Heating device for high-throughput nucleic acid detector

Abstract

The present invention provides a heating device for a high-throughput nucleic acid detector, including a support plate, on which a plurality of chip receiving slots are constructed, and a plurality of heating components are arranged at the bottom of the chip receiving slots, and the plurality of heating components can respectively heat the plurality of chip receiving slots, and each heating component includes a heating plate and a heat conducting plate, wherein the heating plate is located on the side of the heat conducting plate away from the chip receiving slot. The present invention heats the space in each chip receiving slot to maintain a constant temperature, effectively reducing the energy consumption of heating and heat preservation, and at the same time, simplifies the manufacturing process, reduces processing costs and material costs, and is conducive to mass production.

Description

Technical Field

[0001] The present invention belongs to the technical field of nucleic acid detection, and in particular relates to a heating device for a high-throughput nucleic acid detector. Background Art

[0002] The heating device of the high-throughput nucleic acid detector in the prior art is as follows Figure 2 As shown, it mainly consists of a heating film cover plate 1a, a heating film 2a, a support plate 3a, an insulation box 4a and a spring sheet support plate 5a. A plurality of chip receiving slots are constructed on the insulation box 4a, so that the constant temperature of the chips in the plurality of chip receiving slots can be ensured by the heat of the heating film 2a. However, in the heating device of this structure, the heating film 2a is an integrated large-size structure. This heating film heats the insulation box 4a made of aluminum as a whole, which consumes a lot of energy. At the same time, the entire insulation box 4a is a CNC-machined aluminum structure. On the one hand, this type of insulation box leads to high material and processing costs, which is not conducive to mass production. On the other hand, there is a disadvantage that the temperature difference of multiple channels (i.e., chip passage slots) is large (approximately ±1°C). Summary of the invention

[0003] Therefore, the technical problem to be solved by the present invention is to provide a heating device for a high-throughput nucleic acid detector, which heats the space in each chip holding slot to maintain a constant temperature, effectively reducing the energy consumption of heating and insulation, and at the same time, simplifying the manufacturing process, reducing processing costs and material costs, and facilitating mass production.

[0004] In order to solve the above problems, the present invention provides a heating device for a high-throughput nucleic acid detector, including a support plate, on which a plurality of chip receiving slots are constructed, and a plurality of heating components are arranged at the bottom of the chip receiving slots, and the plurality of heating components can respectively heat the plurality of chip receiving slots, and each of the heating components includes a heating plate and a heat conducting plate, wherein the heating plate is located on the side of the heat conducting plate away from the chip receiving slot.

[0005] In some embodiments, the chip receiving slots have an even number, and two adjacent chip receiving slots share a heating assembly; and / or the support plate is a plastic part.

[0006] In some embodiments, the heating plate is a U-shaped electric heating film, and the heat conducting plate is a U-shaped aluminum plate.

[0007] In some embodiments, a temperature detection element is disposed on the heat conducting plate, and the temperature detection element is used to detect the real-time temperature of the heat conducting plate.

[0008] In some embodiments, the heating device further includes a chip in-place detection component, the chip in-place detection component includes a key switch board, the key switch board has a plurality of key switches, the number of the key switches is equal to the number of the chip accommodating slots and the two correspond one-to-one.

[0009] In some embodiments, the chip-in-place detection component also includes a mounting carrier, the mounting carrier has a plurality of cantilevers that can extend into the chip receiving slot, and the key switch board is connected to the cantilevers; and / or, also includes a chip-in-place indication component, the chip-in-place indication component includes a light board, the light board has a plurality of indicator lights, the indicator lights are arranged corresponding to each of the chip receiving slots, and the light board is configured to control the corresponding indicator light to light up when the key switch is pressed, and vice versa.

[0010] In some embodiments, a spring sheet is further provided above each of the cantilevers, and the spring sheet is provided corresponding to each of the chip receiving slots.

[0011] In some embodiments, the heating device further includes a support plate, wherein the support plate is connected to one side of the support plate, and the support plate and the support plate together form a clamping and positioning mechanism for the heating component.

[0012] In some embodiments, a temperature measuring heating plate is further provided between the support plate and the pallet, and is configured to control the power on and off of the heating plate and control the power on and off of the heating plate according to the temperature detection element.

[0013] In some embodiments, a relay board is further provided between the support plate and the support plate, and the light board, key switch board, and temperature measurement and heating plate are communicatively connected to the main control component of the high-throughput nucleic acid detector through the relay board.

[0014] The present invention provides a heating device for a high-throughput nucleic acid detector, which replaces the integrated heating element (heating film) in the prior art with a plurality of heating components corresponding to the chip receiving slots. This eliminates the need to heat the entire insulation box to maintain a constant temperature, but only requires heating the space within each of the chip receiving slots to maintain a constant temperature, thereby effectively reducing the energy consumption for heating and insulation. At the same time, the plurality of heating components are composed of a heating sheet and a heat conducting plate, which replaces the large-sized insulation box in the prior art. The production is achieved by laser wire cutting instead of CNC machining, thereby simplifying the manufacturing process, reducing machining costs and material costs, and facilitating mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of a heating device of a high-throughput nucleic acid detector according to an embodiment of the present invention (structural disassembly);

[0016] Figure 2 It is a schematic diagram of the structure of a heating device of a high-throughput nucleic acid detector in the prior art.

[0017] The reference numerals are as follows:

[0018] 1. Support plate; 2. Temperature detection element; 3. Temperature measurement and heating plate; 4. Key switch plate; 41. Key switch; 5. Relay board; 6. Support plate; 61. Chip accommodating slot; 7. Mounting carrier; 71. Cantilever; 72. Shrapnel; 8. Heating plate; 9. Heat conducting plate; 10. Light board; 101. Indicator light. DETAILED DESCRIPTION

[0019] See also Figure 1 As shown, according to an embodiment of the present invention, a heating device for a high-throughput nucleic acid detector is provided, including a support plate 6, on which a plurality of chip receiving slots 61 are constructed, and a plurality of heating components are arranged at the bottom of the chip receiving slots 61, and the plurality of heating components can respectively heat the plurality of chip receiving slots 61, and each of the heating components includes a heating plate 8 (specifically, for example, an electric heating film such as a PI heating film, a graphene heating film, or a silicone heating film) and a heat conducting plate 9, wherein the heating plate 8 is located on the side of the heat conducting plate 9 away from the chip receiving slot 61. In this technical solution, the integrated heating element (heating film) in the prior art is replaced by a plurality of heating components corresponding to the chip receiving slots 61, so that there is no need to heat the entire insulation box to maintain a constant temperature, but only the space in each of the chip receiving slots 61 needs to be heated to maintain a constant temperature, which effectively reduces the energy consumption of heating and heat preservation. At the same time, the plurality of heating components are composed of a heating plate 8 and a heat conducting plate 9, and the heat conducting plate 9 replaces the large-sized insulation box in the prior art. It is not necessary to use CNC machining but to use laser wire cutting to realize the production, which simplifies the manufacturing process, reduces the processing cost and material cost, and is conducive to mass production. It should be noted that the heating components of the present invention can be designed to be controlled independently of each other, so that it can decide whether to heat and keep warm according to the chip in place (that is, according to whether the chip is placed in the chip receiving slot 61), which can greatly reduce the energy consumption of heating and heat preservation.

[0020] In a specific embodiment, the chip receiving slots 61 have an even number, for example Figure 1 8 chip receiving slots 61 are shown (the corresponding heating device is also an eight-channel heating device at this time). Two adjacent chip receiving slots 61 share one heating component, which can facilitate the assembly between the heating component and the support plate 6 under the premise of reducing energy consumption. As an example, the heating plate 8 is a U-shaped electric heating film, and the heat conducting plate 9 is a U-shaped aluminum plate, which is convenient for the production of the heating plate 8 and the heat conducting plate 9. The electric heating film is attached to the side of the aluminum plate away from the chip receiving slot 61.

[0021] In order to improve the thermal insulation effect of the heating device, the support plate 6 is preferably a plastic part. The support plate 6 made of this material and the heat conductive sheet (such as an aluminum sheet) in each chip receiving slot 61 together form a thermal insulation effect. It should be noted that since the area of ​​the heat conductive sheet is small, the heat dissipation is more uniform and the heating speed is fast, thereby ensuring that the temperature difference of the heating device is within the range of ±0.5°C, and the constant temperature effect is better.

[0022] The heat conducting plate 9 is provided with a temperature detection element 2, and the temperature detection element 2 is used to detect the real-time temperature of the heat conducting plate 9. In specific applications, the temperature detection element 2 can be, for example, an overheat switch, which is arranged on the heat conducting plate 9 to realize real-time detection of the real-time temperature of the heat conducting plate 9. Taking eight channels as an example, there are four U-shaped aluminum plates. At this time, four overheat switches are arranged corresponding to each U-shaped aluminum plate. When the temperature exceeds the preset limit value, a corresponding alarm signal can be issued through the corresponding control panel and the corresponding heating component can be controlled to cut off the power and not heat.

[0023] The heating device also includes a chip in-place detection component, which includes a key switch board 4, and the key switch board 4 has a plurality of key switches 41. The number of the key switches 41 is equal to the number of the chip receiving slots 61 and the two correspond one to one, so as to be able to intelligently detect whether a chip is placed in each of the chip receiving slots 61. In this way, the heating component can be further intelligently controlled by the corresponding control board to determine whether it is heated. For example, when the key switch 41 is closed, it means that a chip is placed in the corresponding chip receiving slot 61. At this time, the corresponding heating device can be controlled to be powered on for heating, and when the key switch 41 is opened, it means that no chip is placed in the corresponding chip receiving slot 61. At this time, the corresponding heating device can be controlled to be powered off and not heated.

[0024] Furthermore, the chip in-place detection component also includes a mounting carrier 7, the mounting carrier 7 has a plurality of cantilevers 71 that can extend into the chip accommodating groove 61, the key switch board 4 is connected to the cantilever 71, specifically, the cantilever 71 is configured with an embedding hole, and the connecting portion of the key switch board 4 is connected to the embedding hole in an interference fit manner, without the need for bolts or the like, which can simplify the installation of the key switch board 4 and reduce the tediousness of wiring. When the key switch board 4 fails, it can be easily removed, making maintenance more convenient.

[0025] In some embodiments, the heating device also includes a chip in-place indication component, and the chip in-place indication component includes a lamp board 10, and the lamp board 10 has a plurality of indicator lights 101, and the indicator lights 101 are arranged corresponding to each of the chip receiving slots 61. The lamp board 10 is configured to control the corresponding indicator light 101 to light up when the push button switch 41 is pressed, and vice versa. At this time, the chip receiving slot 61 can be clearly located by the on and off of the indicator light 101.

[0026] In some embodiments, a spring clip 72 is provided above each cantilever 71, and the spring clip 72 is provided corresponding to each chip receiving slot 61. When a chip is placed in the corresponding chip receiving slot 61, the corresponding spring clip 72 will apply elastic force on the chip to ensure reliable and stable chip position.

[0027] In some embodiments, the heating device also includes a support plate 1, which is connected to one side of the support plate 6. The support plate 1 and the support plate 6 together form a clamping and positioning for the heating component. The support plate 1 can be, for example, a supporting aluminum plate. Of course, other hollow plates with a certain rigidity can also be used, which can significantly increase the overall structural strength of the heating device.

[0028] A temperature measuring and heating plate 3 may also be provided between the support plate 1 and the support plate 6, which is configured to control the power on and off of the heating plate 8 and control the power on and off of the heating plate 8 according to the temperature detection element 2. A relay board 5 may also be provided between the support plate 1 and the support plate 6, and the structure of the heating device is further compact. The light board 10, the key switch board 4, and the temperature measuring and heating plate 3 are connected to the main control component of the high-throughput nucleic acid detector through the relay board 5, realizing the control interaction between the aforementioned functional boards and the high-throughput nucleic acid detector.

[0029] It is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous methods can be freely combined and superimposed.

[0030] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention. The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present invention, and these improvements and variations should also be regarded as the protection scope of the present invention.

Claims

1. A heating device for a high-throughput nucleic acid detector, characterized in that: The invention comprises a support plate (6), on which a plurality of chip receiving slots (61) are constructed, and a plurality of heating components are arranged at the bottom of the chip receiving slots (61), and the plurality of heating components can heat the plurality of chip receiving slots (61) respectively, and each of the heating components comprises a heating plate (8) and a heat conducting plate (9), wherein the heating plate (8) is located on a side of the heat conducting plate (9) away from the chip receiving slot (61); and further comprises a chip in-place detection component, wherein the chip in-place detection component comprises a key switch plate (4), and the key switch plate (4) has a plurality of key switches (41), the number of the key switches (41) is equal to the number of the chip receiving slots (61) and the two respectively correspond one to one; and each of the heating components is designed to be controlled independently of each other, and can determine whether to heat and keep warm according to the chip in-place status detected by the chip in-place detection component.

2. The heating device according to claim 1, characterized in that The chip accommodating slots (61) have an even number, and two adjacent chip accommodating slots (61) share one heating component; and / or the support plate (6) is a plastic part.

3. The heating device according to claim 2, characterized in that: The heating plate (8) is a U-shaped electric heating film, and the heat conducting plate (9) is a U-shaped aluminum plate.

4. The heating device according to claim 3, characterized in that: A temperature detection element (2) is provided on the heat conducting plate (9), and the temperature detection element (2) is used to detect the real-time temperature of the heat conducting plate (9).

5. The heating device according to claim 4, characterized in that: The chip-in-place detection component further comprises a mounting carrier (7), the mounting carrier (7) having a plurality of cantilevers (71) capable of extending into the chip-accommodating slot (61), the key switch board (4) being connected to the cantilevers (71); and / or further comprises a chip-in-place indication component, the chip-in-place indication component comprising a light board (10), the light board (10) having a plurality of indicator lights (101), the indicator lights (101) being arranged corresponding to each of the chip-accommodating slots (61), the light board (10) being configured to control the corresponding indicator light (101) to light up when the key switch (41) is pressed down, and to control the corresponding indicator light (101) to turn off when the key switch (41) is pressed down.

6. The heating device according to claim 5, characterized in that: A spring sheet (72) is also provided above each cantilever (71), and the spring sheet (72) is arranged corresponding to each chip accommodating groove (61).

7. The heating device according to claim 5, characterized in that: It also comprises a support plate (1), wherein the support plate (1) is connected to one side of the support plate (6), and the support plate (1) and the support plate (6) together form a clamping and positioning mechanism for the heating component.

8. The heating device according to claim 7, characterized in that: A temperature measuring heating plate (3) is also provided between the support plate (1) and the support plate (6), and is configured to control the power on and off of the heating plate (8) and to control the power on and off of the heating plate (8) according to the temperature detection element (2).

9. The heating device according to claim 8, characterized in that: A relay board (5) is also provided between the support plate (1) and the support plate (6), and the light board (10), the key switch board (4), and the temperature measurement and heating board (3) are communicatively connected with the main control component of the high-throughput nucleic acid detector via the relay board (5).

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