Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method. A main robot hand enters a processing unit. A pre-processing substrate held by the hand is delivered to a carrying-in position of the processing unit. After the pre-processing substrate is delivered to the carrying-in position, a post-processing substrate is received from a carrying-out position of the processing unit by the hand. After the post-processing substrate is received from the carrying-out position, the hand is caused to exit from the processing unit. The pre-processing substrate is processed by the processing unit.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing apparatus and a substrate processing method that perform a predetermined process on a substrate. BACKGROUND

[0002] A substrate processing apparatus is used to perform various processes on various substrates such as a flat panel display (FPD) substrate, a semiconductor substrate, an optical disc substrate, a magnetic disc substrate, a magneto-optical disc substrate, a reticle substrate, a ceramic substrate, or a solar cell substrate, which are used in liquid crystal display devices or organic EL (Electro Luminescence) display devices.

[0003] For example, Japanese Patent Application Publication No. 2013-77639 describes a substrate processing apparatus that includes a plurality of processing units and a conveyance mechanism that conveys a substrate between the plurality of processing units using first and second robot hands. The plurality of processing units include a heat processing unit, a cooling unit, and a coating processing unit that perform a heat process, a cooling process, and a coating process, respectively, on a substrate. The conveyance mechanism moves between the plurality of processing units in a state in which the substrate is held by the first robot hand and is not held by the second robot hand. In addition, the conveyance mechanism conveys the processed substrate out of the processing unit at the conveyance destination using the second robot hand and conveys the unprocessed substrate held by the first robot hand into the processing unit. SUMMARY

[0004] In the substrate processing apparatus described in Japanese Patent Application Publication No. 2013-77639, the first and second robot hands of the conveyance mechanism continuously perform the conveying of the processed substrate out of the processing unit and the conveying of the unprocessed substrate into the processing unit. Therefore, it is considered that the throughput is improved. However, in order to convey the processed substrate out of the processing unit at the conveyance destination, the conveyance mechanism must move between the plurality of processing units in a state in which neither robot hand holds the substrate. In this case, the number of substrates that can be conveyed at one time is limited to be less than the number of robot hands, so there is a limit to improving the throughput.

[0005] An object of the present application is to provide a substrate processing apparatus and a substrate processing method that can improve the throughput.

[0006] (1) A substrate processing apparatus according to one aspect of the present application includes: a processing unit that has a conveyance-in position at which an unprocessed substrate is conveyed in and a conveyance-out position at which a processed substrate is conveyed out, and that processes the unprocessed substrate; and a substrate conveyance section that has a conveyance holding section configured to selectively hold the unprocessed substrate and the processed substrate. The conveyance holding section receives the processed substrate from the conveyance-out position after the unprocessed substrate is held in the processing unit and is handed over to the conveyance-in position, and exits from the processing unit after the processed substrate is received.

[0007] In this substrate processing apparatus, the carrying holding section of the substrate carrying section enters the processing unit. The pre-processing substrate held by the carrying holding section is delivered to the carrying-in position of the processing unit. After the pre-processing substrate is delivered to the carrying-in position, the post-processing substrate is received from the carrying-out position of the processing unit by the carrying holding section. After the post-processing substrate is received from the carrying-out position, the carrying holding section is caused to exit from the processing unit. The pre-processing substrate is processed by the processing unit.

[0008] According to this configuration, even when the post-processing substrate exists in the processing unit, the pre-processing substrate can be carried into the processing unit. Therefore, the post-processing substrate can be received by the carrying holding section after the pre-processing substrate is delivered to the processing unit. Therefore, it is not necessary to provide the carrying holding section that does not hold the substrate in order to receive the post-processing substrate. Thus, the throughput can be improved in correspondence with the number of carrying holding sections.

[0009] (2) The carrying-in position and the carrying-out position can also be arranged in a manner of being arranged in the vertical direction. In this case, the floor area (occupied area) of the processing unit can be reduced.

[0010] (3) A plurality of processing units can also be provided, a plurality of carrying holding sections are provided in a manner of corresponding to the plurality of processing units respectively, and the plurality of substrate carrying sections receive the post-processing substrate from the carrying-out position after delivering the pre-processing substrate to the carrying-in position by entering the corresponding processing unit, and exit from the corresponding processing unit after receiving the post-processing substrate. In this case, the action of delivering the pre-processing substrate and receiving the post-processing substrate can be continuously performed for the plurality of processing units. Thus, the throughput can be further improved.

[0011] (4) The processing unit can also include a first substrate holding section that holds the substrate carried into the carrying-in position, a first processing section that processes the substrate held by the first substrate holding section, a second substrate holding section that holds the substrate carried from the carrying-out position, a delivery section that delivers the substrate processed by the first processing section from the first substrate holding section to the second substrate holding section, and a second processing section that processes the substrate held by the second substrate holding section. In this case, the substrate carried into the carrying-in position and processed by the first and second processing sections can be carried out from the carrying-out position as the post-processing substrate.

[0012] (5) The first processing section and the second processing section can also process the substrate by different processes. In this case, the different processes can be efficiently performed for the substrate.

[0013] (6) The first processing section can perform cleaning of the central region of the lower surface of the substrate, and the second processing section can perform cleaning of the outer region of the lower surface of the substrate surrounding the central region of the lower surface. In this case, the entire lower surface of the substrate can be cleaned with high efficiency.

[0014] (7) Another aspect of the substrate processing method of the present application includes the steps of: entering the carrying holding section of the substrate carrying section into the processing unit; delivering the pre-processing substrate held by the carrying holding section to the carrying-in position of the processing unit; after delivering the pre-processing substrate to the carrying-in position, receiving the post-processing substrate from the carrying-out position of the processing unit using the carrying holding section; after receiving the post-processing substrate from the carrying-out position, exiting the carrying holding section from the processing unit; and processing the pre-processing substrate using the processing unit.

[0015] According to this substrate processing method, the pre-processing substrate can be carried into the processing unit even when the post-processing substrate is present in the processing unit. Therefore, the post-processing substrate can be received using the carrying holding section after the pre-processing substrate is delivered to the processing unit. Therefore, it is not necessary to provide a carrying holding section that does not hold a substrate in order to receive the post-processing substrate. Thus, the throughput can be improved in correspondence with the number of carrying holding sections. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present application.

[0017] Figure 2 is a schematic cross-sectional view of the substrate processing apparatus of Figure 1 along line J-J.

[0018] Figure 3 is a schematic plan view of a substrate cleaning apparatus according to Figure 1 .

[0019] Figure 4 is an external perspective view showing the internal configuration of the substrate cleaning apparatus according to Figure 3 .

[0020] Figure 5 is a block diagram showing the configuration of a control system of the substrate processing apparatus.

[0021] Figure 6 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus according to Figure 3 .

[0022] Figure 7 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus according to Figure 3 .

[0023] Figure 8is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0024] Figure 9 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0025] Figure 10 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0026] Figure 11 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0027] Figure 12 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0028] Figure 13 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0029] Figure 14 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0030] Figure 15 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0031] Figure 16 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0032] Figure 17 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 3

[0033] Figure 18 is a flowchart showing the substrate processing performed by the control apparatus of Figure 5

[0034] Figure 19 is a flowchart showing the substrate processing performed by the control apparatus of Figure 5 DETAILED DESCRIPTION

[0035] ​​​​​​​​​​​​Hereinafter, the substrate processing apparatus and substrate processing method according to embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, "substrate" refers to a semiconductor substrate (wafer), a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (ElectroLuminescence) display device, a substrate for an optical disc, a substrate for a magnetic disk, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, etc. Furthermore, in this embodiment, the upper surface of the substrate is the circuit formation surface (front side), and the lower surface of the substrate is the surface opposite to the circuit formation surface (back side). Additionally, in this embodiment, the substrate has a circular shape except for the notch.

[0036] (1) Composition of substrate processing device

[0037] Figure 1 This is a schematic top view of a substrate processing apparatus according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic cross-sectional view of the substrate processing apparatus 100 on the JJ line. (See attached image.) Figure 1 As shown, the substrate processing apparatus 100 of this embodiment includes a loading block 110 and a processing block 120. The loading block 110 and the processing block 120 are arranged adjacent to each other.

[0038] Loading block 110 includes multiple (four in this example) carrier placement stages 140 and a conveying unit 150. The multiple carrier placement stages 140 are connected to the conveying unit 150 and are arranged in a row at intervals. On each carrier placement stage 140, a carrier C that houses multiple substrates W is placed.

[0039] The indexing robot 200 and control device 170 are provided in the conveying section 150. The indexing robot 200 includes multiple (four in this example) robots Ia, Ib, Ic, Id, robot support component 210, and conveying drive unit 220.

[0040] The plurality of robots Ia to Id are configured to be able to hold a plurality of substrates W, respectively, and are disposed on the robot support member 210 in a state of being arranged at a fixed interval in the up-down direction. The robot support member 210 is formed in a manner of extending in one direction, and supports the plurality of robots Ia to Id so that the plurality of robots Ia to Id are able to advance and retreat in the one direction. The conveyance drive unit 220 is configured to be able to move in the horizontal direction (a direction in which the plurality of carrier placement stages 140 are arranged), and supports the robot support member 210 in a manner of being able to rotate around a vertical axis and be raised and lowered. Further, the conveyance drive unit 220 includes a plurality of motors and air cylinders, and moves the robot support member 210 in the horizontal direction, rotates the robot support member 210 around the vertical axis, and raises and lowers the robot support member 210, in order to convey the plurality of substrates W by the plurality of robots Ia to Id. In addition, the conveyance drive unit 220 advances and retreats the plurality of robots Ia to Id in the horizontal direction. The control device 170 includes a computer including a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory), and a storage device, and controls each of the constituent units in the substrate processing device 100.

[0041] The processing block 120 includes the cleaning units 161, 162, and the conveyance unit 163. The cleaning units 161, 163, and the cleaning unit 162 are arranged in order adjacent to the conveyance unit 150. In the cleaning units 161, 162, a plurality of (for example, four) substrate cleaning devices 1 are stacked in the up-down direction. Each of the substrate cleaning devices 1 has a carrying-in position for carrying in a substrate W before processing, and a carrying-out position for carrying out the substrate W after processing. Details of the configuration and operation of the substrate cleaning device 1 will be described below.

[0042] The main robot 300 is provided in the conveyance unit 163. The main robot 300 includes a plurality of (four in this example) robots Ma, Mb, Mc, Md, a robot support member 310, and a conveyance drive unit 320. The plurality of robots Ma to Md are configured to be able to hold a plurality of substrates W, respectively, and are disposed on the robot support member 310 in a state of being arranged in the up-down direction.

[0043] The robot support member 310 is formed so as to extend in one direction, and supports a plurality of robots Ma to Md so as to be able to individually advance and retreat in the one direction. The conveyance drive unit 320 supports the robot support member 310 so as to be able to rotate around a vertical axis and ascend and descend. Furthermore, the conveyance drive unit 320 includes a plurality of motors and air cylinders, and the robot support member 310 rotates around the vertical axis and ascends and descends so as to convey a plurality of substrates W with the plurality of robots Ma to Md. In addition, the conveyance drive unit 320 causes the plurality of robots Ma to Md to advance and retreat in the horizontal direction.

[0044] Between the loading block 110 and the processing block 120, a plurality of (four in this example) substrate placement portions PASS1 and a plurality of substrate placement portions PASS2 for transferring substrates W between the indexing robot 200 and the main robot 300 are arranged in a stacked manner. The plurality of substrate placement portions PASS1 are located higher than the plurality of (four in this example) substrate placement portions PASS2.

[0045] The plurality of substrate placement portions PASS2 are used for transferring substrates W from the indexing robot 200 to the main robot 300. The plurality of substrate placement portions PASS1 are used for transferring substrates W from the main robot 300 to the indexing robot 200. The intervals between the plurality of substrate placement portions PASS1 can be substantially equal to the intervals between the plurality of robots Ma to Md of the main robot 300. Similarly, the intervals between the plurality of substrate placement portions PASS2 can be substantially equal to the intervals between the plurality of robots Ma to Md of the main robot 300.

[0046] The indexing robot 200 takes out a substrate W before processing from any one of the plurality of carriers C placed on the plurality of carrier placement tables 140. In addition, the indexing robot 200 places the taken-out substrate W before processing on any one of the plurality of substrate placement portions PASS2. Furthermore, the indexing robot 200 receives a substrate W after processing placed on any one of the plurality of substrate placement portions PASS1 and accommodates it in an empty carrier C.

[0047] The main robot 300 receives the plurality of substrates W before processing placed on the plurality of substrate placement portions PASS2 with the plurality of robots Ma to Md, respectively. At this time, the main robot 300 can receive the plurality of substrates W in order with the plurality of robots Ma to Md. In the case where the intervals between the plurality of substrate placement portions PASS2 are substantially equal to the intervals between the plurality of robots Ma to Md, the main robot 300 can receive the plurality of substrates W simultaneously with the plurality of robots Ma to Md.

[0048] Next, the main robot 300 will transfer the multiple unprocessed substrates W received from the substrate placement section PASS2 using multiple robotic arms Ma to Md to the loading positions of the multiple substrate cleaning devices 1 in the cleaning section 161 or cleaning section 162. Then, the main robot 300 will use multiple robotic arms Ma to Md to receive the multiple processed substrates W placed at the loading positions of the multiple substrate cleaning devices 1.

[0049] Then, the main robot 300 places the multiple processed substrates W received from the substrate cleaning apparatus 1 by the multiple robotic arms Ma to Md onto multiple substrate placement sections PASS1. At this time, the main robot 300 can also place the multiple processed substrates W sequentially onto the multiple substrate placement sections PASS1. When the interval between the multiple substrate placement sections PASS1 is approximately equal to the interval between the multiple robotic arms Ma to Md, the main robot 300 can also use the multiple robotic arms Ma to Md to place the multiple substrates W simultaneously onto the multiple substrate placement sections PASS1.

[0050] (2) Composition of substrate cleaning equipment

[0051] Figure 3 yes Figure 1 A schematic top view of the substrate cleaning apparatus 1. Figure 4 It means Figure 3 A perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1, the X, Y, and Z directions are defined to clarify their positional relationships. Figure 3 and Figure 4 In future diagrams, the X, Y, and Z directions will be indicated using arrows. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction is equivalent to the vertical direction.

[0052] like Figure 3 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an end cleaning device 80, and an opening and closing device 90. These components are housed within the unit housing 2. Figure 3 In the diagram, dashed lines represent the unit housing 2.

[0053] The unit housing 2 has a rectangular bottom portion 2a and four sidewall portions 2b, 2c, 2d, and 2e extending upwards from the four sides of the bottom portion 2a. Sidewall portions 2b and 2c face each other, and sidewall portions 2d and 2e face each other. A rectangular opening is formed in the center of the sidewall portion 2b. This opening serves as a loading / unloading outlet 2x for the substrate W, used when loading and unloading the substrate W relative to the unit housing 2. Figure 4In the present embodiment, the in-out port 2x is indicated by a thick broken line. In the following description, the direction in the Y direction from the inside of the cell housing 2 through the in-out port 2x toward the outside of the cell housing 2 (the direction from the side wall portion 2c toward the side wall portion 2b) is referred to as the front direction, and the opposite direction (the direction from the side wall portion 2b toward the side wall portion 2c) is referred to as the rear direction.

[0054] In the region of the in-out port 2x and its vicinity in the side wall portion 2b, a shutter device 90 is provided. The shutter device 90 includes a shutter 91 configured to open and close the in-out port 2x, and a shutter drive portion 92 that drives the shutter 91. In the following description, the shutter 91 is indicated by a thick double dotted line. Figure 4

[0055] In the central portion of the bottom surface portion 2a, a pedestal device 30 is provided. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive portion 33. The linear guide 31 includes two rails, and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive portion 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0056] On the movable pedestal 32, the lower side holding device 20 and the lower surface cleaning device 50 are provided so as to be arranged in the Y direction. The lower side holding device 20 includes a suction holding portion 21 and a suction holding drive portion 22. The suction holding portion 21 is a so-called rotary chuck having a circular suction surface capable of suction holding the lower surface of the substrate W, and is configured to be rotatable about an axis (an axis in the Z direction) extending in the vertical direction. In the following description, the outline of the substrate W suction held by the lower side holding device 20 is indicated by a double dotted line. Figure 3

[0057] ​​The adsorption holding drive section 22 includes a motor. The motor of the adsorption holding drive section 22 is disposed on the movable base 32 in a manner that the rotational axis thereof protrudes upward. The adsorption holding section 21 is attached to the upper end of the rotational axis of the adsorption holding drive section 22. Further, in the rotational axis of the adsorption holding drive section 22, an attraction path for adsorbing and holding the substrate W in the adsorption holding section 21 is formed. The attraction path is connected to a suction device not shown. The adsorption holding drive section 22 rotates the adsorption holding section 21 around the rotational axis.

[0058] In the vicinity of the lower side holding device 20 on the movable base 32, a transfer device 40 is also provided. The transfer device 40 includes a plurality of (three in this case) support pins 41, a pin linking member 42, and a pin elevation drive section 43. The pin linking member 42 is formed in a manner that it surrounds the adsorption holding section 21 in plan view, and links the plurality of support pins 41. The plurality of support pins 41 extend upward from the pin linking member 42 by a fixed length in a state that they are linked to each other by the pin linking member 42. The pin elevation drive section 43 elevates and lowers the pin linking member 42 on the movable base 32. Thus, the plurality of support pins 41 are relatively elevated and lowered with respect to the adsorption holding section 21.

[0059] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection section 53, an elevation support section 54, a moving support section 55, a lower surface brush rotation drive section 55a, a lower surface brush elevation drive section 55b, and a lower surface brush moving drive section 55c. The moving support section 55 is configured to be movable in the Y direction with respect to the lower side holding device 20 within a fixed region on the movable base 32. As shown in Figure 4 the elevation support section 54 is provided on the moving support section 55 in a manner that it is elevatable and lowerable. The elevation support section 54 has an upper surface 54u that is inclined obliquely downward in a direction away from the adsorption holding section 21 (rearward in this case).

[0060] As shown in Figure 3 the lower surface brush 51 is formed of, for example, a PVA (polyvinyl alcohol) sponge or a PVA sponge in which abrasive grains are dispersed, and has a circular cleaning surface that can be brought into contact with the lower surface of the substrate W. Further, the lower surface brush 51 is attached to the upper surface 54u of the elevation support section 54 in a manner that the cleaning surface faces upward, and in a manner that the cleaning surface is rotatable around an axis that extends in the up-down direction through the center of the cleaning surface. The area of the cleaning surface of the lower surface brush 51 is larger than the area of the adsorption surface of the adsorption holding section 21.

[0061] The two liquid nozzles 52 are respectively attached to the upper surface 54u of the elevation support section 54 in a manner that they are located in the vicinity of the lower surface brush 51 with the liquid ejection ports thereof facing upward. The liquid nozzles 52 are connected to a lower surface cleaning liquid supply section 56 Figure 5). The lower surface cleaning liquid supply section 56 supplies a cleaning liquid to the liquid nozzle 52. The liquid nozzle 52 supplies the cleaning liquid supplied from the lower surface cleaning liquid supply section 56 to the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51. In the present embodiment, pure water (deionized water) is used as the cleaning liquid supplied to the liquid nozzle 52. In addition, with respect to the cleaning liquid supplied to the liquid nozzle 52, carbonated water, ozone water, hydrogen water, electrolytic ion water, SC1 (a mixed solution of ammonia and hydrogen peroxide water), TMAH (tetramethylammonium hydroxide), or the like can be used instead of pure water.

[0062] The gas spouting section 53 is a slit-like gas jet nozzle having a gas spouting port extending in one direction. The gas spouting section 53 is installed on the upper surface 54u of the lift support section 54 in a manner that it is located below the lower surface brush 51 and the adsorption holding section 21 in plan view and the gas jet port faces upward. The gas spouting section 53 is connected to the spouting gas supply section 57 Figure 5 ). The spouting gas supply section 57 supplies a gas to the gas spouting section 53. In the present embodiment, nitrogen gas is used as the gas supplied to the gas spouting section 53. The gas spouting section 53 jets the gas supplied from the spouting gas supply section 57 to the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51 and when the lower surface of the substrate W is dried as described below. In this case, a belt-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding section 21. With respect to the gas supplied to the gas spouting section 53, an inert gas such as argon gas or helium gas can be used instead of nitrogen gas.

[0063] The lower surface brush rotation drive section 55a includes a motor that rotates the lower surface brush 51 when the substrate W is cleaned by the lower surface brush 51. The lower surface brush lift drive section 55b includes a stepping motor or a cylinder that lifts the lift support section 54 with respect to the moving support section 55. The lower surface brush moving drive section 55c includes a motor that moves the moving support section 55 in the Y direction on the movable base 32. Here, the position of the lower side holding device 20 on the movable base 32 is fixed. Therefore, when the moving support section 55 is moved in the Y direction by the lower surface brush moving drive section 55c, the moving support section 55 is relatively moved with respect to the lower side holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower side holding device 20 on the movable base 32 is referred to as a close position, and the position of the lower surface cleaning device 50 when it is farthest from the lower side holding device 20 on the movable base 32 is referred to as a distant position.

[0064] In the central portion of the bottom surface section 2a, a cup device 60 is also provided. The cup device 60 includes a processing cup 61 and a cup drive section 62. The processing cup 61 is provided so as to be liftable in a manner that it surrounds the lower side holding device 20 and the base device 30 in plan view. The cup drive section 62 includes a motor that lifts the processing cup 61. Figure 4In the diagram, the processing cup 61 is indicated by a dashed line. The cup driving unit 62 moves the processing cup 61 between a lower cup position and an upper cup position based on which part of the lower surface of the substrate W is being cleaned by the lower surface brush 51. The lower cup position is when the upper end of the processing cup 61 is located at a height lower than the substrate W held by the adsorption and holding unit 21. Conversely, the upper cup position is when the upper end of the processing cup 61 is located at a height higher than the adsorption and holding unit 21.

[0065] At a height above the processing cup 61, a pair of upper holding devices 10A and 10B are arranged opposite each other across the base device 30 when viewed from above. The upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive unit 13A, and an upper chuck drive unit 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive unit 13B, and an upper chuck drive unit 14B.

[0066] The lower chucks 11A and 11B are arranged symmetrically in a vertical plane extending along the Y direction (front-to-back direction) relative to the center of the adsorption and holding portion 21 when viewed from above, and are movable along the X direction within a common horizontal plane. The lower chucks 11A and 11B each have two support plates capable of supporting the lower periphery of the substrate W from below. The lower chuck driving portions 13A and 13B move the lower chucks 11A and 11B either by bringing them closer together or by moving them further apart.

[0067] Like the lower chucks 11A and 11B, the upper chucks 12A and 12B are arranged symmetrically in a vertical plane extending along the Y direction (front-to-back direction) relative to the center of the adsorption and holding portion 21 when viewed from above, and are movable in the X direction within a common horizontal plane. The upper chucks 12A and 12B each have two holding tabs configured to abut against the outer peripheral end of the substrate W and hold the outer peripheral end of the substrate W. The upper chuck driving portions 14A and 14B move the upper chucks 12A and 12B by either bringing them closer together or by moving them further apart.

[0068] like Figure 3 As shown, an upper surface cleaning device 70 is provided on one side of the processing cup 61, near the upper holding device 10B in a top view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0069] The rotating support shaft 71 is located on the bottom part 2a and is supported by the upper surface cleaning drive unit 74 in a vertically extending manner, allowing it to be raised, lowered, and rotated. Figure 4As shown, arm 72 is positioned above the upper holding device 10B, extending horizontally from the upper end of the rotary support shaft 71. A spray nozzle 73 is mounted at the front end of arm 72.

[0070] The spray nozzle 73 is connected to the upper surface cleaning fluid supply unit 75. Figure 5 The upper surface cleaning fluid supply unit 75 supplies cleaning fluid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning fluid supplied to the spray nozzle 73, and nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning fluid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0071] Furthermore, the cleaning fluid supplied to the spray nozzle 73 can be replaced by carbonated water, ozone water, hydrogen water, electrolyzed ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), or TMAH (tetramethylammonium hydroxide), etc. Additionally, the gas supplied to the spray nozzle 73 can be replaced by an inert gas such as argon or helium, etc.

[0072] The upper surface cleaning drive unit 74 includes one or more pulse motors and cylinders, etc., to raise and lower the rotating support shaft 71 and to rotate the rotating support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc shape on the upper surface of the substrate W, which is held and rotated by the adsorption and holding unit 21, the entire upper surface of the substrate W can be cleaned.

[0073] like Figure 3 As shown, on the other side of the processing cup 61, near the upper holding device 10A in a top view, an end cleaning device 80 is provided. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, an inclined brush 83, and an inclined brush drive unit 84.

[0074] The rotating support shaft 81 is located on the bottom surface 2a and is supported by the inclined brush drive unit 84 in a vertically extending manner, allowing it to be raised, lowered, and rotated. Figure 4 As shown, arm 82 is positioned above the upper holding device 10A, extending horizontally from the upper end of the rotary support shaft 81. At the front end of arm 82, a beveled brush 83 is provided, protruding downwards and rotatable about an axis in the vertical direction.

[0075] The beveled brush 83 is formed, for example, from a PVA sponge or a PVA sponge with dispersed abrasive particles, with an inverted frustum shape in the upper half and a frustum shape in the lower half. According to this beveled brush 83, the outer peripheral end of the substrate W can be cleaned in the central portion of the outer peripheral surface in the vertical direction.

[0076] The bevel brush driving section 84 includes one or a plurality of pulse motors and cylinders or the like, and lifts and rotates the rotation support shaft 81. According to the configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential end portion of the substrate W held and rotated by the adsorption holding section 21, the entire outer circumferential end portion of the substrate W can be cleaned.

[0077] Here, the bevel brush driving section 84 also includes a motor built in the arm 82. The motor rotates the bevel brush 83 provided at the front end portion of the arm 82 around the axis in the up-down direction. Therefore, when the outer circumferential end portion of the substrate W is cleaned, the cleaning force of the bevel brush 83 in the outer circumferential end portion of the substrate W is increased by rotating the bevel brush 83.

[0078] (3) Control system of substrate processing apparatus

[0079] Figure 5 is a block diagram showing the configuration of the control system of the substrate processing apparatus 100. As described above, Figure 1 The control device 170 includes a CPU, a RAM, a ROM, and a storage device. The RAM serves as a work area of the CPU. The ROM stores system programs. The storage device stores a substrate processing program.

[0080] As shown in Figure 5 The control device 170 includes a chuck control section 171, an adsorption control section 172, a pedestal control section 173, a handover control section 174, a lower surface cleaning control section 175, a cup control section 176, an upper surface cleaning control section 177, a bevel cleaning control section 178, a carry-in and carry-out control section 179, and carry-in and carry-out control sections 180 and 181 as functional sections. The functional sections of the control device 170 are realized by the CPU executing the substrate processing program stored in the storage device on the RAM. Part or all of the functional sections of the control device 170 can also be realized by hardware such as an electronic circuit.

[0081] The chuck control section 171, the adsorption control section 172, the pedestal control section 173, the handover control section 174, the lower surface cleaning control section 175, the cup control section 176, the upper surface cleaning control section 177, the bevel cleaning control section 178, and the carry-in and carry-out control section 179 control the operation of each substrate cleaning device 1. Specifically, the chuck control section 171 controls the lower chuck driving sections 13A and 13B and the upper chuck driving sections 14A and 14B to receive the substrate W carried into each substrate cleaning device 1 and hold it at a position above the adsorption holding section 21.

[0082] The adsorption control unit 172 controls the adsorption holding drive unit 22 to adsorb and hold the substrate W using the adsorption holding unit 21 and to rotate the adsorbed and held substrate W. The base control unit 173 controls the base drive unit 33 to move the movable base 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 174 controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the adsorption holding unit 21.

[0083] The lower surface cleaning control unit 175 controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57 to clean the lower surface of the substrate W. The cup control unit 176 controls the cup drive unit 62 so that during the cleaning of the substrate W held by the adsorption and holding unit 21, the processing cup 61 can catch the cleaning liquid that splashes from the substrate W.

[0084] The upper surface cleaning control unit 177 controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by the adsorption and holding unit 21. The inclined surface cleaning control unit 178 controls the inclined surface brush drive unit 84 to clean the outer peripheral end of the substrate W held by the adsorption and holding unit 21. The loading and unloading control unit 179 controls the baffle drive unit 92 to open and close the loading and unloading outlet 2x of the unit housing 2 when loading and unloading the substrate W in each substrate cleaning device 1.

[0085] The transfer control unit 180 controls the transfer drive unit 220 to transfer the substrate W between the multiple carriers C and the multiple substrate placement units PASS1 and PASS2. The transfer control unit 181 controls the transfer drive unit 320 to transfer the substrate W between the multiple substrate placement units PASS1 and PASS2 and the multiple substrate cleaning apparatus 1.

[0086] In addition, Figure 5 In this example, the control device 170 controls not only the movements of the indexing robot 200 and the main robot 300, but the implementation is not limited to this. Each substrate cleaning device 1 may also have a control device for controlling the movement of that substrate cleaning device 1. In this case, the control device 170 may not include the chuck control unit 171, the adsorption control unit 172, the base control unit 173, the transfer control unit 174, the lower surface cleaning control unit 175, the cup control unit 176, the upper surface cleaning control unit 177, the inclined surface cleaning control unit 178, and the loading and unloading control unit 179.

[0087] (4) Operation of the substrate cleaning device

[0088] In the plurality of substrate cleaning apparatuses 1, a plurality of substrates W respectively carried by the robot hands Ma ~ Md of the main robot 300 are sequentially subjected to cleaning processing. Hereinafter, the operation of the substrate cleaning apparatus 1 with respect to the substrate W carried by the robot hand Ma will be described, but the operation of the substrate cleaning apparatus 1 with respect to the substrate W carried by the robot hands Mb ~ Md is the same as the operation of the substrate cleaning apparatus 1 with respect to the substrate W carried by the robot hand Ma. Figure 1

[0089] Figures 6-17 is a schematic view for illustrating an example of the operation of the substrate cleaning apparatus 1 of Figure 3 In each of the drawings of Figures 6-17 , the upper section indicates a plan view of the substrate cleaning apparatus 1. In addition, the middle section indicates a side view of the lower side holding device 20 and its peripheral portion as viewed in the Y direction, and the lower section indicates a side view of the lower side holding device 20 and its peripheral portion as viewed in the X direction. The side view of the middle section corresponds to the A-A line side view of Figure 3 , and the side view of the lower section corresponds to the B-B line side view of Figure 3 . Furthermore, in order to easily understand the shape and the operation state of each constituent element in the substrate cleaning apparatus 1, the scale of a part of the constituent elements is different between the plan view of the upper section and the side views of the middle and lower sections. In addition, in Figures 6-17 , the processing cup 61 is indicated by a double-dot chain line, and the outline of the substrate W is indicated by a thick single-dot chain line.

[0090] In an initial state before the substrate cleaning apparatus 1 is loaded with the substrate W, the shutter 91 of the opening and closing device 90 closes the loading and unloading port 2x. In addition, as shown in Figure 3 , the lower chucks 11A, 11B are maintained in a state in which the distance between the lower chucks 11A, 11B is sufficiently greater than the diameter of the substrate W. In addition, the upper chucks 12A, 12B are also maintained in a state in which the distance between the upper chucks 12A, 12B is sufficiently greater than the diameter of the substrate W. In addition, the movable base 32 of the base device 30 is disposed in such a manner that the center of the lower suction holding portion 21 is located at the center of the processing cup 61 as viewed in plan. In addition, on the movable base 32, the lower surface cleaning device 50 is disposed at a close position. In addition, the elevation support portion 54 of the lower surface cleaning device 50 is in a state in which the cleaning surface (upper end portion) of the lower surface brush 51 is located lower than the suction holding portion 21. In addition, the transfer device 40 is in a state in which the plurality of support pins 41 are located lower than the suction holding portion 21. Furthermore, in the cup device 60, the processing cup 61 is in a lower cup position. In the following description, the center position of the processing cup 61 as viewed in plan will be referred to as a plan reference position rp. In addition, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding portion 21 is at the plan reference position rp will be referred to as a first horizontal position.

[0091] ​The substrate W, to be processed, is transferred into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is transferred in, the baffle 91 opens the transfer outlet 2x. Then, as... Figure 6 As shown by the medium-thick solid line arrow a1, Figure 1 The robotic arm Ma of the main robot 300 enters the cell housing 2 through the loading / unloading outlet 2x and delivers the substrate W to approximately the center position within the cell housing 2. At this time, as... Figure 6 As shown, the substrate W held by the robot arm Ma is located between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B.

[0092] Next, as Figure 7 As indicated by the thick solid arrow a2, the lower chucks 11A and 11B have multiple support plates positioned below the lower peripheral edge of the substrate W. In this state, the robot arm Ma descends. Thus, multiple portions of the lower peripheral edge of the substrate W held by the robot arm Ma are supported by the multiple support plates of the lower chucks 11A and 11B. The substrate W is at the loading position at this time. At this point, at the unloading position, there is a substrate W that was previously loaded into the unit housing 2 and processed. Therefore, after the robot arm Ma delivers the substrate W to the lower chucks 11A and 11B at the loading position as described above, it receives the processed substrate W from the unloading position and exits from the unit housing 2. After the robot arm Ma exits, the baffle 91 closes the loading / unloading outlet 2x.

[0093] Next, as Figure 8 As shown by the thick solid arrow a3, the upper chucks 12A and 12B, with their multiple retaining tabs abutting against the outer peripheral end of the substrate W, approach each other. By having the multiple retaining tabs of the upper chucks 12A and 12B abut against multiple portions of the outer peripheral end of the substrate W, the upper chucks 12A and 12B further hold the substrate W supported by the lower chucks 11A and 11B. In this way, the center of the substrate W held by the upper retaining devices 10A and 10B overlaps or substantially overlaps with the planar reference position rp when viewed from above. Furthermore, as... Figure 8 As indicated by the thick solid arrow a4, the movable base 32 moves forward from the first horizontal position such that the adsorption holding part 21 is offset from the planar reference position rp by a predetermined distance and the center of the lower surface brush 51 is located at the planar reference position rp. At this time, the position of the movable base 32 located on the bottom part 2a is referred to as the second horizontal position.

[0094] Next, as Figure 9 As indicated by the medium-thick solid arrow a5, the lifting support 54 rises such that the cleaning surface of the lower surface brush 51 contacts the central region of the lower surface of the substrate W. Additionally, as... Figure 9As indicated by a thick solid arrow a6, the lower surface brush 51 rotates (spins) around an axis in the up-and-down direction. By this, the contaminant substance adhering to the central region of the lower surface of the substrate W is physically peeled off by the lower surface brush 51.

[0095] In Figure 9 In the lower stage, an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W is shown in a comment box. As shown in the comment box, in the state where the lower surface brush 51 contacts the substrate W, the liquid nozzle 52 and the gas spouting portion 53 are held at a position close to the lower surface of the substrate W. At this time, as indicated by a hollow arrow a51, the liquid nozzle 52 spouts the cleaning liquid toward the lower surface of the substrate W at a position in the vicinity of the lower surface brush 51. By this, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact portion of the lower surface brush 51 and the substrate W, and thus the contaminant substance removed from the back surface of the substrate W by the lower surface brush 51 is washed by the cleaning liquid. In this way, in the lower surface cleaning device 50, the liquid nozzle 52 is installed in the lift support portion 54 together with the lower surface brush 51. By this, the cleaning liquid can be efficiently supplied to the portion of the lower surface of the substrate W cleaned by the lower surface brush 51. Therefore, the consumption amount of the cleaning liquid is reduced and the excessive scattering of the cleaning liquid is suppressed.

[0096] Further, the rotation speed of the lower surface brush 51 at the time of cleaning the lower surface of the substrate W is maintained at a speed at which the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W does not scatter to the side of the lower surface brush 51.

[0097] Here, the upper surface 54u of the lift support portion 54 is inclined toward the obliquely downward direction away from the adsorption holding portion 21. In this case, in the case where the cleaning liquid containing the contaminant substance falls from the lower surface of the substrate W onto the lift support portion 54, the cleaning liquid caught by the upper surface 54u is guided in the direction away from the adsorption holding portion 21.

[0098] Further, at the time of cleaning the lower surface of the substrate W with the lower surface brush 51, the gas spouting portion 53 spouts gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding portion 21 as indicated by a hollow arrow a52 in the comment box of Figure 9 In this embodiment, the gas spouting portion 53 is installed on the lift support portion 54 in such a manner that the gas spouting ports extend in the X direction. In this case, in the case where gas is spouted from the gas spouting portion 53 toward the lower surface of the substrate W, a belt-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. By this, at the time of cleaning the lower surface of the substrate W with the lower surface brush 51, the scattering of the cleaning liquid containing the contaminant substance toward the adsorption holding portion 21 is prevented. Therefore, at the time of cleaning the lower surface of the substrate W with the lower surface brush 51, the cleaning liquid containing the contaminant substance is prevented from adhering to the adsorption holding portion 21, and the adsorption surface of the adsorption holding portion 21 is kept clean.

[0099] Further, in the example of FIG. 6, the gas spouting section 53 spouts gas obliquely upward from the gas spouting section 53 toward the lower surface brush 51 as indicated by the hatched arrow a52, but the embodiment is not limited thereto. The gas spouting section 53 can spout gas in a manner that the gas spouts from the gas spouting section 53 toward the lower surface of the substrate W in the Z direction. Figure 9

[0100] Next, in the state of FIG. 6, when cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lift support section 54 is lowered in a manner that the cleaning surface of the lower surface brush 51 is separated from the substrate W by a prescribed distance. In addition, the spouting of the cleaning liquid from the liquid spouting nozzle 52 toward the substrate W is stopped. At this time, the spouting of the gas from the gas spouting section 53 toward the substrate W is continued. Figure 9

[0101] Then, as indicated by the thick solid arrow a7 in FIG. 7, the movable base 32 is moved backward in a manner that the adsorption holding section 21 is positioned at the planar reference position rp. That is, the movable base 32 is moved from the second horizontal position to the first horizontal position. At this time, the central region of the lower surface of the substrate W is sequentially dried by the gas curtain by continuing the spouting of the gas from the gas spouting section 53 toward the substrate W. Figure 10

[0102] Next, as indicated by the thick solid arrow a8 in FIG. 8, the lift support section 54 is lowered in a manner that the cleaning surface of the lower surface brush 51 is positioned more downward than the adsorption surface (upper end portion) of the adsorption holding section 21. In addition, as indicated by the thick solid arrow a9 in FIG. 8, the upper chuck 12A, 12B is moved away from each other in a manner that the plurality of holding pieces of the upper chuck 12A, 12B are separated from the peripheral end portion of the substrate W. At this time, the state becomes that the substrate W is supported by the lower chuck 11A, 11B. Figure 11 Figure 11

[0103] Then, as indicated by the thick solid arrow a10 in FIG. 9, the pin link member 42 is raised in a manner that the upper end portions of the plurality of support pins 41 are positioned slightly upward from the lower chuck 11A, 11B. By this, the substrate W supported by the lower chuck 11A, 11B is received by the plurality of support pins 41. Figure 11

[0104] Next, as indicated by the thick solid arrow a11 in FIG. 10, the lower chuck 11A, 11B is moved away from each other. At this time, the lower chuck 11A, 11B is moved to a position that does not overlap the substrate W supported by the plurality of support pins 41 in a plan view. By this, both of the upper side holding devices 10A, 10B return to the initial state. Figure 12

[0105] Next, as indicated by the thick solid arrow a12 in FIG. 11, the lift support section 54 is raised in a manner that the cleaning surface of the lower surface brush 51 is positioned more upward than the adsorption surface (upper end portion) of the adsorption holding section 21. By this, the substrate W supported by the plurality of support pins 41 is received by the lower surface brush 51. Figure 13 ​​​​​​​As indicated by the thick solid arrow a12, the pin-connecting member 42 is lowered such that the upper ends of the multiple support pins 41 are located below the adsorption and holding portion 21. As a result, the substrate W supported on the multiple support pins 41 is received by the adsorption and holding portion 21. In this state, the adsorption and holding portion 21 adsorbs and holds the central region of the lower surface of the substrate W. Thus, the center of the substrate W held by the lower holding device 20 overlaps or approximately overlaps with the planar reference position rp when viewed from above. The position of the substrate W at this time is the removed position. Therefore, in this example, the removed position is below the placed position. Simultaneously with or after the pin-connecting member 42 descends, as... Figure 13 As indicated by the thick solid arrow a13, the processing cup 61 rises from the lower cup position to the upper cup position. Consequently, the substrate W, in the removed position, is located below the upper end of the processing cup 61.

[0106] Next, as Figure 14 As shown by the thick solid arrow a14, the adsorption and holding part 21 rotates around an axis in the vertical direction (the axis of rotation of the adsorption and holding drive part 22). As a result, the substrate W adsorbed and held by the adsorption and holding part 21 rotates in a horizontal position.

[0107] Next, the rotating support shaft 71 of the upper surface cleaning device 70 rotates and descends. Thus, as... Figure 14 As indicated by the thick solid arrow a15, the spray nozzle 73 moves to a position above the substrate W, and then descends such that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixture of cleaning fluid and gas onto the upper surface of the substrate W. Additionally, the rotation support shaft 71 rotates. Thus, as... Figure 14 As indicated by the medium-thick solid arrow a16, the spray nozzle 73 is moved to a position above the rotating substrate W. The entire upper surface of the substrate W is cleaned by spraying the mixed fluid onto it.

[0108] Furthermore, when cleaning the upper surface of the substrate W using the spray nozzle 73, the rotating support shaft 81 of the end cleaning device 80 also rotates and descends. Thus, as... Figure 14 As indicated by the thick solid arrow a17, the beveled brush 83 moves to a position above the outer peripheral end of the substrate W. It then descends such that the central portion of the outer peripheral surface of the beveled brush 83 contacts the outer peripheral end of the substrate W. In this state, the beveled brush 83 rotates (spins) about its vertical axis. As a result, contaminants adhering to the outer peripheral end of the substrate W are physically removed by the beveled brush 83. The contaminants removed from the outer peripheral end of the substrate W are then rinsed by a cleaning solution of the mixed fluid sprayed from the nozzle 73 onto the substrate W.

[0109] Furthermore, when cleaning the upper surface of the substrate W using the spray nozzle 73, the lifting support 54 is raised by contacting the cleaning surface of the lower surface brush 51 with the outer region of the lower surface of the substrate W. Additionally, as... Figure 14 As indicated by the thick solid arrow a18, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. Furthermore, the liquid nozzle 52 sprays cleaning fluid toward the lower surface of the substrate W, and the gas ejection section 53 sprays gas toward the lower surface of the substrate W. In this state, further... Figure 14 As shown by the thick solid arrow a19, the movable support 55 moves back and forth between an approaching position and a departing position on the movable base 32. In this way, by moving the movable support 55 horizontally while the lower surface brush 51 is in contact with the lower surface of the substrate W, the cleaning range of the lower surface of the substrate W by the lower surface brush 51 is expanded. Consequently, the entire outer region of the lower surface of the substrate W, which is held and rotated by the adsorption and holding part 21, is cleaned by the lower surface brush 51.

[0110] Next, after cleaning the upper surface, outer peripheral end, and outer region of the lower surface of substrate W, stop spraying the mixing fluid from nozzle 73 onto substrate W. Additionally, as... Figure 15 As indicated by the medium-thick solid line arrow a20, the spray nozzle 73 has moved to one side of the treatment cup 61 (its initial position). Additionally, as... Figure 15 As indicated by the thick solid arrow a21, the inclined brush 83 moves to the other side of the processing cup 61 (the initial position). Then, the rotation of the lower surface brush 51 is stopped, and the lifting support 54 is lowered such that the cleaning surface of the lower surface brush 51 moves a predetermined distance away from the substrate W. Additionally, the spraying of cleaning fluid from the liquid nozzle 52 onto the substrate W and the spraying of gas from the gas ejection section 53 onto the substrate W are stopped. In this state, the high-speed rotation of the adsorption holding section 21 causes the cleaning fluid adhering to the substrate W to be thrown off, and the entire substrate W is dried.

[0111] Next, as Figure 16 As shown by the thick solid arrow a22, the processing cup 61 descends from the upper cup position to the lower cup position. Therefore, the substrate W in the removed position is positioned higher than the upper end of the processing cup 61. Additionally, as... Figure 16 As indicated by the thick solid arrow a23, the lower clamps 11A and 11B are brought close together until they can support the new substrate W, in order to move the new substrate W into the unit housing 2.

[0112] Finally, the substrate W is removed from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is removed, the baffle 91 opens the inlet / outlet 2x. At this point, the substrate W is not present at the inlet position. Therefore, Figure 1The main robot 300 moves the substrate W before processing to the substrate receiving position by the manipulator Ma through the in / out port 2x into the unit housing 2 while holding the substrate W before processing in the state before processing. Then, as shown by a thick solid arrow a21, the manipulator Ma receives the substrate W before processing from the substrate receiving position and exits from the unit housing 2. After the manipulator Ma exits, the shutter 91 closes the in / out port 2x. Figure 17 As shown by a thick solid arrow a24, the manipulator Ma receives the substrate W after processing at the out position and exits from the unit housing 2. After the manipulator Ma exits, the shutter 91 closes the in / out port 2x.

[0113] (5) Substrate processing

[0114] Figure 18 and Figure 19 is a flowchart of the substrate processing performed by the control device 170. Figure 5 The substrate processing of the substrate cleaning device 1 is performed by the CPU of the control device 170 executing the substrate processing program stored in the storage device on the RAM. Hereinafter, the substrate processing will be described using the flowcharts of Figure 18 and Figure 19 The substrate processing of the substrate cleaning device 1 is performed by the CPU of the control device 170 executing the substrate processing program stored in the storage device on the RAM. Hereinafter, the substrate processing will be described using the flowcharts of Figure 18 and Figure 19 The substrate processing of the substrate cleaning device 1 is performed by the CPU of the control device 170 executing the substrate processing program stored in the storage device on the RAM. Hereinafter, the substrate processing will be described using the flowcharts of

[0115] Further, in the flowcharts of Figure 18 and Figure 19 , the actions of the manipulator Ma of the main robot 300 are mainly described, but the actions of the manipulators Mb to Md are the same as those of the manipulator Ma. In addition, in the flowcharts of Figure 18 and Figure 19 , the description of the actions of the indexing robot 200 is omitted.

[0116] First, the main robot 300 moves the substrates W before processing from the substrate placing section PASS 2 by the manipulators Ma to Md (step S1). Next, the main robot 300 causes the manipulator Ma to enter the unit housing 2 of the corresponding substrate cleaning device 1 (step S2).

[0117] Then, the main robot 300 delivers the substrate W before processing moved from the substrate placing section PASS 2 in step S1 to the in position by the manipulator Ma (step S3). At this time, there is no substrate W at the out position. Therefore, the main robot 300 causes the manipulator Ma to exit from the unit housing 2 of the corresponding substrate cleaning device 1 (step S4). In addition, the main robot 300 performs the same processing as steps S2 to S4 in order for the corresponding substrate cleaning device 1 using the manipulators Mb to Mc.

[0118] Next, each substrate cleaning device 1 performs the cleaning processing of Figures 6-17 (step S5). In addition, the main robot 300 moves the substrates W before processing from the substrate placing section PASS 2 by the manipulators Ma to Md (step S6). Steps S5 and S6 can also be performed in parallel.

[0119] After the cleaning process ends, the main robot 300 causes the robot hand Ma to enter the cell housing 2 of the corresponding substrate cleaning device 1 (step S7). Then, the main robot 300 delivers the pre-process substrate W taken out from the substrate placement section PASS2 in step S6 to the carrying-in position using the robot hand Ma (step S8). At this time, the carrying-in position has the substrate W cleaned in step S5 or the following step Sll.

[0120] Therefore, the main robot 300 receives the processed substrate W from the carrying-in position using the robot hand Ma (step S9). Then, the main robot 300 causes the robot hand Ma to exit from the cell housing 2 of the corresponding substrate cleaning device 1 (step S10). In addition, the main robot 300 uses the robot hands Mb to Mc to sequentially perform the same processes as steps S7 to S10 on the corresponding substrate cleaning device 1.

[0121] Next, each substrate cleaning device 1 performs the cleaning process of Figures 6-17 (step Sll). In addition, the main robot 300 carries the processed substrate W received from the carrying-in position in step S9 to the substrate placement section PASS1 using the robot hands Ma to Md (step S12). Steps Sll and S12 can also be performed in parallel.

[0122] Then, the control device 170 determines whether to end the substrate processing (step S13). The control device 170 can determine to end the substrate processing when the user gives an end instruction. Alternatively, the control device 170 can determine to end the substrate processing when the cleaning process of a prescribed number of substrates W is performed. In the case of determining to end the substrate processing, the control device 170 returns to step S6. In this case, steps S6 to S13 are repeated until it is determined to end the substrate processing.

[0123] In the case of determining to end the substrate processing, the main robot 300 causes the robot hand Ma to enter the cell housing 2 of the corresponding substrate cleaning device 1 (step S14). At this time, the carrying-in position has the substrate W cleaned in step Sll. Therefore, the main robot 300 receives the processed substrate W from the carrying-in position using the robot hand Ma (step S15). Then, the main robot 300 causes the robot hand Ma to exit from the cell housing 2 of the corresponding substrate cleaning device 1 (step S16). In addition, the main robot 300 uses the robot hands Mb to Mc to sequentially perform the same processes as steps S14 to S16 on the corresponding substrate cleaning device 1.

[0124] Finally, the main robot 300 receives the processed substrates W from the carry-in position in step S15 using the robot hands Ma to Md and carries them into the substrate mounting portion PASS1 (step S17). Thus, the substrate processing is completed.

[0125] (6) Effects

[0126] In the substrate processing apparatus 100 of the present embodiment, the robot hands Ma to Md of the main robot 300 enter the corresponding substrate cleaning apparatus 1. The pre-processed substrates W held by the respective robot hands Ma to Md are delivered to the carry-in positions of the corresponding substrate cleaning apparatuses 1. After the pre-processed substrates W are delivered to the carry-in positions, the processed substrates W are received from the carry-out positions of the corresponding substrate cleaning apparatuses 1 using the respective robot hands Ma to Md. After the processed substrates W are received from the carry-out positions, the respective robot hands Ma to Md exit from the corresponding substrate cleaning apparatuses 1. The pre-processed substrates W are processed by the respective substrate cleaning apparatuses 1.

[0127] According to this configuration, even when the processed substrates W exist in the respective substrate cleaning apparatuses 1, the pre-processed substrates W can be carried into the substrate cleaning apparatuses 1. Therefore, the pre-processed substrates W can be delivered to the corresponding substrate cleaning apparatuses 1 using the robot hands Ma to Md, and the processed substrates W can be received using the same robot hands Ma to Md. Therefore, it is not necessary to provide robot hands that do not hold the substrates W in order to receive the processed substrates W. In addition, the action of delivering the pre-processed substrates W and receiving the processed substrates W using the plurality of robot hands Ma to Md can be performed continuously with respect to the plurality of substrate cleaning apparatuses 1. Thus, the throughput can be further improved.

[0128] In addition, in the respective substrate cleaning apparatuses 1, the cleaning processing of the lower surface central region is performed using the lower surface cleaning apparatus 50 while the substrate W carried into the carry-in position is held by the upper side holding apparatuses 10A, 10B. Next, the substrate W is further delivered to the lower side holding apparatus 20 using the handover apparatus 40. Then, the cleaning processing of the lower surface outer region is performed using the lower surface cleaning apparatus 50 while the substrate W is held by the lower side holding apparatus 20. Thus, the entire lower surface of the substrate W can be cleaned efficiently, and the cleaned substrate W can be carried out from the carry-out position. Since the carry-in position and the carry-out position are arranged in the up-and-down direction, the floor area (footprint) of the substrate cleaning apparatus 1 can be reduced.

[0129] In addition, as described above, since the delivery and reception of the substrates are performed using one robot with respect to one substrate cleaning apparatus 1, the robot in which a problem has occurred can be easily specified in the case where a conveyance failure such as a breakage of the substrate W occurs due to a malfunction of the robot. Furthermore, since the throughput is improved, it is not necessary to increase the conveyance speed of the main robot 300. Thus, the stability of the conveyance can be improved.

[0130] (7) Other Embodiments

[0131] (a) In the embodiment, the carry-out position is provided below the carry-in position, but the embodiment is not limited thereto. The carry-out position can also be provided above the carry-in position. For example, the carry-in position can be provided at the center of the suction holding portion 21 of the lower holding device 20 on the lower side, and the carry-out position can be provided between the upper holding devices 10A and 10B on the upper side.

[0132] In this configuration, the substrate W is delivered to the carry-in position, and is first suction-held by the lower holding device 20, and the lower surface central region, the outer peripheral end portion, and the upper surface thereof are cleaned in this state. Then, the substrate W held by the lower holding device 20 is received by the upper holding devices 10A and 10B, and is held at the carry-out position. The lower surface central region of the substrate W is cleaned in this state. The cleaned substrate W is carried out from the upper holding devices 10A and 10B to the outside of the cell housing 2.

[0133] Alternatively, the carry-in position and the carry-out position can also be configured not in a manner arranged in the vertical direction. The carry-in position and the carry-out position can also be configured, for example, in a manner arranged in the horizontal direction.

[0134] (b) In the embodiment, the handover device 40 is a handover portion that hands over the substrate W between the upper holding devices 10A and 10B and the lower holding device 20, but the embodiment is not limited thereto. In a case where at least one of the upper holding devices 10A and 10B and the lower holding device 20 is configured in a manner capable of ascending and descending, the handover device 40 can also not be provided. In this case, at least one of the upper holding devices 10A and 10B and the lower holding device 20 is a handover portion, and the substrate W is handed over between the upper holding devices 10A and 10B and the lower holding device 20 by causing the handover portion to ascend and descend.

[0135] (c) In the embodiment, the main robot 300 has four hands Ma to Md, but the embodiment is not limited thereto. The main robot 300 can also have two, three, or five or more hands. In addition, it is preferable that the substrate cleaning device 1 be provided in the substrate processing device 100 in a manner corresponding to the hands of the main robot 300. Alternatively, the main robot 300 can also have one hand. In this case, the throughput can also be improved in correspondence with the number of hands.

[0136] (d) In the embodiment, the substrate cleaning apparatus 1 that performs the cleaning process is provided as the processing unit, but the embodiment is not limited thereto. A heat treatment apparatus that performs a heat treatment, a developing apparatus that performs a developing process, a coating apparatus that performs a coating process, or the like can be provided as the processing unit. Further, the heat treatment apparatus can be configured to be capable of performing different processes such as a heating process and a cooling process on the substrate. The developing apparatus can be configured to be capable of performing different processes such as a positive developing and a negative developing on the substrate.

[0137] (e) In the embodiment, the substrate W held by the upper holding apparatuses 10A and 10B and the substrate W held by the lower holding apparatus 20 are subjected to different processes, but the embodiment is not limited thereto. The substrate W held by the upper holding apparatuses 10A and 10B and the substrate W held by the lower holding apparatus 20 can be subjected to the same process. Alternatively, the substrate W held by the upper holding apparatuses 10A and 10B or the substrate W held by the lower holding apparatus 20 can not be subjected to the process.

[0138] (f) In the embodiment, the substrate processing apparatus 100 includes the control apparatus 170 that controls the substrate cleaning apparatus 1, the main robot 300, and the like, but the embodiment is not limited thereto. In a case where the substrate cleaning apparatus 1 and the main robot 300 are configured to be capable of being controlled by an information processing apparatus outside the substrate processing apparatus 100, the substrate processing apparatus 100 can not include the control apparatus 170.

[0139] (8) Correspondence between each component of the technical solution and each part of the embodiment

[0140] Hereinafter, examples of the correspondence between each component of the technical solution and each element of the embodiment will be described, but the present application is not limited to the following examples. As for each component of the technical solution, other various elements having the configuration or function described in the technical solution can be used.

[0141] In the embodiment, the substrate W is an example of a substrate, the substrate cleaning apparatus 1 is an example of a processing unit, the robots Ma to Md are examples of conveyance holding parts, the main robot 300 is an example of a substrate conveyance part, and the substrate processing apparatus 100 is an example of a substrate processing apparatus. The upper holding apparatuses 10A and 10B are examples of a first substrate holding part, the lower surface cleaning apparatus 50 is an example of a first and a second processing part, the lower holding apparatus 20 is an example of a second substrate holding part, and the handover apparatus 40 is an example of a handover part.

Claims

1. A substrate processing apparatus comprising: a processing unit having a carrying-in position for carrying in a substrate before processing and a carrying-out position for carrying out a substrate after processing, and processing the substrate before processing; and a substrate carrying unit having a plurality of robot hands configured to selectively hold the substrate before processing and the substrate after processing, wherein the processing unit is provided with a plurality of, the plurality of robot hands respectively correspond to the plurality of processing units, the plurality of robot hands each hold the substrate before processing into the corresponding processing unit and deliver the substrate before processing to the carrying-in position, and then receive the substrate after processing from the carrying-out position by the same robot hand, and exit from the corresponding processing unit after receiving the substrate after processing.

2. The substrate processing apparatus according to claim 1, wherein the carrying-in position and the carrying-out position are arranged in a vertical direction.

3. The substrate processing apparatus according to claim 1 or 2, wherein the processing unit includes: a first substrate holding unit holding a substrate carried in the carrying-in position; a first processing unit processing a substrate held by the first substrate holding unit; a second substrate holding unit holding a substrate carried in from the carrying-out position; a delivery unit delivering a substrate processed by the first processing unit from the first substrate holding unit to the second substrate holding unit; and a second processing unit processing a substrate held by the second substrate holding unit.

4. The substrate processing apparatus according to claim 3, wherein the first processing unit and the second processing unit process a substrate differently.

5. The substrate processing apparatus according to claim 4, wherein the first processing unit performs cleaning processing of a central region of a lower surface of a substrate, and the second processing unit performs cleaning processing of a region outside the lower surface surrounding the central region of the lower surface of the substrate.

6. A substrate processing method comprising: causing a robot hand of a substrate carrying unit having a plurality of robot hands to enter a processing unit; delivering a substrate before processing held by the robot hand to a carrying-in position of the processing unit; receiving a substrate after processing from a carrying-out position of the processing unit by the same robot hand after delivering the substrate before processing to the carrying-in position; causing the robot hand to exit from the processing unit after receiving the substrate after processing from the carrying-out position; and processing the substrate before processing by the processing unit. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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