separate parts, one on the left and one on the right. The left part is the inertial device 32 with a vertical alignment reference. For the right part, the cover layer 325 and the second insulating layer 324 are diced and cut along cut 1 until they are within this gap. The remaining material, including the cover layer 325 and the second insulating layer 324, is discarded, and the remaining part is the conventional inertial device 61.

[0134] In the embodiment of the present application, the inertial device 32 with a vertical alignment reference is manufactured by scribing. Since the flatness and verticality of the cut surface are both high, assembly errors and cross-axis coupling errors are reduced, thereby potentially enabling light calibration compensation or calibration-free compensation for high-precision MEMS devices, thereby reducing the cost of MEMS devices.

[0135] Figure 1 This is a structural diagram of a MEMS device provided in an embodiment of the present application. Figure 1 Specifically, it is the main cross-sectional view of the MEMS device. Figure 1 The MEMS device includes: a tube shell 1, a base plate 2 and a first inertial component 3.

[0136] The base plate 2 and the tube shell 1 form a packaging space 4, and the first inertia component 3 is located in the packaging space 4; the first inertia component 3 is installed on the base plate 2 at a preset angle, which is greater than 0 degrees and less than 180 degrees.

[0137] The first inertial assembly 3 includes an inertial device 32, a flexible substrate 33, and a processor 34. The inertial device 32, the first portion 331 of the flexible substrate 33, and the processor 34 are stacked and connected in sequence. The second portion 332 of the flexible substrate 33, excluding the first portion 331, is connected to the surface of the base plate 2 facing the packaging space 4. A first electrode of the inertial device 32 is electrically connected to a first output electrode of the processor 34, a second electrode of the inertial device 32 is electrically connected to an input electrode of the processor 34, a second output electrode of the processor 34 is electrically connected to an electrode of the first portion 331 of the flexible substrate 33, an electrode of the first portion 331 of the flexible substrate 33 is electrically connected to an electrode of the second portion 332 of the flexible substrate 33, and an electrode of the second portion 332 of the flexible substrate 33 is electrically connected to an electrode of the surface of the base plate 2 facing the packaging space 4.

[0138] In this embodiment of the present application, the inertial signal generated by the inertial device 32 in the first inertial assembly 3 is output to a processor 34. After processing the inertial signal, the processor 34 can output the processed inertial signal to the base plate 2 via the flexible substrate 33. This allows the inertial signal from the first inertial assembly 3 to be smoothly output to the base plate 2 even when the first inertial assembly 3 is mounted on the base plate 2 at a preset angle. This simplifies the process and reduces costs. Furthermore, since the first inertial assembly 3 is mounted on the base plate 2 at a preset angle, the bottom of the first inertial assembly 3 is not directly connected to the base plate 2, which helps reduce various zero-position errors caused by packaging stress.

[0139] Optionally, the surface of the base plate 2 facing the packaging space 4 has a first alignment portion 21, and the inertial device 32 has a first mounting portion 31, and the first mounting portion 31 matches the shape of the first alignment portion 21; the first mounting portion 31 is connected to the first alignment portion 21 to mount the first inertial component 3 on the base plate 2 at a preset angle.

[0140] For the relevant explanations of the various components in the MEMS device, please refer to the above embodiments, which will not be described in detail in the embodiments of the present application.

[0141] The above description is an embodiment provided for this application and is not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application should be included in the scope of protection of this application.

Claims

1. A micro-electromechanical system (MEMS) device, characterized in that: The MEMS device includes: a tube shell, a base plate and a first inertial component; The bottom plate and the tube shell form a packaging space, and the first inertia component is located in the packaging space; The bottom plate has a first alignment portion on a surface facing the packaging space, and the first inertial component has a first mounting portion, the first mounting portion matching the shape of the first alignment portion; the first mounting portion is connected to the first alignment portion to mount the first inertial component on the bottom plate at a preset angle, wherein the preset angle is greater than 0 degrees and less than 180 degrees; The first inertial assembly includes an inertial device, a flexible substrate, and a processor. The inertial device, the first portion of the flexible substrate, and the processor are stacked and connected in sequence. The inertial device has the first mounting portion. The second portion of the flexible substrate, excluding the first portion, is connected to a surface of the bottom plate facing the packaging space. The first electrode of the inertial device is electrically connected to the first output electrode of the processor, the second electrode of the inertial device is electrically connected to the input electrode of the processor, the second output electrode of the processor is electrically connected to the electrode of the first part, the electrode of the first part is electrically connected to the electrode of the second part, and the electrode of the second part is electrically connected to the electrode on the surface of the base plate facing the packaging space.

2. The MEMS device according to claim 1, wherein: The preset angle is 90 degrees.

3. The MEMS device according to claim 1, wherein: An angle of a corner portion of the first alignment portion and an angle of a corner portion of the first mounting portion are both the same as the preset angle.

4. The MEMS device according to claim 1, wherein: The inertial device includes a substrate layer, a first insulating layer, an inertial structure layer, a second insulating layer and a cover layer; The substrate layer, the first insulating layer, the inertial structure layer, the second insulating layer and the cover layer are stacked and connected in sequence, the input signal of the inertial structure layer is introduced from the first electrode of the first insulating layer, the output signal of the inertial structure layer is drawn out from the second electrode of the first insulating layer, the first electrode of the first insulating layer is electrically connected to the first output electrode of the processor, and the second electrode of the first insulating layer is electrically connected to the input electrode of the processor.

5. The MEMS device according to claim 4, wherein: The area of ​​the first insulating layer is larger than that of the inertial structure layer, the first insulating layer includes a first edge region and a second edge region, and other regions of the first insulating layer except the first edge region and the second edge region are stacked and connected with the inertial structure layer; The first electrode and the second electrode of the first insulating layer are both located in the first edge region; the surface of the second edge region close to the inertial structure layer and the side surface of the inertial structure layer close to the second edge region constitute the corner portion of the first mounting portion.

6. The MEMS device according to claim 1, wherein: The MEMS device further includes a second inertial component, wherein the second inertial component is located in the packaging space; The bottom plate has a second alignment portion on a surface facing the packaging space, and the second inertial component has a second mounting portion, the second alignment portion matching the shape of the second mounting portion; the second mounting portion is connected to the second alignment portion to mount the second inertial component on the bottom plate at the preset angle; An axial direction of the first inertial assembly is different from an axial direction of the second inertial assembly.

7. The MEMS device according to claim 1, wherein: The MEMS device further includes a third inertial component located in the packaging space and mounted on the base plate, with a stacking surface of the third inertial component being parallel to a surface of the base plate facing the packaging space.

8. The MEMS device according to claim 1, wherein: The first inertial component is a single-axis inertial component or a multi-axis inertial component.

9. The MEMS device according to claim 8, wherein: The first inertial component includes at least one of a gyroscope and an accelerometer.

10. The MEMS device according to claim 1, wherein: The MEMS device further includes a passive component located inside the base plate and electrically connected between an electrode on a surface of the base plate facing the packaging space and a pin on a surface of the base plate facing away from the packaging space.

11. The MEMS device according to any one of claims 1 to 10, wherein: The MEMS device further includes an active device located on a surface of the base plate facing the packaging space and electrically connected between an electrode on the surface of the base plate facing the packaging space and a pin on a surface of the base plate facing away from the packaging space.

12. A micro-electromechanical system (MEMS) device, characterized in that: The MEMS device includes: a tube shell, a base plate and a first inertial component; The base plate and the tube shell form a packaging space, and the first inertia component is located in the packaging space; the first inertia component is mounted on the base plate at a preset angle, and the preset angle is greater than 0 degrees and less than 180 degrees; The first inertial assembly includes an inertial device, a flexible substrate, and a processor; the inertial device, the first portion of the flexible substrate, and the processor are stacked and connected in sequence, and the second portion of the flexible substrate other than the first portion is connected to the surface of the bottom plate facing the packaging space; The first electrode of the inertial device is electrically connected to the first output electrode of the processor, the second electrode of the inertial device is electrically connected to the input electrode of the processor, the second output electrode of the processor is electrically connected to the electrode of the first part, the electrode of the first part is electrically connected to the electrode of the second part, and the electrode of the second part is electrically connected to the electrode on the surface of the base plate facing the packaging space.

13. The MEMS device according to claim 12, wherein: The surface of the base plate facing the packaging space has a first alignment portion, and the inertial device has a first mounting portion, the first mounting portion matches the shape of the first alignment portion; the first mounting portion is connected to the first alignment portion to mount the first inertial component on the base plate at the preset angle.

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