Gate drive protection circuit, system and vehicle inverter system

Abstract

The present application relates to a gate drive protection circuit, system and vehicle-mounted inverter system, wherein the gate drive protection circuit comprises a gate drive module, a fault signal output module, an undervoltage protection module, a short circuit protection module, a mis-conduction protection module and a constant current output module; the gate drive module comprises a drive chip; the fault signal output module is used to be electrically connected to the drive chip and a microcontroller unit for outputting a fault signal; one end of the undervoltage protection module is electrically connected to the drive chip, and the other end is electrically connected to the fault signal output module for performing undervoltage protection on the input voltage of the drive chip; the short circuit protection module is electrically connected to the drive chip and is used to perform short circuit protection on the drive chip; the mis-conduction protection module is electrically connected to the drive chip for preventing the switch transistor from being mis-conducted; the constant current output module is electrically connected to the drive chip for outputting a stable current; therefore, the circuit system has stronger stability, more optimized performance, and the circuit is not easily damaged or scrapped.

Description

Technical Field

[0001] The present application relates to the field of circuit protection technology, and in particular to a gate drive protection circuit, system and vehicle-mounted inverter system. Background Art

[0002] Due to the development of current technology, electronic devices are developing towards high density, high power and miniaturization. While the large-scale use of electronic devices has brought convenience to our lives, the increasing power has made the heat dissipation problem of electronic devices more and more serious. Therefore, heat dissipation is a very critical technology, and the quality of heat dissipation directly affects the performance and life of the product. The earliest IGBT (Insulated Gate Bipolar Transistor) dual-sided water cooling technology (DSC, Dual-sided Cooling Technology) was developed based on the application of new energy vehicles, mainly to solve the power density problem of vehicle-mounted inverters and to improve the heat dissipation effect of modules.

[0003] The gate driver is a key component of the double-sided water cooling technology. The gate driver acts as a power amplifier, which receives low-power input from the controller and generates high-current drive input for the gate of the insulated gate bipolar transistor (IGBT) device and the metal oxide semiconductor field effect transistor (MOSFET) device. However, the existing circuit protection performance is not good enough. The gate driver cannot cope well with circuit short circuit and undervoltage faults during operation, the system stability and reliability are not strong, and the circuit is easily damaged, resulting in scrapping. Summary of the invention

[0004] The embodiments of the present application provide a gate drive protection circuit, system and vehicle inverter system, which can realize undervoltage protection, short circuit protection, switching transistor misconduction protection and constant current output protection for the circuit. The system has stronger stability, more optimized performance, and the circuit is not easy to be damaged or scrapped.

[0005] In the first aspect, a gate drive protection circuit is provided, including a gate drive module, a fault signal output module, an undervoltage protection module, a short circuit protection module, a mis-conduction protection module and a constant current output module; the gate drive module includes a drive chip; the fault signal output module is used to be electrically connected to the drive chip and a micro control unit for outputting a fault signal; one end of the undervoltage protection module is electrically connected to the drive chip, and the other end is electrically connected to the fault signal output module for performing undervoltage protection on the input voltage of the drive chip; the short circuit protection module is electrically connected to the drive chip and is used to perform short circuit protection on the drive chip; the mis-conduction protection module is electrically connected to the drive chip to prevent the switch transistor from being mis-conducted; the constant current output module is electrically connected to the drive chip for outputting a stable current.

[0006] In some embodiments, the fault signal output module includes a first control pin, a transistor and a first resistor; the first control pin is electrically connected to the driving chip; the collector of the transistor is used to be electrically connected to a micro control unit, the base of the transistor is electrically connected to the first control pin, the emitter of the transistor is electrically connected to one end of the first resistor, and the other end of the first resistor is grounded.

[0007] In some embodiments, the undervoltage protection module includes a second control pin, a third control pin and a capacitor; the second control pin and the third control pin are both electrically connected to the driving chip, and the second control pin is connected to a power supply; one end of the capacitor is electrically connected to the second control pin, and the other end of the capacitor is grounded with the other end of the first resistor.

[0008] In some embodiments, the short circuit protection module includes a fourth control pin electrically connected to the driving chip, a filter electrically connected to the fourth control pin, and a second resistor electrically connected to the filter, and the second resistor is grounded.

[0009] In some embodiments, the mis-conduction protection module includes a fifth control pin, a sixth control pin, a seventh control pin, an eighth control pin, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a first MOS tube and a second MOS tube; the fifth control pin, the sixth control pin, the seventh control pin and the eighth control pin are all electrically connected to the driving chip; the fourth resistor is electrically connected to the first MOS tube, the third resistor and the gate of the first MOS tube are electrically connected to the fifth control pin, and the third resistor is connected in parallel with the fourth resistor; one end of the fifth resistor is electrically connected to the sixth control pin, one end of the sixth resistor is electrically connected to the seventh control pin, the other end of the fifth resistor, the other end of the sixth resistor and the eighth control pin are all electrically connected to the first MOS tube, the first MOS tube, the other end of the fifth resistor, the other end of the sixth resistor and the seventh control pin are all electrically connected to the gate of the second MOS tube; the connection node between the second MOS tube and the second resistor is electrically connected to the filter, the second MOS tube is grounded, and the second MOS tube is used to be electrically connected to the switch transistor.

[0010] In some embodiments, the constant current output module includes a ninth control pin, a tenth control pin and a seventh resistor; the ninth control pin and the tenth control pin are both electrically connected to the driving chip; one end of the seventh resistor is electrically connected to the tenth control pin, and the other end is grounded with the ninth control pin.

[0011] In some embodiments, the seventh resistor is a thermistor.

[0012] In a second aspect, a gate drive protection system is provided, comprising a micro control unit, a gate drive protection circuit as described above, and a switching transistor; the gate drive protection circuit is electrically connected to the micro control unit; and the switching transistor is electrically connected to the gate drive protection circuit.

[0013] In some embodiments, the switch transistor is an insulated gate bipolar transistor or a metal oxide semiconductor field effect transistor.

[0014] In a third aspect, a vehicle-mounted inverter system is provided, comprising the gate drive protection system as described above.

[0015] The beneficial effects brought about by the technical solution provided in the present application include: through the gate drive protection circuit, a gate drive module, a fault signal output module, an undervoltage protection module, a short circuit protection module, a mis-conduction protection module and a constant current output module are integrated in the built-in, which can realize undervoltage protection, short circuit protection, switching transistor mis-conduction protection and constant current output protection of the circuit, so that the system stability is stronger, the performance is more optimized, and the circuit is not easy to be damaged and scrapped. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A structural block diagram of a gate drive protection circuit provided in an embodiment of the present application;

[0018] Figure 2 A circuit diagram of a gate drive protection circuit provided in an embodiment of the present application;

[0019] Figure 3 This is a structural block diagram of the gate drive protection system provided in an embodiment of the present application.

[0020] 100, micro control unit; 200, gate drive protection circuit; 210, gate drive module, 220, fault signal output module; 230, undervoltage protection module; 240, short circuit protection module; 250, mis-conduction protection module; 260, constant current output module; 300, switching transistor. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0022] See also Figure 1 As shown, an embodiment of the present application provides a gate drive protection circuit, including a gate drive module 210, a fault signal output module 220, an undervoltage protection module 230, a short circuit protection module 240, a mis-conduction protection module 250 and a constant current output module 260; the gate drive module 210 includes a drive chip; the fault signal output module 220 is used to be electrically connected to the drive chip and the micro control unit 100, and is used to output a fault signal; the undervoltage protection module 230 is electrically connected to the drive chip at one end and electrically connected to the fault signal output module 220 at the other end, and is used to perform undervoltage protection on the input voltage of the drive chip; the short circuit protection module 240 is electrically connected to the drive chip, and is used to perform short circuit protection on the drive chip; the mis-conduction protection module 250 is electrically connected to the drive chip, and is used to prevent the switch transistor 300 from being mis-conducted; the constant current output module 260 is electrically connected to the drive chip, and is used to output a stable current.

[0023] Through the gate drive protection circuit, a gate drive module 210, a fault signal output module 220, an undervoltage protection module 230, a short circuit protection module 240, a mis-conduction protection module 250 and a constant current output module 260 are integrated in the circuit, which can realize undervoltage protection, short circuit protection, switching transistor mis-conduction protection and constant current output protection of the circuit, so that the system stability is stronger, the performance is more optimized, and the circuit is not easy to be damaged and scrapped.

[0024] See also Figure 2 As shown, the fault signal output module 220 includes a first control pin S1, a transistor Q and a first resistor R1; the first control pin S1 is electrically connected to the driving chip; the collector of the transistor Q is used to be electrically connected to the micro control unit 100, the base of the transistor Q is electrically connected to the first control pin S1, the emitter of the transistor Q is electrically connected to one end of the first resistor R1, and the other end of the first resistor R1 is grounded.

[0025] Specifically, in this embodiment, the driver chip fault signal is output through the first control pin S1. When a fault occurs (i.e., when the undervoltage protection function or the short circuit protection function is activated), the first control pin S1 outputs a fault signal. After the fault state is eliminated, the first control pin S1 maintains the fault signal until the fault output ends.

[0026] Optionally, the undervoltage protection module 230 includes a second control pin S2, a third control pin S3 and a capacitor C; the second control pin S2 and the third control pin S3 are both electrically connected to the driving chip, and the second control pin S2 is connected to the power supply Vcc; one end of the capacitor C is electrically connected to the second control pin S2, and the other end of the capacitor C is grounded to the other end of the first resistor R1.

[0027] Specifically, in this embodiment, when the second control pin S2 receives that the power supply voltage drops to a preset voltage, the first control pin S1 outputs a fault signal; when the power supply voltage rises to the preset voltage, the first control pin S1 is reset and the circuit resumes normal operation.

[0028] Optionally, the short circuit protection module 240 includes a fourth control pin S4 electrically connected to the driving chip, a Filter electrically connected to the fourth control pin S4, and a second resistor R2 electrically connected to the Filter, and the second resistor R2 is grounded.

[0029] Specifically, in this embodiment, when the voltage of the fourth control pin S4 exceeds the preset voltage or the short-circuit current, the short-circuit protection function is activated, and the voltage of the first control pin S1 outputs a low level; when the fault output holding time has passed, the short-circuit protection function is released, and the first control pin S1 becomes a high impedance and works normally.

[0030] Optionally, the mis-conduction protection module 250 includes a fifth control pin S5, a sixth control pin S6, a seventh control pin S7, an eighth control pin S8, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a first MOS tube G1 and a second MOS tube G2; the fifth control pin S5, the sixth control pin S6, the seventh control pin S7 and the eighth control pin S8 are all electrically connected to the driver chip; the fourth resistor R4 is electrically connected to the first MOS tube G1, the third resistor R3 and the gate of the first MOS tube G1 are electrically connected to the fifth control pin S5, and the third resistor R3 is connected in parallel with the fourth resistor R4. One end of the fifth resistor R5 is electrically connected to the sixth control pin S6, one end of the sixth resistor R6 is electrically connected to the seventh control pin S7, the other end of the fifth resistor R5, the other end of the sixth resistor R6 and the eighth control pin S8 are all electrically connected to the first MOS transistor G1, the first MOS transistor G1, the other end of the fifth resistor, the other end of the sixth resistor and the seventh control pin are all electrically connected to the gate of the second MOS transistor G2; the connection node between the second MOS transistor G2 and the second resistor R2 is electrically connected to the filter, the second MOS transistor G2 is grounded, and the second MOS transistor G2 is used to be electrically connected to the switch transistor 300.

[0031] Specifically, in this embodiment, the third resistor R3 and the fourth resistor R4 are connected in parallel to the power supply Vcc. When the fifth control pin S5 outputs a high level, the sixth control pin S6 outputs a low level, and the voltage of the seventh control pin S7 is less than a preset voltage, the internal MOS tube of the eighth control pin S8 is turned on to prevent the switching transistor 300 from being mis-turned on. This state is maintained until the fifth control pin S5 outputs a low voltage and the sixth control pin S6 becomes high impedance.

[0032] Optionally, the constant current output module 260 includes a ninth control pin S9, a tenth control pin S10 and a seventh resistor R7; the ninth control pin S9 and the tenth control pin S10 are both electrically connected to the driving chip; one end of the seventh resistor R7 is electrically connected to the tenth control pin S10, and the other end is grounded to the ninth control pin S9; optionally, the seventh resistor R7 is set as a thermistor, and the typical characteristic of the thermistor is that it is sensitive to temperature and exhibits different resistance values ​​at different temperatures. Therefore, the resistance value can be flexibly adjusted according to the operating temperature conditions; wherein the current output value can be adjusted according to the seventh resistor R7, and at the same time, it can ensure that the current has no overshoot or oscillation, and maintains a constant current output state.

[0033] It should be noted that the first control pin S1, the second control pin S2, the third control pin S3, the fourth control pin S4, the fifth control pin S5, the sixth control pin S6, the seventh control pin S7, the eighth control pin S8, the ninth control pin S9 and the tenth control pin S10 are all integrated on the driver chip.

[0034] A gate drive protection circuit provided by an embodiment of the present invention has a built-in integrated gate drive module 210, a fault signal output module 220, an undervoltage protection module 230, a short circuit protection module 240, a misdirection protection module 250 and a constant current output module 260, which can realize undervoltage protection, short circuit protection, switch transistor misdirection protection and constant current output protection for the circuit, so the system stability is stronger, the performance is more optimized, and the circuit is not easy to be damaged and scrapped; when a fault occurs (that is, when the undervoltage protection function or the short circuit protection function is activated), the first control pin S1 outputs a fault signal, and after the fault state is eliminated, the first control pin S1 maintains the fault signal until the fault output ends. When the second control pin S2 receives that the power supply voltage drops to a preset voltage, the first control pin S1 outputs a fault signal; when the power supply voltage rises to a preset voltage, the first control pin S1 is reset, and the circuit resumes normal operation. When the voltage of the fourth control pin S4 exceeds the preset voltage or short-circuit current, the short-circuit protection function is activated, and the voltage of the first control pin S1 outputs a low level; when the fault output holding time has passed, the short-circuit protection function is released, and the first control pin S1 becomes a high impedance and works normally. When the fifth control pin S5 outputs a high level, the sixth control pin S6 outputs a low level, and the voltage of the seventh control pin S7 is less than the preset voltage, the internal MOS tube of the eighth control pin S8 is turned on to prevent the switch transistor 300 from being mis-turned on, and this state is maintained until the fifth control pin S5 outputs a low voltage and the sixth control pin S6 becomes a high impedance; at the same time, the current output value can be adjusted according to the seventh resistor R7, and it can ensure that the current has no overshoot or oscillation, and maintain a constant current output state.

[0035] See also Figure 3 As shown, an embodiment of the present invention further provides a gate drive protection system, comprising a micro control unit 100, a gate drive protection circuit 200 as described above, the gate drive protection circuit 200 being electrically connected to the micro control unit 100, and a switch transistor 300 being electrically connected to the gate drive protection circuit 200. Optionally, the switch transistor 300 is an insulated gate bipolar transistor or a metal oxide semiconductor field effect transistor.

[0036] The gate drive protection system has a built-in integrated gate drive module 210, a fault signal output module 220, an undervoltage protection module 230, a short circuit protection module 240, a mis-conduction protection module 250 and a constant current output module 260, which can realize undervoltage protection, short circuit protection, switch transistor mis-conduction protection and constant current output protection for the circuit, so the system stability is stronger, the performance is more optimized, and the circuit is not easy to be damaged and scrapped.

[0037] An embodiment of the present invention further provides a vehicle-mounted inverter system, comprising the gate drive protection system described above.

[0038] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0039] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0040] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A gate drive protection circuit, characterized in that: include: Gate drive module, including drive chip; A fault signal output module, used to be electrically connected to the driving chip and the micro control unit, and used to output a fault signal; An undervoltage protection module, one end of which is electrically connected to the driver chip, and the other end of which is electrically connected to the fault signal output module, and is used to perform undervoltage protection on the input voltage of the driver chip; a short-circuit protection module, electrically connected to the driving chip and used for short-circuit protection of the driving chip, the short-circuit protection module comprising a fourth control pin electrically connected to the driving chip, a filter electrically connected to the fourth control pin, and a second resistor electrically connected to the filter, wherein the second resistor is grounded; a mis-conduction protection module, electrically connected to the driving chip, for preventing the switch transistor from being mis-conducted, the mis-conduction protection module comprising a fifth control pin, a sixth control pin, a seventh control pin, an eighth control pin, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a first MOS tube and a second MOS tube; The fifth control pin, the sixth control pin, the seventh control pin and the eighth control pin are all electrically connected to the driving chip; The fourth resistor is electrically connected to the drain of the first MOS transistor, the third resistor and the gate of the first MOS transistor are electrically connected to the fifth control pin, and the third resistor is connected in parallel with the fourth resistor; One end of the fifth resistor is electrically connected to the sixth control pin, one end of the sixth resistor is electrically connected to the seventh control pin, the other end of the fifth resistor, the other end of the sixth resistor and the eighth control pin are all electrically connected to the source of the first MOS transistor, and the source of the first MOS transistor, the other end of the fifth resistor, the other end of the sixth resistor and the seventh control pin are all electrically connected to the gate of the second MOS transistor; A connection node between the source of the second MOS transistor and the second resistor is electrically connected to the filter, the source of the second MOS transistor is grounded, and the drain of the second MOS transistor is electrically connected to the switch transistor; The constant current output module is electrically connected to the driving chip and is used to output a stable current.

2. The gate drive protection circuit according to claim 1, characterized in that: The fault signal output module includes a first control pin, a transistor and a first resistor; The first control pin is electrically connected to the driving chip; The collector of the transistor is used to be electrically connected to the micro control unit, the base of the transistor is electrically connected to the first control pin, the emitter of the transistor is electrically connected to one end of the first resistor, and the other end of the first resistor is grounded.

3. The gate drive protection circuit according to claim 2, characterized in that: The undervoltage protection module includes a second control pin, a third control pin and a capacitor; The second control pin and the third control pin are both electrically connected to the driving chip, and the second control pin is connected to a power supply; One end of the capacitor is electrically connected to the third control pin, and the other end of the capacitor is grounded to the other end of the first resistor.

4. The gate drive protection circuit according to claim 1, characterized in that: The constant current output module includes a ninth control pin, a tenth control pin and a seventh resistor; The ninth control pin and the tenth control pin are both electrically connected to the driving chip; One end of the seventh resistor is electrically connected to the tenth control pin, and the other end of the seventh resistor is grounded to the ninth control pin.

5. The gate drive protection circuit according to claim 4, characterized in that: The seventh resistor is a thermistor.

6. A gate drive protection system, characterized in that: include: Micro control unit; The gate drive protection circuit according to any one of claims 1 to 5, wherein the gate drive protection circuit is electrically connected to the micro control unit; as well as, A switching transistor is electrically connected to the gate drive protection circuit.

7. The gate drive protection system according to claim 6, characterized in that: The switch transistor is an insulated gate bipolar transistor or a metal oxide semiconductor field effect transistor.

8. A vehicle-mounted inverter system, characterized in that: The gate drive protection system comprises the gate drive protection system as claimed in any one of claims 6 to 7.

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