A device for testing a fingerprint recognition module and a method for using the same

Abstract

The present invention relates to the field of fingerprint recognition, and discloses a device for testing a fingerprint recognition module and a method for using the device. The device for testing a fingerprint recognition module comprises a housing; a first cover plate, the first cover plate cooperating with the housing to form a storage space for placing the fingerprint recognition module, the first cover plate having a hollowed-out area for exposing the recognition area of ​​the fingerprint recognition module; and a mainboard located within the storage space. When the fingerprint recognition module is located within the storage space, the mainboard is located below the fingerprint recognition module and is configured to be connected to the fingerprint recognition module. The device for testing a fingerprint recognition module can perform various performance tests on the fingerprint recognition module, thereby improving test efficiency and ensuring the performance of the fingerprint recognition module.

Description

Technical Field

[0001] The present invention relates to the technical field of fingerprint recognition, and in particular to a device for testing a fingerprint recognition module and a method for using the device. Background Art

[0002] Fingerprint recognition modules are the core components of products with fingerprint recognition capabilities. They collect and identify fingerprints. Fingerprint recognition is a biometric technology that compares the detailed features of different fingerprints and can be used for identity verification. Currently, fingerprint recognition modules are primarily used in banking and public security information collection, the mobile phone and computer industry, and door locks and security. Demand is strong, and the convenience and security of fingerprint recognition are increasingly popular and recognized. The rapid development of fingerprint recognition modules in the future is undeniable.

[0003] Fingerprint recognition technologies can be broadly categorized into three types: optical, capacitive, and ultrasonic. Optical fingerprint recognition is currently the most widely used biometric technology, but existing optical fingerprint recognition modules still have numerous issues. Therefore, ensuring the performance of optical fingerprint recognition modules has become a pressing issue in this field. Summary of the Invention

[0004] The invention discloses a device for testing a fingerprint recognition module and a method for using the device. The fingerprint recognition module is tested by the device for testing the fingerprint recognition module to ensure the performance of the fingerprint recognition module.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] In a first aspect, the present invention provides a device for testing a fingerprint recognition module, comprising:

[0007] case;

[0008] a first cover plate, wherein the first cover plate cooperates with the housing to form a receiving space for placing a fingerprint recognition module, and the first cover plate has a hollow area, wherein the hollow area is used to expose the recognition area of ​​the fingerprint recognition module;

[0009] The mainboard is located in the accommodating space. When the fingerprint recognition module is located in the accommodating space, the mainboard is located below the fingerprint recognition module. The mainboard is used to connect with the fingerprint recognition module.

[0010] The housing and the first cover cooperate to form a storage space for placing the fingerprint recognition module. The mainboard is placed in the storage space. When the fingerprint recognition module needs to be tested, the fingerprint recognition module is placed in the storage space and placed above the mainboard. The mainboard is connected to the fingerprint recognition module. The first cover above the mainboard has a hollow area. Strong light is shone above the first cover. The strong light passes through the hollow area of ​​the first cover and illuminates the recognition area of ​​the fingerprint recognition module. Since the mainboard is connected to the fingerprint recognition module, the performance of the fingerprint recognition module after being exposed to strong light is analyzed by the mainboard, thereby realizing the strong light resistance test of the fingerprint recognition module. The entire device has a simple structure and is easy to operate. While ensuring the strong light resistance test of the fingerprint recognition module, it also improves the detection efficiency. In addition, it can also ensure that the driver chip (IC) in the fingerprint recognition module exposed outside the recognition area will not malfunction due to exposure to strong light.

[0011] Optionally, a static electricity decoupling structure is provided on a side of the first cover plate facing the main board. When the fingerprint recognition module is located in the accommodating space, the static electricity decoupling structure contacts the fingerprint recognition module to decoupling static electricity in the fingerprint recognition module.

[0012] Optionally, the device for testing the fingerprint recognition module further includes: a second cover plate, the second cover plate being located on the side of the first cover plate facing away from the main board, a reflective sheet being provided at a position corresponding to the recognition area of ​​the fingerprint recognition module on the second cover plate, and the reflective sheet facing the main board.

[0013] Optionally, the device for testing a fingerprint recognition module further includes: a support plate located between the main board and the first cover plate, the support plate having an installation area for installing the fingerprint recognition module.

[0014] Optionally, the main board is connected to the fingerprint recognition module via a flexible circuit board, and the support plate has a reserved groove for allowing the flexible circuit board to pass through.

[0015] Optionally, the orthographic projection of the hollow area on the mainboard is greater than or equal to the orthographic projection of the installation area on the mainboard.

[0016] Optionally, the orthographic projection of the reflective sheet on the mainboard is greater than or equal to the orthographic projection of the mounting area on the mainboard.

[0017] Optionally, the orthographic projection of the reflective sheet on the main board is greater than or equal to the orthographic projection of the hollow area on the main board.

[0018] Optionally, the static electricity derivation structure includes a conductive sheet and a conductive column connected to the conductive sheet, and the conductive column is grounded; the conductive sheet is arranged on the side of the first cover plate facing the main board, and the conductive sheet is located around the hollow area. When the fingerprint recognition module is located in the device for testing the fingerprint recognition module, the conductive sheet contacts the fingerprint recognition module and is used to derivate static electricity in the fingerprint recognition module to the conductive column.

[0019] Optionally, the support plate is detachably connected to the side wall of the shell via a connecting assembly.

[0020] Optionally, the mounting area of ​​the support plate has a first positioning portion, and the first positioning portion is used to correspond to the second positioning portion of the fingerprint recognition module.

[0021] Optionally, one side of the second cover plate is pivotally connected to one side of the shell side wall.

[0022] In a second aspect, the present invention provides a method for using a device for testing a fingerprint recognition module, using the device for testing a fingerprint recognition module as described in any one of the first aspects, comprising:

[0023] The fingerprint recognition module is placed between the first cover plate and the main board, wherein the first cover plate has a hollow area, and the fingerprint recognition module is exposed in the hollow area;

[0024] Conduct strong light resistance test on the fingerprint recognition module.

[0025] Optionally, a static electricity decoupling structure is provided on a side of the first cover plate facing the main board, and the static electricity decoupling structure is in contact with the fingerprint recognition module;

[0026] After the step of placing the fingerprint recognition module between the first cover plate and the main board, wherein the first cover plate has a hollow area, and the hollow area exposes the fingerprint recognition module, the method further includes:

[0027] Conduct anti-static performance testing on the fingerprint recognition module.

[0028] Optionally, a second cover plate is provided on a side of the first cover plate facing away from the main board, and a reflective sheet is provided at a position of the second cover plate corresponding to the fingerprint recognition module, with the reflective sheet facing the main board;

[0029] After the step of placing the fingerprint recognition module between the first cover plate and the main board, wherein the first cover plate has a hollow area, and the hollow area exposes the fingerprint recognition module, the method further includes:

[0030] Perform light uniformity test on the fingerprint recognition module. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of the three-dimensional structure of a device for testing a fingerprint recognition module provided by an embodiment of the present invention;

[0032] Figure 2 A schematic diagram of the three-dimensional structure of a device for testing a fingerprint recognition module provided by an embodiment of the present invention with the second cover in an open state;

[0033] Figure 3 An exploded diagram of a device for testing a fingerprint recognition module provided by an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of the assembly of a mainboard and a housing of a device for testing a fingerprint recognition module provided by an embodiment of the present invention;

[0035] Figure 5 A schematic diagram of the assembly of a support plate, a main board, and a housing of a device for testing a fingerprint recognition module provided by an embodiment of the present invention;

[0036] Figure 6 For Figure 5 An assembly diagram of a fingerprint recognition module installed on the top;

[0037] Figure 7 For Figure 6 A schematic diagram of a structure with a second cover plate installed thereon;

[0038] Figure 8 A schematic structural diagram of the upper portion of a first cover plate for testing a fingerprint recognition module provided by an embodiment of the present invention;

[0039] Figure 9 A schematic structural diagram of the bottom of a first cover plate for testing a fingerprint recognition module provided by an embodiment of the present invention.

[0040] Icon: 100-housing; 200-motherboard; 201-switch; 202-power socket; 203-USB socket; 300-support plate; 301-connection component; 302-reserved slot; 400-fingerprint recognition module; 401-flexible circuit board; 402-recognition area; 500-first cover plate; 501-conductive column; 502-conductive sheet; 503-hollow area; 504-handle; 600-second cover plate; 601-reflective sheet. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] Optical fingerprint recognition is currently the most widely used biometric technology, but existing optical fingerprint recognition modules 400 still have many problems. For example, the module's photosensitive device stops working and cannot recognize images properly under strong light. When excessive static electricity accumulates on the surface of the optical fingerprint recognition module 400, the module may be damaged. The principle of the optical fingerprint recognition module 400 is that the backlight module emits light and passes through the various transparent film layers of the optical fingerprint recognition module 400 to the finger. The photosensitive element in the optical fingerprint recognition module 400 then receives the reflected image and uses it to determine the fingerprint pattern. Therefore, the uniformity of the light emitted from the top surface of the optical fingerprint recognition module 400 directly affects the performance of the fingerprint recognition module 400.

[0043] Therefore, it can be seen that providing a testing device for the fingerprint recognition module 400 with a simple structure that can test both the strong light resistance performance and the light uniformity and antistatic performance is an issue that needs to be solved urgently in this field.

[0044] First, as Figures 1 to 3 As shown, an embodiment of the present invention provides a device for testing a fingerprint recognition module, comprising:

[0045] Housing 100;

[0046] A first cover plate 500 , which cooperates with the housing 100 to form a receiving space for accommodating the fingerprint recognition module 400 . The first cover plate 500 has a hollow area 503 , which is used to expose the recognition area 402 of the fingerprint recognition module 400 ;

[0047] The mainboard 200 is located in the accommodating space. When the fingerprint recognition module 400 is located in the accommodating space, the mainboard 200 is located below the fingerprint recognition module 400 . The mainboard 200 is used to connect with the fingerprint recognition module 400 .

[0048] It should be noted that a storage space for placing the fingerprint recognition module 400 is formed by the cooperation of the housing 100 and the first cover 500. The mainboard 200 is placed in the storage space. When the fingerprint recognition module 400 needs to be tested, the fingerprint recognition module 400 is placed in the storage space and placed above the mainboard 200. The mainboard 200 is connected to the fingerprint recognition module 400. The first cover 500 located above the mainboard 200 has a hollow area 503. The strong light is irradiated through the hollow area 503 of the first cover plate 500 and illuminates the identification area 402 of the fingerprint recognition module 400. Since the mainboard 200 is connected to the fingerprint recognition module 400, the performance of the fingerprint recognition module 400 after being exposed to the strong light is analyzed through the mainboard 200, thereby realizing the strong light resistance test of the fingerprint recognition module 400. The entire device has a simple structure and is easy to operate. While ensuring the strong light resistance test of the fingerprint recognition module 400, it also improves the detection efficiency. In addition, it can also ensure that the driver chip (IC) in the fingerprint recognition module exposed outside the identification area will not malfunction due to exposure to strong light.

[0049] Specifically, the motherboard 200 is equipped with a switch 201, a power socket 202, and a USB socket 203 to control data transmission from an external mobile device and switch 201. The external mobile device here exports data from the motherboard 200 for further analysis or annotation. For ease of operation, the housing 100 is provided with openings corresponding to the motherboard 200 switch 201, power socket 202, and USB socket 203, allowing users to operate them directly from the outside.

[0050] In a specific embodiment, an electrostatic desorption structure is provided on the side of the first cover plate 500 facing the main board 200. When the fingerprint recognition module 400 is located in the accommodation space, the electrostatic desorption structure contacts the fingerprint recognition module 400 to desorb static electricity in the fingerprint recognition module 400.

[0051] When the anti-static performance of the fingerprint recognition module 400 needs to be tested, static electricity is directed toward the fingerprint recognition module 400 from above using a contact or non-contact method. The static electricity conduction structure conducts the static electricity away from the fingerprint recognition module 400. The module is then tested to see if it is still functioning properly, thereby confirming the anti-static performance of the fingerprint recognition module 400.

[0052] In a specific embodiment, the device for testing the fingerprint recognition module also includes: a second cover plate 600, the second cover plate 600 is located on the side of the first cover plate 500 facing away from the main board 200, and a reflective sheet 601 is provided at a position corresponding to the second cover plate 600 and the recognition area 402 of the fingerprint recognition module 400, and the reflective sheet 601 faces the main board 200.

[0053] When it is necessary to perform a light uniformity test on the fingerprint recognition module 400, the light emitted by the backlight module in the fingerprint recognition module 400 passes through the various transparent film layers of the optical fingerprint recognition module 400 and then is emitted toward the reflective sheet 601 on the second cover plate 600. The light emitted by the fingerprint recognition module 400 is then reflected back to the photosensitive element in the module through the reflective sheet 601. Since the main board 200 is connected to the fingerprint recognition module 400, the photosensitive element in the fingerprint recognition module 400 is analyzed through the main board 200 to test its light uniformity.

[0054] Continue to refer Figure 3 The device for testing the fingerprint recognition module provided by the embodiment of the present invention further includes: a support plate 300 located between the main board 200 and the first cover plate 500, and the support plate 300 has an installation area for installing the fingerprint recognition module 400.

[0055] The device for testing the fingerprint recognition module provided by the embodiment of the present invention can detect multiple fingerprint recognition modules 400. In order to facilitate installation and ensure the stability of the fingerprint recognition module 400 after installation, a support plate 300 is provided between the main board 200 and the first cover plate 500. The installation area of ​​the support plate 300 has a first positioning portion, which is used to correspond to the second positioning portion of the fingerprint recognition module 400. Figure 3 The mounting area of ​​the support plate 300 in the figure is provided with a plurality of holes, namely the first positioning portion. The holes in the mounting area correspond to the protrusions in the fingerprint recognition module 400, thereby achieving relative fixation of the positions of the fingerprint recognition module 400 and the support plate 300.

[0056] like Figure 4 As shown, the support plate 300 is detachably connected to the side wall of the housing 100 via a connecting assembly 301. Specifically, a connecting block is provided on the support plate 300, which is then connected to the connecting block via screws or bolts passing through through-holes in the housing 100. This connection method facilitates replacement of the support plate 300 to match fingerprint recognition modules 400 of different specifications, thereby increasing the applicability of the device for testing fingerprint recognition modules provided by the embodiment of the present invention.

[0057] like Figure 5 and Figure 6 As shown, since a support plate 300 is provided between the main board 200 and the fingerprint recognition module 400, in order to facilitate the connection between the main board 200 and the fingerprint recognition module 400, the main board 200 and the fingerprint recognition module 400 are electrically connected through a flexible circuit board 401 (FPC, Flexible Printed Circuit board), and the support plate 300 has a reserved groove 302 for the flexible circuit board 401 to pass through.

[0058] Of course, when conducting strong light resistance and anti-static performance tests on the fingerprint recognition module 400, it is necessary to ensure that static electricity and strong light can pass through the hollow area 503 and hit the fingerprint recognition module 400 located in the installation area. Therefore, the orthographic projection of the hollow area 503 on the mainboard 200 is greater than or equal to the orthographic projection of the installation area on the mainboard 200.

[0059] Of course, when performing light uniformity detection on the fingerprint recognition module 400, it is necessary to ensure that the light emitted by the backlight module in the fingerprint recognition module 400 passes through the various transparent film layers of the optical fingerprint recognition module 400 and then projects onto the reflective sheet 601 on the second cover plate 600, and then the light emitted by the fingerprint recognition module 400 is reflected back to the photosensitive element in the module through the reflective sheet 601. Therefore, the orthographic projection of the reflective sheet 601 on the mainboard 200 is greater than or equal to the orthographic projection of the installation area on the mainboard 200.

[0060] Of course, if the fingerprint recognition module 400 is subjected to a light uniformity test, if the first cover plate 500 is installed in the installation space within the shell 100, in order to ensure that the light emitted by the fingerprint recognition module 400 is reflected back to the photosensitive element in the module through the reflective sheet 601 without being affected, it is necessary to ensure that the orthographic projection of the reflective sheet 601 on the main board 200 is greater than or equal to the orthographic projection of the hollow area 503 on the main board 200.

[0061] like Figure 7 As shown, one side of the second cover plate 600 is pivotally connected to one side of the side wall of the housing 100. With this connection method, when performing light uniformity testing on the fingerprint recognition module 400, it is only necessary to snap the second cover plate 600 together, which is more convenient to operate.

[0062] like Figure 8 and Figure 9 As shown, the electrostatic derivation structure includes a conductive sheet 502 and a conductive column 501 connected to the conductive sheet 502, and the conductive column 501 is grounded; the conductive sheet 502 is arranged on the side of the first cover plate 500 facing the main board 200, and the conductive sheet 502 is located around the hollow area 503. When the fingerprint recognition module 400 is located in the device for testing the fingerprint recognition module, the conductive sheet 502 is in contact with the fingerprint recognition module 400, and is used to derivate the static electricity in the fingerprint recognition module 400 to the conductive column 501.

[0063] Of course, when there are two conductive sheets 502, the two conductive sheets 502 are symmetrically arranged relative to the hollow area 503. The two conductive sheets 502 can better conduct static electricity in the fingerprint recognition module 400, thereby improving the efficiency of static electricity conduction.

[0064] The conductive sheet 502 can be in the form of a long strip, but there are no specific restrictions on its structure. As long as the conductive sheet 502 can contact the fingerprint recognition module 400 and conduct static electricity to the conductive pillars 501, the static electricity on the conductive pillars 501 can then be discharged to the ground to achieve electrostatic discharge (ESD). The conductive sheet 502 is made of a conductive material, while the rest of the first cover 500 is made of a non-conductive material. This ensures that static electricity in the fingerprint recognition module 400 can only be conducted to the conductive pillars 501 through the conductive sheet 502.

[0065] The following describes a specific method for using the device for testing a fingerprint recognition module provided by an embodiment of the present invention:

[0066] Place the main board 200 into the accommodation space in the shell 100, then place the support plate 300 above the main board 200, and the support plate 300 is detachably connected to the shell 100 through the connecting component 301, then place the fingerprint recognition module 400 to be detected in the installation area of ​​the support plate 300, and pass the flexible circuit board 401 in the fingerprint recognition module 400 through the reserved groove 302 in the support plate 300 to connect with the main board 200, place the first cover plate 500 above the fingerprint recognition module 400, and overlap with the side wall of the shell 100 to form an accommodation space with the shell 100, the first cover plate 500 is provided with a hollow area 503 to expose the recognition area 402 in the fingerprint recognition module 400, when the first cover plate 500 needs to be removed, it can be removed by the handle 504.

[0067] When the fingerprint recognition module 400 to be tested is subjected to a strong light resistance test and an anti-static performance test, first open the second cover 600, remove the first cover 500, place the fingerprint recognition module 400 in the installation area on the support plate 300, and connect the flexible circuit board 401 of the fingerprint recognition module 400 to the main board 200, then cover the first cover 500, and the recognition area 402 in the fingerprint recognition module 400 is exposed from the hollow area 503 of the first cover 500, and then the fingerprint recognition module 400 is subjected to strong light irradiation or static electricity conduction.

[0068] When the fingerprint recognition module 400 to be tested is subjected to a light uniformity test, first open the second cover 600, remove the first cover 500, place the fingerprint recognition module 400 in the installation area on the support plate 300, and connect the flexible circuit board 401 of the fingerprint recognition module 400 to the main board 200. Then the first cover 500 can be covered or not, and then the second cover 600 is covered. Then the light emitted by the backlight module in the fingerprint recognition module 400 passes through the various transparent film layers of the optical fingerprint recognition module 400 and is emitted to the reflective sheet 601 on the second cover 600. Then the light emitted by the fingerprint recognition module 400 is reflected back to the photosensitive element in the module by the reflective sheet 601. Since the main board 200 is connected to the fingerprint recognition module 400, the photosensitive element in the fingerprint recognition module 400 is analyzed through the main board 200 to test its light uniformity.

[0069] In a second aspect, an embodiment of the present invention provides a method for using a device for testing a fingerprint recognition module, using the device for testing a fingerprint recognition module described in any one of the first aspects, including:

[0070] The fingerprint recognition module 400 is placed between the first cover plate 500 and the main board 200. The first cover plate 500 has a hollow area 503, and the hollow area 503 exposes the fingerprint recognition module 400.

[0071] The fingerprint recognition module 400 is tested for its resistance to strong light.

[0072] Optionally, a static electricity decoupling structure is provided on a side of the first cover plate 500 facing the main board 200 , and the static electricity decoupling structure is in contact with the fingerprint recognition module 400 ;

[0073] After the step of placing the fingerprint recognition module 400 between the first cover plate 500 and the main board 200, wherein the first cover plate 500 has a hollow area 503 and the hollow area 503 exposes the fingerprint recognition module 400, the method further includes:

[0074] The antistatic performance of the fingerprint recognition module 400 is tested.

[0075] Optionally, a second cover plate 600 is provided on a side of the first cover plate 500 facing away from the main board 200 , and a reflective sheet 601 is provided at a position of the second cover plate 600 corresponding to the fingerprint recognition module 400 , and the reflective sheet 601 faces the main board 200 ;

[0076] After the step of placing the fingerprint recognition module 400 between the first cover plate 500 and the main board 200, wherein the first cover plate 500 has a hollow area 503 and the hollow area 503 exposes the fingerprint recognition module 400, the method further includes:

[0077] Perform light uniformity testing on the fingerprint recognition module 400.

[0078] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A device for testing a fingerprint recognition module, characterized in that: include: case; a first cover plate, wherein the first cover plate cooperates with the housing to form a receiving space for placing a fingerprint recognition module, and the first cover plate has a hollow area, wherein the hollow area is used to expose the recognition area of ​​the fingerprint recognition module; The device for testing the fingerprint recognition module further includes: a second cover plate, the second cover plate being located on a side of the first cover plate facing away from the main board, a reflective sheet being provided at a position of the second cover plate corresponding to the recognition area of ​​the fingerprint recognition module, the reflective sheet facing the main board; The mainboard is located in the accommodating space. When the fingerprint recognition module is located in the accommodating space, the mainboard is located below the fingerprint recognition module. The mainboard is used to connect with the fingerprint recognition module.

2. The device for testing a fingerprint recognition module according to claim 1, wherein: A static electricity decoupling structure is provided on a side of the first cover plate facing the main board. When the fingerprint recognition module is located in the accommodating space, the static electricity decoupling structure contacts the fingerprint recognition module to decoupling static electricity in the fingerprint recognition module.

3. The device for testing a fingerprint recognition module according to claim 1, wherein: The device for testing a fingerprint recognition module further includes: a support plate located between the main board and the first cover plate, wherein the support plate has an installation area for installing the fingerprint recognition module.

4. The device for testing a fingerprint recognition module according to claim 3, wherein: The main board is connected to the fingerprint recognition module via a flexible circuit board, and the support plate has a reserved groove for allowing the flexible circuit board to pass through.

5. The device for testing a fingerprint recognition module according to claim 3, wherein: The orthographic projection of the hollow area on the mainboard is greater than or equal to the orthographic projection of the mounting area on the mainboard.

6. The device for testing a fingerprint recognition module according to claim 3, wherein: The orthographic projection of the reflective sheet on the mainboard is greater than or equal to the orthographic projection of the mounting area on the mainboard.

7. The device for testing a fingerprint recognition module according to claim 6, characterized in that: The orthographic projection of the reflective sheet on the main board is greater than or equal to the orthographic projection of the hollow area on the main board.

8. The device for testing a fingerprint recognition module according to claim 2, wherein: The electrostatic desorption structure includes a conductive sheet and a conductive column connected to the conductive sheet, and the conductive column is grounded; the conductive sheet is arranged on the side of the first cover plate facing the main board, and the conductive sheet is located around the hollow area. When the fingerprint recognition module is located in the device for testing the fingerprint recognition module, the conductive sheet contacts the fingerprint recognition module and is used to desorb static electricity in the fingerprint recognition module to the conductive column.

9. The device for testing a fingerprint recognition module according to claim 3, wherein: The support plate is detachably connected to the side wall of the shell through a connecting assembly.

10. The device for testing a fingerprint recognition module according to claim 3, wherein: The mounting area of ​​the support plate has a first positioning portion, and the first positioning portion is used to correspond to the second positioning portion of the fingerprint recognition module.

11. The device for testing a fingerprint recognition module according to claim 1, wherein: One side of the second cover plate is pivotally connected to one side of the shell side wall.

12. A method for using a device for testing a fingerprint recognition module, characterized in that: The device for testing a fingerprint recognition module according to any one of claims 1 to 11 comprises: The fingerprint recognition module is placed between the first cover plate and the main board, wherein the first cover plate has a hollow area, and the fingerprint recognition module is exposed in the hollow area; Conduct strong light resistance test on the fingerprint recognition module.

13. The method according to claim 12, characterized in that A static electricity decoupling structure is provided on a side of the first cover plate facing the main board, and the static electricity decoupling structure is in contact with the fingerprint recognition module; After the step of placing the fingerprint recognition module between the first cover plate and the main board, wherein the first cover plate has a hollow area, and the hollow area exposes the fingerprint recognition module, the method further includes: Conduct anti-static performance testing on the fingerprint recognition module.

14. The method according to claim 12, characterized in that A second cover plate is provided on a side of the first cover plate facing away from the main board, and a reflective sheet is provided at a position of the second cover plate corresponding to the fingerprint recognition module, and the reflective sheet faces the main board; After the step of placing the fingerprint recognition module between the first cover plate and the main board, wherein the first cover plate has a hollow area, and the hollow area exposes the fingerprint recognition module, the method further includes: Perform light uniformity test on the fingerprint recognition module.

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