An ultra-thin airborne active phased array weather radar antenna architecture

Abstract

The application provides an ultra-thin airborne active phased array weather radar antenna architecture for X-band airborne weather detection, which comprises a metal integral bearing frame for bearing the whole antenna, a microwave multilayer printed circuit board fixed on one side of the metal integral bearing frame, a plurality of microwave chips fixed on the microwave multilayer printed circuit board and a metal shielding cover plate arranged on the other side of the metal integral bearing frame, wherein the metal integral bearing frame is provided with a plurality of chamfered rectangular frames, each chamfered rectangular frame corresponds to one microwave chip, and the positions of the microwave chips on the microwave multilayer printed circuit board are periodically arranged. The antenna architecture integrates the bearing structure, the feed network and the radio frequency receiving and transmitting channel of the phased array system, realizes the reduction of the overall thickness and weight, and makes the thickness reduced by more than 1 / 3; and a multifunctional heat dissipation shielding cover plate is used to conduct the heat of the radio frequency chips to the upper part of the chips, so that the natural convection heat dissipation is realized.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of radio frequency systems, and particularly relates to an ultra-thin airborne active phased array weather radar antenna architecture. BACKGROUND

[0002] The active phased array antenna system mainly comprises a system mechanical bearing structure, a regularly arranged radiator array, a regularly arranged radio frequency transceiver channel array, a feeding network and an auxiliary control power supply interface circuit. The system mechanical bearing structure, the radio frequency transceiver channel and the feeding network are main components of volume and weight.

[0003] The existing active phased array antenna X-band radio frequency transceiver channel includes a single channel, a double channel, a four-channel or a sixteen-channel, etc. The radio frequency transceiver channel array is loaded on the system mechanical bearing structure. The radio frequency chip inside the radio frequency transceiver channel works to generate heat. The heat is conducted to the radio frequency transceiver channel shell through the bottom of the chip, and then is conducted to the heat sink through the system mechanical bearing structure for liquid cooling or air cooling.

[0004] Main disadvantage one: the radio frequency transceiver channel metal shell and the phased array system mechanical bearing structure have two layers of metal structures, which are relatively large in thickness and weight.

[0005] Main disadvantage two: the heat dissipation layer is at the bottom of the radio frequency transceiver channel, which is suitable for air cooling and liquid cooling, but not suitable for natural convection cooling.

[0006] Therefore, the existing airborne phased array antenna system is not suitable for civil aircraft weather radar applications, and an antenna structure with smaller thickness and weight and using natural convection cooling is needed. SUMMARY

[0007] The application aims to solve the above technical problems and reduce the thickness and weight.

[0008] The application aims to provide an X-band ultra-thin airborne active phased array weather radar antenna architecture suitable for an aperture size area of 0.15-0.5m 2 , which comprises a metal overall bearing frame for bearing, a microwave multilayer printed circuit board fixed on one side of the metal overall bearing frame, a plurality of microwave chips fixed on the microwave multilayer printed circuit board, and a metal shielding cover plate arranged on the other side of the metal overall bearing frame, wherein the metal overall bearing frame is provided with a plurality of chamfered rectangular frames, each chamfered rectangular frame corresponds to one microwave chip and a plurality of resistance-capacitance devices, and the positions of the microwave chips on the microwave multilayer printed circuit board are periodically arranged.

[0009] The ultra-thin airborne active phased array weather radar antenna architecture has the feature that the metal overall bearing frame is provided with a mounting piece for mounting on an airborne platform.

[0010] The ultra-thin airborne active phased array weather radar antenna architecture also has the feature that the microwave multilayer printed circuit board also integrates a feed network, a radiator array, a radio frequency via, a blind hole, and a chip array control and power supply network. The microwave multilayer printed circuit board uses a microwave board on the radiator side, uses a microwave board on the microwave chip side, and uses a low-frequency board for the chip array control and power supply network.

[0011] The ultra-thin airborne active phased array weather radar antenna architecture also has the feature that the feed network includes an integrated microstrip line form and a stripline form. The collection port of the feed network is on the side of the microwave multilayer printed circuit board outside the antenna array. The power combining device used by the feed network uses a Wilkinson power divider.

[0012] The ultra-thin airborne active phased array weather radar antenna architecture also has the feature that when the feed network is in the form of a microstrip line, one side of the metal overall bearing frame is provided with a slot corresponding to the feed network.

[0013] The ultra-thin airborne active phased array weather radar antenna architecture also has the feature that the metal overall bearing frame is provided with an array of screws, which are distributed at the four corners of the antenna array unit and used to fasten the microwave multilayer printed circuit board.

[0014] The ultra-thin airborne active phased array weather radar antenna architecture also has the feature that the metal overall bearing frame is connected to the microwave multilayer printed circuit board by welding.

[0015] The ultra-thin airborne active phased array weather radar antenna architecture also has the feature that the microwave chip package is provided, and the heat dissipation structure of the package is on the top.

[0016] The ultra-thin airborne active phased array weather radar antenna architecture also has the feature that the metal shielding cover plate, the microwave multilayer printed circuit board, and the chamfered rectangular frame form an electromagnetic shielding space, and the microwave chip is arranged in the electromagnetic shielding space.

[0017] The ultra-thin airborne active phased array weather radar antenna architecture also has the feature that the microwave chip conducts heat between the metal shielding cover plate and the heat-conducting pad, and the metal shielding cover plate is provided with a boss on the inner side for contacting the heat-conducting pad and a heat sink on the outer side for heat dissipation.

[0018] The ultra-thin airborne active phased array weather radar antenna architecture has the characteristics that the metal shielding cover plate can be selected as one chamfered rectangular frame, two chamfered rectangular frames or multiple chamfered rectangular frames.

[0019] Compared with the prior art, the present application has the following beneficial effects:

[0020] The ultra-thin airborne active phased array weather radar antenna architecture provided by the present application integrates the mechanical bearing structure, the heat dissipation structure, the feed network and the radio frequency transceiver channel of the active phased array antenna system, realizes the reduction of the overall thickness and weight, and reduces the thickness by more than 1 / 3; and the multi-functional shielding cover plate is used to change the heat conduction of the radio frequency chip to the upper part of the chip, and natural convection heat dissipation is realized. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Figure 1 The cross-sectional view of adjacent two units extracted from the array when the microstrip line form feed network is used in the array antenna architecture provided by the embodiment of the present application;

[0023] Figure 2 The top view of adjacent four units extracted from the array when the microstrip line form feed network is used in the array antenna architecture provided by the embodiment of the present application;

[0024] Figure 3 The cross-sectional view of the microwave multilayer printed circuit board when the microstrip line form feed network is used in the array antenna architecture provided by the embodiment of the present application;

[0025] Figure 4 The cross-sectional view of adjacent two units extracted from the array when the stripline form feed network is used in the array antenna architecture provided by the embodiment of the present application;

[0026] Figure 5 The top view of adjacent four units extracted from the array when the stripline feed network is used in the array antenna architecture provided by the embodiment of the present application;

[0027] Figure 6 The cross-sectional view of the microwave multilayer printed circuit board when the stripline feed network is used in the array antenna architecture provided by the embodiment of the present application;

[0028] Figure 7Structure schematic diagram of one side of the metal overall bearing frame in the array antenna architecture provided by the embodiment of the present application when a microstrip line form feeding network is adopted;

[0029] Figure 8 Structure schematic diagram of the other side of the metal overall bearing frame in the array antenna architecture provided by the embodiment of the present application when a microstrip line form feeding network is adopted;

[0030] Figure 9 Sectional view of the metal overall bearing frame in the array antenna architecture provided by the embodiment of the present application when a microstrip line form feeding network is adopted. DETAILED DESCRIPTION

[0031] In order to make the technical means, creative features, purposes and effects realized by the present application easy to understand, the following embodiments are combined with the drawings to specifically describe the antenna architecture provided by the present application.

[0032] In the description of the embodiments of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0033] In addition, the terms "first", "second", "third" and the like are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0034] The terms "mounting", "connecting", "connecting" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood through specific circumstances.

[0035] As Figures 1-9As shown, the embodiment of the present application provides an ultra-thin airborne active phased array weather radar antenna architecture, which comprises a metal overall carrying frame 1 for carrying, a microwave multilayer printed circuit board 5 fixed on one side of the metal overall carrying frame 1, a plurality of microwave chips 4 fixed on the microwave multilayer printed circuit board 5, and a metal shielding cover plate 2 arranged on the other side of the metal overall carrying frame 1, wherein the metal overall carrying frame 1 is provided with a plurality of chamfered rectangular frames, each chamfered rectangular frame corresponds to one microwave chip 4 and a plurality of resistance-capacitance devices 8, and the positions of the microwave chips 4 on the microwave multilayer printed circuit board 5 are periodically arranged. The metal shielding cover plate 2 is assembled on the top of the metal overall carrying frame 1 to shield the microwave signal, increase the strength of the carrying frame, and conduct and dissipate the heat generated by the circuit.

[0036] In some embodiments, the metal overall carrying frame 1 is provided with a mounting part for mounting on an airborne platform.

[0037] In some embodiments, the microwave multilayer printed circuit board 5 further integrates a feed network 10 and 17, a radiator array 12, a radio frequency via hole 15, a blind hole 19, and a control and power supply network 16 of the chip array. The microwave multilayer printed circuit board 5 uses thicker microwave board material 13 on one side of the radiator 12, uses thinner microwave board material 14 on the side of the microwave chip 4, and uses low-frequency board material for the control and power supply network 16 of the chip array.

[0038] In some embodiments, the feed network includes integrated microstrip line and stripline forms. The power combining device used by the feed network uses wilkinson power divider 11 and 18.

[0039] In some embodiments, when the feed network is in the form of a microstrip line, the metal overall carrying frame 1 is provided with a slot 7 corresponding to the feed network on one side.

[0040] In some embodiments, the metal overall carrying frame 1 is provided with a screw array 6 distributed on the four corners of the antenna array unit for fastening the microwave multilayer printed circuit board 5.

[0041] In some embodiments, the microwave chip 4 is packaged, and the heat dissipation structure of the packaging is on the top. The microwave chip 4 is the main radio frequency functional component of the unit and is also the main heat generating component.

[0042] In some embodiments, an electromagnetic shielding space 9 is formed between the metal shielding cover plate 2, the microwave multilayer printed circuit board 5, and the chamfered rectangular frame, and the microwave chip 4 is arranged in the electromagnetic shielding space 9.

[0043] In some embodiments, the microwave chip 4 is thermally connected to the metal shielding cover plate 2 through a thermal pad 3, and the metal shielding cover plate 2 is internally provided with a boss for contacting the thermal pad and externally provided with a heat dissipation fin for heat dissipation.

[0044] In some embodiments, the metal shielding cover plate 2 can be selected to correspond to one chamfered rectangular frame, two chamfered rectangular frames or multiple chamfered rectangular frames.

[0045] The above description is merely preferred embodiments of the present application but not to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application. The above description is merely preferred embodiments of the present application but not to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An ultra-thin airborne active phased array weather radar antenna architecture, operating in X-band, suitable for aperture size area of 0.15-0.5 m 2 characterized in that The architecture includes a metal overall carrying frame for carrying the whole antenna, a microwave multilayer printed circuit board fixed on one side of the metal overall carrying frame, a plurality of microwave chips fixed on the microwave multilayer printed circuit board, and a metal shielding cover plate arranged on the other side of the metal overall carrying frame, wherein the metal overall carrying frame is provided with a plurality of chamfered rectangular frames, each chamfered rectangular frame corresponds to one microwave chip and a plurality of resistance-capacitance devices, and the positions of the microwave chips on the microwave multilayer printed circuit board are arranged periodically, The microwave multilayer printed circuit board is also integrated with a feeding network, a radiator array, a radio frequency via, a blind hole, and a control and power supply network of the chip array, the microwave multilayer printed circuit board uses a microwave board on the side of the radiator, uses a microwave board on the side of the microwave chip, and uses a low-frequency board for the control and power supply network of the chip array.

2. The ultra-thin airborne active phased array weather radar antenna architecture of claim 1, wherein, The metal overall carrying frame is provided with a mounting part for mounting on an airborne platform.

3. The ultra-thin airborne active phased array weather radar antenna architecture of claim 1, wherein, The feeding network includes a microstrip line form and a strip line form, the feeding network combines the microwave signals received by each unit of the antenna array and transmits them to the collection port on the side of the microwave multilayer printed circuit board outside the antenna array, the feeding network also transmits the transmission excitation signal power provided by the collection port on the side of the microwave multilayer printed circuit board outside the antenna array to each unit of the antenna array, and the power dividing device used by the feeding network uses a Wilkinson power divider.

4. The ultra-thin airborne active phased array weather radar antenna architecture of claim 3, wherein, When the feeding network is in the form of a microstrip line, the side of the metal overall carrying frame is provided with a slot corresponding to the feeding network.

5. The ultra-thin airborne active phased array weather radar antenna architecture of claim 1, wherein, The metal overall carrying frame is provided with an array of screws, and the screws are distributed at the four corners of the antenna array unit.

6. The ultra-thin airborne active phased array weather radar antenna architecture of claim 1, wherein, The metal overall carrying frame is also connected to the microwave multilayer printed circuit board by welding.

7. The ultra-thin airborne active phased array weather radar antenna architecture of claim 1, wherein, The microwave chip package is arranged, and the heat dissipation structure of the package arrangement is on the top.

8. The ultra-thin airborne active phased array weather radar antenna architecture of claim 1, wherein, The metal shielding cover plate, the microwave multilayer printed circuit board, and the chamfered rectangular frame form an electromagnetic shielding space of the antenna array unit, and the microwave chip is arranged in the electromagnetic shielding space.

9. The ultra-thin airborne active phased array weather radar antenna architecture of claim 8, wherein, The microwave chip conducts heat between the metal shielding cover plate and the heat-conducting pad, the inside of the metal shielding cover plate is provided with a boss for contacting the heat-conducting pad, and the outside is provided with a heat sink for heat dissipation.

10. The ultra-thin airborne active phased array weather radar antenna architecture of claim 8, wherein, The metal shielding cover plate corresponds to one chamfered rectangular frame, two chamfered rectangular frames, or a plurality of chamfered rectangular frames.

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