Wafer cleaning apparatus and wafer cleaning system

Abstract

The present disclosure relates to the technical field of wafer cleaning, and particularly relates to a wafer cleaning device and a wafer cleaning system. The wafer cleaning device comprises a liquid inlet pipe, a first liquid outlet pipe, a first valve and a liquid supply device. The liquid inlet pipe has an inlet end and an outlet end, and the outlet end is arranged towards a wafer to be cleaned. The pipe wall of the liquid inlet pipe is outwardly protruded to form a protruding part, and the protruding part has a cavity which is in communication with the inside of the liquid inlet pipe. One end of the first liquid outlet pipe is in communication with the cavity, and the other end is in communication with a container. The first valve is arranged on the liquid inlet pipe, and the first valve is located between the protruding part and the outlet end. The liquid supply device is in communication with the inlet end of the liquid inlet pipe, and is used for inputting cleaning liquid into the liquid inlet pipe. The wafer cleaning device has a shorter shutdown waiting time, thereby improving the utilization rate of the cleaning device.

Description

Technical Field

[0001] This disclosure relates to the field of wafer cleaning technology, and in particular to a wafer cleaning device and a wafer cleaning system. Background Technology

[0002] With the rapid development of society, the application of semiconductor devices is becoming increasingly widespread, and the demand for wafers used to manufacture semiconductor devices is also increasing explosively. During the wafer processing, contaminants such as organic matter, particles, and oxides inevitably adhere to the wafer surface. To ensure wafer quality, cleaning equipment is used to spray cleaning fluid onto the wafer to remove these contaminants.

[0003] Currently, the downtime of wafer cleaning equipment is relatively long, resulting in short normal operating time and low utilization rate of the cleaning equipment.

[0004] The information disclosed in the background section is only for enhancing the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to provide a wafer cleaning equipment and a wafer cleaning system that can reduce downtime and thus improve the utilization rate of the cleaning equipment.

[0006] To achieve the above-mentioned objectives, the present disclosure adopts the following technical solution:

[0007] According to one aspect of this disclosure, a wafer cleaning apparatus is provided, the wafer cleaning apparatus comprising:

[0008] The liquid inlet pipe has an inlet end and an outlet end, with the outlet end facing the wafer to be cleaned; the wall of the liquid inlet pipe protrudes outward to form a protrusion, the protrusion having a cavity, the cavity communicating with the interior of the liquid inlet pipe;

[0009] The first drain pipe has one end connected to the cavity and the other end connected to a container;

[0010] A first valve is provided on the inlet pipe, and the first valve is located between the protrusion and the outlet end;

[0011] A liquid supply device, connected to the inlet end, is used to input cleaning liquid into the liquid inlet pipe.

[0012] In one exemplary embodiment of this disclosure, the inlet pipe includes a first section and a second section, the protrusion is located at the connection between the first section and the second section, and the first section and the second section are arranged at an angle to each other in the opposite direction of the protrusion.

[0013] In one exemplary embodiment of this disclosure, the inner wall of the liquid inlet pipe is provided with bubble spikes, the bubble spikes are cone-shaped, and the bottom surface of the bubble spikes is located on the inner wall.

[0014] In one exemplary embodiment of this disclosure, the top of the bubble spike is inclined toward the inlet end.

[0015] In one exemplary embodiment of this disclosure, the number of bubble spikes is multiple and they are divided into multiple bubble spike groups. Each bubble spike group includes multiple bubble spikes distributed circumferentially along the inlet pipe, and the multiple bubble spike groups are distributed axially along the inlet pipe.

[0016] In one exemplary embodiment of this disclosure, the inner surface of the cavity is a smooth curved surface.

[0017] In one exemplary embodiment of this disclosure, the wafer cleaning apparatus further includes:

[0018] The second drain pipe has one end connected to the inlet pipe and the other end connected to the container, and the diameter of the second drain pipe is smaller than the diameter of the inlet pipe.

[0019] In one exemplary embodiment of this disclosure, the second drain pipe is connected to the first drain pipe, and the second drain pipe is connected to the inlet pipe through the first drain pipe.

[0020] In one exemplary embodiment of this disclosure, the diameter of the second drain pipe is smaller than the diameter of the first drain pipe, and the diameter of the first drain pipe is smaller than the diameter of the inlet pipe.

[0021] In one exemplary embodiment of this disclosure, the wafer cleaning apparatus further includes:

[0022] The second valve is provided on the first drain pipe and is located between the connection between the second drain pipe and the first drain pipe and the container;

[0023] A photoelectric sensing device is disposed in a preset area of ​​the first drain pipe, the first drain pipe being a transparent pipe, and the photoelectric sensing device is used to detect the light flux of the preset area;

[0024] The controller is configured to control the first valve to close and the second valve to open when the luminous flux is lower than a preset value; and to control the first valve to open and the second valve to close when the luminous flux is higher than the preset value.

[0025] In one exemplary embodiment of this disclosure, the wafer cleaning apparatus further includes:

[0026] The third valve is located on the inlet pipe and between the protrusion and the inlet end.

[0027] According to another aspect of this disclosure, a wafer cleaning system is provided, the wafer cleaning system comprising:

[0028] A support stage for supporting wafers;

[0029] The wafer cleaning equipment described in any of the above embodiments, wherein the outlet end is positioned facing the support platform.

[0030] In the wafer cleaning equipment of this disclosure, air bubbles in the cleaning fluid adhere to the inner wall of the inlet pipe. When there are too many air bubbles on the inner wall of the inlet pipe, compared to the prior art solution of stopping the wafer processing machine, allowing the cleaning fluid to drain from the outlet of the inlet pipe, and finally flushing away the air bubbles, the wafer cleaning equipment of this application only needs to close the first valve to allow the cleaning fluid to drain into the container through the first drain pipe, bringing the air bubbles in the inlet pipe with it. Therefore, this wafer cleaning equipment can quickly remove air bubbles from the inlet pipe, thereby shortening the downtime, extending its normal operating time, and improving the utilization rate of the cleaning equipment. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0032] Figure 1 This is a schematic diagram of the structure of the wafer cleaning equipment according to the embodiments of this disclosure.

[0033] Figure 2 This is another structural schematic diagram of the wafer cleaning equipment according to an embodiment of the present disclosure.

[0034] Figure 3 This is a schematic diagram of the structure of the photoelectric sensing device according to an embodiment of the present disclosure.

[0035] Figure 4 This is a schematic diagram showing the connection of the controller, photoelectric sensing device, first valve, and second valve according to an embodiment of this disclosure.

[0036] Figure 5 This is a schematic diagram showing the flow direction of the cleaning fluid in the working state of the wafer cleaning equipment according to the present disclosure.

[0037] Figure 6 This is a schematic diagram showing the flow direction of the cleaning fluid in the defoaming state of the wafer cleaning equipment according to the present disclosure.

[0038] Figure 7 This is a schematic diagram showing the flow direction of the cleaning fluid when the wafer cleaning equipment of this disclosure is idle.

[0039] Figure 8 This is a schematic diagram showing the connection of the controller, flow meter, photoelectric sensor, first valve, second valve, third valve and fourth valve according to the embodiments of this disclosure.

[0040] In the diagram: 100, wafer; 101, support platform; 102, container; 1, inlet pipe; 11, protrusion; 110, cavity; 12, first section; 13, second section; 131, nozzle; 14, bubble spike; 2, liquid supply device; 3, first drain pipe; 4, first valve; 5, second drain pipe; 6, second valve; 7, photoelectric sensor; 71, light emitting end; 72, light receiving end; 8, controller; 9, flow meter; 10, third valve; 15, fourth valve. Detailed Implementation

[0041] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are set forth to give a full understanding of embodiments of this disclosure.

[0042] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details described, or other methods, components, materials, etc., can be employed. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the main technical concept of this disclosure.

[0043] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as the orientation of the examples shown in the accompanying drawings. It will be understood that if the icon's arrangement is flipped so that it is upside down, the component described as "up" will become the component described as "down". Other relative terms such as "high," "low," "top," "bottom," "left," and "right" also have similar meanings.

[0044] When a structure is "on" other structures, it may mean that the structure is integrally formed on the other structure, that the structure is "directly" set on the other structure, or that the structure is "indirectly" set on the other structure through another structure. The terms "a," "one," and "described" are used to indicate the existence of one or more elements / components / etc.; the terms "including" and "having" are used to indicate an open-ended inclusion meaning, and that other elements / components / etc. may exist in addition to the listed elements / components / etc. The terms "first" and "second," etc., are used only as markers and are not a limitation on the number of objects.

[0045] In related technologies, wafer cleaning solutions are typically mixed solutions of room-temperature CO2 water, hot plasma water, and APM solutions (including NH4OH and H2O2). When CO2 water is heated, its solubility decreases, causing CO2 bubbles to precipitate. These bubbles disrupt the flow rate of the cleaning solution, leading to unstable wafer etching rates. Furthermore, the aggregation of these bubbles can create larger bubbles, which can cause malfunctions in the valves of the wafer cleaning equipment, preventing the cleaning solution from being sprayed out properly and resulting in defective wafers. Therefore, when too many bubbles accumulate in the pipes, the wafer cleaning equipment will shut down and alarm, alerting the operator to remove the bubbles from the pipes.

[0046] Currently, the debubbling method is manual. Specifically, the valve on the pipeline is opened to its maximum, and the maximum flow rate of cleaning fluid is used to flush away the air bubbles in the pipeline. During this process, the wafer processing machine stops working, and it needs to be restarted after the debubbling process is complete. However, restarting the processing machine takes a long time, and the downtime of the wafer cleaning equipment results in a short normal operating time, leading to low utilization of the wafer cleaning equipment.

[0047] To address the aforementioned problems, this disclosure provides a wafer cleaning apparatus for cleaning a wafer 100. For example... Figure 1 As shown, the wafer 100 can be placed on the support stage 101, which is used to support the wafer 100. Of course, the support stage 101 can also collect and discharge the cleaning fluid sprayed onto the wafer, which will not be described in detail here.

[0048] like Figure 1 As shown, the wafer cleaning equipment may include an inlet pipe 1, a liquid supply device 2, a first drain pipe 3, and a first valve 4, wherein:

[0049] The inlet pipe 1 may have an inlet end and an outlet end. The inlet end may be connected to the liquid supply device 2, which is used to input cleaning liquid into the inlet pipe 1. The outlet end may be set toward the wafer 100 to be cleaned. The pipe wall of the inlet pipe 1 may protrude outward to form a protrusion 11. The protrusion 11 may have a cavity 110 communicating with the interior of the inlet pipe 1. One end of the first drain pipe 3 may be connected to the cavity 110 and the other end may be connected to a container 102. The container 102 is used to collect cleaning liquid. The container 102 may be a component of the wafer cleaning equipment. Of course, it may also be a drainage pit set on the ground. No special limitation is made here. The first valve 4 may be set on the inlet pipe 1, and the first valve 4 may be located between the protrusion 11 and the outlet end of the inlet pipe 1.

[0050] Compared to existing technologies that require stopping the processing machine and draining the cleaning solution from the outlet of the inlet pipe 1, the wafer cleaning equipment of this application only needs to close the first valve 4 to allow the cleaning solution to drain into the container 102 via the first drain pipe 3, thereby carrying away air bubbles in the inlet pipe 1. Therefore, the wafer cleaning equipment of this embodiment can shorten downtime, thereby extending its normal operating time and improving the utilization rate of the wafer cleaning equipment.

[0051] The components of the wafer cleaning equipment provided in this disclosure will now be described in detail with reference to the accompanying drawings:

[0052] like Figure 1 As shown, the wall of the inlet pipe 1 can protrude outward to form a protrusion 11. The protrusion 11 can be cylindrical or hemispherical, etc., which will not be listed here. At the same time, the protrusion 11 can have a cavity 110 communicating with the interior of the inlet pipe 1. The cavity 110 is used to collect and gather air bubbles in the cleaning fluid. Therefore, the inner surface of the cavity 110 can be a smooth curved surface, which is conducive to the flow and aggregation of air bubbles.

[0053] The liquid inlet pipe 1 may include a first section 12 and a second section 13, wherein: the first section 12 may have the above-mentioned inlet end, and the second section 13 may have the above-mentioned outlet end, and the outlet end may be provided with a nozzle 131, and the cleaning liquid flows through the nozzle 131 to form a powerful jet that rushes toward the wafer 100.

[0054] For example, the nozzle 131 can be made of hard materials that are resistant to erosion, such as cemented carbide or ceramics, and the shape of the nozzle 131 can be conical, hyperboloid, or constant speed, etc., which will not be listed here.

[0055] Meanwhile, the first segment 12 and the second segment 13 can be arranged at an angle to each other on the opposite side of the protrusion 11. That is, the protrusion 11 can be located at the connection between the first segment 12 and the second segment 13. At this time, the first segment 12, the second segment 13 and the protrusion 11 are integrally formed, thereby improving the airtightness of the liquid inlet pipe 1 and the entire wafer cleaning equipment.

[0056] Of course, the first section 12, the second section 13 and the protrusion 11 in the liquid inlet pipe 1 can also be separate components. That is to say, the first section 12 and the second section 13 can be two separate pipes, the protrusion 11 can be a separate collection container, and the two separate pipes can be connected at an angle to each other on both sides of the wafer cleaning equipment by welding, bonding or other means.

[0057] For example, the angle between the first segment 12 and the second segment 13 can be an acute angle. Of course, the angle can also be an obtuse angle less than 180°, without any special limitation here.

[0058] It is important to note that when arranging and installing the wafer cleaning equipment, the protrusion 11 of the liquid inlet pipe 1 should be set upwards. The included angle makes the cavity 110 located at the highest point of the first section 12. Of course, the cavity 110 is also located at the highest point of the second section 13. In this way, the air bubbles in the cleaning liquid in the first section 12 and the second section 13 can automatically float to the cavity 110 under the action of buoyancy, thereby making the flow rate of the cleaning liquid sprayed onto the wafer 100 more stable, and thus improving the stability of the etching rate of the wafer 100.

[0059] As mentioned earlier, large air bubbles can cause abnormal valve operation, preventing the cleaning fluid from being sprayed out properly, thus resulting in 100% defective wafers. Figure 1 As shown, bubble punctures 14 can be provided on the inner wall of the liquid inlet pipe 1. These bubble punctures 14 can puncture the bubbles in the liquid inlet pipe 1, thereby breaking down larger bubbles into smaller bubbles. In other words, the wafer cleaning equipment of this embodiment can reduce the generation of large bubbles, thereby improving the processing yield of wafer 100 and reducing the occurrence of equipment alarms.

[0060] The bubble spike 14 can be cone-shaped. For example, the cone can be a circular cone or a pyramid, without any special limitation. At the same time, the bottom surface of the bubble spike 14 can be located on the inner wall of the liquid inlet pipe 1. That is to say, the bottom surface of the cone or pyramid can be connected to the inner wall of the liquid inlet pipe 1 by means of bonding, riveting, etc., which will not be described in detail here.

[0061] Of course, the top of the bubble spike 14 should be tilted towards the inlet end of the liquid inlet pipe 1. That is to say, the bubble spike 14 is a barb, so that the cleaning liquid can come into contact with the bubble spike 14 during the flow, thereby breaking down the larger bubbles into smaller bubbles.

[0062] For example, the angle between the top of the bubble piercing 14 and the inner wall of the inlet pipe 1 can be in the range of 20° to 60°. Of course, the angle can also be other values, as long as it can pierce the bubbles in the cleaning fluid. No special limitation is made here.

[0063] The number of bubble punctures 14 can be multiple, and the multiple bubble punctures 14 can be divided into multiple bubble puncture groups. Each bubble puncture group can include multiple bubble punctures 14 distributed circumferentially along the liquid inlet pipe 1, and the multiple bubble puncture groups can be distributed axially along the liquid inlet pipe 1, thereby obtaining a better puncture effect.

[0064] It should be noted that after the bubble spikes 14 break down the larger bubbles into smaller ones, the angle between the bubble spikes 14 and the inner wall of the liquid inlet pipe 1 also has a certain blocking effect on the bubbles, reducing the amount of bubbles in the cleaning solution sprayed onto the wafer 100, and thus improving the stability of the wafer 100 etching.

[0065] Therefore, the wafer cleaning equipment of this embodiment can puncture large bubbles as they rise to the cavity 110, thereby stabilizing the flow rate of the cleaning fluid and the etch rate of the wafer, and thus improving the wafer yield.

[0066] like Figure 1 As shown, the liquid supply device 2 is connected to the inlet end of the liquid inlet pipe 1 and is used to input cleaning liquid into the liquid inlet pipe 1. For example, the liquid supply device 2 can be a liquid supply pipe or a liquid supply tank. Of course, the liquid supply device 2 may also include a water pump, which is connected to the liquid supply pipe or the liquid supply tank and is used to increase the pressure of the liquid supply pipe or the liquid supply tank. This will not be described in detail here.

[0067] like Figure 1 As shown, one end of the first drain pipe 3 can be connected to the cavity 110 and the other end can be connected to a container 102. The diameter of the first drain pipe 3 can be smaller than the diameter of the inlet pipe 1, so as to facilitate the discharge of the cleaning liquid in the inlet pipe 1.

[0068] For example, the container 102 can be a drainage pool or a drainage pipe, without any special limitation. Of course, the container 102 can be connected to the plant's gravity drain, so that the cleaning fluid can be treated and discharged to avoid environmental pollution.

[0069] It should be noted that one end of the first drain pipe 3 can be connected to the top of the cavity 110. In other words, the first drain pipe 3 is set higher than the inlet pipe 1, which makes it easier for the bubbles collected in the cavity 110 to be discharged into the first drain pipe 3, thereby improving the defoaming effect of the wafer cleaning equipment.

[0070] like Figure 1 As shown, the first valve 4 can be installed on the inlet pipe 1, and the first valve 4 can be located between the protrusion 11 and the outlet end of the inlet pipe 1, for adjusting the flow rate of the cleaning fluid sprayed onto the wafer 100. Furthermore, the first valve 4 can be installed close to the protrusion 11, so that after the first valve 4 is closed, all the cleaning fluid in the inlet pipe 1 can be discharged into the container 102 through the first drain pipe 3, thereby improving the defoaming effect.

[0071] like Figure 2 As shown, the wafer cleaning equipment of this embodiment may further include a second drain pipe 5. One end of the second drain pipe 5 may be connected to the inlet pipe 1, and the other end may be connected to the container 102. The diameter of the second drain pipe 5 is smaller than the diameter of the inlet pipe 1, thereby facilitating the discharge of cleaning fluid from the second drain pipe 5. Of course, the second drain pipe 5 may also be connected to the first drain pipe 3. In this case, the second drain pipe 5 and the inlet pipe 1 are connected through the first drain pipe 3.

[0072] Additionally, the wafer cleaning equipment of this disclosure may further include a second valve 6, a photoelectric sensor 7, and a controller 8, wherein:

[0073] The second valve 6 can be installed on the first drain pipe 3, and is located between the connection between the first drain pipe 3 and the second drain pipe 5 and the container 102. As mentioned above, the diameter of the second drain pipe 5 is smaller than the diameter of the inlet pipe 1, and the diameter of the first drain pipe 3 is smaller than the diameter of the inlet pipe 1. Furthermore, the diameter of the second drain pipe 5 can be smaller than the diameter of the first drain pipe 3.

[0074] For example, the diameter of the first drain pipe 3 can be 70% to 80% of the diameter of the inlet pipe 1, while the diameter of the second drain pipe 5 can be 20% to 30% of the diameter of the inlet pipe 1. These details will not be described in detail here.

[0075] The photoelectric sensor 7 can be installed in a preset area of ​​the first drain pipe 3 to detect the light flux in the preset area. It should be noted that the first drain pipe 3 must be a transparent pipe in order to complete the light flux detection.

[0076] As mentioned earlier, the bubbles gathered in the cavity 110 will move to a position near the cavity 110 under the action of buoyancy and cleaning fluid. Therefore, this preset area can be set close to the cavity 110. Of course, the preset area can also be located at any position between the connection between the first drain pipe 3 and the second drain pipe 5 and the container 102, and no special limitation is made here.

[0077] Specifically, such as Figure 3 As shown, the photoelectric sensing device 7 may include a light emitting end 71 and a light receiving end 72, wherein: the light emitting end 71 may be disposed in the aforementioned preset area for emitting light to the first drain pipe 3; the light receiving end 72 is disposed opposite to the light emitting end 71 for receiving the light from the light emitting end 71.

[0078] It is easy to understand that when there are more bubbles in the first drain pipe 3, the light flux of the preset area is smaller; when there are fewer bubbles in the first drain pipe 3, the light flux of the preset area is larger. The specific correspondence will not be described in detail here.

[0079] like Figure 4As shown, the controller 8 can be connected to the photoelectric sensing device 7 via wired or wireless means, without special limitation. Of course, the controller 8 can also be connected to the first valve 4 and the second valve 6 to control the opening and closing of the first valve 4 and the second valve 6. In this case, both the first valve 4 and the second valve 6 are electromagnetic valves.

[0080] Therefore, when the light flux in the preset area is lower than a preset value (equivalent to the amount of air bubbles in the first drain pipe 3 being lower than a preset value), the controller 8 controls the first valve 4 to open and the second valve 6 to close. At this time, as Figure 5 As shown, the cleaning solution is sprayed onto the wafer 100 through the outlet end of the inlet pipe 1 and discharged into the container 102 through the second drain pipe 5, thereby driving the bubbles to move towards the first drain pipe 3 and keeping the cleaning solution in the first drain pipe 3 in a running water state. That is, the wafer cleaning equipment of this embodiment is in working state.

[0081] Furthermore, when the luminous flux in the preset area is higher than a preset value (equivalent to the amount of air bubbles in the first drain pipe 3 being higher than a preset value), the controller 8 can control the first valve 4 to close and the second valve 6 to open. At this time, such as Figure 6 As shown, the cleaning fluid is discharged into the container 102 through the first drain pipe 3 and the second drain pipe 5, thereby accelerating the discharge speed of bubbles. That is, the wafer cleaning equipment of this embodiment is in the bubble discharge state.

[0082] For example, the preset value of luminous flux can be 800 lumens to 1000 lumens. Of course, the preset value of luminous flux can also be other values, which are not specifically limited here.

[0083] It should be noted that when the first valve 4 is closed and the second valve 6 is closed, such as Figure 7 As shown, the cleaning fluid is discharged only through the second drain pipe 5. However, since the diameter of the second drain pipe 5 is much smaller than the diameter of the inlet pipe 1, the amount of cleaning fluid discharged is not much. At this time, the wafer cleaning equipment of this embodiment is idle.

[0084] like Figure 2 As shown, the wafer cleaning equipment of this embodiment may further include a flow meter 9, a third valve 10, and a fourth valve 15, wherein:

[0085] The flow meter 9 can be installed on the inlet pipe 1 and located between the first valve 4 and the outlet end of the inlet pipe 1. It is used to detect the flow rate of the cleaning fluid sprayed onto the wafer 100. The specifications of the flow meter 9 are not specifically limited here.

[0086] The third valve 10 can be installed on the inlet pipe 1 and located between the inlet end of the inlet pipe 1 and the protrusion 11. It is used to control the start or end of the cleaning process. Of course, the third valve 10 can also control the flow rate of the cleaning fluid entering the inlet pipe 1, which will not be described in detail here.

[0087] The fourth valve 15 can be installed on the second drain pipe 5 and located between the connection between the first drain pipe 3 and the second drain pipe 5 and the container 102, and is used to adjust the flow rate of the cleaning liquid flowing through the second drain pipe 5.

[0088] Therefore, when installing and debugging the wafer cleaning equipment, the flow rate of the cleaning fluid discharged from the idle wafer cleaning equipment through the second drain pipe 5 can be manually controlled through the fourth valve 15. At this time, the fourth valve 15 is a normal manual valve.

[0089] Of course, the fourth valve 15 can also be controlled automatically. For example... Figure 8 As shown, flow meter 9, third valve 10, and fourth valve 15 can be connected to controller 8. In this case, third valve 10 and fourth valve 15 are both solenoid valves. Thus, controller 8 can realize automatic monitoring of cleaning fluid flow and automated operation of the entire wafer cleaning equipment, which will not be described in detail here.

[0090] This common embodiment also provides a wafer cleaning system, which may include a support platform and any of the above-described wafer cleaning devices, wherein: the support platform is used to support the wafer, and the outlet end of the liquid inlet pipe in the wafer cleaning device is arranged facing the support platform. Of course, the support platform can also collect and discharge the cleaning liquid sprayed onto the wafer, which will not be described in detail here.

[0091] It should be understood that this disclosure is not limited to the detailed structure and arrangement of the components presented in this specification. This disclosure can have other embodiments and can be implemented and performed in various ways. The foregoing variations and modifications fall within the scope of this disclosure. It should be understood that this disclosure, as disclosed and defined in this specification, extends to all alternative combinations of two or more individual features mentioned or apparent in the text and / or drawings. All these different combinations constitute multiple alternative aspects of this disclosure. The embodiments described in this specification illustrate the best known mode for implementing this disclosure and will enable those skilled in the art to utilize this disclosure.

Claims

1. A wafer cleaning device, characterized in that, include: The liquid inlet pipe has an inlet end and an outlet end, with the outlet end facing the wafer to be cleaned; The wall of the inlet pipe protrudes outward to form a protrusion, the protrusion having a cavity that communicates with the interior of the inlet pipe; The first drain pipe has one end connected to the cavity and the other end connected to a container; A first valve is provided on the inlet pipe, and the first valve is located between the protrusion and the outlet end; A liquid supply device, connected to the inlet end, is used to input cleaning liquid into the liquid inlet pipe; The inlet pipe includes a first section and a second section, the protrusion is located at the connection between the first section and the second section, and the first section and the second section are arranged at an angle to each other in the opposite direction of the protrusion; The inner wall of the inlet pipe is provided with bubble spikes, the bubble spikes are cone-shaped, and the bottom surface of the bubble spikes is located on the inner wall; The top of the bubble spike is angled toward the inlet end.

2. The wafer cleaning equipment according to claim 1, characterized in that, The number of bubble spikes is multiple, and they are divided into multiple bubble spike groups. Each bubble spike group includes multiple bubble spikes distributed circumferentially along the inlet pipe, and the multiple bubble spike groups are distributed axially along the inlet pipe.

3. The wafer cleaning equipment according to claim 1, characterized in that, The inner surface of the cavity is a smooth curved surface.

4. The wafer cleaning equipment according to claim 1, characterized in that, The wafer cleaning equipment also includes: The second drain pipe has one end connected to the inlet pipe and the other end connected to the container, and the diameter of the second drain pipe is smaller than the diameter of the inlet pipe.

5. The wafer cleaning equipment according to claim 4, characterized in that, The second drain pipe is connected to the first drain pipe, and the second drain pipe is connected to the inlet pipe through the first drain pipe.

6. The wafer cleaning equipment according to claim 4, characterized in that, The diameter of the second drain pipe is smaller than the diameter of the first drain pipe, and the diameter of the first drain pipe is smaller than the diameter of the inlet pipe.

7. The wafer cleaning equipment according to claim 6, characterized in that, The wafer cleaning equipment also includes: The second valve is provided on the first drain pipe and is located between the connection between the second drain pipe and the first drain pipe and the container; A photoelectric sensing device is disposed in a preset area of ​​the first drain pipe, the first drain pipe being a transparent pipe, and the photoelectric sensing device is used to detect the light flux of the preset area; The controller is configured to control the first valve to close and the second valve to open when the luminous flux is lower than a preset value; and to control the first valve to open and the second valve to close when the luminous flux is higher than the preset value.

8. The wafer cleaning equipment according to claim 1, characterized in that, The wafer cleaning equipment also includes: The third valve is located on the inlet pipe and between the protrusion and the inlet end.

9. A wafer cleaning system, characterized in that, include: A support platform for supporting wafers; The wafer cleaning apparatus according to any one of claims 1 to 8, wherein: the outlet end is disposed toward the support platform.

Images