Package reinforcement for protecting semiconductor dies

Abstract

The subject matter of this specification generally relates to electronic packaging. In some embodiments, a lidless electronic package includes a substrate having a surface and a die disposed on the substrate surface. The die has a periphery, a bottom surface adjacent to the substrate surface, and a top surface. The electronic package includes a stiffener disposed on the substrate surface. The stiffener includes a first surface and a second surface, the first surface being a first distance from the substrate surface, and the second surface being disposed between the die and the first surface. The first distance is greater than the distance between the substrate surface and the top surface of the die. The second surface is a second distance from the substrate surface, the second distance being less than the distance between the substrate surface and the top surface of the die. A groove between the first surface and the second surface, the groove including a third surface that is closer to the surface of the substrate than the second surface.

Description

[0001] This application is a divisional application of the following application:

[0002] International application number of the original application: PCT / US2019 / 015551

[0003] International filing date of the original application: January 29, 2019

[0004] National application number of the original application: 201980016011.X

[0005] Title of the original invention application: Package reinforcement for protecting semiconductor die Technical Field

[0006] The invention relates to a packaging reinforcement for protecting semiconductor crystal grains. Background Art

[0007] There are various methods for packaging integrated circuits. A lidless electronic package is one that does not include a lid mounted on the die. This allows for direct contact between the heat sink and the die, resulting in better thermal performance than packages that include a lid. However, as package sizes increase, lidless electronic package designs increasingly face flatness issues. These increasing flatness issues can make package assembly difficult and reduce the yield of finished products. Summary of the Invention

[0008] This specification describes a lidless electronic package having multiple surface stiffeners that protect the semiconductor die from damage and keep the package flat.

[0009] Generally, an innovative aspect of the subject matter described in this specification can be implemented in a lidless electronic package comprising a substrate having a surface and a die disposed on the substrate surface. The die may have a periphery, a bottom surface adjacent to the substrate surface, and a top surface opposite the bottom surface. The lidless electronic package may further comprise a stiffener disposed on the substrate surface and surrounding at least a portion of the periphery of the die. The stiffener may comprise a first surface that is a first distance from the substrate surface. The first distance may be greater than the distance between the substrate surface and the top surface of the die. The stiffener may further comprise a second surface disposed between the die and the first surface. The second surface may be a second distance from the substrate surface. The second distance may be less than the distance between the substrate surface and the top surface of the die.

[0010] These and other embodiments can optionally include one or more of the following features. In some aspects, the first surface and the second surface are substantially parallel to the substrate surface. The first surface can be above the top surface of the die, and the second surface can be below the top surface of the die. The second surface can be closer to the substrate surface than the top surface of the die. In one aspect, the second surface can be approximately 0.02 to 0.06 mm closer to the substrate surface than the top surface of the die.

[0011] In some aspects, the reinforcement member includes an inclined surface extending from the first surface to the second surface. The inclined surface can be at an angle of less than 90 degrees relative to the second surface. In some aspects, the reinforcement member includes a groove between the first surface and the second surface. The groove can include a third surface that is closer to the substrate surface than the second surface.

[0012] In some aspects, the reinforcement member includes a first reinforcement member having a first thickness and a second reinforcement member disposed on a portion of the first reinforcement member. The first thickness causes the second surface to be closer to the substrate surface than the top surface of the die. The second reinforcement member can have a thickness that causes the second surface to be further away from the substrate surface than the top surface of the die.

[0013] In some aspects, the first surface and the second surface are part of a single reinforcement member having a varying thickness.The thickness of the reinforcement member below the first surface can be greater than the thickness of the reinforcement member below the second surface.

[0014] Generally, another innovative aspect of the subject matter described in this specification can be implemented in an electronic package comprising a substrate having a surface and a die disposed on the substrate surface. The die may have a periphery, a bottom surface adjacent to the substrate surface, and a top surface opposite the bottom surface. The electronic package may further comprise a stiffener disposed on the substrate surface and surrounding at least a portion of the periphery of the die. The stiffener may comprise a first portion having a first surface and a first thickness extending between the substrate surface and the first surface. The first thickness may be greater than the thickness of the die. The stiffener may further comprise a second portion having (i) a second surface disposed between the die and the first surface, and (ii) a second thickness extending between the substrate surface and the second surface. The second thickness may be less than the thickness of the die.

[0015] These and other embodiments can optionally include one or more of the following features. In some aspects, the first surface and the second surface are substantially parallel to the substrate surface. The first surface can be above the top surface of the die, and the second surface can be below the top surface of the die. The die can be 0.02 to 0.06 mm thicker than the second portion.

[0016] In some aspects, the reinforcement member includes an inclined surface extending from the first surface to the second surface. The inclined surface can be at an angle of less than 90 degrees relative to the second surface. In some aspects, the reinforcement member includes a groove between the first surface and the second surface. The groove can include a third surface that is closer to the substrate surface than the second surface.

[0017] In general, another innovative aspect of the subject matter described in this specification can be implemented in a lidless electronic package, the lidless electronic package comprising a substrate having a surface and a die attached to the substrate surface. The die can have a periphery, a bottom surface adjacent to the substrate surface, and a top surface opposite the bottom surface. The lidless electronic package can also include a stiffener disposed on the substrate surface and surrounding the periphery of the die. The stiffener can include a first surface and a second surface, the first surface being further away from the substrate surface than the top surface of the die, the second surface being disposed between the die and the first surface. The second surface can be closer to the substrate surface than the top surface of the die.

[0018] These and other embodiments can optionally include one or more of the following features: In some aspects, the first surface is above the top surface of the die, and the second surface is below the top surface of the die. The second surface is 0.02-0.06 mm closer to the substrate surface than the top surface of the die.

[0019] In some aspects, the reinforcement comprises an inclined surface extending from the first surface to the second surface. The inclined surface may be at an angle of less than 90 degrees relative to the second surface.

[0020] In some aspects, the stiffener comprises a groove between the first surface and the second surface. The groove may comprise a third surface that is closer to the substrate surface than the second surface.

[0021] In some aspects, the reinforcement member includes a first reinforcement member having a first thickness and a second reinforcement member disposed on a portion of the first reinforcement member. The first thickness causes the second surface to be closer to the substrate surface than the top surface of the die. The second reinforcement member may have a thickness such that the second surface is further away from the substrate surface than the top surface of the die.

[0022] Certain aspects of the subject matter described herein can be implemented to achieve one or more of the following advantages. An electronic package can include multiple surfaces (e.g., arranged in a stepped pattern) to prevent package warping while also protecting the semiconductor die from damage during heat sink installation. A first portion of a stiffener can be thicker and extend above the top surface of the die to provide better protection against warping. A second portion of the stiffener can be positioned between the die and the first portion of the stiffener and can have a surface below the top surface of the die. The second portion provides a support for the heat sink, preventing the heat sink from initially contacting the die and damaging it, for example, if the heat sink approaches the die at an angle relative to the die's top surface. By having the surface of the second portion lower than the top surface of the die, the heat sink can also lie flat on the die, resulting in better thermal contact between the heat sink and the die than when space is left between the heat sink and the die. This can provide better heat transfer between the die and the heat sink. Thus, the electronic packages described herein allow for larger stiffeners that can provide better protection against warping while also protecting the die from damage caused by stiffeners extending above the top surface of the die.

[0023] The details of one or more embodiments of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages of the invention will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A is a cross-sectional view of an example electronic package.

[0025] Figure 1B yes Figure 1A A top view of an example electronic package.

[0026] Figure 1C yes Figure 1A A partial cross-sectional view of an example electronic package.

[0027] Figure 1D yes Figure 1A A cross-sectional view of an electronic package wherein a heat sink is mounted on the electronic package.

[0028] Figure 1E yes Figure 1A A cross-sectional view of an electronic package with a heat sink installed.

[0029] Figure 2 is a cross-sectional view of another example electronic package.

[0030] Like reference numbers and designations in the various drawings indicate like elements. DETAILED DESCRIPTION

[0031] An electronic package, also known as an integrated circuit (IC) package, includes a substrate and one or more dies disposed on a surface of the substrate. Each die may include an integrated circuit fabricated on a semiconductor material. The electronic package may also include one or more stiffeners to prevent warping of the components of the electronic package. For example, a mismatch in the coefficient of thermal expansion (CTE) may exist among different components of the electronic package. When subjected to temperature fluctuations, such as during the package assembly process, this CTE mismatch can cause the electronic package to warp, bend, or twist, resulting in an uneven electronic package. This flatness issue can make the soldering process more difficult, leading to poor soldering between the electronic package and the circuit board or other mounting surface.

[0032] Reinforcements can prevent electronic packages from warping. They can be attached to the perimeter of the substrate, for example, around the die. The reinforcements can have a higher elastic modulus than the substrate to prevent substrate warping. Generally, increasing the size of the reinforcement, such as increasing its thickness, improves warpage resistance. However, the size of the reinforcement may be limited by the substrate size and the characteristics of the package assembly process.

[0033] If the stiffener extends above the top surface of the die (i.e., the surface opposite the substrate surface), it provides better protection against warping. However, this can make it more difficult to install the heat sink without damaging the die. For example, if the heat sink is installed at an angle (e.g., not flat relative to the top surface of the die), it can damage the die. In some cases, due to the geometry of the electronic package, the installer may not be able to see how flat the heat sink is when it is close to the die.

[0034] The stiffeners described herein may have multiple surfaces and / or varying thicknesses to allow a portion of the stiffener to extend above the top surface of the die while also protecting the die from damage during heat sink installation. For example, the stiffener may include a first surface above the top surface of the die and a second surface below the top surface of the die. The second surface may be disposed between the die and the first surface. In this manner, the second surface may provide a support frame for the heat sink when the heat sink approaches the die at an angle, while also allowing for a larger stiffener.

[0035] In some embodiments, a lidless electronic package includes a substrate having a surface and a die disposed on the substrate surface. The die has a periphery, a bottom surface adjacent to the substrate surface, and a top surface. The electronic package includes a stiffener disposed on the substrate surface. The stiffener includes a first surface and a second surface, the first surface being a first distance from the substrate surface, the second surface being disposed between the die and the first surface. The first distance is greater than a distance between the substrate surface and the top surface of the die. The second surface is a second distance from the substrate surface, the second distance being less than a distance between the substrate surface and the top surface of the die.

[0036] Figures 1A-1E Depicted is an example electronic package 100. The relative dimensions in each figure are illustrative only and are not necessarily drawn to scale. Figure 1A is a cross-sectional view of an example electronic package 100. The electronic package 100 includes a substrate 110 and a die 120 disposed on (eg, attached to) a surface 111 of the substrate 110. Although Figure 1A One crystal grain 120 is shown in FIG. 1 , but a plurality of crystal grains may be provided on the surface 111 of the substrate 110 .

[0037] Electronic package 100 also includes interconnect pins 112 for attaching electronic package 100 to a mounting surface, such as a printed circuit board. Electronic package 100 may be a lidless electronic package that does not include a lid over die 120. For example, the electronic package may be a lidless ball grid array (BGA) package.

[0038] The electronic package 100 also includes a stiffener 130 disposed on (e.g., attached to) the surface 111 of the substrate 110. Typically, the stiffener 130 can be made of a material having a higher elastic modulus than the elastic modulus of the substrate 110. For example, the stiffener 130 can be made of metal (e.g., aluminum, copper, or steel), ceramic, composite material, or other suitable material. Figure 2 As shown, the reinforcement 130 may be a single reinforcement structure or a plurality of reinforcement structures coupled to one another.

[0039] refer to Figure 1B, the reinforcement 130 can surround at least a portion of the periphery of the die 120. The periphery of the die 120 includes the four sides 121A-121D of the die 120. In this example, the reinforcement 130 surrounds the entire periphery of the die 120. In other embodiments, the reinforcement 130 can only surround a portion of the periphery of the die 120. For example, the reinforcement 130 can be installed on one or more sides of the die 120, such as two or three sides. In another example, the reinforcement 130 can substantially surround the periphery of the die 120 by having a corresponding reinforcement 130 on each side 121A-121C of the die 120, but with a space between each adjacent reinforcement.

[0040] exist Figures 1A-1E In the example shown, the stiffener 130 is adjacent to each side 121A-121D of the die 120. For example, each side 121A-121D of the die 120 can contact a corresponding portion of the stiffener 130. In some embodiments, a space exists between the stiffener 130 and the sides 121A-121D of the die 120.

[0041] Figure 1C yes Figure 1A A partial cross-sectional view of a portion 160 of an example electronic package is shown. Figure 1C As shown, stiffener 130 includes a first surface 131 and a second surface 132. First surface 131 may be above top surface 122 of die 120, while second surface 132 is below top surface 122 of die 120. Top surface 122 of die 120 is the surface opposite surface 123 adjacent to surface 111 of substrate 110. The term "top surface" is used for convenience in the subsequent discussion, but top surface 122 may not always be on top of die 120 depending on the orientation of electronic package 100. For example, if the electronic package is flipped, top surface 122 may be below surface 123.

[0042] The term "above" is used to indicate that the first surface 131 is located at a greater distance from the surface 111 of the substrate 110 than the distance between the top surface 122 of the die 120 and the surface 111 of the substrate 110. Similarly, the term "below" is used to indicate that the second surface 132 is located at a shorter distance from the surface 111 of the substrate 110 than the distance between the top surface 122 of the die 120 and the surface 111 of the substrate 110. In different orientations of the electronic package 100, for example, if the electronic package 100 is turned upside down from the illustrated orientation, the height of the first surface 131 can be lower than the height of the top surface 122 of the die 120. However, the first surface 131 is still located further from the surface 111 of the substrate 110 than the distance between the top surface 122 of the die 120 and the surface 111 of the substrate 110.

[0043] The additional thickness of the reinforcement 130 between the first surface 131 and the surface 111 of the substrate 110 provides better protection against warping, thereby allowing the substrate to remain flat. As used herein, the thickness of a portion of the reinforcement 130 refers to the distance between the surface 111 of the substrate 110 and the surface of the portion of the reinforcement 130 opposite the surface 111 of the substrate 110. Protection against warping increases with increasing thickness of the reinforcement. In this example, the portion of the reinforcement 130 between the first surface 131 and the surface 111 of the substrate 110 is thicker than the portion of the reinforcement 130 between the second surface 132 and the surface 111 of the substrate 110.

[0044] When the heat sink is mounted on the electronic package 100, the second surface 132 provides a support frame for the heat sink. Figure 1D As described in detail in , if the heat sink approaches the die 120 at an angle relative to the top surface 122 of the die 120, the heat sink is more likely to contact a portion of the second surface 132 (e.g., on a side of the die 120) rather than the die 120 itself. This protects the die 120 from being damaged by the heat sink.

[0045] To provide a support structure, the second surface 132 is below the top surface 122 of the die 120. That is, the distance between the second surface 132 and the surface 111 of the substrate 110 is shorter than the distance between the top surface 122 of the die 120 and the surface 111 of the substrate 110. Figure 1E This allows the heat sink to rest flat on the die 120 as shown.

[0046] The second surface 132 of the stiffener 130 is closer to the surface 111 of the substrate 110 than the top surface 122 of the die 120. For example, the second surface 132 of the stiffener 130 may be 0.02-0.06 mm below the top surface 122 of the die 120. That is, the distance 171 between the surface 111 of the substrate 110 and the top surface 122 of the die 120 may be 0.02-0.06 mm longer than the distance 172 between the surface 111 of the substrate 110 and the second surface 132. The closer the second surface 132 of the stiffener 130 and the top surface 122 of the die 120 are to the surface 111 of the substrate 110, the greater the likelihood that the heat sink will contact a portion of the second surface 132 of the stiffener 130 before contacting the die 120. However, if the design distance is too short, manufacturing defects may cause the second surface 132 to be higher than the top surface 122 of the die 120, resulting in reduced thermal contact between the heat sink and the die 120.

[0047] In some embodiments, the first surface 131 of the stiffener 130 and the second surface 132 of the stiffener 130 are substantially parallel. That is, the surfaces 131 and 132 may be parallel or have an angle of less than 5 degrees between the surfaces 131 and 132. Similarly, the surfaces 131 and 132 may be substantially parallel to the top surface 122 of the die 120.

[0048] Reinforcement member 130 also includes a lead-in draft 133 and a groove 134. Lead-in draft 133 provides an inclined surface from first surface 131 of reinforcement member 130 toward die 120. If a heat sink approaches die 120 near first surface 131 of reinforcement member 130, lead-in draft 133 helps guide the heat sink toward the center of electronic package 100. The slope of lead-in draft 133 relative to the first surface 131 can be less than 90 degrees, meaning it is not perpendicular to first surface 131.

[0049] The groove 134 can help ensure that the heat sink rests flat on the die 120. For example, if the second surface 132 of the stiffener 130 extends to the lead-in guide 133, one end of the heat sink can rest on the lead-in guide 133. This will cause the heat sink to be at a non-zero angle relative to the top surface 122 of the die 120, resulting in less thermal contact between the heat sink and the die 120.

[0050] Figure 1D yes Figure 1A FIG1 is a cross-sectional view of an electronic package 100 with a heat sink 150 mounted thereon. The heat sink 150 includes a base 154 (e.g., a copper base) and an array of fins 153. In this example, the heat sink 150 approaches the die 120 at an angle. The bottom surface of the base 154 of the heat sink 150 is not parallel to the top surface 122 of the die 120. Before any portion of the heat sink 150 contacts the die 120, the first side 151 of the heat sink 150 contacts a portion of the second surface 132 of the stiffener 130. After the first side 151 contacts the second surface 132 of the stiffener 130, the second side 152 of the heat sink 150 can continue to move toward the second surface 132 of the stiffener 130 on the other side of the substrate 110 until the base 154 of the heat sink 150 rests flatly on the top surface 122 of the die 120. The heat sink 150 may be attached to the electronic package 100 using mechanical means (eg, spring-loaded screws) and adhesives (eg, thermal adhesives), or other suitable attachment techniques.

[0051] If the heat sink 150 is closer to the die 120 than to one side of the electronic package 100, the side of the heat sink 150 may contact the introduction guide 133. The introduction guide 133 may guide the side of the heat sink toward the center of the electronic package 100. In this example, the side of the heat sink 150 contacting the introduction guide may be located above the groove 134.

[0052] Figure 1E yes Figure 1A FIG1 is a cross-sectional view of an electronic package 100 with a heat sink 150 mounted thereon. A base 154 of the heat sink 150 rests on the top surface 122 of the die 120. In this example, the heat sink 150 is longer than the die 120. Therefore, a portion of the heat sink 150 extends over the second surface 132 of the stiffener 130. When the second surface 132 of the stiffener 130 is below the top surface 122 of the die 120, a gap exists between the base 154 of the heat sink 150 and the second surface 132 of the stiffener 130. This gap helps ensure that the base 154 of the heat sink 150 rests flat on the top surface 122 of the die 120. For example, if the second surface 132 of the stiffener 130 is above the top surface 122 of the die 120 , the base 154 of the heat spreader 150 will not directly contact the top surface 122 of the die 120 in at least some portions of the top surface 122 of the die 120 .

[0053] The configuration of the stiffener 130 in the electronic package 100 also provides a wider window in which the heat sink 150 can be mounted relative to designs where the stiffener comprises a single thickness. This allows the fin array 153 to be lowered closer to the top surface 122 of the die 120. This also reduces the thermal resistance of the heat sink by minimizing the thickness of the heat sink's base 154, which allows for a higher heat flux (watts per square millimeter) from the die 120.

[0054] Figure 2 is a cross-sectional view of another example electronic package 200. The example electronic package 200 includes a substrate 210 and a die 220 disposed on (eg, attached to) a surface of the substrate 210. Figure 2 Only one die 220 is shown, but multiple dies may be provided on the surface of the substrate 210. The electronic package 200 also includes interconnect pins 212 for attaching the electronic package 200 to a mounting surface, such as to a printed circuit board.

[0055] The electronic package 200 further includes a stiffener 230 disposed on (eg, attached to) a surface of the substrate 210. Figures 1A-1E The reinforcement member 130 , the reinforcement member 230 may be made of a material having an elastic modulus higher than that of the substrate 210 .

[0056] In this example, the reinforcement 230 is made of two reinforcements 231 and 233. Similar to Figures 1A-1E The reinforcement member 130 is provided on the surface of the substrate 210 and may surround at least a portion of the periphery of the die 220. The reinforcement member 231 has a surface 232, for example, a flat surface below the top surface 222 of the die 220. That is, the distance between the surface 232 of the reinforcement member 231 and the surface of the substrate 210 is shorter than the distance between the top surface 222 of the die 220 and the surface of the substrate 210. Similar to Figures 1A-1E The second surface 132 of the intermediate member 130 and the surface 232 of the reinforcement member 231 provide a support frame for the radiator.

[0057] Reinforcement member 233 may be disposed on (e.g., attached to) surface 232 of reinforcement member 231. Reinforcement member 233 provides additional protection against warping of electronic package 200. For example, the combination of the dimensions of reinforcement member 231 and the dimensions of reinforcement member 233 provides better protection against warping than reinforcement member 231 alone.

[0058] The reinforcement 233 may be provided along the entire periphery of the reinforcement 231 and surround at least a portion of the die 220. Figure 2 As shown, the reinforcement 233 can be provided on the outer edge of the reinforcement 231. The reinforcement 233 can cover the outer edge of the reinforcement 231 on each side of the substrate 210. For example, if the substrate is similar to Figures 1A-1E If the substrate 110 has a rectangular shape, the reinforcement 231 may extend along all four sides, and the reinforcement 233 may be provided on the reinforcement 231 on all four sides.

[0059] The reinforcement 233 may include a Figures 1A-1E The introduction guide portion 133 of the reinforcing member 231 may include an inclined introduction guide portion 235. Although not shown, the reinforcing member 231 may include an inclined Figures 1A-1E For example, the reinforcing member 231 may include a groove in which the introduction guide portion 235 contacts the surface 232 of the reinforcing member 231 .

[0060] Implementations of the subject matter and operations described in this specification can be implemented in digital electronic circuitry, or in computer software, firmware, or hardware, including the structures disclosed in this specification and their equivalents, or in a combination of one or more.

[0061] Although this specification contains many specific implementation details, these details should not be interpreted as limitations on any invention or the scope of what may be claimed, but rather as descriptions of specific features of a particular implementation of a particular invention. In this specification, certain features described in the context of separate embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented separately in multiple embodiments or in any suitable sub-combination. Moreover, although features may be described above as working in certain combinations and even initially claimed as such, in some cases, one or more features in the claimed combination may be deleted from the combination, and the claimed combination may be used in a sub-combination or sub-combination variant.

[0062] Similarly, although operations are depicted in a particular order in the accompanying drawings, this should not be construed as requiring that the operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed to achieve the desired result. Thus, specific embodiments of the present subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the operations may be performed in an order different from that described in the claims and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the particular order shown or in sequential order to achieve the desired results. In some embodiments, multitasking and parallel processing may be advantageous.

Claims

1. A coverless electronic package, characterized in that: include: a substrate having a surface; a die disposed on the surface of the substrate, the die having an outer periphery, a bottom surface adjacent to the surface of the substrate, and a top surface opposite the bottom surface; as well as a reinforcing member, the reinforcing member being disposed on the surface of the substrate and surrounding at least a portion of the periphery of the die, the reinforcing member comprising: a first surface, the first surface being at a first distance from the surface of the substrate, the first distance being greater than a distance between the surface of the substrate and the top surface of the die; a second surface disposed between the die and the first surface, the second surface being a second distance from the surface of the substrate, wherein the second distance is less than a distance between the surface of the substrate and the top surface of the die; and A groove is between the first surface and the second surface, the groove including a third surface closer to the surface of the substrate than the second surface.

2. The coverless electronic package according to claim 1, wherein: The first surface and the second surface are parallel to the surface of the substrate.

3. The coverless electronic package according to claim 1, wherein: The first surface is above the top surface of the die, and the second surface is below the top surface of the die.

4. The coverless electronic package according to claim 1, wherein: The second surface is 0.02-0.06 mm closer to the surface of the substrate than the top surface of the die.

5. The coverless electronic package according to claim 1, wherein: The reinforcement comprises: a first stiffener having a first thickness, the first thickness causing the second surface to be closer to the surface of the substrate than the top surface of the die; and A second reinforcement member is provided on a portion of the first reinforcement member, and the second reinforcement member has a thickness such that the first surface is further away from the surface of the substrate than the top surface of the die.

6. The coverless electronic package according to claim 1, wherein: The first surface and the second surface are part of a single reinforcement member having a varying thickness, wherein the thickness of the reinforcement member below the first surface is greater than the thickness of the reinforcement member below the second surface.

7. An electronic package, characterized in that: include: a substrate having a surface; a die disposed on the surface of the substrate, the die having an outer periphery, a bottom surface adjacent to the surface of the substrate, and a top surface opposite the bottom surface; as well as a reinforcing member, the reinforcing member being disposed on the surface of the substrate and surrounding at least a portion of the periphery of the die, the reinforcing member comprising: a first portion having a first surface and a first thickness extending between the surface of the substrate and the first surface, the first thickness being greater than a thickness of the die; a second portion having (i) a second surface disposed between the die and the first surface, and (ii) a second thickness extending between the surface of the substrate and the second surface, the second thickness being less than the thickness of the die; and A groove is between the first surface and the second surface, the groove including a third surface closer to the surface of the substrate than the second surface.

8. The electronic package according to claim 7, wherein: The first surface and the second surface are parallel to the surface of the substrate.

9. The electronic package according to claim 7, wherein: The first surface is above the top surface of the die, and the second surface is below the top surface of the die.

10. The electronic package according to claim 7, wherein: The grain is 0.02-0.06 mm thicker than the second portion.

11. A coverless electronic package, characterized in that: include: a substrate having a surface; a die attached to the surface of the substrate, the die having an outer periphery, a bottom surface adjacent to the surface of the substrate, and a top surface opposite the bottom surface; as well as a reinforcing member, the reinforcing member being disposed on the surface of the substrate and surrounding the periphery of the die, the reinforcing member comprising: a first surface located further from the surface of the substrate than the top surface of the die; a second surface disposed between the die and the first surface, the second surface being closer to the surface of the substrate than the top surface of the die; and A groove is between the first surface and the second surface, the groove including a third surface closer to the surface of the substrate than the second surface.

12. The coverless electronic package according to claim 11, wherein: The first surface is above the top surface of the die, and the second surface is below the top surface of the die.

13. The coverless electronic package according to claim 11, wherein: The second surface is 0.02-0.06 mm closer to the surface of the substrate than the top surface of the die.

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