A full-temperature intelligent testing device and intelligent adjustment method for solder-free circuit boards

Abstract

The invention relates to the field of circuit board testing and adjustment, and in particular to a full-temperature intelligent testing device for a circuit board without soldering and an intelligent adjustment method, comprising a testing base, a longitudinal translation pair, a lower circuit board under test, a spring pin, a vertical moving pair, a quick locking pair and an upper circuit board under test; the longitudinal translation pair is fixed on the testing base, and the vertical moving pair is connected to the longitudinal translation pair; the lower circuit board under test and the upper circuit board under test are both arranged on the vertical moving pair; the spring pins are respectively arranged on the lower circuit board under test and the upper circuit board under test; a testing circuit is installed on the base, and the quick locking pair is used to lock the testing circuit, and the longitudinal translation pair and the vertical moving pair are adjusted so that the spring pins on the lower circuit board under test and the upper circuit board under test are connected to the testing circuit, so as to realize circuit measurement; the invention designs a full-temperature intelligent testing device for a circuit board without soldering, which can test the circuit board simply and quickly, and can perform intelligent testing.

Description

Technical Field

[0001] The present invention relates to the field of circuit board testing and adjustment, and particularly to a full-temperature intelligent testing device and intelligent adjustment method for solderless circuit boards. Background Art

[0002] Circuit board debugging includes two aspects: testing and adjustment. The specific steps are as follows: First, power on the circuit board and observe; Second, add fixed signals for static adjustment; Finally, input appropriate signals for dynamic adjustment. When debugging a circuit board with pads, the input and output signals of the circuit board are connected to the power supply and measuring instruments through wires, and the connection method between the wires and the circuit board is via through-hole soldering. After multiple soldering operations on the circuit board, defects such as poor solderability of the circuit board pads, pad detachment, and circuit board warping are likely to occur, affecting the performance of the circuit board. Therefore, there is an urgent need for a device and adjustment method that can directly test the circuit without soldering the test circuit board. Summary of the Invention

[0003] For the circuit board debugging with strict restrictions on the number of soldering times, the present invention provides a full-temperature intelligent testing device for solderless circuit boards. The device includes a test base 1, a longitudinal translation pair 2, a lower test circuit board 3, spring pins 4, a vertical movement pair 6, a quick locking pair 7, and an upper test circuit board 8; the longitudinal translation pair 2 is fixed on the test base 1, and the vertical movement pair 6 is connected to the longitudinal translation pair 2; both the lower test circuit board 3 and the upper test circuit board 8 are arranged on the vertical movement pair 6; the spring pins 4 are respectively arranged on the lower test circuit board 3 and the upper test circuit board 8; the test circuit 5 is installed on the base 1, and the quick locking pair 7 is used to lock the test circuit 5, and the longitudinal translation pair 2 and the vertical movement pair 6 are adjusted so that the spring pins 4 on the lower test circuit board 3 and the upper test circuit board 8 are electrically connected to the test circuit 5 to achieve circuit measurement.

[0004] Preferably, the longitudinal translation pair 2 includes a linear motion support seat 21, a guide rail shaft support seat 22, a longitudinal motor mounting seat 23, a longitudinal motor 24, a longitudinal translation fixing plate 25, and a guide rail shaft 26; the guide rail shaft 26 passes through the linear motion support seat 21 and is fixed on the guide rail shaft support seat 22; the longitudinal translation fixing plate 25 is fixed on the linear motion support seat 21; the longitudinal motor 24 is arranged in the longitudinal motor mounting seat 23, and the transmission shaft of the longitudinal motor 24 is connected to the longitudinal translation fixing plate 25.

[0005] Further, high and low temperature grease is coated on the guide rail shaft 26 to enable the linear motion support seat 21 to slide on the guide rail shaft 26.

[0006] Further, the transmission shaft of the longitudinal motor 24 is threadedly connected to the longitudinal translation fixing plate 25.

[0007] Preferably, the vertical moving pair 6 includes a vertically lower moving plate 61, a positioning pin 62, a vertically upper moving plate 63, a vertical double-headed screw 64, a vertical driven gear 65, a vertical driving gear 66, a vertical motor fixing seat 67 and a vertical motor 68; the positioning pin 62 passes through the vertically lower moving plate 61 and the vertically upper moving plate 63; the vertical motor 68 is arranged in the vertical motor fixing seat 67, and the power shaft of the vertical motor 68 is connected to the vertical driving gear 66; the vertical driving gear 66 meshes with the vertical driven gear 65; the vertical driving gear 66 is arranged on the vertical double-headed screw 64, and the vertical double-headed screw 64 is respectively connected to the vertically lower moving plate 61 and the vertically upper moving plate 63; when the vertical motor 68 rotates, the power of the vertical motor 68 acts on the vertically lower moving plate 61 and the vertically upper moving plate 63 through the vertical driving gear 66, the vertical driven gear 65 and the vertical double-headed screw 64 to control the vertical up and down movement of the vertically lower moving plate 61 and the vertically upper moving plate 63.

[0008] Further, the vertical double-headed screw 64 is threadedly connected to the vertically lower moving plate 61 and the vertically upper moving plate 63.

[0009] Preferably, the lower test circuit board 3 is arranged on the upper top surface of the vertically lower moving plate 61 of the vertical moving pair 6, and the upper test circuit board 8 is arranged on the lower bottom surface of the vertically upper moving plate 63 of the vertical moving pair 6; the spring pins 4 are respectively arranged on the lower test circuit board 3 and the upper test circuit board 8, and the pins of the spring pins 4 correspond to each other.

[0010] Preferably, the quick locking pair 7 includes a locking silicone rubber 71, a locking pressing block 72 and a wedge-shaped locking device 73; the locking silicone rubber 71 is connected to the test base 1, and the test circuit 5 is arranged on the locking silicone rubber 71; the wedge-shaped locking device 73 is arranged on the locking pressing block 72, and the test circuit 5 is fixed by the wedge-shaped locking device 73 and the locking pressing block 72.

[0011] An intelligent adjustment method for a full-temperature intelligent test device for a circuit board without soldering, the test device used in the adjustment method is a full-temperature intelligent test device for a circuit board without soldering; the test steps include:

[0012] S1: Open the quick locking pair 7, install the test circuit 5 in the locking silicone rubber 71, and fix the test circuit 5 by using the locking pressing block 72 and the wedge-shaped locking device 73;

[0013] S2: Start the longitudinal motor 24 in the longitudinal translation pair 2, drive the longitudinal translation fixing plate 25 and the linear motion support seat 21 to slide on the guide rail shaft 26 through the power shaft of the longitudinal motor 24 to ensure that the spring pins 4 are vertically aligned with the test circuit 5; at this time, the longitudinal motor 24 stops working;

[0014] S3: Start the vertical motor 68 of the vertical moving pair 6. The vertical driving gear 66 fixed on the vertical motor 68 drives the vertical driven gear 65 to rotate, thereby driving the vertical double-headed screw 64 to rotate. Finally, the vertically lower moving plate 61 and the vertically upper moving plate 63 slide vertically on the positioning pin 62. When the spring pins fixed on the upper test circuit board 8 and the lower test circuit board 3 are in close contact with the test circuit 5 and the springs on the spring pins are deformed, the vertical motor 68 stops working;

[0015] S4: Perform performance tests on the test circuit 5 at normal temperature, high temperature and low temperature, collect and organize the test data through a multi-channel data acquisition system, and save the organized test data;

[0016] S6: Reverse-start the vertical motor 68. When the spring pin 4 is separated from the test circuit 5, the vertical motor 68 stops working. Reverse-start the longitudinal motor 24 to make the longitudinal translation fixing plate 25 slide in the reverse direction. When the longitudinal translation fixing plate 25 returns to the position before the test, the longitudinal motor 24 stops working;

[0017] S7: Intelligently adjust the circuit board 5 according to the saved test data, and re-perform the measurements in steps S2 and S3 on the adjusted test circuit 5 until the test circuit 5 meets the design specifications.

[0018] Preferably, the intelligent adjustment of the circuit board 5 according to the saved test data includes: calculating the impedance and capacitive reactance values required for the circuit board adjustment based on the collected test data; matching the corresponding resistors and capacitors according to the calculated impedance values and capacitive reactance values; placing the all-temperature intelligent test device for circuit boards without soldering on the working table of the soldering robot. The soldering robot selects the corresponding electronic components and solders them to the corresponding positions of the test circuit 5 to complete the adjustment of the test circuit 5.

[0019] The beneficial effects of the present invention are as follows:

[0020] 1. The present invention designs an all-temperature intelligent test device for circuit boards without soldering, which can test the circuit boards simply and quickly and can perform intelligent tests;

[0021] 2. Compared with the traditional circuit board test method, it is not necessary to solder the circuit board to obtain the required test data, which is suitable for circuit boards with strict requirements on the number of soldering times;

[0022] 3. The size of the all-temperature intelligent test device for circuit boards without soldering can be designed according to the actual size of the test circuit, and it can perform batch tests with higher test efficiency;

[0023] 4. The all-temperature intelligent test device for circuit boards without soldering has a low manufacturing cost and does not require a special test site. It can be placed on the working table for testing;

[0024] 5. The full-temperature intelligent testing device for circuit boards without soldering can be placed in a high and low temperature incubator to test circuit boards within the full temperature range, and collect and organize test data;

[0025] 6. The full-temperature intelligent testing device for circuit boards without soldering can be placed on the workbench of a soldering robot, and the soldering robot adjusts the circuit according to the test data to realize the intelligent debugging of the test circuit. Description of the Drawings

[0026] Figure 1 It is a schematic structural diagram of the full-temperature intelligent testing device for circuit boards without soldering designed by the present invention;

[0027] Figure 2 It is a schematic structural diagram of the longitudinal translation pair of the present invention;

[0028] Figure 3 It is a schematic structural diagram of the vertical movement pair of the present invention;

[0029] Figure 4 It is a schematic structural diagram of the quick locking pair of the present invention;

[0030] Among them, 1. Test base, 2. Longitudinal translation pair, 21. Linear motion support seat, 22. Guide rail shaft support seat, 23. Longitudinal motor mounting seat, 24. Longitudinal motor, 25. Longitudinal translation fixing plate, 26. Guide rail shaft, 3. Lower test circuit board, 4. Spring pin, 5. Test circuit, 6. Vertical movement pair, 61. Vertically moving lower plate, 62. Positioning pin, 63. Vertically moving upper plate, 64. Vertical double-headed screw, 65. Vertical driven gear, 66. Vertical driving gear, 67. Vertical motor fixing seat, 68. Vertical motor, 7. Quick locking pair, 71. Locking silicone rubber, 72. Locking pressure block, 73. Wedge-shaped lock, 8. Upper test circuit board. Detailed Embodiment

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] A full-temperature intelligent testing device for circuit boards without soldering, as Figure 1As shown in the figure, the device includes a test base 1, a longitudinal translation pair 2, a lower test circuit board 3, spring pins 4, a vertical movement pair 6, a quick locking pair 7, and an upper test circuit board 8. The longitudinal translation pair 2 is fixed on the test base 1, and the vertical movement pair 6 is connected to the longitudinal translation pair 2. Both the lower test circuit board 3 and the upper test circuit board 8 are arranged on the vertical movement pair 6. The spring pins 4 are respectively arranged on the lower test circuit board 3 and the upper test circuit board 8. The test circuit 5 is installed on the base 1, and the quick locking pair 7 is used to lock the test circuit 5. The longitudinal translation pair 2 and the vertical movement pair 6 are adjusted so that the spring pins 4 on the lower test circuit board 3 and the upper test circuit board 8 are electrically connected to the test circuit 5 to achieve circuit measurement.

[0033] As Figure 2 shown, the longitudinal translation pair 2 includes a linear motion support base 21, a guide rail shaft support base 22, a longitudinal motor mounting base 23, a longitudinal motor 24, a longitudinal translation fixing plate 25, and a guide rail shaft 26. The guide rail shaft 26 passes through the linear motion support base 21 and is fixed on the guide rail shaft support base 22. The longitudinal translation fixing plate 25 is fixed on the linear motion support base 21. The longitudinal motor 24 is arranged in the longitudinal motor mounting base 23, and the transmission shaft of the longitudinal motor 24 is connected to the longitudinal translation fixing plate 25. The longitudinal translation pair 2 provides the power for the front-back movement of the full-temperature intelligent test device for the circuit board without welding, so that the lower test circuit board 3 and the upper test circuit board 8 can adjust their front-back positions to achieve more accurate measurement.

[0034] Optionally, the guide rail shaft 26 is in clearance fit with the linear motion support base 21, that is, a through hole is provided on the linear motion support base 21, and the diameter of the through hole is slightly larger than that of the guide rail shaft 26, so that the linear motion support base 21 can slide on the guide rail shaft 26.

[0035] Preferably, high and low temperature grease is coated on the guide rail shaft 26, so that the linear motion support base 21 can slide more easily on the guide rail shaft 26.

[0036] Preferably, the transmission shaft of the longitudinal motor 24 is threadedly connected to the longitudinal translation fixing plate 25. When the longitudinal motor 24 rotates, since the longitudinal translation fixing plate 25 is fixed by the guide rail shaft 26, the longitudinal translation fixing plate 25 will not rotate with the rotation of the transmission shaft. And the transmission shaft is threadedly connected to the longitudinal translation fixing plate 25, so that the longitudinal translation fixing plate 25 moves along the thread direction.

[0037] The test base 1 is of a cuboid structure, and support columns are respectively arranged at the four corners of the upper surface of the cuboid. The four support columns are used to fix the guide rail shaft support base 22 of the longitudinal translation pair 2.

[0038] A fixing groove is provided on the test base 1, and the fixing groove is used to place the locking silicone rubber 71 of the quick locking pair 7 to prevent the locking silicone rubber 71 from moving.

[0039] As shown Figure 3 in FIG. 1, the vertical moving pair 6 includes a vertically downward moving plate 61, a positioning pin 62, a vertically upward moving plate 63, a vertical double-headed screw 64, a vertical driven gear 65, a vertical driving gear 66, a vertical motor fixing seat 67 and a vertical motor 68; the positioning pin 62 passes through the vertically downward moving plate 61 and the vertically upward moving plate 63; the vertical motor 68 is arranged in the vertical motor fixing seat 67, and the power shaft of the vertical motor 68 is connected to the vertical driving gear 66; the vertical driving gear 66 meshes with the vertical driven gear 65; the vertical driving gear 66 is arranged on the vertical double-headed screw 64, and the vertical double-headed screw 64 is respectively connected to the vertically downward moving plate 61 and the vertically upward moving plate 63; when the vertical motor 68 rotates, the power of the vertical motor 68 acts on the vertically downward moving plate 61 and the vertically upward moving plate 63 through the vertical driving gear 66, the vertical driven gear 65 and the vertical double-headed screw 64, to control the vertical up and down movement of the vertically downward moving plate 61 and the vertically upward moving plate 63.

[0040] Optionally, the positioning pin 62 has a clearance fit with the vertically downward moving plate 61 and the vertically upward moving plate 63, so that the vertically downward moving plate 61 and the vertically upward moving plate 63 can slide on the positioning pin 62. Preferably, the positioning pin 62 is coated with high and low temperature grease, so that the vertically downward moving plate 61 and the vertically upward moving plate 63 can slide more easily on the positioning pin 62.

[0041] Preferably, the vertical double-headed screw 64 is threadedly connected to the vertically downward moving plate 61 and the vertically upward moving plate 63; when the vertical motor 68 rotates, since the vertically downward moving plate 61 and the vertically upward moving plate 63 are fixed by the positioning pin 62, the vertically downward moving plate 61 and the vertically upward moving plate 63 will not rotate with the power transmitted by the vertical motor 68, and the vertical double-headed screw 64 is threadedly connected to the vertically downward moving plate 61 and the vertically upward moving plate 63, so that the vertical double-headed screw 64 and the vertically downward moving plate 61 move along the thread direction.

[0042] The lower test circuit board 3 is arranged on the upper top surface of the vertically downward moving plate 61 of the vertical moving pair 6, and the upper test circuit board 8 is arranged on the lower bottom surface of the vertically upward moving plate 63 of the vertical moving pair 6; the spring pins 4 are respectively arranged on the lower test circuit board 3 and the upper test circuit board 8, and the pins of the spring pins 4 correspond to each other.

[0043] Preferably, the spring pins 4 are welded using a special welding tool.

[0044] As Figure 4As shown, the quick locking pair 7 includes a locking silicone rubber 71, a locking pressing block 72, and a wedge-shaped locking device 73; the locking silicone rubber 71 is connected to the test base 1, and the test circuit 5 is arranged on the locking silicone rubber 71; the wedge-shaped locking device 73 is arranged on the locking pressing block 72, and the test circuit 5 is fixed by the wedge-shaped locking device 73 and the locking pressing block 72.

[0045] An intelligent adjustment method for a full-temperature intelligent test device for a circuit board without soldering. The test device used in this adjustment method is a full-temperature intelligent test device for a circuit board without soldering; the test steps include:

[0046] S1: Open the quick locking pair 7, install the test circuit 5 in the locking silicone rubber 71, and fix the test circuit 5 with the locking pressing block 72 and the wedge-shaped locking device 73;

[0047] S2: Start the longitudinal motor 24 in the longitudinal translation pair 2. Drive the longitudinal translation fixing plate 25 and the linear motion support seat 21 to slide on the guide rail shaft 26 through the power shaft of the longitudinal motor 24 to ensure that the spring pins 4 are vertically aligned with the test circuit 5; at this time, the longitudinal motor 24 stops working;

[0048] S3: Start the vertical motor 68 of the vertical movement pair 6. The vertical drive gear 66 fixed on the vertical motor 68 drives the vertical driven gear 65 to rotate, thereby driving the vertical double-headed screw 64 to rotate. Finally, the vertical lower moving plate 61 and the vertical upper moving plate 63 slide vertically on the positioning pin 62; when the spring pins on the test upper circuit board 8 and the test lower circuit board 3 are in close contact with the test circuit 5 and the springs on the spring pins are deformed, the vertical motor 68 stops working;

[0049] S4: Perform performance tests on the test circuit 5 at normal temperature, high temperature, and low temperature, collect and organize the test data through a multi-channel data acquisition system, and save the organized test data;

[0050] S6: Reverse-start the vertical motor 68. When the spring pins 4 are separated from the test circuit 5, the vertical motor 68 stops working; reverse-start the longitudinal motor 24 to make the longitudinal translation fixing plate 25 slide in the reverse direction. When the longitudinal translation fixing plate 25 returns to the position before the test, the longitudinal motor 24 stops working;

[0051] S7: Intelligently adjust the circuit board 5 according to the saved test data, and re-perform the measurements in steps S2 and S3 on the adjusted test circuit 5; until the test circuit 5 meets the design specifications.

[0052] The intelligent adjustment of the circuit board 5 according to the saved test data includes: calculating the impedance and capacitive reactance values required for the adjustment of the circuit board based on the collected test data; matching the corresponding resistors and capacitors according to the calculated impedance values and capacitive reactance values; placing the full-temperature intelligent test device for the circuit board without soldering on the workbench of the soldering robot, and the soldering robot selects the corresponding electronic components and solders them to the corresponding positions of the test circuit 5 to complete the adjustment of the test circuit 5.

[0053] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "outer", "front", "center", "both ends", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present invention.

[0054] In the present invention, unless otherwise clearly specified and defined, the terms "installation", "setting", "connection", "fixation", "rotation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] The above-mentioned embodiments have further detailed the purpose, technical solutions and advantages of the present invention. It should be understood that the above-mentioned embodiments are only the preferred embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made to the present invention within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A full-temperature intelligent testing device for solder-free circuit boards, characterized in that: The device comprises a test base (1), a longitudinal translation pair (2), a test lower circuit board (3), a spring pin (4), a vertical movement pair (6), a quick locking pair (7) and a test upper circuit board (8); the longitudinal translation pair (2) is fixed on the test base (1), and the vertical movement pair (6) is connected to the longitudinal translation pair (2); the test lower circuit board (3) and the test upper circuit board (8) are both arranged on the vertical movement pair (6); the spring pin (4) is respectively arranged on the test lower circuit board (3) and the test upper circuit board (8); the test circuit (5) is installed on the base (1), and the test circuit (5) is locked by using the quick locking pair (7); the longitudinal translation pair (2) and the vertical movement pair (6) are adjusted so that the spring pins (4) on the test lower circuit board (3) and the test upper circuit board (8) are connected to the test circuit (5), thereby realizing circuit measurement; The longitudinal translation pair (2) comprises a linear motion support seat (21), a guide shaft support seat (22), a longitudinal motor mounting seat (23), a longitudinal motor (24), a longitudinal translation fixing plate (25) and a guide shaft (26); the guide shaft (26) passes through the linear motion support seat (21) and is fixed to the guide shaft support seat (22); the longitudinal translation fixing plate (25) is fixed to the linear motion support seat (21); the longitudinal motor (24) is arranged in the longitudinal motor mounting seat (23), and the transmission shaft of the longitudinal motor (24) is connected to the longitudinal translation fixing plate (25); the guide shaft (26) is coated with high and low temperature grease, so that the linear motion support seat (21) slides on the guide shaft (26); the transmission shaft of the longitudinal motor (24) is connected to the longitudinal translation fixing plate (25) by threading; The vertical moving pair (6) comprises a vertical downward moving plate (61), a positioning pin (62), a vertical upward moving plate (63), a vertical double-headed screw (64), a vertical driven gear (65), a vertical driving gear (66), a vertical motor fixing seat (67) and a vertical motor (68); the positioning pin (62) passes through the vertical downward moving plate (61) and the vertical upward moving plate (63); the vertical motor (68) is arranged in the vertical motor fixing seat (67), and the power shaft of the vertical motor (68) is connected to the vertical driving gear (66); the vertical driving gear (66) is meshed with the vertical driven gear (65); the vertical driving gear (66) is arranged on the vertical double-headed screw (64), and the vertical double-headed screw (64) is respectively connected to the vertical downward moving plate (61) and the vertical upward moving plate (63); when the vertical motor (68) rotates, the power of the vertical motor (68) acts on the vertical downward moving plate (61) and the vertical upward moving plate (63) through the vertical driving gear (66), the vertical driven gear (65) and the vertical double-headed screw (64), and controls the vertical downward moving plate (61) and the vertical upward moving plate (63) to move up and down; the vertical double-headed screw (64) is threadedly connected to the vertical downward moving plate (61) and the vertical upward moving plate (63).

2. A full-temperature intelligent testing device for solder-free circuit boards according to claim 1, characterized in that: The test lower circuit board (3) is arranged on the upper top surface of the vertically movable lower plate (61) of the vertically movable pair (6), and the test upper circuit board (8) is arranged on the lower bottom surface of the vertically movable upper plate (63) of the vertically movable pair (6); the spring pins (4) are respectively arranged on the test lower circuit board (3) and the test upper circuit board (8), and the pins of the spring pins (4) correspond to each other.

3. A full-temperature intelligent testing device for solder-free circuit boards according to claim 1, characterized in that: The quick locking pair (7) comprises a locking silicone rubber (71), a locking pressure block (72) and a wedge-shaped locking device (73); the locking silicone rubber (71) is connected to the test base (1), and the test circuit (5) is arranged on the locking silicone rubber (71); the wedge-shaped locking device (73) is arranged on the locking pressure block (72), and the test circuit (5) is fixed by the wedge-shaped locking device (73) and the locking pressure block (72).

4. An intelligent adjustment method for a full-temperature intelligent test device for a solder-free circuit board, characterized in that: The test device used in the adjustment method is a full-temperature intelligent test device for solder-free circuit boards according to any one of claims 1 to 3; comprising: S1: Open the quick locking pair (7), install the test circuit (5) in the locking silicone rubber (71), and fix the test circuit (5) using the locking pressure block (72) and the wedge-shaped locker (73); S2: Start the longitudinal motor (24) in the longitudinal translation pair (2), and drive the longitudinal translation fixing plate (25) and the linear motion support seat (21) to slide on the guide shaft (26) through the power shaft of the longitudinal motor (24), so as to ensure that the spring needle (4) and the test circuit (5) are vertically aligned; at this time, the longitudinal motor (24) stops working; S3: starting the vertical motor (68) of the vertical moving pair (6), and the vertical driving gear (66) fixed on the vertical motor (68) drives the vertical driven gear (65) to rotate, thereby driving the vertical double-headed screw (64) to rotate, and finally the vertical lower moving plate (61) and the vertical upper moving plate (63) slide vertically on the positioning pin (62); when the spring pins fixed on the test upper circuit board (8) and the test lower circuit board (3) are in close contact with the test circuit (5), and the spring on the spring pin is deformed, the vertical motor (68) stops working; S4: Performing performance tests on the test circuit (5) at room temperature, high temperature and low temperature, collecting and collating the test data through a multi-channel data acquisition system, and saving the collated test data; S6: Reversely start the vertical motor (68), and when the spring pin (4) is separated from the test circuit (5), the vertical motor (68) stops working; reversely start the longitudinal motor (24), so that the longitudinal translation fixing plate (25) slides in the reverse direction, and when the longitudinal translation fixing plate (25) returns to the position before the test, the longitudinal motor (24) stops working; S7: Intelligently adjust the circuit board according to the stored test data, and re-execute the measurements of step S2 and step S3 on the adjusted test circuit (5) until the test circuit (5) meets the design specifications.

5. The intelligent adjustment method for a full-temperature intelligent testing device for a solder-free circuit board according to claim 4, characterized in that: Intelligently adjusting the circuit board according to the stored test data includes: calculating the impedance and capacitive reactance values ​​required for the circuit board adjustment according to the collected test data; matching the corresponding resistance and capacitance according to the calculated impedance and capacitive reactance values; placing the circuit board soldering-free full-temperature intelligent test device on a welding robot workbench, the welding robot selecting corresponding electronic components and soldering them to corresponding positions of the test circuit (5), and completing the adjustment of the test circuit (5).

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