Photosensitive component and manufacturing method thereof, camera module

Abstract

The present application provides a photosensitive component and a manufacturing method thereof, and a camera module. The photosensitive component includes: a reinforcing plate, having a first side and a second side opposite to each other in the thickness direction, and a hollow hole connecting the first side and the second side; a photosensitive chip, arranged on the first side of the reinforcing plate, and the projection in the thickness direction covers the hollow hole, and the side of the photosensitive chip facing away from the reinforcing plate includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area; a circuit board, arranged on the first side of the reinforcing plate, and including a mounting opening penetrating along the thickness direction and sleeved on the photosensitive chip, and there is a gap between the hole wall of the mounting opening and the outer periphery of the photosensitive chip; and a molded body, formed in one piece by molding a molding material, so that at least a portion of the non-photosensitive area, at least a portion of the circuit board, and the gap are encapsulated by the formed molded body.

Description

Technical Field

[0001] The present application relates to the field of optical elements, and more specifically, to a photosensitive component, a method for manufacturing a photosensitive component, a camera module, and a method for manufacturing a camera module. Background Art

[0002] Mobile electronic devices have become extremely popular, and since almost all users need to take pictures, camera modules have become an almost indispensable component in mobile electronic devices. As users have increasingly higher requirements for photo quality and effects, high pixels, large chips, small sizes, and large apertures are the development trend of existing camera modules. However, it is very difficult for a camera device to simultaneously meet the requirements of high pixels, large chips, small sizes, and large apertures. For example, how to obtain higher image quality with a smaller camera module volume has become a major problem in the field of compact camera modules (such as camera modules for mobile phones).

[0003] Mobile phone models are becoming more compact, and in recent years, the pursuit of increasing the screen-to-body ratio of mobile phones has made the space available for the front camera module inside the phone smaller and smaller, causing the front module to develop in the direction of smaller size. At the same time, the number of rear camera modules is increasing, and the area they occupy is also increasing. This has led to a corresponding reduction in the size of other components on the mobile phone, such as batteries and motherboards. In order to avoid sacrificing the configuration of other components, the market hopes that the size of the rear camera module can be reduced, that is, to achieve a small-size package. However, in order to improve the image quality, while pursuing high pixels, large aperture and other performance, the size of the photosensitive chip has become larger and larger. At the same time, the technological development of chip manufacturers has also made the chips larger and larger. This makes the demand for miniaturization of camera modules difficult to achieve.

[0004] In order to achieve the miniaturization of the camera module to adapt to the narrow installation space, a molding process is usually used to directly form the bracket of the lens assembly or the bracket of other components on the circuit board. For example, the MOB (Mold on Board) process and the MOC (Mold on Chip) process. Specifically, the camera module may include a lens assembly and a photosensitive assembly, and the lens group and other optical elements of the lens assembly are arranged on the photosensitive path of the photosensitive chip of the photosensitive assembly. It should be noted that in some schemes, the color filter can be directly installed in the photosensitive assembly to constitute a part of the photosensitive assembly, but in other schemes, the color filter may not be arranged in the photosensitive assembly, but the color filter may be made into an independent color filter assembly or installed in other forms on the light-transmitting path. Therefore, the lens assembly can sometimes be understood as a combination of light-transmitting elements such as lens groups, color filters and their supporting structural parts.

[0005] refer to Figure 1The photosensitive component may include a circuit board 1 and a molded body 2 integrally molded on the circuit board 1. The molded body 2 may eliminate the avoidance space of the traditional lens holder attached module, and may achieve the advantages of the photosensitive component and the module in which the photosensitive component is set in terms of length, width, height, etc. In addition, the molded body 2 may reinforce the strength of the circuit board 1, so the circuit board may be thinned, and the flatness of the photosensitive component may be ensured on the basis of reducing the thickness requirement of the circuit board 1.

[0006] Exemplarily, in the MOC packaging process, the photosensitive chip 3 is pre-attached to the circuit board 1, and then a molded body 2 is formed on the circuit board 1 through a molding process, and the molded body 2 can wrap a part of the non-photosensitive area of ​​the photosensitive chip 3. The combination of the circuit board 1 and the molded body 2, and the combination of the molded body 2 and the photosensitive chip 3 are both very strong rigid combinations, which often require destructive methods to remove. However, the circuit board 1 and the photosensitive chip 3 are combined by glue, which is a relatively flexible combination. At the same time, the thermal expansion coefficients (CTE) of the circuit board 1, the molded body 2 and the photosensitive chip 3 are different. Therefore, when the ambient temperature changes greatly during the manufacturing process (for example, the molding material molding in the molding process needs to increase the temperature to more than 150 degrees Celsius, the baking stage needs to increase the temperature to more than 80 degrees Celsius, and the ambient temperature may change many times in the subsequent process of producing the photosensitive component and the camera module), the expansion degree of the circuit board 1, the molded body 2 and the photosensitive chip 3 is different, and the expansion speed is also different. Among them, the shrinkage degree of the photosensitive chip 3 is often the smallest. Since the connection between the circuit board 1 and the mold body 2 is a rigid connection, stress will be generated between the circuit board 1 and the mold body 2 due to the difference in expansion or contraction, causing the circuit board 1 and the mold body 2 to bend, and this bending will cause the photosensitive chip 3 to deform, especially the upward bending deformation of the photosensitive chip 3 will cause a significant decrease in the imaging quality of the photosensitive component.

[0007] In addition, the photosensitive chip 3 is connected to the circuit board 1 by glue, and the glue is applied in a way that the edges are low and the middle is high, which can also cause the photosensitive chip 3 to bend; and the subsequent baking process can also cause bending. When the photosensitive chip 3 is a large chip with high pixels, it is thin and large in size, which is more likely to cause field curvature problems.

[0008] Moreover, although the molding process has achieved the miniaturization of the photosensitive component, the photosensitive chip 3, the circuit board 1, and the molded body 2 form a closed and narrow space, which makes it more difficult to dissipate heat for the photosensitive chip 3. The high temperature environment in the manufacturing and use of the photosensitive component will cause the field curvature of the photosensitive chip 3, resulting in a decrease in imaging quality. In particular, with the popularization of high-pixel chips and the gradual improvement of functions such as video shooting, the energy consumption and heat dissipation problems of large-size chips are becoming more and more prominent, so it is expected to be solved in the module packaging design and manufacturing process. Summary of the invention

[0009] An embodiment of the present application provides a photosensitive component, which includes: a reinforcement plate having a first side and a second side opposite to each other in the thickness direction, and a hollow hole connecting the first side and the second side; a photosensitive chip, which is arranged on the first side of the reinforcement plate, and whose projection in the thickness direction covers the hollow hole, and a side of the photosensitive chip facing away from the reinforcement plate includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area; a circuit board, which is arranged on the first side of the reinforcement plate, and includes a mounting opening that penetrates along the thickness direction and is sleeved on the photosensitive chip, and a gap is provided between the hole wall of the mounting opening and the outer periphery of the photosensitive chip; and a molded body, which is formed integrally by molding a molding material, and at least a portion of the non-photosensitive area, at least a portion of the circuit board, and the gap are encapsulated by the formed molded body.

[0010] In one embodiment, in a cross section in the thickness direction, the portion of the photosensitive chip corresponding to the hollow hole occupies 50% to 80% of the total area of ​​the photosensitive chip.

[0011] In one embodiment, in the radial direction of the thickness direction, the molded body is located outside the hollow hole.

[0012] In one embodiment, the reinforcing plate includes a frame-shaped member; in any radial direction of the photosensitive chip, the outer frame edge of the frame-shaped member is located outside the outer periphery of the photosensitive chip, and the inner frame edge of the frame-shaped member is located inside the outer periphery of the photosensitive chip.

[0013] In one embodiment, the shape of the frame-shaped component is a rectangular frame; in any radial direction of the photosensitive chip, the distance between the inner frame edge of the rectangular frame and the outer periphery of the photosensitive chip is not less than 1 mm.

[0014] In one embodiment, the reinforcement plate further includes an auxiliary support member, which is disposed in a frame opening of the frame-shaped member and fixedly connected to the photosensitive chip.

[0015] In one embodiment, the reinforcement plate further comprises a heightening member located in the mounting opening.

[0016] In one embodiment, the photosensitive chip is electrically connected to the circuit board via an electrical connection element.

[0017] In one embodiment, the photosensitive chip is electrically connected to a side of the circuit board facing away from the reinforcement plate via an electrical connection element.

[0018] In one embodiment, the molded body is used to encase the electrical connection element.

[0019] In one embodiment, the molded body is also used to wrap the electronic components disposed on the side of the circuit board facing away from the reinforcement plate.

[0020] In one embodiment, the molded body includes a first supporting portion and a first fixing portion located outside the first supporting portion in the radial direction of the mounting opening; the first supporting portion is fixedly connected to the non-photosensitive area and is fixedly connected to the reinforcement plate through the gap; the first fixing portion is fixedly connected to the circuit board.

[0021] In one embodiment, at least one of a thermal conductive adhesive, a heat dissipation film, a heat reducing gap filler and an electromagnetic interference absorber is disposed on the surface of the corresponding hollow hole of the photosensitive chip.

[0022] In one embodiment, the photosensitive component further includes a color filter, which is disposed on a side of the molded body facing away from the circuit board.

[0023] In one embodiment, the photosensitive component also includes a supporting mirror seat, which is annular in shape, and the outer periphery of the supporting mirror seat overlaps the side of the molded body facing away from the circuit board; the inner periphery of the supporting mirror seat is located outside the effective area of ​​the photosensitive chip, and the side of the inner periphery of the supporting mirror seat facing away from the photosensitive chip is used for overlapping the color filter; the molded body is located radially outside the color filter.

[0024] In one embodiment, a sink is provided at the inner periphery of the support mirror seat on the side facing away from the photosensitive chip, and the bottom of the sink overlaps the color filter; an annular groove is provided at the outer periphery of the support mirror seat on the side facing the photosensitive chip, and the bottom of the annular groove is used to overlap the molded body.

[0025] In a second aspect, an embodiment of the present application provides a camera module, comprising the aforementioned photosensitive component and lens assembly.

[0026] The third aspect of the present application provides a method for manufacturing a photosensitive component, comprising: forming a reinforcement plate having a hollow hole, wherein the hollow hole connects a first side and a second side of the reinforcement plate that are opposite to each other in the thickness direction; applying an adhesive on the first side of the reinforcement plate; mounting a photosensitive chip to the first side of the reinforcement plate so that the projection of the photosensitive chip in the thickness direction covers the hollow hole; mounting a circuit board to the first side of the reinforcement plate, and making an installation opening of the circuit board that passes through the thickness direction be sleeved on the photosensitive chip, with a gap between the hole wall of the installation opening and the outer periphery of the photosensitive chip; and molding the molding material on the first side of the reinforcement plate to form a molded body, wherein at least a portion of the non-photosensitive area, at least a portion of the circuit board, and the gap are encapsulated by the formed molded body.

[0027] In one embodiment, the method further comprises: disposing a color filter on a side of the molded body facing away from the circuit board.

[0028] In one embodiment, the method further includes: overlapping the outer periphery of the annular support mirror seat on the side of the molded body facing away from the circuit board; overlapping the color filter on the side of the inner periphery of the support mirror seat facing away from the photosensitive chip.

[0029] In one embodiment, the method further includes: disposing at least one of a thermal conductive adhesive, a heat dissipation film, a heat reducing gap filler and an electromagnetic interference absorber on the surface of the corresponding hollow hole of the photosensitive chip.

[0030] A fourth aspect of the present application provides a method for manufacturing a camera module, comprising: assembling a photosensitive component obtained by the aforementioned method with a lens component.

[0031] The photosensitive component and camera module provided by the embodiments of the present application have high heat dissipation efficiency. The back side of the photosensitive area of ​​the photosensitive chip can be in contact with the outside through the hollow hole, thereby better dissipating heat. At the same time, by setting the circuit board on the reinforcement plate, it helps to increase the structural strength of the circuit board. In addition, the molded body is connected to the photosensitive chip, the reinforcement plate and the circuit board at the same time, further improving the overall structural strength of the photosensitive component. The reinforcement plate with higher strength enables the circuit board with good bending performance to meet the overall load-bearing requirements of the photosensitive component, the flatness of the circuit board is improved, and the field curvature deformation of the image formed by the photosensitive chip is small. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0033] Figure 1 A schematic structural diagram of a photosensitive component in the prior art is shown;

[0034] Figure 2 A schematic structural diagram of a photosensitive component according to an embodiment of the present application is shown;

[0035] Figure 3 Shows Figure 2 The enlarged view of point A in the middle;

[0036] Figure 4 Shows Figure 2 A schematic bottom view of

[0037] Figure 5 A schematic structural diagram of another photosensitive component according to an embodiment of the present application is shown;

[0038] Figure 6 Shows Figure 5 A schematic bottom view of

[0039] Figure 7 A schematic structural diagram of another photosensitive component according to an embodiment of the present application is shown;

[0040] Figure 8 A schematic structural diagram of another photosensitive component according to an embodiment of the present application is shown;

[0041] Fig. 9 A schematic structural diagram of another photosensitive component according to an embodiment of the present application is shown; and

[0042] Fig.10 A flow chart of a method for manufacturing a photosensitive component according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0043] In order to better understand the present application, a more detailed description will be made of various aspects of the present application with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0044] It should be noted that in this specification, the expressions first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teaching of the present application, the first side discussed below may also be referred to as the second side. And vice versa.

[0045] In the drawings, the thickness, size and shape of the components have been slightly adjusted for ease of illustration. The drawings are for illustration only and are not strictly drawn to scale. For example, the thickness of the circuit board and the thickness of the reinforcement plate are not in proportion to actual production. As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not as terms of degree, and are intended to illustrate the inherent deviations in measured or calculated values ​​that will be recognized by those of ordinary skill in the art.

[0046] It should also be understood that the terms "comprises", "including", "having", "includes" and / or "comprising", when used in this specification, indicate the presence of the stated features, elements and / or components, but do not exclude the presence or addition of one or more other features, elements, components and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed features rather than modifying the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application". And, the term "exemplary" is intended to refer to an example or illustration.

[0047] Unless otherwise specified, all words (including engineering terms and scientific and technological terms) used in this article have the same meaning as those commonly understood by ordinary technicians in the field to which this application belongs. It should also be understood that, unless clearly stated in this application, words defined in common dictionaries should be interpreted as having the same meaning as their meaning in the context of the relevant technology, and should not be interpreted in an idealized or overly formal sense.

[0048] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. In addition, unless explicitly limited or contradictory to the context, the specific steps included in the method described in the present application are not necessarily limited to the order described, but can be performed in any order or in parallel. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0049] refer to Figure 2 and Figure 3 ,in Figure 2 A schematic structural diagram of a photosensitive component according to an embodiment of the present application is shown. Figure 2 The upper side in the figure may be the first side, and the lower side may be the second side. The direction shown in the figure is not the direction in actual use. For example, the direction from bottom to top is placed in a horizontal plane when in use. Figure 2 The photosensitive component provided in the embodiment of the present application includes: a reinforcement plate 5, a circuit board 1, a photosensitive chip 3 and a molded body 2.

[0050] The reinforcement plate 5 has a certain rigidity and a certain thickness in the up-down direction. The reinforcement plate 5 includes a through hollow hole 501, and the hollow hole 501 connects the upper side and the lower side. Exemplarily, the axis of the hollow hole 501 is along the optical axis. Exemplarily, the shape of the hollow hole 501 can be an inclined column or a trapezoid. The reinforcement plate 5 can include a plurality of hollow holes 501. In another case, it can also be considered that a plurality of independent through holes constitute the hollow hole 501, and these through holes are located within a preset area.

[0051] The photosensitive chip 3 is arranged on the upper side of the reinforcing plate 5, and the photosensitive chip 3 covers a part of the port located on the upper side of the hollow hole 501 or completely covers it. It can also be considered that the main body of the reinforcing plate 5 supports a part of the photosensitive chip 3, and the other part of the photosensitive chip 3 is suspended in the hollow hole 501. The photosensitive chip 3 can be a charge-coupled device (CCD) type image sensor or a complementary metal oxide semiconductor (CMOS) type image sensor. The photosensitive chip 3 is used to receive imaging light and form an image, refer to Figure 3 The photosensitive chip 3 includes a photosensitive area 301 and a non-photosensitive area 302 surrounding the photosensitive area 301 . Figure 2 The photosensitive direction of the photosensitive chip 3 is toward the upper side. The design direction of the photosensitive chip 3 is related to the installation position of the lens assembly to be matched. Generally speaking, the lens assembly to be matched is set on the upper side, and the imaging light is irradiated to the photosensitive chip 3 from the upper side.

[0052] The circuit board 1 is arranged on the upper side of the reinforcing plate 5, and the circuit board 1 includes a mounting opening 101. The mounting opening 101 penetrates the circuit board 1 in the thickness direction, and the hole wall of the mounting opening 101 is sleeved on the photosensitive chip 3. In other words, arranging at least a part of the photosensitive chip 3 in the mounting opening 101 is conducive to reducing the relative height between the photosensitive chip 3 and the circuit board 1, thereby reducing the height of the photosensitive component.

[0053] There is a gap 102 between the outer periphery of the photosensitive chip 3 and the hole wall of the mounting opening 101. Since the material of the photosensitive chip 3 is usually different from that of the circuit board 1, the degree of thermal expansion and contraction when heated is usually different. The gap 102 helps to reduce the mutual influence between the two. In particular, it reduces the influence of the circuit board 1 on the flatness of the photosensitive chip 3 when it is heated or deformed by external forces. It helps to ensure that the imaging of the photosensitive chip 3 always has a small field curvature. Furthermore, the gap 102 is conducive to the installation of the photosensitive chip 3 and the circuit board 1, and reserves the installation margin between the photosensitive chip 3 and the circuit board 1.

[0054] The molded body 2 is arranged on the upper side of the circuit board 1, that is, the side facing away from the reinforcing plate 5. The molded body 2 can be annular and have a light window 201, which is used to provide a light path for the photosensitive chip. In an exemplary embodiment, the molded body 2 includes a first supporting portion 21 and a first fixing portion 22. The molded body 2 is an integrated structure, so the first supporting portion 21 and the first fixing portion 22 are two parts distinguished according to function. Specifically, the first supporting portion 21 is used to integrally encapsulate at least a portion of the non-photosensitive area 302 of the photosensitive chip 3 and the interval 102. During molding, the first supporting portion 21 can pass through or fill the interval 102 and also integrally encapsulate the upper surface of the reinforcing plate 5. The first supporting portion can also encapsulate a portion of the circuit board 1 close to the interval 102. The first fixing portion 22 is located at the radial periphery of the first supporting portion 21, and is used to integrally encapsulate a portion of the circuit board 1. The molded body 2 can also improve the connection strength between the components in the photosensitive component. .

[0055] Exemplarily, the reinforcing plate 5 and the photosensitive chip 3 may be glued, and the first supporting portion 21 may be formed on the surface of the photosensitive chip 3. In addition, the first supporting portion 21 is arranged at a position to avoid blocking the imaging light, thereby ensuring that the light passes through the light window 201 to reach the photosensitive area 301 of the photosensitive chip, so that the photosensitive area 301 of the photosensitive chip 3 can open the image normally.

[0056] In an exemplary embodiment, the photosensitive component further includes: an electrical connection element 7, and the photosensitive chip 3 is electrically connected to the circuit board 1 through the electrical connection element 7. Specifically, the non-photosensitive area 302 of the photosensitive chip 3 is electrically connected to the side of the circuit board 1 that is away from the reinforcement plate. Exemplarily, the length of the electrical connection element 7 is greater than the distance between the connection point on the photosensitive chip 3 and the connection point on the circuit board 1.

[0057] Specifically, the photosensitive chip 3 is electrically connected to the upper side of the circuit board 1, that is, the side facing away from the reinforcing plate 5, through the electrical connection element 7. The photosensitive area 301 of the photosensitive chip 3 is used for light sensing, and the non-photosensitive area 302 is electrically connected to the circuit board, so that the electrical signal after the photoelectric conversion of the photosensitive area 301 is transmitted to the circuit board.

[0058] The photosensitive component provided in the embodiment of the present application has good heat dissipation performance. The hollow hole 501 exposes the lower end surface of the photosensitive chip 3 to the external environment, and the heat generated by the photosensitive chip 3 during operation can be directly transferred to the external environment. The circuit board 1 is subjected to less heat and can have smaller deformation. At the same time, the reinforcement plate 5 helps to strengthen the strength of the circuit board 1.

[0059] In an exemplary embodiment, in the cross section in the thickness direction of the reinforcing plate 5, the portion of the photosensitive chip 3 corresponding to the hollow hole 501 accounts for 50% to 80% of the total area of ​​the photosensitive chip 3. This arrangement ensures that the photosensitive chip 3 has sufficient supported area and sufficient heat dissipation area. This makes the flatness of the photosensitive chip 3 at a relatively good level. Exemplarily, the projection of the light window 201 of the molded body 2 in the thickness direction usually covers the hollow hole 501. That is, the projection of the main body of the molded body 2 in the thickness direction is located within the main body of the reinforcing plate 5. This arrangement helps to form a more stable molded body 2, and the photosensitive chip 3 is flatter.

[0060] In other words, the main body of the reinforcing plate 5 includes a second supporting portion 51 for supporting the photosensitive chip 3 and a second fixing portion 52 for connecting the circuit board 1. The second supporting portion 51 and the second fixing portion 52 are generally an integrated structure. The area of ​​the portion of the photosensitive chip 3 supported by the second supporting portion 51 of the reinforcing plate 5 accounts for 20% to 50% of the total area of ​​the photosensitive chip 3.

[0061] Since the lower end surface of the circuit board 1 is fixedly connected to the reinforcing plate 5, at least one electronic component 6 arranged on the circuit board 1 is usually arranged on the side facing away from the reinforcing plate 5, that is, on the upper side of the circuit board. The electronic component 6 is electrically connected to the circuit board 1. The electronic component 6 can be a resistor, a capacitor, a driving element, a signal processing element, a storage element, etc. The first fixing portion 22 of the molded body 2 can be used to wrap these electronic components 6. In addition, the molded body 2 can also be made into a preset shape to match other accessories.

[0062] In an exemplary embodiment, the molded body 2 is used to wrap the electrical connection element 7. Specifically, the first support portion 21 is used to wrap the electrical connection element 7. The molded body 2 can improve the strength of the electrical connection element 7 and is conducive to extending the service life of the electrical connection element 7.

[0063] The electrical connection element 7 and the electronic components 6 at the circuit board 1 are encapsulated and wrapped in the mold body 2, so as to be isolated from the external environment and not exposed to the external environment. On the other hand, the space waste caused by the installation space reserved for the electrical connection element 7 and the electronic components 6 in the prior art can be solved.

[0064] In an exemplary embodiment, at least one of a thermal conductive adhesive, a heat dissipation film, a heat reducing gap filler, and an electromagnetic interference (EMI) absorber is provided in the area corresponding to the hollow hole 501 on the lower surface of the photosensitive chip 3. The provision of the thermal conductive adhesive, the heat dissipation film, and the heat reducing gap filler is conducive to improving the heat dissipation speed of the photosensitive chip 3. Exemplarily, the heat reducing gap filler and the electromagnetic interference absorber are provided at the same time, so that the photosensitive chip 3 can be electromagnetically shielded while accelerating the heat dissipation.

[0065] In an exemplary embodiment, the photosensitive component further includes a color filter 4, and the color filter 4 is disposed on the upper side of the mold body 2. The upper portion of the mold body 2 can be configured to a preset shape, for example, including a recess, and the color filter 4 is then disposed in the recess.

[0066] refer to Figure 4 , the photosensitive chip 3 generally has a rectangular outer periphery. Exemplarily, the hollow hole 501 of the reinforcing plate 5 is a square hole.

[0067] Exemplarily, the reinforcing plate 5 includes a second supporting portion 51, and a projection area thereof along the thickness direction includes a plurality of through holes. The outer circumference size of the second supporting portion 51 is set according to the photosensitive chip 3 to be mounted.

[0068] Exemplarily, the second supporting portion 51 of the reinforcing plate 5 is frame-shaped, and the frame-shaped second supporting portion 51 circumferentially supports the entire outer periphery of the photosensitive chip 3. In other words, the photosensitive chip 3 covers the entire hollow hole 501.

[0069] refer to Figure 5 and Figure 6 In an exemplary embodiment, the second support portion 51 of the reinforcing plate 5 includes a frame-shaped member 511. In any radial direction of the photosensitive chip 3, the outer frame edge of the frame-shaped member 511 is located outside the outer periphery of the photosensitive chip 3, and the inner frame edge of the frame-shaped member 511 is located inside the outer periphery of the photosensitive chip. The outer frame edge of the frame-shaped member 511 may be located at the outer periphery of the photosensitive chip 3.

[0070] In an exemplary embodiment, the shape of the frame member 511 is a rectangular frame.

[0071] In an exemplary embodiment, in any radial direction of the photosensitive chip 3, the distance between the inner frame edge of the frame member 511 and the outer periphery of the photosensitive chip 3 is not less than 1 mm. Supporting the entire outer periphery of the photosensitive chip 3 helps to strengthen the strength of the photosensitive chip 3. Further controlling the support width at the outer periphery of the photosensitive chip 3 can ensure that there is sufficient contact area between it and the reinforcement plate 5, and thus it has sufficient support area.

[0072] In an exemplary embodiment, the second support portion 51 of the reinforcement plate 5 further includes an auxiliary support member 512. The auxiliary support member 512 is disposed within the frame opening of the frame member 511 and is fixedly connected to the photosensitive chip 3. The second support portion 51 is in a "field" shape and can be considered to have four hollow holes 501. The auxiliary support member 512 can support the photosensitive chip 3 more stably, prevent the photosensitive chip 3 from bending, and enable the photosensitive chip 3 to have good heat dissipation performance.

[0073] Exemplarily, it can be considered that an auxiliary support member 512 is disposed inside a hollow hole 501. The auxiliary support member 512 is composed of multiple slats, such as various shapes like "cross" shape, "rice" shape, "river" shape, "middle" shape, "Y" shape, etc., and divides the hollow hole 501.

[0074] Reference Figure 7 , in an exemplary embodiment, the second support portion 51 of the reinforcement plate 5 further includes a heightening member 513. The upper end surface of the heightening member 513 is higher than the upper end surface of the second fixing portion 52. In the photosensitive component, the heightening member 513 can be located in the mounting opening 101 of the circuit board 1. By means of the heightening member 513 with a preset height, after the photosensitive chip 3 is mounted on the upper end surface of the second support portion 51, it has a preset height relative to the circuit board 1. The photosensitive component arranged in this way is used to correspond and match with lens components with different back focus requirements.

[0075] Reference Figure 8 and Fig. 9 , in an exemplary embodiment, the photosensitive component further includes a support lens holder 8. The support lens holder 8 is annular, and its outer periphery overlaps on the side of the molding body 2 facing away from the circuit board 1. The inner periphery of the support lens holder 8 is located outside the effective area of the photosensitive chip 3. The side of the inner periphery of the support lens holder 8 facing away from the photosensitive chip 3 is used to overlap the color filter 4. To ensure that the optical path of the photosensitive chip 3 is not affected, the molding body 2 is located radially outside the color filter 4.

[0076] Reference Figure 8 , the molding body 2 is disposed in the non-photosensitive area of the photosensitive chip 2 and on the upper side of the circuit board 1. The molding body 2 is also used to cover and wrap the electrical connection element 7 and the electronic component 6. Reference Fig. 9 The molded body 2 is arranged on the upper side of the circuit board 1 and can be used to wrap the electronic components 6. It can be seen that the radial dimension of the color filter 4 is smaller than the span of the molded body 2 on the left and right sides of the photosensitive chip 3. Fig. 9 When the span of the middle molded body 2 is large, the arrangement of the support lens holder 8 enables the color filter 4 to only need a relatively small size. The color filter 4 with a smaller size can better overcome the problem of being fragile during installation.

[0077] In an exemplary embodiment, a sink 802 is provided at the inner periphery of the supporting mirror seat 8 on the side facing away from the photosensitive chip 3, and the bottom of the sink 802 overlaps the color filter 4; an annular groove 801 is provided at the outer periphery of the supporting mirror seat 8 on the side facing the photosensitive chip 3, and the bottom of the annular groove 801 is used to overlap the mold body 2.

[0078] refer to Fig. 9 A photosensitive component provided in an embodiment of the present application includes: a reinforcement plate 5, a circuit board 1, a photosensitive chip 3 and a molded body 2.

[0079] The reinforcing plate 5 has a certain rigidity, and includes a through-hole 501 . The through-hole 501 connects the upper side and the lower side of the reinforcing plate 5 .

[0080] The photosensitive chip 3 is disposed on the upper side of the reinforcing plate 5, and the photosensitive chip 3 covers the upper port of the hollow hole 501. It can also be considered that the main body of the reinforcing plate 5 supports a part of the photosensitive chip 3, and the other part of the photosensitive chip 3 is suspended in the hollow hole 501. Fig. 9 The light sensing direction of the middle photosensitive chip 3 is toward the upper side.

[0081] The circuit board 1 is disposed on the upper side of the reinforcing plate 5, and the circuit board 1 includes a mounting opening 101. The mounting opening 101 penetrates the circuit board 1 along the thickness direction. The hole wall of the mounting opening 101 is sleeved on the photosensitive chip 3 and has a gap 102 between it and the outer periphery of the photosensitive chip 3.

[0082] The molded body 2 is arranged on the upper side of the circuit board 1, that is, the side facing away from the reinforcing plate 5. The molded body 2 is located radially outside the mounting opening 101 of the circuit board 1. Usually, the molded body 2 is an integrated structure, and specifically can be a ring surrounding the mounting opening 101. The molded body 2 is fitted and fixedly connected to at least a portion of the circuit board 1. Exemplarily, the electronic component 6 is arranged on the upper side of the circuit board 1, and the molded body 2 wraps the electronic component 6.

[0083] In an exemplary embodiment, there may be a gap 102 between the outer periphery of the photosensitive chip 3 and the hole wall of the mounting opening 101. This helps to ensure that the imaging of the photosensitive chip 3 always has a smaller field curvature.

[0084] In an exemplary embodiment, the photosensitive component further includes: an electrical connection element 7, and the photosensitive chip 3 is electrically connected to the upper side of the circuit board 1 through the electrical connection element 7. Exemplarily, the length of the electrical connection element 7 is greater than the distance between the connection point on the photosensitive chip 3 and the connection point on the upper side of the circuit board 1.

[0085] In an exemplary embodiment, the photosensitive assembly further includes a support lens holder 8 and a color filter 4. A sink 802 is provided on the inner periphery of the support lens holder 8 on the side facing away from the photosensitive chip 3, and the bottom of the sink 802 overlaps the color filter 4; an annular groove 801 is provided on the outer periphery of the support lens holder 8 on the side facing the photosensitive chip 3, and the bottom of the annular groove 801 is used to overlap the mold body 2. The mold body 2 may include a sink matched with the annular groove 801.

[0086] The photosensitive component provided in the embodiment of the present application has good heat dissipation performance. The hollow hole 501 exposes the lower end surface of the photosensitive chip 3 to the external environment, and the heat generated by the photosensitive chip 3 during operation can be directly transferred to the external environment. In addition, the upper side space of the photosensitive chip 3 is large, which is also conducive to heat dissipation. The circuit board 1 is subjected to less heat and can have smaller deformation.

[0087] The present application also provides a camera module, which includes the aforementioned photosensitive component and lens component. The lens component can be installed on the upper side of the circuit board 1. The heat dissipation performance of the camera module is good, and thus the imaging field curvature is small and the imaging quality is high. Moreover, at least a part of the photosensitive chip 3 is installed in the mounting opening 101 of the circuit board 1, which can adapt to lens components with different back focal lengths, and thus is suitable for forming various types of camera modules.

[0088] refer to Fig.10 The present application also provides a method 1000 for manufacturing a photosensitive component, the method 1000 comprising the following steps:

[0089] S1010, forming a reinforcement plate with a hollow hole, wherein the hollow hole connects a first side and a second side of the reinforcement plate that are opposite to each other in the thickness direction. Exemplarily, the end surfaces of the second support portion and the second fixing portion of the reinforcement plate located on the first side are processed to different heights.

[0090] Exemplarily, hollow holes may be formed on the substrate to form the reinforcement plate. Exemplarily, the reinforcement plate may be directly formed by powder metallurgy or the like.

[0091] S1020, applying adhesive to the first side of the reinforcement plate.

[0092] S1030, mounting the photosensitive chip to the first side of the reinforcing plate, and making the projection of the photosensitive chip in the thickness direction cover at least a portion of the hollow hole.

[0093] S1040, mounting the circuit board to the first side of the reinforcing plate, and making the through mounting openings of the circuit board along the thickness direction be sleeved on the photosensitive chip.

[0094] S1050, molding the molding material on the side of the circuit board facing away from the reinforcing plate to form a molded body.

[0095] The method 1000 uses an adhesive to assemble the photosensitive component, which has a strong structure and a small volume. The method can manufacture a photosensitive component with good heat dissipation and good adaptability.

[0096] In an exemplary embodiment, before step S1040 , the method further includes: manufacturing a circuit board.

[0097] In an exemplary embodiment, the method 1000 further includes, after step S1040, electrically connecting the photosensitive chip to electronic components on the circuit board via electrical connection elements.

[0098] Specifically, a mold can be provided. When manufacturing the photosensitive component, the photosensitive chip, the reinforcement plate and the circuit board are placed in the mold. The mold can include an upper mold, which can be respectively attached to the upper surface of the photosensitive chip and the upper surface of the circuit board to form a cavity. The mold can also include auxiliary tooling, which can support the bottom of the photosensitive chip. Then the molding material is injected into the mold, specifically into the cavity. After the molding material is cured, a molded body of a preset shape is formed. The molded body fixes the photosensitive chip and the circuit board as one, and further fixes the reinforcement plate as one. The molding material can be a thermoplastic material or a thermosetting material, for example, nylon, polypropylene (PP), epoxy resin, etc. can be selected.

[0099] At least a portion of the non-photosensitive area, at least a portion of the circuit board, and the interval are integrally encapsulated by a molded body. This integrated encapsulation method is different from the traditional method of gluing a base to press or fix the photosensitive chip. On the one hand, the shape of the molded body formed by molding is easier to control and has good surface flatness, which can further provide flat installation conditions for the installation of other parts (such as color filters, lens assemblies or drivers, etc.), helping to ensure that the optical axis state of the assembled camera module is good. On the other hand, the bonding space occupied by glue is saved, and there is no need to consider the matching gap between the photosensitive chip and the base, which helps to reduce the height of the camera module.

[0100] In an exemplary embodiment, the method 1000 further includes: S1060 , disposing a color filter on a side of the molded body facing away from the circuit board.

[0101] In an exemplary embodiment, step S1060 includes: overlapping the outer periphery of the annular support lens holder on the side of the molded body facing away from the circuit board, and overlapping the color filter on the side of the inner periphery of the support lens holder facing away from the photosensitive chip.

[0102] In an exemplary embodiment, the method 1000 further includes: disposing at least one of a thermal conductive adhesive, a heat dissipation film, a heat reducing gap filler, and an electromagnetic interference absorber on the surface of the corresponding hollow hole of the photosensitive chip. The heat dissipation film may be mounted before or after S1020, while the thermal conductive adhesive, the heat reducing gap filler, or the electromagnetic interference absorber is usually applied after S1020.

[0103] The embodiment of the present application also provides a method for manufacturing a camera module, comprising: assembling the photosensitive component obtained by the aforementioned method 1000 with a lens component. The lens component may be located in the photosensitive direction of the photosensitive component. The optical axis of the lens component may correspond to the center position of the photosensitive chip of the photosensitive component.

[0104] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of protection involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the technical concept. For example, the above features are replaced with (but not limited to) technical features with similar functions in the present application.

Claims

1. A photosensitive component, characterized in that: include: A reinforcing plate having a first side and a second side opposite to each other in a thickness direction, and a hollow hole connecting the first side and the second side; A photosensitive chip is arranged on the first side of the reinforcing plate, and its projection in the thickness direction covers the hollow hole. In the cross section in the thickness direction, the portion of the photosensitive chip corresponding to the hollow hole accounts for 50% to 80% of the total area of ​​the photosensitive chip. The side of the photosensitive chip facing away from the reinforcing plate includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A circuit board is arranged on the first side of the reinforcing plate and comprises a mounting opening penetrating along the thickness direction and sleeved on the photosensitive chip, a hole wall of the mounting opening is spaced from the outer periphery of the photosensitive chip, and a partial area of ​​a surface of one side of the photosensitive chip facing the reinforcing plate is exposed outside the reinforcing plate and the circuit board; as well as The molded body is formed integrally by molding the molding material, and at least a portion of the non-photosensitive area, at least a portion of the circuit board and the interval are encapsulated by the formed molded body, and the molded body is simultaneously connected to the photosensitive chip, the reinforcement plate and the circuit board.

2. The photosensitive component according to claim 1, wherein: In the radial direction of the thickness direction, the molded body is located outside the hollow hole.

3. The photosensitive component according to claim 1, wherein: The reinforcing plate includes a frame-shaped member; In any radial direction of the photosensitive chip, the outer frame edge of the frame-shaped member is located outside the outer periphery of the photosensitive chip, and the inner frame edge of the frame-shaped member is located inside the outer periphery of the photosensitive chip.

4. The photosensitive component according to claim 3, wherein: The shape of the frame-shaped component is a rectangular frame; In any radial direction of the photosensitive chip, the distance between the inner frame edge of the rectangular frame and the outer periphery of the photosensitive chip is not less than 1 mm.

5. The photosensitive component according to claim 4, wherein: The reinforcing plate also includes an auxiliary supporting member, which is disposed in a frame opening of the frame-shaped member and is fixedly connected to the photosensitive chip.

6. The photosensitive component according to claim 1, wherein: The reinforcement plate also includes a heightening member located in the mounting opening.

7. The photosensitive component according to claim 1, wherein: The photosensitive chip is electrically connected to the circuit board via an electrical connection element.

8. The photosensitive component according to claim 7, wherein: The photosensitive chip is electrically connected to the side of the circuit board facing away from the reinforcement plate through an electrical connection element.

9. The photosensitive component according to claim 8, wherein: The molded body is used to wrap the electrical connection element.

10. The photosensitive component according to claim 1, wherein: The molded body is also used to wrap the electronic components arranged on the side of the circuit board facing away from the reinforcement plate.

11. The photosensitive component according to claim 10, wherein: The molded body comprises a first supporting portion and a first fixing portion located outside the first supporting portion in the radial direction of the mounting opening; The first supporting portion is fixedly connected to the non-photosensitive area and passes through the gap to be fixedly connected to the reinforcing plate; The first fixing portion is fixedly connected to the circuit board.

12. The photosensitive component according to any one of claims 1 to 11, wherein: At least one of a thermal conductive adhesive, a heat dissipation film, a heat-reducing gap filler and an electromagnetic interference absorber is arranged on the surface of the photosensitive chip corresponding to the hollow hole.

13. The photosensitive component according to claim 1, wherein: The invention also comprises a color filter, wherein the color filter is arranged on a side of the molded body facing away from the circuit board.

14. The photosensitive component according to claim 13, wherein: It also includes a support mirror seat, which is annular, and the outer periphery of the support mirror seat is overlapped with the side of the molded body facing away from the circuit board; The inner periphery of the support mirror seat is located outside the effective area of ​​the photosensitive chip, and the side of the inner periphery of the support mirror seat facing away from the photosensitive chip is used to overlap the color filter; The molded body is located radially outside the color filter.

15. The photosensitive component according to claim 14, wherein: A sink is provided on the side of the inner periphery of the supporting mirror seat facing away from the photosensitive chip, and the bottom of the sink overlaps the color filter; An annular groove is arranged on the side of the outer periphery of the supporting lens seat facing the photosensitive chip, and the bottom of the annular groove is used to overlap the mold body.

16. A camera module, characterized in that: It comprises a photosensitive component and a lens component as described in any one of claims 1 to 15.

17. A method for manufacturing a photosensitive component, characterized in that: include: forming a reinforcing plate having a hollow hole, wherein the hollow hole communicates a first side and a second side of the reinforcing plate that are opposite to each other in a thickness direction; applying adhesive to the first side of the reinforcement plate; Mounting a photosensitive chip to the first side of the reinforcing plate so that the projection of the photosensitive chip in the thickness direction covers the hollow hole, and in a cross section in the thickness direction, a portion of the photosensitive chip corresponding to the hollow hole accounts for 50% to 80% of the total area of ​​the photosensitive chip, and a side of the photosensitive chip facing away from the reinforcing plate includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area; Mounting the circuit board to the first side of the reinforcing plate, and making the mounting opening of the circuit board penetrating along the thickness direction be sleeved on the photosensitive chip, with a gap between the hole wall of the mounting opening and the outer periphery of the photosensitive chip, and a partial area of ​​the surface of the photosensitive chip on one side facing the reinforcing plate being exposed outside the reinforcing plate and the circuit board; as well as The molding material is molded on the first side of the reinforcement plate to form a molded body, wherein at least a portion of the non-photosensitive area, at least a portion of the circuit board and the gap are encapsulated by the formed molded body, and the molded body is simultaneously connected to the photosensitive chip, the reinforcement plate and the circuit board.

18. The method according to claim 17, wherein: Also includes: The color filter is arranged on the side of the molded body facing away from the circuit board.

19. The method according to claim 18, wherein: Also includes: Overlapping the outer periphery of the annular support mirror seat on the side of the molded body facing away from the circuit board; The color filter is overlapped on the side of the inner periphery of the supporting lens seat facing away from the photosensitive chip.

20. The method according to claim 17, wherein: Also includes: At least one of a thermal conductive adhesive, a heat dissipation film, a heat reducing gap filler and an electromagnetic interference absorber is arranged on the surface of the photosensitive chip corresponding to the hollow hole.

21. A method for manufacturing a camera module, characterized in that: include: Assemble the photosensitive component obtained by the method as described in any one of claims 17 to 20 with the lens component.

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