Electronic device and foreign body detection method

Abstract

The present application provides an electronic device and a foreign body detection method. The electronic device includes a first shell, a first conductive member, a second conductive member, and a processor. The first shell has a receiving space, and the first shell has a first through hole connected to the receiving space. The first conductive member is installed in the first shell, the first conductive member covers the first through hole, and the first conductive member has a plurality of first through holes connected to the first through holes. The second conductive member is arranged in the receiving space and is spaced apart from the first conductive member. The second conductive member is farther away from the first through hole than the first conductive member, and at least part of the positive projection of the second conductive member on the first conductive member is located in the first conductive member to form a capacitor with the first conductive member. The processor electrically connects the first conductive member and the second conductive member, and the processor is used to detect changes in the capacitance parameters of the capacitor. When a foreign object falls on the first conductive member or the second conductive member, the capacitance parameters of the capacitor will be changed. Therefore, it can be judged whether there is a foreign object on the capacitor based on the change in the capacitance parameters.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to electronic equipment and foreign body detection methods. Background Art

[0002] For various reasons, electronic device casings often have holes to facilitate airflow between the inside and outside of the casing. To prevent foreign matter from entering the casing, shielding structures are often installed. While foreign matter prevents entry, it can accumulate on the shielding structures, affecting airflow. Currently, electronic devices cannot detect whether foreign matter is on the shielding structures. Summary of the Invention

[0003] In view of this, a first aspect of the present application provides an electronic device, including:

[0004] A first shell having a receiving space, wherein the first shell has a first through hole communicating with the receiving space;

[0005] a first conductive member, mounted on the first housing, covering the first via hole, and having a plurality of first through holes communicating with the first via hole;

[0006] a second conductive member disposed in the receiving space and spaced apart from the first conductive member, the second conductive member being farther away from the first via hole than the first conductive member, and at least a portion of an orthographic projection of the second conductive member on the first conductive member being located within the first conductive member, so as to form a capacitor with the first conductive member; and

[0007] A processor is electrically connected to the first conductive member and the second conductive member, and is used to detect a change in a capacitance parameter of the capacitor and determine whether there is a foreign object on the capacitor based on the change in the capacitance parameter.

[0008] The electronic device provided in the first aspect of the present application is configured by arranging a first conductive member on a first housing and a second conductive member in a receiving space, and the first conductive member and the second conductive member can form a capacitor. The first conductive member and the second conductive member are both electrically connected to a processor. When a voltage is applied to the first conductive member and the second conductive member, and the capacitor is in a clean state, that is, when no foreign matter falls on the capacitor, during the gas exchange process, the force exerted by the gas on the first conductive member is small, and the first conductive member itself will produce a small offset. When the first conductive member is offset, the vertical distance between the first conductive member and the second conductive member will change, thereby changing the capacitance parameter of the capacitor, that is, changing the size of the capacitance. And when the first conductive member is continuously offset, that is, when the first conductive member is continuously vibrating, the change in capacitance will generate current and cause the current to continuously change.

[0009] When a foreign object falls onto the first conductive member, the foreign object's inherent mass affects the vertical distance between the first and second conductive members. Furthermore, the foreign object blocks the first through-hole in the first conductive member. When gas exchange occurs, the force exerted by the gas on the first conductive member increases, causing the first conductive member to vibrate more strongly. In other words, the change in the vertical distance between the first and second conductive members is greater than when there is no foreign object, and the capacitance parameters also change, resulting in a greater change in both capacitance and current.

[0010] Furthermore, when a foreign object passes through the first through-hole and lands on the second conductive member, or when a foreign object enters the electronic device through other holes and lands on the second conductive member, the presence of the foreign object changes the dielectric environment between the first and second conductive members, thereby changing the dielectric constant of the capacitor, which in turn changes the capacitance parameters of the capacitor. Furthermore, if the foreign object partially penetrates the first through-hole but remains on the first conductive member, part of the foreign object will also be located between the first and second conductive members, thus changing the dielectric constant of the capacitor and, consequently, the capacitance parameters of the capacitor.

[0011] Therefore, the processor can detect changes in the capacitor's capacitance parameters based on the above-mentioned characteristics of the capacitor and compare the changes in the capacitance parameters with the preset capacitance parameters. When the detected capacitance parameters are the same as the preset capacitance parameters, it means that the capacitor is in the same clean state at this time, that is, no foreign matter has fallen on the first conductive member and the second conductive member. When the detected capacitance parameters are different from the preset capacitance parameters, it can be determined that there is foreign matter on the capacitor, that is, at least one of the first conductive member and the second conductive member has foreign matter, so as to understand the situation and status of the foreign matter.

[0012] A second aspect of the present application provides a foreign object detection method, which is applied to an electronic device, wherein the electronic device includes a capacitor, the capacitor includes a first conductive member and a second conductive member spaced apart, the first conductive member having a plurality of first through holes, the foreign object detection method comprising:

[0013] Obtaining a preset capacitance parameter of the capacitor when the capacitor is in a clean state;

[0014] detecting a detection capacitance parameter of the capacitor; and

[0015] When the detected capacitance parameter is different from the preset capacitance parameter, it is determined that there is foreign matter on the capacitor.

[0016] The foreign matter detection method provided in the second aspect of the present application is simple and can first obtain the preset capacitance parameters of the capacitor when it is in a clean state. The clean state refers to a state where no foreign matter has fallen on the capacitor. The preset capacitance parameters include but are not limited to capacitance and the capacitance variation range, current and the current variation range. The detection capacitance parameters of the capacitor are then detected. The detection capacitance parameters include but are not limited to capacitance and the capacitance variation range, current and the current variation range.

[0017] The detected capacitance parameter can then be compared with the preset capacitance parameter. If the detected capacitance parameter is the same as the preset capacitance parameter, it indicates that the capacitor is in a clean state, i.e., no foreign matter has fallen on the first conductive member or the second conductive member. If the detected capacitance parameter is different from the preset capacitance parameter, it can be determined that there is foreign matter on the capacitor, i.e., at least one of the first conductive member and the second conductive member has foreign matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0019] Figure 1 This is a top view of an electronic device in one embodiment of the present application.

[0020] Figure 2 In one embodiment of this application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0021] Figure 3 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0022] Figure 4 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0023] Figure 5 Schematic diagram of the first conductive member and the second conductive member when a foreign object falls into the first conductive member in one embodiment of the present application.

[0024] Figure 6 FIG. 1 is a schematic diagram of the first conductive member and the second conductive member when no foreign matter falls into the first conductive member in one embodiment of the present application.

[0025] Figure 7 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0026] Figure 8 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0027] Figure 9 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0028] Figure 10 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0029] Figure 11 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0030] Figure 12 Schematic diagram of the three-dimensional structure of the first conductive member, the first buffer member, the first adhesive member, and a portion of the first shell in one embodiment of the present application.

[0031] Figure 13 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0032] Figure 14 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0033] Figure 15 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0034] Figure 16 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0035] Figure 17 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0036] Figure 18 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0037] Figure 19 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction.

[0038] Figure 20 Schematic diagram of a foreign body detection method in one embodiment of the present application.

[0039] Figure 21 This is a schematic diagram of the steps after S300 in one embodiment of the present application.

[0040] Figure 22 This is a schematic diagram of the steps after S300 in another embodiment of the present application.

[0041] Figure 23 This is a schematic diagram of the steps after S300 in another embodiment of the present application.

[0042] Figure 24 This is a schematic diagram of S200 in one embodiment of the present application.

[0043] Figure 25 This is a schematic diagram of S200 in another embodiment of the present application.

[0044] Description of labels:

[0045] Electronic device 1, first housing 10, receiving space 11, first via 12, first insulating portion 13, conductive member 14, positioning post 15, first conductive member 21, first shielding member 22, middle portion 221, edge portion 222, first through hole 23, first wire 24, second through hole 25, second conductive member 31, second shielding member 32, third through hole 33, second wire 34, processor 40, first adhesive member 50, second via 51, first buffer member 52, third through hole-53, positioning hole-54, second adhesive member-55, fourth through hole-56, shielding member-60, shielding groove-61, second shell-70, bottom wall-701, side wall-702, fourth through hole-71, speaker module-80, bracket-81, main body-811, conductive part-8111, extension part-812, second insulating part-8121, speaker unit-82, diaphragm-820, first sound cavity-83, second sound cavity-84, fifth through hole-85, installation hole-86. DETAILED DESCRIPTION

[0046] The following are preferred implementations of the present application. It should be noted that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

[0047] Before introducing the technical solutions of the present application, the technical problems in the related technologies are introduced in detail.

[0048] Various structural parts are set in the shell of the electronic device, such as air intake parts, exhaust parts, heat dissipation parts or speaker modules, etc. Due to the existence of the above-mentioned parts, various through holes are opened on the shell accordingly. For example, air intake holes, exhaust holes, sound holes, heat dissipation holes, etc. However, the opening of through holes will expose the space inside the shell. Therefore, in order to prevent foreign matter from the outside (such as dust, impurities, water droplets, etc.) from entering the shell and affecting the performance of the parts inside the shell, a shielding structure is usually set on the shell to block most foreign matter from the outside from entering the shell. The shielding structure is usually provided with a plurality of through holes, which are used to realize the transmission and interaction of gas on the basis of the blocking effect.

[0049] While the shielding structure prevents foreign matter from entering the housing, it can accumulate on the shielding structure, affecting the appearance and performance of the electronic device. Furthermore, the presence of foreign matter can block the through-holes in the shielding member, thereby affecting gas flow and the performance of the electronic device. Furthermore, currently, electronic devices cannot detect the presence of foreign matter on the shielding structure, as well as its condition and status, such as whether the foreign matter has landed on the shielding member, and the type and quantity of the foreign matter.

[0050] Someone has designed a dust screen with a sensing function. This involves installing a transmission column on the dust screen, and placing a sensor and its contacts inside the housing. When a foreign object lands on the dust screen, the transmission column will continuously approach the contacts. When the number of foreign objects is large enough, the transmission column contacts the contacts, triggering the sensor to generate an electrical signal, alerting the user or electronic device to the specific foreign object. However, this method requires mechanical sensing for induction, which takes up a large amount of space in the sound channel. The vibration of the dust screen itself is also very weak, requiring precision machinery to amplify and measure, and it is also impossible to assess the situation and status of the foreign object.

[0051] In view of this, in order to solve the above problems, this application provides an electronic device. Please refer to Figures 1-6 . Figure 1 This is a top view of an electronic device in one embodiment of the present application. Figure 2 In one embodiment of this application Figure 1 Schematic diagram of a partial cross section along the AA direction. Figure 3 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction. Figure 4 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction. Figure 5 Schematic diagram of the first conductive member and the second conductive member when a foreign object falls into the first conductive member in one embodiment of the present application. Figure 6 FIG. 1 is a schematic diagram of the first conductive member and the second conductive member when no foreign matter falls into the first conductive member in one embodiment of the present application.

[0052] This embodiment provides an electronic device 1, specifically including a first housing 10, a first conductive member 21, a second conductive member 31, and a processor 40. The first housing 10 has a receiving space 11, and the first housing 10 has a first via 12 connected to the receiving space 11. The first conductive member 21 is mounted on the first housing 10, covering the first via 12. The first conductive member 21 has a plurality of first through holes 23 connected to the first via 12. The second conductive member 31 is disposed within the receiving space 11 and spaced apart from the first conductive member 21. The second conductive member 31 is further away from the first via 12 than the first conductive member 21, and at least a portion of the orthographic projection of the second conductive member 31 on the first conductive member 21 is located within the first conductive member 21, thereby forming a capacitor with the first conductive member 21. The processor 40 is electrically connected to the first conductive member 21 and the second conductive member 31. The processor 40 is configured to detect changes in the capacitance parameters of the capacitor and determine whether there is a foreign object on the capacitor based on the changes in the capacitance parameters.

[0053] The electronic device 1 provided in this embodiment includes, but is not limited to, mobile terminals such as mobile phones, tablet computers, laptop computers, PDAs, personal computers (PCs), personal digital assistants (PDAs), portable media players (PMPs), navigation devices, wearable devices, smart bracelets, pedometers, and fixed terminals such as digital TVs and desktop computers. This embodiment does not limit the type of electronic device 1.

[0054] The electronic device 1 provided in this embodiment includes a first shell 10. The first shell 10 can provide a mounting base for other structural parts in the electronic device 1, and the first shell 10 can also provide effective mechanical protection for the structural parts of the electronic device 1. In addition, the diverse appearance effects of the first shell 10 can also provide excellent appearance performance for the electronic device 1. Optionally, the electronic device 1 includes not only one shell, but may include multiple shells. In this embodiment, one of the shells is artificially named as the first shell 10. Further optionally, the first shell 10 includes but is not limited to a middle frame, a rear shell, a front shell, an outer shell, or an inner shell, etc. Optionally, the material of the first shell 10 includes but is not limited to metal, plastic, etc.

[0055] The first shell 10 has a receiving space 11 for receiving and installing various structural components of the electronic device 1. The first shell 10 also has a first through hole 12 connected to the receiving space 11. It can be seen from the relevant technology that since there are structural components such as air intake components, exhaust components, heat dissipation components, and speaker modules 80 in the electronic device 1, it is necessary to open a first through hole 12 on the shell to allow the internal and external gases to interact to achieve the functions of air intake, exhaust, sound emission, and heat dissipation. When the first through hole 12 is used for air intake, it can also be called an air intake hole; when the first through hole 12 is used for exhaust, it can also be called an exhaust hole; when the first through hole 12 is used for heat dissipation, it can also be called a heat dissipation hole; when the first through hole 12 is used for sound emission, it can also be called a sound outlet.

[0056] The electronic device 1 provided in this embodiment also includes a first conductive part 21. The first conductive part 21 is a structure with conductive properties. Optionally, the material of the first conductive part 21 includes but is not limited to metal and its alloys, graphite, etc. The first conductive part 21 is installed in the first shell 10 and covers the first via 12 to prevent foreign objects from entering the receiving space 11 in the first shell 10. The first conductive part 21 is installed in the first shell 10, which can be understood as the first conductive part 21 is directly connected to the first shell 10, or the first conductive part 21 is indirectly connected to the first shell 10 through other structural parts. For example, the first conductive part 21 can be bonded to the first shell 10 by an adhesive, and the first conductive part 21 can also be bonded to other components by an adhesive, and the other components are installed on the first shell 10. As for the positional relationship between the first conductive part 21 and the first shell 10, as shown in FIG. Figure 2 As shown, the first conductive member 21 can be installed on the surface of the first shell 10 close to the receiving space 11. Figure 3 As shown, the first conductive member 21 can be installed on the exterior surface of the first housing 10. Figure 4 As shown, the first conductive member 21 may also be installed in the first via hole 12 .

[0057] Optionally, the first conductive member 21 covering the first through hole 12 can be understood as the orthographic projection of the first conductive member 21 on the first shell 10 covering the first through hole 12, or overlapping with the first through hole 12, so as to ensure that foreign matter does not enter the first shell 10 from between the first conductive member 21 and the first shell 10. Optionally, in this embodiment, the first conductive member 21 can be directly used to block foreign matter and serve as one of the plates of the capacitor. Alternatively, the first conductive member 21 can be installed on other structural members such as the first shielding member 22, and the first shielding member 22 is used to provide a mounting base for the first conductive member 21 and to block dust, and the first conductive member 21 is used to serve as one of the plates of the capacitor.

[0058] In addition, the first conductive member 21 has a plurality of first through holes 23 connected to the first via holes 12, so that the gas inside and outside the first housing 10 can interact with the first via holes 12 through the first through holes 23. This embodiment does not limit the shape, size, or number of the first through holes 23, as long as they can prevent foreign matter from entering and do not affect the interaction of the gas inside and outside the first housing 10.

[0059] The electronic device 1 provided in this embodiment further includes a second conductive member 31, which is also a structure having conductive properties. Optionally, the material of the second conductive member 31 includes, but is not limited to, metals, alloys thereof, graphite, etc. The second conductive member 31 is disposed within the receiving space 11, and the second conductive member 31 is spaced apart from the first conductive member 21, and at least a portion of the orthographic projection of the second conductive member 31 on the first conductive member 21 is located within the first conductive member 21, that is, the second conductive member 31 is disposed at least partially in direct correspondence with the first conductive member 21, so that the first conductive member 21 and the second conductive member 31 can form a capacitor.

[0060] Optionally, the second conductive member 31 may be a newly added structural member, or the second conductive member 31 may be a partial structure of a structural member located within the receiving space 11, serving as the second conductive member 31, such as the metal bracket 81 of the camera module. This embodiment illustrates the second conductive member 31 as a newly added structural member, and the location of the second conductive member 31 will be described in detail later in this application.

[0061] The electronic device 1 provided in this embodiment also includes a processor 40, and the first conductive member 21 and the second conductive member 31 are both electrically connected to the processor 40. Since the first conductive member 21 and the second conductive member 31 are spaced apart, and there is usually air between the first conductive member 21 and the second conductive member 31 in the receiving space 11. In this way, the first conductive member 21 and the second conductive member 31 will form a capacitor, and the first conductive member 21 and the second conductive member 31 are the two plates of the capacitor. The power supply in the electronic device 1 can be the two plates of the capacitor, and the first conductive member 21 and the second conductive member 31 apply voltage. When a voltage is applied between the two plates of the capacitor, the capacitor will store charge. As for the positional relationship between the processor 40 and the first conductive member 21 and the second conductive member 31, this embodiment does not limit it here. Figure 2-Figure 4 The figure only shows that the first conductive member 21 and the second conductive member 31 are electrically connected to the processor 40, and does not represent the positional relationship between the processor 40 and the first conductive member 21 and the second conductive member 31. Figure 2-Figure 4 shown.

[0062] Optionally, since the processor 40 is mounted on a printed circuit board (PCB), the first conductive member 21 and the second conductive member 31 being electrically connected to the processor 40 can also be understood as the first conductive member 21 and the second conductive member 31 being electrically connected to the PCB. Optionally, the first conductive member 21 can be electrically connected to the processor 40 via a first wire 24, and the second conductive member 31 can be electrically connected to the processor 40 via a second wire 34.

[0063] When the electronic device 1 is working and the capacitor is in a clean state, that is, when no foreign matter falls on the capacitor. Due to the operation of the internal structural parts of the electronic device 1, the gas inside and outside the first shell 10 will be exchanged. At this time, the force of the gas on the first conductive part 21 is relatively small, and the first conductive part 21 itself will produce a small offset. For example, when the air intake or exhaust part starts to take in or exhaust air, the first conductive part 21 will be offset. Or when the air intake or exhaust part changes transmission, the first conductive part 21 will also be offset and vibrated accordingly. Alternatively, when the speaker module 80 is working, due to the emission of different audio frequencies, the diaphragm 820 will be offset and vibrated differently, so the first conductive part 21 will also be offset and vibrated accordingly. Among them, the vibration mentioned here refers to a single offset, or multiple offsets of the same or different displacements.

[0064] When the first conductive member 21 deflects, the vertical distance between it and the second conductive member 31 changes. This change in vertical distance changes the capacitance of the capacitor. As the first conductive member 21 continues to vibrate, the capacitance also changes. As the capacitance changes, the charge on the plates also changes, generating a current that continuously changes.

[0065] If no foreign matter falls on the capacitor, that is, no foreign matter falls on the first conductive part 21 and the second conductive part 31, the capacitance and current remain unchanged or change within a preset range of change. However, if a foreign matter falls on the first conductive part 21, the foreign matter itself has a certain mass that will affect the vertical distance between the first conductive part 21 and the second conductive part 31. And some foreign matter will block the first through hole 23 on the first conductive part 21. In this way, during gas exchange, the gas cannot effectively enter and discharge, so the force of the gas on the first conductive part 21 becomes greater, and the first conductive part 21 itself will produce greater vibration. In other words, the change in the vertical distance between the first conductive part 21 and the second conductive part 31 is greater than when there is no foreign matter. When there is a foreign matter on the first conductive part 21 (such as Figure 5 As shown), the minimum vertical distance between the first conductive member 21 and the second conductive member 31 (as shown Figure 5 The size shown in L1 in FIG) is larger than when there is no foreign matter on the first conductive member 21 (as shown in FIG). Figure 6As shown), the minimum vertical distance between the first conductive member 21 and the second conductive member 31 (as shown Figure 6 The size of L2 in the figure is smaller. In this case, the capacitance parameters will also change, that is, the change in capacitance is greater and the change in current is also greater.

[0066] Furthermore, when a foreign object passes through the first through-hole 23 and lands on the second conductive member 31, or when a foreign object enters the electronic device 1 through other holes and lands on the second conductive member 31, the presence of the foreign object changes the dielectric environment between the first conductive member 21 and the second conductive member 31, thereby changing the dielectric constant of the capacitor, which in turn changes the capacitance parameters of the capacitor. Furthermore, if the foreign object partially penetrates the first through-hole 23 but remains on the first conductive member 21, part of the foreign object will also be located between the first conductive member 21 and the second conductive member 31, thus changing the dielectric constant of the capacitor and, consequently, the capacitance parameters of the capacitor.

[0067] Therefore, the processor 40 can detect the change of the capacitance parameter of the capacitor according to the above-mentioned characteristics of the capacitor, and compare the change of the capacitance parameter with the preset capacitance parameter. When the detected capacitance parameter is the same as the preset capacitance parameter, it means that the state of the capacitor at this time is the same as the clean state, that is, no foreign matter has fallen on the first conductive member 21 and the second conductive member 31. When the detected capacitance parameter is different from the preset capacitance parameter, it can be determined that there is foreign matter on the capacitor, that is, at least one of the first conductive member 21 and the second conductive member 31 has foreign matter, so that the electronic device 1 and the user know that there is foreign matter on the capacitor. And the larger the number of foreign matter, the larger the size of the foreign matter, and the larger the range of its variation, the larger the size, so the size, type, quantity and other information of the foreign matter can also be analyzed according to the size of the change in the range of variation.

[0068] In summary, the electronic device 1 provided in this embodiment is provided with a first conductive member 21 and a second conductive member 31. When a foreign object falls on the first conductive member 21, the foreign object affects the vertical distance between the first conductive member 21 and the second conductive member 31, thereby affecting the capacitance and current of the capacitor. When a foreign object falls on the second conductive member 31, the foreign object affects the dielectric constant of the capacitor. Therefore, this embodiment can detect the presence of a foreign object by detecting, analyzing, and judging the change in the electrical signal. Compared to mechanical sensing, this can improve detection accuracy and reduce space occupation.

[0069] Please refer to Figure 7 , Figure 7 In another embodiment of the present application Figure 1Schematic diagram of a partial cross section along the AA direction. In this embodiment, the electronic device 1 further includes a first shielding member 22 mounted on the first housing 10, the first shielding member 22 having a second through hole 25 connected to the first through hole 23, and the first conductive member 21 is disposed on a side of the first shielding member 22 close to the second conductive member 31.

[0070] This embodiment may additionally provide a first shielding member 22, wherein the first shielding member 22 is used to prevent foreign matter from entering the components inside the first shell 10. Optionally, the material of the first shielding member 22 includes but is not limited to insulating materials such as nylon, polyethylene, and non-woven fabrics. For example, the first shielding member 22 may be a dustproof net. The first shielding member 22 is installed on the first shell 10, which can be understood as the first shielding member 22 being directly connected to the first shell 10, or the first shielding member 22 being indirectly connected to the first shell 10 through other structural members. For example, the first shielding member 22 can be bonded to the first shell 10 by an adhesive, and the first shielding member 22 can also be bonded to other components by an adhesive, and the other components are installed on the first shell 10.

[0071] In this embodiment, the first conductive member 21 can be provided on the first shielding member 22. Optionally, the first conductive member 21 can be prepared on the first shielding member 22 by methods such as electroplating, spraying, chemical vapor deposition, or physical vapor deposition. Furthermore, the fact that the first conductive member 21 is provided on the side of the first shielding member 22 close to the second conductive member 31 can be understood as meaning that the first conductive member 21 is closer to the second conductive member 31 than the first shielding member 22, thereby reducing the initial vertical distance between the first conductive member 21 and the second guide layer. Thus, when the first conductive member 21 vibrates, the change in the vertical distance between the first conductive member 21 and the second guide layer is more obvious, i.e., the change in capacitance and current is more obvious, thereby improving the accuracy of the judgment made by the processor 40.

[0072] In other words, the first shielding member 22 is closer to the outside world than the first conductive member 21. This protects the first conductive member 21 from damage. Furthermore, when the processor 40 applies voltage to the first conductive member 21, and when the first conductive member 21 deflects and vibrates, an electrostatic effect is generated on the first conductive member 21. This prevents the first conductive member 21 from automatically attracting foreign matter, further reducing the amount of foreign matter that enters the first conductive member 21.

[0073] Alternatively, the first conductive member 21 of this embodiment can be obtained by first forming a layer of the first conductive member 21 on the side of the first shielding member 22 close to the second conductive member 31, and then removing the first conductive member 21 disposed in the first through hole 23 of the first shielding member 22. Of course, in other embodiments, the first conductive member 21 can also be disposed on the side of the first shielding member 22 facing away from the second conductive member 31, and in the first through hole 23 of the first shielding member 22.

[0074] In addition, the first shielding member 22 is provided with a second through hole 25 that communicates with the first through hole 23, facilitating gas exchange and interconnecting the first through hole 23, the second through hole 25, and the first via 12. The orthographic projection of the first shielding member 22 on the first conductive member 21 causes the first through hole 23 and the second through hole 25 to overlap, i.e., the first through hole 23 and the second through hole 25 are identical, further improving gas flow efficiency.

[0075] Please refer to Figure 8 , Figure 8 In another embodiment of the present application Figure 1 Partial cross-sectional view along the AA direction In this embodiment, the first housing 10 includes a first insulating portion 13 , the first insulating portion 13 has the first via hole 12 , and the first conductive member 21 is mounted on the first insulating portion 13 .

[0076] In this embodiment, at least a portion of the first housing 10 may be formed from a first insulating portion 13. The first insulating portion 13 has insulating properties and may be made of materials including, but not limited to, various plastics. A first via 12 may be provided in the first insulating portion 13, and a first conductive member 21 may be mounted on the first insulating portion 13. When the first conductive member 21 moves, the capacitor generates current. Mounting the first conductive member 21 on the first insulating portion 13 prevents this current from being conducted to the first housing 10 and, consequently, to the user, potentially affecting their health.

[0077] Optionally, the first shell 10 may be composed of the first insulating part 13. Or the first shell 10 may also be partially composed of the first insulating part 13, and the remaining part may be composed of the conductive part 14. The conductive part 14 has conductive properties, and its material includes but is not limited to metal and its alloys. As for the position and distribution relationship between the conductive part 14 and the first insulating part 13, this embodiment does not limit it here, and the first shell 10 can be designed accordingly according to the different needs of different parts. Optionally, the first shell 10 can be prepared by insert injection molding, for example, first preparing the conductive part 14, then placing the conductive part 14 in a mold, and performing injection molding and other processes on the basis of the conductive part 14 to finally obtain the first shell 10.

[0078] Please refer to Figure 9 , Figure 9 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction. In this embodiment, the electronic device 1 further includes a first adhesive member 50. The first adhesive member 50 has insulating properties and is located between the first housing 10 and the first conductive member 21. The first adhesive member 50 has a second via hole 51 that connects the first through hole 23 and the first via hole 12.

[0079] In this embodiment, the first adhesive member 50 can be used to install the first conductive member 21 on the first shell 10. The first adhesive member 50 is provided with a second via 51, which connects the first through hole 23 and the first through hole 12 so as not to affect the exchange of gas inside and outside the first shell 10. The second via 51 on the first adhesive member 50 can be understood as the first adhesive member 50 is arranged on the periphery of the first conductive member 21 to form a larger second through hole 51. In other words, the first adhesive member 50 is arranged between the first conductive member 21 and the first shell 10, and the second through hole 51 runs through the first adhesive member 50. In addition, the number and size of the second through holes 51 are not limited in this embodiment, as long as the second through holes 51 can connect the interface between the first through hole 23 and the first through hole 12. Further optionally, the orthographic projections of the first conductive member 21 and the first adhesive member 50 on the first shell 10 make the first through hole 23, the first via hole 12, and the second via hole 51 overlap with each other, that is, the first through hole 23, the first via hole 12, and the second via hole 51 are exactly the same, further improving the gas circulation efficiency.

[0080] In addition, since the first adhesive 50 is insulating, this embodiment can not only use the first adhesive 50 to install the first conductive member 21 on the first shell 10, but also use the insulating first adhesive 50 to separate the first conductive member 21 from the first shell 10, thereby preventing the current of the first conductive member 21 from being transmitted to the user.

[0081] Please refer to Figure 10 , Figure 10 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction. In this embodiment, the electronic device 1 further includes a first shielding member 22 mounted on the first housing 10. The first shielding member 22 includes a middle portion 221 and an edge portion 222 connected to each other. The edge portion 222 is located at the periphery of the middle portion 221 and is bonded to the first adhesive member 50. At least a portion of the middle portion 221 covers the first via 12. The middle portion 221 has a second through hole 25 connected to the first through hole 23. The first conductive member 21 is disposed in the middle portion 221.

[0082] This embodiment can also include a first shielding member 22. Since the first shielding member 22 has been described in detail above, it will not be further described here. Because the first shielding member 22 covers the first via 12, the size of the first shielding member 22 is larger than the size of the first via 12. In this case, the portion of the first shielding member 22 that is larger than the size of the first via 12 can be considered the edge portion 222, while the portion of the first shielding member 22 that covers the first via 12 can be considered the middle portion 221. In other words, for ease of understanding, different parts of the first shielding member 22 have been artificially named differently.

[0083] In this embodiment, the edge portion 222 is bonded to the first housing 10 via a first adhesive 50, while the middle portion 221 is used to block foreign matter. The first through hole 23 is provided in the middle portion 221. Whether the edge portion 222 is provided with the first through hole 23 is not limited in this embodiment. In other words, the edge portion 222 may or may not be provided with the first through hole 23.

[0084] Furthermore, because the edge portion 222 is bonded to the first adhesive member 50, when the first conductive member 21 vibrates, the vibration amplitude of the first conductive member 21 located at the edge portion 222 is smaller. Therefore, in this embodiment, the first conductive member 21 can be positioned in the middle portion 221 to reduce the area of the first conductive member 21 and thus reduce the cost of the first conductive member 21. Furthermore, when the first shielding member 22 vibrates, the vibration amplitude of the middle portion 221 is greater than that of the edge portion 222. Therefore, positioning the first conductive member 21 in the middle portion 221 allows for more significant changes in the vertical distance between the first conductive member 21 and the second guide layer when the first conductive member 21 vibrates, i.e., when the first conductive member 21 vibrates, the changes in capacitance and current are more pronounced, further improving the accuracy of the judgment made by the processor 40.

[0085] Please refer to Figure 11 , Figure 11 In another embodiment of the present application Figure 1 Partial cross-sectional view along the AA direction. In this embodiment, the electronic device 1 further includes a first buffer member 52 and two first adhesive members 50. The first buffer member 52 is located between the first conductive member 21 and the first housing 10. One first adhesive member 50 is located between the first buffer member 52 and the first housing 10, and the other first adhesive member 50 is located between the first buffer member 52 and the first conductive member 21. The first buffer member 52 has a third via hole 53 that communicates with the second via hole 51.

[0086] This embodiment can also include a first buffer member 52, in which case there are two first adhesive members 50. The first buffer member 52 is positioned between the first conductive member 21 and the first housing 10, and two first adhesive members 50 are then positioned on opposite sides of the first buffer member 52. Specifically, one first adhesive member 50 is used to bond the first buffer member 52 to the first housing 10, and another first adhesive member 50 is used to bond the first conductive member 21 to the first buffer member 52. Similarly, a third via 53 can be provided in the first buffer member 52 to facilitate gas exchange between the interior and exterior of the housing.

[0087] The first buffer member 52 is a structural member with certain cushioning properties. Optionally, the material of the first buffer member 52 includes an elastic member or foam. The addition of the first buffer member 52 between the first conductive member 21 and the first housing 10 prevents the first shielding member 22 in the first conductive member 21 or the first conductive member 21 from directly contacting the first housing 10, thereby preventing damage to the first shielding member 22 or the first conductive member 21 during vibration. For example, when the first housing 10 connected to the first conductive member 21 is made of a rigid material, such as a metal alloy, and the first conductive member 21 is in contact with the first housing 10, since the first conductive member 21 is also typically made of a rigid material, collisions between rigid materials during vibration can affect and damage the first conductive member 21, even with the first adhesive member 50. The addition of the first buffer member 52 can alleviate this problem. Of course, in other embodiments, buffer members can also be added when the first conductive member 21, the first shielding member 22, the second conductive member 31, and the second shielding member 32 are bonded to other components.

[0088] Please refer to Figure 12 , Figure 12 The figure is a schematic diagram of the three-dimensional structure of the first conductive member, the first buffer member, the first adhesive member, and a portion of the first housing in one embodiment of the present application. In this embodiment, the first conductive member 21, the first buffer member 52 (not shown), and the two first adhesive members 50 are each provided with a positioning hole 54. The first housing 10 is provided with a positioning post 15, at least a portion of which is disposed within the positioning hole 54.

[0089] Since the first housing 10 is provided with a first through hole 12, the first conductive member 21 is provided with a first through hole 23, the first adhesive member 50 is provided with a second through hole 51, and the first buffer member 52 is provided with a third through hole 53, the positioning holes 54 can be used to cooperate with the positioning posts 15 during assembly to reduce the difficulty of positioning the above components, thereby making the positioning of each through hole and via more accurate, reducing the difficulty of assembly and improving assembly efficiency. Optionally, the first shielding member 22 also has positioning holes 54. Specifically, during assembly, the first conductive member 21, the first buffer member 52, the two first adhesive members 50, and even the positioning holes 54 of the first shielding member 22 can be sleeved on the positioning posts 15, thereby reducing the difficulty of positioning the first through hole 23, the second through hole 25, the first through hole 12, the second through hole 51, and the third through hole 53. Alternatively, the first conductive member 21, the first buffer member 52, the two first adhesive members 50, and even the first shielding member 22 can be assembled together using the positioning hole 54 to improve the positioning accuracy of the first through hole 23, the second through hole 25, the second via hole 51, and the third via hole 53, and then the assembled structure is placed on the positioning column 15 and positioned with the first via hole 12.

[0090] Please refer to Figure 13 , Figure 13 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction. In this embodiment, the electronic device 1 further includes a second shielding member 32 disposed within the receiving space 11. The second shielding member 32 is spaced apart from the first conductive member 21. The second conductive member 31 is disposed on the second shielding member 32. The second conductive member 31 and the second shielding member 32 have a plurality of third through holes 33.

[0091] In this embodiment, a second shielding member 32 may be added to the receiving space 11, so that the second conductive member 31 is disposed on the second shielding member 32. In other words, the second conductive member 31 is mounted on the second shielding member 32. Optionally, the second shielding member 32 may be made of, but not limited to, insulating materials such as nylon, polyethylene, and non-woven fabric. Optionally, the second conductive member 31 may be deposited on the second shielding member 32 by electroplating, spray coating, chemical vapor deposition, or physical vapor deposition.

[0092] The second shielding member 32 is spaced apart from the first conductive member 21 to prevent the second shielding member 32 from being directly arranged on the first conductive member 21, thereby affecting the channel for gas circulation in the first shell 10, making it easier for the first conductive member 21 and the second conductive member 31 to form a capacitor. In addition, the second conductive member 31 and the second shielding member 32 have multiple third through holes 33. That is, the second shielding member 32 and the second conductive member 31 can also further block foreign matter and prevent foreign matter from falling into certain structural parts, such as the speaker module 80. Optionally, the second shielding member 32 can be a dustproof net. And due to the presence of the third through hole 33, the gas can be directly transmitted from the third through hole 33 of the second shielding member 32 and the second conductive member 31 to the first through hole 23 of the first conductive member 21, reducing the difficulty of gas transmission.

[0093] Furthermore, when the second conductive member 31 and the second shielding member 32 utilize the third through hole 33 as a gas transmission channel, if a foreign object falls on the second conductive member 31, it will not only change the dielectric constant of the capacitor, but when gas passes through the second conductive member 31, the foreign object will also affect the movement of the second conductive member 31 in the same way as it affects the movement of the first conductive member 21, further affecting the vertical distance between the first conductive member 21 and the second conductive member 31, and further affecting the change in the capacitance parameter. This can further improve the accuracy of the detection and judgment of the processor 40.

[0094] Please refer to Figure 14 , Figure 14 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross section along the AA direction. In this embodiment, the second conductive member 31 is disposed on the side of the second shielding member 32 close to the first conductive member 21. It can also be understood that the second conductive member 31 is closer to the first conductive member 21 than the second shielding member 32, which can further reduce the initial vertical distance between the first conductive member 21 and the second guide layer. When the first conductive member 21 vibrates, that is, when the first conductive member 21 vibrates, the change in the vertical distance between the first conductive member 21 and the second guide layer is more obvious, that is, the change in capacitance and current is more obvious, thereby further improving the accuracy of the judgment of the processor 40.

[0095] Alternatively, the second conductive member 31 of this embodiment can be obtained by first forming a layer of the second conductive member 31 on the side of the second shielding member 32 close to the first conductive member 21, and then removing the second conductive member 31 disposed in the third through hole 33 of the second shielding member 32. Of course, in other embodiments, the second conductive member 31 can also be disposed on the side of the second shielding member 32 facing away from the first conductive member 21, and in the third through hole 33 of the second shielding member 32.

[0096] Please refer again Figure 14In this embodiment, the orthographic projection of the first conductive member 21 on the second conductive member 31 overlaps with the second conductive member 31. This further increases the area of the first conductive member 21 and the second conductive member 31 facing each other, reducing the impact of the first through-hole 23 and the third through-hole 33 on the first conductive member 21 and the second conductive member 31. Optionally, the first through-hole 23 and the third through-hole 33 have the same size, number, and shape.

[0097] Please refer to Figure 15 , Figure 15 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross-section along the AA direction. In another embodiment of this embodiment, the size of the third through hole 33 is smaller than that of the first through hole 23. When most dust is blocked by the first conductive member 21, if a small foreign object enters the receiving space 11 through the first conductive member 21, it can be blocked by the second shielding member 32, thereby improving the shielding effect of the electronic device 1.

[0098] Please refer to Figure 16 , Figure 16 In another embodiment of the present application Figure 1 Partial cross-sectional view along the AA direction. In this embodiment, the electronic device 1 further includes a shielding member 60 , the shielding member 60 having a shielding slot 61 , the second conductive member 31 is disposed in the shielding slot 61 , and the opening of the shielding slot 61 faces the first conductive member 21 .

[0099] When the first conductive member 21 and the second conductive member 31 vibrate, the capacitance of the capacitor changes, thereby generating current. When the first conductive member 21 continues to vibrate, its current will continue to be generated. When current is generated, a magnetic field is generated. This embodiment can be supplemented with a shielding member 60. The shielding member 60 has a shielding function. The second conductive member 31 can be placed in the shielding groove 61 of the shielding member 60 to prevent the magnetic field generated by the second conductive member 31 from affecting the performance of other structural components. As for whether the second shielding member 32 is placed in the shielding groove 61, this embodiment does not limit it.

[0100] In addition, the opening direction of the shielding slot 61 faces the first conductive member 21. This arrangement does not affect the capacitor formed by the first conductive member 21 and the second conductive member 31. Secondly, the vibrating gas can also be transmitted from the first conductive member 21 and the second conductive member 31 to the outside without affecting the transmission of the gas.

[0101] Please refer to Figure 17 , Figure 17 In another embodiment of the present application Figure 1Schematic diagram of a partial cross section along the AA direction. In this embodiment, the electronic device 1 further includes a second housing 70, which is mounted on the first housing 10. The second housing 70 includes a bottom wall 701 and a side wall 702 that is bent and connected to the periphery of the bottom wall 701. At least a portion of the side wall 702 is disposed within the receiving space. The first conductive member 21 is located between the first housing 10 and the side wall 702. The second shielding member 32 and the second conductive member 31 are located on a side of the side wall 702 facing away from the first conductive member 21. The side wall 702 has a fourth through hole 71 that connects the first through hole 23 with the third through hole 33.

[0102] This embodiment can also include a second housing 70. The second housing 70 can be installed on the first housing 10 to cover one side of the first housing 10. The second housing 70 can also provide a mounting base for more structural components. The first conductive member 21, the second shielding member 32, and the second conductive member 31 can be installed on opposite sides of the side wall 702. In other words, the side wall 702 can provide a mounting base for the first conductive member 21, the second shielding member 32, and the second conductive member 31. In addition, a fourth through hole 71 can be provided in the side wall 702 to allow gas circulation. The bottom wall 701 can be used to mount other structural components such as a display module.

[0103] In addition, the second shielding member 32 and the second conductive member 31 are arranged on one side of the side wall 702, and the first conductive member 21 is arranged between the other side of the side wall 702 and the first shell 10, so that a closed and stable gas channel can be formed, so that the gas is transmitted to the outside from the third through hole 33, the fourth through hole 71, the first through hole 23, and the first through hole 12 in sequence, thereby realizing gas circulation.

[0104] Alternatively, the first housing 10 may be a middle frame, and the second housing 70 may be a front housing. Alternatively, in addition to the first housing 10 and the second housing 70, the electronic device 1 may further include a third housing, which is mounted on the first housing 10 to cover the other side of the first housing 10. The third housing includes, but is not limited to, a rear housing.

[0105] Please refer to Figure 18 , Figure 18 In another embodiment of the present application Figure 1Schematic diagram of a partial cross-section taken along the AA direction. In this embodiment, the electronic device 1 further includes a speaker module 80, at least a portion of which is disposed within the receiving space 11. The speaker module 80 includes a connected speaker unit 82 and a bracket 81. The bracket 81 is bonded to the bottom wall 701, and the second shielding member 32 and the second conductive member 31 are mounted on the bracket 81. A portion of the bracket 81, a portion of the speaker unit 82, and the second housing 70 enclose a first sound cavity 83, while the remaining bracket 81 and the remaining speaker unit 82 enclose a second sound cavity 84. The remaining bracket 81 has a fifth through hole 85 connecting the second sound cavity 84 with the third through hole 33. The speaker module 80 is electrically connected to the processor 40. When foreign matter is present on the capacitor, the processor 40 is further configured to increase the amplitude of the diaphragm 820 of the speaker unit 82 to separate at least a portion of the foreign matter from the first conductive member 21 and the second conductive member 31.

[0106] This embodiment can also add a speaker module 80, and the second shielding member 32 and the second conductive member 31 are arranged on the bracket 81 of the speaker module 80, and the bracket 81 is provided with a fifth through hole 85. The bracket 81, the speaker unit 82, and the second shell 70 can cooperate to form a first sound cavity 83 and a second sound cavity 84. Since the speaker unit 82 has a diaphragm 820, when the speaker module 80 is in operation, the diaphragm 820 will continuously vibrate, pushing air flow, that is, squeezing and pushing the first sound cavity 83 and the second sound cavity 84 to form sound. This sound can be transmitted to the outside world through other holes such as the fifth through hole 85, the third through hole 33, the fourth through hole 71, the first through hole 23, and the first through hole 12. Therefore, the second shielding member 32 and the second conductive member 31 are arranged on the bracket 81 to further form a closed air channel, thereby improving the sound quality. Furthermore, when a foreign object falls on the second conductive member 31, the movement of the second conductive member 31 also changes, affecting the air transmission, thereby causing a difference in the vibration of the second conductive member 31, further affecting the vertical distance between the first conductive member 21 and the second conductive member 31, and further affecting the change in the capacitance parameter. This further improves the accuracy of the detection and judgment of the processor 40.

[0107] Alternatively, the first sound cavity 83 may be a rear sound cavity, and the second sound cavity 84 may be a front sound cavity. Alternatively, the first via 12 may also be referred to as a sound outlet. Alternatively, the bracket 81 may be bonded and sealed to the second housing 70 using an adhesive such as foam.

[0108] In addition, the speaker module 80 is electrically connected to the processor 40, and the processor 40 is used to control the operation of the speaker module 80. When it is determined that there is foreign matter on the capacitor, the processor 40 can also control the speaker module 80, for example, to increase the volume, that is, to increase the amplitude of the diaphragm 820 of the speaker unit 82, so as to shake at least part of the foreign matter off the first conductive member 21 and the second conductive member 31, so that at least part of the foreign matter is separated from the first conductive member 21 and the second conductive member 31. The vibration of the speaker drives the vibration of the conductive member 14 to achieve vibration dust removal.

[0109] Please refer again Figure 18 In this embodiment, the bracket 81 includes a main body 811 and an extension portion 812 bent and connected to the periphery of the main body 811 , and at least a portion of the main body 811 includes a conductive portion 8111 .

[0110] The bracket 81 includes a main body 811 and an extension portion 812. The main body 811 is used to install structural parts such as the speaker module 80 and the display module. The extension portion 812 is used to cooperate with the first shell 10 to achieve assembly, and the extension portion 812 can also be used to install the second shielding member 32, the second conductive member 31, and the first conductive member 21.

[0111] In this embodiment, the bracket 81 includes a conductive portion 8111, that is, at least a portion of the bracket 81 is made of a material with conductive properties. Optionally, the conductive portion 8111 includes metal and its alloys. This can firstly improve the mechanical strength of the bracket 81, so under the premise of requiring the same mechanical strength, the thickness of the main body 811 and the bracket 81 can be reduced, thereby reducing the thickness of the entire electronic device 1. Secondly, since the conductive member 14 has a certain thermal conductivity, the conductive portion 8111 can be used to promptly conduct the heat generated by the speaker unit 82 during operation to achieve the purpose of heat dissipation. In addition, a mounting hole 86 can be opened on the first shell 10, so that part of the bracket 81 is arranged in the mounting hole 86, further reducing the thickness of the entire electronic device 1.

[0112] Please refer to Figure 19 , Figure 19 In another embodiment of the present application Figure 1 Schematic diagram of a partial cross-section along the AA direction. In this embodiment, the extension portion 812 includes a second insulating portion 8121, the second insulating portion 8121 having the fifth through hole 85 connected to the third through hole 33, and the electronic device 1 further includes a second adhesive member 55, the second adhesive member 55 being disposed between the second insulating portion 8121 and the second shielding member 32, and the second adhesive member 55 having a fourth via 56 connected to the fifth through hole 85.

[0113] The extension portion 812 may include a second insulating portion 8121, meaning that at least a portion of the extension portion 812 is made of a non-conductive polymer material, such as plastic. In this case, the bracket 81 is composed of two materials. Therefore, the bracket 81 can be manufactured by insert molding. For example, the conductive portion 8111 is first manufactured, then placed in a mold, and then injection molding is performed on the conductive portion 8111 to ultimately produce the bracket 81.

[0114] In this embodiment, a fifth through hole 85 can be provided in the second insulating portion 8121, thereby allowing the second shielding member 32 and the second conductive member 31 to be mounted on the second insulating portion 8121. Furthermore, the second shielding member 32 and the second conductive member 31 can be bonded to the second insulating portion 8121 using a second adhesive member 55. Because the rigidity of the second insulating portion 8121 is lower than that of the conductive portion 8111, the buffer member can be omitted. Only the second adhesive member 55 can be used to bond the second shielding member 32, the second conductive member 31, and the second insulating portion 8121, thereby reducing the size of the electronic device 1.

[0115] In addition, for the other connection sides of the first conductive member 21 and the second conductive member 31, such as the bonding between the first conductive member 21 and the side wall 702, and the bonding between the second conductive member 31 and the side wall 702, adhesives can also be used for bonding. And from the perspective of buffering requirements, if the side wall 702 of the second shell 70 is made of a softer polymer material, then only adhesives can be used for bonding, as in the present embodiment. If the side wall 702 of the second shell 70 is made of a harder metal material, a buffer can be added to the adhesive to provide buffering to prevent rigid collisions from damaging the first conductive member 21 and the second conductive member 31.

[0116] The above is an introduction to the structure of the electronic device 1 of this application. Of course, in addition to the structure of the electronic device 1, this application also introduces a foreign body detection method applied to the electronic device 1.

[0117] Please refer to Figure 20 , Figure 20 This is a schematic diagram of a foreign object detection method according to one embodiment of the present application. This embodiment provides a foreign object detection method applied to an electronic device 1, wherein the electronic device 1 includes a capacitor, the capacitor including a first conductive member 21 and a second conductive member 31 spaced apart from each other, the first conductive member 21 having a plurality of first through holes 23. The foreign object detection method includes steps S100, S200, and S300. Steps S100, S200, and S300 are described in detail below.

[0118] S100: Obtain preset capacitance parameters when the capacitor is in a clean state.

[0119] The clean state in this embodiment can be understood as a state when foreign matter has not yet fallen into the plates of the capacitor, in other words, a state when foreign matter has not yet fallen into the first conductive member 21 and the second conductive member 31. The preset capacitance parameters in this state include but are not limited to at least one of the preset capacitance parameters, preset current parameters, preset capacitance variation range parameters, and preset current variation range parameters. For example, when there is a speaker module 80 in the electronic device 1, due to the vibration of the diaphragm 820 of the speaker unit 82 in the speaker module 80, the first conductive member 21 is also continuously vibrated, changing the size of the vertical distance between the first conductive member 21 and the second conductive member 31, thereby forming a changing capacitance and a changing current, and changing the size of the capacitance and the size of the current. And as the diaphragm 820 continues to vibrate, the capacitance and the current continue to change, forming the preset capacitance variation range parameters and the preset current variation range parameters.

[0120] For example, when the electronic device 1 includes an air intake component, an exhaust component, or a heat sink, when operating stably, the flow of gas is relatively stable. At this time, the vertical distance between the first conductive component 21 and the second conductive component 31 does not change, thereby forming a stable capacitance. At this time, since the capacitance does not change, the current is zero, forming a preset capacitance parameter and a preset current parameter.

[0121] Alternatively, the preset capacitance parameters can be obtained through real-time detection, for example, when various structural components begin to operate, at which point it can be assumed that dust has not yet fallen into the capacitors. Alternatively, the preset capacitance parameters can be obtained from a server or terminal. Alternatively, the preset capacitance parameters can be pre-stored in a memory of the electronic device 1 and directly called from the memory.

[0122] S200: Detect capacitance parameters of the capacitor.

[0123] This embodiment can then obtain the detected capacitance parameters of the capacitor. The detected capacitance parameters are parameters obtained after the capacitor is detected. When the speaker module 80, air intake member, exhaust member, or heat sink is operating, the detected capacitance parameters of the capacitor formed by the first conductive member 21 and the second conductive member 31 can be detected.

[0124] The detected capacitance parameter includes, but is not limited to, at least one of a capacitance parameter, a current parameter, a capacitance variation range parameter, and a current variation range parameter. The capacitance parameter, current parameter, capacitance variation range parameter, and current variation range parameter can be understood in the same way as the preset capacitance parameter, preset current parameter, preset capacitance variation range parameter, and preset current variation range parameter described above, and are not further described in this embodiment.

[0125] Optionally, regarding when to detect the capacitance parameter of the capacitor, this embodiment can detect the capacitance parameter in real time, or detect the capacitance parameter at intervals, or detect the capacitance parameter when a detection signal is received.

[0126] S300: When the detected capacitance parameter is different from the preset capacitance parameter, it is determined that there is a foreign object on the capacitor.

[0127] Even after obtaining the detected capacitance parameters, it is still impossible to determine whether a foreign object has fallen into the capacitor. The detected capacitance parameters may indicate that no foreign object has fallen into the capacitor, or they may indicate that a foreign object has fallen into the capacitor. Therefore, the relationship between the detected capacitance parameters and the preset capacitance parameters can be determined to see whether the detected capacitance parameters are the same as the preset capacitance parameters. This can be used to determine whether a foreign object is present on the capacitor, that is, whether a foreign object is present on at least one of the first conductive member 21 and the second conductive member 31.

[0128] When the detected capacitance parameter is the same as the preset capacitance parameter, it indicates that the capacitor is in a clean state, meaning that no foreign matter has fallen onto the first conductive member 21 or the second conductive member 31. When the detected capacitance parameter is different from the preset capacitance parameter, the capacitor is not in a clean state, indicating that a change has occurred in the detected capacitance parameter, meaning that at least one of the capacitance parameter, the current parameter, the capacitance variation range parameter, and the current variation range parameter has changed. Therefore, it can be determined that at least one of the first conductive member 21 or the second conductive member 31 has a foreign matter.

[0129] This is because the foreign matter itself has a certain mass that will affect the vertical distance between the first conductive member 21 and the second conductive member 31. In addition, some foreign matter will block the first through hole 23 on the first conductive member 21. In this way, during gas exchange, the gas cannot enter and exhaust effectively, so the force of the gas on the first conductive member 21 (i.e., the first conductive member 21) becomes greater, and the first conductive member 21 itself will produce greater vibrations, resulting in different vibrations of the first conductive member 21. In other words, the change in the vertical distance between the first conductive member 21 and the second conductive member 31 is greater than when there is no foreign matter. The change in vertical distance will affect at least one of the capacitance parameters, current parameters, capacitance variation range parameters, and current variation range parameters.

[0130] For example, when the electronic device 1 includes a speaker module 80, the diaphragm 820 vibrates at a predetermined frequency to produce sound, thereby causing the first conductive member 21 to vibrate. When a foreign object is present, the foreign object causes the first conductive member 21 to vibrate more strongly, thereby changing the capacitance variation range parameters of the capacitor and the current variation range parameters. This is different from the preset capacitance variation range parameters of the capacitor and the preset current variation range parameters, thereby determining the presence of a foreign object.

[0131] For another example, if an electronic device 1 includes an air intake, exhaust, or heat sink and is in a stable operating state, and a foreign object falls into the device, the foreign object will change the capacitance of the capacitor and generate a current, thereby changing the capacitance and current parameters. This will be different from the preset capacitance and current parameters of the capacitor, thereby determining the presence of a foreign object.

[0132] Please refer to Figure 21 , Figure 21 This is a schematic diagram of the steps after S300 in one embodiment of the present application. In this embodiment, after S300 "determining that there is a foreign object on the capacitor", S410 and S420 are further included. S410 and S420 are described in detail below.

[0133] S410: Obtain a difference parameter between the detected capacitance parameter and the preset capacitance parameter.

[0134] S420: When the difference parameter is greater than a preset value, a foreign object reminder message is issued.

[0135] After determining that at least one of the first conductive member 21 and the second conductive member 31 has a foreign object, the detection capacitance parameter and the preset capacitance parameter are described. Therefore, in this embodiment, the difference parameter between the detection capacitance parameter and the preset capacitance parameter can be first obtained, that is, the difference between the detection capacitance parameter and the preset capacitance parameter. In other words, it is the difference between the capacitance and its variation range, and the current and its variation range. The difference parameter is then compared with the preset value. When the difference parameter is less than or equal to the preset value, it is determined that although there is a foreign object, it is still within the controllable range. At this time, the foreign object reminder can be temporarily not issued. However, if the difference parameter is greater than the preset value, there may be more foreign objects or larger foreign objects falling on the capacitor. Or because the interval is too long, foreign objects continue to accumulate, forming a large number of foreign objects. It is determined that not only is there a foreign object, but the foreign objects are already numerous and large in size, affecting the normal exchange of gas, and need to be cleaned up. Therefore, a foreign object reminder message can be issued to remind the electronic device 1 or the user. In addition, the preset value can be adjusted according to other aspects such as the model of the electronic device 1 , the size of the first via hole 12 , and the purpose of the first via hole 12 .

[0136] Optionally, the preset value may be obtained from a server or a terminal, or the preset value may be pre-stored in a memory of the electronic device 1 and then directly retrieved from the memory.

[0137] In summary, this embodiment not only requires the presence of foreign matter, but also requires the presence of a large amount of foreign matter before issuing a foreign matter warning message, which can reduce the frequency of warnings and reduce power consumption. Of course, in other embodiments, a foreign matter warning message can be issued as long as the detected capacitance parameter is different from the preset capacitance parameter, thereby promptly alerting the user and the electronic device 1.

[0138] Please refer to Figure 22 , Figure 22 This is a schematic diagram of the steps after S300 in another embodiment of the present application. In this embodiment, after S300 "determining that there is a foreign object on the capacitor," the steps further include S510, S520, and S530. The details of S510, S520, and S530 are as follows.

[0139] S510: Obtain a difference parameter between the detected capacitance parameter and the preset capacitance parameter.

[0140] S520, obtaining a preset difference parameter; wherein the preset difference parameter includes a correspondence between a preset difference range and at least one of a foreign matter type, a foreign matter quantity, and a foreign matter size.

[0141] S530: issuing foreign object warning information according to the difference parameter and the preset difference parameter; wherein the foreign object warning information includes at least one of foreign object type information, foreign object quantity information, and foreign object size information.

[0142] After determining that at least one of the first conductive member 21 and the second conductive member 31 has a foreign object, the detected capacitance parameter and the preset capacitance parameter are described. Therefore, in this embodiment, the difference parameter between the detected capacitance parameter and the preset capacitance parameter can be first obtained, that is, the difference between the detected capacitance parameter and the preset capacitance parameter. In other words, the difference between the capacitance and its variation range, and the current and its variation range.

[0143] Then, a preset difference parameter is obtained, where the preset difference parameter includes a correspondence between a preset difference range and at least one of the foreign object type, foreign object quantity, and foreign object size. For example, when the preset difference range is A, the foreign object type is a1, the foreign object quantity is a2, and the foreign object size is a3. When the preset difference range is B, the foreign object type is b1, the foreign object quantity is b2, and the foreign object size is b3. When the preset difference range is C, the foreign object type is c1, the foreign object quantity is c2, and the foreign object size is c3, etc.

[0144] Optionally, the preset difference parameter can be obtained from a server or a terminal, or pre-stored in a memory of the electronic device 1 and then directly retrieved from the memory.

[0145] The difference parameter can then be compared with a preset difference parameter. Specifically, it can be determined whether the difference parameter falls within a preset difference range. For example, if the difference parameter falls within the preset difference range A, the foreign object type can be determined to be a1, the number of foreign objects to be a2, and the size of the foreign object to be a3. Accordingly, a foreign object warning message can be issued, wherein the foreign object warning message includes at least one of the foreign object type information, foreign object number information, and foreign object size information, thereby informing the user of the specific situation of the current foreign object.

[0146] Please refer to Figure 23 , Figure 23 This is a schematic diagram of the steps following S300 in another embodiment of the present application. In this embodiment, the electronic device 1 further includes a speaker unit 82 having a diaphragm 820. After S300, "Determining that a foreign object is present on the capacitor," the electronic device 1 further includes S610. S610 is described in detail below.

[0147] S610 , increasing the amplitude of the diaphragm 820 to separate at least a portion of the foreign matter from the first conductive member 21 and the second conductive member 31 .

[0148] In this embodiment, after determining that a foreign object has fallen into the capacitor, there is no need to remind the user, and the foreign object removal operation can be directly performed using the speaker module 80 of the electronic device 1. Specifically, the volume of the speaker module 80 can be increased, that is, the amplitude of the diaphragm 820 can be increased, causing the diaphragm 820 to vibrate more, causing the first conductive member 21 and the second conductive member 31 to vibrate more and deflect more, thereby shaking at least part of the foreign object off the first conductive member 21 and the second conductive member 31, separating at least part of the foreign object from the first conductive member 21 and the second conductive member 31. The vibration of the speaker drives the vibration of the conductive member 14 to achieve vibration dust removal.

[0149] Please refer to Figure 24 , Figure 24 This is a schematic diagram of S200 in one embodiment of the present application. In this embodiment, the electronic device 1 further includes a speaker unit 82 having a diaphragm 820. S200, "Detecting the Capacitance Parameter of the Capacitor," includes S210, S220, and S230. S210, S220, and S230 are described in detail below.

[0150] S210 , obtaining a first amplitude of the diaphragm 820 .

[0151] S220 , obtaining a second amplitude of the diaphragm 820 .

[0152] S230: When the second amplitude is smaller than the first amplitude, detect a detection capacitance parameter of the capacitor.

[0153] When the diaphragm 820 of the speaker unit 82 vibrates, it has an amplitude, and the amplitude is the absolute value of the maximum displacement of the diaphragm 820 from the equilibrium position when it vibrates. Therefore, the amplitude can represent the vibration intensity of the diaphragm 820. In this embodiment, the first amplitude of the diaphragm 820 can be obtained first, and then the second amplitude of the diaphragm 820 can be obtained. When the second amplitude is smaller than the first amplitude, it means that the vibration intensity of the diaphragm 820 has weakened. From this, it can be inferred that it may be because a foreign object has fallen on the capacitor, and the foreign object has blocked the through hole of the first conductive part 21 or the second conductive part 31, which reduces the smoothness of gas exchange, thereby reducing the amplitude of the diaphragm 820. Therefore, the detection capacitance parameter of the capacitor can be detected at this time, and used to compare with the preset capacitance parameter to further determine whether there is a foreign object falling on the capacitor.

[0154] Please refer to Figure 25 , Figure 25 Schematic diagram of S200 in another embodiment of the present application. In this embodiment, S200 "detecting the capacitance parameter of the capacitor" includes S240. S240 is described in detail as follows.

[0155] S240: Detect capacitance parameters of the capacitor at preset time intervals.

[0156] In this embodiment, the detection capacitance parameter of the capacitor can also be detected at intervals of a preset time, thereby reducing the detection frequency. Optionally, the size of the preset time can vary according to other aspects such as the model of the electronic device 1, the size of the first via 12, the purpose of the first via 12, etc. Alternatively, the preset time varies with the environment in which the electronic device 1 is located. For example, when the electronic device 1 is in the first environment, the preset time is the first time; when the electronic device 1 is in the second environment, the preset time is the second time, wherein the cleanliness of the first environment is greater than the cleanliness of the second environment, and the first time is greater than the second time. In other words, when the electronic device 1 is in a relatively clean environment, the preset time can be longer. When the electronic device 1 is in a relatively dirty environment, the preset time can be shorter.

[0157] The above is a detailed introduction to the contents provided in the implementation mode of the present application. This article explains and illustrates the principles and implementation modes of the present application. The above explanation is only used to help understand the method and core idea of the present application. At the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation mode and application scope. In summary, the contents of this specification should not be understood as limiting the present application.

Claims

1. An electronic device, characterized in that: include: A first shell having a receiving space, wherein the first shell has a first through hole communicating with the receiving space; a first conductive member, mounted on the first housing, covering the first via hole, and having a plurality of first through holes communicating with the first via hole; a second conductive member disposed in the receiving space and spaced apart from the first conductive member, the second conductive member being farther away from the first via hole than the first conductive member, and at least a portion of an orthographic projection of the second conductive member on the first conductive member being located within the first conductive member, so as to form a capacitor with the first conductive member; as well as a processor electrically connected to the first conductive member and the second conductive member, the processor being configured to detect a change in a capacitance parameter of the capacitor and determine whether there is a foreign object on the capacitor based on the change in the capacitance parameter; a first adhesive member having insulating properties, being located between the first housing and the first conductive member, and having a second via hole communicating with the first through hole and the first via hole; A first shielding member is installed on the first shell, and the first shielding member includes a middle portion and an edge portion connected to each other, the edge portion is located at the periphery of the middle portion, and the edge portion is bonded to the first adhesive member; at least part of the middle portion covers the first via hole, and the middle portion has a second through hole connected to the first through hole, and the first conductive member is prepared on the middle portion by electroplating, spraying, chemical vapor deposition, or physical vapor deposition.

2. The electronic device according to claim 1, wherein The electronic device further includes a first shielding member installed on the first housing, the first shielding member has a second through hole communicating with the first through hole, and the first conductive member is arranged on a side of the first shielding member close to the second conductive member.

3. The electronic device according to claim 1, wherein The first shell includes a first insulating portion having the first through hole, and the first conductive member is installed on the first insulating portion.

4. The electronic device according to claim 1, wherein The electronic device also includes a first buffer and two first adhesive members, the first buffer is located between the first conductive member and the first shell, one first adhesive member is located between the first buffer and the first shell, and the other first adhesive member is located between the first buffer and the first conductive member, and the first buffer has a third via hole connected to the second via hole.

5. The electronic device according to claim 4, wherein: The first conductive member, the first buffer member, and the two first adhesive members are all provided with positioning holes. The first shell is provided with positioning posts, and at least part of the positioning posts is disposed in the positioning holes.

6. The electronic device according to claim 1, wherein The electronic device further includes a second shielding member disposed in the receiving space, the second shielding member is spaced apart from the first conductive member, the second conductive member is disposed on the second shielding member, and the second conductive member and the second shielding member have a plurality of third through holes.

7. The electronic device according to claim 6, wherein: The second conductive member is disposed on a side of the second shielding member close to the first conductive member.

8. The electronic device according to claim 6, wherein: An orthographic projection of the first conductive member on the second conductive member overlaps with the second conductive member.

9. The electronic device according to claim 6, wherein: The size of the third through hole is smaller than that of the first through hole.

10. The electronic device according to claim 6, wherein: The electronic device further includes a shielding member having a shielding groove. The second conductive member is disposed in the shielding groove, and an opening direction of the shielding groove faces the first conductive member.

11. The electronic device according to claim 6, wherein: The electronic device also includes a second shell, which is installed on the first shell. The second shell includes a bottom wall and a side wall bent and connected to the periphery of the bottom wall. At least part of the side wall is arranged in the receiving space. The first conductive part is located between the first shell and the side wall. The second shielding part and the second conductive part are located on the side of the side wall away from the first conductive part; the side wall has a fourth through hole connecting the first through hole and the third through hole.

12. The electronic device according to claim 11, wherein: The electronic device further includes a speaker module, at least a portion of which is disposed in the receiving space, the speaker module including a speaker unit and a bracket connected to each other, the bracket being bonded to the bottom wall, and the second shielding member and the second conductive member being mounted on the bracket; Part of the bracket, part of the speaker unit, and the second shell are arranged to form a first sound cavity, and the remaining bracket and the remaining speaker unit are arranged to form a second sound cavity, and the remaining bracket has a fifth through hole connecting the second sound cavity and the third through hole; The speaker module is electrically connected to the processor. When there is foreign matter on the capacitor, the processor is further configured to increase the amplitude of the diaphragm of the speaker unit to separate at least part of the foreign matter from the first conductive member and the second conductive member.

13. The electronic device according to claim 12, wherein: The bracket includes a body and an extension portion bent and connected to the periphery of the body, and at least a portion of the body includes a conductive portion.

14. The electronic device according to claim 13, wherein: The extension portion includes a second insulating portion having the fifth through hole. The electronic device also includes a second adhesive member disposed between the second insulating portion and the second shielding member, and having a fourth via hole connected to the fifth through hole.

15. A foreign body detection method, characterized in that: Applicable to electronic equipment, the electronic equipment comprising: A first shell having a receiving space, wherein the first shell has a first through hole communicating with the receiving space; a first conductive member, mounted on the first housing, covering the first via hole, and having a plurality of first through holes communicating with the first via hole; a second conductive member disposed in the receiving space and spaced apart from the first conductive member, the second conductive member being farther away from the first via hole than the first conductive member, and at least a portion of an orthographic projection of the second conductive member on the first conductive member being located within the first conductive member, so as to form a capacitor with the first conductive member; and a processor electrically connected to the first conductive member and the second conductive member, the processor being configured to detect a change in a capacitance parameter of the capacitor and determine whether there is a foreign object on the capacitor based on the change in the capacitance parameter; a first adhesive member having insulating properties, being located between the first housing and the first conductive member, and having a second via hole communicating with the first through hole and the first via hole; a first shielding member mounted on the first housing, the first shielding member comprising a middle portion and an edge portion connected to each other, the edge portion being located at a periphery of the middle portion and bonded to the first bonding member; at least a portion of the middle portion covers the first through hole, and the middle portion has a second through hole communicating with the first through hole; The foreign body detection method comprises: Obtaining a preset capacitance parameter of the capacitor when the capacitor is in a clean state; detecting a detection capacitance parameter of the capacitor; and When the detected capacitance parameter is different from the preset capacitance parameter, it is determined that there is foreign matter on the capacitor.

16. The foreign matter detection method according to claim 15, wherein: After "determining that there is a foreign object on the capacitor", the method further includes: Obtaining a difference parameter between the detected capacitance parameter and the preset capacitance parameter; When the difference parameter is greater than a preset value, a foreign object reminder message is issued.

17. The foreign matter detection method according to claim 15, wherein: After "determining that there is a foreign object on the capacitor", the method further includes: Obtaining a difference parameter between the detected capacitance parameter and the preset capacitance parameter; Obtaining a preset difference parameter; wherein the preset difference parameter includes a correspondence between a preset difference range and at least one of a foreign body type, a foreign body quantity, and a foreign body size; Foreign object reminder information is issued according to the difference parameter and the preset difference parameter; wherein the foreign object reminder information includes at least one of foreign object type information, foreign object quantity information, and foreign object size information.

18. The foreign matter detection method according to claim 15, wherein: The electronic device further includes a speaker unit having a diaphragm. After "determining that a foreign object is present on the capacitor," the electronic device further includes: The vibration amplitude of the diaphragm is increased to separate at least a portion of the foreign matter from the first conductive member and the second conductive member.

19. The foreign matter detection method according to claim 15, wherein: The electronic device further includes a speaker unit having a diaphragm, and “detecting a capacitance parameter of the capacitor” includes: obtaining a first amplitude of the diaphragm; obtaining a second vibration amplitude of the diaphragm; When the second amplitude is smaller than the first amplitude, a detection capacitance parameter of the capacitor is detected.

20. The foreign matter detection method according to claim 15, wherein: “Detecting capacitance parameters of the capacitor” includes: The detection capacitance parameter of the capacitor is detected at preset time intervals.

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