Coil device

Abstract

The present invention provides a coil device with sufficiently large magnetic coupling. The coil device (10) comprises: a first conductor (30), a second conductor (40) arranged inside the first conductor (30) and at least partly extending along the first conductor (30), a core (20a, 20b) in which the first conductor (30) and the second conductor (40) are arranged, and an insulating layer (70) is formed at least between the first conductor (30) and the second conductor (40).

Description

Technical Field

[0001] The present invention relates to a coil device used as, for example, an inductor. Background Art

[0002] As a coil device used as an inductor or the like, there is known a coil device described in Patent Document 1, for example. The coil device described in Patent Document 1 includes two conductors and a core in which the two conductors are arranged. In the coil device described in Patent Document 1, a region where no magnetic body is arranged is formed between the two conductors, thereby increasing the magnetic coupling between the two conductors.

[0003] However, in the coil device described in Patent Document 1, it is difficult to sufficiently increase the magnetic coupling between the two conductors due to its structure, and a technology that can sufficiently increase the magnetic coupling between the conductors is required.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-184509 Summary of the invention

[0007] Problems to be solved by the invention

[0008] The present invention has been developed in view of such actual circumstances, and an object of the present invention is to provide a coil device having sufficiently large magnetic coupling.

[0009] Technical solutions to solve problems

[0010] In order to achieve the above-mentioned object, a first aspect of the present invention provides a coil device having:

[0011] a first conductor;

[0012] A second conductor, which is disposed inside the first conductor and at least a portion of which extends along the first conductor;

[0013] a core having the first conductor and the second conductor arranged therein,

[0014] An insulating layer is formed at least between the first conductor and the second conductor.

[0015] The coil device of the first aspect of the present invention has a first conductor and a second conductor arranged inside the first conductor and at least partially extending along the first conductor, and an insulating layer is formed at least between the first conductor and the second conductor. In this case, the first conductor and the second conductor are arranged in an overlapping (double-layer) manner at a predetermined interval, but in this configuration, magnetic flux can be efficiently transmitted between the first conductor and the second conductor, and the magnetic coupling between the first conductor and the second conductor can be fully increased. In addition, the first conductor and the second conductor are fully insulated via the insulating layer interposed therebetween, so that a short circuit failure can be prevented between the first conductor and the second conductor, and a highly reliable coil device can be realized.

[0016] Preferably, the second conductor is composed of a flat wire, and the insulating layer is composed of an insulating film formed on the surface of the second conductor. In this way, by using a flat wire with an insulating film as the second conductor, the insulating layer can be interposed between the first conductor and the second conductor simply by overlapping and arranging the second conductor inside the first conductor, and the above-mentioned effect can be easily obtained.

[0017] Preferably, the first conductor and the second conductor are connected via a fusion layer formed by fusing the insulating layer formed on the surface of the second conductor. With such a structure, the insulating layer formed by the fusion layer can be filled without a gap between the first conductor and the second conductor, and the insulation between the first conductor and the second conductor can be fully ensured.

[0018] Preferably, the insulating layer is formed between the core and the first conductor or the second conductor. By setting such a structure, the core and the first conductor or the second conductor are fully insulated via the insulating layer interposed therebetween, thereby preventing a short circuit failure between the core and the first conductor or the second conductor, and realizing a highly reliable coil device.

[0019] Preferably, the first conductor is formed of a conductor plate having a plating layer formed on the surface. With such a structure, it is easy to attach a bonding member such as solder or a conductive adhesive to the surface of the first conductor, and the first conductor can be firmly connected to the mounting surface of the mounting substrate. In particular, when solder is used as the bonding member, a solder fillet can be easily formed on the side surface of the first conductor, thereby making the connection between the first conductor and the mounting surface of the mounting substrate firmly connected.

[0020] Preferably, the second conductor has a mounting opposite surface that can be opposite to the mounting surface, the mounting opposite surface is composed of a bondable surface without the insulating layer formed thereon and a non-bonding surface with the insulating layer formed thereon, and the non-bonding surface is formed closer to the first conductor than the bondable surface. In this case, it is easy to attach the bonding component to the bondable surface, and on the other hand, it is not easy to attach the bonding component to the non-bonding surface. Therefore, the bonding component attached to the bondable surface can be prevented from being exposed to the first conductor by the non-bonding surface, and a short circuit defect can be effectively prevented from occurring between the first conductor and the second conductor.

[0021] Preferably, the bondable surface has a rising portion that rises relative to the mounting surface. By setting such a structure, a bonding component can be attached not only to the surface opposite to the mounting surface of the mounting substrate, but also to the rising portion. Therefore, when soldering is used as the bonding component, a solder fillet can be formed on the rising portion of the bondable surface, and the second conductor can be firmly connected to the mounting surface of the mounting substrate. In addition, by setting such a structure, it is possible to prevent, for example, a solder ball from being formed on the mounting portion of the second conductor.

[0022] Preferably, an outer curved portion that curves outward is formed at the end of the first conductor, and an inner curved portion that curves inward is formed at the end of the second conductor, and the curvature radius of the inner surface of the outer curved portion is larger than the curvature radius of the outer surface of the inner curved portion. In this case, the bending angle of the inner surface of the outer curved portion (the portion of the inner surface of the first conductor where the outer curved portion is located) is smaller than the bending angle of the outer surface of the inner curved portion (the portion of the outer surface of the second conductor where the inner curved portion is located). Therefore, the outer surface of the inner curved portion is sharply curved near the mounting surface of the mounting substrate, while the inner surface of the outer curved portion is slowly curved from a position away from the mounting surface of the mounting substrate. Therefore, a large space is formed between the inner surface of the outer curved portion and the outer surface of the inner curved portion, and a short circuit defect can be effectively prevented from occurring between the first conductor and the second conductor around the mounting surface of the mounting substrate.

[0023] Preferably, the cross-sectional area of ​​the first conductor perpendicular to the extending direction is larger than the cross-sectional area of ​​the second conductor perpendicular to the extending direction. With such a structure, the DC resistance of the first conductor can be reduced compared to the DC resistance of the second conductor.

[0024] Preferably, the bottom surface of the core is arranged at a position separated from the mounting surface. By setting such a structure, the insulation between the bottom surface of the core and the mounting surface of the mounting substrate can be fully ensured, and in particular, when the core is formed by a metal magnetic body, etc., a short circuit failure between the bottom surface of the core and the mounting surface of the mounting substrate can be effectively prevented.

[0025] Preferably, an insulating coating is formed at least on the bottom surface of the core. By setting such a structure, the insulation between the bottom surface of the core and the second conductor (or, the first conductor) and the insulation between the bottom surface of the core and the mounting surface of the mounting substrate can be fully ensured through the insulating coating.

[0026] Preferably, the mounting portion of the first conductor and the mounting portion of the second conductor are insulated via a resin gasket. With such a structure, it is possible to effectively prevent a short circuit failure from occurring between the first mounting portion and the second mounting portion.

[0027] In order to achieve the above object, a second aspect of the present invention provides a coil device having:

[0028] A first conductor having a first outer mounting portion formed at one end and a second outer mounting portion formed at the other end;

[0029] A second conductor, which is arranged inside the first conductor and has a first inner mounting portion formed at one end and a second inner mounting portion formed at the other end;

[0030] a core, which disposes the first conductor and the second conductor inside;

[0031] The resin gasket includes a first lateral insulating portion disposed between the first outer mounting portion and the first inner mounting portion, and a second lateral insulating portion disposed between the second outer mounting portion and the second inner mounting portion.

[0032] The coil device of the second aspect of the present invention comprises: a first conductor having a first outer mounting portion formed at one end and a second outer mounting portion formed at the other end; and a second conductor having a first inner mounting portion formed at one end and arranged inside the first conductor, and a second inner mounting portion formed at the other end. That is, in the coil device of the second aspect of the present invention, the first conductor and the second conductor are overlapped (double-layered) at a predetermined interval, as in the coil device of the first aspect of the present invention, so that magnetic flux can be efficiently transmitted between the first conductor and the second conductor, and the magnetic coupling between the first conductor and the second conductor can be sufficiently increased.

[0033] In addition, the coil device of the second aspect of the present invention has a resin gasket, which has a first lateral insulating portion arranged between the first outer mounting portion and the first inner mounting portion, and a second lateral insulating portion arranged between the second outer mounting portion and the second inner mounting portion. By arranging the first lateral insulating portion between the first outer mounting portion and the first inner mounting portion, the insulation distance between them can be fully ensured via the first lateral insulating portion, and the first outer mounting portion can be fully insulated from the first inner mounting portion. Similarly, by arranging the second lateral insulating portion between the second outer mounting portion and the second inner mounting portion, the insulation distance between them can be fully ensured via the second lateral insulating portion, and the second outer mounting portion can be fully insulated from the second inner mounting portion. Therefore, a short circuit failure between the first conductor and the second conductor can be prevented, and a coil device with high reliability can be achieved.

[0034] Preferably, the bottom surface of the resin pad is arranged above the bottom surfaces of the first inner mounting portion and the second inner mounting portion, and is arranged above the bottom surfaces of the first outer mounting portion and the second outer mounting portion. With such a structure, when the coil device is mounted on the mounting substrate with the resin pad mounted, the resin pad can be prevented from interfering (contacting) with the mounting substrate, and the mounting strength between the coil device and the mounting substrate can be fully ensured.

[0035] Preferably, the resin gasket has an inner insulating portion between one end and the other end of the second conductor, and the inner insulating portion is arranged between the bottom surface of the core and the first inner mounting portion, and is arranged between the bottom surface of the core and the second inner mounting portion. By arranging (a portion of) the inner insulating portion between the bottom surface of the core and the first inner mounting portion, the insulation distance between them can be sufficiently ensured via the inner insulating portion, and the bottom surface of the core and the first inner mounting portion can be sufficiently insulated. Similarly, by arranging (a portion of) the inner insulating portion between the bottom surface of the core and the second inner mounting portion, the insulation distance between them can be sufficiently ensured via the inner insulating portion, and the bottom surface of the core and the second inner mounting portion can be sufficiently insulated.

[0036] In addition, by disposing (a part of) the inner insulating portion between the bottom surface of the core and the first inner mounting portion and by filling the space therebetween with (a part of) the inner insulating portion, when the first inner mounting portion is connected to the pad pattern of the mounting substrate by, for example, solder, the problem of the first inner mounting portion and the bottom surface of the core being connected by a solder ball (occurrence of a short circuit defect) can be effectively prevented. Similarly, by disposing (a part of) the inner insulating portion between the bottom surface of the core and the second inner mounting portion and by filling the space therebetween with (a part of) the inner insulating portion, when the second inner mounting portion is connected to the pad pattern of the mounting substrate by, for example, solder, the problem of the second inner mounting portion and the bottom surface of the core being connected by a solder ball (occurrence of a short circuit defect) can be effectively prevented.

[0037] Alternatively, a first gap is formed between the first side insulating portion and one end of the inner insulating portion in the first direction, a second gap is formed between the second side insulating portion and the other end of the inner insulating portion in the first direction, the first side insulating portion, the second side insulating portion, and the inner insulating portion extend along a second direction orthogonal to the first direction, and the resin gasket has a first connecting portion that connects one end of each of the first side insulating portion, the second side insulating portion, and the inner insulating portion in the second direction along the first direction. By setting such a structure, one end of the second conductor can be embedded in the resin gasket via the first gap, and the other end of the second conductor can be embedded in the resin gasket via the second gap, and the installation of the resin gasket relative to the second conductor becomes easy. In addition, by connecting the first side insulating portion, the second side insulating portion, and the inner insulating portion using the connecting portion, a resin gasket that integrates them via the connecting portion can be formed, and the installation of the resin gasket relative to the second conductor becomes easy compared to the case where they are formed as separate bodies.

[0038] Preferably, a first outer inclined portion is formed on at least one of the upper surface and the lower surface of the first connecting portion so as to be inclined to the outer side in the second direction. After the resin gasket is mounted on the second conductor, for example, when the first conductor and the second conductor are mounted on the core, the structure as described above can prevent the connecting portion of the resin gasket from interfering (contacting) with the bottom surface of the core during the process, and the process can be easily performed.

[0039] Preferably, at the other end of the inner insulating portion located on the opposite side of the first connecting portion in the second direction, a second outer inclined portion is formed on at least one of the upper surface and the lower surface of the inner insulating portion so as to be inclined to become lower toward the outer side in the second direction. With such a structure, when the resin gasket is mounted relative to the second conductor, the inner insulating portion of the resin gasket can be prevented from interfering (contacting) with the bottom surface of the core, etc., and the resin gasket can be mounted smoothly.

[0040] Preferably, at the other end of the inner insulating portion located on the opposite side of the first connecting portion in the second direction, the width of the inner insulating portion along the first direction decreases toward the outside in the second direction. With such a structure, when the resin gasket is mounted relative to the second conductor, both ends of the resin gasket in the first direction can be prevented from interfering (contacting) with one end and the other end of the second conductor, and the resin gasket can be mounted smoothly.

[0041] Preferably, the resin pad has a protrusion that protrudes from the bottom surface of the resin pad and is at least partially disposed between the first front end of the first inner mounting portion and the second front end of the second inner mounting portion. With such a structure, the first front end and the second front end can be well insulated via the protrusion, and for example, a problem (occurrence of a short circuit) caused by connecting them due to a solder ball or the like can be prevented.

[0042] Preferably, a first step surface located on one side of the protruding portion and a second step surface located on the other side of the protruding portion are formed on the bottom surface of the resin gasket, the first inner mounting portion abuts against the first step surface, and the second inner mounting portion abuts against the second step surface. With such a structure, the first inner mounting portion is fixed to the first step surface, and the second inner mounting portion is fixed to the second step surface, so that the resin gasket can be mounted on the second conductor in a stable state.

[0043] It may also be that a first gap is formed between the first lateral insulating portion and one end of the inner insulating portion in the first direction, and a second gap is formed between the second lateral insulating portion and the other end of the inner insulating portion in the first direction, the first lateral insulating portion, the second lateral insulating portion, and the inner insulating portion respectively extend along a second direction orthogonal to the first direction, and the resin gasket has: a first connecting portion, which connects one end of the first lateral insulating portion, the second lateral insulating portion, and the inner insulating portion respectively in the second direction along the first direction; and a second connecting portion, which connects the other end of the first lateral insulating portion, the second lateral insulating portion, and the inner insulating portion respectively in the second direction along the first direction.

[0044] In the case of such a structure, the first gap is surrounded on all sides by the first side insulating portion, one end of the inner insulating portion in the first direction, the first connecting portion, and the second connecting portion, and the second gap is surrounded on all sides by the second side insulating portion, the other end of the inner insulating portion in the first direction, the first connecting portion, and the second connecting portion. With one end and the other end of the second conductor inserted (through) into the first gap and the second gap, respectively, the resin gasket can be attached to the core in a stable state by fixing it to the bottom surface of the core, for example.

[0045] Preferably, a first recessed portion located on one side of the second direction and a second recessed portion located on the other side of the second direction are formed on the bottom surface of the resin gasket, the first recessed portion accommodates the first inner mounting portion, and the second recessed portion accommodates the second inner mounting portion. By accommodating the first inner mounting portion in the first recessed portion and accommodating the second inner mounting portion in the second recessed portion, the first inner mounting portion and the second inner mounting portion can be prevented from being exposed to the outside, and good insulation between the first inner mounting portion and the second inner mounting portion can be achieved.

[0046] Alternatively, the resin pad includes: a first arm portion that rises from the first connection portion; a second arm portion that rises from the second connection portion; a first convex portion that protrudes inwardly in the first direction is formed at the front end portion of the first arm portion; a second convex portion that protrudes inwardly in the first direction is formed at the front end portion of the second arm portion; a first concave portion is formed on the side surface of one side of the core in the first direction; a second concave portion is formed on the side surface of the other side of the core in the first direction; the first convex portion engages with the first concave portion; and the second convex portion engages with the second concave portion. By engaging the first convex portion with the first concave portion, the first arm portion can be fixed to the side surface of the core on one side in the first direction. Similarly, by engaging the second convex portion with the second concave portion, the second arm portion can be fixed to the side surface of the core on the other side in the first direction. As a result, the resin pad can be fixed to the core via the first arm portion and the second arm portion.

[0047] Preferably, a third inclined portion inclined in a manner that becomes lower toward the outside is formed on the surface of the first lateral insulating portion at a position facing the first outer mounting portion, and a fourth inclined portion inclined in a manner that becomes lower toward the outside is formed on the surface of the second lateral insulating portion at a position facing the second outer mounting portion. By forming the third inclined portion on the surface of the first lateral insulating portion, the first lateral insulating portion can be prevented from interfering (contacting) with the first outer mounting portion. Similarly, by forming the fourth inclined portion on the surface of the second lateral insulating portion, the second lateral insulating portion can be prevented from interfering (contacting) with the second outer mounting portion.

[0048] Alternatively, one of the first inner mounting portion and the first outer mounting portion may have a curved shape bent into a substantially L-shape, the other of the first inner mounting portion and the first outer mounting portion may have a substantially straight shape, one of the second inner mounting portion and the second outer mounting portion may have a curved shape bent into a substantially L-shape, and the other of the second inner mounting portion and the second outer mounting portion may have a substantially straight shape. For example, by setting the shapes of the first inner mounting portion and the second inner mounting portion to be substantially straight shapes, the shape of the first conductor may be set to a simple shape, and the processing of the first conductor may become easy. In addition, by setting the shapes of the first outer mounting portion and the second outer mounting portion to be curved shapes (substantially L-shaped), the second conductor may be connected to the pad pattern of the mounting substrate in a stable state. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1A It is a perspective view of the coil device according to the first embodiment of the present invention.

[0050] Figure 1B yes Figure 1A A top view of the coil arrangement is shown.

[0051] Figure 1C is Figure 1A The coil device shown is a top view with a tape member attached thereto.

[0052] Figure 2 yes Figure 1A An exploded perspective view of the coil device shown.

[0053] Figure 3 yes Figure 1A The coil device shown is a cross-sectional view along line III-III.

[0054] Figure 4A It is a perspective view of a coil device according to a second embodiment of the present invention.

[0055] Figure 4B yes Figure 4A A top view of the coil arrangement is shown.

[0056] Figure 5 yes Figure 4A An exploded perspective view of the coil device shown.

[0057] Figure 6 yes Figure 4A A cross-sectional view of the coil device shown along line VI-VI.

[0058] Figure 7 It is a perspective view of a coil device according to a third embodiment of the present invention.

[0059] Figure 8 yes Figure 7 An exploded perspective view of the coil device shown.

[0060] Fig. 9 yes Figure 7 A cross-sectional view of the coil device shown along line VII-VII.

[0061] Fig.10 It is a perspective view of a coil device according to a fourth embodiment of the present invention.

[0062] Fig.11 yes Fig.10 A perspective view of the resin liner shown.

[0063] Fig.12 is Fig.11 A perspective view of a resin gasket with a second conductor mounted thereon.

[0064] Fig.13 It is a perspective view of a coil device according to a fifth embodiment of the present invention.

[0065] Fig.14A yes Fig.13 A perspective view of the resin liner shown.

[0066] Fig. 14B yes Fig.14A A bottom perspective view of the resin liner is shown.

[0067] Fig.15 Yes means Fig.13 A side view of the inner side of the coil device is shown.

[0068] Fig.16A is for Fig.13 The coil device manufacturing method shown is a perspective view for explaining the method of mounting the resin spacer on the second conductor.

[0069] Fig. 16B Yes means Fig.16A A three-dimensional diagram of the subsequent process.

[0070] Fig. 16C Yes means Fig. 16B A three-dimensional diagram of the subsequent process.

[0071] Fig.16D Yes means Fig. 16C A three-dimensional diagram of the subsequent process.

[0072] Fig.17A It is a perspective view of a coil device according to a sixth embodiment of the present invention.

[0073] Fig. 17B yes Fig.17A Bottom view of the coil arrangement shown.

[0074] Fig.18 yes Fig.17A A perspective view of the resin liner shown.

[0075] Fig.19 Yes means Fig.17A A side view of the inner side of the coil device is shown.

[0076] Fig. 20 It is a perspective view of a coil device according to a seventh embodiment of the present invention.

[0077] Fig.21 yes Fig. 20 A perspective view of the second core is shown.

[0078] Fig. 22 yes Fig. 20 A perspective view of the resin liner shown.

[0079] Fig.23 Yes means Fig. 20 A side view of the inner side of the coil device is shown.

[0080] Fig.24A It is a perspective view of a coil device according to an eighth embodiment of the present invention.

[0081] Fig. 24B yes Fig.24A Bottom view of the coil arrangement shown.

[0082] Fig.25 yes Fig.24A A perspective view of the resin liner shown.

[0083] Fig.26 Yes means Fig.24A A side view of the inner side of the coil device is shown.

[0084] Fig. 27 It is a side view showing the inner state of the coil device according to the ninth embodiment of the present invention.

[0085] Fig.28 yes Fig. 27 A perspective view of the resin liner shown.

[0086] Fig.29 It is a side view showing the inner state of the coil device according to the tenth embodiment of the present invention.

[0087] Fig.30 yes Fig.29 Bottom view of the coil arrangement shown.

[0088] Fig.31 Yes means Figure 4A A side view of the inner side of a modified example of the coil device shown.

[0089] Fig.32 yes Fig.31 A perspective view of the resin liner shown.

[0090] Fig.33A Yes means Fig. 27 A side view of the inner side of a modified example of the coil device shown.

[0091] Fig.33B yes Fig.33A Bottom view of the coil arrangement shown. DETAILED DESCRIPTION

[0092] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0093] First embodiment

[0094] like Figure 1A As shown, the coil device 10 of the first embodiment of the present invention is formed in a substantially rectangular parallelepiped shape and functions as a coupling coil for a power supply circuit, etc. The width of the coil device 10 in the X-axis direction is preferably 3.0 to 20.0 mm, the width in the Y-axis direction is preferably 3.0 to 20.0 mm, and the width in the Z-axis direction is preferably 3.0 to 20.0 mm.

[0095] like Figure 2 As shown, the coil device 10 includes a first core 20a, a second core 20b, a first conductor 30, and a second conductor 40. One of the first conductor 30 and the second conductor 40 functions as a primary coil, and the other functions as a secondary coil. The conductors 30 and 40 will be described in detail later.

[0096] The first core 20a and the second core 20b have the same shape, respectively, and are formed in a so-called E-shape. The first core 20a and the second core 20b are arranged in a manner opposite to each other in the Y-axis direction and are bonded using an adhesive or the like. The first core 20a and the second core 20b are formed of a magnetic body, for example, by molding and sintering a magnetic powder composed of a magnetic material with a high magnetic permeability, such as Ni-Zn ferrite, Mn-Zn ferrite, or a metal magnetic body.

[0097] The first core 20a includes a first base portion 21a, a pair of first outer legs 22a, 22a, a first middle leg portion 23a disposed between the pair of first outer legs 22a, 22a, a first groove portion 24a, and first side groove portions 25a, 25a. The first base portion 21a is formed in a substantially flat plate shape (substantially a rectangular parallelepiped shape).

[0098] A pair of first outer legs 22a, 22a are formed at the ends of the first base portion 21a on one side and the other side in the X-axis direction at a predetermined interval in the X-axis direction. The first outer legs 22a, 22a protrude from the surface of the first base portion 21a on one side in the Y-axis direction toward the side in the Y-axis direction by a predetermined length. The first outer legs 22a, 22a each have an elongated shape in the Z-axis direction, and extend from the upper end to the lower end of the first base portion 21a in the Z-axis direction.

[0099] The first middle leg 23a is formed at the approximate center of the first base portion 21a in the X-axis direction. The first middle leg 23a protrudes a predetermined length from the side of the first base portion 21a in the Y-axis direction facing the Y-axis direction. The first middle leg 23a has an elongated shape in the Z-axis direction, extending from the upper part of the first base portion 21a in the Z-axis direction to the lower end. The protruding width of the first middle leg 23a in the Y-axis direction is approximately equal to the protruding width of the first outer leg 22a in the Y-axis direction. In the example shown in the figure, the width of the first middle leg 23a in the X-axis direction is larger than the width of the first outer leg 22a in the X-axis direction, and is approximately 2 to 3 times larger.

[0100] like Figure 3 As shown, an insulating coating 26 is formed on the surface of the first middle leg portion 23a that faces the mounting surface 50 of the mounting substrate. The insulating coating 26 is made of a resin material such as epoxy resin or polyurethane resin. The thickness of the insulating coating 26 is preferably 1 to 200 μm. In addition, the insulating coating 26 is also formed on the bottom surface of the second middle leg portion 23b of the second core 20b.

[0101] like Figure 2 As shown, the first groove portion 24a has a shape (roughly U-shaped) corresponding to the shape of the first conductor 30, and extends along the periphery of the first middle leg portion 23a. The first conductor 30 and the second conductor 40 can be arranged in an overlapping manner inside the first groove portion 24a. The first groove portion 24a has a first side portion 241, a second side portion 242, and an upper portion 243.

[0102] The first lateral portion 241 and the second lateral portion 242 extend approximately linearly along the Z-axis direction, respectively, extending from the upper end portion of the first base portion 21a in the Z-axis direction to the lower end portion. The first lateral portion 241 is formed between the first outer leg portion 22a and the first middle leg portion 23a located on one side of the X-axis direction, and the second lateral portion 242 is formed between the first outer leg portion 22a and the first middle leg portion 23a located on the other side of the X-axis direction. The X-axis direction width of each of the first lateral portion 241 and the second lateral portion 242 is larger than the sum of the thicknesses (plate thicknesses) of each of the conductors 30 and 40. As described later, the conductor side portions 31 and 41 of the conductors 30 and 40 are arranged in the first lateral portion 241, and the conductor side portions 32 and 42 of the conductors 30 and 40 are arranged in the second lateral portion 242.

[0103] The upper portion 243 is formed above the first base portion 21a and extends in the X-axis direction. The upper portion 243 connects the upper end of the first side portion 241 and the upper end of the second side portion 242. The Z-axis direction width of the upper portion 243 is greater than the sum of the thicknesses (plate thicknesses) of the conductors 30 and 40. As described later, the conductor upper portions 33 and 43 of the conductors 30 and 40 are arranged in the upper portion 243.

[0104] A pair of first side grooves 25a, 25a are respectively formed below the first outer leg portions 22a, 22a located on one side and the other side in the X-axis direction, and extend along the X-axis direction toward one end side and the other end side of the first base portion 21a in the X-axis direction. The first side grooves 25a, 25a are respectively connected to the lower end portions of the side portions 241, 242, and a substantially L-shaped groove portion is formed by the side portions 241, 242 and the first side grooves 25a, 25a. The width of each of the first side grooves 25a, 25a in the Z-axis direction is the same as or greater than the thickness (plate thickness) of the first conductor 30. As described later, the mounting portions 34, 35 of the first conductor 30 are respectively arranged in the first side grooves 25a, 25a.

[0105] The second core 20b includes a second base portion 21b, a pair of second outer leg portions 22b, 22b, and a second middle leg portion 23b ( Figure 1B ), second groove 24b, second lateral grooves 25b, 25b. The second outer legs 22b, 22b are arranged opposite to the first outer legs 22a, 22a, and the second middle legs 23b are arranged opposite to the first middle legs 23a. The shape of the second core 20b is the same as that of the first core 20a, so the description of the shapes of the above-mentioned parts in the second core 20b is omitted.

[0106] like Figure 1B As shown, the combination of the first core 20a and the second core 20b can be performed by bonding a surface of one side of the first core 20a located on the opposite side of the first base 21a in the Y-axis direction and a surface of one side of the second core 20b located on the opposite side of the second base 21b in the Y-axis direction via an adhesive or the like (not shown). More specifically, the outer legs 22a, 22b of the cores 20a, 20b are bonded to each other and / or the middle legs 23a, 23b are bonded to each other.

[0107] When the first core 20a and the second core 20b are placed opposite to each other and combined in the Y-axis direction, gaps G1 and G2 with a specified width in the Y-axis direction are formed between the first core 20a and the second core 20b at the positions where the outer legs 22a and 22b are formed, and a gap G3 with a specified width in the Y-axis direction is formed at the positions where the middle legs 23a and 23b are formed.

[0108] The gap G1 has a predetermined length in the X-axis direction and is formed between the first outer leg portion 22a and the second outer leg portion 22b located on one side in the X-axis direction. The gap G2 has a predetermined length in the X-axis direction and is formed between the first outer leg portion 22a and the second outer leg portion 22b located on the other side in the X-axis direction. The lengths of the gaps G1 and G2 in the X-axis direction are equal to the lengths of the outer legs 22a and 22b in the X-axis direction. In addition, the gaps G1 and G2 also have a predetermined length in the Z-axis direction, which is equal to the lengths of the outer legs 22a and 22b in the Z-axis direction.

[0109] The gap G3 has a predetermined length in the X-axis direction and is formed between the first center leg portion 23a and the second center leg portion 23b. The length of the gap G3 in the X-axis direction is equal to the length of the center legs 23a and 23b in the X-axis direction. In the example shown in the figure, the length of the gap G3 in the X-axis direction is longer than the length of the gaps G1 and G2 in the X-axis direction. In addition, the gap G3 also has a predetermined length in the Z-axis direction, and its length is equal to the length of the first center legs 23a and 23b in the Z-axis direction. The gaps G1 to G3 are formed in the same straight line along the boundary between the first core 20a and the second core 20b.

[0110] The Y-axis width W1 of the gap G1 is preferably 0.1 to 1.0 mm, and more preferably 0.1 to 0.5 mm. The same applies to the Y-axis widths of the gaps G2 and G3. In addition, the Y-axis widths of the gaps G1 to G3 may be different from each other.

[0111] like Figure 2 As shown in FIG. 1 , the first conductor 30 is formed of a conductor plate and has a bent shape (roughly a U-shape). The first conductor 30 is disposed between the first core 20a and the second core 20b together with the second conductor 40. As a material constituting the first conductor 30, for example, good conductors of metals such as copper and copper alloys, silver, and nickel can be cited, but there is no particular limitation as long as it is a conductor material. The first conductor 30 is formed by, for example, machining a metal plate, but the method of forming the first conductor 30 is not limited thereto.

[0112] In the example shown in the figure, the first conductor 30 has a vertically elongated shape as a whole, and the height of the first conductor 30 in the Z-axis direction is larger than the width thereof in the X-axis direction. The cross-sectional area perpendicular to the extension direction of the first conductor 30 is larger than the cross-sectional area perpendicular to the extension direction of the second conductor 40. In addition, the thickness (plate thickness) of the first conductor 30 is larger than the thickness (plate thickness) of the second conductor 40. The thickness of the first conductor 30 is preferably 0.5 to 2.5 mm, and the thickness of the second conductor 40 is preferably 0.1 to 1 mm. The width of the first conductor 30 in the Y-axis direction may be substantially equal to the width of the second conductor 40 in the Y-axis direction.

[0113] A plating layer is formed on the entire surface of the first conductor 30. The plating layer is composed of a single layer or multiple layers, for example, a metal plating layer such as Cu plating, Ni plating, Sn plating, Ni-Sn plating, Cu-Ni-Sn plating, Ni-Au plating, Au plating, etc. The plating layer is formed by performing, for example, electroplating or electroless plating on the surface of the first conductor 30. The thickness of the plating layer is not particularly limited, but is preferably 1 to 30 μm.

[0114] The first conductor 30 includes a first conductor side portion 31, a second conductor side portion 32, a conductor upper portion 33, a first mounting portion (outer mounting portion) 34, and a second mounting portion (outer mounting portion) 35. The first conductor side portion 31 and the second conductor side portion 32 extend in the Z-axis direction, respectively. In the first conductor 30, the side where the first conductor side portion 31 is arranged functions as an input terminal (or output terminal), and the side where the second conductor side portion 32 is arranged functions as an output terminal (or input terminal). The conductor upper portion 33 extends in the X-axis direction, and connects the first conductor side portion 31 and the second conductor side portion 32, respectively.

[0115] The first mounting portion 34 and the second mounting portion 35 are respectively formed continuously (integrally) with one end and the other end of the first conductor 30, that is, the lower end of the first conductor side portion 31 and the second conductor side portion 32. The mounting portions 34 and 35 are bent in a direction substantially perpendicular to the conductor side portions 31 and 32, and extend outward in the X-axis direction. Through these mounting portions 34 and 35, the first conductor 30 can be connected to the mounting surface 50 ( Figure 3 The first conductor 30 is connected to the mounting surface 50 via a bonding member such as solder or a conductive adhesive.

[0116] like Figure 1A As shown in FIG. 1 , the ends (end faces) of the mounting portions 34 and 35 are exposed to the outside from the side direction of the first core 20a and the second core 20b in the X-axis direction. Figure 3 As shown, the lower surfaces of the mounting portions 34 and 35 are exposed to the outside from below the first core 20a and the second core 20b. By exposing the mounting portions 34 and 35 to the outside, the heat generated around the mounting portions 34 and 35 can be effectively dissipated to the outside of the cores 20a and 20b.

[0117] A first outer bent portion 38 bent toward the outside in the X-axis direction (opposite to the side on which the second conductor 40 is arranged) is formed near the boundary between the first conductor side portion 31 and the first mounting portion 34, and a second outer bent portion 39 bent toward the outside in the X-axis direction is formed near the boundary between the second conductor side portion 32 and the second mounting portion 35.

[0118] like Figure 1B and Figure 2As shown, a first outer cutout portion 36 and a second outer cutout portion 37 are formed on the outer surface of the first conductor 30. The first outer cutout portion 36 is formed on the surface of the first conductor side portion 31 and the first mounting portion 34, and extends along the extension direction (longitudinal direction) of the first conductor side portion 31 and the first mounting portion 34. The first outer cutout portion 36 is composed of a groove, and a tapered surface is formed on the inner side thereof. The shape of the first outer cutout portion 36 is equal to the shape formed by the first conductor side portion 31 and the first mounting portion 34, and is substantially L-shaped. The first outer cutout portion 36 is formed at the approximate center of the first conductor side portion 31 and the first mounting portion 34 in the Y-axis direction, and extends continuously from the upper end of the first conductor side portion 31 to the end of the first mounting portion 34.

[0119] The second outer cutout portion 37 is formed on the surface of the second conductor side portion 32 and the second mounting portion 35, and extends along the extension direction (longitudinal direction) of the second conductor side portion 32 and the second mounting portion 35. The second outer cutout portion 37 is formed by a groove, and a tapered surface is formed inside the groove. The shape of the second outer cutout portion 37 is equal to the shape formed by the second conductor side portion 32 and the second mounting portion 35, and is substantially L-shaped. The second outer cutout portion 37 is formed at the substantially central portion of the second conductor side portion 32 and the second mounting portion 35 in the Y-axis direction, and extends continuously from the upper end of the second conductor side portion 32 to the end of the second mounting portion 35.

[0120] The outer cutouts 36 and 37 are formed in the first conductor 30 at positions corresponding to the gaps G1 and G2 (positions close to the gaps G1 and G2). More specifically, the outer cutouts 36 and 37 are formed in the conductor side portions 31 and 32 so as to extend in the Z-axis direction along the outer leg edge portions 22a1 and 22b1 of the outer leg portions 22a and 22b adjacent to the first conductor 30. In addition, the outer cutouts 36 and 37 are formed in the mounting portions 34 and 35 so as to extend in the X-axis direction along the lower ends of the outer leg portions 22a and 22b.

[0121] The first outer cutout portion 36 is opposed to (faces) the other end side of the gap G1 in the X-axis direction, and at a position corresponding to the gap G1, the surface of the first conductor 30 is separated from the other end side of the gap G1 in the X-axis direction by a distance corresponding to the depth D of the first outer cutout portion 36. The second outer cutout portion 37 is opposed to (faces) one end side of the gap G2 in the X-axis direction, and at a position corresponding to the gap G2, the surface of the first conductor 30 is separated from the one end side of the gap G2 in the X-axis direction by a distance corresponding to the depth of the second outer cutout portion 37.

[0122] The Y-axis width of the outer cutouts 36 and 37 is larger than the Y-axis width of the gaps G1 and G2. The ratio W2 / W1 of the Y-axis width W2 of the first outer cutout 36 to the Y-axis width W1 of the gap G1 is preferably 0.5 to 10, more preferably 1 to 7, and particularly preferably 3 to 5. The ratio of the Y-axis width of the second outer cutout 37 to the Y-axis width of the gap G2 is the same.

[0123] The ratio W2 / W3 of the Y-axis width W2 of the first outer cutout portion 36 to the Y-axis width W3 of the first conductor 30 is preferably 0.2 to 0.8, more preferably 0.3 to 0.5. The same is true for the ratio of the Y-axis width of the second outer cutout portion 37 to the Y-axis width of the first conductor 30.

[0124] The ratio D / T1 of the depth D of the first outer cutout 36 to the thickness T1 of the first conductor 30 is preferably 0.1 to 0.5, more preferably 0.2 to 0.4. The same is true for the ratio of the depth D of the second outer cutout 37 to the thickness T1 of the first conductor 30 .

[0125] The relationship between the depth D of the first outer cutout 36 and the width W1 of the gap G1 in the Y-axis direction is preferably D>W1, but is not limited thereto. The ratio D / W1 of the depth D to the width W1 is preferably 0.5 to 5, and more preferably 1 to 3. The relationship between the depth of the second outer cutout 37 and the width of the gap G2 in the Y-axis direction is the same.

[0126] In this embodiment, by determining the values ​​of W2 / W1, W2 / W3, D / T1 or D / W1 as described above, or setting D>W1, the leakage magnetic flux generated in the gaps G1 and G2 can be prevented from colliding with the conductor side portions 31 and 32 and the mounting portions 34 and 35 at the positions corresponding to the gaps G1 and G2.

[0127] like Figure 2 As shown, the second conductor 40 is made of a flat wire and has a bent shape (approximately a U-shape). The second conductor 40 can be made of the same material as the first conductor 30. The second conductor 40 is arranged inside the cores 20a and 20b (inside the grooves 24a and 24b) together with the first conductor 30. When the conductors 30 and 40 are arranged inside the grooves 24a and 24b, the second conductor 40 is arranged inside the first conductor 30 at a predetermined interval, the middle legs 23a and 23b are arranged inside the second conductor 40, and the outer legs 22a and 22b are arranged outside the first conductor 30.

[0128] In the example shown in the figure, the second conductor 40 has a vertically long shape, and the height of the second conductor 40 in the Z-axis direction is longer than the length thereof in the X-axis direction. The second conductor 40 is smaller than the first conductor 30 and is surrounded by the first conductor 30 in this arrangement.

[0129] The second conductor 40 includes a first conductor side portion 41, a second conductor side portion 42, a conductor upper portion 43, a first mounting portion (inner mounting portion) 44, and a second mounting portion (inner mounting portion) 45. The first conductor side portion 41 and the second conductor side portion 42 extend along the Z-axis direction and are arranged opposite to each other in the X-axis direction. In the second conductor 40, the side where the first conductor side portion 41 is arranged functions as an input terminal (or output terminal), and the side where the second conductor side portion 42 is arranged functions as an output terminal (or input terminal).

[0130] The first conductor side portion 41 of the second conductor 40 extends substantially in parallel along the first conductor side portion 31 of the first conductor 30 , and the second conductor side portion 42 of the second conductor 40 extends substantially in parallel along the second conductor side portion 32 of the first conductor 30 .

[0131] The conductor upper portion 43 extends along the X-axis direction, and connects the upper ends of the first conductor side portion 41 and the second conductor side portion 42. The conductor upper portion 43 of the second conductor 40 extends substantially parallel to the conductor upper portion 33 of the first conductor 30.

[0132] The first mounting portion 44 and the second mounting portion 45 are respectively formed continuously (integrally) with one end portion and the other end portion of the second conductor 40 , that is, lower ends of the first conductor side portion 41 and the second conductor side portion 42 .

[0133] The mounting portions 44 and 45 are bent in a direction substantially perpendicular to the conductor side portions 41 and 42 and extend inward in the X-axis direction. Figure 3 As shown, the mounting portions 44, 45 extend along the bottom surfaces of the middle legs 23a, 23b, and a gap of a predetermined width is formed between the upper surfaces of the mounting portions 44, 45 and the bottom surfaces of the middle legs 23a, 23b. In addition, as described above, the insulating coating 26 is formed on the bottom surfaces of the middle legs 23a, 23b, so that the middle legs 23a, 23b and the mounting portions 44, 45 are well insulated.

[0134] With respect to the X-axis direction, the first mounting portion 44 of the second conductor 40 extends in the opposite direction to the first mounting portion 34 of the first conductor 30. Also, with respect to the X-axis direction, the second mounting portion 45 of the second conductor 40 extends in the opposite direction to the second mounting portion 35 of the first conductor 30.

[0135] The second conductor 40 can be connected to the mounting surface 50 of the mounting substrate via the mounting portions 44 and 45. The second conductor 40 is joined to the mounting surface 50 via a joining member such as solder or a conductive adhesive.

[0136] The lower surfaces of the mounting portions 44 and 45 are exposed to the outside from below the first core 20a and the second core 20b. By exposing the mounting portions 44 and 45 to the outside, the heat generated around the mounting portions 44 and 45 can be effectively dissipated to the outside of the cores 20a and 20b.

[0137] The mounting portions 44 and 45 have mounting facing surfaces 440 and 450 that can face the mounting surface 50 of the mounting substrate. The mounting facing surfaces 440 and 450 are surfaces that are connected to the mounting surface 50. The details of the mounting facing surfaces 440 and 450 will be described later.

[0138] An insulating layer 70 is formed between the first conductor 30 and the second conductor 40. The insulating layer 70 is interposed between the first conductor 30 and the second conductor 40, and plays a role of insulating the first conductor 30 from the second conductor 40. The insulating layer 70 of this embodiment is composed of an insulating film formed on the surface of the second conductor 40, and is formed integrally with the second conductor 40. In the example shown in the figure, the surface (outer surface) of the insulating layer 70 is not in contact with the inner surface of the first conductor 30, and a gap is formed between the outer surface of the insulating layer 70 and the inner surface of the first conductor 30.

[0139] As the form of the insulating layer 70, various forms are conceivable, for example, the insulating layer 70 may be formed by a fusion layer formed by fusion-bonding an insulating film formed on the surface of the second conductor 40. In this case, the inner surface of the first conductor 30 and the outer surface of the second conductor 40 are connected via the fusion layer (insulating layer 70), and the insulating layer 70 can be filled in the gap between the first conductor 30 and the second conductor 40 without a gap, so that the insulation between the first conductor 30 and the second conductor 40 can be fully ensured. In addition, by connecting the first conductor 30 and the second conductor 40 via the insulating layer 70, the effect of improving the magnetic coupling between the first conductor 30 and the second conductor 40 is obtained.

[0140] The welding layer can be formed by heating the insulating film formed on the surface of the second conductor 40. In addition, the welding layer can also be configured differently from the insulating film formed on the surface of the second conductor 40. For example, the insulating film and the welding layer can be formed in double layers on the surface of the second conductor 40.

[0141] In addition, for example, the insulating layer 70 may be formed of a resin body (a resin body such as a resin pad) formed separately from the second conductor 40. In this case, by setting the shape of the resin body to a curved shape corresponding to the shape of the gap between the first conductor 30 and the second conductor 40 (approximately a U-shape), the insulating layer 70 can be formed along the outer surface of the second conductor 40 and the inner surface of the first conductor 30.

[0142] like Figure 2As shown, the insulating layer 70 covers the entire surface of the second conductor 40 (except for the bonding surfaces 441 and 451 of the mounting opposing surfaces 440 and 450 described later). The range in which the insulating layer 70 is formed is not limited to the range shown in the figure, and the insulating layer 70 only needs to be formed at least at a position where the inner surface of the first conductor 30 and the outer surface of the second conductor 40 face each other.

[0143] like Figure 3 As shown in FIG. 1 , when the distance between the inner surface of the first conductor 30 and the outer surface of the second conductor 40 is L, the thickness T3 of the insulating layer 70 is appropriately determined within the range of 0<T3≦L. For example, when the insulating layer 70 is formed by an insulating film formed on the surface of the second conductor 40, the thickness is preferably 1 to 200 μm, and more preferably 1 to 100 μm. In addition, for example, when the insulating layer 70 is formed by a resin body formed separately from the second conductor 40, the thickness of the insulating layer 70 may be thicker than the above-mentioned thickness.

[0144] The material constituting the insulating layer 70 is not particularly limited, and examples thereof include polyester, polyester imide, polyamide, polyamide imide, polyurethane, epoxy, and epoxy-modified acrylic resin.

[0145] The insulating layer 70 entirely covers the outer surface, inner surface, and side surfaces perpendicular to the conductor side portions 41, 42 and the conductor upper portion 43. By forming the insulating layer 70 on the inner surface of the conductor side portions 41, 42 and the conductor upper portion 43, the second conductor 40 can be well insulated from the middle legs 23a, 23b of the cores 20a, 20b.

[0146] Between the second conductor 40 and the middle legs 23a, 23b of the cores 20a, 20b, the insulating layer 70 is formed integrally with the second conductor 40, and extends along the inner surface of the second conductor 40 (the conductor side portions 41, 42 and the conductor upper portion 43). The insulating layer 70 formed between the second conductor 40 and the middle legs 23a, 23b of the cores 20a, 20b is formed in the same manner as the insulating layer 70 formed between the first conductor 30 and the second conductor 40 described above.

[0147] The insulating layer 70 covers the entire inner surface, side surface, and end surface (each end surface of the second conductor 40 ) of the mounting portions 44 , 45 , and only partially covers the outer surface (mounting facing surfaces 440 , 450 ).

[0148] In more detail, the mounting opposing surfaces 440 and 450 include bondable surfaces 441 and 451 on which the insulating layer 70 is not formed, and non-bonding surfaces 442 and 452 on which the insulating layer 70 is formed. Since the insulating layer 70 is not formed on the bondable surfaces 441 and 451, conductivity is imparted to the bondable surfaces 441 and 451, and the bondable surfaces 441 and 451 can be connected to the mounting surface 50 of the mounting substrate via a bonding member such as soldering.

[0149] The bondable surfaces 441, 451 are formed from the substantially central portion of the mounting portions 44, 45 in the X-axis direction to the front end portions (each end portion of the second conductor 40) of the mounting portions 44, 45. The non-bonding surfaces 442, 452 are formed from the base end portions (the connection portions with the conductor side portions 41, 42) of the mounting portions 44, 45 to the substantially central portion of the mounting portions 44, 45 in the X-axis direction. Therefore, in the present embodiment, the non-bonding surfaces 442, 452 are formed closer to the first conductor 30 than the bondable surfaces 441, 451.

[0150] Thus, in this embodiment, the insulating layer 70 is formed on the entire inner surface of the second conductor 40 along its longitudinal direction, whereas the insulating layer 70 is not formed on the outer surface of the second conductor 40 only at both ends in its longitudinal direction.

[0151] like Figure 2 As shown in FIG. 1 , a first inner curved portion 46 curved inwardly in the X-axis direction (on the side opposite to the side where the first conductor 30 is arranged) is formed near the boundary between the first conductor side portion 41 and the first mounting portion 44, and a second inner curved portion 47 curved inwardly in the X-axis direction is formed near the boundary between the second conductor side portion 42 and the second mounting portion 45. The curvature radius of the outer surface of the inner curved portions 46 and 47 of the second conductor 40 is smaller than the curvature radius of the inner surface of the outer curved portions 38 and 39 of the first conductor 30.

[0152] In the manufacture of the coil device 10, the Figure 2 The first core 20a, the second core 20b, the first conductor 30, and the second conductor 40 are shown. As the second conductor 40, for example, a flat wire having an insulating film (insulating layer 70) formed on the surface thereof is prepared by machining. Figure 2 Such a flat wire with an insulating coating can be formed by, for example, dipping a metal plate in a resin solution.

[0153] On the mounting opposing surfaces 440, 450 of the second conductor 40, bondable surfaces 441, 451 where the insulating layer 70 is not formed are formed. The bondable surfaces 441, 451 are formed by, with respect to the above-mentioned flat wire, subjecting the insulating layer 70 to peeling off from the mounting opposing surfaces 440, 450 by laser irradiation or the like at positions where the bondable surfaces 441, 451 are to be formed. In addition, the stripping of the insulating layer 70 can also be performed by cutting the surface of the flat wire with a file or the like. It is preferred that solder is attached to the stripped portion of the insulating layer 70 by solder dipping or the like. Thus, the solder wettability of the bondable surfaces 441, 451 can be improved. In addition, the formation of the bondable surfaces 441, 451 can be performed when the flat wire is processed into Figure 2 The shaping shown can be done before, or it can also be done after processing.

[0154] Next, the first conductor 30 and the second conductor 40 are overlapped and arranged inside the first groove 24a (second groove 24b) of the first core 20a (second core 20b). More specifically, the second conductor 40 is arranged so as to surround the first middle leg 23a (second middle leg 23b), and then the first conductor 30 is arranged at a predetermined interval so as to surround the second conductor 40. At this time, the first conductor 30 and / or the second conductor 40 may be fixed to the first core 20a by an adhesive or the like.

[0155] In addition, a member in which the inner surface of the first conductor 30 and the outer surface of the second conductor 40 are previously joined via the insulating layer 70 (welding layer) may be arranged inside the first groove 24a (second groove 24b) of the first core 20a (second core 20b). In this way, by integrating the first conductor 30 and the second conductor 40 via the insulating layer 70, it is easy to arrange the first core 20a (second core 20b) inside the first groove 24a (second groove 24b).

[0156] Next, the second core 20b (first core 20a) is combined with the first core 20a (second core 20b) so that the first conductor 30 and the second conductor 40 are accommodated in the second groove portion 24b (first groove portion 24a).

[0157] At this time, if Figure 1B As shown, the first core 20a and the second core 20b are combined in a state where a prescribed interval is set in the Y-axis direction in such a manner that a gap G1 is formed between the first outer leg 22a and the second outer leg 22b on one side of the X-axis direction, a gap G2 is formed between the first outer leg 22a and the second outer leg 22b on the other side of the X-axis direction, and a gap G3 is formed between the first middle leg 23a and the second middle leg 23b.

[0158] Thus, the outer cutouts 36 and 37 are arranged to face the gaps G1 and G2, and the outer bent portions 38 and 39 are arranged to face the gap G3. Then, the first core 20a and the second core 20b are bonded together by an adhesive or the like to obtain a Figure 1A The coil arrangement 10 is shown.

[0159] Then, if Figure 1C As shown, an accessory component 60 may be attached to the upper surface of the core 20a, 20b, and text such as a manufacturing number may be printed on the surface of the belt component 60 (in the example of the identifier / illustration, text such as "R15"). Alternatively, a belt component 60 pre-printed with text such as a manufacturing number (identifier) ​​may be attached to the upper surface of the core 20a, 20b. The belt component 60 is, for example, a Kapton tape, and is attached across the cores 20a, 20b. The printing of text on the belt component 60 is performed by laser irradiation or the like. In addition, currently, an accessory component is attached in a manner of engraving text on the upper surface of the core by laser irradiation and covering the text from above, but in this case, there is a problem that it is difficult to observe the text engraved on the upper surface of the core. By printing text on the belt component attached to the upper surface of the core, or attaching the belt component printed with text to the upper surface of the core as in the present embodiment, the text can be clearly identified, and the above-mentioned problems can be effectively prevented.

[0160] Above, such as Figure 2 and Figure 3 As shown in FIG. 1 , the coil device 10 of the present embodiment includes: a first conductor 30, a second conductor 40 arranged inside the first conductor 30 and at least a portion (conductor side portions 41, 42 and conductor upper portion 43) extending along the first conductor 30 (conductor side portions 31, 32 and conductor upper portion 33), and an insulating layer 70 is formed at least between the first conductor 30 and the second conductor 40. In this case, the first conductor 30 and the second conductor 40 are arranged in an overlapping (double-layer) manner with a predetermined interval therebetween, but in this arrangement, magnetic flux can be efficiently transmitted between the first conductor 30 and the second conductor 40, and the magnetic coupling between the first conductor 30 and the second conductor 40 can be sufficiently increased. In addition, the first conductor 30 and the second conductor 40 are sufficiently insulated by the insulating layer 70 interposed therebetween, so that a short circuit failure can be prevented from occurring between the first conductor 30 and the second conductor 40, and a highly reliable coil device 10 can be realized.

[0161] In addition, the second conductor 40 of the present embodiment is composed of a flat wire, and the insulating layer 70 is composed of an insulating film formed on the surface of the second conductor 40. In this way, by using a flat wire with an insulating film as the second conductor 40, the second conductor 40 is simply overlapped and arranged inside the first conductor 30, and the insulating layer 70 can be interposed between the first conductor 30 and the second conductor 40, so that the above-mentioned effect can be easily obtained.

[0162] In addition, in the present embodiment, the insulating layer 70 is formed between the middle legs 23a, 23b of the cores 20a, 20b and the second conductor 40. Therefore, the middle legs 23a, 23b and the second conductor 40 are sufficiently insulated via the insulating layer 70 interposed therebetween, so that a short circuit failure between the middle legs 23a, 23b and the second conductor 40 can be prevented, and a highly reliable coil device 10 can be realized.

[0163] In addition, the first conductor 30 of the present embodiment is composed of a conductor plate having a plating layer formed on the surface. Therefore, a bonding member such as solder or a conductive adhesive can be easily attached to the surface of the first conductor 30, and the first conductor 30 can be firmly connected to the mounting surface 50 of the mounting substrate. In particular, when solder is used as the bonding member, a solder fillet can be easily formed on the side surface of the first conductor 30, thereby making the connection between the first conductor 30 and the mounting surface 50 of the mounting substrate firmly connected.

[0164] In addition, in the present embodiment, the mounting opposing surfaces 440 and 450 have: bondable surfaces 441 and 451 on which the insulating layer 70 is not formed; and non-bonding surfaces 442 and 452 on which the insulating layer 70 is formed, and the non-bonding surfaces 442 and 452 are formed closer to the first conductor 30 than the bondable surfaces 441 and 451. In this case, the above-mentioned bonding component is easy to adhere to the bondable surfaces 441 and 451, while on the other hand, the bonding component is difficult to adhere to the non-bonding surfaces 442 and 452. Therefore, the bonding component attached to the bondable surfaces 441 and 451 can be prevented from being exposed to the first conductor 30 by the non-bonding surfaces 442 and 452, and a short circuit defect caused by a solder ball or the like between the first conductor 30 and the second conductor 40 can be effectively prevented.

[0165] In addition, in the present embodiment, the curvature radius of the inner surface of the outer curved portions 38 and 39 is larger than the curvature radius of the outer surface of the inner curved portions 46 and 47 of the second conductor 40. In this case, the curvature angle of the inner surface of the outer curved portions 38 and 39 is smaller than the curvature angle of the outer surface of the inner curved portions 46 and 47. Therefore, the outer surface of the inner curved portions 46 and 47 is sharply curved near the mounting surface 50 of the mounting substrate, while the inner surface of the outer curved portions 38 and 39 is gently curved from a position away from the mounting surface 50 of the mounting substrate. Therefore, a large space is formed between the inner surface of the outer curved portions 38 and 39 and the outer surface of the inner curved portions 46 and 47, and a short circuit failure can be effectively prevented from occurring between the first conductor 30 and the second conductor 40 around the mounting surface 50. In addition, even when the land pattern of the mounting substrate to which the mounting portions 44 and 45 of the second conductor 40 are connected is wide in the X-axis direction, the mounting portions 34 and 35 of the first conductor 30 can be prevented from contacting the land pattern.

[0166] In the present embodiment, the cross-sectional area perpendicular to the extending direction of the first conductor 30 is larger than the cross-sectional area perpendicular to the extending direction of the second conductor 40. Therefore, the DC resistance of the first conductor 30 can be made smaller than that of the second conductor 40.

[0167] In the present embodiment, the insulating coating 26 is formed on the bottom surfaces of the middle legs 23a and 23b of the cores 20a and 20b. Therefore, the insulating coating 26 can ensure sufficient insulation between the bottom surfaces of the middle legs 23a and 23b and the second conductor 40.

[0168] Second embodiment

[0169] The coil device 110 of the second embodiment of the present invention differs only in the following points, and the other structures are the same as those of the first embodiment, achieving the same effects. In the drawings, the same reference numerals are given to the same components as those of the first embodiment, and the description of the repeated parts is omitted.

[0170] like Figure 4A and Figure 5 As shown, the coil device 110 includes a first core 120a, a second core 120b, a first conductor 130, and a second conductor 40. The first core 120a has a pair of first outer leg portions 122a, 122a, and does not have Figure 2 The side grooves 25a and 25b shown are different from the first core 20a of the first embodiment. The length of the first outer leg portions 122a and 122a in the Z-axis direction is longer by the amount that the side grooves 25a and 25b are not provided.

[0171] The second core 120b is different from the second core 20b of the first embodiment in that it is formed in a flat plate shape. When the first core 120a and the second core 120b are combined, a so-called EI type core is formed.

[0172] like Figure 4B As shown, a gap G4 is formed between the first outer leg 122a located on one side of the X-axis direction and the second core 120b, and a gap G5 is formed between the first outer leg 122a located on the other side of the X-axis direction and the second core 120b. The gaps G4 and G5 extend in the Z-axis direction and the X-axis direction respectively along the first outer leg 122a.

[0173] In addition, a gap G6 is formed between the first middle leg portion 23a and the second core 120b. The gap G6 extends in the Z-axis direction and the X-axis direction along the first middle leg portion 23a.

[0174] like Figure 5As shown, the first conductor 130 includes a first conductor side portion 131, a second conductor side portion 132, a conductor upper portion 133, a first mounting portion 134, and a second mounting portion 135. Step portions 131a and 132a are formed at the upper ends of the conductor side portions 131 and 132, and step portions 131b and 132b are formed at the lower ends of the conductor side portions 131 and 132. The step portions 131a and 132a are formed on both side surfaces (surfaces parallel to the XZ plane) of the conductor side portions 131 and 132, and the step portions 131b and 132b are formed on the inner surfaces (surfaces parallel to the YZ plane) of the conductor side portions 131 and 132.

[0175] The width of the conductor upper portion 133 in the Y-axis direction is Figure 2 The width of the conductor upper portion 33 of the illustrated first conductor 30 in the Y-axis direction is reduced by the amount by which the step portions 131 a and 132 a are formed at the upper ends of the conductor side portions 131 and 132 .

[0176] The first mounting portion 134 includes a first mounting bent portion 340, a first mounting connecting portion 341, and a first mounting main body portion 342. The second mounting portion 135 includes a second mounting bent portion 350, a second mounting connecting portion 351, and a second mounting main body portion 352. The mounting bent portions 340 and 350 are formed continuously (integrally) with the lower end portions of the conductor side portions 131 and 132. The mounting bent portions 340 and 350 are bent in a direction substantially perpendicular to the conductor side portions 131 and 132, and extend in the Y-axis direction toward the side where the first core 120a is arranged.

[0177] The mounting connection parts 341 and 351 are formed continuously (integrally) with the ends of the mounting bent parts 340 and 350, and connect the mounting bent parts 340 and 350 to the mounting main body parts 342 and 352. The mounting connection parts 341 and 351 extend outward in the X-axis direction.

[0178] The mounting body parts 342, 352 and the ends of the mounting connection parts 341, 351 are formed continuously (integrally) and extend in the Y-axis direction toward the side where the second core 120b is arranged. The first conductor 130 can be connected to the mounting surface (not shown) of the mounting substrate via the mounting body parts 342, 352. The bonding of the mounting body parts 342, 352 to the mounting surface is performed via bonding members such as solder or conductive adhesive.

[0179] A first outer cutout portion 136 and a second outer cutout portion 137 are formed on the outer surface of the first conductor 130. The outer cutout portions 136 and 137 extend continuously along the extending direction (longitudinal direction) of the conductor side portions 131 and 132 and the mounting bent portions 340 and 350. Parts (upper ends) of the outer cutout portions 136 and 137 are also formed at the respective ends of the conductor upper portion 133 in the X-axis direction.

[0180] like Figure 4B and Figure 5 As shown, the first outer cutout portion 136 is composed of the conductor upper portion 133, the first conductor side portion 131, and the surface-cut portion where the corners on one side of the Y-axis direction of each of the first mounting curved portion 340 (the corners between the outer surfaces and the side surfaces of the conductor upper portion 133, the first conductor side portion 131, and the first mounting curved portion 340) are chamfered. The second outer cutout portion 137 is composed of the conductor upper portion 133, the second conductor side portion 132, and the surface-cut portion where the corners on one side of the Y-axis direction of each of the second mounting curved portion 350 (the corners between the outer surfaces and the side surfaces of the conductor upper portion 133, the second conductor side portion 132, and the second mounting curved portion 350) are chamfered. At the positions where the outer cutout portions 136 and 137 are formed, an inclined surface (C surface) is provided on each of the conductor upper portion 133, the conductor side portions 131 and 132, and the mounting curved portions 340 and 350.

[0181] The outer cutouts 136 and 137 are formed in the conductor 130 at positions corresponding to the gaps G4 and G5 (positions close to the gaps G4 and G5). More specifically, the outer cutouts 136 and 137 are formed in the conductor 130 so as to extend in the Z-axis direction along the outer leg edges 122a1 and 122a1 of the outer leg portions 122a and 122a adjacent to the conductor 130.

[0182] The first outer cutout portion 136 faces a direction inclined with respect to the other end side of the gap G4 in the X-axis direction, and at a position corresponding to the gap G4, the distance between the surface of the conductor 130 and the other end side of the gap G4 in the Y-axis direction is a distance corresponding to the Y-axis width W5 or the X-axis width W6 of the first outer cutout portion 136. The second outer cutout portion 137 faces a direction inclined with respect to one end side of the gap G5 in the X-axis direction, and at a position corresponding to the gap G5, the distance between the surface of the conductor 130 and the one end side of the gap G5 in the Y-axis direction is a distance corresponding to the Y-axis width or the X-axis width of the second outer cutout portion 137.

[0183] The Y-axis width of the outer cutouts 136 and 137 is preferably greater than the Y-axis width of the gaps G4 and G5, but is not limited thereto. The ratio W5 / W4 of the Y-axis width W5 of the first outer cutout 136 to the Y-axis width W4 of the gap G4 is preferably 0.5 to 6, more preferably 1 to 5, and particularly preferably 2 to 4. The ratio of the Y-axis width of the second outer cutout 137 to the Y-axis width of the gap G5 is the same.

[0184] The width of the outer cutouts 136 and 137 in the X-axis direction is preferably greater than the width of the gaps G4 and G5 in the Y-axis direction, but is not limited thereto. The ratio W6 / W4 of the width W6 of the first outer cutout 136 in the X-axis direction to the width W4 of the gap G4 in the Y-axis direction is preferably 0.5 to 6, more preferably 1 to 5, and particularly preferably 2 to 4. The ratio of the width of the second outer cutout 137 in the X-axis direction to the width of the gap G5 in the Y-axis direction is the same.

[0185] The ratio W5 / W7 of the Y-axis width W5 of the first outer cutout 136 to the Y-axis width W7 of the conductor 130 is preferably 0.1 to 0.5, more preferably 0.2 to 0.3. The ratio of the Y-axis width W5 of the second outer cutout 137 to the Y-axis width W7 of the conductor 130 is the same.

[0186] The width W6 of the first outer cutout portion 136 in the X-axis direction is equal to the thickness T2 of the conductor 130 ( Figure 5 The ratio W6 / T2 of ) is preferably 0.1 to 0.9, and more preferably 0.3 to 0.7. The ratio of the width of the second outer cutout portion 137 in the X-axis direction to the thickness T2 of the conductor 130 is also the same.

[0187] In this embodiment, by determining the values ​​of W5 / W4, W6 / W4, W5 / W7 or W6 / T2 as described above, or setting them to W5>W4 or W6>W4, the leakage magnetic flux generated in the gaps G4 and G5 can be prevented from colliding with the upper portion 133 of the conductor at the positions corresponding to the gaps G4 and G5.

[0188] In this embodiment, the same effects as those of the first embodiment are obtained. In addition, in this embodiment, the dimensions of the mounting portions 134 and 135 (particularly the dimensions of the mounting body portions 342 and 352) are smaller than those of the mounting portions 34 and 35 of the first embodiment, thereby miniaturizing the coil device 110.

[0189] In addition, in this embodiment, if Figure 6 As shown, the conductor side portions 131 and 132 are provided with step portions 131b and 132b at the lower ends. Therefore, a space is formed between the mounting portions 134 and 135 (mounting bent portions 340 and 350) of the first conductor 130 and the mounting portions 44 and 45 of the second conductor 40 by the step width of the step portions 131b and 132b, and a short circuit failure between the first conductor 130 and the second conductor 40 can be effectively prevented around the mounting surface (not shown) of the mounting substrate.

[0190] Third embodiment

[0191] The coil device 210 of the third embodiment of the present invention is different only in the following points, and the other structures are the same as those of the first embodiment described above, and the same effects are achieved. In the drawings, the components common to the first and second embodiments are marked with common symbols, and the description of the repeated parts is omitted.

[0192] like Figure 7 As shown, the coil device 210 includes a first core 120a, a second core 220b, a first conductor 30, and a second conductor 240. The second core 220b has the same shape as the first core 120a.

[0193] like Figure 8 As shown in FIG. 1 , the second conductor 240 has a first mounting portion 244 and a second mounting portion 245. The ends of the mounting portions 244 and 245 (the ends of the second conductor 240) stand upward. Fig. 9 As shown, the end surfaces of the mounting portions 244 and 245 are arranged at a predetermined interval in the Z-axis direction with respect to the bottom surfaces of the middle leg portions 23 a and 23 b of the cores 120 a and 220 b.

[0194] The first mounting portion 244 has a first mounting facing surface 440', and the second mounting portion 245 has a second mounting facing surface 450'. The first mounting facing surface 440' has a first rising portion 443 rising with respect to the mounting surface (not shown) of the mounting substrate, and the second mounting facing surface 450' has a second rising portion 453 rising with respect to the mounting surface of the mounting substrate. The rising portions 443, 453 rise with respect to the mounting surface of the mounting substrate at a midway position of the bondable surfaces 441', 451' in the X-axis direction.

[0195] In this embodiment, the same effect as in the first embodiment is obtained. In addition, in this embodiment, the mounting opposing surfaces 440', 450' have rising portions 443, 453. Therefore, with respect to the mounting portions 244, 245, not only the opposing surface with respect to the mounting surface of the mounting substrate but also the bonding component can be attached to the rising portions 443, 453. Therefore, in the case of using soldering as the bonding component, it is known that solder fillets are formed on the rising portions 443, 453, and the second conductor 240 can be firmly connected to the mounting surface of the mounting substrate. In addition, it is possible to prevent the occurrence of a short circuit defect between the mounting portions 244, 245 caused by, for example, a solder ball being formed on the mounting portions 244, 245 of the second conductor.

[0196] In addition, in the present embodiment, the bottom surfaces of the cores 120a and 220b are arranged at positions separated from the mounting surface (not shown) of the mounting substrate. Figure 7As shown, the bottom surfaces of the cores 120a and 220b are separated from the bottom surfaces of the mounting portions 34 and 35 connected to the mounting surface of the mounting substrate by a distance equal to or greater than the thickness of the first conductor 30. Therefore, in this embodiment, the insulation between the bottom surfaces of the cores 120a and 220b and the mounting surface of the mounting substrate can be sufficiently ensured, and in particular, when the cores 120a and 220b are formed of a metal magnetic body or the like, a short circuit failure between the bottom surfaces of the cores 120a and 220b and the mounting surface can be effectively prevented.

[0197] Fourth embodiment

[0198] The coil device 310 of the fourth embodiment of the present invention is different only in the following points, and the other structures are the same as those of the first embodiment described above, and the same effects are achieved. In the drawings, the components common to the first to third embodiments are marked with common symbols, and the description of the repeated parts is omitted.

[0199] like Fig.10 As shown, the coil device 310 includes: a first core 120a, a second core 220b, a first conductor 30, a second conductor 40, and a resin gasket 80. The resin gasket 80 is arranged below the cores 120a and 220b and fixed in a manner spanning the first conductor 30 and the second conductor 40. The resin gasket 80 mainly has the function of achieving good insulation between the first conductor 30 and the second conductor 40.

[0200] like Fig.11 and Fig.12 As shown, the resin spacer 80 includes a base portion 81 , a first lateral insulating portion 82 a , a second lateral insulating portion 82 b , a first groove portion 83 a , a second groove portion 83 b , and a protruding portion 84 .

[0201] The base portion 81 has a flat plate shape, is disposed above each of the first mounting portion 44 and the second mounting portion 45 , and is fixed so as to be sandwiched between the lower ends of the first conductor side portion 41 and the second conductor side portion 42 of the second conductor 40 .

[0202] A protrusion 84 extending in the Y-axis direction is formed at a substantially central portion in the X-axis direction of the base portion 81. The protrusion 84 is disposed in a gap formed between the mounting portions 44 and 45 of the second conductor 40. The downward protrusion width of the protrusion 84 is substantially equal to the thickness (plate thickness) of the mounting portions 44 and 45, and the first mounting portion 44 and the second mounting portion 45 can be separated in the X-axis direction via the protrusion 84. The protrusion 84 is a member for preventing the first mounting portion 44 and the second mounting portion 45 from being connected via a bonding member (solder ball) (solder bridge) when the second conductor 40 is connected to a mounting surface (not shown) of a mounting substrate via a bonding member such as soldering.

[0203] The first groove 83a is formed between the base portion 81 and the first lateral insulating portion 82a, and the second groove 83b is formed between the base portion 81 and the second lateral insulating portion 82b. The grooves 83a and 83b extend along the Y-axis direction, and one end of the grooves 83a and 83b in the Y-axis direction is closed, while the other end in the Y-axis direction is open. The lower end of the conductor side portions 41 and 42 of the second conductor 40 can be inserted into the grooves 83a and 83b through the other end in the Y-axis direction of the grooves 83a and 83b.

[0204] The first lateral insulating portion 82a is disposed on one side of the base portion 81 in the X-axis direction with the first groove portion 83a interposed therebetween. The second lateral insulating portion 82b is disposed on the other side of the base portion 81 in the X-axis direction with the second groove portion 83b interposed therebetween. The lateral insulating portions 82a and 82b extend along the Y-axis direction and have the same Y-axis width as the base portion 81. A first inclined portion 85a is formed on the upper surface of the first lateral insulating portion 82a, and a second inclined portion 85b is formed on the upper surface of the second lateral insulating portion 82b.

[0205] The first side insulating portion 82a is disposed on the first mounting portion 34 ( Fig.10 ) and the first conductor side portion 41 of the second conductor 40. At this time, the first inclined portion 85a is arranged along the shape of the first outer bent portion 38 of the first conductor 30.

[0206] The second side insulating portion 82b is disposed on the second mounting portion 35 ( Fig.10 ) and the second conductor side portion 42 of the second conductor 40. At this time, the second inclined portion 85b is arranged along the shape of the second outer curved portion 39 of the first conductor 30.

[0207] The side insulating portions 82a and 82b are components for preventing the first mounting portion 34 (second mounting portion 35) of the first conductor 30 and the first mounting portion 44 (second mounting portion 45) of the second conductor 40 from being connected via a joining component (solder bridge) when the conductors 30 and 40 are connected to a mounting surface (not shown) of a mounting substrate via a joining component such as soldering.

[0208] In this embodiment, the same effects as those of the first embodiment are obtained. In addition, in this embodiment, the mounting portions 34 and 35 of the first conductor 30 and the mounting portions 44 and 45 of the second conductor 40 are insulated via the resin gasket 80. Therefore, it is possible to effectively prevent short circuit failures from occurring between the first mounting portions 34 and 35 and the second mounting portions 44 and 45.

[0209] Fifth embodiment

[0210] The coil device 410 of the fifth embodiment of the present invention differs only in the following points, and the other structures are the same as those of the fourth embodiment, achieving the same effects. In the drawings, the same reference numerals are used for the components common to the fourth embodiment, and the description of the repeated parts is omitted.

[0211] like Fig.13 As shown, the coil device 410 includes: a first core 420a, a second core 420b, and a resin pad 90. The second core 420b has a bottom surface recess 27. The bottom surface recess 27 is formed on the bottom surface of the second base portion 21b of the second core 420b, and is recessed from the bottom surface of the second base portion 21b to the upper side in the Z-axis direction. The bottom surface recess 27 has a predetermined length along the X-axis direction, and is continuously formed from one side of the second base portion 21b in the X-axis direction to the other side. Although detailed illustration is omitted, a bottom surface recess 27 is also formed on the bottom surface of the first base portion 21a of the first core 420a. The bottom surface recess 27 is provided so as not to interfere (contact) with the resin pad 90 when the resin pad 90 is arranged on the bottom surface of each of the cores 420a and 420b. Therefore, the depth of the bottom surface recess 27 in the Z-axis direction is preferably equal to or greater than the thickness of the resin pad 90 in the Z-axis direction.

[0212] A bottom convex portion 27a is formed at one end of the recess 27 in the X-axis direction, and a bottom convex portion 27b is formed at the other end of the recess 27 in the X-axis direction. The bottom surfaces of the bottom convex portions 27a and 27b are located above the bottom surfaces of the first mounting portion 34 and the second mounting portion 35 of the first conductor 30, and are located above the bottom surfaces of the first mounting portion 44 and the second mounting portion 45 of the second conductor 40. The bottom convex portions 27a and 27b may be omitted (see Fig.10 ).

[0213] like Fig.14A As shown, the resin gasket 90 includes an inner insulating portion 91, a first side insulating portion 92a, a second side insulating portion 92b, a first groove portion 93a, a second groove portion 93b, a protrusion 94, and a connection portion 96. The resin gasket 90 is mounted on the first mounting portion 44 and the second mounting portion 45 of the second conductor 40.

[0214] The inner insulating portion 91 has a substantially flat plate shape and extends along the Y-axis direction. Fig.15As shown in FIG. 1 , the inner insulating portion 91 is disposed above each of the first mounting portion 44 and the second mounting portion 45 of the second conductor 40, and is fixed in a manner sandwiched between the lower end portion of the first conductor side portion 41 and the lower end portion of the second conductor side portion 42 of the second conductor 40. More specifically, the inner insulating portion 91 is disposed between one end portion and the other end portion of the second conductor 40, between the bottom surface of the cores 420a, 420b and the first mounting portion 44 of the second conductor 40, and between the bottom surface of the cores 420a, 420b and the second mounting portion 45 of the second conductor 40.

[0215] The inner insulating portion 91 mainly has a function of achieving insulation between the cores 420a, 420b and the mounting portions 44, 45 of the second conductor 40. That is, by disposing a portion of the inner insulating portion 91 between the bottom surfaces of the cores 420a, 420b and the first mounting portion 44, the insulation distance therebetween can be sufficiently ensured via the inner insulating portion 91, and the bottom surfaces of the cores 420a, 420b can be sufficiently insulated from the first mounting portion 44. Similarly, by disposing a portion of the inner insulating portion 91 between the bottom surfaces of the cores 420a, 420b and the second mounting portion 45, the insulation distance therebetween can be sufficiently ensured via the inner insulating portion 91, and the bottom surfaces of the cores 420a, 420b can be sufficiently insulated from the second mounting portion 45.

[0216] In addition, by disposing a part of the inner insulating portion 91 between the bottom surface of the cores 420a and 420b and the first mounting portion 44 of the second conductor 40, and by using a part of the inner insulating portion 91 to fill the space therebetween, it is possible to effectively prevent the problem of the first mounting portion 44 and the bottom surface of the cores 420a and 420b being connected by solder balls (occurrence of short circuit failure) when the first mounting portion 44 is connected to the land pattern of the mounting substrate by, for example, soldering. Similarly, by disposing a part of the inner insulating portion 91 between the bottom surface of the cores 420a and 420b and the second mounting portion 45 of the second conductor 40, and by using a part of the inner insulating portion 91 to fill the space therebetween, it is possible to effectively prevent the problem of the second mounting portion 45 and the bottom surface of the cores 420a and 420b being connected by solder balls (occurrence of short circuit failure) when the second mounting portion 45 is connected to the land pattern of the mounting substrate by, for example, soldering.

[0217] The upper surface of the inner insulating portion 91 does not abut against the bottom surfaces of the cores 420a and 420b, and a gap is formed between the upper surface of the inner insulating portion 91 and the bottom surfaces of the cores 420a and 420b. The width of the inner insulating portion 91 in the X-axis direction is smaller than the interval between the first conductor side portion 41 and the second conductor side portion 42 of the second conductor 40, so that the inner insulating portion 91 can be smoothly inserted (arranged) between the first conductor side portion 41 and the second conductor side portion 42 along the Y-axis direction.

[0218] like Fig.14AAs shown in FIG. 1 , an outer inclined portion 910a is formed on the upper surface of the inner insulating portion 91. The outer inclined portion 910a has a tapered surface, and is inclined in a manner that becomes lower toward the outer side in the Y-axis direction at the end of the inner insulating portion 91 on the positive side in the Y-axis direction. By providing the outer inclined portion 910a, the thickness of the inner insulating portion 91 in the Z-axis direction becomes smaller as it moves toward the outer side in the Y-axis direction. Fig.15 As shown, the outer inclined portion 910a is inclined so as to be separated from the bottom surfaces of the cores 420a and 420b in the Z-axis direction. The outer inclined portion 910a is formed only on the upper surface of the inner insulating portion 91, but may be formed on the lower surface of the inner insulating portion 91.

[0219] By forming an outer inclined portion 910a on at least one of the upper surface and the lower surface of the inner insulating portion 91, when the resin gasket 91 is installed relative to the second conductor 40, the inner insulating portion 91 can be prevented from interfering (contacting) with the bottom surface of the core 420a, 420b, etc., and the installation of the resin gasket 90 becomes smooth.

[0220] like Fig.14A As shown, a side inclined portion 912a is formed on one side of the inner insulating portion 91 in the X-axis direction, and a side inclined portion 912b is formed on the other side of the inner insulating portion 91 in the X-axis direction. The side inclined portions 912a and 912b have tapered surfaces, and are inclined inwardly in the X-axis direction at the end of the inner insulating portion 91 on the positive Y-axis direction. By providing the side inclined portions 912a and 912b, the X-axis width of the inner insulating portion 91 decreases as it moves outwardly in the Y-axis direction. Fig.15 As shown, the side inclined portion 912a is inclined so as to be separated from the lower end of the first conductor side portion 41 of the second conductor 40 in the X-axis direction. In addition, the side inclined portion 912b is inclined so as to be separated from the lower end of the second conductor side portion 42 of the second conductor 40 in the X-axis direction.

[0221] By forming side inclined portions 912a and 912b on the inner insulating portion 91, when the resin gasket 90 is installed relative to the second conductor 40, the two ends of the resin gasket 90 in the X-axis direction can be prevented from interfering (contacting) with the first conductor side portion 41 and the second conductor side portion 42 of the second conductor 40, thereby smoothing the installation of the resin gasket 90.

[0222] like Fig. 14BAs shown, a protrusion 94 is formed on the lower surface (bottom surface) of the inner insulating portion 91. The protrusion 94 protrudes from the lower surface of the inner insulating portion 91 and extends along the Y-axis direction. A bottom surface inclined portion 94a is formed on the side surface of one side of the protrusion 94 in the X-axis direction, and a bottom surface inclined portion 94b is formed on the side surface of the other side of the protrusion 94 in the X-axis direction. The protrusion 94 has a tapered shape along its protruding direction, and the cross-sectional shape of the protrusion 94 (the cross-sectional shape parallel to the XZ plane) is roughly trapezoidal. One end of the protrusion 94 in the Y-axis direction is connected to the connecting portion 96, and the other end of the protrusion 94 in the Y-axis direction is located at the other end of the inner insulating portion 91 in the Y-axis direction.

[0223] like Fig.15 As shown, at least a portion of the protrusion 94 (the entire protrusion 94 in this embodiment) is disposed between the first mounting portion 44 and the second mounting portion 45 of the second conductor 40. By forming the protrusion 94 on the lower surface of the inner insulating portion 91, the front end portion 44a of the first mounting portion 44 and the front end portion 45a of the second mounting portion 45 can be well insulated via the protrusion 94, and problems such as connection between them due to solder balls (occurrence of short circuit failure) can be prevented. In addition, the lower surface (protruding surface) of the protrusion 94 is substantially flush with the lower surface of the connecting portion 96 and the lower surfaces of the side insulating portions 92a and 92b.

[0224] like Fig. 14B As shown, a first step surface 911a and a second step surface 911b are formed on the lower surface of the inner insulating portion 91. The first step surface 911a is formed on the positive direction side of the protrusion 94 in the X-axis, and the second step surface 911b is formed on the negative direction side of the protrusion 94 in the X-axis. The step heights of the step surfaces 911a and 911b correspond to the protrusion length of the protrusion 94. Fig.15 As shown, the upper surface of the first mounting portion 44 abuts against the first step surface 911a, and the upper surface of the second mounting portion 45 abuts against the second step surface 911b. Thus, the first mounting portion 44 is fixed to the first step surface 911a, and the second mounting portion 45 is fixed to the second step surface 911b, so that the resin gasket 90 can be mounted on the second conductor 40 in a stable state.

[0225] The step height of the first step surface 911a is smaller than the thickness of the first mounting portion 44. Therefore, when the upper surface of the first mounting portion 44 abuts against the first step surface 911a, the lower surface of the first mounting portion 44 is located (exposed) below the front end portion of the protrusion 94. Similarly, the step height of the second step surface 911b is smaller than the thickness of the second mounting portion 45. Therefore, when the upper surface of the second mounting portion 45 abuts against the second step surface 911b, the lower surface of the second mounting portion 45 is located (exposed) below the front end portion of the protrusion 94.

[0226] In addition, in a state where the resin gasket 90 is mounted on the second conductor 40, the lower surface of the first mounting portion 44 is located lower than the lower surface of the first lateral insulating portion 92a of the resin gasket 90, and the lower surface of the second mounting portion 45 is located lower than the lower surface of the second lateral insulating portion 92b of the resin gasket 90. As a result, in the present embodiment, the bottom surface of the resin gasket 90 is arranged higher than the lower surfaces of the first mounting portion 44 and the second mounting portion 45 of the second conductor 40, and is arranged higher than the lower surfaces of the first mounting portion 34 and the second mounting portion 35 of the first conductor 30.

[0227] With this structure, when the coil device 410 is mounted on the mounting substrate with the resin gasket 90 mounted on the second conductor 40, interference (contact) between the resin gasket 90 and the mounting substrate can be prevented, thereby ensuring sufficient mounting strength between the coil device 410 and the mounting substrate.

[0228] like Fig.14A As shown, the first lateral insulating portion 92a is arranged adjacent to the X-axis positive direction side of the inner insulating portion 91, and extends linearly along the Y-axis direction with a predetermined length. In addition, the second lateral insulating portion 92b is arranged adjacent to the X-axis negative direction side of the inner insulating portion 91, and extends linearly along the Y-axis direction with a predetermined length. The length of the lateral insulating portions 92a and 92b along the Y-axis direction is shorter than the length of the inner insulating portion 91 along the Y-axis direction. As a result, the length of the lateral insulating portions 92a and 92b along the Y-axis direction is shorter, which can improve the durability of the lateral insulating portions 92a and 92b and prevent damage to the lateral insulating portions 92a and 92b.

[0229] like Fig.15 As shown, the thickness of the side insulating portions 92a and 92b along the Z-axis direction is smaller than the thickness of the inner insulating portion 91 along the Z-axis direction, and a step is formed between the upper surfaces of the side insulating portions 92a and 92b and the upper surface of the inner insulating portion 91.

[0230] The first lateral insulating portion 92a is disposed between the first mounting portion 34 of the first conductor 30 and the first mounting portion 44 of the second conductor 40. Thus, the insulation distance between them can be sufficiently ensured through the first lateral insulating portion 92a, and the first mounting portion 34 of the first conductor 30 and the first mounting portion 44 of the second conductor 40 can be sufficiently insulated. Similarly, the second lateral insulating portion 92b is disposed between the second mounting portion 35 of the first conductor 30 and the second mounting portion 45 of the second conductor 40. Thus, the insulation distance between them can be sufficiently ensured through the second lateral insulating portion 92b, and the second mounting portion 35 of the first conductor 30 and the second mounting portion 45 of the second conductor 40 can be sufficiently insulated.

[0231] like Fig.14AAs shown, a first inclined portion 95a is formed on the upper surface of the first lateral insulating portion 92a, and a second inclined portion 95b is formed on the upper surface of the second lateral insulating portion 92b. The first inclined portion 95a extends continuously along the long side direction of the first lateral insulating portion 92a, and the second inclined portion 95b extends continuously along the long side direction of the second lateral insulating portion 92b.

[0232] like Fig.15 As shown, the first inclined portion 95a is inclined so as to become lower toward the positive direction of the X axis at a position facing the first mounting portion 34 of the first conductor 30. The second inclined portion 95b is inclined so as to become lower toward the negative direction of the X axis at a position facing the second mounting portion 35 of the first conductor 30.

[0233] By forming the first inclined portion 95a on the first side insulating portion 92a, when the first side insulating portion 92a is arranged between the first mounting portion 34 of the first conductor 30 and the first mounting portion 44 of the second conductor 40, it is possible to prevent the first side insulating portion 92a from interfering with (contacting) the first mounting portion 34 of the first conductor 30. In addition, by forming the second inclined portion 95b on the second side insulating portion 92b, when the second side insulating portion 92b is arranged between the second mounting portion 35 of the first conductor 30 and the second mounting portion 45 of the second conductor 40, it is possible to prevent the second side insulating portion 92b from interfering with (contacting) the second mounting portion 35 of the first conductor 30.

[0234] like Fig.14A As shown, a first groove portion (first gap) 93a is formed between the first side insulating portion 92a and one end of the inner insulating portion 91 in the X-axis direction, and a second groove portion (second gap) 93b is formed between the second side insulating portion 92b and the other end of the inner insulating portion 91 in the X-axis direction. In this embodiment, by fitting one end of the second conductor 40 (the lower end of the first conductor side portion 41) into the first groove portion 93a and fitting the other end of the second conductor 40 (the lower end of the second conductor side portion 42) into the second groove portion 93b, the resin gasket 90 can be attached to the second conductor 40, and the attachment of the resin gasket 90 to the second conductor 40 becomes easy.

[0235] The end of the first side insulating portion 92a on the negative direction of the Y axis, the end of the second side insulating portion 92b on the negative direction of the Y axis, and the end of the inner insulating portion 91 on the negative direction of the Y axis are connected by a connecting portion 96. The connecting portion 96 extends along the X axis direction. By connecting the first side insulating portion 92a, the second side insulating portion 92b, and the inner insulating portion 91 along the X axis direction by the connecting portion 96, it is possible to form a resin liner 90 that is integrated through the connecting portion 96, and it is easier to attach the resin liner 90 to the second conductor 40 than when they are formed as separate bodies. In addition, the end of the first side insulating portion 92a on the positive direction of the Y axis, the end of the second side insulating portion 92b on the positive direction of the Y axis, and the end of the inner insulating portion 91 on the positive direction of the Y axis are not connected by the connecting portion, and are open to the positive direction side of the first groove portion 93a and the positive direction side of the second groove portion 93b.

[0236] An outer inclined portion 960a is formed on the upper surface of the connecting portion 96 so as to be inclined downward toward the negative direction of the Y axis. The outer inclined portion 960a is formed continuously from one end of the connecting portion 96 in the X-axis direction to the other end. Fig. 14B As shown in FIG. 1 , an outer inclined portion 960b is formed on the lower surface of the connecting portion 96 so as to be inclined lower toward the negative direction of the Y axis. The outer inclined portion 960b is formed continuously from one end to the other end of the connecting portion 96 in the X axis direction. The outer inclined portion 960a and the outer inclined portion 960b have symmetrical shapes.

[0237] As described later, after the resin gasket 90 is installed relative to the second conductor 40, the assembly of the first conductor 30 and the second conductor 40 is installed on the cores 420a and 420b. However, by forming the outer inclined portions 960a and 960b on the connecting portion 96, it is possible to prevent the connecting portion 96 from interfering (contacting) with the bottom surfaces of the cores 420a and 420b during this process, thereby making it easy to perform this process.

[0238] A cutout 96a is formed at the end of the connecting portion 96 on the negative side in the Y-axis direction. The cutout 96a is formed by a cutout that is recessed from the end of the connecting portion 96 on the negative side in the Y-axis direction toward the positive side in the Y-axis direction. The cutout 96a is provided to facilitate identification of the front and back surfaces of the resin liner 90 using an imaging device such as a CCD camera. The cutout 96a is disposed on the negative side of the center of the connecting portion 96 in the X-axis direction, but may be disposed on the positive side. By disposing the cutout 96a on one side of the connecting portion 96 in the X-axis direction, identification of the front and back surfaces of the resin liner 90 becomes easy.

[0239] Next, the method for manufacturing the coil device 410 will be described with a focus on the method for attaching the resin spacer 90 to the second conductor 40. First, the resin spacer 90 is attached to the second conductor 40. Fig.16A The jig 100 shown in the figure is used for the above-mentioned operation. The jig 100 includes a jig body 110 , a conductor fixing portion 120 , a spacer inserting portion 130 , and a conductor placing portion 140 .

[0240] The fixture body 110 has a substantially rectangular parallelepiped shape with a long side in the X-axis direction. On the surface of the fixture body 110 on the positive side of the Y-axis, a plurality of (8) conductor fixing portions 120 are arranged at regular intervals along the X-axis direction. The conductor fixing portion 120 has a substantially rectangular parallelepiped shape and protrudes toward the positive side of the Y-axis. The inner surface of the second conductor 40 having a substantially C-shaped shape can be hooked on the outer surface of the conductor fixing portion 120, thereby fixing the second conductor 40 (see Fig. 16B ).

[0241] The X-axis width of the conductor fixing portion 120 is preferably equal to or less than the X-axis distance between the first conductor side portion 41 and the second conductor side portion 42 of the second conductor 40, and more preferably substantially equal to each other. Thus, the second conductor 40 can be fixed to the conductor fixing portion 120 securely or without misalignment.

[0242] On the surface of the clamp body 110 on the positive side of the Y axis, a plurality of (8) pad insertion portions 130 are arranged at regular intervals along the X axis direction. The plurality of pad insertion portions 130 are formed at positions corresponding to the plurality of conductor fixing portions 120. More specifically, the pad insertion portion 130 is formed at a position offset downward from the conductor fixing portion 120. The pad insertion portion 130 has a concave shape that is recessed from the surface on the positive side of the Y axis of the clamp body 110 to the negative side of the Y axis, and a portion of the resin pad 90 ( Fig.14A The end portion of the inner insulating portion 91 on the positive direction side of the Y axis and the end portions of the side insulating portions 92a and 92b on the positive direction side of the Y axis shown in FIG.

[0243] The X-axis width of the spacer insertion portion 130 is Fig.14A The X-axis width of the resin liner 90 shown is preferably equal to or greater than the width thereof, and more preferably substantially equal to the width thereof. Thus, when a portion of the resin liner 90 is disposed inside the liner insertion portion 130 , displacement of the resin liner 90 in the X-axis direction can be prevented.

[0244] The conductor mounting portion 140 has a substantially rectangular parallelepiped shape having a long side in the X-axis direction, and is connected to the lower end of the jig body 110. The X-axis width of the conductor mounting portion 140 is substantially equal to the X-axis width of the jig body 110. The conductor mounting portion 140 has a shape protruding toward the Y-axis positive direction side from the surface of the jig body 110 on the Y-axis positive direction side.

[0245] The mounting portions 34 and 35 of the first conductor 30 and the mounting portions 44 and 45 of the second conductor 40 can be mounted on the upper surface of the conductor mounting portion 140. The Y-axis direction width (the protruding length of the surface of the jig body 110 from the Y-axis positive direction side) of the conductor mounting portion 140 is preferably larger than the Y-axis direction width of the mounting portions 34 and 35 of the first conductor 30 and the mounting portions 44 and 45 of the second conductor 40. Thus, the mounting portions 34 and 35 of the first conductor 30 and the mounting portions 44 and 45 of the second conductor 40 can be mounted on the upper surface of the conductor mounting portion 140 in a stable state.

[0246] In mounting the resin spacer 90 on the second conductor 40, first prepare Fig.16A The fixture 100 shown, as Fig. 16B As shown, the second conductor 40 is fixed to the conductor fixing portion 120 in such a manner that the inner surface of the second conductor 40 abuts against the outer surface of the conductor fixing portion 120 of the fixture 100. The first mounting portion 44 and the second mounting portion 45 of the second conductor 40 are placed on the upper surface of the conductor mounting portion 140. Fig. 16B In the embodiment, the second conductor 40 is fixed to only one conductor fixing portion 120 provided in the jig 100 , but another second conductor 40 may be fixed to another conductor fixing portion 120 .

[0247] Then, if Fig. 16C As shown in FIG. 1 , the resin liner 90 is mounted on the second conductor 40. When the resin liner 90 is mounted, the resin liner 90 is slid toward the second conductor 40 in the Y-axis direction so that the first groove 93a and the second groove 93b of the resin liner 90 enter the first conductor side 41 and the second conductor side 42 of the second conductor 40, respectively. When the resin liner 90 is inserted into the first conductor side 41 and the second conductor side 42 until the first conductor side 41 is located near the bottom of the first groove 93a and the second conductor side 42 is located near the bottom of the second groove 93b, the end of the resin liner 90 on the negative direction side of the Y-axis is inserted into the liner insertion portion 130. In this way, by inserting the end of the resin liner 90 on the negative direction side of the Y-axis into the liner insertion portion 130, it is possible to prevent the end of the resin liner 90 on the positive direction side of the Y-axis from being arranged at a position that unnecessarily protrudes on the positive direction side of the Y-axis.

[0248] Then, if Fig.16DAs shown in FIG. 1 , the resin liner 90 is slid downward along the first conductor side portion 41 and the second conductor side portion 42 of the second conductor 40, so that the resin liner 90 is arranged at the positions of the first mounting portion 44 and the second mounting portion 45 of the second conductor 40. At this time, the resin liner 90 is slid downward along the first conductor side portion 41 and the second conductor side portion 42 until the upper surface of the first mounting portion 44 abuts against the first step surface 911a ( Fig. 14B ), and the upper surface of the second mounting portion 45 abuts against the second step surface 911b ( Fig. 14B ).

[0249] An adhesive is pre-applied on the upper surfaces of the first mounting portion 44 and the second mounting portion 45, or on the first step surface 911a and the second step surface 911b of the inner insulating portion 91. Thus, when the upper surface of the first mounting portion 44 abuts against the first step surface 911a, they can be joined by the adhesive. In addition, when the upper surface of the second mounting portion 45 abuts against the second step surface 911b, they can be joined by the adhesive. As the adhesive, epoxy resin, acrylic resin or polyurethane resin can be used. When the adhesive is cured, in order to ensure good bonding between the step surfaces 911a, 911b and the mounting portions 44, 45, the upper surface of the resin gasket 90 is pushed toward the mounting portions 44, 45 in advance to improve the tightness between them.

[0250] Next, the first conductor 30 is arranged outside the second conductor 40. The first conductor 30 is arranged so that the first conductor side portion 31 of the first conductor 30 faces the first conductor side portion 41 of the second conductor 40, and the second conductor side portion 32 of the first conductor 30 faces the second conductor side portion 42 of the second conductor 40. The first mounting portion 34 and the second mounting portion 35 of the first conductor 30 are placed on the conductor placement portion 140. Next, an adhesive is applied, for example, locally to a plurality of locations between the inner surface of the first conductor 30 and the outer surface of the second conductor 40 and cured. Thus, a conductor assembly consisting of the first conductor 30, the second conductor 40, and the resin gasket 90 is formed.

[0251] Next, the conductor assembly is mounted Fig.13The first core 420a and the second core 420b are shown. The side surface on the negative side of the Y-axis of the conductor assembly and the first core 420a, the side surface on the positive side of the Y-axis of the conductor assembly and the second core 420b, and the first core 420a and the second core 420b are joined by an adhesive. The side surface on the negative side of the Y-axis of the conductor assembly and the first core 420a only need to be joined by an adhesive, for example, locally at several locations, but the joining by the adhesive can also be omitted. In addition, the side surface on the positive side of the Y-axis of the conductor assembly and the second core 420b only need to be joined by an adhesive, for example, locally at several locations, but the joining by the adhesive can also be omitted. For the first core 420a and the second core 420b, it is only necessary to place Figure 1B and Figure 2 The first middle leg portion 23a and the second middle leg portion 23b shown in the figure are bonded to each other by an adhesive, and the first outer leg portion 22a and the second outer leg portion 22b are bonded to each other by an adhesive. Then, by curing the adhesive, the Fig.13 The coil device 410 shown in FIG. 1 may be provided by the resin spacer 90 , and may be attached to the second conductor 40 after the cores 420 a and 420 b are assembled to the first conductor 30 and the second conductor 40 .

[0252] In this embodiment, the same effect as in the fourth embodiment can be obtained. Fig.14A and Fig. 14B As shown, the inner insulating portion 91 has an outer inclined portion 910a and side inclined portions 912a, 912b, and the connecting portion 96 has outer inclined portions 960a, 960b. When the resin gasket 90 is installed relative to the second conductor 40, interference (contact) between the resin gasket 90 and the cores 420a, 420b, etc. can be prevented, and the installation of the resin gasket 90 relative to the second conductor 40 becomes easy.

[0253] Sixth Embodiment

[0254] The coil device 510 of the sixth embodiment of the present invention differs only in the following points, and the other structures are the same as those of the fifth embodiment, achieving the same effects. In the drawings, the same reference numerals are used for the same components as those of the fifth embodiment, and the description of the repeated parts is omitted.

[0255] like Fig.17A As shown, the coil device 510 has a resin pad 590. Fig.18As shown in FIG. 1 , the resin liner 590 has a connecting portion 97 in addition to the inner insulating portion 91, the first side insulating portion 92a, the second side insulating portion 92b, and the connecting portion 96. The connecting portion 97 connects the end of the first side insulating portion 92a on the positive direction of the Y axis, the end of the inner insulating portion 91 on the positive direction of the Y axis, and the end of the second side insulating portion 92b on the positive direction of the Y axis along the X axis direction. The shape of the connecting portion 97 is the same as that of the connecting portion 96.

[0256] The connection parts 96 and 97 are not formed Fig.14A and Fig. 14B The outer inclined portion 960a and the outer inclined portion 960b are shown. Fig. 14B The first step surface 911a and the second step surface 911b are shown. That is, the upper surface and the lower surface of the resin liner 590 are composed of flat surfaces.

[0257] On the other hand, a bottom groove 98 is formed in the center of the lower surface of the inner insulating portion 91 of the resin liner 590 in the X-axis direction. The bottom groove 98 extends from one end of the inner insulating portion 91 in the Y-axis direction to the other end. By forming the bottom groove 98 on the lower surface of the inner insulating portion 91, for example, when the first mounting portion 44 and the second mounting portion 45 of the second conductor 40 are connected to the mounting substrate by soldering, the bottom groove 98 can be used to block the molten solder from flowing between the first mounting portion 44 and the second mounting portion 45 in a manner that spreads on the lower surface of the inner insulating portion 91. In addition, a groove corresponding to the bottom groove 98 may be formed in the center of the X-axis direction along the Y-axis direction on the upper surface of the inner insulating portion 91.

[0258] The first groove 593a is surrounded on all sides by the first side insulating portion 92a, one end of the inner insulating portion 91 in the X-axis direction, the connecting portion 96, and the connecting portion 97. In addition, the second groove 593b is surrounded on all sides by the second side insulating portion 92b, the other end of the inner insulating portion 91 in the X-axis direction, the connecting portion 96, and the connecting portion 97. Fig. 17B As shown, the opening shape of the first groove portion 593a corresponds to the bottom surface shape of the first mounting portion 44 of the second conductor 40, so that the first mounting portion 44 can be inserted into the first groove portion 593a. In addition, the opening shape of the second groove portion 593b corresponds to the bottom surface shape of the second mounting portion 45 of the second conductor 40, so that the second mounting portion 45 can be inserted into the second groove portion 593b.

[0259] like Fig.19As shown in FIG. 1 , the resin liner 590 is mounted on the bottom surface of the cores 420a and 420b in a state where the cores 420a and 420b are attached to the first conductor 30 and the second conductor 40 (the assembly of the first conductor 30 and the second conductor 40 described above) by an adhesive (or without using an adhesive). The resin liner 590 is installed by inserting one end and the other end of the second conductor 40 into the first groove 593a and the second groove 593b of the resin liner 590, respectively.

[0260] The upper surface of the resin liner 590 is bonded to the bottom surface of the cores 420a and 420b, for example, partially at several locations, by an adhesive. When the resin liner 590 is mounted on the bottom surface of the cores 420a and 420b, a portion of the mounting portions 44 and 45 of the second conductor 40 is accommodated in the groove portions 593a and 593b, while the remaining portion of the mounting portions 44 and 45 is exposed to the outside of the groove portions 593a and 593b. That is, the bottom surface of the resin liner 590 is located above the bottom surface of the mounting portions 44 and 45, so that the mounting portions 44 and 45 can be well connected to the land pattern of the mounting substrate by soldering or the like without being hindered by the resin liner 590.

[0261] In this embodiment, the same effects as those of the fifth embodiment are obtained. In particular, in this embodiment, the first mounting portion 44 and the second mounting portion 45 of the second conductor 40 are inserted into the first groove portion 593a and the second groove portion 593b, respectively, and only the upper surface of the resin liner 590 is fixed to the bottom surface of the cores 420a and 420b, so that the coil device 510 can be provided with the resin liner 590, and the resin liner 590 can be easily installed.

[0262] Seventh embodiment

[0263] The coil device 610 of the seventh embodiment of the present invention differs only in the following points, and the other structures are the same as those of the sixth embodiment, achieving the same effects. In the drawings, the same reference numerals are given to the same components as those of the sixth embodiment, and the description of the repeated parts is omitted.

[0264] like Fig. 20 As shown, the coil device 610 includes a first core 620a, a second core 620b, and a resin pad 690. Fig.21 As shown, the second core 620b has a second base portion 621b, and a side recess 28 is formed on the outer side surface of the second base portion 621b. The side recess 28 is formed at the lower end of the outer side surface of the second base portion 621b, and the lower end of the side recess 28 is connected to the bottom recess 27. In addition, the first core 620a has the same shape as the second core 620b, and therefore, a detailed description thereof is omitted.

[0265] The side recess 28 has an arm setting portion 28a and an engaging recess 28b. The arm setting portion 28a has a concave shape that is recessed from the surface of the second base portion 621b to the inner side in the Y-axis direction. The arm setting portion 28a is formed at the approximate center of the second base portion 621b in the X-axis direction, and extends upward along the Z-axis direction from the bottom surface recess 27 of the second core 620b by a predetermined length.

[0266] The engaging recess 28b is formed at the upper end of the arm setting portion 28a. The engaging recess 28b has a concave shape that is recessed from the surface of the second base portion 621b toward the inner side in the Y-axis direction, and the depth of the engaging recess 28b along the Y-axis direction is greater than the depth of the arm setting portion 28a along the Y-axis direction. An inclined surface is formed on the bottom surface of the engaging recess 28b, and the engaging recess 28b is formed so that the width becomes narrower toward the bottom.

[0267] like Fig. 22 As shown, the resin liner 690 has an arm portion 99a and an arm portion 99b. Fig.18 The resin gasket 590 of the sixth embodiment shown is different in that the arm portion 99a stands upward from the upper surface of the connecting portion 96 along the Z-axis direction, and the arm portion 99b stands upward from the upper surface of the connecting portion 97 along the Z-axis direction.

[0268] The arm portions 99a and 99b have arm main bodies 990a and 990b and convex portions 991a and 991b. The arm main bodies 990a and 990b have a columnar structure (roughly a rectangular parallelepiped shape) having a long side direction in the Z-axis direction. The convex portion 991a is formed at the front end portion of the arm main body 990a and protrudes to the positive direction of the Y-axis (the center of the resin pad 690). The convex portion 991b is formed at the front end portion of the arm main body 990b and protrudes to the negative direction of the Y-axis (the inner side of the resin pad 690). The convex portion 991a and the convex portion 991b are arranged face to face along the Y-axis direction. Inclined surfaces are formed on the convex portions 991a and 991b, and are formed to become tapered as they protrude toward the direction in which they protrude. The convex shape of the convex portion 991b is similar to that of the convex portion 991b. Fig.21 The concave shape of the engaging recess 28b shown corresponds to this.

[0269] like Fig.21 and Fig. 22 As shown, the arm main body 990b is fixed to the arm setting portion 28a of the second core 620b. Similarly, the arm main body 990a is fixed to the arm setting portion of the first core 620a (omitted from the figure). The protrusion 991b is engaged with the engagement recess 28b of the second core 620b (refer to Fig.23 ), the protrusion 991a engages with the engaging recess (not shown) of the first core 620a. When the arms 99a and 99b are fixed relative to the cores 620a and 620b, the surfaces of the arms 99a and 99b are roughly flush with the outer side surfaces (surfaces) of the cores 620a and 620b.

[0270] By engaging the protrusion 991b with the engaging recess 28b of the second core 620b, the arm 99b can be fixed to the outer side surface of the second core 620b in the Y-axis direction. Similarly, by engaging the protrusion 991a with the engaging recess (not shown) of the first core 620a, the arm 99a can be fixed to the outer side surface of the first core 620a in the Y-axis direction. As a result, the resin gasket 690 can be fixed to the cores 620a and 620b via the arm portions 99a and 99b, and the resin gasket 690 can be installed relative to the cores 620a and 620b without using an adhesive. The resin gasket 690 is assembled to the cores 620a and 620b in a state where the cores 620a and 620b are mounted to the first conductor 30 and the second conductor 40 (an assembly of the first conductor 30 and the second conductor 40) by an adhesive (or without using an adhesive). In addition, as Fig.23 As shown, when the resin gasket 690 is fixed to the cores 620a and 620b, a gap is formed between the upper surface of the resin gasket 690 (inner insulating portion 91, connecting portions 96, 97, side insulating portions 92a, 92b) and the bottom surfaces of the cores 620a and 620b, and they are not tightly fitted.

[0271] Eighth Embodiment

[0272] The coil device 710 of the eighth embodiment of the present invention differs only in the following points, and the other structures are the same as those of the sixth embodiment, achieving the same effects. In the drawings, the same reference numerals are given to the same components as those of the sixth embodiment, and the description of the repeated parts is omitted.

[0273] like Fig.24A As shown, the coil device 710 has a resin pad 790. Fig.25 As shown, the resin liner 790 has a first groove portion 793a and a second groove portion 793b. The width of the first groove portion 793a in the X-axis direction is greater than Fig.18 The width of the first groove 593a of the resin liner 590 shown in FIG. 5 is smaller in the X-axis direction. Similarly, the width of the second groove 793b in the X-axis direction is smaller than that of the second groove 793b in FIG. Fig.18 The width of the second groove 593 b of the resin liner 590 shown in the figure is reduced in the X-axis direction. The width of the grooves 793 a and 793 b in the X-axis direction is substantially equal to the plate thickness of the second conductor 40 .

[0274] In this embodiment, if Fig.26As shown in FIG. 7 , the first groove portion 793a functions as an insertion passage for the first conductor side portion 41 of the second conductor 40, and the lower end portion of the first conductor side portion 41 of the second conductor 40 is inserted through the first groove portion 793a. In addition, the second groove portion 793b functions as an insertion passage for the second conductor side portion 42 of the second conductor 40, and the lower end portion of the second conductor side portion 42 of the second conductor 40 is inserted through the second groove portion 793b. That is, the first mounting portion 44 of the second conductor 40 is not arranged (inserted) in the first groove portion 793a, and the second mounting portion 45 of the second conductor 40 is not arranged (inserted) in the second groove portion 793b.

[0275] like Fig.25 As shown, an outer inclined portion 960a extending along the X-axis direction is formed at the end of the connection portion 96 on the negative side of the Y-axis, and an outer inclined portion 960b extending along the X-axis direction is formed at the end of the connection portion 97 on the positive side of the Y-axis.

[0276] like Fig. 24B As shown, the spacer recess 913a is formed on the positive direction side of the X-axis, and the spacer recess 913b is formed on the negative direction side of the X-axis on the lower surface of the inner insulating portion 91. The spacer recess 913a and the spacer recess 913b are arranged at a predetermined interval in the X-axis direction, and the interval is equal to or larger than the interval between the first mounting portion 44 and the second mounting portion 45 of the second conductor 40.

[0277] The first mounting portion 44 of the second conductor 40 is received in the gasket recess 913a, and the upper surface of the first mounting portion 44 abuts against the bottom surface of the gasket recess 913a. The second mounting portion 45 of the second conductor 40 is received in the gasket recess 913b, and the upper surface of the second mounting portion 45 abuts against the bottom surface of the gasket recess 913b. Fig.26 As shown in the figure, in the state where the spacer recesses 913a and 913b accommodate the mounting portions 44 and 45, a part of the mounting portions 44 and 45 of the second conductor 40 is accommodated inside the spacer recesses 913a and 913b, while the remaining part of the mounting portions 44 and 45 is exposed to the outside of the spacer recesses 913a and 913b. In this way, by accommodating a part of the mounting portions 44 and 45 in the spacer recesses 913a and 913b, it is possible to achieve good insulation between the first mounting portion 44 and the second mounting portion 45.

[0278] When the resin gasket 790 is mounted on the second conductor 40, the second conductor 40 before the first mounting portion 44 and the second mounting portion 45 are formed, that is, the second conductor 40 having a substantially C-shaped shape is prepared. Then, the first groove portion 793a is inserted through one end of the second conductor 40, and the second groove portion 793b is inserted through the other end. Then, one end of the second conductor 40 is bent (that is, the first mounting portion 44 is formed on the second conductor 40), and the end is accommodated in the gasket recess 913a so that the upper surface thereof abuts against the bottom surface of the gasket recess 913a. In addition, the other end of the second conductor 40 is bent (that is, the second conductor 40 is formed with the second mounting portion 45), and the end is accommodated in the gasket recess 913b so that the upper surface thereof abuts against the bottom surface of the gasket recess 913b. That is, after the resin gasket 790 is mounted on the substantially C-shaped second conductor 40, the second conductor 40 is molded to be provided with the shapes of the first mounting portion 44 and the second mounting portion 45. In addition, the resin gasket 790 is mounted on the second conductor 40 or the bottom surface of the core 420a, 420b in a state where the core 420a, 420b is attached to the first conductor 30 and the second conductor 40 (an assembly of the first conductor 30 and the second conductor 40) by an adhesive (or without using an adhesive).

[0279] In this embodiment, the same effect as in the sixth embodiment is obtained. Fig.26 As shown in FIG. 1 , when the resin liner 790 is mounted on the second conductor 40, the upper surface of the resin liner 790 (the inner insulating portion 91, the connecting portions 96, 97, and the side insulating portions 92a, 92b) abuts against the bottom surfaces of the cores 420a, 420b. Therefore, the insulation between the mounting portions 44, 45 of the second conductor 40 and the bottom surfaces of the cores 420a, 420b can be well ensured by the inner insulating portion 91 and the like.

[0280] The resin gasket 790 is pressed upward in the Z-axis direction by the first mounting portion 44 and the second mounting portion 45, and is thereby fixed so as to be sandwiched between the mounting portions 44 and 45 and the cores 420a and 420b. Therefore, the resin gasket 790 can be mounted without using an adhesive.

[0281] Ninth embodiment

[0282] The coil device 810 of the ninth embodiment of the present invention differs only in the following points, and the other structures are the same as those of the eighth embodiment, achieving the same effects. In the drawings, the same reference numerals are used for the components common to the eighth embodiment, and the description of the repeated parts is omitted.

[0283] like Fig. 27As shown, the coil device 810 includes a second conductor 840 and a resin pad 890. The second conductor 840 does not have Fig.26 The first mounting portion 44 and the second mounting portion 45 shown in the figure, on the other hand, have a first lateral bent portion 48 and a second lateral bent portion 49. The first lateral bent portion 48 is formed at one end of the second conductor 40, and is bent inwardly in the X-axis direction and downwardly in the Z-axis direction. Similarly, the second lateral bent portion 49 is formed at the other end of the second conductor 40, and is bent inwardly in the X-axis direction and downwardly in the Z-axis direction. That is, the first lateral bent portion 48 and the second lateral bent portion 49 are bent in directions approaching each other with respect to the X-axis direction, and then extend parallel to each other along the Z-axis direction.

[0284] like Fig.28 As shown, a first side step portion 920a extending along the Y-axis direction is formed on the upper surface of the first side insulating portion 92a of the resin liner 890. In addition, a second side step portion 920b extending along the Y-axis direction is formed on the upper surface of the second side insulating portion 92b. The step height of each of the first side step portion 920a and the second side step portion 920b is equal to or greater than the plate thickness of the second conductor 840. In addition, no side step portion 920a or 92b is formed on the upper surface of the side insulating portions 92a and 92b. Fig.25 The inclined portions 95a and 95b shown in the figure are not formed at the connecting portions 96 and 97. Fig.25 The outer inclined portions 960a and 960b are shown. Fig. 24B Gasket recesses 913a, 913b are shown.

[0285] like Fig. 27 As shown, the first lateral bent portion 48 (the portion extending in the X-axis direction) is arranged on the first lateral step portion 920a, and the second lateral bent portion 49 (the portion extending in the X-axis direction) of the second conductor 840 is arranged on the second lateral step portion 920b. In addition, the first lateral bent portion 48 is inserted downwardly through the interior of the first groove portion 793a, and the second lateral bent portion 49 is inserted downwardly through the interior of the second groove portion 793b. That is, on the resin liner 890, a substantially L-shaped insertion passage through which the first lateral bent portion 48 is inserted is formed by the first lateral step portion 920a and the first groove portion 793a. In addition, a substantially L-shaped insertion passage through which the second lateral bent portion 49 is inserted is formed by the second lateral step portion 920b and the second groove portion 793b.

[0286] The upper surface of the resin liner 890 is bonded to the bottom surface of the cores 420a and 420b by an adhesive or the like. In this embodiment, the same effect as in the eighth embodiment is obtained. In addition, in this embodiment, the first mounting portion 44 and the second mounting portion 45 are not formed on the second conductor 840. Therefore, after the side bending portions 48 and 49 of the second conductor 40 are inserted into the grooves 793a and 793b of the resin liner 890, it is not necessary to perform molding for giving the second conductor 840 the shapes of the first mounting portion 44 and the second mounting portion 45. Therefore, the manufacture of the coil device 810 becomes easy.

[0287] Tenth embodiment

[0288] The coil device 910 of the tenth embodiment of the present invention differs only in the following points, and the other structures are the same as those of the first embodiment, achieving the same effects. In the drawings, the same reference numerals are given to the same components as those of the first embodiment, and the description of the repeated parts is omitted.

[0289] like Fig.29 and Fig.30 As shown, in the coil device 910, the first middle leg portion 23a of the first core 20a and the second middle leg portion 23b of the second core 20b are connected by a magnetic resin layer 200. The magnetic resin layer 200 is composed of a magnetic powder and a resin containing the magnetic powder. Examples of the magnetic powder include metal powder (metal magnetic body) and ferrite. Examples of the ferrite include Ni-Zn ferrite and Mn-Zn ferrite. Examples of the resin include epoxy resin, acrylic resin or polyurethane resin. The magnetic resin layer 200 is in close contact with the surface of the first middle leg portion 23a on the positive direction side of the Y axis, and is in close contact with the surface of the first middle leg portion 23b on the negative direction side of the Y axis.

[0290] In the present embodiment, the magnetic resin layer 200 is formed (applied) on the entire surface of the first middle leg portion 23a on the positive direction side of the Y axis (and / or the surface of the second middle leg portion 23b on the negative direction side of the Y axis). However, the magnetic resin layer 200 may be formed only on a portion of the surface of the first middle leg portion 23a on the positive direction side of the Y axis (and / or the surface of the second middle leg portion 23b on the negative direction side of the Y axis). The magnetic resin layer 200 is preferably formed on an area of ​​30% or more of the surface of the first middle leg portion 23a on the positive direction side of the Y axis (or the surface of the second middle leg portion 23b on the negative direction side of the Y axis), more preferably formed on an area of ​​50% or more, and particularly preferably formed on an area of ​​75% or more. The larger the area of ​​the region where the magnetic resin layer 200 is formed, the lower the loss of the magnetic flux passing through the first core 20a and the second core 20b can be, and the coil device 910 with excellent inductance characteristics can be realized.

[0291] The Y-axis width of the magnetic resin layer 200 is Fig.30The Y-axis width of the gap G3 shown is preferably 0.1 to 1.0 mm, and more preferably 0.1 to 0.5 mm. However, the Y-axis width of the magnetic resin layer 200 may be smaller than the Y-axis width of the gap G3. The magnetic resin layer 200 may be formed only on one of the surface on the Y-axis positive side of the first middle leg 23a and the surface on the Y-axis negative side of the second middle leg 23b. In this case, the Y-axis width of the magnetic resin layer 200 is smaller than the Y-axis width of the gap G3. In addition, even if the magnetic resin layer 200 is formed on both of the above-mentioned surfaces, when the magnetic resin layer 200 is not formed to span the surface on the Y-axis positive side of the first middle leg 23a and the surface on the Y-axis negative side of the second middle leg 23b, the Y-axis width of the magnetic resin layer 200 is smaller than the Y-axis width of the gap G3.

[0292] The magnetic resin layer 200 may be formed locally (in a dotted manner) at a plurality of locations on the surface of the first middle leg portion 23a on the positive direction side of the Y axis (or the surface of the second middle leg portion 23b on the negative direction side of the Y axis). Alternatively, the magnetic resin layer 200 may be formed continuously or discontinuously only on the outer edge of the surface of the first middle leg portion 23a on the positive direction side of the Y axis (and / or the surface of the second middle leg portion 23b on the negative direction side of the Y axis). In this case, the shape of the magnetic resin layer 200 may be set to a ring shape surrounding the outer edge of the surface of the first middle leg portion 23a on the positive direction side of the Y axis (or the surface of the second middle leg portion 23b on the negative direction side of the Y axis).

[0293] Although detailed illustration is omitted, in the coil device 910, the first outer leg portion 22a of the first core 20a and the second outer leg portion 22b of the second core 20b may be connected via the magnetic resin layer 200. The magnetic resin layer 200 may be formed on both of the pair of first outer legs 22a (and / or the pair of second outer legs 22b), or may be formed on only one of the pair of first outer legs 22a (and / or the pair of second outer legs 22b).

[0294] In this case, the magnetic resin layer 200 may be formed locally (in a dotted manner) at a plurality of locations on the surface of the first outer leg 22a on the positive Y-axis direction side (or the surface of the second outer leg 22b on the negative Y-axis direction side). Alternatively, the magnetic resin layer 200 may be formed continuously or discontinuously only on the outer edge of the surface of the first outer leg 22a on the positive Y-axis direction side (and / or the surface of the second outer leg 22b on the negative Y-axis direction side). In this case, the shape of the magnetic resin layer 200 may be set to a ring shape surrounding the outer edge of the surface of the first outer leg 22a on the positive Y-axis direction side (or the surface of the second outer leg 22b on the negative Y-axis direction side).

[0295] However, the magnetic resin layer 200 is not formed between the first outer leg 22a and the second outer leg 22b, and the magnetic resin layer 200 is formed only between the first middle leg 23a and the second middle leg 23b. This can effectively reduce the loss of magnetic flux passing through the first core 20a and the second core 20b, thereby realizing the coil device 910 with excellent inductance characteristics.

[0296] In addition, a resin layer that does not contain magnetic powder is formed between the first outer leg 22a and the second outer leg 22b, and a resin layer (magnetic resin layer 200) that contains magnetic powder is formed only between the first middle leg 23a and the second middle leg 23b, so that the first core 20a and the second core 20b can be well (firmly) connected.

[0297] In addition, the present invention is not limited to the above-mentioned embodiment, and various changes can be made within the scope of the present invention.

[0298] In the first embodiment described above, the insulation between the first conductor 30 and the second conductor 40 is ensured by the insulating layer 70 formed on the surface of the second conductor 40, but by forming the insulating layer 70 on the surface of the first conductor 30 (particularly, the inner surface of the first conductor 30), the first conductor 30 and the second conductor 40 can be insulated. In addition, the insulating layer 70 may be formed on both the surface of the second conductor 40 and the inner surface of the first conductor 30. The same applies to the second to fourth embodiments described above.

[0299] In the first embodiment, the insulation between the second conductor 40 and the middle legs 23a and 23b of the cores 20a and 20b is ensured by the insulating layer 70 formed on the surface of the second conductor 40. However, the first conductor 30 may be insulated from the outer legs 22a and 22b of the cores 20a and 20b by forming the insulating layer 70 on the surface of the first conductor 30 (particularly, the outer surface of the first conductor 30). Alternatively, the second conductor 40 may be insulated from the middle legs 23a and 23b of the cores 20a and 20b by forming the insulating layer 70 (insulating coated middle legs 23a and 23b) on the outer circumferential surface of the middle legs 23a and 23b of the cores 20a and 20b, or the first conductor 30 may be insulated from the outer legs 22a and 22b of the cores 20a and 20b by forming the insulating layer 70 (insulating coated outer legs 22a and 22b) on the outer circumferential surface of the outer legs 22a and 22b of the cores 20a and 20b. The same applies to the above-mentioned second to fourth embodiments.

[0300] In the first embodiment, the insulating layer 70 is continuously formed along the outer surface or the inner surface of the second conductor 40, but may be intermittently formed. The same applies to the second to fourth embodiments.

[0301] In the first embodiment described above, the first core 20a and the second core 20b are configured as separate bodies, but they may be configured as one body. The same applies to the second to fourth embodiments described above.

[0302] In the first embodiment, the curvature radius of the outer surface of the inner curved portions 46 and 47 of the second conductor 40 is smaller than the curvature radius of the inner surface of the outer curved portions 38 and 39 of the first conductor 30, but the above magnitude relationship may be reversed. In this case, the same effect is obtained. The same applies to the second to fourth embodiments.

[0303] In the above-mentioned embodiments, the insulating layer 70 may extend continuously along the inner surface or the outer surface of the second conductor 40 , but may also extend discontinuously.

[0304] In the first embodiment described above, if Figure 3 As shown in the figure, the insulating coating 26 is formed on the bottom surface of the middle leg portions 23a and 23b, but the position of forming the insulating coating 26 is not limited thereto. For example, the insulating coating 26 may be formed on the entire core 20a and 20b. Alternatively, the insulating coating 26 may be formed on the bottom surface of the outer leg portions 22a and 22b. In this case, the insulation between the bottom surface of the outer leg portions 22a and 22b and the mounting portions 34 and 35 of the first conductor 30 can be well achieved. In addition, by forming the insulating coating 26 on the bottom surface of the base portions 21a and 21b, the insulation between the bottom surface of the base portions 21a and 21b and the mounting surface of the mounting substrate can be well achieved.

[0305] like Fig.29 As shown, the fifth embodiment can also be applied to the second embodiment, so that the coil device 110 ( Figure 4A )have Fig.14A The resin liner 90 shown or Fig.32 A resin liner 90' is shown. Fig.32 The resin liner 90' shown in FIG. 14 is different from the resin liner 90 shown in FIG. 14 in that the side insulating portions 92a and 92b do not have the inclined portions 95a and 95b. Fig.31 As shown, this is because the mounting bent portions 340, 350 of the mounting portions 134, 135 of the first conductor 130 are adjacently arranged on the sides of the side insulating portions 92a, 92b in the X-axis direction, but the inner side surface shape of the mounting bent portions 340, 350 in the X-axis direction becomes a vertical shape. Therefore, even if the inclined portions 95a, 95b are omitted from the side insulating portions 92a, 92b, the side insulating portions 92a, 92b will not interfere with (contact) the mounting bent portions 340, 350.

[0306] In the ninth embodiment, it is also possible to Fig. 27The second conductor 840 shown omits the side bends 48 and 49. In this case, Fig.33A As shown in FIG. 8 , the conductor side portions 41 and 42 of the second conductor 840 ′ have a straight line shape extending linearly along the Z-axis direction. Fig.33B As shown, it is possible to omit the resin liner 890' Fig.28 The side steps 920a, 920b are provided for configuring the side curved portions 48, 49. Fig.33A In the second conductor 840' shown, Fig. 27 The second conductor 840 shown is different and does not have the side bends 48, 49. Fig.33A As shown, the lower ends of the conductor side portions 41 and 42 of the second conductor 840' protrude downward from the lower surface of the resin pad 890'. The conductor side portions 41 and 42 of the second conductor 840' can be connected to the land pattern of the mounting substrate by solder or the like via the protruding portions of the conductor side portions 41 and 42.

[0307] The tenth embodiment may be applied to the second to ninth embodiments, and the coil devices of the second to ninth embodiments may also include the magnetic resin layer 200 .

[0308] In the first embodiment described above, Figure 1C The tape member 60 shown is pre-printed with characters (identifiers) such as a manufacturing number, but the tape member 60 may be a plain tape member without printing such characters or the like.

[0309] Explanation of symbols

[0310] 10, 110, 210, 310, 410, 510, 610, 710, 810, 910 ... coil device 20a, 120a, 420a, 620a ... first core

[0311] 20b, 120b, 220b, 420b, 620b…second core

[0312] 21a, 621b…first base

[0313] 21b…Second base

[0314] 22a, 122a ... first outer leg

[0315] 22a1, 122a1 ... first outer leg edge portion

[0316] 22b…Second outer leg

[0317] 22b1…Second outer leg edge

[0318] 23a…First midfoot

[0319] 23b…Second midfoot

[0320] 24a...first groove portion

[0321] 24b...second groove portion

[0322] 241…First side part

[0323] 242…Second side

[0324] 243…upper part

[0325] 25a ... first side groove

[0326] 25b...Second side groove

[0327] 26…Insulation coating

[0328] 27…Bottom recess

[0329] 27a, 27b...Bottom convex portion

[0330] 28…Side recess

[0331] 28a ... Arm installation part

[0332] 28b…engagement recess

[0333] 30, 130…First conductor

[0334] 31, 131 ... side of first conductor

[0335] 32, 132…side of second conductor

[0336] 33, 133… Upper part of conductor

[0337] 34, 134…first mounting portion

[0338] 340 ... first installation curved portion

[0339] 341 ... first mounting connection portion

[0340] 343 ... first mounting body

[0341] 35, 135…Second mounting portion

[0342] 350…Second installation bend

[0343] 351…Second installation connection portion

[0344] 353…Second installation main body

[0345] 36, 136 ... first outer incision

[0346] 37, 137…Second outer incision

[0347] 38 ... first outer curved portion

[0348] 39…Second outer curved portion

[0349] 40, 240, 840, 840'... Second conductor

[0350] 41…side portion of first conductor

[0351] 42… Second conductor side

[0352] 43…Conductor upper part

[0353] 44, 244…First mounting portion

[0354] 440, 440'... installation opposite surface

[0355] 441, 441'…joint surface

[0356] 442…Non-joint surface

[0357] 443…Standing part

[0358] 45, 245…Second installation part

[0359] 450, 450'... installation opposite surface

[0360] 451, 451'…joint surface

[0361] 452…Non-joint surface

[0362] 453…Standing part

[0363] 46…first inner curved portion

[0364] 47…Second inner curved portion

[0365] 48…first lateral curved portion

[0366] 49…Second lateral bending portion

[0367] 50…Mounting surface of mounting base

[0368] 60…with parts

[0369] 70…Insulation layer

[0370] 80, 90, 590, 690, 790, 890, 890'...resin liner

[0371] 91…Inner insulation

[0372] 911a, 911b…step surface

[0373] 910a, 910b, 960a, 960b ... outer inclined portion

[0374] 912a, 912b ... side slope portion

[0375] 913a, 913b ... gasket recess

[0376] 92a, 92b ... side insulation part

[0377] 920a, 920b…side step portion

[0378] 93a, 593a, 793a ... first groove portion (first gap)

[0379] 93b, 593b, 793b ... second groove portion (second gap)

[0380] 94…Protrusion

[0381] 94a, 94b ... bottom surface inclined portion

[0382] 95a, 95b ... inclined portion

[0383] 96, 97…Connection

[0384] 96a…Incision

[0385] 98…Bottom groove

[0386] 99a, 99b...arm

[0387] 990a, 990b ... arm body

[0388] 991a, 991b...convex portion

[0389] 100…Clamp

[0390] 110…Clamp body

[0391] 120…Conductor fixing part

[0392] 130…Gasket insertion portion

[0393] 140…Conductor mounting portion

[0394] 200…Magnetic resin layer.

Claims

1. A coil device, comprising: A first conductor having a first outer mounting portion formed at one end and a second outer mounting portion formed at the other end; A second conductor, which is arranged inside the first conductor and has a first inner mounting portion formed at one end and a second inner mounting portion formed at the other end; a core, which disposes the first conductor and the second conductor inside; a resin gasket having a first lateral insulating portion disposed between the first outer mounting portion and the first inner mounting portion, and a second lateral insulating portion disposed between the second outer mounting portion and the second inner mounting portion, The resin gasket has an inner insulating portion between one end and the other end of the second conductor, the inner insulating portion being arranged between the bottom surface of the core and the first inner mounting portion, and between the bottom surface of the core and the second inner mounting portion, A first gap is formed between the first side insulating portion and one end of the inner insulating portion in the first direction, and a second gap is formed between the second side insulating portion and the other end of the inner insulating portion in the first direction. The first side insulating portion, the second side insulating portion, and the inner insulating portion extend along a second direction orthogonal to the first direction, respectively. The resin pad has: a first connecting portion, which connects one end of the first lateral insulating portion, the second lateral insulating portion, and the inner insulating portion in the second direction along the first direction; and a second connecting portion, which connects the other end of the first lateral insulating portion, the second lateral insulating portion, and the inner insulating portion in the second direction along the first direction.

2. The coil device according to claim 1, wherein: The bottom surface of the resin gasket is arranged above the bottom surfaces of the first inner mounting portion and the second inner mounting portion, and is arranged above the bottom surfaces of the first outer mounting portion and the second outer mounting portion.

3. The coil device according to claim 1 or 2, wherein: A first gap is formed between the first side insulating portion and one end of the inner insulating portion in the first direction, and a second gap is formed between the second side insulating portion and the other end of the inner insulating portion in the first direction. The first side insulating portion, the second side insulating portion, and the inner insulating portion extend along a second direction orthogonal to the first direction, respectively. The resin spacer includes a first connection portion that connects one end of each of the first side insulating portion, the second side insulating portion, and the inner insulating portion in the second direction along the first direction.

4. The coil device according to claim 3, wherein: A first outer inclined portion that is inclined so as to become lower toward the outer side in the second direction is formed on at least one of the upper surface and the lower surface of the first connecting portion.

5. The coil device according to claim 3, wherein: At the other end of the inner insulating portion located on the opposite side of the first connecting portion in the second direction, a second outer inclined portion inclined so as to become lower toward the outer side in the second direction is formed on at least one of the upper surface and the lower surface of the inner insulating portion.

6. The coil device according to claim 3, wherein: At the other end of the inner insulating portion located on the opposite side of the first connecting portion in the second direction, the width of the inner insulating portion along the first direction decreases toward the outside in the second direction.

7. The coil device according to claim 1 or 2, wherein: The resin gasket has a protrusion that protrudes from a bottom surface of the resin gasket and is at least partially disposed between a first front end portion of the first inner mounting portion and a second front end portion of the second inner mounting portion.

8. The coil device according to claim 7, wherein: A first step surface located on one side of the protrusion and a second step surface located on the other side of the protrusion are formed on the bottom surface of the resin pad. The first inner mounting portion abuts against the first step surface, and the second inner mounting portion abuts against the second step surface.

9. The coil device according to claim 1, wherein: A first concave portion located on one side of the second direction and a second concave portion located on the other side of the second direction are formed on the bottom surface of the resin pad. The first inner mounting portion is received in the first recess, and the second inner mounting portion is received in the second recess.

10. The coil device according to claim 1 or 9, wherein: The resin pad includes: a first arm portion rising from the first connection portion; and a second arm portion rising from the second connection portion. A first convex portion is formed at a front end portion of the first arm portion and protrudes inward in the first direction. A second convex portion is formed at a front end portion of the second arm portion and protrudes inward in the first direction. A first concave portion is formed on a side surface of the core on one side in the first direction, and a second concave portion is formed on a side surface of the core on the other side in the first direction. The first convex portion is engaged with the first concave portion, and the second convex portion is engaged with the second concave portion.

11. The coil device according to claim 1 or 2, wherein: A third inclined portion is formed on the surface of the first side insulating portion at a position facing the first outer mounting portion and is inclined so as to become lower toward the outer side. A fourth inclined portion that is inclined so as to become lower toward the outside is formed on the surface of the second side insulating portion at a position facing the second outer mounting portion.

12. A coil device, comprising: A first conductor having a first outer mounting portion formed at one end and a second outer mounting portion formed at the other end; A second conductor, which is arranged inside the first conductor and has a first inner mounting portion formed at one end and a second inner mounting portion formed at the other end; a core, which disposes the first conductor and the second conductor inside; a resin gasket having a first lateral insulating portion disposed between the first outer mounting portion and the first inner mounting portion, and a second lateral insulating portion disposed between the second outer mounting portion and the second inner mounting portion, One of the first inner mounting portion and the first outer mounting portion has a curved shape bent into an L-shape, and the other of the first inner mounting portion and the first outer mounting portion has a straight shape. One of the second inner mounting portion and the second outer mounting portion has a curved shape bent into an L-shape, and the other of the second inner mounting portion and the second outer mounting portion has a straight shape.

Images