Deformation simulation method for electronic devices subjected to multiple destructive tests

Abstract

The present invention discloses a method for simulating deformation of an electronic device after multiple destructive tests, comprising the following steps: first, establishing N finite element models, and the i-th finite element model is used to perform finite element analysis of the electronic device after the i-th destructive test, so as to obtain a numerical solution of the electronic device after the i-th destructive test, N is an integer greater than 1, and i is an integer from 1 to N; then, starting from i being 1, extracting the numerical solution obtained by the i-th finite element model as readable data of the i+1-th finite element model, and allowing the i+1-th finite element model to perform finite element analysis of the electronic device after the i+1-th destructive test according to the readable data, until the N-th finite element model completes the finite element analysis of the electronic device after the N-th destructive test. Therefore, the deformation or damage of at least one part of the electronic device due to strain / stress accumulation can be effectively measured.

Description

[Technical field]

[0001] The invention relates to a deformation simulation method, in particular to a deformation simulation method for an electronic device subjected to multiple destructive tests. [Background technology]

[0002] During the product inspection process, electronic devices may need to undergo multiple destructive tests. For example, electronic devices are dropped multiple times in different directions, and as the number of impacts accumulates, the degree of damage to the parts on the electronic device increases. Currently, Computer Aided Engineering (CAE) performs dynamic simulations based on the scenario of an electronic device being subjected to a single destructive test. Although this method can effectively predict the deformation or damage of parts, it does not take into account the effect of strain / stress accumulation, so the deformation or damage of some parts caused by strain / stress accumulation will not be easy to measure. In addition, strain / stress accumulation is an important topic in this field not only in dynamic simulation, but also in static simulation. [Summary of the invention]

[0003] In order to solve the above technical problems, one embodiment of the present invention discloses a deformation simulation method for an electronic device after multiple destructive tests, comprising the following steps: first, N finite element models are established, and the i-th finite element model is used to perform finite element analysis of the electronic device after the i-th destructive test to obtain a numerical solution of the electronic device after the i-th destructive test, N is an integer greater than 1, and i is an integer from 1 to N; then, starting from i being 1, the numerical solution obtained by the i-th finite element model is extracted as readable data of the i+1-th finite element model, and the i+1-th finite element model is allowed to perform finite element analysis of the electronic device after the i+1-th destructive test based on the readable data, until the N-th finite element model completes the finite element analysis of the electronic device after the N-th destructive test.

[0004] The deformation simulation method of the electronic device after multiple destructive tests is applicable to CAE, and the steps of establishing the N finite element models include: obtaining a geometric model of the electronic device; and pre-processing the geometric model to generate the N finite element models by meshing.

[0005] In the deformation simulation method of the electronic device after multiple destructive tests, the geometric model of the electronic device is made by computer aided design (CAD) software.

[0006] In the deformation simulation method of the electronic device after multiple destructive tests, the extracted numerical solution is the strain result and / or stress result of at least one component on the electronic device after the i-th destructive test.

[0007] In the deformation simulation method of the electronic device after multiple destructive tests, the i-th finite element model and the (i+1)-th finite element model are also used to perform finite element analysis of drop tests of the electronic device in different orientations.

[0008] The method for simulating deformation of an electronic device after multiple destructive tests also includes: post-processing the numerical solution obtained from the Nth finite element model to generate a chart result.

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention.

Brief Description of the Drawings

[0010] Figure 1 is a schematic diagram of an electronic device according to an embodiment of the present invention undergoing multiple destructive tests.

[0011] Figure 2 It is a flowchart of the steps of a deformation simulation method of an electronic device subjected to multiple destructive tests according to an embodiment of the present invention.

[0012] Figure 3 yes Figure 2 A schematic diagram of a deformation simulation method for an electronic device subjected to multiple destructive tests expressed in text boxes. [Specific implementation method]

[0013] The following is an explanation of the implementation of the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content provided in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementations will further explain the relevant technical content of the present invention in detail, but the content provided is not intended to limit the scope of protection of the present invention.

[0014] Please also see Figure 1 and Figure 2 , Figure 1 is a schematic diagram of an electronic device according to an embodiment of the present invention subjected to multiple destructive tests, Figure 2 1 is a flowchart of the steps of a method for simulating deformation of an electronic device after multiple destructive tests according to an embodiment of the present invention. Figure 1 The electronic device is a laptop computer as an example, and the multiple destructive tests are multiple drop tests in different directions as an example, for example, 6 faces, 12 edges and 8 corners are subjected to 26 drop tests in total, but the present invention is not limited to this. In short, because Figure 1 Electronic devices are subjected to multiple destructive tests, so Figure 2 In step S110, the embodiment of the present invention first establishes N finite element models, and the i-th finite element model is used to perform finite element analysis of the electronic device after the i-th destructive test to obtain a numerical solution of the electronic device after the i-th destructive test. It should be understood that N is an integer greater than 1, which depends on how many destructive tests the electronic device will undergo, and i is an integer from 1 to N. In this embodiment, the electronic device undergoes 26 destructive tests, for example, so N can be 26, for example, but the present invention is not limited to this.

[0015] Next, in step S120, starting from i=1, the embodiment of the present invention will extract the numerical solution obtained by the i-th finite element model as the readable data of the i+1-th finite element model, and let the i+1-th finite element model perform the finite element analysis of the electronic device after the i+1-th destructive test according to the readable data, until the N-th finite element model completes the finite element analysis of the electronic device after the N-th destructive test. Finally, in step S130, the embodiment of the present invention will post-process the numerical solution obtained by the N-th finite element model to generate a graphical result, but the present invention does not limit the specific implementation method of the graphical result. In practice, the deformation simulation method of the electronic device after multiple destructive tests of the embodiment of the present invention can be applied to CAE, and the steps of establishing these N finite element models include: obtaining a geometric model of the electronic device; and pre-processing the geometric model to generate these N finite element models by meshing.

[0016] Generally speaking, the geometric model of the electronic device is made by CAD software, but the present invention is not limited thereto. In summary, after obtaining the geometric model of the electronic device, the embodiment of the present invention uses CAE to establish the N finite element models, and if Figure 1 For example, the i-th finite element model and the i+1-th finite element model are also used to perform finite element analysis of the electronic device drop test in different directions. As mentioned above, in order to effectively measure the deformation or damage of at least one part of the electronic device, such as the guide pin and / or the holder housing, due to strain / stress accumulation, the numerical solution extracted by the embodiment of the present invention is the strain result and / or stress result of the at least one part after the i-th destructive test. In addition, please refer to Figure 3 , Figure 3 yes Figure 2 A schematic diagram of a deformation simulation method for an electronic device subjected to multiple destructive tests expressed in text boxes.

[0017] like Figure 3As shown, the text boxes: Finite element model 1 to Finite element model N represent the 1st finite element model to the Nth finite element model, respectively, and the text boxes: Numerical solution 1 to Numerical solution N represent the numerical solutions obtained from the 1st finite element model to the Nth finite element model, respectively. As mentioned above, the finite element model 1 will be used to perform finite element analysis of the electronic device after the first destructive test to obtain the numerical solution 1 of the electronic device after the first destructive test. Next, the embodiment of the present invention will extract the numerical solution 1, that is, the strain result and / or stress result of at least one part on the electronic device after the first destructive test as readable data of the finite element model 2, and allow the finite element model 2 to perform finite element analysis of the electronic device after the second destructive test based on the readable data to obtain the numerical solution 2 of the electronic device after the second destructive test.

[0018] Similarly, an embodiment of the present invention will extract numerical answer 2, that is, the strain result and / or stress result of the at least one part after the second destructive test as readable data of the finite element model 3, and allow the finite element model 3 to perform finite element analysis of the electronic device after the third destructive test based on the readable data. Similarly, after the finite element model N-1 obtains the numerical answer N-1, the embodiment of the present invention will extract numerical answer N-1, that is, the strain result and / or stress result of the at least one part after the N-1th destructive test as readable data of the finite element model N, and allow the finite element model N to perform finite element analysis of the electronic device after the Nth destructive test based on the readable data, so as to obtain the numerical answer N of the electronic device after the Nth destructive test.

[0019] Finally, the embodiment of the present invention can also perform post-processing on the numerical solution N obtained by the finite element model N to generate a graphical result to reflect the strain / stress cumulative distribution diagram of the at least one part, but the present invention is not limited to this. That is, even if the i-th finite element model and the i+1-th finite element model are used for different types of destructive tests, such as finite element analysis of drop tests in different directions, when the i+1-th finite element model performs finite element analysis of the electronic device after the i+1-th destructive test, the i+1-th finite element model will take into account the strain results and / or stress results of the at least one part on the electronic device after the i-th destructive test, so that the deformation or damage of the at least one part due to strain / stress accumulation can be effectively measured.

[0020] In summary, compared to the prior art which simulates the situation that the electronic device is subjected to a single destructive test, the deformation simulation method of the electronic device subjected to multiple destructive tests of the embodiment of the present invention simulates the situation that the electronic device is subjected to multiple consecutive destructive tests. In addition, the deformation simulation method of the electronic device subjected to multiple destructive tests of the embodiment of the present invention will extract the numerical solution obtained by the i-th finite element model, that is, the strain result and / or stress result of at least one part on the electronic device subjected to the i-th destructive test as the readable data of the i+1-th finite element model, and let the i+1-th finite element model perform finite element analysis of the electronic device subjected to the i+1-th destructive test based on the readable data. Therefore, the deformation or damage of the at least one part on the electronic device due to the accumulation of strain / stress can be effectively measured.

[0021] The contents provided above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the scope of the present invention.

Claims

1. A method for simulating deformation of an electronic device after multiple destructive tests, characterized in that: include: Establishing N finite element models, and the i-th finite element model is used to perform finite element analysis of the electronic device after the i-th destructive test, so as to obtain a numerical solution of the electronic device after the i-th destructive test, wherein N is an integer greater than 1 and is determined by the number of times the electronic device is subjected to the destructive test; and i is an integer from 1 to N; as well as Starting from i being 1, the numerical solution obtained by the i-th finite element model is extracted as the readable data of the i+1-th finite element model, and the i+1-th finite element model is allowed to perform the finite element analysis of the electronic device after the i+1-th destructive test according to the readable data, until the N-th finite element model completes the finite element analysis of the electronic device after the N-th destructive test.

2. The method for simulating deformation of an electronic device after multiple destructive tests as claimed in claim 1, characterized in that: The deformation simulation method of the electronic device after multiple destructive tests is applicable to a computer-aided engineering, and the steps of establishing the N finite element models include: obtaining a geometric model of the electronic device; and The geometric model is pre-processed to generate the N finite element models by meshing.

3. The method for simulating deformation of an electronic device after multiple destructive tests as claimed in claim 2, characterized in that: The geometric model of the electronic device is made by computer-aided design software.

4. The method for simulating deformation of an electronic device after multiple destructive tests as claimed in claim 1, characterized in that: The extracted numerical solution is a strain result and / or a stress result of at least one component on the electronic device after the i-th destructive test.

5. The method for simulating deformation of an electronic device after multiple destructive tests as claimed in claim 1, characterized in that: The i-th finite element model and the (i+1)-th finite element model are also used to perform the finite element analysis of the drop test of the electronic device in different orientations.

6. The method for simulating deformation of an electronic device after multiple destructive tests as claimed in claim 1, characterized in that: The deformation simulation method of the electronic device after multiple destructive tests also includes: The numerical solution obtained for the Nth finite element model is post-processed to generate a graphical result.

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