Semiconductor package device

Abstract

The present disclosure relates to a semiconductor package device. The semiconductor package device includes a first light blocking structure having a first cavity and a second cavity; a first transparent structure and a second transparent structure disposed on the first light blocking structure corresponding to the first cavity and the second cavity; and a second light blocking structure disposed at least partially on the first light blocking structure and between the first transparent structure and the second transparent structure, the second light blocking structure being capable of blocking light transmission between the first transparent structure and the second transparent structure.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging device. BACKGROUND

[0002] A general optical sensor, such as a ToF (Time of Flight) sensor or a heart rate sensor, requires two or more optical windows to separate a light receiving component and a light emitting component to reduce the interference of noise light. Most of the products on the market use LCP (Liquid Crystal Polymer) to form an obstacle to block noise light.

[0003] The current LCP injection molding wall thickness limit requires sufficient space for LCP bonding. In addition, the space occupied by the overflow of the bonded LCP is not conducive to product miniaturization. SUMMARY

[0004] The present disclosure provides a semiconductor packaging device.

[0005] In a first aspect, the present disclosure provides a semiconductor packaging device, comprising:

[0006] a first light blocking structure having a first cavity and a second cavity;

[0007] a first transparent structure and a second transparent structure disposed on the first light blocking structure corresponding to the first cavity and the second cavity;

[0008] a second light blocking structure at least partially disposed on the first light blocking structure and located between the first transparent structure and the second transparent structure, the second light blocking structure being capable of blocking light transmission between the first transparent structure and the second transparent structure.

[0009] In some optional embodiments, the device further comprises:

[0010] a light receiving element, the first light blocking structure being disposed on the light receiving element.

[0011] In some optional embodiments, the device further comprises:

[0012] a light emitting element, the light emitting element being disposed on the light receiving element.

[0013] In some optional embodiments, the first light blocking structure is capable of blocking light from the light emitting element.

[0014] In some embodiments, the light receiving element comprises a first light sensing region corresponding to the first cavity.

[0015] The light emitting element corresponds to the second cavity.

[0016] In some embodiments, the light receiving element further comprises a second light sensing region corresponding to the second cavity.

[0017] In some embodiments, the first light blocking structure is disposed at least partially between the first light sensing region and the second light sensing region.

[0018] In some embodiments, the device further comprises:

[0019] a first support structure and a second support structure disposed at least partially within the first cavity and the second cavity, respectively;

[0020] The first transparent structure and the second transparent structure are disposed on the first support structure and the second support structure, respectively.

[0021] In some embodiments, the material of the first light blocking structure is different from the material of the second light blocking structure.

[0022] In some embodiments, the material of the first light blocking structure has a different light transmittance from the material of the second light blocking structure.

[0023] In some embodiments, the device further comprises:

[0024] a substrate, the light receiving element being disposed on the substrate, the substrate electrically connecting the light receiving element by wire bonding.

[0025] In some embodiments, the second light blocking structure covers at least part of the wire bonding.

[0026] In some embodiments, the first light blocking structure covers at least part of the wire bonding.

[0027] The semiconductor packaging device provided in this disclosure includes: a first light-blocking structure having a first cavity and a second cavity; a first transparent structure and a second transparent structure disposed on the first light-blocking structure corresponding to the first cavity and the second cavity; and a second light-blocking structure, at least partially disposed on the first light-blocking structure and located between the first transparent structure and the second transparent structure, which can block the light transmission between the first transparent structure and the second transparent structure. The light block formed by the first light-blocking structure and the second light-blocking structure prevents the light transmission between the first cavity and the second cavity, and also prevents the light transmission between the first transparent structure and the second transparent structure. The first light-blocking structure can prevent the packaging material from overflowing into the first cavity and the second cavity, avoiding the space occupied by the overflowing material, which is beneficial to the miniaturization of the semiconductor packaging device. Attached Figure Description

[0028] Other features, objects, and advantages of this disclosure will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0029] Figure 1A This is a longitudinal cross-sectional structural schematic diagram of one embodiment of a semiconductor packaging apparatus according to the present disclosure;

[0030] Figure 1B yes Figure 1A A top view of a partial structure of a semiconductor packaging device in some embodiments;

[0031] Figure 1C yes Figure 1A A top view of a partial structure of a semiconductor packaging device in some other embodiments;

[0032] Figure 1D yes Figure 1A A top view of an embodiment of a semiconductor packaging device;

[0033] Figure 2 This is a longitudinal cross-sectional structural schematic diagram of another embodiment of the semiconductor packaging apparatus according to the present disclosure;

[0034] Figures 3A-3E This is a longitudinal cross-sectional structural diagram of a semiconductor packaging device manufactured at various stages according to an embodiment of the present disclosure;

[0035] Figures 4A-4F This is a longitudinal cross-sectional structural view of a semiconductor packaging device manufactured at various stages according to yet another embodiment of the present disclosure.

[0036] Symbol explanation:

[0037] 11 - first light blocking structure; 111 - first cavity; 112 - second cavity; 12 - second light blocking structure; 13 - first transparent structure; 14 - second transparent structure; 15 - light receiving element; 151 - first light sensing area; 152 - second light sensing area; 16 - light emitting element; 17 - substrate; 18 - wire; 19 - first support structure; 20 - second support structure; 21 - first encapsulation layer; 22 - second encapsulation layer. DETAILED DESCRIPTION

[0038] The specific embodiments of the present disclosure will be described below with reference to the accompanying drawings and examples, and those skilled in the art can easily understand the technical problems solved by the present disclosure and the technical effects generated by the content recorded in the specification. It should be understood that the specific embodiments described herein are only used to explain the related application, and not to limit the application. In addition, only the parts related to the application are shown in the drawings for ease of description.

[0039] It should be noted that the structures, proportions, sizes, etc. shown in the drawings of the specification are only used to cooperate with the content recorded in the specification for the understanding and reading of those skilled in the art, and do not define the limiting conditions for the implementation of the present disclosure, so they do not have technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be generated by the present disclosure, should still fall within the scope of the technical content disclosed by the present disclosure. At the same time, the terms such as "upper", "first", "second" and "one" used in the specification are only for the convenience of clear description, and not to limit the scope of the implementation of the present disclosure. The change or adjustment of the relative relationship without substantially changing the technical content should also be considered as the implementation of the present disclosure.

[0040] It should also be noted that the embodiments of the present disclosure correspond to the longitudinal cross-section in the front view direction, the transverse cross-section in the right view direction, and the horizontal cross-section in the upper view direction.

[0041] In addition, the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict. The present disclosure will be described in detail below with reference to the drawings and in combination with the embodiments.

[0042] Reference Figure 1A , Figure 1A is a longitudinal cross-sectional structure schematic diagram of one embodiment of a semiconductor package device according to the present disclosure.

[0043] As Figure 1A shown, the semiconductor package device 100 can include a first light blocking structure 11, a second light blocking structure 12, a first transparent structure 13, and a second transparent structure 14. Among them:

[0044] The first light blocking structure 11 has a first cavity 111 and a second cavity 112.

[0045] The first light blocking structure 11 is capable of blocking the light in the first cavity 111 and the second cavity 112 from passing through the first light blocking structure 11, and the first light blocking structure 11 is capable of preventing the light in the first cavity 111 and the second cavity 112 from penetrating through.

[0046] The first transparent structure 13 and the second transparent structure 14 are disposed on the first light blocking structure 11 corresponding to the first cavity 111 and the second cavity 112.

[0047] Here, the first transparent structure 13 and the second transparent structure 14 can be optical windows composed of a light-transmitting material, and the light can pass through the first transparent structure 13 and the second transparent structure 14, and the light-transmitting material can include, but is not limited to, glass, polymethyl methacrylate (PMMA), Polystyrene (PS), Polycarbonate (PC), poly bis allyl diglycol carbonate (CR-39), styrene acrylonitrile copolymer, poly 4-methyl pentene-1, and transparent polyamide, etc.

[0048] The present disclosure does not make specific limitations on the light transmittance of the first transparent structure 13 and the second transparent structure 14, and the light-transmitting material can be selected according to the actual light transmittance needs.

[0049] The first light blocking structure 11 can be a light blocking structure formed by an adhesive material, and the adhesive material can include, but is not limited to, non-conductive plastic (NCP), non-conductive film (NCF), anisotropic conductive adhesive film (ACF), anisotropic conductive adhesive plastic (ACP), PI, Epoxy, resin, PP (PrePreg, pre-impregnated material or semi-cured resin, semi-cured sheet), ABF, glue, etc.

[0050] The first light blocking structure 11 is capable of supporting the first transparent structure 13 and the second transparent structure 14.

[0051] Figure 1B is Figure 1A A top view of a partial structure of a semiconductor package device in some embodiments is shown in FIG. 1A, and a top view of a partial structure of a semiconductor package device in some embodiments is shown in FIG. 1B. Figure 1BAs shown in some optional implementations, the first light blocking structure 11 is partially disposed below the first transparent structure 13 and the second transparent structure 14, and partially disposed below the first transparent structure 13 and the second transparent structure 14 away from the middle side of the first transparent structure 13 and the second transparent structure 14.

[0052] Figure 1C As shown in some optional implementations, the first light blocking structure 11 is partially disposed below the first transparent structure 13 and the second transparent structure 14, and partially disposed below the first transparent structure 13 and the second transparent structure 14 away from the middle side of the first transparent structure 13 and the second transparent structure 14. Figure 1A The top view schematic diagram of the semiconductor package device in some embodiments is shown in FIG. 6. Figure 1C As shown in some optional implementations, the first light blocking structure 11 is partially disposed below the first transparent structure 13 and the second transparent structure 14, and partially disposed below the first transparent structure 13 and the second transparent structure 14 away from the middle side of the first transparent structure 13 and the second transparent structure 14.

[0053] The second light blocking structure 12 is disposed at least partially on the first light blocking structure 11 and between the first transparent structure 13 and the second transparent structure 14, and the second light blocking structure 12 is capable of blocking the light transmission between the first transparent structure 13 and the second transparent structure 14.

[0054] Figure 1D As shown in some optional implementations, the first light blocking structure 11 is partially disposed below the first transparent structure 13 and the second transparent structure 14, and partially disposed below the first transparent structure 13 and the second transparent structure 14 away from the middle side of the first transparent structure 13 and the second transparent structure 14. Figure 1A The top view schematic diagram of the semiconductor package device in some embodiments is shown in FIG. 6. Figure 1A and 1D As shown in some optional implementations, the material of the first light blocking structure 11 is different from the material of the second light blocking structure 12. The second light blocking structure 12 can be formed by various molding compounds. For example, the molding compound can include epoxy resin, filler, catalyst, pigment, release agent, flame retardant, coupling agent, hardener, low stress absorber, adhesion promoter, ion trapping agent, etc.

[0055] In the embodiments of the present disclosure, the light transmittance of the material of the first light blocking structure 11 can be the same as or different from the light transmittance of the material of the second light blocking structure 12, and the present disclosure does not make specific limitations thereon, as long as the light transmittance of the material of the first light blocking structure 11 and the light transmittance of the material of the second light blocking structure 12 can achieve light blocking.

[0056] The first light blocking structure 11 can block overflow of the mold sealing material of the second light blocking structure 12 to the first cavity 111 and the second cavity 112, avoiding space occupation of the overflow.

[0057] In some optional embodiments, as shown in Figure 1A The semiconductor package device 100 can further include:

[0058] The light receiving element 15, and the first light blocking structure 11 is disposed on the light receiving element 15.

[0059] Here, the light receiving element 15 can include, for example, a die, an ASIC (Application Specific Integrated Circuit) chip, an HBM (High Bandwidth Memory) chip, or a PIC (photonic integrated circuit) chip, etc.

[0060] In some optional embodiments, as shown in Figure 1A The light receiving element 15 includes a first light sensing area 151, and the first light sensing area 151 corresponds to the first cavity 111.

[0061] External light can enter the first cavity 111 through the first transparent structure 13 and be transmitted to the first light sensing area 151.

[0062] In some optional embodiments, as shown in Figure 1A The light receiving element 15 further includes a second light sensing area 152, and the second light sensing area 152 corresponds to the second cavity 112.

[0063] The first light blocking structure 11 is at least partially disposed between the first light sensing area 151 and the second light sensing area 152.

[0064] Here, the first light sensing area 151 and the second light sensing area 152 can include, for example, a WG (Waveguide Grating).

[0065] In some optional embodiments, as shown in Figure 1A The semiconductor package device 100 can further include:

[0066] The light emitting element 16 is disposed on the light receiving element 15.

[0067] Here, the light emitting element 16 can be electrically connected to the light receiving element 15 through wire bonding.

[0068] The light emitting element 16 can be a light emitting electronic device, such as a light-emitting diode (LED) or the like.

[0069] The first light blocking structure 11 is capable of blocking light from the light emitting element 16.

[0070] The light emitting element 16 corresponds to the second cavity 112.

[0071] It can be understood that part of the light emitted by the light emitting element 16 can be transmitted to the outside through the second transparent structure 14, and part of the light can be reflected by the second transparent structure 14 and transmitted to the second light sensing area 152.

[0072] In some optional embodiments, as shown in FIG. 1, the semiconductor package device 100 can further include: Figure 1A

[0073] The substrate 17, on which the light receiving element 15 is disposed, is electrically connected to the light receiving element by wire 18.

[0074] The substrate 17 can be various types of substrates, which are not specifically limited in the present disclosure.

[0075] The substrate 17 can include organic and / or inorganic materials, wherein the organic material can be, for example, polyamide (PA), polyimide (PI), epoxy, poly-p-phenylene benzobisoxazole (PBO) fiber, FR-4 epoxy glass cloth laminate, PP (PrePreg, also known as semi-cured resin, semi-cured sheet), ABF (Ajinomoto Build-up Film), etc., and the inorganic material can be, for example, silicon (Si), glass, ceramic, silicon oxide, silicon nitride, tantalum oxide, etc.

[0076] The substrate 17 can also be, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate, etc.

[0077] The substrate 17 can further include an interconnection structure, such as a conductive trace, a conductive via, etc. Here, the conductive via can be a through-hole, a buried hole, or a blind hole, and the through-hole, the buried hole, or the blind hole can be filled with a conductive material, such as a metal or a metal alloy, wherein the metal can be, for example, gold (Au), silver (Ag), aluminum (Al), nickel (Ni), palladium (Pd), copper (Cu), or an alloy thereof.​

[0078] In some alternative embodiments, as shown in FIG. 1C, the second light blocking structure 12 covers at least a portion of the wire 18 to provide a protection effect on the wire 18. Figure 1A

[0079] In some alternative embodiments, as shown in FIG. 1D, the first light blocking structure 11 covers at least a portion of the wire 18 to provide a protection effect on the wire 18. Figure 1A

[0080] With continued reference to the semiconductor package device 200 as shown in FIG. 2A, the semiconductor package device 200 is similar to the semiconductor package device 100 as shown in FIG. 1A, except that in the semiconductor package device 200, the material of the second light blocking structure 12 is the same as the material of the first light blocking structure 11, and the semiconductor package device 200 further comprises a first support structure 19 and a second support structure 20. Figure 2 Figure 2 Figure 1A

[0081] Here, the first support structure 19 and the second support structure 20 are at least partially disposed in the first cavity 111 and the second cavity 112, respectively.

[0082] The first transparent structure 13 and the second transparent structure 14 are disposed on the first support structure 19 and the second support structure 20, respectively.

[0083] The support of the first transparent structure 13 and the second transparent structure 14 by the first support structure 19 and the second support structure 20 can improve the flatness of the first transparent structure 13 and the second transparent structure 14.

[0084] The first support structure 19 and the second support structure 20 can be formed by various molding compounds. For example, the molding compound can include an epoxy resin, a filler, a catalyst, a pigment, a release agent, a flame retardant, a coupling agent, a hardener, a low stress absorber, an adhesion promoter, an ion trapping agent, etc.

[0085] In some alternative embodiments, as shown in FIG. 2B, the first light blocking structure 11 is partially disposed on the first support structure 19 and the second support structure 20. Figure 2

[0086] ​​​​​​Figures 3A-3E are longitudinal cross-sectional structure diagrams of semiconductor package devices 300A, 300B, 300C, 300D, and 300E manufactured at different stages according to one embodiment of the present disclosure.

[0087] Referring to Figure 3A First, a substrate 17 is provided.

[0088] Then, a light receiving element 15 having a first light sensing area 151 and a second light sensing area 152 is disposed on the substrate 17.

[0089] Then, the substrate 17 and the light receiving element 15 are electrically connected by wire 18.

[0090] Referring to Figure 3B A light emitting element 16 is disposed on the light receiving element 15 adjacent to the second light sensing area 152, and the light receiving element 15 and the light emitting element 16 are electrically connected by wire.

[0091] Referring to Figure 3C A first light blocking structure 11 having a first cavity 111 corresponding to the first light sensing area 151 and a second cavity 112 corresponding to the second light sensing area 152 and the light emitting element 16 is disposed on the light receiving element 15.

[0092] Here, the first light blocking structure 11 can be formed by potting an adhesive material.

[0093] Referring to Figure 3D First, a first transparent structure 13 and a second transparent structure 14 are provided.

[0094] Then, the first transparent structure 13 and the second transparent structure 14 are disposed on the first light blocking structure 11 adjacent to the first cavity 111 and the second cavity 112.

[0095] Referring to Figure 3E The second light blocking structure 12 is formed by molding to be at least partially disposed on the first light blocking structure 11 and between the first transparent structure 13 and the second transparent structure 14.

[0096] The molding process can be at least one of transfer molding, injection molding, compression molding, liquid molding, and spray molding.

[0097] Figures 4A-4FFigures 1A, 1B, 1C, 1D, 1E and 1F are longitudinal cross-sectional structure schematic diagrams of semiconductor package devices 400A, 400B, 400C, 400D, 400E and 400F manufactured at different stages according to yet another embodiment of the present disclosure.

[0098] Referring to Figure 4A First, a substrate 17 is provided.

[0099] Then, a light receiving element 15 having a first light sensing area 151 and a second light sensing area 152 is disposed on the substrate 17.

[0100] Then, the substrate 17 and the light receiving element 15 are electrically connected by wire 18.

[0101] Referring to Figure 4B The mold encapsulation is performed to form a first encapsulation layer 21 and a second encapsulation layer 22, which are disposed on the substrate 17 and cover both sides of the wire 18 and the light receiving element 15.

[0102] The mold encapsulation process can be at least one of transfer molding, injection molding, compression molding, liquid molding and spray molding.

[0103] Referring to Figure 4C Part of the encapsulation material of the first encapsulation layer 21 and part of the encapsulation material of the second encapsulation layer 22 are removed to form a first support structure 19 and a second support structure 20.

[0104] Here, the part of the encapsulation material of the first encapsulation layer 21 and the part of the encapsulation material of the second encapsulation layer 22 can be removed by etching, plasma etching or mechanical polishing.

[0105] Referring to Figure 4D A light emitting element 16 is disposed on the light receiving element 15 adjacent to the second light sensing area 152 and electrically connected to the light receiving element 15 by wire.

[0106] Referring to Figure 4E A first light blocking structure 11 is disposed on the light receiving element 15 and the first support structure 19 and the second support structure 20, the first light blocking structure 11 having a first cavity 111 and a second cavity 112, the first light sensing area 151 corresponding to the first cavity 111, the second light sensing area 152 and the light emitting element 16 corresponding to the second cavity 112, and the first support structure 19 and the second support structure 20 being at least partially disposed in the first cavity 111 and the second cavity 112.

[0107] Reference Figure 4F First, the first transparent structure 13 and the second transparent structure 14 are provided.

[0108] Then, the first transparent structure 13 and the second transparent structure 14 are disposed on the first light blocking structure 11 corresponding to the first cavity 111 and the second cavity 112, and are disposed on the first support structure 19 and the second support structure 20 correspondingly.

[0109] Finally, the second light blocking structure 12 is disposed between the first transparent structure 13 and the second transparent structure 14.

[0110] Here, the second light blocking structure 12 can be formed by pouring adhesive material between the first transparent structure 13 and the second transparent structure 14.

[0111] The method for manufacturing a semiconductor structure provided by the present disclosure can achieve similar technical effects as the aforementioned semiconductor structure, which will not be repeated here.

[0112] Although the present disclosure has been described and illustrated with reference to specific embodiments, the description and illustrations have been made by way of example only. It is understood that various changes in the details can be made by those skilled in the art without departing from the true spirit and scope of the present disclosure. The drawings are not necessarily to scale. There can be differences between the technical reproduction and the actual implementation in the present disclosure due to variables in the manufacturing process, etc. There can be other embodiments of the present disclosure that are not specifically described. The specification and drawings should be considered illustrative rather than restrictive. Modifications can be made to adapt a particular situation, material, composition of matter, method or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to particular operations performed in a particular order, it will be understood that these operations can be combined, sub-divided, or re-ordered to form equivalent methods without departing from the teachings of the present disclosure. Therefore, the order and grouping of operations are not limiting to the present disclosure unless specifically indicated herein.

Claims

1. A semiconductor package device, comprising: a first light blocking structure having a first cavity and a second cavity; a first transparent structure and a second transparent structure disposed on the first light blocking structure corresponding to the first cavity and the second cavity; a second light blocking structure disposed at least partially on the first light blocking structure and between the first transparent structure and the second transparent structure, the second light blocking structure capable of blocking light transmission between the first transparent structure and the second transparent structure; the second light blocking structure formed by a mold encapsulation material; the first light blocking structure formed by an adhesive material, a side surface being curved, for blocking the mold encapsulation material of the second light blocking structure from overflowing into the first cavity and the second cavity; the device further comprising a light receiving element and a light emitting element; the first light blocking structure directly contacting the light receiving element and disposed entirely on the light receiving element; the light emitting element disposed on the light receiving element; the first light blocking structure capable of blocking light from the light emitting element.

2. The apparatus of claim 1, wherein, the light receiving element comprising a first light sensing area corresponding to the first cavity; the light emitting element corresponding to the second cavity.

3. The apparatus of claim 2, wherein, the light receiving element further comprising a second light sensing area corresponding to the second cavity.

4. The apparatus of claim 3, wherein, the first light blocking structure disposed at least partially between the first light sensing area and the second light sensing area.

5. The apparatus of claim 1, wherein, a material of the first light blocking structure different from a material of the second light blocking structure.

6. The apparatus of claim 1, wherein, a light transmittance of the material of the first light blocking structure different from a light transmittance of the material of the second light blocking structure.

7. The apparatus of claim 1, wherein, the device further comprising: a substrate, the light receiving element disposed on the substrate, the substrate electrically connected to the light receiving element by wire bonding; the second light blocking structure covering at least part of the wire bonding.

8. The apparatus of claim 7, wherein, the first light blocking structure covering at least part of the wire bonding.

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