Display device

Abstract

This application discusses a display device capable of improving heat dissipation performance. The display device includes a display panel and a rear cover for supporting the display panel, wherein the rear cover includes a first rear cover stacked on the display panel and a second rear cover stacked on the first rear cover, and the rear cover has thermal conductivity.

Description

Technical Field

[0001] The present disclosure relates to a display device. More specifically, the present disclosure relates to a display device having improved heat dissipation performance. Background Art

[0002] With the development of the information society, the demand for display devices is increasing in various forms. In response to this demand, display devices having various display panels such as liquid crystal display panels, plasma display panels, and organic light emitting display panels are being studied and commercialized.

[0003] An organic light emitting display device having an organic light emitting display panel is a self-luminous display device. Different from a display device having a liquid crystal display panel, the organic light emitting display device does not require a separate light source and thus can be manufactured relatively thin and light. In addition, the organic light emitting display device can operate at a low voltage and has excellent characteristics in terms of color rendering property, response speed, viewing angle, contrast ratio, etc., and thus has been widely used in recent years.

[0004] However, the organic light emitting elements or organic light emitting materials used in the organic light emitting display panel may be more susceptible to heat than liquid crystal materials. Therefore, heat dissipation ability is important in the organic light emitting display device. In a general organic light emitting display device, a rear cover that supports the rear of the organic light emitting display panel and an inner plate attached to the inner surface of the rear cover to enhance the rigidity of the rear cover and serve as a heat dissipation member can be used. However, in the related art support structure composed of the rear cover and the inner plate, the thickness of the rear cover or the inner plate may be large to ensure the rigidity of the support structure. In this case, heat dissipation through the inner plate may be insufficient. Summary of the Invention

[0005] Therefore, the inventors of the present disclosure have invented a support structure for an organic light emitting display panel, which can improve heat dissipation performance while reducing the manufacturing cost of the display device.

[0006] An object of an embodiment of the present disclosure is to provide a display device capable of improving heat dissipation performance while reducing its manufacturing cost.

[0007] In addition, an object of an embodiment of the present disclosure is to provide a display device that can prevent external moisture from penetrating into the display panel and can achieve a narrow bezel structure.

[0008] The object according to the present disclosure is not limited to the above object. Other objects and advantages according to the present disclosure not mentioned above can be understood from the following description and can be more clearly understood from the embodiments according to the present disclosure. In addition, it will be readily understood that the objects and advantages according to the present disclosure can be achieved by the features and combinations thereof disclosed in the claims.

[0009] According to one aspect of the present disclosure for achieving the above technical purpose, a display device capable of improving heat dissipation performance can be provided. The display device includes: a display panel; and a rear cover for supporting the display panel, wherein the rear cover includes: a first rear cover stacked on the display panel; and a second rear cover stacked on the first rear cover. The rear cover has thermal conductivity.

[0010] According to an embodiment of the present disclosure, the first rear cover is attached to the display panel via a first bonding member, the area of the second rear cover is smaller than the area of the first rear cover, and the second rear cover is attached to the first rear cover via a second bonding member.

[0011] According to an embodiment of the present disclosure, the first bonding member includes a heat dissipation material.

[0012] According to an embodiment of the present disclosure, the display device further includes a connector configured to connect a part of the first rear cover and a part of the second rear cover.

[0013] According to an embodiment of the present disclosure, the first rear cover, the second rear cover, and the connector are integrally formed with each other.

[0014] According to an embodiment of the present disclosure, the connector is disposed adjacent to the lower end of the display panel, and the bottom of the connector protrudes downward beyond the lower end of the display panel.

[0015] According to an embodiment of the present disclosure, the connector is bent, and at least one wrinkle is provided on the inner surface of the bent portion of the connector.

[0016] According to an embodiment of the present disclosure, the first rear cover includes an inner region attached to the display panel, and an edge region surrounding a part of the edge of the display panel, wherein the display device further includes a sealing member configured to minimize moisture penetration between the display panel and the edge of the first rear cover.

[0017] According to an embodiment of the present disclosure, a source printed circuit board is attached to the first rear cover, and a control printed circuit board is attached to the second rear cover.

[0018] According to an embodiment of the present disclosure, the second rear cover does not cover the source printed circuit board, and a signal cable configured to interconnect the control printed circuit board and the source printed circuit board passes through the lower end of the second rear cover.

[0019] According to an embodiment of the present disclosure, the second rear cover covers the source printed circuit board, and has at least one through hole defined therein, and a signal cable configured to interconnect the control printed circuit board and the source printed circuit board passes through the at least one through hole.

[0020] According to an embodiment of the present disclosure, each of the upper end and the lower end of the at least one through hole has a curvature.

[0021] According to one embodiment of the present disclosure, the at least one through hole extends in a manner inclined with respect to the top surface and the bottom surface of the second rear cover.

[0022] According to one embodiment of the present disclosure, the rear cover is made of: aluminum, copper, or an alloy thereof; or a clad metal in which aluminum, copper, or an alloy thereof is laminated; or a steel plate material including galvanized steel, aluminized steel, or aluminum-zinc plated steel.

[0023] According to one embodiment of the present disclosure, the rear cover is made of a PCM (pre-coated metal) material as a color steel plate material, which is obtained by coating a resin on the steel plate material or attaching a film to the steel plate material.

[0024] According to another aspect of the present disclosure, a display device includes a display panel and a rear cover having thermal conductivity. The rear cover includes a first rear cover having an inner region attached to the display panel via a first bonding member, and an edge region surrounding a part of the edge of the display panel. The rear cover further includes a second rear cover attached to the rear surface of the first rear cover via a second bonding member. The display device further includes a connector disposed adjacent to the lower end of the display panel, wherein the connector interconnects a part of the first rear cover and a part of the second rear cover, and wherein the first rear cover, the second rear cover, and the connector are integrally formed with each other.

[0025] According to one embodiment of the present disclosure, the area of the second rear cover is smaller than the area of the first rear cover.

[0026] According to one embodiment of the present disclosure, the lower end of the connector protrudes downward beyond the lower end of the display panel.

[0027] According to one embodiment of the present disclosure, the connector is bent, and at least one wrinkle is provided on the inner surface of the bent portion of the connector.

[0028] According to one embodiment of the present disclosure, the display device further includes a sealing member configured to minimize moisture penetration between the top edge, the right edge, and the left edge of the display panel and the edge region of the first rear cover.

[0029] According to one embodiment of the present disclosure, a source printed circuit board is attached to the first rear cover, and a control printed circuit board is attached to the second rear cover.

[0030] According to one embodiment of the present disclosure, the second rear cover does not cover the source printed circuit board, and a signal cable configured to interconnect the control printed circuit board and the source printed circuit board passes through the lower end of the second rear cover.

[0031] According to an embodiment of the present disclosure, the second rear cover covers the source printed circuit board and has at least one through hole defined therein, and is configured to allow a signal cable for interconnecting the control printed circuit board and the source printed circuit board to pass through the at least one through hole.

[0032] According to an embodiment of the present disclosure, each of an upper end and a lower end of the at least one through hole has a curvature.

[0033] According to an embodiment of the present disclosure, the at least one through hole extends in a manner inclined with respect to a top surface and a bottom surface of the second rear cover.

[0034] According to an embodiment of the present disclosure, the first adhesive member includes a heat dissipation material.

[0035] According to an embodiment of the present disclosure, since the rear cover having thermal conductivity supports the display panel, a display device capable of improving heat dissipation performance can be provided.

[0036] In addition, according to an embodiment of the present disclosure, since the first rear cover and the second rear cover form a stacked structure, a rear cover having high flexural rigidity can be provided.

[0037] In addition, according to an embodiment of the present disclosure, since the area of the second rear cover is smaller than the area of the first rear cover, the total weight of the rear cover can be reduced while maintaining high flexural rigidity.

[0038] In addition, according to an embodiment of the present disclosure, since the rear cover supports the display panel and dissipates heat at the same time, a separate inner plate required in the related art to support the display panel and dissipate heat is not needed. Therefore, according to an embodiment of the present disclosure, the structure for supporting the display panel is simplified. Due to the reduction in the number of its components, the manufacturing cost of the display device can be reduced.

[0039] In addition, according to an embodiment of the present disclosure, the display device includes a connector disposed adjacent to a lower end of the display panel. A lower end of the connector protrudes downward beyond the lower end of the display panel. Therefore, even when the display device collides with the ground during handling of the display device, it is possible to prevent the display panel from directly colliding with the ground and being damaged. It is possible to prevent a flexible film extending to surround the lower end of the display panel to interconnect the source printed circuit board and the display panel from directly colliding with the ground and being damaged.

[0040] The effects of the present disclosure are not limited to the above effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The present invention will be more fully understood from the following detailed description given below and the accompanying drawings which are given by way of illustration only, and thus do not limit the present invention.

[0042] Figure 1 is a plan view illustrating a display device according to one embodiment of the present disclosure.

[0043] Figure 2 is a perspective view illustrating a display device according to one embodiment of the present disclosure.

[0044] Figure 3 and Figure 4 Along the Figure 1 and Figure 2 Cross-sectional views of the display device taken along the II' section line and the II-II' section line.

[0045] Figure 5 is a perspective view of a rear cover in an unfolded state according to one embodiment of the present disclosure.

[0046] Figure 6 is a plan view illustrating a display device according to another embodiment of the present disclosure.

[0047] Figure 7 is a perspective view illustrating a display device according to another embodiment of the present disclosure.

[0048] Figure 8 It is along Figure 6 and Figure 7 A cross-sectional view of the display device taken along line III-III'.

[0049] Figure 9 is a perspective view illustrating a deployed state of a rear cover according to another embodiment of the present disclosure.

[0050] Figures 10 to 12 Each of the diagrams is a cross-sectional view schematically illustrating a structure of an organic light emitting display panel that can be used in a display device according to an embodiment of the present disclosure.

[0051] Figure 13 is a detailed cross-sectional view illustrating a stacked structure of a bottom emission type organic light emitting display panel that can be used in a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0052] The advantages and features of the present disclosure, as well as methods for achieving these advantages and features, will become apparent with reference to the embodiments described in detail later in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, but may be implemented in a variety of different forms. Therefore, these embodiments are provided only to complete the present disclosure and to fully inform those skilled in the art of the present disclosure of its scope, and the present disclosure is limited only by the scope of the claims.

[0053] The shapes, dimensions, ratios, angles, quantities, etc. disclosed in the accompanying drawings used to describe the embodiments of the present disclosure are exemplary, and the present disclosure is not limited thereto. The same reference numerals refer to the same elements throughout this document. In addition, for simplicity of description, the description and details of well-known steps and elements are omitted. Furthermore, in the following detailed description of the present disclosure, numerous specific details are set forth to provide a thorough understanding of the present disclosure. However, it should be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, processes, components, and circuits are not described in detail so as not to unnecessarily obscure various aspects of the present disclosure.

[0054] The terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the present disclosure. As used herein, the singular forms "a" and "an" are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that when used in this specification, the terms "comprises", "comprising", "includes" and "including" specify the presence of the stated features, integers, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components and / or portions thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of..." when preceding a list of elements may modify the entire list of elements and may not modify the individual elements in the list. In the interpretation of numerical values, errors or tolerances may occur even if not explicitly described therein.

[0055] In addition, it should be understood that when an element or layer is referred to as "connected to" or "coupled to" another element or layer, it can be directly on, connected to, or coupled to the other element or layer, or there may be one or more intervening elements or layers. Further, it should also be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there may also be one or more intervening elements or layers.

[0056] In the description of temporal relationships, for example, the temporal precedence relationship between two events, such as "after", "subsequent", "before", etc., another event may occur therebetween unless it is "directly after", "directly subsequent", or "directly before", etc.

[0057] In addition, as used herein, when one layer, film, region, plate, etc. is disposed "on" or "on top of" another layer, film, region, plate, etc., the former may directly contact the latter or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when one layer, film, region, plate, etc. is directly disposed "on" or "on top of" another layer, film, region, plate, etc., the former directly contacts the latter and no other layer, film, region, plate, etc. is disposed between the former and the latter. In addition, as used herein, when one layer, film, region, plate, etc. is disposed "under" or "beneath" another layer, film, region, plate, etc., the former may directly contact the latter or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when one layer, film, region, plate, etc. is directly disposed "under" or "beneath" another layer, film, region, plate, etc., the former directly contacts the latter and no other layer, film, region, plate, etc. is disposed between the former and the latter.

[0058] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part and may not define an order. Thus, without departing from the spirit and scope of the present disclosure, the first element, component, region, layer, or part described below may be referred to as the second element, component, region, layer, or part.

[0059] The features of the various embodiments of the present disclosure may be partially or wholly combined with each other and may be technically related or interoperable with each other. Each embodiment may be implemented independently or may be implemented together in an associated relationship.

[0060] Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present inventive concept pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly defined in this specification.

[0061] Hereinafter, embodiments of the present disclosure related to a display device will be described in detail with reference to the accompanying drawings. All components of each display device according to all embodiments of the present disclosure are operatively coupled and configured.

[0062] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure. Figure 2 is a perspective view showing a display device according to an embodiment of the present disclosure.Figure 3 and Figure 4 are cross-sectional views of a display device taken along the I-I' cutting line and the II-II' cutting line along Figure 1 and Figure 2 respectively. Figure 5 is a perspective view showing an unfolded state of a rear cover according to an embodiment of the present disclosure.

[0063] Referring to Figures 1 to 4 , a display device according to an embodiment of the present disclosure may include a display panel 100 and a rear cover 200 having thermal conductivity, and the rear cover 200 supports the display panel 100 and dissipates heat. In an embodiment of the present disclosure, the rear cover 200 may include a first rear cover 210 and a second rear cover 230 sequentially stacked on the display panel 100, and a connector 250 connecting a part of the first rear cover 210 and a part of the second rear cover 230 to each other. The first rear cover 210, the second rear cover 230, and the connector 230 may be integrally formed with each other.

[0064] Although it is shown and described that a connector is used to connect the first rear cover and the second rear cover, and the first rear cover, the second rear cover, and the connector are integrally formed with each other, the connector may also be omitted and the first rear cover and the second rear cover may be configured as separate components. For example, the first rear cover and the second rear cover may be separately manufactured and attached to each other by an adhesive without a connector. In the following description, we will mainly describe a display device having a connector, but the present disclosure is not limited thereto.

[0065] The first rear cover 210 may be attached to the display panel 100 via a first adhesive member 150. The area of the second rear cover 230 is smaller than the area of the first rear cover 210, and it may be attached to the rear surface of the first rear cover 210 via a second adhesive member 170.

[0066] The rear cover 200 may be made of a metal having good thermal conductivity or a material including a metal. For example, the rear cover 200 may be made of a metal such as aluminum or copper, an alloy thereof, or a clad metal in which aluminum or copper, an alloy thereof, is laminated. However, the present disclosure is not limited thereto.

[0067] In addition, for example, the rear cover 200 may be made of a steel plate material such as an electrogalvanized steel sheet, a hot-dip galvanized steel sheet, an aluminum-zinc plated steel sheet, and an aluminum plated steel sheet. In addition, for example, the rear cover 200 may be made of a PCM (pre-coated metal) material as a color steel plate material, which is obtained by coating a polyester resin on a steel plate material or attaching a laminated film thereto. However, the present disclosure is not limited thereto.

[0068] According to an embodiment of the present disclosure, heat generated from the display panel 100 during the operation of the display device can be easily discharged to the outside through the rear cover 200 having good thermal conductivity that supports the display panel 100. In addition, according to an embodiment of the present disclosure, since the first rear cover 210 and the second rear cover 230 form a stacked structure, the rear cover 200 can have high bending stiffness. In addition, according to an embodiment of the present disclosure, since the area of the second rear cover 230 is smaller than the area of the first rear cover 210, the total weight of the rear cover 200 can be reduced while maintaining high bending stiffness.

[0069] In addition, according to an embodiment of the present disclosure, since the rear cover 200 supports the display panel 100 and dissipates heat at the same time, a separate inner plate required in the related art to support the display panel 100 and dissipate heat is not needed. Therefore, according to an embodiment of the present disclosure, the structure for supporting the display panel 100 can be simplified. Due to the reduction in the number of components of the display device, the manufacturing cost of the display device can be reduced.

[0070] The first adhesive member 150 may include a heat dissipation material. Therefore, heat dissipation can be more effectively performed through the rear cover 200 according to an embodiment of the present disclosure.

[0071] The connector 250 may be disposed adjacent to the lower end of the display panel 100. The lower end of the connector 250 protrudes downward beyond the lower end of the display panel 100. When carrying the display device, the display device may collide with the ground or the like. In this case, the connector 250 that protrudes downward beyond the lower end of the display panel 100 can prevent the display panel 100 from directly colliding with the ground and being damaged.

[0072] The connector 250 may be bent. At least one pleat 250c is provided on the inner surface of the bent portion of the connector 250. Due to the at least one pleat 250c, the connector 250 can be easily bent, and attaching the second rear cover 230 to the first rear cover 210 can be easily performed.

[0073] The display device according to an embodiment of the present disclosure may include a source printed circuit board 440 attached to the first rear cover 210 and a control printed circuit board 400 attached to the second rear cover 230. The source printed circuit board 440 may be attached to the rear surface of the first rear cover 210 through a third adhesive member 180. In addition, the control printed circuit board 400 may be fixed to the rear surface of the second rear cover 230 via screws or the like. In this case, the second rear cover 230 may include holes into which screws or the like can be inserted.

[0074] The source printed circuit board 440 can be connected to the data lines provided on the display panel 100 in a COF (chip on film) or TCP (tape carrier package) scheme. Signal lines for transmitting various signals can be formed on the source printed circuit board 440. The source driver IC 480 can be mounted on the flexible film 460. One end of the flexible film 460 can be connected to the display panel 100, while the opposite end of the flexible film 460 can be connected to the source printed circuit board 440. The source printed circuit board 440 can be connected to the display panel 100 via at least one flexible film 460. The flexible film 460 can wind around the lower end of the source printed circuit board 440 and extend from the display panel 100 toward the source printed circuit board 440.

[0075] When transporting the display device, the display device may collide with the ground or the like. In this case, the connector 250 that protrudes downward beyond the lower end of the display panel 100 can prevent the flexible film 460 that extends to wind around the lower end of the first rear cover 210 from directly colliding with the ground or the like and being damaged.

[0076] The control printed circuit board 400 can be connected to at least one source printed circuit board 440 via a signal cable 420 such as an FFC (flexible flat cable) or an FPC (flexible printed circuit). A timing controller that generates and provides a timing control signal to be transmitted to the source driver IC 480 or the like can be mounted on the control printed circuit board 400. In an embodiment of the present disclosure, the second rear cover 230 does not cover the source printed circuit board 440. The signal cable 420 configured to interconnect the control printed circuit board 400 and the source printed circuit board 440 can pass through the lower end of the second rear cover 230.

[0077] Reference Figure 5 , it can be better understood that the first rear cover 210, the second rear cover 230, and the connector 250 of the rear cover 200 are integrally formed with each other. The first rear cover 210 includes an inner region 210a attached to the display panel 100 and an edge region 210b surrounding a part of the edge of the display panel 100. The edge region 210b can surround three edges of the display panel 100, for example, the upper edge, the left edge, and the right edge. To this end, the thickness of the edge region 210b is greater than the thickness of the inner region 210a. The second rear cover 230 can be connected to the first rear cover 210 via the connector 250. The connector 250 connects the left / right edge regions of the first rear cover 210 to the left / right edge regions of the second rear cover 230 respectively. The area of the second rear cover 230 is smaller than the area of the first rear cover 210. The rear cover 200 can be manufactured, for example, by processing a metal material plate using a press or the like.

[0078] The display device according to an embodiment of the present disclosure may further include a sealing member 300 configured to minimize moisture penetration between the edge region 210b of the display panel 100 and the first rear cover 210. The sealing member 300 may be made of an organic material including an optically curable material or a thermally curable material, such as epoxy resin, acrylic resin, and silicone resin.

[0079] In addition, the sealing member 300 further includes moisture-absorbing particles made of talc, calcium oxide (CaO), barium oxide (BaO), zeolite, and silicon oxide (SiO). The sealing member 300 may further include a curing retarder. The sealing member may seal between the display panel 100 and the edge region 210b of the first rear cover 210 without affecting the display panel 100. In addition, the seal 300 may further include a pigment or a dye to present various colors.

[0080] The display device according to an embodiment of the present disclosure uses the sealing member 300 configured to minimize moisture penetration between the edge 210b of the display panel 100 and the first rear cover 210 to effectively prevent external moisture from penetrating into the display panel 100. Therefore, the size of the effective bezel can be reduced, and thus a narrow bezel can be achieved.

[0081] Figure 6 is a plan view showing a display device according to another embodiment of the present disclosure. Figure 7 is a perspective view showing a display device according to another embodiment of the present disclosure. Figure 8 is along Figure 6 and Figure 7 A cross-sectional view of the display device taken along the III-III' cutting line. Figure 9 is a perspective view showing an unfolded state of a rear cover according to another embodiment of the present disclosure.

[0082] According to Figures 6 to 9 The display device according to another embodiment shown in is different from the display device according to the embodiment shown in in terms of the shape of the rear cover, especially the shape of the second rear cover. Other components have the same or similar structures as those in the embodiment shown in Figures 1 to 5 The resulting effects are the same or similar to those in the embodiment shown in Figures 1 to 5 Therefore, hereinafter, the display device according to the embodiment shown in will be mainly described based on the differences from the display device according to the embodiment shown in Figures 1 to 5 According to Figures 1 to 5 The display device according to the embodiment shown in is different from the display device according to the embodiment shown in in terms of the shape of the rear cover, especially the shape of the second rear cover. Other components have the same or similar structures as those in the embodiment shown in Figures 6 to 9 The display device according to the embodiment shown in will be mainly described based on the differences from the display device according to the embodiment shown in

[0083] Referring to Figures 6 to 9 , the second rear cover 230 according to the present embodiment may have a ratio larger than Figures 1 to 5The area of the second rear cover 230 in one embodiment shown is larger. Thus, the second rear cover 230 can cover at least one source printed circuit board 440 and can include at least one through hole 230h. A signal cable 420 configured to interconnect the control printed circuit board 400 and the source printed circuit board 440 can pass through at least one through hole 230h of the second rear cover 230.

[0084] The at least one through hole 230h can be formed to be inclined with respect to the top surface and the bottom surface of the second rear cover 230. Thus, the signal cable 420 can be bent at a small angle instead of being bent at a large angle, and can interconnect the control printed circuit board 400 and the source printed circuit board 440.

[0085] In addition, each of the upper end and the lower end of the at least one through hole 230h can have a curvature. In this way, since each of the upper end and the lower end of the at least one through hole 230h can not be sharp but can have a curvature, for example, the signal cable 420 will not be damaged even when the signal cable 420 contacts the upper end and the lower end of the at least one through hole 230h during installation.

[0086] Figures 10 to 12 are cross-sectional views schematically showing the structure of an organic light emitting display panel used in a display device according to an embodiment of the present disclosure.

[0087] The organic light emitting display panel 100 that can be used in one embodiment of the present disclosure may include a substrate, a plurality of thin film transistors formed on the substrate, a light emitting layer including an organic light emitting element layer disposed between two opposing electrode layers and disposed on the thin film transistors, and a encapsulation layer disposed on the light emitting layer.

[0088] In one example, based on the direction of light from the organic light emitting element layer, the organic light emitting display panel according to this embodiment can be divided into a top emission type panel and a bottom emission type panel.

[0089] Briefly, in the top emission scheme, the light generated from the organic light emitting element layer travels in the upward direction, which is the opposite direction of the direction toward the substrate. One surface of the display panel opposite to the substrate serves as an image display surface.

[0090] Conversely, in the bottom emission scheme, the light generated from the organic light emitting element layer travels toward the substrate of the panel and passes through the substrate. In this case, the outer surface of the substrate of the panel serves as an image display surface.

[0091] Figure 10 is a cross-sectional view of a top emission type display panel in which light travels in the direction from the substrate of the organic light emitting display panel to the thin film transistor TFT.

[0092] As Figure 10 shown in Figure 10 , the top-emission type organic light-emitting display panel 100 may be configured to include a light-emitting layer 1280 and an encapsulation layer 1290 disposed on the light-emitting layer to protect the light-emitting layer.

[0093] The light-emitting layer 1280 may serve as an array substrate including a light-emitting organic light-emitting element layer. The light-emitting layer 1280 includes a glass substrate 1211, a thin-film transistor layer (TFT) 1214 formed on the glass substrate 1211, and an organic light-emitting element layer 1219 disposed on the thin-film transistor layer.

[0094] The light-emitting layer 1280 includes a first electrode (anode or cathode) and a second electrode (cathode or anode) connected to a source electrode or a drain electrode of the thin-film transistor. The organic light-emitting element layer 1219 is disposed between both the first electrode and the second electrode.

[0095] Under the switching operation of the thin-film transistor, the organic light-emitting element emits light in a self-luminous manner due to the potential difference between the first electrode and the second electrode.

[0096] The substrate made of a glass material prevents external moisture and foreign substances from flowing in. However, external moisture and foreign substances may flow into the organic light-emitting display layer opposite to the glass substrate. Therefore, it is necessary to protect the organic light-emitting display layer from moisture, foreign substances, etc.

[0097] Therefore, the encapsulation layer 1290 as a protective layer is attached to the top surface of the organic light-emitting element layer of the light-emitting layer to prevent moisture, foreign substances, etc. from infiltrating into the organic light-emitting element layer.

[0098] According to the present disclosure, the encapsulation layer is not limited to this term. It should be understood that the encapsulation layer may include the concept of various protective layers that protect the organic light-emitting element layer constituting the light-emitting layer of the organic light-emitting display panel from moisture, foreign substances, etc. Therefore, the encapsulation layer may be represented by other terms, such as a protective layer and a second substrate layer.

[0099] In one example, as Figure 10 shown in Figure 10 , in the top-emission scheme, light propagates in a direction opposite to the glass substrate 1211 of the light-emitting layer, and the top surface of the light-emitting layer may serve as an image display surface. The encapsulation layer 1290 is formed on the image display surface side, that is, on the top surface of the organic light-emitting element layer 1219.

[0100] In addition, as Figure 10As shown, in the top emission scheme, the encapsulation layer 1290 is disposed on the side of the image display surface and thus needs to be transparent. Therefore, the encapsulation layer 1290 can or needs to be made of a glass material. In addition, in the top emission scheme, the encapsulation layer 1290 can serve as the image display surface exposed to the viewer. Therefore, the encapsulation layer needs to have a rigidity above a certain level to resist external impacts.

[0101] Therefore, in the top emission scheme, the encapsulation layer 1290 needs to be implemented as a glass layer with a relatively large thickness. In a large-size TV, the thickness of the encapsulation layer 1290 should be at least about 1 mm.

[0102] Figure 11 and Figure 12 is a cross-sectional view of a bottom emission type organic light-emitting display panel. Figure 11 The case where different organic light-emitting layers are applied for each color is shown. Figure 12 The case of using a white organic light-emitting layer W-OLED and a color filter layer is shown. Hereinafter, it will be mainly based on Figure 11 to describe.

[0103] As Figure 11 shown, the organic light-emitting display panel 100 that can be used in a display device according to an embodiment of the present disclosure can be configured to include an encapsulation layer 1290, a light-emitting layer 1280 disposed on the encapsulation layer 1290, and a polarization layer 1270 disposed on the light-emitting layer 1280.

[0104] The light-emitting layer 1280 refers to an array substrate including a light-emitting organic light-emitting element layer. The light-emitting layer 1280 may include a glass substrate 1211, a thin film transistor (TFT) layer 1214 formed on the substrate 1211, and an organic light-emitting element layer 1219 disposed on the thin film transistor layer. In this figure, the flip style of the light-emitting layer 1280 is set between the polarization layer 1270 and the encapsulation layer 1290.

[0105] As Figure 13 described in more detail, in the light-emitting layer 1280, a first electrode (anode or cathode) connected to the source electrode or drain electrode of the thin film transistor and a second electrode (cathode or anode) are included. The organic light-emitting element layer 1219 is disposed between the first electrode and the second electrode.

[0106] Under the switching operation of the thin film transistor, the organic light-emitting element emits light in a self-luminous manner due to the potential difference between the first electrode and the second electrode.

[0107] In this regard, one surface of the polarization layer 1270 can be used as an image display surface. The polarization layer 1270, the light-emitting layer 1280, and the encapsulation layer 1290 are stacked in this order below the image display surface. In some cases, the polarization layer 1270 can be omitted.

[0108] In one example, Figure 11 it is shown that the organic light-emitting element layer 1219 that constitutes the light-emitting layer 1280 without a separate color filter includes organic light-emitting materials that output light of each color R, G, or B. Figure 12 it is shown that the organic light-emitting element layer is implemented as a white organic light-emitting element layer 1264 to emit white light and a color filter layer 1248 is provided on the white organic light-emitting element layer.

[0109] As Figure 11 and Figure 12 shown, in the organic light-emitting display panel 100 operating in a bottom emission scheme, the light-emitting layer 1280 can include a substrate 1211, a thin film transistor layer 1214, and an organic light-emitting element layer 1219 that are sequentially arranged below the image display surface.

[0110] In this state, the light emitted from the organic light-emitting element layer passes through the thin film transistor layer 1214 and the substrate 1211. Therefore, when assuming that the substrate 1211 is at the bottom layer, the light travels toward the substrate. In this way, the display device operates in a bottom emission scheme.

[0111] In the organic light-emitting display panel 100 operating in a bottom emission scheme, in order to protect the organic light-emitting element layer 1219, the encapsulation layer 1290 is provided adjacent to the organic light-emitting element layer 1219.

[0112] Therefore, in a top emission type device as [[ID=XX]] Figure 10 shown, the encapsulation layer can be used as an image display surface. In Figure 11 and Figure 12 shown in the bottom emission type device, the encapsulation layer 1290 is opposite to the image display surface, and thus does not need to be made of a transparent material and does not need to be rigid to protect the display device from external impact.

[0113] For example, the encapsulation layer 1290 in a display device operating in a bottom emission scheme can only have the function of preventing moisture or foreign substances from infiltrating into the organic light-emitting element layer of the light-emitting layer 1280.

[0114] Therefore, the encapsulation layer 1290 of the organic light-emitting display panel according to the present embodiment can be implemented as a thin film made of a metal material and has a second thickness T2 that is smaller than the first thickness T1 of the encapsulation layer 1290 of the display device operating in a top emission scheme as described above.

[0115] In fact, the second thickness of the encapsulation layer 1290 of the organic light-emitting display panel according to the present embodiment may be in the range of about 0.05 mm to 0.2 mm.

[0116] In addition, the material forming the encapsulation layer 1290 of the organic light-emitting display panel according to the present embodiment is not limited to metal. There is no limitation on the material forming the encapsulation layer 1290 as long as the encapsulation layer 1290 can be formed into a thin film to protect the organic light-emitting element layer.

[0117] However, in order to prevent hydrogen and oxygen from penetrating into the organic light-emitting element layer 1219 and thus prevent the organic light-emitting element from being oxidized, the encapsulation layer 1290 may be made of an iron-nickel alloy, a so-called invar metal material, which prevents hydrogen / oxygen from penetrating into the organic light-emitting element layer 1219.

[0118] In addition, preferably, the encapsulation layer 1290 is made of a metal material having a reflection characteristic above a certain level.

[0119] The light emitted from the organic light-emitting element layer 1219 needs to be output to the image display surface opposite to the encapsulation layer 1290. Therefore, when the encapsulation layer 1290 is made of a metal material having a reflection characteristic above a certain level, the encapsulation layer 1290 can be used as a reflector, thereby improving the light efficiency of the display panel.

[0120] Thus, according to an embodiment of the present disclosure, when an organic light-emitting display panel operating in a bottom emission scheme is used, compared with a display device operating in a top emission scheme as shown in Figure 10 , the thickness of the encapsulation layer can be reduced. Therefore, due to the reflection characteristic of the encapsulation layer 1290, there is an advantage of improving the light efficiency of the display panel.

[0121] As shown in Figure 11 and Figure 12 , the light emitted from the organic light-emitting element layer 1219 needs to be output to the image display surface opposite to the encapsulation layer 1290. Therefore, when the encapsulation layer 1290 is made of a material having a reflection characteristic above a certain level, the encapsulation layer 1290 can be used as a reflector, thereby improving the light efficiency of the display panel.

[0122] In one example, different from Figure 11 having different organic light-emitting layers applied for each color, Figure 12 shows an example in which the organic light-emitting element layer 1219 is implemented as a white organic light-emitting element layer W-OLED that emits white light, and a color filter layer 1248 is provided on the white organic light-emitting element layer W-OLED.

[0123] Generally, the light efficiency of a white organic light-emitting element is superior to that of organic light-emitting elements of other colors. Therefore, when usingFigure 12 When the structure shown in [reference] is adopted, the light efficiency of the organic light emitting display device can be further improved.

[0124] Figure 13 FIG. [reference] is a detailed cross-sectional view showing a stacked structure of a bottom-emission type organic light emitting display panel that can be used in a display device according to an embodiment of the present disclosure.

[0125] For ease of illustration, in [reference], the light emission direction is shown as the downward direction or the image display surface is shown as the bottom surface. This is opposite to [reference]. However, the present disclosure is not limited thereto. Figure 13 In [reference], the light emission direction is shown as the downward direction or the image display surface is shown as the bottom surface. This is opposite to [reference]. However, the present disclosure is not limited thereto. Figure 12 However, the present disclosure is not limited thereto.

[0126] As shown in [reference], the polarization layer 1270 is disposed on the image display surface side. The light emitting layer 1280 is stacked on the polarization layer 1270 and in contact with the polarization layer 1270. The encapsulation layer 1290 is disposed on the light emitting layer 1280. Figure 13 As shown in [reference], the polarization layer 1270 is disposed on the image display surface side. The light emitting layer 1280 is stacked on the polarization layer 1270 and in contact with the polarization layer 1270. The encapsulation layer 1290 is disposed on the light emitting layer 1280.

[0127] The detailed structure of the light emitting layer 1280 of the organic light emitting display panel operating in the bottom emission scheme used in the present embodiment is as follows.

[0128] On the substrate 1211 of the light emitting layer 1280, the following components can be provided: a buffer layer 1220, a light blocking layer 1222, a first interlayer insulating film 1224, a semiconductor layer 1226, a gate insulating film 1228, a gate electrode 1230, a second interlayer insulating film 1232, a source electrode 1242, a drain electrode 1244, a third interlayer insulating film 1246, a color filter 1248, a planarization layer 1250, a first electrode 1260, a bank 1262, an organic light emitting element layer 1264, a second electrode 1266, a passivation layer 1268, etc.

[0129] In one example, the substrate 1211 of the light emitting layer 1280 can be a glass substrate. However, the present disclosure is not limited thereto. The substrate 1211 can be a plastic substrate including PET (polyethylene terephthalate), PEN (polyethylene naphthalate), and polyimide.

[0130] The buffer layer 1220 serves to prevent impurities from penetrating onto the substrate 1211 or to improve interface characteristics and flatness, and can be made of a single layer or multiple layers made of silicon nitride SiO x or silicon oxynitride SiN x .

[0131] The light blocking layer 1222 is used to prevent light from entering the channel region of the semiconductor layer 1226. To this end, the light blocking layer 1222 can be made of an opaque metal layer to block light. In addition, the light blocking layer 1222 is electrically connected to the drain electrode 1244 to suppress parasitic capacitance.

[0132] The first interlayer insulating film 1224 insulates the light blocking layer 1222 and the semiconductor layer 1226 from each other. The first interlayer insulating film 1224 includes an insulating material and may be stacked on the buffer layer 1220 and the light blocking layer 1222.

[0133] The semiconductor layer 1226 may be disposed on the first interlayer insulating film 1224 and may include silicon (Si), and may have an active region constituting a channel, a source region doped with a high concentration of impurities and disposed on both sides of the active region, and a drain region.

[0134] The gate insulating film 1228 insulates the semiconductor layer 1226 and the gate electrode 1230 from each other. The gate insulating film 1228 includes an insulating material and may be stacked on the semiconductor layer 1226.

[0135] The gate electrode 1230 is placed on the gate insulating film 1228 and receives a gate voltage from the gate line.

[0136] The second interlayer insulating film 1232 protects the gate electrode 1230 and insulates the gate electrode 1230, the source electrode 1242, and the drain electrode 1244 from each other. The second interlayer insulating film 1232 includes an insulating material and may be stacked on the first interlayer insulating film 1224, the semiconductor layer 1226, and the gate electrode 1230.

[0137] Each of the source electrode 1242 and the drain electrode 1244 is disposed on the second interlayer insulating film 1232 and may contact the semiconductor layer 1226 via a first contact hole and a second contact hole formed in the second interlayer insulating film 1232, respectively. In addition, the drain electrode 1244 may contact the light blocking layer 1222 via a third contact hole.

[0138] The source electrode 1242 and the drain electrode 1244, the semiconductor layer 1226 in contact with these electrodes, the gate insulating film 1228 formed on the semiconductor layer 1226, the gate electrode 1230, etc. may constitute the thin film transistor layer 1214.

[0139] The third interlayer insulating film 1246 protects the source electrode 1242 and the drain electrode 1244.

[0140] The color filter 1248 may be disposed on the second interlayer insulating film 1232 and is disposed at a position overlapping the organic light emitting element layer 1216 to change the color of light emitted toward the substrate 1211 in a display device operating in a bottom emission scheme.

[0141] The planarization layer 1250 protects the source electrode 1242 and the drain electrode 1244 and planarizes the surface on which the first electrode 1260 is placed.

[0142] The first electrode 1260 can be placed on the planarization layer 1250 and can contact the drain electrode 1244 via a fourth contact hole formed in the planarization layer 1250. In addition, the first electrode 1260 serves as an anode. The first electrode can be made of a transparent conductive material having a relatively high work function value so that the light generated by the organic light-emitting element layer 1264 can be transmitted through the first electrode.

[0143] For example, the first electrode 1260 can be made of a metal oxide such as ITO (indium tin oxide) or IZO (indium zinc oxide), a mixture of a metal and an oxide such as ZnO:Al or SnO2:Sb, or a conductive polymer such as poly(3-methylthiophene), poly[3,4-(ethylene-1,2-dioxy)thiophene] (PEDT), polypyrrole, and polyaniline. Alternatively, the first electrode 260 can be made of carbon nanotubes (CNT), graphene, silver nanowires, etc.

[0144] The organic light-emitting element layer 1264 can be placed on the first electrode 1260 and can be composed of a single layer made of a light-emitting material or can be composed of multiple layers including a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer. The organic light-emitting element layer 1264 can be implemented as a white organic light-emitting element layer that outputs white light and can be applied to the entire surface of the substrate without being patterned. The organic light-emitting element layer 1264 does not undergo a patterning process, thereby obtaining a simple manufacturing process or achieving cost reduction.

[0145] The second electrode 1266 can be placed on the organic light-emitting element layer 1264, can serve as a cathode, and can be made of a conductive material having a relatively low work function value. The second electrode 1266 can be implemented as a single layer made of a single metal such as silver (Ag) or an alloy composed of a certain content of magnesium (Mg) or a multi-layer made thereof.

[0146] The first electrode 1260 connected to the thin film transistor, the second electrode 1266 disposed opposite to the first electrode 1260, and the organic light-emitting element layer 1264 interposed between the first electrode 1260 and the second electrode 1266 are collectively referred to as an organic light-emitting element.

[0147] In the organic light-emitting element layer 1264, when a predetermined voltage is applied across the first electrode 1260 and the second electrode 1266, the holes injected from the first electrode 1260 and the electrons provided from the second electrode 1266 are transferred to the organic light-emitting element layer 1264 to form excitons. When the excitons transition from the excited state to the ground state, light can be generated and emitted in the form of visible light.

[0148] The bank 1262 can be formed on the edge of the first electrode 1260. An opening can be defined in the bank to partially expose the first electrode 1260. For example, the bank 1262 can be made of an inorganic insulating material such as SiO x , SiN x and SiON.

[0149] The passivation layer 1268 can be used to protect the organic layer from moisture and oxygen, and can have a multi-layer structure made of inorganic materials, organic materials, and mixtures thereof.

[0150] In one example, a single low-reflectivity layer 1271 can be disposed on each of the light-blocking layer 1222, the gate electrode 1230, the source electrode 1242, and the drain electrode 1244. The low-reflectivity layer prevents reflection of external light, thereby preventing problems such as reduced visibility, reduced brightness, and reduced contrast.

[0151] The low-reflectivity layer 1271 can be made of a material that absorbs external light introduced through the substrate 1211, or can be coated with a light absorber. External light can refer to unpolarized light that does not pass through a polarizing plate or a polarizing layer.

[0152] The material that absorbs external light can include a light-absorbing metal or an alloy thereof, and can have a black-based color. For example, the low-reflectivity layer 1271 can be made of any one of molybdenum (Mo), chromium (Cr), titanium (Ti), niobium (Nb), manganese (Mn), tantalum (Ta), or an alloy thereof. However, the embodiments are not limited thereto. The low-reflectivity layer can be made of any other metal that can absorb light. Therefore, the low-reflectivity layer 1271 can prevent external light from being reflected back towards the outside.

[0153] In addition, the low-reflectivity layer 1271 can be made of a metal oxide or an alloy formed by a light-absorbing metal and a metal oxide, and can block light introduced from the outside. The low-reflectivity layer 1271 can be made of metal oxides such as ITO (indium tin oxide), IZO (indium zinc oxide), and ITZO (indium tin oxide), for example. Destructive interference may occur between the light reflected from the surface of the low-reflectivity layer 1271 and the light that passes through the low-reflectivity layer 1271 and is then reflected from the interface between the conductive layer and the low-reflectivity layer 1271. Therefore, external light may not be able to travel to the outside.

[0154] In one example, the organic light-emitting display panel 100 according to the present embodiment can further include a transmittance adjusting film and / or a transparent multi-layer film disposed on the substrate 1211 to absorb light in the visible wavelength range.

[0155] The transmittance adjusting film has a predetermined transmittance, and thus can absorb light incident on the substrate 1211 from the outside. Therefore, the reflectance of the substrate 1211 is greatly reduced by external light absorption.

[0156] The transparent multilayer film has such a structure in which a plurality of refractive layers having different refractive indices are stacked one on top of another. Therefore, external light is eliminated by destructive interference between light beams reflected from the refractive layers having different refractive indices respectively to reduce the reflectance of external light.

[0157] The transmittance adjusting film and / or the transparent multilayer film may constitute the polarization layer 1270 itself or a part thereof.

[0158] Although the embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments. The present disclosure can be implemented in various modified ways without departing from the technical idea of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical idea of the present disclosure, but are used to describe the present disclosure. The scope of the technical idea of the present disclosure is not limited by the embodiments.

[0159] Therefore, it should be understood that the above embodiments are illustrative and not restrictive in all respects. The protection scope of the present invention shall be subject to the claims, and all technical ideas within the protection scope of the present disclosure shall be understood to be included within the scope of the present disclosure.

Claims

1. A display device, comprising: A display panel; And A rear cover for supporting the display panel, Wherein, the rear cover comprises: A first rear cover, which is attached to the display panel; and A second rear cover, which extends from the first rear cover; and Wherein, the second rear cover is bent from the first rear cover and is disposed on the rear surface of the first rear cover; Wherein, the display device further comprises a connector configured to connect a part of the first rear cover and a part of the second rear cover; and Wherein, the first rear cover, the second rear cover and the connector are integrally formed with each other.

2. The display device according to claim 1, wherein The first rear cover is attached to the display panel via a first adhesive member, and The area of the second rear cover is smaller than that of the first rear cover, and the second rear cover is attached to the first rear cover via a second adhesive member.

3. The display device according to claim 2, wherein, The first adhesive member comprises a heat dissipation material.

4. The display device according to claim 1, wherein, The connector is disposed adjacent to the lower end of the display panel, and The bottom of the connector protrudes downward beyond the lower end of the display panel.

5. The display device according to claim 4, wherein, The connector is bent, and at least one wrinkle is provided on the inner surface of the bent portion of the connector.

6. The display device according to claim 1, wherein, The first rear cover comprises: An inner area attached to the display panel; and An edge area surrounding a part of the edge of the display panel, Wherein, the display device further comprises a sealing member configured to minimize moisture penetration between the display panel and the edge of the first rear cover.

7. The display device according to claim 1, wherein, A source printed circuit board is attached to the first rear cover, while a control printed circuit board is attached to the second rear cover.

8. The display device according to claim 7, wherein, The second rear cover does not cover the source printed circuit board, and A signal cable configured to interconnect the control printed circuit board and the source printed circuit board passes through the lower end of the second rear cover.

9. The display device according to claim 7, wherein, The second rear cover covers the source printed circuit board and has at least one through hole defined therein, and A signal cable configured to interconnect the control printed circuit board and the source printed circuit board passes through the at least one through hole.

10. The display device according to claim 9, wherein, Each of the upper end and the lower end of the at least one through hole has a curvature.

11. The display device according to claim 10, wherein, The at least one through hole extends in a manner inclined with respect to the top surface and the bottom surface of the second rear cover.

12. The display device according to claim 1, wherein, The rear cover is made of: Aluminum, copper or an alloy thereof; or Clad metal in which aluminum, copper or an alloy thereof is laminated; or Steel plate material, which includes galvanized steel, aluminized steel or aluminum-zinc plated steel.

13. The display device according to claim 12, wherein, The rear cover is made of a pre-coated metal material as a color steel plate material, which is obtained by coating resin on the steel plate material or attaching a film to the steel plate material.

14. A display device, which comprises: A display panel; A rear cover having thermal conductivity and comprising: A first rear cover, comprising: An inner area attached to the display panel via a first adhesive member; and An edge area surrounding a part of the edge of the display panel; and A second rear cover, which is disposed on the rear surface of the first rear cover; Wherein, the display device further comprises a connector configured to connect a part of the first rear cover and a part of the second rear cover; and Wherein, the first rear cover, the second rear cover and the connector are integrally formed with each other.

15. The display device according to claim 14, wherein, The area of the second rear cover is smaller than the area of the first rear cover.

16. The display device according to claim 14, wherein, The connector is disposed adjacent to the lower end of the display panel.

17. The display device according to claim 16, wherein, The connector is curved, and at least one wrinkle is provided on an inner surface of a bent portion of the connector.

18. The display device according to claim 14, wherein, The display device further includes a sealing member configured to minimize moisture penetration between a top edge, a left edge, and a right edge of the display panel and the edge region of the first rear cover.

19. The display device according to claim 14, wherein, The source printed circuit board is attached to the first rear cover, and the control printed circuit board is attached to the second rear cover.

20. The display device according to claim 19, wherein, The second rear cover does not cover the source printed circuit board, and a signal cable configured to interconnect the control printed circuit board and the source printed circuit board passes through a lower end of the second rear cover.

21. The display device according to claim 19, wherein, The second rear cover covers the source printed circuit board and has at least one through hole defined therein, and a signal cable configured to interconnect the control printed circuit board and the source printed circuit board passes through the at least one through hole.

22. The display device according to claim 21, wherein, Each of an upper end and a lower end of the at least one through hole has a curvature.

23. The display device according to claim 22, wherein, The at least one through hole extends in a manner inclined with respect to a top surface and a bottom surface of the second rear cover.

24. The display device according to claim 14, wherein, The first adhesive member includes a heat dissipation material.

25. The display device according to claim 16, wherein, A lower end of the connector protrudes downward beyond a lower end of the display panel.

Images