Thermal stress analysis method, system and terminal device for multilayer membrane element

Abstract

The embodiment of the present application provides a method, system and terminal device for thermal stress analysis of a multilayer membrane element. The method is applied to the ANSYS Workbench platform, including: adding material properties of components required to constitute the multilayer membrane element in the steady-state structure module; using a geometric model tool to create a three-dimensional model of the substrate of the multilayer membrane element, and meshing the substrate to obtain a network model; then defining the multilayer membrane three-dimensional solid-shell unit by inserting a command and setting its cross section according to the material properties and thickness of different membrane layers of the multilayer membrane element; finally, based on the temperature distribution data of the multilayer membrane element, setting the boundary conditions of the network model and solving the thermal stress to obtain the thermal stress analysis results of the multilayer membrane element. It solves the pain points of the difficulty in modeling multilayer membranes and the difficulty in meshing high aspect ratios, and realizes the thermal stress analysis of multilayer membrane elements for the first time in ANSYS Workbench.

Description

Technical Field

[0001] The present application relates to the technical field of finite element analysis, and in particular to a method, system and terminal device for thermal stress analysis of a multilayer membrane element. Background Art

[0002] Multilayer monochromators are widely used in many synchrotron radiation facilities at home and abroad, such as BSRF, NSRL, SSRF in China, Spring-8 in Japan, ESRF in France, APS in the United States, etc. When the surface of a multilayer film element absorbs a high heat load, it will produce a large deformation. Due to the different thermal expansion coefficients of the film layer material and the substrate material, a very large thermal stress will be generated in the film layer of the multilayer film element, which has an adverse effect on the safety of the film layer. In order to predict the performance and service life of the multilayer film structure, the finite element method can be used for simulation analysis. However, due to the high aspect ratio of the multilayer film structure, that is, the huge difference in scale (10^6) between the thickness (nm) and the length and width (mm) of the film, it brings great difficulties to the finite element meshing and simulation analysis. At present, the finite element analysis of the thermal stress of multilayer film elements cannot be performed in ANSYS WORKBENCH. The few existing cases are all implemented by writing APDL codes in the classic ANSYS environment. Because they are in the classic ANSYS environment, the modeling, meshing and load application processes are not intuitive enough, and the human-computer interaction is not friendly. In addition, it involves many deep-level technologies of finite element units, making it difficult for beginners to master this method. If problems arise, it is also difficult to troubleshoot them. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a thermal stress analysis method, system and terminal device for multi-layer membrane elements based on ANSYS Workbench, which can accurately simulate the thermal stress analysis results of the multi-layer membrane elements, especially the stress conditions inside each membrane layer, and solve the current problem of difficulty in finite element analysis of multi-layer membrane elements with huge aspect ratio differences.

[0004] In a first aspect, an embodiment of the present application provides a method for thermal stress analysis of a multilayer membrane element, which is applied to an ANSYS Workbench platform, and the method includes:

[0005] Adding material properties of components required to constitute the multilayer membrane element in the steady-state structure module, wherein the components of the multilayer membrane element include a substrate and different membrane layers;

[0006] Using a geometric model tool to create a three-dimensional model of the substrate, and using a network partitioning tool to mesh the substrate to obtain a network model;

[0007] In the model setting interface, a multilayer membrane three-dimensional solid-shell unit is defined by inserting a command, and a cross section of the multilayer membrane three-dimensional solid-shell unit is set according to the material properties and thickness of the different membrane layers;

[0008] Based on the temperature distribution data of the multilayer membrane element, setting the boundary conditions of the network model including the multilayer membrane three-dimensional solid-shell element;

[0009] The network model with the boundary conditions is subjected to thermal stress solving to obtain the thermal stress analysis result of the multilayer membrane element.

[0010] In some embodiments, the step of defining a multilayer membrane three-dimensional solid-shell unit by inserting a command in a model setting interface includes:

[0011] Selecting the upper surface nodes of the created three-dimensional model of the substrate, and copying the nodes upwards according to the total thickness of all film layers in the multilayer film element;

[0012] The multilayer membrane three-dimensional solid-shell unit is established by using eight corresponding and adjacent nodes in sequence until all upper and lower nodes are used up.

[0013] In some embodiments, setting the boundary conditions of the network model based on the temperature distribution data of the multilayer membrane element includes:

[0014] The bottom surface nodes of the substrate are set as fixed constraints without friction constraints;

[0015] According to the temperature distribution data of the substrate of the multilayer membrane element, applying a temperature load to each node of the substrate by command;

[0016] According to the temperature distribution data of each membrane layer of the multilayer membrane element, a corresponding temperature load is applied to each layer unit in the multilayer membrane three-dimensional solid-shell unit by command mode; the applied temperature load is used to solve thermal stress.

[0017] In some embodiments, the thermal stress analysis results of the multilayer film element include deformation and stress distribution of the substrate and each film layer calculated based on the applied temperature load;

[0018] The deformation and stress distribution of each film layer are displayed by adding commands.

[0019] In some embodiments, creating the three-dimensional model of the substrate comprises:

[0020] A three-dimensional model of a quarter of the substrate is established, and then the three-dimensional model of the substrate is adjusted according to the actual size of the substrate through a stretching function.

[0021] In some embodiments, the gridding the substrate using a network partitioning tool to obtain a network model includes:

[0022] The substrate is meshed using hexahedral network units to obtain a hexahedral mesh model.

[0023] In some embodiments, the material properties of the component include one or more of a coefficient of thermal expansion, a Poisson's ratio, and a Young's modulus of each of the substrate and the different film layers.

[0024] In a second aspect, an embodiment of the present application provides a multilayer membrane element thermal stress analysis system, which is applied to the ANSYS Workbench platform, and the system includes:

[0025] A steady-state analysis unit, used for adding material properties of components required to constitute the multilayer membrane element in the steady-state structure module, wherein the components of the multilayer membrane element include a substrate and different membrane layers;

[0026] A model creation unit, used for creating a three-dimensional model of the substrate using a geometric model tool;

[0027] A mesh division unit, used for meshing the substrate using a network division tool to obtain a network model;

[0028] A model definition unit, used to define a multilayer membrane three-dimensional solid-shell unit by inserting a command in a model setting interface, and to set a cross section of the multilayer membrane three-dimensional solid-shell unit according to the material properties and thicknesses of the different membrane layers;

[0029] A boundary setting unit, used to set the boundary conditions of the network model including the multilayer membrane three-dimensional solid-shell element based on the temperature distribution data of the multilayer membrane element;

[0030] The thermal stress analysis unit is used to solve the thermal stress of the network model set with the boundary conditions to obtain the thermal stress analysis result of the multilayer membrane element.

[0031] In a third aspect, an embodiment of the present application provides a terminal device, which includes a processor and a memory, wherein the memory stores a computer program, and the processor is used to execute the computer program to implement the above-mentioned multilayer membrane element thermal stress analysis method.

[0032] In a fourth aspect, an embodiment of the present application provides a readable storage medium storing a computer program, which, when executed on a processor, implements the above-mentioned multilayer film element thermal stress analysis method.

[0033] The embodiments of the present application have the following beneficial effects:

[0034] The thermal stress analysis method of the multilayer membrane element based on ANSYS Workbench in the embodiment of the present application is to add the material properties of the components required to constitute the multilayer membrane element in the steady-state structure module; use the geometric model tool to create a three-dimensional model of the substrate of the multilayer membrane element, and mesh the substrate to obtain a network model; then define the multilayer membrane three-dimensional solid-shell unit by inserting a command and set its section according to the material properties and thickness of different membrane layers of the multilayer membrane element; finally, based on the temperature distribution data of the multilayer membrane element, set the boundary conditions of the network model and solve the thermal stress to obtain the thermal stress analysis results of the multilayer membrane element. This method can accurately simulate the deformation and stress distribution data of the multilayer membrane element, especially the stress situation inside each membrane layer, and solve the current problem of difficult finite element analysis of multilayer membrane elements with huge aspect ratio size differences; and, using the more visualized and interactive ANSYS Workbench, it has high efficiency in pre- and post-processing, and compared with the complex and obscure finite element classical interface, it has the characteristics of high efficiency in pre- and post-processing, easy implementation, and simple operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 A first flow chart of a method for analyzing thermal stress of a multilayer film element according to an embodiment of the present application is shown;

[0037] Figure 2 The interface of the steady-state structural analysis model in ANSYS Workbench of the embodiment of the present application is shown;

[0038] Figure 3 A three-dimensional model of a substrate of a multilayer membrane element according to an embodiment of the present application is shown;

[0039] Figure 4 A schematic diagram of a hexahedral grid of a substrate of a multilayer membrane element according to an embodiment of the present application is shown;

[0040] Figure 5 A schematic diagram of constructing a three-dimensional solid-shell unit of a multilayer membrane according to an embodiment of the present application is shown;

[0041] Figure 6 A second flow chart of the method for analyzing thermal stress of a multilayer film element according to an embodiment of the present application is shown;

[0042] Figure 7a and Figure 7b The equivalent stress and deformation distribution of a substrate of a multilayer membrane element of an embodiment of the present application are respectively shown;

[0043] Figure 8a and Figure 8b The stress distribution of the 159th and 160th layers of a multilayer film element according to an embodiment of the present application is shown respectively;

[0044] Fig. 9 A schematic structural diagram of a multilayer membrane element thermal stress analysis system according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0046] The components of the embodiments of the present application generally described and shown in the drawings herein may be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0047] Hereinafter, the terms "including", "having" and their cognates, which may be used in various embodiments of the present application, are intended only to indicate specific features, numbers, steps, operations, elements, components, or combinations of the foregoing items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing items or adding the possibility of one or more features, numbers, steps, operations, elements, components, or combinations of the foregoing items.

[0048] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0049] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as those generally understood by those skilled in the art to which the various embodiments of the present application belong. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meanings as the contextual meanings in the relevant technical field and will not be interpreted as having idealized meanings or overly formal meanings unless clearly defined in the various embodiments of the present application.

[0050] ANSYS Workbench, as a model analysis tool, has powerful functions, including but not limited to simulation of various types of structural materials, simplified analysis of complex fluid dynamics engineering and other engineering simulation analysis and design. Due to its friendly visual interface, easy operation, high pre- and post-processing efficiency, it is widely used in different fields such as construction, exploration, geology, water conservancy, transportation, electricity, surveying and mapping, land, environment, forestry, metallurgy, etc.

[0051] For a multilayer membrane element including a substrate and different membrane layer structures, in order to predict the performance and service life of the different membrane layer structures, a simulation analysis can be performed by using the finite element method. As mentioned above, due to the existing finite element analysis of multilayer membrane elements, there is a problem that the high aspect ratio of the multilayer membrane structure is very different, and it can only be implemented by writing APDL code in the classic ANSYS environment, which is not intuitive and difficult to operate. In this regard, this application proposes a layer membrane element thermal stress analysis method based on the ANSYS Workbench platform, which well solves the problem that the finite element analysis of the thermal stress of the multilayer membrane element cannot be performed in ANSYS WORKBENCH. Not only that, by using the temperature distribution data of the multilayer membrane element for boundary setting, the deformation and stress distribution data of the multilayer membrane element can be accurately simulated, especially the stress condition inside each membrane layer, which solves the current problem of the difficulty of finite element analysis of multilayer membrane elements with huge aspect ratio size differences.

[0052] The following will provide an explanation with reference to specific embodiments.

[0053] Example 1

[0054] Figure 1 Shown is a first flow chart of a thermal stress analysis method for a multilayer membrane element according to an embodiment of the present application.

[0055] Exemplarily, based on the ANSYS Workbench software platform, the thermal stress analysis method of the multilayer membrane element mainly includes operations such as modeling, pre-processing, solving, and post-processing, and specifically includes steps S110-S600:

[0056] Step S100, adding material properties of components required to constitute a multilayer membrane element in a steady-state structure module, wherein the components of the multilayer membrane element include a substrate and different membrane layers.

[0057] In this embodiment, the multilayer membrane element may be an element composed of a substrate and a multilayer membrane structure located on the surface of the substrate. For example, some aerospace products are usually covered with a membrane structure on the surface to achieve the characteristics of high temperature and high pressure resistance of the product. Exemplarily, when it is necessary to perform thermal stress analysis on the target multilayer membrane element, the components of the multilayer membrane element are first obtained, which may specifically include a substrate (Solid) and each membrane structure, as well as the material properties of each component. Among them, the material properties of each component may include, but are not limited to, one or more of the thermal expansion coefficient, Poisson's ratio, and Young's modulus, etc., which can be obtained according to actual needs and are not limited here.

[0058] The above-mentioned steady-state structural module refers to the Static Structural module in the Workbench software platform, which is mainly used for stable structural analysis (also called static structural analysis). Exemplarily, the terminal device (such as a computer, etc.) used to execute the method may be pre-installed with ANSYS Workbench software, such as Figure 2 As shown, enter the ANSYS Workbench interface, select the Static Structural module, and then click Engineering Data to enter the material property editing interface, create the required material and set its properties.

[0059] It can be understood that by adding the materials of each component of the multilayer membrane element in the steady-state structure module and setting its properties, a basis can be provided for subsequent model establishment.

[0060] For example, if a certain multilayer film element includes a substrate made of Si (silicon) and a multilayer film structure such as B4C (boron carbide) and Pd (palladium), the material properties of each component can be added accordingly.

[0061] Step S200: creating a three-dimensional model of the substrate using a geometric model tool.

[0062] The geometric model tool mentioned above refers to the Design Modeler tool in the Geometry module of the platform, which can be used to directly create three-dimensional models of some common structures. Exemplarily, when using the Design Modeler tool to build a three-dimensional model of a substrate, a substrate sketch Sketch can be first created, and then the Extrude function can be used to adjust the actual size of the substrate to obtain a three-dimensional model of the substrate. Then, click Model to enter the Mechanical setting interface, and specify the material of the substrate in the created model tree Geometry, such as specifying the material of the substrate as Si.

[0063] Taking the above-mentioned multilayer membrane element as an example, a sketch of a three-dimensional model of a substrate can be firstly established, and then the final three-dimensional model of the substrate can be obtained by adjusting it according to the actual size of the substrate through the stretching function. For example, Figure 3 As shown, a three-dimensional model of a quarter base is taken as an example, and its size is 50×30×60mm.

[0064] Step S300, meshing the three-dimensional model of the substrate using a network partitioning tool to obtain a network model.

[0065] Exemplarily, based on the three-dimensional model of the substrate constructed above, the constructed three-dimensional model will be further meshed, that is, a finite element mesh model will be established for subsequent finite element analysis. In one embodiment, the substrate will be meshed using a complete hexahedral mesh unit to obtain a hexahedral mesh model. For example, in the ANSYS Workbench platform, Figure 2 As shown in the figure, after clicking Mesh, the unit size will be set, the unit type of the upper surface of the base will be controlled to be quadrilateral, and then the following will be generated: Figure 4 The hexahedral mesh model shown.

[0066] Step S400, defining a multilayer membrane three-dimensional solid-shell unit by inserting a command in a model setting interface, and setting a cross section of the multilayer membrane three-dimensional solid-shell unit according to the material properties and thicknesses of the different membrane layers.

[0067] Among them, the three-dimensional solid-shell element is also called the SOLSH190 element. This element can be used to model shell structures of various thicknesses. It has 8 nodes, each with 3 degrees of freedom, and the user can add loads such as pressure or temperature on the surface of the element for force or thermal analysis.

[0068] For example, in the Geometry model tree corresponding to the current substrate, right-click to enter Insert, use the Commands command to define a multilayer film SOLSH190 unit, and set the material properties and thickness of different sections of the unit according to the data of these layers and the number of cycles, so as to achieve modeling and analysis of the multilayer film structure. Still taking the above-mentioned multilayer film element as an example, for example, the thickness of the single Pd layer can be 10 -6 mm and the thickness of the single B4C layer is 10 -6 mm, and the number of cycles of the multilayer film is set to 80.

[0069] Specifically, the upper surface node of the three-dimensional model of the substrate can be selected, and according to the total thickness of all the film layers in the multilayer film element, one layer of nodes can be copied upwards; then the eight corresponding and adjacent nodes of the upper and lower layers can be used in turn, such as Figure 5As shown, four nodes 1, 2, 3, and 4 are selected in the lower layer (A), and four nodes 1', 2', 3', and 4' are also selected in the copied upper layer (A') for corresponding connection, until all nodes of the upper and lower layers are used up, thereby completing the generation operation of the multilayer membrane three-dimensional solid-shell unit. It can be understood that through the above processing, the X and Y coordinates of the corresponding nodes of the upper and lower layers of the SOLSH190 unit can be guaranteed to be strictly the same, and the accuracy of the analysis can be further improved.

[0070] It should be understood that since there is no directly available SOLSH190 unit in the existing ANSYS Workbench platform, it is impossible to use the existing related models to realize the modeling and analysis of multi-layer membrane elements. For this reason, this embodiment proposes that after the substrate is meshed, the nodes on its upper surface are used to regenerate a layer of nodes by node replication, wherein the distance between the two layers is the total thickness of the multi-layer membrane, thereby creating a multi-layer SOLSH190 unit, thereby providing an analytical model basis for the thermodynamic analysis of the multi-layer membrane element on the platform.

[0071] Step S500: setting boundary conditions of a network model including a multilayer membrane three-dimensional solid-shell unit based on the temperature distribution data of the multilayer membrane element.

[0072] The above boundary conditions are mainly used as constraints during simulation analysis to ensure that the simulation results are reliable and can fit the actual situation. In this embodiment, for multilayer membrane elements, corresponding temperature loads can be applied based on known temperature distribution data of the elements, and thermal stress can be solved in combination with the material properties of each component.

[0073] like Figure 6 As shown, in one implementation, the above step S500 includes:

[0074] Sub-step S510, setting the bottom surface nodes of the base as fixed constraints without friction constraints.

[0075] Sub-step S520, applying a temperature load to each node of the substrate by command according to the temperature distribution data of the substrate.

[0076] Sub-step S530, according to the temperature distribution data of each membrane layer, a corresponding temperature load (also called thermal load) is applied to each layer unit in the multilayer membrane three-dimensional solid-shell unit by command mode. It can be understood that the above-applied temperature load will be used for thermal stress simulation of the grid model.

[0077] For example, boundary conditions can be set in Static Structural, for example, the bottom surface node of the substrate is set as Fixed Support (fixed constraint) and Frictionless Support (frictionless constraint); for example, the bottom surface node (0,0,-60) is selected as a fixed constraint, and the XOZ and YOZ planes are set as symmetry constraint surfaces, etc. Then, a heat load is applied to each node of the substrate through the Commands command, and the upper surface node of the substrate is copied by inserting the Commands command, and the SOLSH190 unit is established, and then the corresponding temperature load is applied to each layer of the membrane according to the temperature distribution data of each membrane layer.

[0078] Step S600, performing thermal stress calculation on a network model with boundary conditions set therein to obtain a thermal stress analysis result of the multilayer membrane element.

[0079] Exemplarily, after adding boundary conditions to the finite element mesh model, thermal stress simulation and analysis can be performed, which can be implemented using the existing thermal stress analysis tools in the platform to obtain the thermal stress analysis results of the multilayer membrane element. In one embodiment, the thermal stress analysis results of the multilayer membrane element may include the deformation and equivalent stress of the substrate after the load is applied, and the stress distribution of each membrane layer.

[0080] For example, still taking the above-mentioned multilayer membrane element with B4C layer and Pd layer as an example, after adding the corresponding thermal load and performing thermal stress simulation on the ANSYS Workbench platform, the following can be obtained: Figure 7a and Figure 7b The deformation and stress distribution of the quarter substrate are shown; and the stress distribution of the top two layers of the multilayer film SOLSH190 unit is extracted by adding the Commands command, where Figure 8a is the stress distribution of the 159th layer, Figure 8b The stress distribution of the 160th layer is shown. In addition, in order to further verify the accuracy of the analysis results, the inventors also compared the analysis results with the thermal stress analysis results in the classic ANSYS environment. The comparison shows that the highest equivalent stress of the B4C membrane in the two methods is 277.4MPa and 278.4MPa respectively; the highest equivalent stress of Pd in ​​the two methods is 206.9MPa and 207.8MPa respectively. It can be seen that the results obtained by the two methods are very similar, so this also further illustrates that for multilayer membrane elements, the thermal stress analysis method based on the ANSYS Workbench platform of this embodiment is accurate and feasible.

[0081] This embodiment first proposes a thermal stress analysis method for multilayer membrane components based on ANSYS Workbench. By inserting the Commands command in the Workbench environment, the corresponding multilayer membrane SOLSH190 unit is established based on the constructed mesh model by copying the upper surface nodes and the total thickness of the membrane layer and the thickness and material properties of each membrane layer, so as to provide a model analysis basis for the multilayer membrane component. Then, using the known temperature distribution data of the multilayer membrane component, constraints are set on the substrate, and the temperature loads of the substrate and the multilayer membrane are applied, and then the deformation and stress distribution of the substrate and each membrane layer are solved, which solves the pain points of the difficulty in modeling multilayer membranes and the difficulty in dividing the grid with high aspect ratio. Compared with the APDL operation interface in the classic ANSYS environment, this method makes full use of the characteristics of ANSYS Workbench, such as good interactivity, simple operation, and higher processing efficiency. In addition, the thermal stress analysis method of the multilayer membrane component based on ANSYS Workbench can also be more suitable for scenarios such as finite element analysis with large-scale multilayer membranes.

[0082] Example 2

[0083] Please refer to Fig. 9 Based on the method of the above-mentioned embodiment 1, this embodiment proposes a multilayer membrane element thermal stress analysis system 100, which is applied to the ANSYS Workbench platform.

[0084] Exemplarily, the multilayer film element thermal stress analysis system 100 includes:

[0085] The steady-state analysis unit 110 is used to add material properties of components required to constitute the multi-layer membrane element in the steady-state structure module, and the components of the multi-layer membrane element include a substrate and different membrane layers.

[0086] The model creation unit 120 is used to create a three-dimensional model of the substrate using a geometric model tool.

[0087] The meshing unit 130 is used to mesh the substrate using a network partitioning tool to obtain a network model.

[0088] The unit definition unit 140 is used to define the multilayer membrane three-dimensional solid-shell unit by inserting a command in the model setting interface, and to set the cross section of the multilayer membrane three-dimensional solid-shell unit according to the material properties and thickness of the different membrane layers.

[0089] The boundary setting unit 150 is used to set the boundary conditions of the network model based on the temperature distribution data of the multilayer membrane element.

[0090] The thermal stress analysis unit 160 is used to solve the thermal stress of the network model set with the boundary conditions to obtain the thermal stress analysis result of the multilayer membrane element.

[0091] It can be understood that the functions of the various units of this embodiment correspond to the methods of the above-mentioned embodiment 1, and the options in the above-mentioned embodiment 1 are also applicable to this embodiment, so they will not be described repeatedly here.

[0092] The present application also provides a terminal device, such as a computer, etc., exemplarily, the terminal device includes a processor and a memory, wherein the memory stores a computer program, and the processor runs the computer program to enable the terminal device to execute the functions of the various modules in the above-mentioned multilayer membrane element thermal stress analysis method or the above-mentioned multilayer membrane element thermal stress analysis system.

[0093] The present application also provides a readable storage medium for storing the computer program used in the above-mentioned terminal device.

[0094] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and structure diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in an alternative implementation, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the structure diagram and / or the flow diagram, and the combination of boxes in the structure diagram and / or the flow diagram, can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0095] In addition, the functional modules or units in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0096] If the function is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art, and the computer software product is stored in a storage medium, including several instructions for a computer device (which can be a smart phone, a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk.

[0097] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

Claims

1. A method for analyzing thermal stress of a multilayer membrane element, characterized in that: Applied to the ANSYS Workbench platform, the method includes: Adding material properties of components required to constitute the multilayer membrane element in the steady-state structure module, wherein the components of the multilayer membrane element include a substrate and different membrane layers; Using a geometric model tool to create a three-dimensional model of the substrate, and using a network partitioning tool to mesh the three-dimensional model of the substrate to obtain a network model; In the model setting interface, a multilayer membrane three-dimensional solid-shell unit is defined by inserting a command, specifically comprising: selecting the upper surface node of the three-dimensional model of the created substrate, and copying the node upward according to the total thickness of all membrane layers in the multilayer membrane element; sequentially using eight corresponding and adjacent nodes above and below to establish a multilayer membrane three-dimensional solid-shell unit until all upper and lower nodes are used up; wherein the multilayer membrane three-dimensional solid-shell unit is a SOLSH190 unit; Setting the cross section of the multilayer membrane three-dimensional solid-shell unit according to the material properties and thickness of the different membrane layers; Based on the temperature distribution data of the multilayer membrane element, the boundary conditions of the network model including the multilayer membrane three-dimensional solid-shell unit are set; specifically including: setting the bottom surface nodes of the substrate as fixed constraints without friction constraints; applying a temperature load to each node of the substrate by command according to the temperature distribution data of the substrate of the multilayer membrane element; applying a corresponding temperature load to each layer of the multilayer membrane three-dimensional solid-shell unit by command according to the temperature distribution data of each membrane layer of the multilayer membrane element; the applied temperature load is used to solve thermal stress; The network model with the boundary conditions is subjected to thermal stress solving to obtain the thermal stress analysis result of the multilayer membrane element; the thermal stress analysis result of the multilayer membrane element includes the deformation and stress distribution of the substrate and each membrane layer calculated based on the applied temperature load.

2. The method for thermal stress analysis of a multilayer film element according to claim 1, characterized in that: The deformation and stress distribution of each membrane layer are displayed by adding commands.

3. The method for thermal stress analysis of a multilayer film element according to claim 1, characterized in that: The step of creating a three-dimensional model of the substrate comprises: A three-dimensional model of a quarter of the substrate is established, and then the three-dimensional model of the substrate is adjusted according to the actual size of the substrate through a stretching function.

4. The method for thermal stress analysis of a multilayer film element according to claim 1, characterized in that: The method of meshing the three-dimensional model of the substrate using a network partitioning tool to obtain a network model includes: The three-dimensional model of the substrate is meshed using hexahedral network units to obtain a hexahedral mesh model.

5. The method for analyzing thermal stress of a multilayer film element according to any one of claims 1 to 4, characterized in that: The material properties of the assembly include one or more of a coefficient of thermal expansion, a Poisson's ratio, and a Young's modulus of each of the substrate and the different film layers.

6. A thermal stress analysis system for a multilayer membrane element, characterized in that: Applied to the ANSYS Workbench platform, the system includes: A steady-state analysis unit, used for adding material properties of components required to constitute the multilayer membrane element in the steady-state structure module, wherein the components of the multilayer membrane element include a substrate and different membrane layers; A model creation unit, used for creating a three-dimensional model of the substrate using a geometric model tool; A meshing unit, used for meshing the three-dimensional model of the substrate using a network partitioning tool to obtain a network model; The model definition unit is used to define a multilayer membrane three-dimensional solid-shell unit by inserting a command in the model setting interface, specifically comprising: selecting the upper surface node of the three-dimensional model of the created substrate, and copying the node upward according to the total thickness of all membrane layers in the multilayer membrane element; sequentially using eight corresponding and adjacent nodes above and below to establish a multilayer membrane three-dimensional solid-shell unit until all upper and lower nodes are used up; and also used to set the cross section of the multilayer membrane three-dimensional solid-shell unit according to the material properties and thickness of the different membrane layers; A boundary setting unit is used to set the boundary conditions of the network model containing the multilayer membrane three-dimensional solid-shell unit based on the temperature distribution data of the multilayer membrane element, specifically including: setting the bottom surface nodes of the substrate as fixed constraints and frictionless constraints; applying a temperature load to each node of the substrate by command according to the temperature distribution data of the substrate of the multilayer membrane element; applying a corresponding temperature load to each layer of the multilayer membrane three-dimensional solid-shell unit by command according to the temperature distribution data of each membrane layer of the multilayer membrane element; the applied temperature load is used to solve thermal stress; A thermal stress analysis unit is used to solve the thermal stress of the network model set with the boundary conditions to obtain the thermal stress analysis results of the multilayer membrane element; the thermal stress analysis results of the multilayer membrane element include the deformation and stress distribution of the substrate and each membrane layer calculated based on the applied temperature load.

7. A terminal device, characterized in that: The terminal device includes a processor and a memory, wherein the memory stores a computer program, and the processor is used to execute the computer program to implement the thermal stress analysis method for a multilayer film element according to any one of claims 1 to 5.

8. A readable storage medium, characterized in that: The device stores a computer program, which, when executed on a processor, implements the thermal stress analysis method for a multilayer film element according to any one of claims 1 to 5.

Images