LED Display Module Chip Hybrid Mounting Method and LED Display Module

Abstract

The present invention discloses a method for chip mixed mounting of an LED display module. By dividing a carrier into M chip regions and dividing a target substrate into N target regions, and setting chip picking and placing rules for each of the N target regions corresponding to each chip region, and making there be different chip picking and placing rules among the N target regions, then transferring the LED chips in each chip region to each target region according to the chip picking and placing rules. Finally, the LED chips in each target region come from multiple chip regions, so that the LED chips in each target region are arranged in a disordered manner, and the arrangements of the LED chips in the N target regions are also different, increasing the degree of chaos of the mixed mounting of the LED chips on the target substrate, which can eliminate the differences in color, brightness, etc. of the entire screen of the display module, and the display effect is more excellent. In addition, the present invention also discloses an LED display module manufactured by using this mixed mounting method.

Description

Technical Field

[0001] The present invention relates to the technical field of LED display, and particularly relates to a method for mixing and mounting LED display module chips and an LED display module. Background Art

[0002] With the continuous improvement of indoor display application technology, currently used display application products such as projection, DLP (Digital Light Processing), LCD (Liquid Crystal Display), and PDP (Plasma Display Panel) can no longer fully meet the market application requirements. There are still some defects in various aspects that prevent them from breaking through the development of technology. The full-color LED (Light Emitting Diode) display technology overcomes many defects of the above products. For example, Mini LED (LED display screen and backlight) and Micro LED have become the first choices for indoor and outdoor displays, such as command centers, outdoor advertising screens, conference centers, etc., and one of the main development goals for consumer electronic screens respectively.

[0003] Generally, limited by epitaxial growth equipment, processes, and chip processes, the wavelength, voltage, etc. of chips in an LED wafer are widely distributed. For example, the wavelength distribution range can reach 10 nm. Since the human eye can easily recognize the wavelength differences in the visible light band, both Mini LED and Micro LED displays require the chip emission wavelength to be distributed in a relatively narrow range to prevent the appearance of blocky color difference regions that can be recognized by the human eye. The so-called blocky color difference refers to the color within the block, that is, the wavelengths are the same, while there are slight differences in color between blocks. In addition, differences in voltage, current, etc. will also cause problems of brightness differences between regions. Existing solutions, such as in Mini LED displays, select chips according to parameters such as wavelength and voltage through sorting. In Micro LED displays, however, sorting is not possible, and the problem of wide chip emission wavelength distribution is difficult to solve by conventional epitaxial chip processes. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for mixing and mounting LED display module chips to improve the display uniformity of the LED display module.

[0005] Another purpose of the present invention is to provide an LED display module with good display uniformity.

[0006] To achieve one of the above purposes, the present invention provides a method for mixing and mounting LED display module chips, including:

[0007] Providing at least one carrier carrying a plurality of LED chips, and dividing the at least one carrier into M chip regions;

[0008] Provide a target substrate and divide the target substrate into N target areas;

[0009] Set the chip picking and placing rules for the N target areas. There are different chip picking and placing rules in the N target areas. The chip picking and placing rules are as follows: pick out the LED chips at a certain position from each chip area and place them at the preset positions in the target areas;

[0010] Transfer the LED chips in each chip area to each target area according to the chip picking and placing rules.

[0011] In some embodiments, the "providing at least one carrier carrying a plurality of LED chips" includes: providing at least one carrier carrying a plurality of sorted LED chips; the LED chips on all the carriers belong to the same parameter range, and the parameters include at least one of wavelength, voltage and current.

[0012] In some embodiments, each chip area is arranged with p rows and q columns of LED chips, each target area is arranged with p rows and q columns of chip placement positions, and each chip placement position is used to place one LED chip.

[0013] In some embodiments, each chip area is arranged with p rows and q columns of LED chips, each target area is arranged with p rows and q columns of chip placement positions, and each chip placement position is used to place Y LED chips, where Y is an integer greater than 1. By performing the mixing method multiple times, Y LED chips with different emission colors are placed at each chip placement position.

[0014] In some embodiments, the "setting the chip picking and placing rules for the N target areas, where there are different chip picking and placing rules in the N target areas" includes: setting a chip picking and placing sequence, which is composed of a plurality of disordered codes. The plurality of disordered codes are arranged in p rows and q columns. The position of each code in the chip picking and placing sequence corresponds to the position of the LED chip to be picked out in each chip area and the chip placement position of the picked-out LED chip in each target area; for each target area, it is set to pick out LED chips from each chip area according to different code combination rules.

[0015] In some embodiments, the chip picking and placing sequence is composed of N out-of-order codes. The statement "for each target area, it is set to pick out LED chips from each of the chip areas according to different code combination rules respectively" includes: for the first target area, pick out an LED chip from the corresponding position of the first chip area at the position of code K1 in the chip picking and placing sequence, pick out an LED chip from the corresponding position of the second chip area at the position of code K2 in the chip picking and placing sequence, and so on, pick out an LED chip from the corresponding position of the Nth chip area at the position of code KN in the chip picking and placing sequence; for the second target area, pick out an LED chip from the corresponding position of the first chip area at the position of code KN in the chip picking and placing sequence, pick out an LED chip from the corresponding position of the second chip area at the position of code K1 in the chip picking and placing sequence, and so on, pick out an LED chip from the corresponding position of the Nth chip area at the position of code KN-1 in the chip picking and placing sequence; and so on, for the Nth target area, pick out an LED chip from the corresponding position of the first chip area at the position of code K2 in the chip picking and placing sequence, pick out an LED chip from the corresponding position of the second chip area at the position of code K3 in the chip picking and placing sequence, and so on, pick out an LED chip from the corresponding position of the Nth chip area at the position of code K1 in the chip picking and placing sequence.

[0016] In some embodiments, N is an integer multiple of M. When the mixing method is first executed, the LED chips in each of the chip areas are transferred to M non-adjacent target areas. By executing the mixing method multiple times, the LED chips are transferred to the remaining N - M target areas; the code combination rules for the remaining N - M target areas are respectively obtained by rotating the code combination rules for the M non-adjacent target areas by a preset angle.

[0017] In some embodiments, the statement "transfer the LED chips in each of the chip areas to each of the target areas according to the chip picking and placing rules" includes: according to the chip picking and placing rules, first transfer the corresponding LED chips in each of the chip areas to one of the target areas. After the transfer of the LED chips in the one target area is completed, then sequentially complete the transfer of the LED chips in the other target areas.

[0018] In some embodiments, the statement "transfer the LED chips in each of the chip areas to each of the target areas according to the chip picking and placing rules" includes: according to the chip picking and placing rules, first transfer the LED chips in one of the chip areas correspondingly to each of the target areas. After the transfer of the LED chips in the one chip area is completed, then sequentially transfer the LED chips in the other chip areas correspondingly to each of the target areas.

[0019] To achieve the second above-mentioned object, the present invention provides an LED display module, which is made by the above-mentioned hybrid mounting method.

[0020] Compared with the prior art, the present invention divides the carrier into M chip regions and divides the target substrate into N target regions, sets the chip picking and placing rules for each of these N target regions corresponding to each chip region, and makes there be different chip picking and placing rules in the N target regions. Then, according to the chip picking and placing rules, the LED chips in each chip region are transferred to each target region. Finally, the LED chips in each target region come from multiple chip regions, so that the LED chips in each target region are arranged in a disordered manner, and the LED chip arrangements in the N target regions are also different, increasing the degree of chaos of the hybrid mounting of the LED chips on the target substrate, which can eliminate the differences in color, brightness, etc. of the entire screen of the display module, and the display effect is more excellent. In addition, it can also replace the existing sorting method, improve production efficiency, and improve chip utilization rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of a carrier in an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of each chip region in an embodiment of the present invention;

[0023] Figure 3 is a schematic diagram of a target substrate in an embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of a chip picking and placing sequence in an embodiment of the present invention;

[0025] Figure 5 is a schematic diagram of each target region after installing the LED chips in an embodiment of the present invention;

[0026] Figure 6 is a schematic diagram of each target region after installing the LED chip a in an embodiment of the present invention;

[0027] Figure 7 is a schematic diagram of a target substrate in another embodiment of the present invention;

[0028] Figure 8 is a partial schematic diagram of a target substrate in an embodiment of the present invention;

[0029] Figure 9 is a schematic diagram of a target substrate in another embodiment of the present invention;

[0030] Figure 10 is a schematic diagram of a target substrate in yet another embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] To describe the content, structural features, achieved objectives and effects of the present invention in detail, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0032] In the description of the invention, it should be understood that the orientation or positional relationship indicated by terms such as "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, and thus cannot be construed as a limitation to the protected content of the present invention.

[0033] Generally, LED chips close to each other on the carrier have closer parameters (for example, wavelength, voltage, current, etc.), while LED chips farther away usually have greater parameter differences. The method for mixing and mounting LED display module chips disclosed in the present invention realizes the disordered arrangement of LED chips on a target substrate (such as a PCB board, etc.) to eliminate chromaticity differences and brightness differences of the entire display module, and obtain an LED display module with better display consistency / uniformity.

[0034] The following takes specific embodiments as examples to describe the technical solutions of the present invention in detail in conjunction with the accompanying drawings:

[0035] Embodiment 1:

[0036] In this embodiment, the method for mixing and mounting LED display module chips includes the following steps:

[0037] S101, provide a carrier 10 carrying a plurality of LED chips, divide the carrier 10 into ten chip areas, and each chip area is arranged with ten rows and ten columns of LED chips. For convenience of description, the ten chip areas are respectively called chip area one, chip area two, chip area three, chip area four, chip area five, chip area six, chip area seven, chip area eight, chip area nine, and chip area ten, as Figure 1 shown; mark the LED chips in chip area one as a, mark the LED chips in chip area two as b, mark the LED chips in chip area three as c, mark the LED chips in chip area four as d, mark the LED chips in chip area five as e, mark the LED chips in chip area six as f, mark the LED chips in chip area seven as g, mark the LED chips in chip area eight as h, mark the LED chips in chip area nine as i, and mark the LED chips in chip area ten as j, as Figure 2 shown.

[0038] Among them, the carrier can be one, that is, one carrier is divided into ten chip regions; the carrier can be multiple, for example, two, that is, two carriers are divided into ten chip regions, or it can be ten, that is, each individual carrier serves as a chip region respectively. The carrier can be, for example, a blue film, a wafer, etc. The LED chips on the carrier can be sorted LED chips. After being sorted, the LED chips belong to the same parameter range, for example, the same BIN value range. The wavelengths of all LED chips belong to the same relatively narrow wavelength range, the voltages of all LED chips belong to the same specific voltage range, and the currents also belong to the same specific current range. The LED chips on the carrier can also be unsorted LED chips.

[0039] S102. Provide a target substrate 20, divide the target substrate 20 into ten target regions. Correspondingly, each target region is arranged with ten rows and ten columns of chip placement positions, and each chip placement position is used to place an LED chip. For convenience of description, the ten target regions are respectively called target region A, target region B, target region C, target region D, target region E, target region F, target region G, target region H, target region I, and target region J, as Figure 3 shown.

[0040] Among them, the size of a single target region can be the same as that of a single chip region. When picking and placing LED chips, there is no need to change the distance between the LED chips; it can also be a size relationship that is scaled proportionally in the horizontal and / or vertical directions. Correspondingly, when picking and placing LED chips, it is necessary to increase or decrease the distance between the LED chips proportionally.

[0041] S103. Set a chip picking and placing sequence 30. The chip picking and placing sequence 30 is composed of ten disordered codes. The ten disordered codes are arranged in ten rows and ten columns. The position of each code in the chip picking and placing sequence 30 corresponds to the position of the LED chip to be taken out in each chip region and the chip placement position of the taken-out LED chip in each target region; for each target region, it is set to take out LED chips from each chip region according to different code combination rules respectively. For convenience of description, the ten codes are respectively represented by Arabic numerals 1-10. The chip picking and placing sequence 30 is as Figure 4 shown.

[0042] For the target area A, the LED chip a is taken out from the corresponding position in the first chip area at the position of the chip picking and placing sequence 30 with the code number 1, the LED chip b is taken out from the corresponding position in the second chip area at the position of the chip picking and placing sequence 30 with the code number 2, and so on. The LED chip j is taken out from the corresponding position in the tenth chip area at the position of the chip picking and placing sequence 30 with the code number 10. For the target area B, the LED chip a is taken out from the corresponding position in the first chip area at the position of the chip picking and placing sequence 30 with the code number 10, the LED chip b is taken out from the corresponding position in the second chip area at the position of the chip picking and placing sequence 30 with the code number 1, and so on. The LED chip j is taken out from the corresponding position in the tenth chip area at the position of the chip picking and placing sequence 30 with the code number 9; and so on. For the target area J, the LED chip a is taken out from the corresponding position in the first chip area at the position of the chip picking and placing sequence 30 with the code number 2, the LED chip b is taken out from the corresponding position in the second chip area at the position of the chip picking and placing sequence 30 with the code number 3, and so on. The LED chip j is taken out from the corresponding position in the tenth chip area at the position of the chip picking and placing sequence 30 with the code number 1.

[0043] S104. According to the chip picking and placing sequence 30 and the corresponding code combination rules for each target area, take out the LED chips from each chip area and place them in each target area. Specifically:

[0044] First, take out the LED chip a from the corresponding position in the first chip area at the position of the chip picking and placing sequence 30 with the code number 1 and place it at the corresponding position in the target area A; take out the LED chip b from the corresponding position in the second chip area at the position of the chip picking and placing sequence 30 with the code number 2 and place it at the corresponding position in the target area A; take out the LED chip c from the corresponding position in the third chip area at the position of the chip picking and placing sequence 30 with the code number 3 and place it at the corresponding position in the target area A; take out the LED chip d from the corresponding position in the fourth chip area at the position of the chip picking and placing sequence 30 with the code number 4 and place it at the corresponding position in the target area A; take out the LED chip e from the corresponding position in the fifth chip area at the position of the chip picking and placing sequence 30 with the code number 5 and place it at the corresponding position in the target area A; take out the LED chip f from the corresponding position in the sixth chip area at the position of the chip picking and placing sequence 30 with the code number 6 and place it at the corresponding position in the target area A; take out the LED chip g from the corresponding position in the seventh chip area at the position of the chip picking and placing sequence 30 with the code number 7 and place it at the corresponding position in the target area A; take out the LED chip h from the corresponding position in the eighth chip area at the position of the chip picking and placing sequence 30 with the code number 8 and place it at the corresponding position in the target area A; take out the LED chip i from the corresponding position in the ninth chip area at the position of the chip picking and placing sequence 30 with the code number 9 and place it at the corresponding position in the target area A; take out the LED chip j from the corresponding position in the tenth chip area at the position of the chip picking and placing sequence 30 with the code number 10 and place it at the corresponding position in the target area A. The final obtained target area A is asFigure 5 as shown

[0045] Next, take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick - and - place sequence 30 with code 10, and place it at the corresponding position in target area B; take out the LED chip b from the corresponding position in chip area 2 at the position of chip pick - and - place sequence 30 with code 1; take out the LED chip c from the corresponding position in chip area 3 at the position of chip pick - and - place sequence 30 with code 2, and place it at the corresponding position in target area B; take out the LED chip d from the corresponding position in chip area 4 at the position of chip pick - and - place sequence 30 with code 3, and place it at the corresponding position in target area B; take out the LED chip e from the corresponding position in chip area 5 at the position of chip pick - and - place sequence 30 with code 4, and place it at the corresponding position in target area B; take out the LED chip f from the corresponding position in chip area 6 at the position of chip pick - and - place sequence 30 with code 5, and place it at the corresponding position in target area B; take out the LED chip g from the corresponding position in chip area 7 at the position of chip pick - and - place sequence 30 with code 6, and place it at the corresponding position in target area B; take out the LED chip h from the corresponding position in chip area 8 at the position of chip pick - and - place sequence 30 with code 7, and place it at the corresponding position in target area B; take out the LED chip i from the corresponding position in chip area 9 at the position of chip pick - and - place sequence 30 with code 8, and place it at the corresponding position in target area B; take out the LED chip j from the corresponding position in chip area 10 at the position of chip pick - and - place sequence 30 with code 9, and place it at the corresponding position in target area B. The final obtained target area B is as Figure 5 shown

[0046] And so on;

[0047] Finally, take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code 2, and place it at the corresponding position in target area J; take out the LED chip b from the corresponding position in chip area 2 at the position of chip pick-and-place sequence 30 with code 3, and place it at the corresponding position in target area J; take out the LED chip c from the corresponding position in chip area 3 at the position of chip pick-and-place sequence 30 with code 4, and place it at the corresponding position in target area J; take out the LED chip d from the corresponding position in chip area 4 at the position of chip pick-and-place sequence 30 with code 5, and place it at the corresponding position in target area J; take out the LED chip e from the corresponding position in chip area 5 at the position of chip pick-and-place sequence 30 with code 6, and place it at the corresponding position in target area J; take out the LED chip f from the corresponding position in chip area 6 at the position of chip pick-and-place sequence 30 with code 7, and place it at the corresponding position in target area J; take out the LED chip g from the corresponding position in chip area 7 at the position of chip pick-and-place sequence 30 with code 8, and place it at the corresponding position in target area J; take out the LED chip h from the corresponding position in chip area 8 at the position of chip pick-and-place sequence 30 with code 9, and place it at the corresponding position in target area J; take out the LED chip i from the corresponding position in chip area 9 at the position of chip pick-and-place sequence 30 with code 10, and place it at the corresponding position in target area J; take out the LED chip j from the corresponding position in chip area 10 at the position of chip pick-and-place sequence 30 with code 1. The final target area J is as Figure 5 shown.

[0048] That is, according to the positions of the codes 1 / 2 / 3 / 4 / 5 / 6 / 7 / 8 / 9 / 10 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area A respectively; according to the positions of the codes 10 / 1 / 2 / 3 / 4 / 5 / 6 / 7 / 8 / 9 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area B respectively; according to the positions of the codes 9 / 10 / 1 / 2 / 3 / 4 / 5 / 6 / 7 / 8 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area C respectively; according to the positions of the codes 8 / 9 / 10 / 1 / 2 / 3 / 4 / 5 / 6 / 7 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area D respectively; according to the positions of the codes 7 / 8 / 9 / 10 / 1 / 2 / 3 / 4 / 5 / 6 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area E respectively; according to the positions of the codes 6 / 7 / 8 / 9 / 10 / 1 / 2 / 3 / 4 / 5 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area F respectively; according to the positions of the codes 5 / 6 / 7 / 8 / 9 / 10 / 1 / 2 / 3 / 4 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area G respectively; according to the positions of the codes 4 / 5 / 6 / 7 / 8 / 9 / 10 / 1 / 2 / 3 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area H respectively; according to the positions of the codes 3 / 4 / 5 / 6 / 7 / 8 / 9 / 10 / 1 / 2 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area I respectively; according to the positions of the codes 2 / 3 / 4 / 5 / 6 / 7 / 8 / 9 / 10 / 1 in the chip picking and placing sequence 30, LED chips are taken out from the corresponding positions of chip regions one to ten and placed into the target area J respectively. Finally, the obtained target areas A to J are as Figure 5 shown.

[0049] Example 2:

[0050] In this embodiment, different from the above Example 1, in the above Example 1, the corresponding LED chips in each chip region are first transferred to one of the target areas, and after the LED chip layout in this one target area is completed, the LED chip layouts in other target areas are then completed in sequence. In Example 2, the LED chips in one of the chip regions are correspondingly transferred to each target area, and after the transfer of the LED chips in this one chip region is completed, the LED chips in other chip regions are then correspondingly transferred to each target area in sequence. Specifically:

[0051] First, take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 1, and place it at the corresponding position in target area A; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 10, and place it at the corresponding position in target area B; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 9, and place it at the corresponding position in target area C; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 8, and place it at the corresponding position in target area D; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 7, and place it at the corresponding position in target area E; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 6, and place it at the corresponding position in target area F; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 5, and place it at the corresponding position in target area G; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 4, and place it at the corresponding position in target area H; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 3, and place it at the corresponding position in target area I; take out the LED chip a from the corresponding position in chip area 1 at the position of chip pick-and-place sequence 30 with code number 2, and place it at the corresponding position in target area J. The arrangement of the LED chip a in each target area is as Figure 6 shown.

[0052] Next, take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 2, and place it at the corresponding position in target area A; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 1, and place it at the corresponding position in target area B; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 10, and place it at the corresponding position in target area C; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 9, and place it at the corresponding position in target area D; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 8, and place it at the corresponding position in target area E; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 7, and place it at the corresponding position in target area F; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 6, and place it at the corresponding position in target area G; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 5, and place it at the corresponding position in target area H; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 4, and place it at the corresponding position in target area I; take out the LED chip b from the corresponding position in chip area two at the position of chip pick-and-place sequence 30 with code number 3, and place it at the corresponding position in target area J.

[0053] And so on;

[0054] Finally, the obtained target areas A to J are as Figure 5 shown.

[0055] It can be understood that in Figure 5 、 Figure 6 , separating target areas A to J is for the convenience of distinction. In actual implementation, target areas A to J can be connected to each other.

[0056] Example 3:

[0057] Different from the above-mentioned First Embodiment and Second Embodiment, in the Third Embodiment, each chip placement position is used to place three LED chips with different emission colors. For example, each chip placement position is provided with three pairs of pads respectively for fixing red, blue, and green LED chips. Each time the mixing and assembling method is executed, LED chips of one emission color are transferred to the chip placement position. For example, when the mixing and assembling method is executed for the first time, the red LED chips are transferred to one pair of pads of the chip placement position. Then, when the same mixing and assembling method is executed again, the blue LED chips are transferred to the second pair of pads of the chip placement position. Then, when the same mixing and assembling method is executed again, the green LED chips are transferred to the third pair of pads of the chip placement position, thus realizing the transfer of RGB three kinds of LED chips.

[0058] Of course, each chip placement position is not limited to placing three LED chips, and can also be used to place two LED chips, four LED chips, etc.

[0059] Fourth Embodiment:

[0060] Different from the above-mentioned First Embodiment, Second Embodiment, and Third Embodiment, in the Fourth Embodiment, the number of target areas is no longer equal to the number of chip areas, but an integer multiple of the number of chip areas. Specifically, the carrier is divided into ten chip areas, while the target substrate 20' is divided into forty target areas. As Figure 7 shown, the target areas A to J are arranged in two rows in sequence, and there is also a target area spaced in the horizontal and vertical directions respectively. There is a target area A' between the target area A and the target area B, there is a target area A''' between the target area A and the target area F, and there is a target area A'' on the connection line between the target area A and the target area G; there is a target area B' between the target area B and the target area C, there is a target area B''' between the target area B and the target area G, and there is a target area B'' on the connection line between the target area B and the target area H, and so on. The code combination rules of the target areas A', A'', A''' are obtained by rotating the code combination rule of the target area A as a whole by 90 degrees, 180 degrees, and 270 degrees respectively. The code combination rules of the target areas B', B'', B''' are obtained by rotating the code combination rule of the target area B as a whole by 90 degrees, 180 degrees, and 270 degrees respectively, and so on. In this way, while simplifying the design of the code combination rule, the LED chips on the target substrate 20' can be further scrambled, making the display effect of the manufactured display module better.

[0061] Specifically, when the mixing and assembling method is executed for the first time, the LED chips in each chip area are transferred to ten non-adjacent target areas. As Figure 7Target areas A to J; when the mixing method is executed for the second time, transfer the LED chips to target areas A' to J'; when the mixing method is executed for the third time, transfer the LED chips to target areas A'' to J''; when the mixing method is executed for the fourth time, transfer the LED chips to target areas A''' to J'''. The obtained target areas A and A' are as shown in Figure 8 shown, and it can be known from Figure 8 that the arrangement of the LED chips on target area A' is equivalent to that of the LED chips on target area A rotated 90 degrees clockwise as a whole.

[0062] Of course, the code combination rules of target areas A', A'', and A''' are not limited to being obtained by rotating the code combination rules of target area A by 90 degrees, 180 degrees, and 270 degrees as a whole. In specific implementation, any angle can be rotated, and the same principle applies to other target areas. When executing the mixing method once, it is not limited to transferring the LED chips to non-adjacent target areas, and it can also be transferred to adjacent target areas.

[0063] Example Five:

[0064] Different from the above Example Four, in this Example Five, the target substrate 20'' is divided into twenty targets, where the target areas A to J are arranged in two rows in sequence, with only one target area spaced horizontally between them, and the number of target areas is twice the number of chip areas. There is target area J' between target area A and target area B, target area I' between target area B and target area C, target area H' between target area C and target area D, target area G' between target area D and target area E, target area F' on the side of target area E far from target area D, target area E' between target area F and target area G, target area D' between target area G and target area H, target area C' between target area H and target area I, target area B' between target area I and target area J, and target area A' on the side of target area J far from target area I, as shown in Figure 9 shown. The code combination rule of target area A' is obtained by rotating the code combination rule of target area A by 180 degrees as a whole, the code combination rule of target area B' is obtained by rotating the code combination rule of target area B by 180 degrees as a whole, and so on. In this way, while simplifying the design of the code combination rule, the LED chips on the target substrate 20'' can be further scrambled, making the display effect of the manufactured display module better.

[0065] Specifically, when the mixing method is executed for the first time, transfer the LED chips in each chip area to ten non-adjacent target areas, as shown in Figure 9Target areas A to J; when the mixed mounting method is executed for the second time, transfer the LED chips to target areas A' to J'.

[0066] Embodiment Six:

[0067] Different from the above Embodiment Four and Embodiment Five, in this Embodiment Six, the target substrate 20''' is divided into twenty targets, where target areas A to J are arranged in two rows in sequence, with only one target area spaced longitudinally between them, and the number of target areas is twice the number of chip areas. There is target area J' between target area A and target area F, and on the side of target area F far from target area A is target area E', there is target area I' between target area B and target area G, and on the side of target area G far from target area B is target area D', there is target area H' between target area C and target area H, and on the side of target area H far from target area C is target area C', there is target area G' between target area D and target area I, and on the side of target area I far from target area D is target area B', there is target area F' between target area E and target area J, and on the side of target area J far from target area E is target area A', as Figure 10 shown. The code combination rule of target area A' is obtained by rotating the code combination rule of target area A by 180 degrees as a whole, and the code combination rule of target area B' is obtained by rotating the code combination rule of target area B by 180 degrees as a whole, and so on. Thus, while simplifying the design of the code combination rule, it can further scramble the LED chips on the target substrate 20''', making the display effect of the manufactured display module better.

[0068] It can be understood that the number of chip areas is not limited to ten. In specific implementation, it is better to be able to achieve a better mixed mounting effect of LED chips and a lower complexity. The number of LED chips in each chip area is not limited to the same number, the number of LED chips in the chip area and the number of chip placement positions in the target area are not limited to the same number or the same arrangement, and even less limited to the form of ten rows and ten columns. Similarly, the chip picking and placing sequence 30 is not limited to the same arrangement as the LED chip arrangement in the chip area, nor limited to including ten codes. The chip picking and placing rule is not limited to the form based on the chip picking and placing sequence 30.

[0069] In summary, in the present invention, the carrier is divided into multiple chip regions, and the target substrate is divided into multiple target regions. Chip placement rules for each of the multiple target regions corresponding to each chip region are set, and there are multiple different chip placement rules among the multiple target regions. Then, according to the chip placement rules, the LED chips in each chip region are transferred to each target region. Finally, the LED chips in each target region come from multiple chip regions, so that the LED chips in each target region are arranged in a disordered manner, and the arrangements of the LED chips in the multiple target regions are also different, increasing the degree of chaos in the mixed installation of the LED chips on the target substrate, eliminating the differences in color, brightness, etc. of the entire display module screen, and achieving a more excellent display effect. In addition, it can also replace the existing sorting method, improve production efficiency, and improve chip utilization rate.

[0070] The content described in this specification is a further detailed description of the present invention in combination with specific preferred embodiments, but these descriptions should not be construed as limiting the scope of the present invention. According to the protection scope listed in the appended claims of the present invention, the described embodiments of the present invention can be combined in any suitable manner in one or more embodiments. For those skilled in the art of the present invention, without departing from the concept of the present invention, equivalent implementations or substitutions and various forms of combinations made should be regarded as belonging to the protection scope determined by the claims submitted for the present invention.

Claims

1. A method for mixed mounting of LED display module chips, characterized in that, Including: Providing at least one carrier carrying a plurality of LED chips, and dividing the at least one carrier into M chip regions; Providing a target substrate, and dividing the target substrate into N target regions; Setting the chip picking and placing rules for the N target regions, where there are different chip picking and placing rules among the N target regions, and the chip picking and placing rules are: taking out the LED chips at a certain position from each chip region respectively, and placing them at the preset positions in the target regions; Transferring the LED chips in each chip region to each target region according to the chip picking and placing rules; Wherein, the "providing at least one carrier carrying a plurality of LED chips" includes: Providing at least one carrier carrying a plurality of sorted LED chips; the LED chips on all the carriers belong to the same parameter range, and the parameters include at least one of wavelength, voltage and current; Each chip region arranges p rows and q columns of LED chips, each target region arranges p rows and q columns of chip placement positions, and each chip placement position is used to place one LED chip; The "setting the chip picking and placing rules for the N target regions, where there are different chip picking and placing rules among the N target regions" includes: Setting a chip picking and placing sequence, which is composed of a plurality of disordered codes, and the plurality of disordered codes are arranged in p rows and q columns. The position of each code in the chip picking and placing sequence corresponds to the position of the LED chip to be taken out in each chip region and the chip placement position of the taken-out LED chip in each target region; For each target region, it is set to take out LED chips from each chip region respectively according to different code combination rules; The chip picking and placing sequence is composed of N disordered codes, and the "for each target region, it is set to take out LED chips from each chip region respectively according to different code combination rules" includes: For the first target region, taking out the LED chip at the position corresponding to the code K1 in the chip picking and placing sequence from the corresponding position in the first chip region, taking out the LED chip at the position corresponding to the code K2 in the chip picking and placing sequence from the corresponding position in the second chip region, and so on, taking out the LED chip at the position corresponding to the code KN in the chip picking and placing sequence from the corresponding position in the Nth chip region; For the second target region, taking out the LED chip at the position corresponding to the code KN in the chip picking and placing sequence from the corresponding position in the first chip region, taking out the LED chip at the position corresponding to the code K1 in the chip picking and placing sequence from the corresponding position in the second chip region, and so on, taking out the LED chip at the position corresponding to the code KN-1 in the chip picking and placing sequence from the corresponding position in the Nth chip region; and so on, For the Nth target area, take out the LED chips from the corresponding positions of the first chip area at the position of the chip picking and placing sequence with the code K2, take out the LED chips from the corresponding positions of the second chip area at the position of the chip picking and placing sequence with the code K3, and so on, take out the LED chips from the corresponding positions of the Nth chip area at the position of the chip picking and placing sequence with the code K1; N is an integer multiple of M. When the mixing method is first executed, transfer the LED chips in each chip area to M non-adjacent target areas. By executing the mixing method multiple times, transfer the LED chips to the remaining N - M target areas; the code combination rules for the remaining N - M target areas are respectively obtained by rotating a preset angle through the code combination rules of the M non-adjacent target areas.

2. The mixed loading method according to claim 1, wherein The step of "transferring the LED chips in each chip area to each target area according to the chip picking and placing rules" includes: according to the chip picking and placing rules, first transfer the corresponding LED chips in each chip area to one of the target areas. After the transfer of the LED chips in the one target area is completed, then complete the transfer of the LED chips in the other target areas in sequence.

3. The mixed loading method according to claim 1, characterized in that, The step of "transferring the LED chips in each chip area to each target area according to the chip picking and placing rules" includes: according to the chip picking and placing rules, first transfer the LED chips in one of the chip areas correspondingly to each target area. After the transfer of the LED chips in the one chip area is completed, then transfer the LED chips in the other chip areas correspondingly to each target area in sequence.

4. An LED display module, characterized in that, The LED display module is manufactured by using the mixing method according to any one of claims 1 to 3.

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