Display module and display device

Abstract

The present invention relates to the field of display, and discloses a display module and a display device, wherein the display module comprises a display panel and a cover plate; the display panel comprises a main body and a rear folding portion, and the rear folding portion is bent toward a side of the main body away from the cover plate; a heat dissipation film is located on a side of the display panel away from the cover plate, a first adhesive layer is located on a side of the display panel away from the cover plate, a thermal conductive layer is located on a side of the first adhesive layer away from the cover plate, and a buffer layer is located between the first adhesive layer and the thermal conductive layer; an avoidance groove is provided at a position corresponding to the heat dissipation film and the rear folding portion to expose the first adhesive layer, a flexible circuit board has a first connection end and a second connection end, the first connection end of the flexible circuit board is connected to the rear folding portion of the display panel, and the flexible circuit board is entirely located on a side of the display panel away from the cover plate; a protective structure is located on a side of the thermal conductive layer away from the display panel, and an orthographic projection of the second connection end of the flexible circuit board on the heat dissipation film is located within the protective structure; and the second adhesive layer is provided between the rear folding portion and the main body.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the continuous development of science and technology, more and more display devices are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable and important tool for people today. Display devices display images through display modules.

[0003] With the development of display technology, more and more display panels are applied to people's daily life. The bending area of ​​the existing display panel only exists in the frame area of ​​the display panel, so that the frame area of ​​the display panel is bent through the bending area to reduce the area of ​​the frame area of ​​the display panel and realize a narrow frame. Since the display panel is relatively fragile, various problems will also occur when it is bent. Summary of the invention

[0004] The invention discloses a display module and a display device, which are used to reduce the adverse effects caused by the bending of a display panel.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] In a first aspect, the present invention provides a display module, comprising:

[0007] A display panel and a cover plate located on the light emitting side of the display panel; the display panel comprises a main body and a rear folding portion, the rear folding portion is bent toward a side of the main body away from the cover plate;

[0008] a heat dissipation film, the heat dissipation film being located at a side of the display panel away from the cover plate, wherein the heat dissipation film comprises a first adhesive layer, a buffer layer and a heat conductive layer, the first adhesive layer being located at a side of the display panel away from the cover plate, the heat conductive layer being located at a side of the first adhesive layer away from the cover plate, and the buffer layer being located between the first adhesive layer and the heat conductive layer; an avoidance groove is provided at a position corresponding to the rear folding portion of the heat dissipation film so as to expose the first adhesive layer, and an orthographic projection of the rear folding portion on the heat dissipation film is located in the avoidance groove;

[0009] A flexible circuit board, the flexible circuit board having a first connection end and a second connection end, the first connection end of the flexible circuit board being connected to the rear folded portion of the display panel, and the flexible circuit board being entirely located on a side of the display panel away from the cover plate;

[0010] a protective structure, wherein the protective structure is located on a side of the heat-conducting layer away from the display panel, and an orthographic projection of the second connecting end of the flexible circuit board on the heat dissipation film is located within the protective structure;

[0011] A second adhesive layer is disposed between the rear folded portion and the main body, and the rear folded portion and the second adhesive layer at least partially overlap.

[0012] The display module provided by the present invention includes a display panel and a cover plate located on the light-emitting side of the display panel, and the display panel includes a main body and a rear folding portion, the rear folding portion is bent toward the side of the main body away from the cover plate, and the display panel also generates heat when working. In order to dissipate the heat of the display panel, a heat dissipation film is arranged on the side of the display panel away from the cover plate, and the heat dissipation film specifically includes a first adhesive layer, a buffer layer and a heat conductive layer, the first adhesive layer is located on the side of the display panel away from the cover plate, the heat conductive layer is located on the side of the first adhesive layer away from the cover plate, and the buffer layer is located between the first adhesive layer and the heat conductive layer. The flexible circuit board is entirely located on the side of the display panel away from the cover plate, and an avoidance groove is provided at the position of the heat dissipation film corresponding to the rear folding portion to expose the first adhesive layer. When the first connection end of the flexible circuit board is electrically connected to the rear folding portion of the display panel, since the flexible circuit board is entirely located on the side of the display panel away from the cover plate, the rear folding portion of the display panel is formed by bending. In order to prevent the bent rear folding portion from rebounding, a second adhesive layer is provided between the rear folding portion and the main body. The second adhesive layer is on the side of the first adhesive layer facing the rear folding portion, so that the first adhesive layer and the second adhesive layer are adhered to form an adhesive structure, and the rear folding portion at least partially overlaps with the second adhesive layer. Due to the addition of the second adhesive layer, the overall thickness of the adhesive structure between the main body and the rear folding portion is increased. Since the viscosity is positively correlated with the thickness, the viscosity of the adhesive structure between the main body and the rear folding portion is increased, and the rebound of the rear folding portion is effectively avoided. At the same time, since the display panel is relatively fragile, the second connection end of the flexible circuit board located on the side of the display panel away from the cover plate is likely to cause pressure damage to the display panel, resulting in abnormal display of the display panel. Therefore, on the side of the heat conductive layer in the heat dissipation film away from the display panel, the orthographic projection of the second connection end of the flexible circuit board on the heat dissipation film is located within the protective structure, which protects the display panel. By integrating the protective structure and the second adhesive layer onto the heat dissipation film to achieve an integrated structure, the process flow can be effectively reduced, thereby improving production efficiency.

[0013] Optionally, the heat dissipation film further includes: an insulating layer located between the heat conductive layer and the buffer layer.

[0014] Optionally, the heat dissipation film is provided with a mounting groove, and the opening of the mounting groove faces a side away from the cover plate;

[0015] The protection structure is located in the installation slot, and along a direction perpendicular to the plane where the cover plate is located, the protection structure at least partially extends out of the opening of the installation slot.

[0016] Optionally, along a direction perpendicular to the plane where the cover plate is located, the depth of the mounting groove is the same as the depth of the avoidance groove.

[0017] Optionally, there is a gap between the protection structure and the inner wall of the mounting groove, and the gap is greater than 0.15 mm.

[0018] Optionally, the thickness of the protection structure is 1.01 to 1.2 times the depth of the mounting groove.

[0019] Optionally, there is a gap between the second adhesive layer and the inner wall of the avoidance groove, and the gap is greater than 0.15 mm.

[0020] Optionally, the thickness of the second adhesive layer is 1.01 to 1.15 times the depth of the avoidance groove.

[0021] Optionally, the first adhesive layer is in a grid shape.

[0022] Optionally, the material of the insulating layer includes at least one of polyethylene terephthalate plastic or polyimide.

[0023] Optionally, the display module further includes a polarizer and optical glue;

[0024] The polarizer is located on a side of the display panel facing the cover plate, and the optical adhesive is located on a side of the polarizer facing the cover plate.

[0025] In a second aspect, the present invention provides a display device, comprising the display module described in any one of the first aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A front view of a display module provided by an embodiment of the present invention;

[0027] Figure 2 for Figure 1 A cross-sectional view in the XX direction;

[0028] Figure 3 An exploded diagram of a display module provided by an embodiment of the present invention;

[0029] Figure 4 for Figure 2 A local structure enlarged schematic diagram of A;

[0030] Figure 5 for Figure 2 A schematic diagram of the enlarged local structure of B;

[0031] Figure 6 A schematic structural diagram of a display device provided by an embodiment of the present invention.

[0032] Icons: 1-display module; 11-display panel; 111-main body; 112-rear folding part; 12-cover plate; 13-heat dissipation film; 131-first adhesive layer; 132-buffer layer; 133-heat conductive layer; 134-avoidance groove; 136-installation groove; 14-flexible circuit board; 141-first connecting end; 142-second connecting end; 15-protective structure; 16-second adhesive layer; 17-polarizer; 18-optical glue; 2-display device. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] like Figures 1 to 5 As shown, in a first aspect, an embodiment of the present invention provides a display module, including:

[0035] A display panel 11 and a cover plate 12 located on the light emitting side of the display panel 11; the display panel 11 includes a main body 111 and a rear folding portion 112, and the rear folding portion 112 is bent toward a side of the main body 111 away from the cover plate 12;

[0036] The heat dissipation film 13 is located on the side of the display panel 11 away from the cover plate 12, wherein the heat dissipation film 13 includes a first adhesive layer 131, a buffer layer 132 and a heat conductive layer 133, the first adhesive layer 131 is located on the side of the display panel 11 away from the cover plate 12, the heat conductive layer 133 is located on the side of the first adhesive layer 131 away from the cover plate 12, and the buffer layer 132 is located between the first adhesive layer 131 and the heat conductive layer 133; the heat dissipation film 13 is provided with an avoidance groove 134 at a position corresponding to the rear folding portion 112 to expose the first adhesive layer 131, and the orthographic projection of the rear folding portion 112 on the heat dissipation film 13 is located in the avoidance groove 134;

[0037] A flexible circuit board 14, wherein the flexible circuit board 14 has a first connection end 141 and a second connection end 142, wherein the first connection end 141 of the flexible circuit board 14 is connected to the rear folded portion 112 of the display panel 11, and the flexible circuit board 14 is entirely located on a side of the display panel 11 away from the cover plate 12;

[0038] A protection structure 15 , the protection structure 15 is located on a side of the heat-conducting layer 133 away from the display panel 11 , and an orthographic projection of the second connection end 142 of the flexible circuit board 14 on the heat dissipation film 13 is located inside the protection structure 15 ;

[0039] The second adhesive layer 16 is disposed between the rear folded portion and the main body portion, and the rear folded portion 112 and the second adhesive layer 16 at least partially overlap.

[0040] The display module provided by the present invention includes a display panel 11 and a cover plate 12 located on the light emitting side of the display panel 11, and the display panel 11 includes a main body 111 and a rear folding portion 112, the rear folding portion 112 is bent toward the side of the main body 111 away from the cover plate 12, and the display panel 11 will also generate heat when working. In order to dissipate the heat of the display panel 11, a heat dissipation film 13 is provided on the side of the display panel 11 away from the cover plate 12, and the heat dissipation film 13 specifically includes a first adhesive layer 131, a buffer layer 132 and a heat conductive layer 133, the first adhesive layer 131 is located on the side of the display panel 11 away from the cover plate 12, the heat conductive layer 133 is located on the side of the first adhesive layer 131 away from the cover plate 12, and the buffer layer 132 is located between the first adhesive layer 131 and the heat conductive layer 133. The flexible circuit board 14 is entirely located on the side of the display panel 11 away from the cover plate 12, and an avoidance groove 134 is provided at the position of the heat dissipation film 13 corresponding to the rear folding portion 112 to expose the first adhesive layer 131. When the first connection end 141 of the flexible circuit board 14 is electrically connected to the rear folding portion 112 of the display panel 11, since the flexible circuit board 14 is entirely located on the side of the display panel 11 away from the cover plate 12, the rear folding portion 112 of the display panel 11 is formed by bending. In order to prevent the bent rear folding portion 112 from rebounding, a second adhesive layer 16 is provided between the rear folding portion 112 and the main body 111. The second adhesive layer 16 is on the side of the first adhesive layer 131 facing the rear folding portion 112, so that the first adhesive layer 131 and the second adhesive layer 16 are pasted to form a pasting structure, and the rear folding portion 112 and the second adhesive layer 16 at least partially overlap. Of course, in order to ensure that the rear folding portion 112 and the second adhesive layer are more firmly pasted, the rear folding portion and the second adhesive layer can completely overlap. Due to the addition of the second adhesive layer 16, the overall thickness of the adhesive structure between the main body 111 and the rear folding part 112 is increased. Since the viscosity is positively correlated with the thickness, the viscosity of the adhesive structure between the main body 111 and the rear folding part 112 is increased, and the rebound of the rear folding part 112 is effectively avoided. At the same time, since the display panel 11 is relatively fragile, the second connection end 142 of the flexible printed circuit 14 located on the side of the display panel 11 away from the cover plate is easy to cause pressure damage to the display panel 11, resulting in abnormal display of the display panel 11. Therefore, on the side of the heat conductive layer 133 in the heat dissipation film 13 away from the display panel 11, the positive projection of the second connection end 142 of the flexible printed circuit 14 (flexible printed circuit, FPC) on the heat dissipation film 13 is located in the protective structure 15, which plays a protective role on the display panel 11. By integrating the protective structure 15 and the second adhesive layer 16 on the heat dissipation film 13 to achieve an integrated structure, the process flow can be effectively reduced, thereby improving production efficiency.

[0041] With the development of display technology, more and more display panels 11 are applied to people's daily life. The rear folding portion 112 of the display panel 11 is bent, so that the rear folding portion 112 of the display panel 11 is bent through the rear folding portion 112 to reduce the area of ​​the frame area of ​​the display panel 11 and realize a narrow frame. Figure 3 As shown, the display panel 11 is used for display. Since the display panel 11 needs to be bent, the display panel 11 can be a flexible OLED (Organic Light Emitting Diode) panel.

[0042] The driving chip (IC) may adopt a variety of packaging technologies to reduce the width of the frame and increase the screen-to-body ratio of the display module 1, which is not limited in the embodiment of the present invention.

[0043] For example, taking the display panel 11 as a flexible OLED display panel 11, the driving chip (IC) can adopt COP (Chip on Panel) technology, that is, the driving chip is directly set on the rear folding portion 112 of the display panel 11, and the rear folding portion 112 is bent to the side of the display panel 11 away from the cover plate 12, thereby reducing the width of the frame and increasing the screen-to-body ratio of the display module 1.

[0044] Continue to refer to Figure 3 A cover plate 12 is provided on the light emitting side of the display panel 11, and the cover plate 12 is used to protect the display panel 11, wherein the cover plate 12 can be a 3D glass cover plate 12, or a 2D glass cover plate 12. Of course, the cover plate 12 can also be made of other transparent materials besides glass. The cover plate 12 can also be a flexible transparent material, such as plastic (CPI: Colorless PI; PET: Polyethylene terephthalate, etc.) or ultra-thin glass (UTG, Ultra Thin Glass), etc., and those skilled in the art can set it according to actual needs.

[0045] Continue to refer to Figure 3 and Figure 5As the rear folding portion 112 of the display panel 11 is bent, due to the trend of thinning of the display device 2, the radius R of the bent rear folding portion 112 becomes smaller and smaller, resulting in the thickness of the first adhesive layer 131 in the heat dissipation film 13 in the bent area being limited. For example, the first adhesive layer 131 can be a double-sided adhesive with a double-sided adhesive effect. When the material of the first adhesive layer 131 is confirmed, its viscosity is positively correlated with its thickness. In order to improve the adhesive force of the first adhesive layer 131, an avoidance groove 134 is provided at the position of the heat dissipation film 13 corresponding to the rear folding portion 112. The first adhesive layer 131 is exposed, and the second adhesive layer 16 is provided on the side of the first adhesive layer 131 facing the rear fold portion 112, so that the first adhesive layer 131 and the second adhesive layer 16 are adhered to form an adhesive structure, and the rear fold portion 112 at least partially overlaps with the second adhesive layer 16. Due to the addition of the second adhesive layer 16, the overall thickness of the adhesive structure between the main body 111 and the rear fold portion 112 is increased. Since the viscosity is positively correlated with the thickness, the viscosity of the adhesive structure between the main body 111 and the rear fold portion 112 is increased, and the rebound of the rear fold portion 112 is effectively avoided.

[0046] Specifically, the first adhesive layer 131 is in a grid shape for venting air and preventing the generation of bubbles during lamination.

[0047] Of course, in order to enhance the anti-deformation capability of the heat dissipation film 13, the heat dissipation film 13 further includes: an insulating layer located between the heat conductive layer 133 and the buffer layer 132. The material of the insulating layer includes at least one of PET (Polyethylene terephthalate) or PI (Polyimide).

[0048] Specifically, the material of the heat-conducting layer 133 includes at least one of copper, aluminum or silver; the buffer layer 132 can be selected as foam for buffering.

[0049] like Figure 4As shown, there are many specific installation methods for the protection structure 15. For example, the protection structure 15 can be directly adhered to the thermal conductive layer 133 in the heat dissipation film 13, that is, the outermost layer in the heat dissipation film 13, that is, the side of the heat dissipation film 13 facing the flexible printed circuit board. For example, a portion of the film layer in the heat dissipation film 13 may be opened at a position corresponding to the second connection end 142 of the flexible printed circuit board to form a mounting groove 136, and the opening of the mounting groove 136 faces the side away from the cover plate 12; the protective structure 15 is located in the mounting groove 136, and along the direction perpendicular to the plane where the cover plate 12 is located, due to the compression of the protective structure 15, an opening is provided in which the protective structure 15 at least partially extends out of the mounting groove 136, for example, only the thermal conductive layer 133 in the heat dissipation film 13 is opened, or the thermal conductive layer 133 and the buffer layer 132 in the heat dissipation film 13 are opened. Of course, in order to facilitate the pasting of the protective structure 15, it is best to open a portion of the film layer in the heat dissipation film 13 and expose the first adhesive layer 131, so that the protective structure 15 can be directly connected to the first adhesive layer 131 without adding a pasting process, which saves more process and cost.

[0050] Part of the film layer of the heat dissipation film 13 is provided with a mounting groove 136 and an escape groove 134. For the convenience of processing, the mounting groove 136 and the escape groove 134 can be set to the same depth along the direction perpendicular to the plane where the cover plate 12 is located, that is, for example, the buffer layer 132 and the heat conductive layer 133 in the heat dissipation film 13 are opened to form the mounting groove 136, and the buffer layer 132 and the heat conductive layer 133 in the heat dissipation film 13 are opened to form the escape groove 134. Of course, if an insulating layer is provided between the heat conductive layer 133 and the buffer layer 132, the insulating layer can also be opened together until the first adhesive layer 131 is exposed.

[0051] Regarding the specific relationship between the protection structure 15 and the mounting groove 136 , considering the fitting tolerance of the process, there is a gap between the protection structure 15 and the inner wall of the mounting groove 136 , and the gap is greater than 0.15 mm.

[0052] Specifically, the thickness of the protective structure 15 is 1.01 to 1.2 times the depth of the mounting groove 136. For example, the material of the protective structure 15 is foam, and there is compression in the foam, which will be compressed during the bonding process, so the thickness of the protective structure 15 needs to exceed the depth of the mounting groove 136. That is, if the thermal conductive layer 133 and the buffer layer 132 in the heat dissipation layer are opened to form the mounting groove 136, the thickness of the protective structure 15 exceeds 1% to 20% of the sum of the thicknesses of the thermal conductive layer 133 and the buffer layer 132 in the heat dissipation film 13; if the thermal conductive layer 133, the insulating layer and the buffer layer 132 in the heat dissipation layer are opened to form the mounting groove 136, the thickness of the protective structure 15 exceeds 1% to 20% of the sum of the thicknesses of the thermal conductive layer 133, the insulating layer and the buffer layer 132 in the heat dissipation film 13.

[0053] Regarding the specific relationship between the second adhesive layer 16 and the mounting groove 136 , considering the bonding tolerance of the manufacturing process, there is a gap between the second adhesive layer 16 and the inner wall of the avoidance groove 134 , and the gap is greater than 0.15 mm.

[0054] Specifically, the thickness of the second adhesive layer 16 is 1.01 to 1.15 times the depth of the avoidance groove 134. For example, the material of the second adhesive layer 16 is double-sided adhesive tape, which is compressible and will be compressed during bonding in the manufacturing process, so the thickness of the second adhesive layer 16 needs to exceed the depth of the avoidance groove 134. That is, if the thermal conductive layer 133 and the buffer layer 132 in the heat dissipation layer are opened to form the avoidance groove 134, the thickness of the second adhesive layer 16 exceeds 1% to 15% of the sum of the thicknesses of the thermal conductive layer 133 and the buffer layer 132 in the heat dissipation film 13; if the thermal conductive layer 133, the insulating layer and the buffer layer 132 in the heat dissipation layer are opened to form the avoidance groove 134, the thickness of the second adhesive layer 16 exceeds 1% to 15% of the sum of the thicknesses of the thermal conductive layer 133, the insulating layer and the buffer layer 132 in the heat dissipation film 13.

[0055] The display module 1 provided in the embodiment of the present invention further includes a polarizer 17 and an optical adhesive 18;

[0056] The polarizer 17 is located on a side of the display panel 11 facing the cover plate 12 , and the optical adhesive 18 is located on a side of the polarizer 17 facing the cover plate 12 .

[0057] Among them, Figure 3 As shown, a polarizer 17 is disposed on one side of the display panel 11 close to the cover plate 12 . The polarizer 17 can reduce reflected light in the ambient light on the light-emitting side of the cover plate 12 , thereby helping to improve the display effect of the display module 1 .

[0058] Optionally, an optical adhesive 18 (Optically Clear Adhesive, OCA) is further provided on the side of the polarizer 17 close to the cover plate 12, and the polarizer 17 is bonded to the cover plate 12 through the optical adhesive 18. The optical adhesive 18 has the characteristics of being colorless and transparent, having high light transmittance, having good bonding strength, and having small curing shrinkage, so as to ensure the display effect of the display module 11 while fixing the display panel 11 and the cover plate 12 well.

[0059] In a second aspect, an embodiment of the present invention provides a display device 2, comprising the display module 1 described in any one of the first aspects.

[0060] The display device 2 provided in the embodiment of the present invention can be Figure 6The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiments of the present invention do not specifically limit this.

[0061] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A display module, characterized in that: include: A display panel and a cover plate located on the light emitting side of the display panel; the display panel comprises a main body and a rear folding portion, the rear folding portion is bent toward a side of the main body away from the cover plate; A heat dissipation film, the heat dissipation film is located on a side of the display panel away from the cover plate, wherein the heat dissipation film comprises a first adhesive layer, a buffer layer and a heat conductive layer, the first adhesive layer is located on a side of the display panel away from the cover plate, the heat conductive layer is located on a side of the first adhesive layer away from the cover plate, and the buffer layer is located between the first adhesive layer and the heat conductive layer; a avoidance groove is provided at a position corresponding to the heat dissipation film and the rear folding portion to expose the first adhesive layer, and the orthographic projection of the rear folding portion on the heat dissipation film is located in the avoidance groove; A flexible circuit board, the flexible circuit board having a first connection end and a second connection end, the first connection end of the flexible circuit board being connected to the rear folded portion of the display panel, and the flexible circuit board being entirely located on a side of the display panel away from the cover plate; a protective structure, wherein the protective structure is located on a side of the heat-conducting layer away from the display panel, and an orthographic projection of the second connecting end of the flexible circuit board on the heat dissipation film is located within the protective structure; A second adhesive layer is disposed between the rear folded portion and the main body, and the rear folded portion and the second adhesive layer at least partially overlap.

2. The display module according to claim 1, characterized in that: The heat dissipation film further includes: an insulating layer located between the heat conductive layer and the buffer layer.

3. The display module according to claim 1 or 2, characterized in that: The heat dissipation film is provided with a mounting groove, and the opening of the mounting groove faces a side away from the cover plate; The protection structure is located in the installation slot, and along a direction perpendicular to the plane where the cover plate is located, the protection structure at least partially extends out of the opening of the installation slot.

4. The display module according to claim 3, characterized in that: Along a direction perpendicular to the plane where the cover plate is located, the depth of the installation groove is the same as the depth of the avoidance groove.

5. The display module according to claim 4, characterized in that: There is a gap between the protection structure and the inner wall of the mounting groove, and the gap is greater than 0.15 mm.

6. The display module according to claim 5, characterized in that: The thickness of the protection structure is 1.01 to 1.2 times the depth of the installation groove.

7. The display module according to claim 1 or 2, characterized in that: There is a gap between the second adhesive layer and the inner wall of the avoidance groove, and the gap is greater than 0.15 mm.

8. The display module according to claim 7, characterized in that: The thickness of the second adhesive layer is 1.01 to 1.15 times the depth of the avoidance groove.

9. The display module according to claim 1, characterized in that: The first adhesive layer is in a grid shape.

10. The display module according to claim 2, characterized in that: The material of the insulating layer includes at least one of polyethylene terephthalate plastics or polyimide.

11. The display module according to claim 1, characterized in that: The display module also includes a polarizer and optical glue; The polarizer is located on a side of the display panel facing the cover plate, and the optical adhesive is located on a side of the polarizer facing the cover plate.

12. A display device, characterized in that: A display module comprising any one of claims 1-11.

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