Device and method for forming the same

Abstract

A device and a device forming method include a first sealing member, a second sealing member, a first circuit member, a second circuit member and one or more compression members. The first sealing member has a first outer portion and a first inner portion, the first outer portion has a first sealing portion, and the first inner portion is located on the inner side of the first outer portion. The second sealing member has a second outer portion and a second inner portion, the second outer portion has a second sealing portion, and the second inner portion is located on the inner side of the second outer portion. The first sealing portion and the second sealing portion are combined together. The first circuit member and the second circuit member are enclosed in a closed space surrounded by the first inner portion and the second inner portion. One of the compression members is located between the first sealing member and the first circuit member, or between the second sealing member and the second circuit member. The present invention can provide a thinner new device.

Description

Technical Field

[0001] The present invention relates to a device including a circuit member sealed by a thin film and a method for forming the device. Background Art

[0002] For example, a device that can be made thinner is disclosed in JP2001-332654A (Patent Document 1), the contents of which are incorporated herein by reference.

[0003] refer to Fig.19 , Patent document 1 discloses a module (device) 90 with a built-in semiconductor chip. The device 90 includes a thermosetting resin composition (sealing resin) 92 and a circuit member 94 including a semiconductor chip 96 and a wiring pattern 98. The sealing resin 92 is formed so that the circuit member 94 is embedded therein. Then, the surface of the sealing resin 92 is polished so that the device 90 is thinned.

[0004] For devices including circuit members, further thickness reduction is required. Summary of the invention

[0005] Therefore, an object of the present invention is to provide a novel device that can be made thinner.

[0006] One aspect of the present invention provides a device, which includes a first sealing member, a second sealing member, a first circuit member, a second circuit member and one or more compression members. The first sealing member is formed by a film and has a first interior and a first exterior. The first interior is located inside the first exterior. The second sealing member has a second interior and a second exterior. The second interior is located inside the second exterior. The first exterior has a first sealing portion. The second exterior has a second sealing portion. The first sealing portion and the second sealing portion are combined to form a sealing trace. The device is formed with a closed space surrounded by the first interior and the second interior. The first circuit member and the second circuit member are enclosed in the closed space. The first circuit member includes a first contact point. The second circuit member includes a second contact point. The first contact point and the second contact point contact each other. The compression member is enclosed in the closed space. The compression member includes at least one of the first compression member and the second compression member. The first compression member is at least partially located between the first sealing member and the first contact point. The second compression member is at least partially located between the second sealing member and the second contact point. Each compression member has a body and two main surfaces. The two main surfaces of each compression member are positioned relative to each other across the body in a predetermined direction. A portion of the air contained in the body of each compression member is discharged.

[0007] According to a device of one aspect of the present invention, a first sealing member and a second sealing member overlap each other to contact each other, and at the same time, a first circuit member, a second circuit member (hereinafter referred to as "circuit member") and a compression member are sandwiched between them. The first film is formed by a film. The compression member can be compressed to be thinner. Except that each circuit member should be provided with a contact point, the structure of each circuit member is not limited. Therefore, each circuit member of one aspect of the present invention has a simple structure and can be formed by various materials. For example, each circuit member can be an insulating film formed with a conductive pattern having a contact point. In this case, the thickness of the entire device can be made very thin. Therefore, one aspect of the present invention provides a new device that can be made thinner.

[0008] A more complete understanding of the objectives of the present invention may be obtained by studying the following description of the preferred embodiments and referring to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 : is a perspective view showing a device according to an embodiment of the present invention, in which a boundary line of a contact region formed between a first sealing member and a second sealing member is shown by a dotted line, and a portion of the device surrounded by the dotted line is enlarged and shown.

[0010] Figure 2 It is shown Figure 1 Side view of the device.

[0011] Figure 3 It is taken along line III-III Figure 2 sectional views of a device, wherein two parts of the device (respectively surrounded by dot-dash lines) are enlarged and shown, and a boundary of a contact region is shown by a dotted line in one of the enlarged views.

[0012] Figure 4 It shows that Figure 3 An enlarged cross-sectional view of a portion of the device surrounded by a double-dashed line A in the enlarged view of .

[0013] Figure 5 It is schematically shown Figure 3 A cross-sectional view of a specific example of a device.

[0014] Figure 6 It is schematically shown Figure 5 A view of a first conductive pattern of a first circuit member and a second conductive pattern of a second circuit member of a device, wherein, although the first contact point of the first circuit is shown far away from the second contact point of the second circuit, the actual first contact points are located on the second contact points, respectively.

[0015] Figure 7 is shown for forming Figure 1A flow chart of an example of a method of forming a device.

[0016] Figure 8 It is shown in Figure 7 A perspective view of a device material group prepared in a preparatory step of a forming method, wherein the outline of a hidden first circuit is shown by a dotted line.

[0017] Fig. 9 It is shown in Figure 7 In the arranging step of the forming method, Figure 8 A perspective view of a device material group.

[0018] Fig.10 It is shown Fig. 9 Side view of a device material group.

[0019] Fig.11 is a diagram showing a section taken along line XI-XI Fig.10 A cross-sectional view of a device material group, in which two portions of the device material group surrounded by dashed lines are enlarged and shown.

[0020] Fig.12 It is shown Figure 7 The forming method comprises the steps of arranging the assembly machine and Fig.10 Schematic view of the structure of a device material group, which is arranged in an assembly machine.

[0021] Fig.13 It is shown that multiple Fig. 9 FIG. 1 is a view of components of device material groups, wherein the boundary lines between each device material group and other device material groups are shown by dashed lines.

[0022] Fig.14 It is shown Figure 5 Cross-sectional views of variations of the device.

[0023] Fig.15 It is shown Figure 5 A cross-sectional view of another variation of a device.

[0024] Fig.16 It is shown Figure 5 A cross-sectional view of a device material group of yet another variation of the device.

[0025] Fig.17 It is shown Figure 8 1 is a perspective view of a variation of a film component of a device material set, wherein the structure of the manufactured device is shown for a portion of the film component surrounded by a dotted line.

[0026] Fig.18 It is shown Figure 81 is a perspective view of another variation of a film component of a device material set, wherein the structure of the manufactured device is shown for a portion of the film component surrounded by a dotted line.

[0027] Fig.19 is a cross-sectional view showing the device of Patent Document 1.

[0028] Although the invention is susceptible to various modifications and alternative forms, specific embodiments of the invention are shown by way of example in the drawings and will be described in detail herein. It should be understood, however, that the drawings and detailed description thereof are not intended to limit the invention to the particular forms disclosed, but on the contrary, are intended to cover all modifications, equivalents and alternative forms falling within the spirit and scope of the invention as defined by the appended claims. DETAILED DESCRIPTION

[0029] refer to Figure 1 and Figure 2 , the device 10 according to an embodiment of the present invention is an independent electronic device. More specifically, the device 10 can work alone without being physically attached to another electronic device (not shown). For example, the device 10 measures the heart rate of the subject by attaching the device 10 near the heart of the subject, and sends the measurement result to another electronic device. Therefore, the device 10 can be used as an electronic device for measuring biological information such as heart rhythm. However, the present invention is not limited to this, but can be applied to various devices with various functions.

[0030] refer to Figure 1 , 3 8, the device 10 of the present embodiment includes a circuit structure 12, a sealing member (film member) 14, and two compression members 60. The circuit structure 12 is a member for enabling the device 10 to be used as an electronic device. For example, the circuit structure 12 has an electronic circuit (not shown) for measuring heart rate and another electronic circuit (not shown) for transmitting the measurement result to another electronic device (not shown). Figure 3 The film member 14 accommodates the entire circuit structure 12 and the entire compression member 60 therein. Therefore, the circuit structure 12 and the compression member 60 are enclosed in the film member 14, and the film member 14 protects the circuit structure 12 from the external environment.

[0031] Hereinafter, the structure of the device 10 of this embodiment will be described.

[0032] refer to Figure 3 and Figure 8, the circuit structure 12 of the present embodiment includes a first circuit member 40 and a second circuit member 50. The film member 14 of the present embodiment includes a first sealing member 20 made of an insulator and a second sealing member 30 made of an insulator. The compression member 60 of the present embodiment includes a first compression member 62 that can be compressed by pressure and a second compression member 64 that can be compressed by pressure. Therefore, the device 10 includes a first sealing member 20, a second sealing member 30, a first circuit member 40, a second circuit member 50, a first compression member 62 and a second compression member 64.

[0033] refer to Figure 3 and Figure 5 , the above six components, namely the first sealing member 20, the second sealing member 30, the first circuit member 40, the second circuit member 50, the first compression member 62 and the second compression member 64 are stacked and combined in the up-down direction (Z direction) to form one of the devices 10. The device 10 of the present embodiment only includes the above six components. However, the present invention is not limited to this, and the device 10 may include other components in addition to the above six components. For example, the device 10 may further include an additional circuit member. On the contrary, the device 10 may only include one of the first compression member 62 and the second compression member 64.

[0034] refer to Figure 8 , the first circuit member 40 of the present embodiment has a first base 42 and a first conductive pattern 44. The first base 42 of the present embodiment is a rectangular thin plate formed of an insulating film, and is bendable. The first base 42 extends parallel to a horizontal plane (sheet plane: XY plane) perpendicular to the Z direction. The first conductive pattern 44 is formed on the first base 42. Specifically, the first conductive pattern 44 is made of a conductor such as copper, and is formed on the lower surface (negative Z side surface) of the first base 42 by a formation method such as silver ink printing or etching.

[0035] The second circuit member 50 of the present embodiment has a second base 52 and a second conductive pattern 54. The second base 52 of the present embodiment is a rectangular sheet formed of an insulating film and is bendable. The second base portion 52 extends parallel to the XY plane. The second conductive pattern 54 is formed on the second base 52. Specifically, the second conductive pattern 54 is made of a conductor such as copper and is formed on the upper surface (positive Z side surface) of the second base 52 by a forming method such as silver ink printing or etching.

[0036] The first circuit member 40 and the second circuit member 50 of the present embodiment have the above-mentioned structures, respectively. However, the present invention is not limited thereto. For example, each of the first circuit member 40 and the second circuit member 50 may be provided with one or more electronic components. One of the first circuit member 40 and the second circuit member 50 may be a single electronic component. In addition, the shape of each of the first base 42 and the second base 52 is not limited to a rectangle, but may be modified as needed. Each of the first base 42 and the second base 52 may be a rigid circuit board having rigidity and hardly bending. The method for forming each of the first conductive pattern 44 and the second conductive pattern 54 is not particularly limited,

[0037] In the present embodiment, the first conductive pattern 44 has a first contact point 48, and the second conductive pattern 54 has a second contact point 58. Therefore, the first circuit member 40 includes the first contact point 48, and the second circuit member 40 includes the second contact point 48. Figure 3 and Figure 4 , in the fabricated device 10 (see Figure 1 ), the first contact point 48 and the second contact point 58 are in contact with each other. Therefore, the first circuit member 40 and the second circuit member 50 are combined with each other so that the first contact point 48 and the second contact point 58 are in contact with each other. The first circuit member 40 and the second circuit member 50 combined as described above form the circuit structure 12. The first conductive pattern 44 and the second conductive pattern 54 of the circuit structure 12 are electrically connected to each other.

[0038] Figure 8 The first conductive pattern 44 and the second conductive pattern 54 shown are abstract conductive patterns for simply explaining the present invention and have no specific function. In other words, even when the first contact point 48 shown in the figure and the second contact point 58 shown in the figure are in contact with each other, the device 10 (see Figure 1 ) cannot be used as an electronic device. The actual first conductive pattern 44 and the actual second conductive pattern 54 have, for example, Figure 5 and 6 The structure shown.

[0039] refer to Figure 5 and Figure 6 , the first base 42 has a first circuit 43 formed on its lower surface, and the second base 52 has a second circuit 53 formed on its upper surface. The first circuit 43 has a button battery 46 and two first conductive patterns 44 respectively formed with first contact points 48. The second circuit 53 has a light emitting diode (LED) 56 and two second conductive patterns 54 respectively formed with second contact points 58. When the first contact points 48 are in contact with the second contact points 58, the button battery 46 supplies power to the LED 56, and the LED 56 emits light. The structures of the first circuit 43 and the second circuit 53 can be modified as follows: Figure 5 and Figure 6 For example, the second circuit 53 may have a circuit for measuring the heart rate instead of the LED 56 and another circuit for transmitting the measurement result.

[0040] according to Figure 5 and Figure 6 , the number of the first contact points 48 and the number of the second contact points 58 are both two. However, the number of the first contact points 48 and the number of the second contact points 58 may be as follows: Figure 8 One is shown, but there may be more than three. Therefore, the first circuit member 40 should have one or more first contact points 48, and the second circuit member 50 should have one or more second contact points 58 corresponding to the first contact points 48. In the manufactured device 10, each first contact point 48 should be in contact with a corresponding second contact point 58.

[0041] refer to Figures 1 to 3 , the first sealing member 20 and the second sealing member 30 of the present embodiment have structures similar to each other. More specifically, each of the first sealing member 20 and the second sealing member 30 is a rectangular sheet formed by a film and is bendable. Each of the first sealing member 20 and the second sealing member 30 extends parallel to the XY plane. The first sealing member 20 has a peripheral edge 29 on the XY plane. The second sealing member 30 has a peripheral edge 39 on the XY plane.

[0042] The first sealing member 20 and the second sealing member 30 of the present embodiment overlap each other so that the position of the peripheral edge 29 and the position of the peripheral edge 39 are aligned with each other on the XY plane. However, the present invention is not limited to this. For example, the size of the first sealing member 20 in the XY plane and the size of the second sealing member 30 in the XY plane can be different from each other. The shape of each of the first sealing member 20 and the second sealing member 30 is not limited to a rectangle, but can be modified as needed.

[0043] refer to Figure 1 and Figure 3 , the first sealing member 20 has a first inner portion 22 and a first outer portion 24. The first inner portion 22 is located inside the first outer portion 24 on the XY plane. In other words, the first outer portion 24 is a portion of the first sealing member 20 surrounding the first inner portion 22. The second sealing member 30 has a second inner portion 32 and a second outer portion 34. The second inner portion 32 is located inside the second outer portion 34 on the XY plane. In other words, the second outer portion 34 is a portion of the second sealing member 30 surrounding the second inner portion 32.

[0044] refer to Figure 3The first inner portion 22 of the first sealing member 20 and the second inner portion 32 of the second sealing member 30 of the device 10 are components for accommodating the circuit structure 12 and the compression member 60. Figure 3 and Figure 8 , before forming the device 10 of the present embodiment, the first sealing member 20 extends uniformly along the XY plane, and there is no visible boundary between the first inner portion 22 and the first inner portion 22. Before forming the device 10, the second sealing member 30 extends uniformly along the XY plane, and there is no visible boundary between the second inner portion 32 and the second outer portion 34. However, the present invention is not limited to this. For example, a visible boundary such as a depression may be formed between the first inner portion 22 and the first outer portion 24, and a visible boundary such as a depression may be formed between the second inner portion 32 and the second outer portion 34.

[0045] refer to Figure 1 and 3 The first outer portion 24 of the present embodiment has a first sealing portion 26 and a first contact portion 28. The second outer portion 34 of the present embodiment has a second sealing portion 36 and a second contact portion 38. The sealing portion 26 and the second sealing portion 36 are joined together to form the sealing trace 16.

[0046] According to the present embodiment, the first sealing portion 26 and the second sealing portion 36 are combined together by heat sealing. Therefore, the sealing trace 16 of the present embodiment is a trace in which the first sealing portion 26 and the second sealing portion 36 are welded to each other by heating. However, the present invention is not limited to this, and the first sealing portion 26 and the second sealing portion 36 can be combined together by various methods such as high frequency, ultrasound, laser or bonding. For example, the first sealing portion 26 and the second sealing portion 36 can be combined together by an adhesive. In this case, the sealing trace 16 is a bonding trace. In this case, the second sealing member 30 can be a relatively thick member with rigidity.

[0047] The sealing trace 16 of the present embodiment is formed on the entire edge of the first sealing portion 26 and the second sealing portion 36. In other words, the sealing trace 16 surrounds the first inner portion 22 and the second inner portion 32 in the entire circumference in the XY plane. At the same time, a portion of the first sealing portion 26 and a portion of the second sealing portion 36, especially the outer periphery of the first sealing portion 26 and the second sealing portion 36 in the XY plane are not heat-sealed, so that the sealing trace 16 is not formed. However, the present invention is not limited to this, and the sealing trace 16 may be formed on the entire first sealing portion 26 and the second sealing portion 36.

[0048] refer to Figure 8, each compression member 60 is a foamed cushioning material with elasticity. More specifically, each compression member 60 of the present embodiment is an open-cell structure, such as a polyurethane sponge, a polyolefin sponge or a chloroprene rubber (CR) sponge. The open-cell structure of the present embodiment is formed by an expandable and compressible elastomer and a large number of holes densely formed in the elastomer. The holes are interconnected to form an open hole. The open hole opens outward from the elastomer. When the open-cell structure is compressed, the open-cell structure contracts and the air in the hole is discharged. When the compression of the open-cell structure stops, the open-cell structure expands to return to its shape before compression, and the outside air is absorbed into the hole. Each compression member 60 of the present embodiment is an excellent cushioning material made of such an open-cell structure.

[0049] In detail, each compression member 60 of the present embodiment has a main body 602 and two main surfaces 604. The two main surfaces 604 of each compression member 60 are oriented in a predetermined direction or along a predetermined direction. Figure 8 The Z direction in the direction of the body 602 is positioned relative to each other, passes through the body 602, and is perpendicular to the plane of the predetermined direction or along the Figure 8 For each compression member 60, when the body 602 is compressed so that the two main surfaces 604 approach each other in a predetermined direction, a portion of the air contained in the body 602 is discharged, and when the compression of the body 602 stops, the air flows into the body 602.

[0050] Each compression member 60 of the present embodiment has the above-mentioned structure. However, the present invention is not limited thereto. For example, each compression member 60 may be formed by two flat plates connected to each other by a large number of springs to work similarly to an open-cell structure.

[0051] refer to Figure 3 and Figure 8 , when the device 10 of the present embodiment is formed, the first sealing member 20 and the second sealing member 30 approach each other and move in the Z direction. While the compression member 60 is compressed, these members are combined together. When the compression member 60 is compressed, the air contained in the compression member 60 is discharged. When the first sealing portion 26 and the second sealing portion 36 are combined together, the inside of the device 10 is isolated from the outside of the device 10. Each compression member 60 absorbs the air remaining in the device 10, so that the air pressure of the internal space of the device 10 is reduced. Due to the difference between the air pressure of the internal space and the air pressure outside the device 10, the first contact portion 28 and the second contact portion 38 contact each other in the contact area 17. As a result, the device 10 is formed with a closed space 18 surrounded by the first inner portion 22 and the second inner portion 32.

[0052] refer to Figure 1 and Figure 3, the first sealing portion 26 of the first sealing member 20 and the second sealing portion 36 of the second sealing member 30 are components for firmly combining the first sealing member 20 and the second sealing member 30 together by sealing such as heat sealing. The first contact portion 28 of the first sealing member 20 and the second contact portion 38 of the second sealing member 30 are parts that contact each other according to the combination of the first sealing portion 26 and the second sealing portion 36 under low pressure. According to the present embodiment, before sealing, there is no visible boundary between the first sealing portion 26 and the first contact portion 28. Similarly, before sealing, there is no visible boundary between the second sealing portion 36 and the second contact portion 38. However, the present invention is not limited to this. For example, a visible boundary such as a depression can be formed between the first sealing portion 26 and the first contact portion 28, and a visible boundary such as a depression can be formed between the second sealing portion 36 and the second contact portion 38.

[0053] According to the present embodiment, the first sealing portion 26 and the second sealing portion 36 are combined together in a state where the air pressure in the closed space 18 is set to a low pressure lower than the atmospheric pressure. In addition, the contact area 17 seamlessly surrounds the first inner portion 22 and the second inner portion 32 on its entire edge in the XY plane, thereby blocking the air that may flow between the inside and the outside of the closed space 18. Therefore, the air pressure in the confined space 18 is maintained at a low pressure lower than the atmospheric pressure not only by the first sealing portion 26 and the second sealing portion 36 bonded together, but also by the first contact portion 28 and the second contact portion 38 that are firmly in contact with each other. However, the present invention is not limited to this. For example, the contact area 17 may partially surround the first inner portion 22 and the second inner portion 32 in the XY plane.

[0054] refer to Figure 3 The compression member 60 is enclosed in the closed space 18 maintained with the above-mentioned low pressure. The first compression member 62 is located between the first sealing member 20 and the first circuit member 40 in the Z direction. The second compression member 64 is located between the second sealing member 30 and the second circuit member 50 in the Z direction.

[0055] refer to Figure 3 , the first circuit member 40 and the second circuit member 50 are enclosed in the closed space 18, and the closed space 18 and the compression member 60 maintain the above-mentioned low pressure. When the device 10 is formed, the first sealing member 20 presses the first compression member 62 on the first circuit member 40, and the second sealing member 30 presses the second compression member 64 on the second circuit member 50. Figure 3 and Figure 8Each of the compression members 60 compressed in this way is compressed mainly in a predetermined direction (Z direction) while discharging the air in the body 602. Therefore, in each of the compression members 60 of the manufactured device 10, a part of the air contained in the body 602 is discharged. Therefore, the thickness or the dimension in the Z direction of each of the compression members 60 of the device 10 is much thinner than that of the compression member 60 before compression.

[0056] References Figure 3 and Figure 4 , the first contact point 48 and the second contact point 58 are in contact with each other in the closed space 18. Specifically, the compression member 60 enclosed in the closed space 18 absorbs a small amount of air remaining in the closed space 18. As a result, the air pressure of the closed space 18 is reduced. Due to the air pressure difference between the inside and the outside of the closed space 18, the first contact point 48 and the second contact point 58 are pressed against each other. In addition, the first contact point 48 is pressed against the second contact point 58 by the restoring force of the first compression member 62, and the second contact point 58 is pressed against the first contact point 48 by the restoring force of the second compression member 64. Therefore, the first contact point 48 and the second contact point 58 are pressed against each other by the restoring force of the compression member 60. Therefore, the contact between the first contact point 48 and the second contact point 58 can be reliably maintained.

[0057] Summarize the above description, the first sealing member 20 and the second sealing member 30 of the device 10 of the present embodiment overlap each other and contact each other, and the first circuit component 40, the second circuit component 50 (hereinafter referred to as "circuit component") and the compression member 60 are sandwiched between them. The first sealing member 20 and the second sealing member 30 are both formed by a film. The compression member 60 can be compressed to be thinner. Except that each circuit component should be provided with a contact such as the first contact 48 or the second contact 58, the structure of each circuit member is not restricted. Therefore, each circuit member of the present embodiment has a simple structure and can be formed by various materials. For example, each circuit member can be an insulating film formed with a conductive pattern with a contact point, such as the first conductive pattern 44 or the second conductive pattern 54. In this case, the thickness of the entire device 10 can be made very thin. Therefore, the present embodiment provides a new device 10 that can be made thinner.

[0058] The compression member 60 of the present embodiment includes a first compression member 62 and a second compression member 64. Since the first compression member 62 and the second compression member 64 of the present embodiment are arranged so that the first contact point 48 and the second contact point 58 are sandwiched between them, the first contact point 48 and the second contact point 58 can be further stably connected. However, the present invention is not limited to this. For example, the compression member 60 may include only one of the first compression member 62 and the second compression member 64. On the contrary, the number of each of the first compression member 62 and the second compression member 64 may be two or more. Therefore, the device 10 should include one or more compression members 60. The compression member 60 may include at least one of the first compression member 62 and the second compression member 64.

[0059] refer to Figure 3 and Figure 8 , except for the end of the first circuit member 40, the first compression member 62 of the present embodiment completely covers the first circuit member 40. Except for the end of the second circuit member 50, the second compression member 64 of the present embodiment completely covers the second circuit member 50. Therefore, the size (area) of each compression member 60 on the XY plane is much larger than the size (area) of each of the first contact point 48 and the second contact point 58. Each compression member 60 having a large size as described above can be easily arranged to correspond to the first contact point 48 and the second contact point 58, respectively.

[0060] Each compression member 60 before compression has a large size not only in the XY plane but also in the Z direction. In other words, before compression, each compression member 60 of the present embodiment has a large volume. When air flows into the closed space 18 of the device 10 in use, the air is absorbed into the compression member 60, thereby reducing the restoring force of the compression member 60. However, since each compression member 60 of the present embodiment is large, the variation of the restoring force can be reduced.

[0061] However, the present invention is not limited thereto. For example, the size and shape of each compression member 60 are not particularly limited, as long as the compression member 60 can be enclosed in the closed space 18 so that the first contact point 48 and the second contact point 58 are pressed against each other. For example, the first compression member 62 can be located only between the first sealing member 20 and the first contact point 48. The second compression member 64 can be located only between the second sealing member 30 and the second contact point 58. The first compression member 62 should be at least partially located between the first sealing member 20 and the first contact point 48. Therefore, the second compression member 64 should be at least partially located between the first sealing member 20 and the first contact point 48. The second compression element 64 should be at least partially located between the second sealing element 30 and the second contact point 58.

[0062] Since the device 10 of the present embodiment includes the compression member 60, a contact force is generated between the first contact point 48 and the second contact point 58 of the manufactured device 10 due to the restoring force of the compression member 60. The contact force between the first contact point 48 and the second contact point 58 can be stably maintained for a long time. In addition, the compression member 60 serves as a buffer material, so the device 10 is hardly damaged even when bent. The present embodiment provides a device 10 that can stably operate for a long time under various environments.

[0063] refer to Figure 1 and Figure 3 , the first contact portion 28 and the second contact portion 38 of the present embodiment seamlessly surround the first inner portion 22 and the second inner portion 32 over the entire edge in the XY plane. The first sealing portion 26 and the second sealing portion 36 seamlessly surround the first contact portion 28 and the second contact portion 38 over the entire edge in the XY plane. According to this structure, the enclosed space 18 can be reliably maintained in an airtight state. In addition, by cutting off the first sealing portion 26 and the second sealing portion 36, the first circuit member 40 and the second circuit member 50 can be easily taken out from the enclosed space 18. Therefore, according to the present embodiment, each member is easy to collect separately and can be reused. However, the present invention is not limited to this. For example, the first sealing portion 26 and the second sealing portion 36 may partially surround the first contact portion 28 and the second contact portion 38 in the XY plane. The first sealing portion 26 and the second sealing portion 36 may be partially formed or may not be formed.

[0064] refer to Figure 1 and Fig.11 , the first sealing member 20 and the second sealing member 30 of the present embodiment respectively include two layers, which are composed of a fusible layer 146 that can be melted by heat sealing and an infusible layer 148 that cannot be melted by heat. In other words, the first sealing member 20 and the second sealing member 30 each have a two-layer structure formed by a fusible layer 146 and an infusible layer 148. For example, the fusible layer 146 is made of polyethylene and the infusible layer 148 is made of nylon. According to this structure, while maintaining the infusible layer 148 of the first sealing part 26 and the second sealing part 36, the fusible layer 146 is fused to each other. However, the present invention is not limited to this, and each of the first sealing member 20 and the second sealing member 30 can have a structure according to the sealing method. For example, each of the first sealing member 20 and the second sealing member 30 can include only one layer, or can include three or more layers.

[0065] Each of the first sealing member 20 and the second sealing member 30 of the present embodiment is formed so that a portion thereof other than the first sealing portion 26 and the second sealing portion 36 also includes a fusible layer 146 and a non-fusible layer 148. However, the present invention is not limited thereto. For example, the fusible layer 146 may be formed only in each of the first sealing portion 26 and the second sealing portion 36.

[0066] refer to Figure 1 , each of the first sealing member 20 and the second sealing member 30 preferably has a high barrier property to oxygen. More specifically, each of the first sealing member 20 and the second sealing member 30 preferably includes a layer made of a high oxygen barrier material, which is a material having a high barrier property to oxygen. According to this layer structure, oxidation of the metal member of the circuit structure 12 can be reduced.

[0067] For example, the high oxygen barrier material may be a linear low-density polyethylene (LLDPE). More specifically, the high oxygen barrier material may be PET / Al / PE formed by laminating polyethylene terephthalate, aluminum, and polyethylene; for example, PET / Al / PE. ON / PE formed by laminating biaxially stretched nylon and polyethylene; PET / EVOH / PE formed by laminating polyethylene terephthalate, polyvinyl chloride, and polyethylene; or may be formed by laminating a transparent high barrier film and polyethylene. The transparent high barrier film may be polyethylene terephthalate (PET) deposited with SiOx or alumina.

[0068] The first sealing member 20 and the second sealing member 30 of the present embodiment preferably have a high barrier to water vapor in addition to a high barrier to oxygen. More specifically, each of the first sealing member 20 and the second sealing member 30 preferably includes a layer made of a high water vapor barrier material, which is a material with high barrier properties to water vapor. According to the layer structure, the circuit structure 12 can be waterproof. For example, the high water vapor barrier material can be a sheet made of ON / PE, biaxially stretched polypropylene (OPP) or PET and coated with a material of polyvinylidene chloride (PVDC).

[0069] Each of the first sealing member 20 and the second sealing member 30 may have various barrier properties such as barrier properties to nitrogen in addition to high barrier properties to oxygen and water vapor. Therefore, each of the first sealing member 20 and the second sealing member 30 preferably has high barrier properties according to its use.

[0070] refer to Figure 7 The device 10 of this embodiment is formed by three steps (see Figure 1), the three steps include a preparation step (step 1), an arrangement step (step 2) and a sealing step (step 3). However, the present invention is not limited thereto, and the method for forming the device 10 can be modified as needed. Hereinafter, the method for forming the device 10 of the present embodiment will be described.

[0071] refer to Figure 8 , in the preparation step (see Figure 6 ), prepare a device material group 11. The device material group 11 includes a first sealing member 20, a second sealing member 30, a first circuit member 40, a second circuit member 50 and a compression member 60. Each member has the structure that has been described, and various modifications can be made as explained.

[0072] Therefore, the forming method of the present embodiment includes preparing a first sealing member 20, a second sealing member 30, a first circuit member 40, a second circuit member 50 and a compression member 60, wherein the first sealing member 20 is formed of a film, the first circuit member 40 includes a first contact point 48, the second circuit member 50 includes a second contact point 58, and the compression member 60 includes at least one of a first compression member 62 and a second compression member 64, each compression member 60 has a main body 602 and two main surfaces 604, and the two main surfaces 604 of each compression member 60 are positioned in a predetermined direction ( Figure 8 The main bodies 602 and 604 are positioned relative to each other in the Z direction (in the Z direction), wherein for each compression member 60, when the main body 602 is compressed so that the two main surfaces 604 approach each other in a predetermined direction, a portion of the air contained in the main body 602 is discharged, and when the compression of the main body 602 stops, the air flows into the main body 602.

[0073] Then, refer to Figures 9 to 11 , in the layout step (see Figure 7 ), the first sealing member 20, the first circuit member 40, the second circuit member 50 and the second sealing member 30 are stacked in sequence from top to bottom along the Z direction. At the same time, the first circuit member 40 and the second circuit member 50 are located in the middle of the first sealing member 20 and the second sealing member 30 in the XY plane. The first circuit member 40 and the second circuit member 50 are arranged so that the first contact point 48 and the second contact point 58 face each other in the Z direction. The first compression member 62 and the second compression member 64 are arranged to vertically sandwich the first contact point 48 of the first circuit member 40 and the second contact point 58 of the second circuit member 50 therebetween. In addition, the first sealing member 20 and the second sealing member 30 are arranged so that their two fusible layers 146 face each other in the Z direction.

[0074] Then, refer to Figures 9 to 12, the device material group 11 arranged as described above is accommodated in the assembly machine 70. Therefore, the forming method of the present embodiment includes stacking and arranging the first sealing member 20, the first circuit member 40, and the second circuit member 50 in sequence in the assembly machine 70 while the first contact point 48 and the second contact point 58 face each other, the first compression member 62 is at least partially located between the first sealing member 20 and the first contact point 48, and the second compression member 64 is at least partially located between the second sealing member 30 and the second contact point 58.

[0075] refer to Fig.12 , the assembly machine 70 of the present embodiment includes a mold 74, a pressing portion 76 and a heat sealing bar 78. The device material group 11 is placed on the mold 74. Then, the pressing portion 76 of the assembly machine 70 moves downward together with the heat sealing bar 78, and presses toward the mold 74 while pressing the device material group 11. Each compression member 60 is compressed mainly in the Z direction by the pressing of the pressing portion 76, while exhausting the air contained therein. When each compression member 60 is fully compressed, the first sealing member 20 and the second sealing member 30 are sealed by the heat sealing bar 78.

[0076] In detail, the heat sealing bar 78 of the present embodiment has a heating portion 782. According to the present embodiment, the heating portion 782 is heated to have a temperature higher than the melting point of the fusible layer 146 (see Fig.11 The heating portion 782 thus heated is pressed against the first sealing portion 26 of the first sealing member 20 and the second sealing portion 36 of the second sealing member 30 which are vertically overlapped with each other, so that the first sealing portion 26 and the second sealing portion 36 are heat-sealed.

[0077] As a result of heat sealing, the first circuit member 40, the second circuit member 50 and the compression member 60 are enclosed in the closed space 18 surrounded by the first sealing member 20 (see FIG. Figure 3 ). After heat sealing, if the pressing of the pressing portion 76 is stopped, the compression member 60 absorbs the air in the closed space 18 and returns to its original shape. The compression member 60 that absorbs the air expands, so that the volume of the closed space 18 increases and the air pressure of the closed space 18 decreases. As a result, an air pressure difference is generated between the inside and the outside of the closed space 18, and a compressive force that compresses the compression member 60 is generated. When the compressive force is balanced with the restoring force of the compression member 60, the expansion of the compression member 60 ends.

[0078] When the expansion of the compression member 60 is finished, the compression member 60 has not yet returned to its original shape and has a restoring force. The first contact point 48 and the second contact point 58 are pressed against each other by the restoring force of the compression member 60, and the compression force is generated by the air pressure difference between the inside and the outside of the closed space 18 (see Figure 3). As a result, the first contact point 48 and the second contact point 58 are firmly in contact with each other.

[0079] Therefore, the forming method of the present embodiment includes: while compressing the compression member 60, sealing the first sealing member 20 and the second sealing member 30 that are in contact with each other, so that the first circuit member 40, the second circuit member 50 and the compression member 60 are enclosed in the closed space 18 surrounded by the first sealing member 20 and the second sealing member 30 (refer to Figure 3 ), and the first contact point 48 and the second contact point 58 are in contact with each other.

[0080] refer to Figure 3 According to the forming method of the present embodiment, the first contact point 48 and the second contact point 58 are firmly in contact with each other without being fixed to each other by welding or the like. Therefore, when the device 10 is no longer used, the device 10 can be disassembled by simply cutting off the first sealing portion 26 and the second sealing portion 36. In addition, for example, the first circuit member 40 and the second circuit member 50 can be closed in the closed space 18 with low pressure to reduce the degradation of the metal member due to oxidation. However, the present invention is not limited thereto, but the forming method and the sealing method of the device 10 can be modified as needed.

[0081] refer to Figures 7 to 12 According to the above-mentioned forming method, through the steps from the preparation step to the sealing step, one of the devices 10 is formed from one of the device material groups 11 (see Figure 1 ). However, the present invention is not limited thereto. For example, reference Fig.13 , a component including a plurality of device material groups 11 may be prepared and arranged. The entire component may be subjected to a sealing step (see Figure 7 and 12 ).also, Fig.13 The components shown can be moved to an assembly machine 70 (see FIG. Fig.12 )middle.

[0082] In addition to the modifications already described, various modifications may be made to this embodiment. Five modifications will be described below.

[0083] Will Fig.14 and Figure 5 By comparison, a device 10A according to a first variation of the present embodiment includes a circuit structure 12A different from the circuit structure 12 of the device 10, a sealing member 14A different from the sealing member 14 of the device 10, and a compression member 60A different from the compression member 60 of the device 10. The sealing member 14A, similar to the sealing member 14, accommodates the circuit structure 12A together with the compression member 60A therein.

[0084] The sealing member 14A of this modification includes a second sealing member (substrate) 30A and a first sealing member 20 identical to the device 10, and the first sealing member 20 is formed by a film. The second sealing member 30A is a rigid circuit board. The circuit structure 12A of this modification includes a first circuit member 40A and a second circuit member 50A. The first circuit member 40A is a single electronic component and includes two first contact points 48A. The second circuit member 50A is a conductive pattern formed on the second sealing member 30A and includes two second contact points 58A. The first contact point 48A contacts the second contact point 58A respectively, so that the conductive patterns formed on the second sealing member 30A are electrically connected to each other. The compression member 60A includes only a first compression member 62A. The first compression member 62A is an open-cell structure similar to the first compression member 62.

[0085] As mentioned above, device 10A includes a first sealing member 20, a second sealing member 30A, a first circuit member 40A, a second circuit member 50A and a compression member 60A. The first sealing member 20 and the second sealing member 30A are sealed by adhesive, for example. However, the present invention is not limited thereto. For example, the first sealing member 20 and the second sealing member 30A can be heat-sealed. In this case, similar to the first sealing member 20, the second sealing member 30A may include two layers, which are composed of a fusible layer (not shown) that can be melted by heat sealing and an infusible layer (not shown) that cannot be melted by heat sealing. In addition, similar to the first sealing member 20, the second sealing member 30A can have high barrier properties, such as high barrier properties to oxygen and high barrier properties to water vapor.

[0086] The device 10A is formed with a closed space 18 similar to the device 10. The first circuit member 40A and the second circuit member 50A are enclosed in the closed space 18 together with the compression member 60A. The compression member 60A is located between the first sealing member 20 and the entire first circuit member 40A including the first contact point 48A, and presses the first contact point 48A toward the second contact point 58A, respectively. According to this modification, the first contact point 48A can be stably connected to the corresponding second contact point 58A in a state where the first circuit member 40A is not fixed to the second circuit member 50A by welding or the like.

[0087] Will Fig.15 and Figure 5 In comparison, the device 10B according to the second variation of the present embodiment includes a circuit structure 12B different from the circuit structure 12A of the device 10A, a sealing member 14B different from the sealing member 14A of the device 10A, and a compression member 60B different from the compression member 60A of the device 10A. The sealing member 14B accommodates the circuit structure 12B together with the compression member 60B similarly to the sealing member 14A.

[0088] The sealing member 14B of this modification example includes the first sealing member 20 identical with the device 10A, and the first sealing member 20 is formed by a film, and the second sealing member (plate) 30B as a rigid circuit board similar to the second sealing member 30A of the device 10A. The circuit structure 12B of this modification example includes a first circuit member 40B and a second circuit member 50B. The first circuit member 40B is formed by a single electronic component 41B. The electronic component 41B includes a main body 42B and two terminals 49B. Each terminal 49B is used as a first contact point 48B. The second circuit member 50B is a conductive pattern formed on the second sealing member 30B, and includes two second contact points 58B corresponding to the first contact point 48B respectively. The compression member 60B only includes two first compression members 62B corresponding to the first contact point 48B respectively. Each first compression member 62B is an open hole structure similar to the first compression member 62A.

[0089] As described above, device 10B includes first sealing member 20, second sealing member 30B, first circuit member 40B, second circuit member 50B and two compression members 60B. First sealing member 20 and second sealing member 30B are sealed by adhesive, for example. Device 10B is formed with closed space 18 similar to device 10A. First circuit member 40B and second circuit member 50B are enclosed in closed space 18 together with two compression members 60B. First contact point 48B contacts second contact point 58B respectively.

[0090] Each compression member 60B is located between the corresponding first contact point 48B and the first sealing member 20, and presses the first contact point 48B of the terminal 49B onto the second contact point 58B. Each terminal 49B is arranged on the lower part of the main body 42B, and extends downward toward the corresponding second contact point 58B. Each compression member 60B does not cover the main body 42B, but covers the corresponding terminal 49B.

[0091] According to this modification, similar to the device 10A, the first contact point 48B can be stably connected to the corresponding second contact point 58B in a state where the first circuit member 40B is not fixed to the second circuit member 50B by welding, etc. In addition, according to this modification, the size of each compression member 60B on the XY plane can be made smaller than the size of the entire first circuit member 40B.

[0092] This variation may be further modified. For example, the number of electronic components 41B may be two or more. The first circuit member 40B may be a rigid circuit board. In this case, the second circuit member 50B may be a single electronic component 41B. Therefore, at least one of the first circuit member 40B and the second circuit member 50B may include an electronic component 41B. Each terminal 49B of the electronic component 41B may be used as one of the first contact point 48B and the second contact point 58B. Each terminal 49B of the electronic component 41B may extend from the main body portion 42B toward the remaining one of the first contact point 48B and the second contact point 58B. One of the compression members 60B may not cover the main body portion 42B, but may cover the terminal 49B.

[0093] Will Fig.16 and Fig.10 By comparison, the device material set 11C according to the third variation of the present embodiment includes a circuit structure 12C different from the circuit structure 12 of the device material set 11, a sealing member (film member) 14 the same as the device material set 11, and a compression member 60C different from the compression member 60 of the device material set 11. The film member 14 is heat-sealed in the same manner as the device 10 (see FIG. Figure 1 ). A device (not shown) assembled from the device material group 11C forms a closed space 18 similar to the device 10 (see Figure 3 ).

[0094] The circuit structure 12C of this modification includes a first circuit member 40C and a second circuit member 50C. The first circuit member 40C includes a first base 42 similar to the first circuit member 40, a first conductive pattern 44 formed on the first base 42, and an electronic component 471C to be connected to the first conductive pattern 44. The second circuit member 50C includes a second base 52 similar to the second circuit member 50, a second conductive pattern 54 formed on the second base 52, and an electronic component 571C to be connected to the second conductive pattern 54. The compression member 60C includes three first compression members 62C and three second compression members 64C. Each compression element 60C is an open-hole structure similar to the compression element 60.

[0095] The first circuit member 40C includes four first contact points 48C. Three first contact points 48C are provided on the first conductive pattern 44. Another first contact point 48C is provided on the electronic component 471C. The second circuit member 50C includes four second contact points 58C corresponding to the first contact points 48C, respectively. Two of the second contact points 58C are provided on the second conductive pattern 54. The other two of the second contact points 58C are provided on the electronic component 571C.

[0096] from Fig.16It can be seen that the device (not shown) formed by the device material group 11C includes a first sealing member 20, a second sealing member 30, a first circuit member 40C, a second circuit member 50C and six compression members 60C. The first circuit member 40C and the second circuit member 50C are enclosed in the closed space 18 of the device together with the six compression members 60C (see Figure 3 ). The first contact points 48C are in contact with the second contact points 58C, respectively. Each first compression member 62C is located between the corresponding first contact point 48C and the first sealing member 20, and presses the first contact point 48C toward the corresponding second contact point 58C. Each second compression member 64C is located between the corresponding second contact point 58C and the second sealing member 30, and presses the second contact point 58C against the corresponding first contact point 48C.

[0097] According to this modification, similar to the device 10, the first contact point 48C can be stably connected to the second contact point 58C without welding the first circuit member 40C including the electronic component 471C and the second circuit member 50C including the electronic component 571C. In addition, according to this modification, the size of each compression member 60C in the Z direction can be adjusted according to the distance between the first contact point 48C and the second contact point 58C. For example, the first contact point 48C of the first conductive pattern 44 and the second contact point 58C of the second conductive pattern 54 are far away from each other compared with other first contact points 48C and other second contact points 58C. In this case, the size of the corresponding compression member 60C in the Z direction can be made larger, so that the restoring force of the compressed compression member 60C is larger. By adjusting as described above, while making the thickness of the entire device 10B uniform, the first contact point 48C can be stably connected to the second contact point 58C, respectively.

[0098] Will Fig.17 and Figure 8 By comparison, a device 10D according to a fourth variation of the present embodiment is formed by a device material group 11D. The device material group 11D includes a film member (planar sheet) 14D made of an insulator instead of the first sealing member 20 and the second sealing member 30 of the device material group 11. The device material group 11D also includes a circuit structure 12 identical to the circuit member 12 of the device material group 11 and a compression member (not shown) smaller than the compression member 60 of the device material group 11.

[0099] The plane sheet 14D is bent at its center, i.e., the predetermined portion 142D, in the front-rear direction (X direction), thereby forming a first sealing member (sheet) 20D and a second sealing member (sheet) 30D that overlap each other in the Z direction. Therefore, the first sealing member 20D and the second sealing member 30D are two sheets of a single film member 14D that overlap each other. The film member 14D is a single plane sheet. The film member 14D has a predetermined portion 142D and a cutting edge 144D. The cutting edge 144D is the edge of the film member 14D on the XY plane.

[0100] The device 10D of this modification can be connected to the device 10 (refer to Figure 1 ) is formed by the same formation method, thereby having the same structure as device 10. In step (see Figure 7 ), the circuit structure 12 and the compression member are arranged between the first sealing member 20D and the second sealing member 30D along the Z direction. The first sealing portion 26D and the second sealing portion 36D are combined together to form a sealing trace 16D. The first contact portion 28D and the second contact portion 38D contact each other in the contact area 17D. The device 10D is formed with a closed space 18 similar to the device 10 (see Figure 3 ). The first circuit member 40, the second circuit member 50 and the compression member are enclosed in the closed space 18. The first contact point 48 of the first circuit member 40 and the second contact point 58 of the second circuit member 50 are pressed against each other by the compression member to contact each other.

[0101] However, device 10D differs from device 10 (see Figure 1 ) is different. First, the first sealing member 20D and the second sealing member 30D are two sheet-like sheets folded to overlap each other at the predetermined portion 142D. Therefore, the first sealing member 20D and the second sealing member 30D are connected to each other at the predetermined portion 142D. According to this structure, it is not necessary to seal the portion between the predetermined portion 142D and the contact area 17D. Therefore, only the portion between the contact area 17D ​​and the cutting edge 144D is sealed. In other words, the sealing trace 16D is only formed between the contact area 17D ​​and the cutting edge 144D. However, the present invention is not limited to this, but the portion between the predetermined portion 142D and the contact area 17D ​​can be sealed. Therefore, the sealing trace 16D should be formed at least between the contact area 17D ​​and the cutting edge 144D.

[0102] Will Fig.18 and Figure 8By comparison, a device 10E according to a fifth variation of the present embodiment is formed by a device material group 11E. The device material group 11E includes a film member (folded sheet) 14E made of an insulator, replacing the first sealing member 20 and the second sealing member 30 of the device material group 11. The device material group 11E also includes the same circuit structure 12 as the device material group 11 and a compression member (not shown) that is smaller than the compression member 60 of the device material group 11.

[0103] The folded sheet 14E has three connection sides, i.e., a predetermined portion 142E, on the XY plane, and is open at its front end (positive X side end). According to this structure, the folded sheet 14E is formed with a first sealing component (sheet) 20E and a second sealing component (sheet) 30E overlapping in the Z direction. Therefore, the first sealing member 20E and the second sealing member 30E are two pieces of a single film member 14E overlapping each other. The film member 14E is a single folded sheet. The film member 14E has a predetermined portion 142E and a cutting edge 144E. The cutting edge 144E is the edge of the opening of the film member 14E.

[0104] The device 10E of this variation can be connected to the device 10 (see Figure 1 ) is formed by a similar formation method to that of the device 10, thereby having a structure similar to that of the device 10. For example, in the arrangement step (see Figure 7 ), the circuit structure 12 and the compression member are placed in the film member 14E and arranged between the first sealing member 20E and the second sealing member 30E in the Z direction. The first sealing portion 26E and the second sealing portion 36E are combined together to form a sealing trace 16E. The first contact portion 28E and the second contact portion 38E contact each other in the contact area 17E. The device 10E is formed with a closed space 18 similar to the device 10 (see Figure 3 ). The first circuit member 40, the second circuit member 50, and the compression member are enclosed in the closed space 18. The first contact point 48 of the first circuit member 40 and the second contact point 58 of the second circuit member 50 are pressed against each other by the compression member to contact each other.

[0105] However, device 10E differs from device 10 (see Figure 1) is different. First, the first sealing member 20E and the second sealing member 30E are two thin sheets connected to each other at the predetermined portion 142E. Therefore, the first sealing member 20E and the second sealing member 30E are connected to each other at the predetermined portion 142E. According to this structure, there is no need to seal the portion between the predetermined portion 142E and the contact area 17E. Therefore, only the contact area 17E and the cutting edge 144E are sealed. In other words, the sealing trace 16E is only formed between the contact area 17E and the cutting edge 144E. However, the present invention is not limited to this, but the portion between the predetermined portion 142E and the contact area 17E can be sealed. Therefore, the sealing trace 16E should be formed at least between the contact area 17E and the cutting edge 144E.

[0106] The film members of the fourth and fifth modifications described above are a single flat sheet or a single folded sheet. However, the film member of the present invention is not limited thereto, but may be variously modified.

[0107] While there have been described what are considered to be preferred embodiments of the present invention, those skilled in the art will recognize that other and further modifications may be made therein without departing from the spirit of the invention, and it is intended to claim all embodiments that fall within the true scope of the invention.

Claims

1. A device, characterized in that comprising a first sealing member, a second sealing member, a first circuit member, a second circuit member and one or more compression members, wherein: a first sealing member formed of a membrane and having a first inner portion and a first outer portion; The first inner portion is located inside the first outer portion; a second sealing member having a second inner portion and a second outer portion; The second inner portion is located on the inner side of the second outer portion; The first outer portion has a first sealing portion; The second outer portion has a second sealing portion; The first sealing portion and the second sealing portion are joined together to form a sealing trace; The device is formed with a closed space surrounded by a first interior and a second interior; The first circuit member and the second circuit member are enclosed in a closed space; The first circuit member includes a first contact point; The second circuit member includes a second contact point; The first contact point and the second contact point are in contact with each other; The compression member is enclosed in a closed space; The compression member includes at least one of a first compression member and a second compression member; the first compression member being at least partially located between the first sealing member and the first contact point; the second compression member being at least partially located between the second sealing member and the second contact point; Each compression member has a body and two major surfaces; The two major surfaces of each compression member are positioned opposite to each other across the body in a predetermined direction; and exhausting a portion of the air contained in the body of each compression member; Each of the compression members is an open-cell structure; The device functions as an electronic device, and the first contact point and the second contact point are pressed against each other due to the air pressure difference between the inside and the outside of the closed space and are firmly contacted with each other by the restoring force of the compression member.

2. The device according to claim 1, characterized in that: The first outer portion has a first contact portion; The second outer portion has a second contact portion; The first contact portion and the second contact portion contact each other in a contact region; and The contact area surrounds the first inner portion and the second inner portion over the entire edges of the first inner portion and the second inner portion.

3. The device according to claim 1, characterized in that The first sealing portion and the second sealing portion are bonded together by heat sealing.

4. The device according to claim 3, characterized in that Each of the first sealing member and the second sealing member includes two layers consisting of a meltable layer meltable by heat sealing and a non-meltable layer non-meltable by the heat sealing.

5. The device according to claim 1, characterized in that The second sealing member is formed of a film.

6. The device according to claim 2, characterized in that: The first sealing member and the second sealing member are two sheets of a single-sheet membrane member overlapping each other; The membrane member has a predetermined portion and a cutting edge; The first sealing member and the second sealing member are connected to each other at a predetermined portion; and A sealing trace is formed at least between the contact portion and the cutting edge.

7. The device according to claim 6, characterized in that: The membrane member is a single planar sheet; and The first sealing member and the second sealing member are two sheets folded at predetermined portions to overlap each other.

8. The device according to claim 6, characterized in that: The membrane member is a single folded sheet; and The first sealing member and the second sealing member are two sheets connected to each other at a predetermined portion.

9. The device according to claim 1, characterized in that Each of the first sealing member and the second sealing member has a high barrier property.

10. The device according to claim 9, characterized in that Each of the first sealing member and the second sealing member has a high barrier property to oxygen.

11. The device according to claim 9, characterized in that Each of the first sealing member and the second sealing member has a high barrier property against water vapor.

12. The device according to claim 1, characterized in that: The first circuit member has a first base and a first conductive pattern; The first base is formed of an insulating film; A first conductive pattern is formed on the first base and has a first contact point; The second circuit member has a second base and a second conductive pattern; The second base is formed of an insulating film; and The second conductive pattern is formed on the second base and has a second contact point.

13. The device according to claim 1, characterized in that: The first compression member completely covers the first circuit member except for an end portion of the first circuit member; and The second compression member completely covers the second circuit member except for an end portion of the second circuit member.

14. The device according to claim 1, characterized in that: At least one of the first circuit member and the second circuit member includes an electronic component; The electronic component includes a main body and terminals; The terminal serves as one of the first contact point and the second contact point and extends from the body portion toward the remaining one of the first contact point and the second contact point; and One of the compression members does not cover the body portion but covers the terminal.

15. A method for forming a device, characterized in that: The device includes a first sealing member, a second sealing member, a first circuit member, a second circuit member, and one or more compression members, and the forming method includes: preparing a first sealing member, a second sealing member, a first circuit member, a second circuit member, and a compression member, the first sealing member being formed of a film, the first circuit member including a first contact point, the second circuit member including a second contact point, the compression member including at least one of a first compression member and a second compression member, each of the compression members having a main body and two main surfaces, the two main surfaces of each of the compression members being positioned to be opposite to each other across the main body in a predetermined direction, and for each compression member, when the main body is compressed so that the two main surfaces approach each other in the predetermined direction, a portion of air contained in the main body is discharged, and when the compression of the main body is stopped, the air flows into the main body; sequentially arranging a first sealing member, a first circuit member, a second circuit member, and a second sealing member in a stacked manner, with a first contact point and a second contact point facing each other, the first compression member being at least partially located between the first sealing member and the first contact point, and the second compression member being at least partially located between the second sealing member and the second contact point; and sealing the first sealing member and the second sealing member in contact with each other while compressing the compression member, so that the first circuit member, the second circuit member, and the compression member are enclosed in a closed space surrounded by the first sealing member and the second sealing member, and the first contact point and the second contact point are in contact with each other; Each of the compression members is an open-cell structure; The device functions as an electronic device, and the first contact point and the second contact point are pressed against each other due to the air pressure difference between the inside and the outside of the closed space and are firmly contacted with each other by the restoring force of the compression member.

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