Wafer processing apparatus and wafer handling method
By using a fixed connection between the ejector base and the ejector rod in the wafer processing equipment and a sensor linkage, the impact problem caused by the ejector rod detaching from the base during wafer production is solved, improving production safety and equipment reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGXIN MEMORY TECH INC
- Filing Date
- 2021-11-10
- Publication Date
- 2026-07-24
AI Technical Summary
The problem of wafer ejector pins colliding with each other due to ejector pins detaching from the base during wafer manufacturing can lead to damage to equipment and products.
By setting a fixed connection (such as screw connection or snap-fit connection) between the push rod base and the push rod in the wafer processing device, and setting a sensor on the push rod path, the sensor is linked with the robotic arm to prevent the wafer pick-up and delivery action from being performed when the push rod has not reached the designated position.
It effectively avoids collisions between wafers and ejector pins, reduces damage to equipment and products, and improves the safety and reliability of wafer production.
Smart Images
Figure CN114078737B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the semiconductor field, and more particularly to a wafer processing apparatus and a wafer handling method. Background Technology
[0002] With the upgrading of semiconductor products and changes in processes, various gases may be released or by-products may condense under high-temperature conditions during wafer production. Due to design defects in the production chamber, the resulting contamination can lead to increased maintenance frequency or even damage to components or breakage.
[0003] In existing technologies, during annealing processes or silicon oxide film growth in Applied Materials' (AMAT) rapid thermal processing chambers, contaminants from byproducts or released gases can accumulate in cooler areas of the chamber, such as lift pin holes. Once the contamination reaches a certain level, the lift pins may stick to the hole walls and cannot fall freely. If this happens, the wafer may break off when the robotic arm enters the chamber, or the wafer may shatter.
[0004] Reducing the probability of equipment and products being damaged by collisions during semiconductor manufacturing processes has become an urgent problem to be solved. Summary of the Invention
[0005] The technical problem to be solved by this disclosure is to solve the problem of wafer ejector pins colliding with each other when ejector pins detach from the base during wafer manufacturing, and to provide a wafer processing device and a wafer handling method.
[0006] This disclosure provides a wafer processing apparatus, comprising: a base having a through hole; a push rod disposed within the through hole; a robotic arm for picking up and delivering wafers; and a sensor disposed on the movement path of the push rod, which senses the position of the push rod by electromagnetic induction, and the sensor is linked to the robotic arm.
[0007] In some embodiments, the wafer processing apparatus further includes a push rod base connected to the push rod and driving the push rod to move up and down within the through hole, wherein the push rod base and the push rod are fixedly connected.
[0008] In some embodiments, in the wafer processing apparatus, the push rod base and the push rod are screwed together.
[0009] In some embodiments, in the wafer processing apparatus, the push rod base and the push rod are connected by a snap-fit connection.
[0010] In some embodiments of the wafer processing apparatus, when the push rod has not reached the designated position, the sensor prevents the wafer from being picked up or fed, thus preventing the wafer from colliding with the push rod.
[0011] In some embodiments, in the wafer processing apparatus, the push rod includes a sensing point for the sensor to sense the position of the push rod.
[0012] In some embodiments, in the wafer processing apparatus, the top rod base is raised or lowered using a lifting mechanism or magnetic force control.
[0013] This disclosure provides a wafer handling method using any of the above-described wafer processing apparatus, comprising: moving a push rod to a predetermined position, a sensor issuing a command and placing the wafer; moving the push rod to a non-predetermined position, a sensor issuing a command to prohibit placing the wafer.
[0014] In some embodiments, for the wafer handling method, the step of moving the push rod to a predetermined position, the sensor issuing a command, and placing the wafer further comprises: moving the push rod to the predetermined position, the sensor issuing a command, and the robotic arm placing the wafer; the push rod rising to lift the wafer, and the robotic arm withdrawing; the push rod lowering, the wafer falling onto the base and undergoing wafer processing.
[0015] In some embodiments, the wafer handling method, after the wafer processing is completed, includes removing the wafer by: raising a push rod to lift the wafer and inserting a robotic arm; moving the push rod to a predetermined position, receiving a signal from a sensor, and having the robotic arm pull out the wafer; and lowering the push rod to complete the wafer removal.
[0016] In some embodiments, for the wafer pick-and-place method, after the wafer removal step is completed, the push rod moves to a predetermined position, and a new wafer is used to complete the cycle of wafer pick-and-place and processing.
[0017] In some embodiments, for the wafer handling method, the wafer processing apparatus further includes a push rod base, the push rod base being connected to the push rod and driving the push rod to move up and down within the through hole, and the push rod base and the push rod being fixedly connected.
[0018] In some embodiments, for the wafer handling method, the push rod base and the push rod are screwed together.
[0019] In some embodiments, for the wafer handling method, the push rod base and the push rod are connected by a snap-fit connection.
[0020] In some embodiments, for the wafer pick-and-place method, when the push rod has not reached the designated position, the sensor prevents the wafer pick-and-place action to prevent the wafer from colliding with the push rod.
[0021] In some embodiments, for the wafer pick-and-place method, the push rod includes a sensing point for the sensor to sense the position of the push rod.
[0022] In some embodiments, for the wafer handling method, the top rod base is raised or lowered using a lifting mechanism or magnetic force control.
[0023] This disclosure provides a wafer processing apparatus and a wafer handling method. By fixing the push rod to the push rod base, the problem of wafer push rod collision caused by the push rod detaching from the base during wafer production is effectively improved. By setting up sensors, the picking and feeding error of the robotic arm during wafer production is reduced, and the damage to equipment and products caused by wafer impact with the push rod is reduced.
[0024] The above description is only a preferred embodiment of this disclosure. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this disclosure, and these improvements and modifications should also be considered within the scope of protection of this disclosure. Attached Figure Description
[0025] Appendix Figure 1 The diagram shown is a schematic diagram of a wafer processing apparatus according to a specific embodiment of this disclosure.
[0026] Appendix Figure 2 The diagram shown is a schematic diagram of a wafer processing apparatus according to a specific embodiment of this disclosure.
[0027] Appendix Figure 3 The diagram shown is a schematic diagram of a wafer processing apparatus according to a specific embodiment of this disclosure.
[0028] Appendix Figure 4 The diagram shown is a schematic diagram of a wafer processing apparatus according to a specific embodiment of this disclosure.
[0029] Appendix Figure 5 The diagram shows the steps of a wafer handling method according to a specific embodiment of this disclosure. Detailed Implementation
[0030] The specific embodiments of the wafer processing apparatus and wafer handling method provided in this disclosure will be described in detail below with reference to the accompanying drawings.
[0031] Appendix Figure 1 The diagram shows a wafer processing apparatus according to a specific embodiment of this disclosure. The wafer processing apparatus includes: a base 101 having a through hole 102; a push rod 103 disposed within the through hole 102; a robotic arm (not shown) for picking up and delivering wafers 100; and a sensor 104 disposed on the movement path of the push rod 103, sensing the position of the push rod 103 by electromagnetic induction, and the sensor 104 being linked with the robotic arm.
[0032] In this specific embodiment, the wafer processing apparatus further includes a push rod base 106, which is connected to the push rod 103 and drives the push rod 103 to move up and down within the through hole 102. In the wafer processing apparatus of this specific embodiment, the push rod base 106 is raised and lowered using a lifting mechanism or magnetic force. In other specific embodiments of this disclosure, the push rod base 106 can also be raised and lowered using other methods. The push rod base 106 and the push rod 103 are fixedly connected; in this specific embodiment, the push rod base 106 and the push rod 103 are screwed together. The push rod 103 is rotated and fixed to the push rod base 106 by threads 109. Since the tightness of the threads is much higher than that of a smooth push rod, fixing it to the push rod base 106 by screwing solves the problem of the push rod 103 detaching from the base 101 and causing the wafer push rods to collide during wafer production.
[0033] In the wafer processing apparatus described in this specific embodiment, the push rod base 106 and the push rod 103 move up and down within a columnar push rod cavity 107. A sensor 104 is disposed on the outer wall of the push rod cavity 107. The push rod 103 includes a sensing point 105 for the sensor 104 to sense the position of the push rod 103. When the push rod 103 moves up and down within the push rod cavity 107, the sensor 104 can determine the position of the push rod 103 through the sensing point 105. When the push rod 103 has not reached the designated position, the sensor 104 prevents the wafer from being picked up or dropped, thus preventing the wafer 100 from colliding with the push rod 103. That is, when the push rod 103 has not returned to the designated position, the robotic arm (not shown) is not allowed to perform pick-up or drop operations to avoid damage to the equipment and products caused by the wafer 100 impacting the push rod 103.
[0034] This disclosure provides a wafer handling method using the aforementioned wafer processing apparatus, comprising: moving a push rod 103 to a predetermined position, and a sensor 104 issuing a command to place a wafer 100 thereon; moving the push rod 103 to a non-predetermined position, and a sensor 104 issuing a command to prevent the placement of the wafer 100.
[0035] Appendix Figure 5 The diagram illustrates the steps of a wafer handling method according to a specific embodiment of this disclosure. In this specific embodiment, refer to the attached diagram. Figure 5 and appendix Figure 1The wafer handling method further includes: step S51, the push rod 103 moves to a predetermined position, the sensor 104 issues a command, and the robotic arm (not shown) places the wafer 100; if the push rod 103 moves to a non-predetermined position, the sensor 104 issues a command to prevent the placement of the wafer 100; step S52, the push rod 103 rises to lift the wafer 100, and the robotic arm withdraws; step S53, the push rod 103 lowers, and the wafer 100 falls onto the base 101 for wafer processing; step S54, the push rod 103 rises to lift the wafer 100, and the robotic arm extends; step S55, the push rod 103 moves to a predetermined position, the sensor 104 issues a command, and the robotic arm withdraws the wafer 100; if the push rod 103 moves to a non-predetermined position, the sensor 104 issues a command to prevent the withdrawal of the wafer 100; step S56, the push rod 103 lowers, completing the removal of the wafer 100.
[0036] In this specific embodiment, after the wafer placement, wafer processing, and wafer removal steps are completed, the push rod 103 moves to a predetermined position and completes the cycle of wafer pick-up and processing using a new wafer.
[0037] In the wafer handling method described in this specific embodiment, the wafer processing device further includes a push rod base 106, which is connected to the push rod 103 and drives the push rod 103 to move up and down within the through hole 102. The push rod base 106 is raised and lowered using a lifting mechanism or magnetic control. The push rod base 106 and the push rod 103 are fixedly connected; in this specific embodiment, the push rod base 106 and the push rod 103 are screwed together. The push rod 103 is rotatably fixed to the push rod base 106 by threads 109. Since the tightness of the threads is much higher than that of a smooth push rod, fixing the push rod 103 to the push rod base 106 by screwing solves the problem of the push rod 103 detaching from the base 101 and causing the wafer push rods to collide during wafer production.
[0038] In this specific embodiment, the push rod base 106 and the push rod 103 move up and down within a columnar push rod cavity 107. A sensor 104 is disposed on the outer wall of the push rod cavity 107. The push rod 103 includes a sensing point 105 for the sensor 104 to sense the position of the push rod 103. When the push rod 103 moves up and down within the push rod cavity 107, the sensor 104 can determine the position of the push rod 103 through the sensing point 105. If the push rod 103 moves to a non-predetermined position, the sensor 104 issues a command to prevent the placement of the wafer 100. That is, when the push rod 103 does not reach the designated position, the sensor 104 prevents the robotic arm (not shown) from performing wafer loading / unloading actions to avoid damage to the equipment and products caused by the wafer 100 impacting the push rod 103.
[0039] The above technical solution effectively improves the problem of wafer ejector collision caused by ejector detachment from the base during wafer production by fixing the ejector pin to the ejector pin base; by setting up sensors, it reduces the error of robotic arm picking and feeding during wafer production and reduces the damage to equipment and products caused by wafer impact with ejector pin.
[0040] Appendix Figure 2 The diagram shown is a schematic representation of a wafer processing apparatus according to another specific embodiment of this disclosure. The wafer processing apparatus includes: a base 201 having a through hole 202; a push rod 203 disposed within the through hole 202; a robotic arm (not shown) for picking up and delivering wafers 200; and a sensor 204 disposed on the movement path of the push rod 203, sensing the position of the push rod 203 via electromagnetic induction, and the sensor 204 being linked with the robotic arm.
[0041] In this specific embodiment, the wafer processing apparatus further includes a push rod base 206, which is connected to the push rod 203 and drives the push rod 203 to move up and down within the through hole 202. In the wafer processing apparatus of this specific embodiment, the push rod base 206 is raised and lowered using a lifting mechanism or magnetic force. In other specific embodiments of this disclosure, the push rod base 206 can also be raised and lowered using other methods. The push rod base 206 and the push rod 203 are fixedly connected; in this specific embodiment, the push rod base 206 and the push rod 203 are screwed together. The push rod 203 is rotated and fixed to the push rod base 206 by threads 209. Since the tightness of the threads is much higher than that of a smooth push rod, fixing the push rod 203 to the push rod base 206 by screwing solves the problem of the push rod 203 detaching from the base 201 and causing the wafer push rods to collide during wafer production.
[0042] In this specific embodiment, the push rod base 206 and the push rod 203 move up and down within the columnar push rod cavity 207. The sensor 204 is disposed on the inner wall of the push rod cavity 207. The push rod 203 is made of metal. When the push rod 203 moves up and down within the push rod cavity 207, it causes a change in magnetic flux. The sensor 204 can determine the position of the push rod 203 through electromagnetic induction. When the push rod 203 has not reached the designated position, the sensor 204 prevents the wafer from being picked up or dropped, preventing the wafer 200 from colliding with the push rod 203. That is, when the push rod 203 has not returned to the designated position, the robotic arm (not shown) is not allowed to perform the picking up or dropping operation to avoid damage to the equipment and products caused by the wafer 200 hitting the push rod 203.
[0043] This disclosure provides a wafer handling method using the aforementioned wafer processing apparatus, comprising: moving a push rod 203 to a predetermined position, and a sensor 204 issuing a command to place a wafer 200 thereon; moving the push rod 203 to a non-predetermined position, and a sensor 204 issuing a command to prevent the placement of the wafer 200.
[0044] Appendix Figure 5 The diagram illustrates the steps of a wafer handling method according to a specific embodiment of this disclosure. In this specific embodiment, refer to the attached diagram. Figure 5 and appendix Figure 2 The wafer handling method further includes: Step S51, the push rod 203 moves to a predetermined position, the sensor 204 issues a command, and the robotic arm (not shown) places the wafer 200; if the push rod 203 moves to a non-predetermined position, the sensor 204 issues a command to prevent the placement of the wafer 200; Step S52, the push rod 203 rises to lift the wafer 200, and the robotic arm withdraws; Step S53, the push rod 203 lowers, and the wafer 200 falls onto the base 201 for wafer processing; Step S54, the push rod 203 rises to lift the wafer 200, and the robotic arm extends; Step S55, the push rod 203 moves to a predetermined position, the sensor 204 issues a command, and the robotic arm withdraws the wafer 200; if the push rod 203 moves to a non-predetermined position, the sensor 204 issues a command to prevent the withdrawal of the wafer 200; Step S56, the push rod 203 lowers, completing the removal of the wafer 200.
[0045] In this specific embodiment, after the wafer placement, wafer processing, and wafer removal steps are completed, the push rod 203 moves to a predetermined position and completes the cycle of wafer pick-up and processing using a new wafer.
[0046] In the wafer handling method described in this specific embodiment, the wafer processing device further includes a push rod base 206, which is connected to the push rod 203 and drives the push rod 203 to move up and down within the through hole 202. The push rod base 206 is raised and lowered using a lifting mechanism or magnetic control. The push rod base 206 and the push rod 203 are fixedly connected; in this specific embodiment, the push rod base 206 and the push rod 203 are screwed together. The push rod 203 is rotatably fixed to the push rod base 206 by threads 209. Since the tightness of the threads is much higher than that of a smooth push rod, fixing the push rod 203 to the push rod base 206 by screwing solves the problem of the push rod 203 detaching from the base 201 and causing the wafer push rods to collide during wafer production.
[0047] In this specific embodiment, the push rod base 206 and the push rod 203 move up and down within the columnar push rod cavity 207. The sensor 204 is disposed on the inner wall of the push rod cavity 207. The push rod 203 is made of metal. When the push rod 203 moves up and down within the push rod cavity 207, it causes a change in magnetic flux. The sensor 204 can determine the position of the push rod 203 through electromagnetic induction. If the push rod 203 moves to a position other than the predetermined position, the sensor 204 issues a command to prohibit the insertion of the wafer 200. That is, when the push rod 203 does not reach the designated position, the sensor 204 prevents the robotic arm (not shown) from performing wafer feeding or picking actions to avoid damage to the equipment and products caused by the wafer 200 impacting the push rod 203.
[0048] The above technical solution effectively improves the problem of wafer ejector collision caused by ejector detachment from the base during wafer production by fixing the ejector pin to the ejector pin base; by setting up sensors, it reduces the error of robotic arm picking and feeding during wafer production and reduces the damage to equipment and products caused by wafer impact with ejector pin.
[0049] Appendix Figure 3 The diagram shown is a schematic of a wafer processing apparatus according to another specific embodiment of this disclosure. The wafer processing apparatus includes: a base 301 having a through hole 302; a push rod 303 disposed within the through hole 302; a robotic arm (not shown) for picking up and delivering wafers 300; and a sensor 304 disposed on the movement path of the push rod 303, sensing the position of the push rod 303 by electromagnetic induction, and the sensor 304 being linked with the robotic arm.
[0050] In this specific embodiment, the wafer processing apparatus further includes a push rod base 306, which is connected to the push rod 303 and drives the push rod 303 to move up and down within the through hole 302. In the wafer processing apparatus of this specific embodiment, the push rod base 306 is raised and lowered using a lifting mechanism or magnetic force. In other specific embodiments of this disclosure, the push rod base 306 may also be raised and lowered using other methods. The push rod base 306 and the push rod 303 are fixedly connected. In this specific embodiment, the push rod base 306 and the push rod 303 are connected by a snap-fit connection. The push rod is fixed to the push rod base 306 by a snap-fit 309. Since the snap-fit is much tighter than the smooth push rod, fixing the push rod 303 to the push rod base 306 by the snap-fit solves the problem of the push rod 303 detaching from the base 301 and causing the wafer push rods to collide during wafer production.
[0051] In the wafer processing apparatus described in this specific embodiment, the push rod base 306 and the push rod 303 move up and down within a columnar push rod cavity 307. A sensor 304 is disposed on the outer wall of the push rod cavity 307. The push rod 303 includes a sensing point 305 for the sensor 304 to sense the position of the push rod 303. When the push rod 303 moves up and down within the push rod cavity 307, the sensor 304 can determine the position of the push rod 303 through the sensing point 305. When the push rod 303 has not reached the designated position, the sensor 304 prevents the wafer from being picked up or dropped, preventing the wafer 300 from colliding with the push rod 303. That is, when the push rod 303 has not returned to the designated position, the robotic arm (not shown) is not allowed to perform pick-up or drop operations to avoid damage to the equipment and products caused by the wafer 300 impacting the push rod 303.
[0052] This disclosure provides a wafer handling method using the aforementioned wafer processing apparatus, comprising: moving a push rod 303 to a predetermined position, and a sensor 304 issuing a command to place a wafer 300 thereon; moving the push rod 303 to a non-predetermined position, and a sensor 304 issuing a command to prevent the placement of the wafer 300.
[0053] Appendix Figure 5 The diagram illustrates the steps of a wafer handling method according to a specific embodiment of this disclosure. In this specific embodiment, refer to the attached diagram. Figure 5 and appendix Figure 3 The wafer handling method further includes: Step S51, the push rod 303 moves to a predetermined position, the sensor 304 issues a command, and the robotic arm (not shown) places the wafer 300; if the push rod 303 moves to a non-predetermined position, the sensor 304 issues a command to prevent the placement of the wafer 300; Step S52, the push rod 303 rises to lift the wafer 300, and the robotic arm withdraws; Step S53, the push rod 303 lowers, and the wafer 300 falls onto the base 301 for wafer processing; Step S54, the push rod 303 rises to lift the wafer 300, and the robotic arm extends; Step S55, the push rod 303 moves to a predetermined position, the sensor 304 issues a command, and the robotic arm withdraws the wafer 300; if the push rod 303 moves to a non-predetermined position, the sensor 304 issues a command to prevent the withdrawal of the wafer 300; Step S56, the push rod 303 lowers, completing the removal of the wafer 300.
[0054] In this specific embodiment, after the wafer placement, wafer processing, and wafer removal steps are completed, the push rod 303 moves to a predetermined position and uses a new wafer to complete the cycle of wafer pick-up and processing.
[0055] In the wafer handling method described in this specific embodiment, the wafer processing device further includes a push rod base 306. The push rod base 306 is connected to the push rod 303 and drives the push rod 303 to move up and down within the through hole 302. The push rod base 306 is raised and lowered using a lifting mechanism or magnetic control. The push rod base 306 and the push rod 303 are fixedly connected. In this specific embodiment, the push rod base 306 and the push rod 303 are connected by a snap-fit. The push rod is fixed to the push rod base 306 by a snap-fit 309. Since the snap-fit is much tighter than the smooth push rod, fixing the push rod 303 to the push rod base 306 by the snap-fit solves the problem of the push rod 303 detaching from the base 301 and causing the wafer push rods to collide during wafer production.
[0056] In this specific embodiment, the push rod base 306 and the push rod 303 move up and down within a columnar push rod cavity 307. A sensor 304 is disposed on the outer wall of the push rod cavity 307. The push rod 303 includes a sensing point 305 for the sensor 304 to sense the position of the push rod 303. When the push rod 303 moves up and down within the push rod cavity 307, the sensor 304 can determine the position of the push rod 303 through the sensing point 305. If the push rod 303 moves to a non-predetermined position, the sensor 304 issues a command to prohibit the insertion of the wafer 300. That is, when the push rod 303 does not reach the designated position, the sensor 304 prevents the robotic arm (not shown) from performing wafer feeding / retrieving actions to avoid damage to the equipment and products caused by the wafer 300 impacting the push rod 303.
[0057] The above technical solution effectively improves the problem of wafer ejector collision caused by ejector detachment from the base during wafer production by fixing the ejector pin to the ejector pin base; by setting up sensors, it reduces the error of robotic arm picking and feeding during wafer production and reduces the damage to equipment and products caused by wafer impact with ejector pin.
[0058] Appendix Figure 4 The diagram shown is a schematic representation of a wafer processing apparatus according to another specific embodiment of this disclosure. The wafer processing apparatus includes: a base 401 having a through hole 402; a push rod 403 disposed within the through hole 402; a robotic arm (not shown) for picking up and delivering wafers 400; and a sensor 404 disposed on the movement path of the push rod 403, sensing the position of the push rod 403 via electromagnetic induction, and the sensor 404 being linked with the robotic arm.
[0059] In this specific embodiment, the wafer processing apparatus further includes a push rod base 406, which is connected to the push rod 403 and drives the push rod 403 to move up and down within the through hole 402. In the wafer processing apparatus of this specific embodiment, the push rod base 406 is raised and lowered using a lifting mechanism or magnetic force. In other specific embodiments of this disclosure, the push rod base 406 can also be raised and lowered using other methods. The push rod base 406 and the push rod 403 are fixedly connected; in this specific embodiment, the push rod base 406 and the push rod 403 are connected by a snap-fit connection. The push rod is fixed to the push rod base 406 by a snap-fit 409. Since the snap-fit is much tighter than a smooth push rod, fixing the push rod 403 to the push rod base 406 by the snap-fit solves the problem of the push rod 403 detaching from the base 401 and causing collisions between wafer push rods during wafer production.
[0060] In this specific embodiment, the push rod base 406 and the push rod 403 move up and down within a columnar push rod cavity 407. A sensor 404 is disposed on the inner wall of the push rod cavity 407. The push rod 403 is made of metal. When the push rod 403 moves up and down within the push rod cavity 407, it causes a change in magnetic flux. The sensor 404 can determine the position of the push rod 403 through electromagnetic induction. When the push rod 403 has not reached the designated position, the sensor 404 prevents the wafer from being picked up or dropped, preventing the wafer 400 from colliding with the push rod 403. That is, when the push rod 403 has not returned to the designated position, the robotic arm (not shown) is not allowed to perform pick-up or drop operations to avoid damage to the equipment and products caused by the wafer 400 impacting the push rod 403.
[0061] This disclosure provides a wafer handling method using the aforementioned wafer processing apparatus, comprising: moving a push rod 403 to a predetermined position, and a sensor 404 issuing a command to place a wafer 400 thereon; moving the push rod 403 to a non-predetermined position, and a sensor 404 issuing a command to prevent the placement of the wafer 400.
[0062] Appendix Figure 5 The diagram illustrates the steps of a wafer handling method according to a specific embodiment of this disclosure. In this specific embodiment, refer to the attached diagram. Figure 5 and appendix Figure 4The wafer handling method further includes: Step S51, the push rod 403 moves to a predetermined position, the sensor 404 issues a command, and the robotic arm (not shown) places the wafer 400; if the push rod 403 moves to a non-predetermined position, the sensor 404 issues a command to prevent the placement of the wafer 400; Step S52, the push rod 403 rises to lift the wafer 400, and the robotic arm withdraws; Step S53, the push rod 403 lowers, and the wafer 400 falls onto the base 401 for wafer processing; Step S54, the push rod 403 rises to lift the wafer 400, and the robotic arm (not shown) extends in; Step S55, the push rod 403 moves to a predetermined position, the sensor 404 issues a command, and the robotic arm withdraws the wafer 400; if the push rod 403 moves to a non-predetermined position, the sensor 404 issues a command to prevent the withdrawal of the wafer 400; Step S56, the push rod 403 lowers, completing the removal of the wafer 400.
[0063] In this specific embodiment, after the wafer placement, wafer processing, and wafer removal steps are completed, the push rod 403 moves to a predetermined position and completes the cycle of wafer pick-up and processing using a new wafer.
[0064] In the wafer handling method described in this specific embodiment, the wafer processing device further includes a push rod base 406. The push rod base 406 is connected to the push rod 403 and drives the push rod 403 to move up and down within the through hole 402. The push rod base 406 is raised and lowered using a lifting mechanism or magnetic control. The push rod base 406 and the push rod 403 are fixedly connected. In this specific embodiment, the push rod base 406 and the push rod 403 are connected by a snap-fit. The push rod is fixed to the push rod base 406 by a snap-fit 409. Since the snap-fit is much tighter than the smooth push rod, fixing the push rod 403 to the push rod base 406 by the snap-fit solves the problem of the push rod 403 detaching from the base 401 and causing the wafer push rods to collide during wafer production.
[0065] In this specific embodiment, the push rod base 406 and the push rod 403 move up and down within a columnar push rod cavity 407. A sensor 404 is disposed on the inner wall of the push rod cavity 407. The push rod 403 is made of metal. When the push rod 403 moves up and down within the push rod cavity 407, it causes a change in magnetic flux. The sensor 404 can then determine the position of the push rod 403 through electromagnetic induction. If the push rod 403 moves to a position other than the predetermined one, the sensor 404 issues a command to prevent the insertion of the wafer 400. That is, when the push rod 403 has not reached the designated position, the sensor 404 prevents the robotic arm (not shown) from performing wafer feeding / retrieving actions to avoid damage to the equipment and products caused by the wafer 400 impacting the push rod 403.
[0066] The above technical solution effectively improves the problem of wafer ejector collision caused by ejector detachment from the base during wafer production by fixing the ejector pin to the ejector pin base; by setting up sensors, it reduces the error of robotic arm picking and feeding during wafer production and reduces the damage to equipment and products caused by wafer impact with ejector pin.
[0067] The above description is only a preferred embodiment of this disclosure. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this disclosure, and these improvements and modifications should also be considered within the scope of protection of this disclosure.
Claims
1. A wafer processing apparatus, characterized in that, include: A base having a through hole; A push rod is disposed within the through hole; A robotic arm used for picking up and delivering wafers; A sensor is installed on the moving path of the push rod and senses the position of the push rod by electromagnetic induction. The sensor is linked with the robotic arm. The wafer processing apparatus further includes a push rod base, which is connected to the push rod and drives the push rod to move up and down within the through hole. The push rod base and the push rod are fixedly connected. The push rod includes a sensing point for the sensor to sense the position of the push rod; The top rod base is raised and lowered using lifting machinery or magnetic control.
2. The wafer processing apparatus according to claim 1, characterized in that, The base of the top rod and the top rod are connected by screws.
3. The wafer processing apparatus according to claim 1, characterized in that, The base of the top rod and the top rod are connected by a snap-fit mechanism.
4. The wafer processing apparatus according to claim 1, characterized in that, When the push rod does not reach the designated position, the sensor prevents the wafer from being picked up or delivered, thus preventing the wafer from colliding with the push rod.
5. A wafer handling method, employing the wafer processing apparatus according to any one of claims 1-4, characterized in that, include: The push rod moves to the predetermined position, the sensor issues a command, and the wafer is inserted; If the push rod moves to an unintended position, the sensor will issue a command to prevent the wafer from being placed.
6. The wafer handling method according to claim 5, characterized in that, The steps for moving the push rod to the predetermined position, receiving a command from the sensor, and inserting the wafer are as follows: The push rod moves to the predetermined position, the sensor sends a command, and the robotic arm places the wafer; The push rod rises to lift the wafer, and the robotic arm pulls it out; The push rod is lowered, and the wafer falls onto the base for wafer processing.
7. The wafer handling method according to claim 6, characterized in that, After the wafer processing is completed, the wafer is removed, including: The push rod rises to lift the wafer, and the robotic arm extends in; The push rod moves to the predetermined position, the sensor sends a command, and the robotic arm extracts the wafer; The push rod is lowered, completing the removal of the wafer.
8. The wafer handling method according to claim 7, characterized in that, After the wafer processing is completed and the wafer removal step is finished, the push rod moves to the predetermined position and a new wafer is used to complete the cycle of wafer pick-up and processing.
9. The wafer handling method according to claim 5, characterized in that, The wafer processing apparatus further includes a push rod base, which is connected to the push rod and drives the push rod to move up and down within the through hole. The push rod base and the push rod are fixedly connected.
10. The wafer handling method according to claim 9, characterized in that, The base of the top rod and the top rod are connected by screws.
11. The wafer handling method according to claim 9, characterized in that, The base of the top rod and the top rod are connected by a snap-fit mechanism.
12. The wafer handling method according to claim 5, characterized in that, The push rod includes a sensing point for the sensor to sense the position of the push rod.
13. The wafer handling method according to claim 5, characterized in that, The top rod base is raised and lowered using lifting machinery or magnetic control.