Substrate processing device and substrate transport method

Abstract

The present invention provides a substrate processing apparatus and a substrate transport method capable of suppressing degradation of a structure disposed at an opening. The substrate processing apparatus includes: a substrate transport module having an internal space through which substrates pass, the internal space being controlled to an atmospheric pressure environment when the substrates are transported to an external space controlled to a positive pressure relative to atmospheric pressure; an opening disposed in the substrate transport module, connecting the internal space with the external space; a gate disposed in the opening, having a transport space; an ejection portion for ejecting a purge gas from the external space toward the edge of the opening; and an exhaust port for exhausting the transport space via a path separate from the opening.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a substrate conveying method. Background Art

[0002] In a substrate processing apparatus, a structure such as a gate is provided at an opening through which a substrate passes when the substrate is carried out, for example (see, for example, Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-220588 Summary of the Invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a technique for suppressing deterioration of a structure provided in an opening.

[0008] Technical solutions to technical problems

[0009] A substrate processing device according to one embodiment of the present invention includes: a substrate feeding and carrying out module having an internal space for substrates to pass through, wherein when the substrates are carried out to an external space controlled to be at a positive pressure compared to atmospheric pressure, the internal space is controlled to be an atmospheric pressure environment; an opening portion provided in the substrate feeding and carrying out module, connecting the internal space with the external space; a gate provided in the opening portion, having a transport space; an ejection portion for ejecting a purge gas from the side of the external space to the edge of the opening portion; and an exhaust port for exhausting the transport space via a path different from the opening portion.

[0010] Effects of the Invention

[0011] According to the present invention, it is possible to suppress deterioration of a structure provided in an opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a diagram showing an example of a schematic configuration of a substrate processing apparatus 1 according to an embodiment.

[0013] Figure 2 It is a diagram showing an example of a schematic structure of the load lock chamber 4 .

[0014] Figure 3 It is a diagram showing an example of the schematic configuration of the load lock chamber 4 and the gate 5 .

[0015] Figure 4 It is a diagram showing an example of the schematic configuration of the load lock chamber 4 and the gate 5 .

[0016] Figure 51 is a diagram schematically showing the general structure of the substrate G, the gate 5 and the load lock chamber 4.

[0017] Figure 6 1 is a diagram showing an example of a schematic structure of the load lock panel 6 .

[0018] Figure 7 1 is a diagram showing an example of a schematic structure of the load lock panel 6 .

[0019] Figure 8 It is a diagram schematically showing the flow of the ejected purge gas.

[0020] Figure 9 It is a diagram schematically showing the flow of the ejected purge gas.

[0021] Figure 10 It is a diagram showing an example of the schematic structure of the nozzle 61.

[0022] Figure 11 This is a diagram showing the load lock panel 6 as viewed from the load lock chamber 4 side.

[0023] Figure 12 It is a diagram schematically showing the flow of exhausted gas.

[0024] Figure 13 It is a diagram schematically showing the flow of exhausted gas.

[0025] Figure 14 It is a diagram schematically showing the flow of exhausted gas.

[0026] Figure 15 It is a diagram schematically showing the flow of exhausted gas.

[0027] Figure 16 It is a diagram schematically showing the flow of exhausted gas.

[0028] Figure 17 It is a diagram schematically showing the flow of exhausted gas.

[0029] Figure 18 This is a flowchart showing an example of processing (substrate transport method) executed in the substrate processing apparatus 1 .

[0030] Figure 19 1 is a diagram showing an example of the schematic configuration of the load-lock chamber 4 , the gate 5 , the nozzle 61 , and the exhaust pipe 64A.

[0031] Description of Reference Numerals

[0032] 1. Substrate processing device

[0033] 2 Processing chamber

[0034] 3 Transport Room

[0035] 4 Load lock chamber

[0036] 5 gates

[0037] 6 Load lock panel

[0038] 7 Control Unit

[0039] 8 Loader

[0040] 42 opening

[0041] 51U door cover

[0042] 51L door cover

[0043] 55 guide rail

[0044] 61 nozzle (discharge part)

[0045] 421U Edge

[0046] 421L Edge

[0047] 422U Edge

[0048] 422L Edge

[0049] 641U exhaust port

[0050] 642U exhaust port

[0051] 643U exhaust port

[0052] 644U exhaust port

[0053] 645U exhaust port

[0054] 646U exhaust port

[0055] 641L exhaust port

[0056] 642L exhaust port

[0057] 643L exhaust port

[0058] 644L exhaust port

[0059] 645L exhaust port

[0060] 646L exhaust port. DETAILED DESCRIPTION

[0061] Hereinafter, referring to the accompanying drawings, an embodiment of the substrate processing apparatus and substrate transport method disclosed in the present invention will be described. In addition, the disclosed substrate processing apparatus and substrate transport method are not limited to this embodiment.

[0062] In a substrate processing apparatus, when processed substrates are transported to the outside, there is a possibility that processing gas adhering to the substrates may adhere to the structure provided at the opening through which the substrates are transported, causing corrosion and other structural degradation. Therefore, there is a desire for a technology that can suppress degradation of the structure provided at the opening through which the substrates are transported.

[0063] Figure 1 This figure shows an example of the schematic structure of a substrate processing apparatus 1 according to an embodiment. The figure illustrates an XYZ coordinate system. The X-axis and Y-axis directions correspond to the left-right and front-back directions of the substrate processing apparatus, respectively, with the side at the opening for feeding substrates as the front. The Z-axis direction corresponds to the vertical direction (height) of the horizontally arranged substrate processing apparatus, i.e., the vertical direction.

[0064] The substrate processing apparatus 1 includes a processing chamber 2, a transport chamber 3, a load lock chamber 4, a gate 5, a load lock panel 6, and a control unit 7. Figure 1 In the figure, the load lock panel 6 is shown removed from the gate 5. The control unit 7 is shown as a functional module. The load lock chamber 4 of the substrate processing apparatus 1 can be connected to a loader 8 on the side opposite to the transport chamber 3. The loader 8 may or may not be a component of the substrate processing apparatus 1.

[0065] In the substrate processing apparatus 1, the processing chamber 2, the transport chamber 3 and the load lock chamber 4 each have an internal space for storing substrates and the like. Adjacent internal spaces are connected to each other via openings. A structure for opening and closing is provided at the opening. An example of an opening and closing structure is a gate, one of which is shown as gate 5. By closing the opening to make the internal space airtight, each internal space can be controlled to have a different air pressure environment from each other. Examples of controllable air pressure environments are atmospheric pressure environment and reduced pressure environment. A reduced pressure environment is an environment in which the pressure is lower than that of the atmospheric pressure environment (for example, a vacuum pressure environment).

[0066] Hereinafter, the components of the substrate processing apparatus 1 will be described in order. Figure 5 The figure in the middle shows substrate G, which is referred to as substrate G hereinafter.

[0067] The processing chamber 2 is a part (module) for processing the substrate G. The processing chamber 2 is illustrated by a plurality of processing chambers 21 to 23 that can process the substrate G. The processing performed on the substrate G in the processing chambers 21 to 23 can be the same processing or different processing. An example of substrate G is a glass substrate for FPD (Flat Panel Display). Examples of FPD are liquid crystal displays, organic EL displays, etc. Other examples of substrate G are sheets or films made of flexible materials formed from synthetic resins such as polyimide. An example of substrate processing is plasma processing. Examples of plasma processing include plasma processing such as etching processing, ashing processing, and film forming processing. Various processing gases can be used in substrate processing. Examples of processing gases are chlorine-based gases containing chlorine atoms and fluorine-based gases containing fluorine atoms. Such processing gases may be corrosive gases to some components of the substrate processing device 1, for example. In particular, when mixed with an atmosphere containing moisture, its corrosiveness becomes more significant.

[0068] The transport chamber 3 is a module that transports substrates G between the processing chamber 2 and the load lock chamber 4. The substrates G can be transported by, for example, a vacuum robot. Although not shown, the transport chamber 3 includes a two-tiered transport robot that can transport substrates, namely, remove and hold processed substrates G from the processing chamber 2 and bring unprocessed substrates G into the processing chamber 2.

[0069] The load lock chamber 4 is a substrate feeding and unfeeding module that temporarily holds the substrate G in a buffer portion (not shown) provided inside, thereby serving as an intermediary for the transportation of the substrate G between the transport chamber 3 and the external space. In this example, the space possessed by the loader 8 corresponds to the external space, and the load lock chamber 4 carries out the feeding and unfeeding of the substrate G between it and the loader 8. The feeding of the substrate G includes the process of taking (feeding) the substrate G (unprocessed substrate) before being processed in the processing chamber 2 from the loader 8 into the internal space of the load lock chamber 4. The unfeeding of the substrate G includes the process of taking (feeding) the substrate G (processed substrate) processed in the processing chamber 2 from the load lock chamber 4 to the loader 8. In addition, as described above, the transport robot has a two-layer structure, and therefore the load lock chamber 4 also has a two-layer structure. Also refer to Figure 2 , the load lock chamber 4 will be described.

[0070] Figure 2 This figure shows an example of the schematic structure of the load lock chamber 4. The load lock chamber 4 includes a main body 41 and an opening 42. The main body 41 defines an internal space S. The opening 42 connects the internal space S with the external space, i.e., the loader 8. When the substrate G passes through the internal space S and is delivered to the loader 8, the internal space S is controlled to atmospheric pressure, and the loader 8 is controlled to a positive pressure relative to atmospheric pressure. Control is performed by the control unit 7, described later.

[0071] The internal space S includes an internal space SU (upper internal space) and an internal space SL (lower internal space) that are separated from each other vertically. Correspondingly, the opening 42 includes an opening 42U and an opening 42L.

[0072] The opening 42U connects the internal space SU and the loader 8. The edge portions of the opening 42U that extend in the vertical direction (Z-axis direction) are referred to as edge portions 421U in the figure. The edge portions 421U are a pair of edge portions located on the left and right sides of the opening 42U. The edge portions of the opening 42U that extend in the horizontal direction (X-axis direction) are referred to as edge portions 422U in the figure. The edge portions 422U are a pair of edge portions located above and below the opening 42U.

[0073] The opening 42L connects the internal space SL and the loader 8. The edge portions of the opening 42L that extend in the vertical direction (Z-axis direction) are referred to as edge portions 421L in the figure. The edge portions 421L are a pair of edge portions located on the left and right sides of the opening 42L. The edge portions of the opening 42L that extend in the horizontal direction (X-axis direction) are referred to as edge portions 422L in the figure. The edge portions 422L are a pair of edge portions located above and below the opening 42L.

[0074] return Figure 1 The gate 5 is provided in the opening of the load lock chamber 4, which is located on the opposite side of the load lock chamber 4 from the transport chamber 3, that is, on the loader 8 side. Figure 3 and Figure 4 Next, the gate 5 provided in the load lock chamber 4 will be described.

[0075] Figure 3 and Figure 4 It is a diagram showing an example of the schematic configuration of the load lock chamber 4 and the gate 5 . Figure 3 A half-section diagram. Figure 4 The hollow arrow in the figure schematically indicates the opening and closing direction of the valve.

[0076] The main body 41 of the load lock chamber 4 is shown as a wall defining the upper and lower surfaces and side surfaces of the internal space S. Reference numerals are assigned to several wall portions, which are shown as an upper wall 411, an intermediate wall 412, and a lower wall 413. The upper wall 411 defines the upper surface of the internal space SU within the internal space S. The intermediate wall 412 defines the lower surface of the internal space SU and the upper surface of the internal space SL within the internal space S. The lower wall 413 defines the lower surface of the internal space SL within the internal space S.

[0077] The gate 5 is provided at the opening 42. More specifically, the gate 5 includes a gate 5U, a gate 5L, and a partition wall 56. The gate 5U is an upper gate corresponding to the opening 42U. When the gate 5U is open, its opening communicates with the opening 42U. The opening of the gate 5U can define an upper transfer space between the load lock chamber 4 and the load lock panel 6, which is continuous with the internal space SU and communicates with the interior of the loader 8. The gate 5L is a lower gate corresponding to the opening 42L. When the gate 5L is open, its opening communicates with the opening 42L. The opening of the gate 5L defines a lower transfer space between the load lock chamber 4 and the load lock panel 6, which is continuous with the internal space SL and communicates with the interior of the loader 8. The partition wall 56 is provided between the gates 5U and 5L, connected to the intermediate wall 412 of the load lock chamber 4. The partition wall 56 can define the upper transfer space and a portion of the lower transfer space. Hereinafter, the upper conveyance space and the lower conveyance space are collectively referred to as a conveyance space.

[0078] The gate 5U includes a door cover 51U, a valve body 52U, a cylinder 53U, a guide block 54U, and a guide rail 55U. The door cover 51U moves up and down together with the valve body 52U disposed on the inner side of the door cover 51U. The door cover 51U moves along the edge 421U of the opening 42U of the load lock chamber 4 as the valve body 52U moves up and down. The valve body 52U moves up and down in conjunction with the cylinder 53U. The cylinder 53U is, for example, an actuator capable of controlling movement in the up and down directions. In addition, the valve body 52U is slidably connected to the guide rail 55U via the guide block 54U. The guide rail 55U guides the valve body 52U in the direction of movement. The guide rail 55U is a pair of guide rails disposed on the edge 421U of the opening 42U and extends in the up and down direction. By moving along the guide rail 55U, the valve body 52U stabilizes its up and down movement. The guide rail 55U is a portion that supports the movement of the valve body 52U, and therefore requires higher strength than other portions. An example of a material for imparting such high strength to the guide rail 55U is SUS440C.

[0079] The gate 5L includes a door cover 51L, a valve body 52L, a cylinder 53L, a guide block 54L, and a guide rail 55L. The above elements are the same as the corresponding parts of the gate 5U, so the description is omitted. In addition, the guide rail 55U and the guide rail 55L are collectively referred to as the guide rail 55 (see the following description). Figure 6 ).

[0080] Figure 5: This is a diagram schematically showing the outline structure of the substrate G, the gate 5 and the load lock chamber 4. In addition, the illustration of the load lock panel 6 is omitted. The hollow arrow extending in the horizontal direction (Y-axis direction) schematically indicates the moving direction of the substrate G. The hollow arrow extending in the longitudinal direction (Z-axis direction) schematically indicates the opening and closing direction of the gate 5. For example, when the valve body 52U moves upward and the opening 42U is opened, the substrate G supported by the arm A is sent from the loader 8 to the internal space SU via the upper transport space. In addition, the substrate G is sent from the internal space SU to the loader 8 via the upper transport space. The same description can be made for the valve body 52L. In addition, in the load lock chamber 4 and the gate 5, the sealing components for improving the airtightness are illustrated with black dots.

[0081] return Figure 1 , the load lock panel 6 is installed on the gate 5. For details about the load lock panel 6, refer to Figure 6 The following figures will be used for explanation.

[0082] The control unit 7 controls the operation of various components of the substrate processing apparatus 1. The control unit 7 includes a controller 71, a user interface 72, and a storage unit 73. The controller 71 includes a CPU, which controls the operation of, for example, the processing chamber 2, the transport chamber 3, the load lock chamber 4, the gate 5, and the nozzle 61 (described later) mounted on the load lock panel 6. The user interface 72 includes, for example, a keyboard for a process manager to input instructions for managing the substrate processing apparatus 1, and a display for visually displaying the operating status of the substrate processing apparatus 1. The storage unit 73 stores recipes, including control programs (software) and processing condition data, for implementing various processes performed by the substrate processing apparatus 1 under the control of the controller 71. The user interface 72 and the storage unit 73 are connected to the controller 71. Furthermore, as needed, arbitrary recipes are retrieved from the storage unit 73 by instructions from the user interface 72 and executed by the controller 71, thereby performing the desired process in the substrate processing apparatus 1 under the control of the controller 71. The control program and processing condition data can be stored in a computer-readable storage medium such as a CD-ROM, hard disk, floppy disk, or flash memory. Alternatively, the control program and processing condition data can be transferred from another device via a dedicated line in real time for online use.

[0083] The loader 8 is a module that transfers substrates G between the loader 8 and the load lock chamber 4. The loader 8 includes, for example, an indexer and a pair of cassettes disposed on the indexer and storing substrates G. Within the cassettes, substrates G are arranged in multiple layers, spaced apart from one another. For example, one cassette stores unprocessed substrates, while the other stores processed substrates.

[0084] Among the operations of the substrate processing apparatus 1 described above, the outline of the operations related to the transport of the substrate G is described in detail. The gate 5 is opened, and the substrate G is transported from the loader 8 to the load lock chamber 4. The gate 5 is closed, and the load lock chamber 4 is controlled from atmospheric pressure to a reduced pressure environment. The substrate G transported into the load lock chamber 4 is transported to the processing chamber 2 via the transport chamber 3. Both the transport chamber 3 and the processing chamber 2 are controlled to a reduced pressure environment. When the substrate G is transferred from the load lock chamber 4 to the transport chamber 3, the load lock chamber 4 and the transport chamber 3 are controlled to the same degree of reduced pressure environment. In the processing chamber 2, the substrate G is processed using a processing gas. After the processing is completed, the substrate G is transported to the load lock chamber 4 via the transport chamber 3. After the load lock chamber 4 is pressurized and controlled to atmospheric pressure, the gate 5 is opened, and the substrate G is sent from the load lock chamber 4 to the loader 8.

[0085] Here, when the substrate G (processed substrate) processed in the processing chamber 2 is sent to the loader 8 through the transport chamber 3 and the load lock chamber 4, the load lock chamber 4 is pressurized and controlled to atmospheric pressure, but the loader 8 can also be controlled to be a positive pressure compared to the atmospheric pressure. Therefore, an airflow from the loader 8 to the load lock chamber 4 is generated. Moreover, the substrate G (processed substrate) is attached to the processing gas. Therefore, the processing gas attached to the substrate G being sent out diffuses from the loader 8 to the load lock chamber 4, and as the airflow collides with the structure (for example, the guide rail 55 of the gate 5) provided at the edge of the opening 42 of the load lock chamber 4, it is attached thereto. The structure provided at the edge of the opening 42 is also exposed to the atmosphere, and therefore, there is a possibility of corrosion (deterioration) due to the reaction between the components of the processing gas and the moisture in the atmosphere.

[0086] In order to suppress the adhesion of the processing gas to the structure provided at the edge of the opening 42 (i.e., the deterioration of the structure), in the substrate processing apparatus 1 of the embodiment, gas is ejected from the loader 8 side toward the edge of the opening 42. Examples of the ejection mechanism (ejection portion) are a nozzle that blows out a purge gas supplied from a purge gas supply line as a gas, a fan that blows air to the surrounding gas from the loader 8 side, and the like. Hereinafter, an example in which the ejection portion is a nozzle will be described. An example of a mechanism for implementing the ejection of purge gas using a nozzle is a load lock panel 6. The load lock panel 6 is constituted by, for example, assembling a nozzle and the like in a partition between the load lock chamber 4 and the external space.

[0087] Figure 6 and Figure 7 1 is a diagram showing an example of a schematic structure of the load lock panel 6 . Figure 6 It is an exploded perspective view of the load lock chamber 4 , the gate 5 , and the load lock panel 6 . Figure 7This is a diagram showing the load lock panel 6 as viewed from the loader 8. The load lock panel 6 is disposed on the opposite side of the load lock chamber 4 with the gate 5 interposed therebetween, facing the load lock chamber 4 and the gate 5. Figure 6 and Figure 7 6 , the nozzle 61 , the opening 62 , the air supply pipe 63 , and the partition wall 66 are shown in FIG. 1 , among the components of the load lock panel 6 .

[0088] The nozzles 61 are disposed opposite the edge of the opening 42 to enable ejection of purge gas from the loader 8 side toward the edge of the opening 42 of the load lock chamber 4. Since the guide rails 55 are structures disposed at the edge of the opening 42, the nozzles 61 are disposed opposite the guide rails 55 to enable ejection of purge gas toward the guide rails 55. Specifically, the nozzles 61 include nozzles 61U and nozzles 61L. Nozzles 61U are a pair of nozzles disposed opposite the edge 421U of the opening 42U, i.e., the pair of guide rails 55U. Nozzles 61L are a pair of nozzles disposed opposite the edge 421L of the opening 42L, i.e., the pair of guide rails 55L.

[0089] Opening 62 is provided so as to communicate with opening 42 of load lock chamber 4 and the opening of gate 5. Opening 62 includes opening 62U and opening 62L. Opening 62U is provided so as to communicate with opening 42U and the opening of gate 5U. Opening 62U can define the end of the upper transport space. Opening 62L is provided so as to communicate with opening 42L and the opening of gate 5L. Opening 62L can define the end of the lower transport space.

[0090] The gas supply pipe 63 is a gas supply path (supply path) that supplies purge gas to the nozzle 61. An example of purge gas is dry gas. The gas supply pipe 63 includes a gas supply pipe 63U and a gas supply pipe 63L. The gas supply pipe 63U supplies the purge gas to the nozzle 61U. The gas supply pipe 63L supplies the purge gas to the nozzle 61L.

[0091] The partition wall 66 partitions the opening 62U and the opening 62L, and is provided so as to be connected to the partition wall 56 of the gate 5. The partition wall 66 can define an end portion of the upper conveyance space and a part of an end portion of the lower conveyance space.

[0092] The nozzle 61 is provided opposite to the guide rail 55, so the nozzle 61 ejects the purge gas toward the front of the guide rail 55. This allows the purge gas to efficiently collide with the guide rail 55. Figure 8 and Figure 9 Provide explanation.

[0093] Figure 8 and Figure 9 FIG is a diagram schematically showing the flow of the ejected purge gas. Figure 8As shown in FIG. 1 , when the purge gas is sprayed toward the side of the guide rail 55, it is difficult for the purge gas to flow in the portion opposite to the side across the guide rail 55. Therefore, in the portion where the purge gas flow is difficult to generate, the processing gas diffused from the loader 8 may adhere to the guide rail 55. Figure 9 As shown, when the purge gas is sprayed toward the front of the guide rail 55, a purge gas flow is generated on both the front and side portions of the guide rail 55. Therefore, the process gas diffused from the loader 8 is removed by the purge gas flow before reaching the guide rail 55, and is less likely to adhere to the guide rail 55. Therefore, it is preferable to spray the purge gas toward the front of the guide rail 55 rather than the side portions.

[0094] Figure 10 : is a diagram showing an example of the schematic structure of a nozzle. In this example, the nozzle 61 is a shower plate that ejects a purge gas from a plurality of holes, and includes a plate 611, a plate 612, and a sealing component 613. The plate 611 includes a port 611a, a port 611b, and a port 611c that are arranged at different positions. By selectively connecting the air supply pipe 63 to any one of the above-mentioned ports, the connection position of the air supply pipe 63 can be adjusted. In this example, the air supply pipe 63 is connected to the port 611b, and the other ports 611a and the port 611c are retained (open). In addition, the number of ports connected to the air supply pipe 63 does not necessarily need to be 3. When the position that is most suitable for ejecting gas from the plate 12 to the guide rail 55 is determined, only one can be set. In addition, a plurality of ports can be set and the most suitable position can be appropriately selected according to different conditions.

[0095] The plate 612 has a plurality of ejection holes 612a. The plurality of ejection holes 612a are arranged so as to obtain a desired flow rate, for example, a flow rate of several tens of L / min to several hundreds of L / min. The plurality of ejection holes 612a are arranged in a grid shape in the vertical direction (Z-axis direction) and the left-right direction (X-axis direction), for example. Each ejection hole 612a has, for example, a circular shape with a diameter of several mm. In addition, without being limited to the above, the plurality of ejection holes 612a can be arranged in a rhombus shape, a concentric circle shape, etc., and each ejection hole can be rectangular, oval, etc.

[0096] The plate 611 and the plate 612 are joined via a sealing member 613 to form an airtight internal space for guiding the purge gas supplied to the port (port 611 b in this example) of the plate 611 to the ejection holes 612 a of the plate 612 .

[0097] By making the nozzle 61 a shower plate, it is easy to adjust the spray range of the purge gas, for example. For example, the structure for exhausting the purge gas sprayed from the nozzle 61 as described above is also assembled to the load lock panel 6. Figure 11 Provide explanation.

[0098] Figure 11 This figure shows the load lock panel 6 as viewed from the load lock chamber 4. In addition to the nozzle 61, opening 62, gas supply pipe 63, and partition wall 66 described above, the load lock panel 6 also includes an exhaust pipe 64, exhaust ports 641U to 646U, exhaust ports 641L to 646L, and a purge gas controller 65. In this example, the gas supply pipe 63U of the gas supply pipe 63 branches at a branch point 63Ua in the upper center of the load lock panel 6, extending in the horizontal direction (X-axis direction) and connecting to the nozzle 61. The gas supply pipe 63L of the gas supply pipe 63 branches at a branch point 63La in the lower center of the load lock panel 6, extending in the horizontal direction and connecting to the nozzle 61L.

[0099] The exhaust pipe 64 is an exhaust flow path for exhausting the transport space and includes an exhaust pipe 64U and an exhaust pipe 64L.

[0100] The exhaust duct 64U is connected to exhaust ports 641U through 646U. Exhaust ports 641U through 646U exhaust the upper transfer space via a separate path from the opening 42U, the opening of the gate 5U, and the opening 62U of the load lock panel 6. Exhaust ports 641U through 646U are located near the edge 422U of the opening 42U of the load lock chamber 4 (e.g., within a range of several millimeters to several centimeters) and are arranged along the edge 422U (in the X-axis direction).

[0101] Exhaust duct 64L is connected to exhaust ports 641L through 646L. Exhaust ports 641L through 646L exhaust the lower transfer space via a separate path from opening 42L, the opening of gate 5L, and opening 62L of load lock panel 6. Exhaust ports 641L through 646L are located near edge 422L of opening 42L of load lock chamber 4 and are arranged along edge 422L (in the X-axis direction).

[0102] Exhaust duct 64U and exhaust duct 64L will be further described. Exhaust duct 64U branches at branch point 64Ua in the upper center of load lock panel 6 and extends in the left-right direction, connecting to exhaust ports 641U through 646U, respectively. Exhaust ports 641U through 646U are located above the upper transport space. Exhaust ports 641U through 646U have a central axis direction (in this example, the central axis direction in the Z-axis direction) that intersects the opening central axis direction (Y-axis direction) of opening 42U. Exhaust ports 641U through 646U are located between a pair of guide rails 55U provided on the left and right edges 421U of opening 42U. Exhaust port 641U and exhaust port 646U are located near guide rails 55U. Exhaust port 643U and exhaust port 644U are located near the center of the upper transport space. Exhaust port 642U is located between exhaust ports 641U and 643U. The exhaust port 645U is provided between the exhaust port 644U and the exhaust port 646U.

[0103] The exhaust pipe 64L branches at a branch point 64La in the lower center of the load lock panel 6 and extends in a left-right direction, connecting to exhaust ports 641L through 646L, respectively. Exhaust ports 641L through 646L are located at the lower portion of the lower transport space. Exhaust ports 641L through 646L have a central axis (in this example, the Z-axis) that intersects the central axis of the opening 42L (the Y-axis). Exhaust ports 641L through 646L are located between a pair of guide rails 55L provided at the left and right edges 421L of the opening 42L. Exhaust ports 641L and 646L are located near the guide rails 55L. Exhaust ports 643L and 644L are located near the center of the lower transport space. Exhaust port 642L is located between exhaust ports 641L and 643L. Exhaust port 645L is located between exhaust ports 644L and 646L.

[0104] As described above, exhaust ports are provided not only near the guide rail 55 but also near the center of the upper transport space and the lower transport space, thereby making it easier to exhaust the entire transport space. Figures 12 to 17 Provide explanation.

[0105] Figures 12 to 17 is a diagram schematically showing the flow of the exhaust gas. Figure 12 and Figure 13 As shown, when the exhaust port is provided only near the guide rail 55, the exhaust flow of the purge gas is formed only near the guide rail 55. Figure 14 and Figure 15 As shown, when an exhaust port is also provided between the vicinity of the guide rail 55 and the center of the transport space (in the middle position), the exhaust flow of the purge gas is also formed in the middle position. Figure 16 and Figure 17 As shown, if the exhaust port is also provided in the center of the transport space, a flow of exhaust gas of the purge gas is also formed near the center. Therefore, it is preferable to provide the exhaust port not only near the guide rail 55 but also to the center of the transport space.

[0106] return Figure 11 The purge gas controller 65 controls the supply of purge gas through the gas supply pipe 63. Examples of purge gas supply control include opening and closing the gas supply and adjusting the flow rate. Furthermore, the purge gas controller 65 controls the exhaust of the purge gas through the exhaust pipe 64. Examples of purge gas exhaust control include opening and closing the exhaust and adjusting the flow rate. To achieve the above-mentioned gas supply and exhaust control, the purge gas controller 65 may include variable valves, flow meters, and the like provided on the gas supply pipe 63 and the exhaust pipe 64.

[0107] An example of the on and off control of the gas supply and exhaust performed by the purge gas controller 65 is described. When an unprocessed substrate is sent from the loader 8 to the load lock chamber 4, the gas supply and exhaust are controlled to be closed. When a processed substrate is sent from the load lock chamber 4 to the loader 8, the gas supply and exhaust are controlled to be open. In addition, although it is not implemented in normal processing, when an unprocessed substrate is sent from the load lock chamber 4 to the loader 8 for any reason, the gas supply and exhaust are controlled to be closed. When the substrate processing device 1 is started (idle state), the gas supply and exhaust are controlled to be open. When the substrate processing device 1 is not started (shutdown state), the gas supply and exhaust are controlled to be closed. In the case where the gas supply and / or exhaust of the purge gas does not work normally, the gas supply and exhaust are controlled to be closed. In addition, the gas supply control and exhaust control performed by the purge gas controller 65 can also be performed in the control unit 7 ( Figure 1 ) is controlled. When the supply and / or exhaust of the purge gas performed by the purge gas controller 65 does not work normally (for example, when the flow rate is reduced), the control unit 7 can also perform control to issue an alarm.

[0108] Reference Figure 18 Among the operations of the substrate processing apparatus 1 described above, the operation when the substrate G is carried out from the load lock chamber 4 to the loader 8 will be described.

[0109] Figure 18 1 is a flowchart showing an example of a process (substrate transport method) executed in the substrate processing apparatus. Unless otherwise specified, each process is performed under the control of the control unit 7. Initially, the substrate G is in a pre-processed state and is located in the processing chamber 2.

[0110] In step S1, substrate processing is performed. Specifically, substrate G is processed using a processing gas (eg, a chlorine-based gas) in a processing chamber 2. Remaining processing gas that is not consumed during the processing adheres to substrate G.

[0111] In step S2, the load lock chamber is controlled to a reduced pressure environment. That is, the load lock chamber 4 is controlled to a reduced pressure environment compared to atmospheric pressure. Alternatively, the reduced pressure environment may be maintained continuously from the moment the unprocessed substrate G is transferred from the load lock chamber 4 to the processing chamber 2.

[0112] In step S3, the purge gas is ejected and exhausted. Specifically, the purge gas is supplied to nozzle 61 via gas supply pipe 63 and ejected toward guide rails 55U and 55L. This exhausts the transport space through exhaust ports 641U to 646U, 641L to 646L, and exhaust pipe 64.

[0113] In step S4, the substrate G is conveyed. Specifically, as described in step S3 above, while the purge gas is being ejected and exhausted, the substrate G is conveyed from the processing chamber 2 through the transport chamber 3 and the load lock chamber 4 to the loader 8. At this time, the substrate G transferred from the transport chamber 3 to the load lock chamber 4 temporarily remains in the load lock chamber 4. After the pressure in the load lock chamber 4 is raised to atmospheric pressure, the gate 5 is opened and the substrate G is conveyed to the loader 8. Alternatively, the ejection and exhaust of the purge gas may be initiated concurrently with the transport of the substrate G from the processing chamber 2 to the transport chamber 3, or may be initiated between the time the substrate G is transported to the transport chamber 3 and the time the gate 5 is opened.

[0114] In the above process, when the substrate G is transferred from the load lock chamber 4 to the loader 8, the transfer space is evacuated along with the ejection of the purge gas (steps S3 and S4). Therefore, as described above, it is possible to suppress the degradation of the structure (e.g., the guide rail 55) provided in the opening 42 due to the adhesion of the process gas.

[0115] The embodiments described above should be considered in all respects to be illustrative and not restrictive. The embodiments described above may be implemented in various ways. The embodiments described above may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0116] In the above embodiment, an example of exhausting the upper transport space from above is described. However, the upper transport space can also be exhausted from below. In this case, the exhaust port is provided below the upper transport space. Furthermore, the upper transport space can also be exhausted from both above and below. In this case, the exhaust ports are provided above and below within the upper transport space.

[0117] In the above embodiment, an example of exhausting the lower transport space from below is described. However, the lower transport space may also be exhausted from above. In this case, the exhaust port is provided at the upper portion of the lower transport space. Furthermore, the lower transport space may also be exhausted from both above and below. In this case, for example, the exhaust ports are provided at the upper and lower portions of the lower transport space.

[0118] For example, when the processing gas exhausted together with the purge gas is lighter than air, the gas tends to move above the upper transport space and the lower transport space. Therefore, the possibility of efficiently ejecting the gas is increased by performing the exhaust from above compared to the exhaust from below. When the processing gas exhausted together with the purge gas is heavier than air (for example, in the case of chlorine-based gas), the gas tends to move below the upper transport space and the lower transport space. Therefore, the possibility of efficiently ejecting the gas is increased by performing the exhaust from below compared to the exhaust from above. Figure 19 , which illustrates an example in which the upper transport space is also exhausted downward.

[0119] Figure 19 This is a diagram (half-sectional view) showing an example of the schematic structure of the load lock chamber 4, gate 5, nozzle 61, and exhaust pipe 64A. The load lock panel 6 is omitted except for the nozzle 61 and exhaust pipe 64A. The exhaust pipe 64A, which serves as an exhaust flow path, includes an exhaust pipe 64UA and an exhaust pipe 64LA. The exhaust pipe 64UA is connected to a plurality of exhaust ports through the edge of the partition wall 56 of the gate 5. Exhaust port 646UA and exhaust port 645UA are shown as examples of the plurality of exhaust ports. The exhaust port provided on the partition wall 56 is provided at the lower portion of the upper transport space and exhausts the upper transport space from below. Similarly to the exhaust pipe 64L, the exhaust pipe 64LA is connected to the lower exhaust port in the lower transport space, thereby exhausting the lower transport space from below.

[0120] In the above embodiment, the elements related to the ejection and exhaust of the purge gas, such as the nozzle 61 and the exhaust port 641U, are described as being incorporated into the load lock panel 6. However, the present invention is not limited to this embodiment, and the elements related to the ejection and exhaust of the purge gas may be provided in any manner in the substrate processing apparatus 1.

[0121] In the above embodiment, an example is described in which the processing chamber 2 includes three processing chambers, namely, processing chambers 21 to 23. However, the processing chamber 2 may be one processing chamber, or may be two or four or more processing chambers.

[0122] In the above embodiment, the substrate loading and unloading module is described as an example of the load lock chamber 4. However, in addition to the load lock chamber 4, any module capable of loading and unloading substrates G in the substrate processing apparatus 1 can be used as the substrate loading and unloading module.

[0123] The substrate processing apparatus 1 described above is defined as follows, for example. Figures 1 to 17 As described in the above, the substrate processing device 1 includes a substrate feeding and sending module (for example, a load lock chamber 4), an opening portion 42, a gate 5, a spray portion (for example, a nozzle 61) and an exhaust port (exhaust port 641U, etc.). The substrate feeding and sending module has an internal space S. When the substrate G is sent to an external space (for example, a loader 8) that is controlled to be at a positive pressure compared to atmospheric pressure, the internal space S is controlled to be an atmospheric pressure environment for the substrate G to pass through. The opening portion 42 is provided in the substrate feeding and sending module to connect the internal space S and the external space. The gate 5 is provided with respect to the opening portion 42 and has a transport space. The spray portion sprays a purge gas from the side of the external space to the edge of the opening portion 42. The exhaust port (641U, etc.) exhausts the transport space via a path different from the opening portion 42.

[0124] According to the substrate processing apparatus 1 described above, the purge gas is ejected from the side of the opening 42 closer to the outside space toward the edge of the opening 42. Furthermore, the transport space is exhausted via a different path from the opening 42. This prevents the processing gas adhering to the substrates G during transport from adhering to structures disposed at the edge of the opening 42. Consequently, degradation of the structures disposed at the opening 42 can be suppressed.

[0125] As reference Figure 11 As described above, a plurality of exhaust ports (exhaust ports 641U to 646U and exhaust ports 641L to 646L, etc.) may be provided along the edges 422U and 422L of the opening 42. This facilitates exhaustion of the entire transport space.

[0126] As reference Figure 11 As described above, the exhaust port may have a central axis direction (e.g., a central axis direction in the Z-axis direction) that intersects the central axis direction (Y-axis direction) of the opening 42. For example, in this way, the transport space can be exhausted in a direction different from the opening 42.

[0127] As reference Figure 11 and Figure 19 As described above, the exhaust port may include an exhaust port (exhaust port 641L, exhaust port 646UA, etc.) provided below the transport space. By exhausting the transport space downward, a gas heavier than air can be efficiently ejected.

[0128] As reference Figure 2 、 Figure 3 、 Figure 6 and Figure 11 As described in , etc., the internal space S may include an upper internal space (internal space SU) and a lower internal space (internal space SL), the transport space may include an upper transport space communicating with the upper internal space and a lower transport space communicating with the lower internal space, and an exhaust port may be provided in each of the upper transport space and the lower transport space (exhaust port 641U, etc. and exhaust port 641L, etc.). Thus, exhaust can be provided in either the upper transport space or the lower transport space.

[0129] As reference Figure 10 As described above, the ejection portion may be a shower plate. This makes it easier to adjust the ejection range of the purge gas, for example.

[0130] As reference Figure 3 、 Figure 4 、 Figure 6 and Figure 7 As described above, the gate 5 may include a valve body 52U or the like that moves along the edge 421U or the like of the opening 42, and a guide rail 55 that guides the movement of the valve body 52U or the like, with the ejection portion ejecting the purge gas toward the guide rail 55. The substrate processing apparatus 1 may also include a processing chamber 2 that processes the substrate G using a processing gas that corrodes the guide rail 55 (e.g., a processing gas containing chlorine atoms). This can suppress corrosion of the guide rail 55.

[0131] Reference Figure 18 The substrate transport method described above is also one embodiment of the present invention. Specifically, the substrate transport method includes step S3 of jetting a purge gas from the external space side (the loader 8 side) of the opening 42 toward the edge of the opening 42 in the substrate processing apparatus 1, thereby exhausting the transport space via a path separate from the opening 42. According to this substrate transport method, as described so far, it is possible to suppress deterioration of the structure provided in the opening 42.

Claims

1. A substrate processing device, characterized in that: include: a substrate feeding and discharging module having an internal space for passing substrates, wherein the internal space is controlled to be at an atmospheric pressure environment when the substrates are fed to an external space controlled to be at a positive pressure compared to atmospheric pressure; an opening portion, which is provided in the substrate feeding and discharging module and connects the internal space with the external space; The gate provided at the opening has a transport space; A jetting portion for jetting a purge gas from the external space side toward the edge of the opening; and An exhaust port for exhausting the transport space via a path different from the opening.

2. The substrate processing device according to claim 1, wherein: A plurality of exhaust ports are provided along the edge of the opening.

3. The substrate processing device according to claim 1 or 2, wherein: The exhaust port has a central axis direction intersecting with an opening central axis direction of the opening.

4. The substrate processing device according to claim 1 or 2, wherein: The exhaust port includes an exhaust port provided below the transport space.

5. The substrate processing device according to claim 1 or 2, wherein: The internal space includes an upper internal space and a lower internal space, The transport space includes an upper transport space communicating with the upper inner space and a lower transport space communicating with the lower inner space. The exhaust port is provided in each of the upper conveyance space and the lower conveyance space.

6. The substrate processing device according to claim 1 or 2, wherein: The ejection portion is a shower plate.

7. The substrate processing device according to claim 1 or 2, wherein: The substrate loading and unloading module is a load lock chamber that can be connected to a loader having the external space.

8. The substrate processing device according to claim 1 or 2, wherein: The gate includes: a valve body that can move along a first edge portion extending in a first direction among the edges of the opening; and a guide rail that guides the movement direction of the valve body. The ejection portion ejects the purge gas toward the guide rail.

9. The substrate processing device according to claim 8, wherein: A processing chamber is included for processing the substrate using a processing gas capable of corroding the guide rail.

10. The substrate processing device according to claim 9, wherein: The process gas contains chlorine atoms.

11. A substrate transport method, characterized in that: The substrate processing device includes: a substrate feeding and discharging module having an internal space for passing substrates, wherein the internal space is controlled to be at an atmospheric pressure environment when the substrates are fed to an external space controlled to be at a positive pressure compared to atmospheric pressure; an opening portion, which is provided in the substrate feeding and feeding module and connects the internal space with the external space; and The gate provided at the opening has a transport space. The substrate transport method comprises: In the substrate processing apparatus, the step includes jetting a purge gas from the outer space side of the opening toward the edge of the opening and exhausting the transfer space through a path different from the opening.

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