A substrate integrated with a passive device and a method of manufacturing the same
By integrating passive components on both sides of the dielectric layer, the problems of large size and high power consumption of passive components on RF PCBs are solved, realizing the miniaturization and high-performance integration of RF devices, reducing costs and improving the flexibility of circuit design.
CN114121929BActive Publication Date: 2026-05-26BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2021-11-11
- Publication Date
- 2026-05-26
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Figure CN114121929B_ABST
Abstract
The present disclosure provides a substrate integrated with a passive device and a preparation method thereof, and belongs to the technical field of radio frequency devices. The present disclosure provides a preparation method of a substrate integrated with a passive device, which comprises: providing a dielectric layer, the dielectric layer comprising a first surface and a second surface oppositely arranged along the thickness direction thereof, and the dielectric layer having a first connecting via hole penetrating through the thickness direction thereof; forming a first transfer electrode in the first connecting via hole; and integrating a sub-circuit on the first surface and the second surface of the dielectric layer respectively, the sub-circuit comprising at least a passive device, and the first transfer electrode electrically connecting the sub-circuit on the first surface and the sub-circuit on the second surface.
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