Display substrate and display device

Abstract

The present invention discloses a display substrate and a display device, wherein each sub-pixel region of a base substrate includes a light-emitting chip, and an insulating layer located between the base substrate and the light-emitting chip is provided with at least one through hole at a position corresponding to at least part of the sub-pixel region. Since the through hole is filled with a phase change material, the phase change material can absorb the heat generated by the light-emitting chip to perform a phase change, thereby adjusting the operating temperature of the light-emitting chip, thereby improving the heat dissipation effect of the light-emitting chip during high-brightness display, so that the light-emitting chip is maintained within a normal operating temperature and display brightness range, thereby improving the display effect of the display substrate.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a display device. Background Art

[0002] Micro-light-emitting diode (u-LED) chips have the advantages of high brightness, wide color gamut, and accurate colors, and are a hot research topic in the current display field. However, as the display density of LED chips continues to increase, the LED chips in a unit area generate a lot of heat when displaying at high brightness, and heat dissipation becomes increasingly difficult, causing the temperature of the driver backplane (Panel) to rise rapidly.

[0003] The inventors of the present application have found that for red LED chips, the heat generation is particularly obvious due to the greater matching difference between the substrate and the chip. According to data, the temperature of the driver backplane can rise to 60-70°C when the display is high brightness. Figure 1 As shown, this will cause the brightness of the red LED chip to drop by more than 50%, resulting in uneven light emission and color deviation, which seriously affects the display effect. In addition, the heat dissipation difficulty will also cause the resistance of the driving backplane to increase, causing the voltage drift of the thin film transistor, affecting the final display effect. Summary of the invention

[0004] The embodiments of the present invention provide a display substrate and a display device, which are used to solve the problem of heat dissipation difficulty of the existing display substrate during high-brightness display.

[0005] Therefore, an embodiment of the present invention provides a display substrate, including:

[0006] A base substrate, wherein the base substrate has a plurality of sub-pixel regions;

[0007] A plurality of light-emitting chips are located on one side of the substrate and are respectively located in the sub-pixel regions;

[0008] An insulating layer is located between the base substrate and the light-emitting chip. The insulating layer is provided with at least one through hole at a position corresponding to at least part of the sub-pixel area. The through hole is filled with a phase change material. The phase change material is configured to absorb the heat generated by the light-emitting chip to perform a phase change.

[0009] Optionally, the above-mentioned display substrate provided in an embodiment of the present invention further includes a first metal layer located between the light-emitting chip and the insulating layer, the first metal layer includes a first heat dissipation structure, the first heat dissipation structure includes a first heat dissipation portion with the same pattern as the through hole, and the orthographic projection of the first heat dissipation portion on the base substrate covers the orthographic projection of the through hole on the base substrate.

[0010] Optionally, in the above-mentioned display substrate provided in an embodiment of the present invention, the light-emitting chip includes a light-emitting main body portion and two conductive connection portions connected to the light-emitting main body portion, and the first heat dissipation structure also includes a second heat dissipation portion electrically connected to the first heat dissipation portion, and the second heat dissipation portion extends to the gap between the two conductive connection portions.

[0011] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the first heat dissipation structure further includes a third heat dissipation portion electrically connected to the first heat dissipation portion and located between the insulating layer and the phase change material.

[0012] Optionally, in the above-mentioned display substrate provided in an embodiment of the present invention, it also includes a second metal layer located between the base substrate and the insulating layer; the second metal layer includes a second heat dissipation structure with the same pattern as the through hole, and the orthographic projection of the second heat dissipation structure on the base substrate covers the orthographic projection of the through hole on the base substrate.

[0013] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the third heat dissipation portion is in contact with or not in contact with the second heat dissipation structure.

[0014] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the structure of the through hole is a comb-shaped structure, and the comb-shaped structure is provided with a body and a plurality of comb teeth connected to a side of the body away from the light-emitting chip.

[0015] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the number of the through holes is two, and the two through holes are symmetrically arranged about the center of the light-emitting chip.

[0016] Optionally, in the above-mentioned display substrate provided by the embodiment of the present invention, it further comprises a plurality of binding parts electrically connected to each of the conductive connecting parts, and the binding parts are located in the first metal layer;

[0017] The materials of the first metal layer and the second metal layer are both molybdenum-niobium alloy / copper / molybdenum-niobium alloy or titanium / aluminum / titanium.

[0018] Optionally, in the above-mentioned display substrate provided by the embodiment of the present invention, it further includes: a gate metal layer located on the base substrate, a source-drain metal layer located on the side of the gate metal layer away from the base substrate, and a plurality of binding parts electrically connected to each of the conductive connecting parts; the binding parts are located in the first metal layer; wherein,

[0019] The first metal layer and the source-drain metal layer are located in the same film layer, and the second metal layer and the gate metal layer are located in the same film layer.

[0020] Optionally, in the above-mentioned display substrate provided by the embodiment of the present invention, it further includes: a gate metal layer located on the base substrate, a source-drain metal layer located on the side of the gate metal layer away from the base substrate, and a plurality of binding parts electrically connected to each of the conductive connecting parts; the binding parts are located on the side of the source-drain metal layer away from the base substrate; wherein,

[0021] The first metal layer and the source / drain metal layer are located in the same film layer, and the second metal layer and the gate metal layer are located in the same film layer;

[0022] Or, the first metal layer and the binding portion are located in the same film layer, and the second metal layer and the source-drain metal layer are located in the same film layer;

[0023] Alternatively, the first metal layer and the binding portion are located in the same film layer, and the second metal layer and the gate metal layer are located in the same film layer.

[0024] Optionally, the display substrate provided in the embodiment of the present invention further includes a passivation layer located between the binding part and the light-emitting chip, and the conductive connection part of the light-emitting chip is electrically connected to the binding part through a via hole penetrating the passivation layer.

[0025] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the through hole is further filled with a photoresist material, and the phase change material is dispersed in the photoresist.

[0026] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the phase change material includes paraffin or polyethylene glycol.

[0027] Correspondingly, an embodiment of the present invention further provides a display device, comprising the above-mentioned display substrate provided by an embodiment of the present invention.

[0028] The beneficial technical effects brought about by the technical solution provided by the embodiment of the present invention include at least:

[0029] In the display substrate and display device provided by the embodiments of the present invention, each sub-pixel area of ​​the base substrate includes a light-emitting chip, and the insulating layer located between the base substrate and the light-emitting chip is provided with at least one through hole at a position corresponding to at least part of the sub-pixel area. Since the through hole is filled with a phase change material, the phase change material can absorb the heat generated by the light-emitting chip to perform a phase change, and then the operating temperature of the light-emitting chip can be adjusted, thereby improving the heat dissipation effect of the light-emitting chip during high-brightness display, so that the light-emitting chip is maintained within a normal operating temperature and display brightness range, thereby improving the display effect of the display substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is the temperature variation curve of the light-emitting chip over time when it is working;

[0031] Figure 2 A schematic diagram of a top view structure of a display substrate provided by an embodiment of the present invention;

[0032] Figure 3 For along Figure 2 A schematic cross-sectional view of the BB' direction;

[0033] Figure 4 For along Figure 2 A schematic cross-sectional view of the CC' direction;

[0034] Figure 5 for Figure 2 Schematic diagram of the structure of the middle membrane layer;

[0035] Figure 6 A schematic structural diagram of another display substrate provided by an embodiment of the present invention;

[0036] Figure 7 A schematic structural diagram of another display substrate provided by an embodiment of the present invention;

[0037] Figure 8 A schematic structural diagram of another display substrate provided by an embodiment of the present invention;

[0038] Fig. 9 A schematic structural diagram of another display substrate provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present disclosure.

[0040] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. "Include" or "comprising" and other similar words used in the present disclosure mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and other similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Inside", "outside", "upper", "lower", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0041] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual proportions, and are only intended to illustrate the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0042] An embodiment of the present invention provides a display substrate, such as Figure 2-Figure 4 As shown, Figure 2 Schematic diagram showing a top view of a substrate. Figure 3 for Figure 2 The cross section along the BB' direction is shown in the figure. Figure 4 for Figure 2 The cross section along the CC' direction is shown in FIG. 1 , and the display substrate comprises:

[0043] A base substrate 1, the base substrate 1 has a plurality of sub-pixel regions AA; the embodiment of the present invention only illustrates one sub-pixel region AA;

[0044] A plurality of light emitting chips 2 are located on one side of the base substrate 1 and are respectively located in the sub-pixel area AA;

[0045] The insulating layer 3 is located between the substrate 1 and the light-emitting chip 2. The insulating layer 3 is provided with at least one through hole 31 at a position corresponding to at least part of the sub-pixel area AA. The through hole 31 is filled with a phase change material, which is configured to absorb the heat generated by the light-emitting chip 2 to perform a phase change.

[0046] In the display substrate provided by the embodiment of the present invention, each sub-pixel area of ​​the base substrate includes a light-emitting chip, and the insulating layer located between the base substrate and the light-emitting chip is provided with at least one through hole at a position corresponding to at least part of the sub-pixel area. Since the through hole is filled with a phase change material, the phase change material can absorb the heat generated by the light-emitting chip to perform a phase change, and then the operating temperature of the light-emitting chip can be adjusted, thereby improving the heat dissipation effect of the light-emitting chip during high-brightness display, so that the light-emitting chip is maintained within the normal operating temperature and display brightness range, ensuring the stability of the color coordinates displayed by the light-emitting chip, and then improving the display effect of the display substrate.

[0047] It should be noted that the embodiment of the present invention does not limit the luminous color of the sub-pixel region included in the display substrate; the sub-pixel region can be any one of a red sub-pixel region, a green sub-pixel region, or a blue sub-pixel region. The display substrate can simultaneously include sub-pixel regions of three luminous colors, namely, a red sub-pixel region, a green sub-pixel region, or a blue sub-pixel region; of course, it can also include only a sub-pixel region of one luminous color, for example: only a plurality of red sub-pixel regions, or only a plurality of green sub-pixel regions, or only a plurality of blue sub-pixel regions. The specific color can be determined according to actual requirements.

[0048] Preferably, the display substrate provided by the embodiment of the present invention includes a red sub-pixel area, a green sub-pixel area and a blue sub-pixel area, and at least one through hole is correspondingly arranged in the red sub-pixel area, the green sub-pixel area and the blue sub-pixel area, and the through hole is filled with phase change material, so that the operating temperature of all light-emitting chips can be adjusted, thereby improving the heat dissipation effect of all light-emitting chips during high-brightness display, so that all light-emitting chips are maintained within the normal operating temperature and display brightness range, thereby improving the display effect of the display substrate.

[0049] Specifically, the material of the substrate may be a rigid material, such as glass, or a flexible material, such as polyimide.

[0050] In a specific implementation, in order to effectively transfer the heat generated by the light-emitting chip when it is working to the phase change material in the through hole, in the above-mentioned display substrate provided by the embodiment of the present invention, as Figure 2-Figure 4 As shown, it also includes a first metal layer 4 located between the light emitting chip 2 and the insulating layer 3, the first metal layer 4 includes a first heat dissipation structure 41, the first heat dissipation structure 41 includes a first heat dissipation portion 411 having the same pattern as the through hole 31, and the orthographic projection of the first heat dissipation portion 411 on the base substrate 1 covers the orthographic projection of the through hole 31 on the base substrate 1. In this way, the first heat dissipation portion 411 made of metal can play a good role in heat conduction, thereby improving the heat dissipation rate.

[0051] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2-Figure 4 As shown, the light emitting chip 2 includes a light emitting main body 21 and two conductive connecting parts 22 (positive and negative electrodes of the light emitting chip 2) connected to the light emitting main body 21, and the first heat dissipation structure 41 also includes a second heat dissipation part 412 electrically connected to the first heat dissipation part 411, and the second heat dissipation part 412 extends to the gap between the two conductive connecting parts 22. By extending the second heat dissipation part 412 to the gap between the two conductive connecting parts 22, the thermal conductivity can be improved (the thermal conductivity of the insulating layer is lower than that of the metal), and at the same time, it is closer to the heat source (the light emitting chip 2 generates heat when working), so as to achieve the purpose of faster heat dissipation.

[0052] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2-Figure 4 As shown, the first heat dissipation structure 41 also includes a third heat dissipation portion 413 electrically connected to the first heat dissipation portion 411 and located between the insulating layer 3 and the phase change material. In this way, the first heat dissipation structure 41 can wrap the phase change material in the through hole 31 to increase the heat dissipation area and heat dissipation rate.

[0053] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2-Figure 4 As shown, it also includes a second metal layer 5 located between the base substrate 1 and the insulating layer 3; the second metal layer 5 includes a second heat dissipation structure 51 with the same pattern as the through hole 31, and the orthographic projection of the second heat dissipation structure 51 on the base substrate 1 covers the orthographic projection of the through hole 31 on the base substrate 1. In this way, the first heat dissipation structure 41 and the second heat dissipation structure 51 wrap the phase change material in the through hole 31, and the first heat dissipation structure 41 and the second heat dissipation structure 51 form a heat dissipation microchannel, further improving the heat dissipation area and heat dissipation rate.

[0054] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2-Figure 4 As shown, the third heat dissipation portion 413 is in contact with the second heat dissipation structure 41, so that the first heat dissipation structure 41 and the second heat dissipation structure 51 form a closed structure that wraps the phase change material in the through hole 31, further increasing the heat dissipation area and heat dissipation rate. Of course, due to the influence of the manufacturing process, the third heat dissipation portion 413 may not be in contact with the second heat dissipation structure 41.

[0055] Therefore, the embodiment of the present invention can effectively absorb the heat emitted by the light-emitting chip by introducing a heat dissipation microchannel containing phase change material in the sub-pixel area, and improve the heat dissipation efficiency by wrapping the phase change material with two metal layers, which can effectively reduce the heat concentration effect displayed by the light-emitting chip and achieve a better display effect.

[0056] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2 and Figure 5 As shown, Figure 5 To illustrate a top view of the insulating layer 3, the through hole 31 is a comb-like structure, which includes a body 311 and a plurality of comb teeth 312 connected to the body 311 away from the light-emitting chip 2. By providing the through hole 31 with a comb-like structure, the heat dissipation area can be increased, and the heat dissipation rate can be further increased.

[0057] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2 and Figure 5As shown, the number of through holes 31 can be two, and the two through holes 31 are symmetrically arranged about the center of the light-emitting chip 2. This makes it easy to manufacture, and the heat dissipation is carried out simultaneously from different sides of the light-emitting chip 2, which can further improve the heat dissipation rate. Of course, the number of through holes 31 can also be 1 or more, and the two through holes 31 can also be asymmetrically arranged. The specific heat dissipation microchannel is designed according to the layout design and process conditions of the sub-pixel area. For example, in a pixel area with a size (pitch) of 500μm (including red, green, and blue sub-pixel areas), a heat dissipation microchannel with a length, width, and height of 20*15*5μm can be designed. A single pixel area can accommodate 4*10 total 40 parallel heat dissipation microchannels, which can absorb a large amount of heat generated when the light-emitting chip is working through the solid-liquid phase change process of the phase change material.

[0058] In addition, the heat dissipation microchannel also increases the heat dissipation area within the pixel area (pixel), ΔA = A 散热微通道 / A pixel *100%≈10%. At the same time, selecting a metal with high thermal conductivity, such as copper (397w / m·℃) or silver (420w / m·℃), can also increase the heat dissipation rate. According to the heat transfer formula, Q=kA△t / L, k is the heat transfer coefficient, A is the cross-sectional area of ​​heat transfer, and L is the length of the heat transfer path. In the present invention, the heat transfer coefficient k (selecting a metal with high thermal conductivity to make the first metal layer and the second metal layer) and the heat transfer cross-sectional area A (the through holes of the comb-like structure) are improved. Therefore, the embodiments of the present invention can complete heat dissipation more quickly.

[0059] In summary, the embodiments of the present invention can significantly improve the heat dissipation capability of the display substrate by providing heat dissipation microchannels in the sub-pixel region.

[0060] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2 As shown, it also includes a plurality of binding parts 33 electrically connected to each conductive connecting part 22, and the binding parts 33 are located in the first metal layer 4;

[0061] The materials of the first metal layer 4 and the second metal layer 5 can both be molybdenum-niobium alloy / copper / molybdenum-niobium alloy or titanium / aluminum / titanium. That is, the display substrate provided in the embodiment of the present invention can be a DC test substrate to perform device performance testing on the light-emitting chip 2, and the thickness of the first metal layer 4 and the second metal layer 5 can both be about 9000 angstroms.

[0062] Specifically, Figure 2 As shown, the materials of the first metal layer 4 and the second metal layer 5 may also be ITO / Ag / TIO, pure Mo, etc.

[0063] Specifically, Figure 2-Figure 4 As shown, the material of the insulating layer 3 may be resin, that is, the insulating layer 3 is a flat layer.

[0064] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2 As shown, it also includes a lead 34 electrically connected to the binding part 33, and the lead 34 is used to input a signal to the conductive connection part 22 through the binding part 33 to make the light-emitting chip 2 emit light.

[0065] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 6 As shown, it also includes: a gate metal layer 10 located on the base substrate 1, a source-drain metal layer 20 located on the side of the gate metal layer 10 away from the base substrate 1, and a plurality of binding parts 33 electrically connected to each conductive connection part 22; the binding part 33 is located on the first metal layer 4; wherein,

[0066] The first metal layer 4 and the source-drain metal layer 20 are located in the same film layer, and the second metal layer 5 and the gate metal layer 10 are located in the same film layer. That is, the display substrate provided in the embodiment of the present invention can be a driving backplane, so the original gate metal layer 10 and the source-drain metal layer 20 of the driving backplane can be used to make the first metal layer 4 and the second metal layer 5, without adding a separate process for making the first metal layer 4 and the second metal layer 5, thereby reducing the manufacturing process and reducing the cost.

[0067] Specifically, Figure 6 As shown, the insulating layer 3 is an interlayer insulating layer.

[0068] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 7-Figure 9 As shown, it also includes: a gate metal layer 10 located on the base substrate 1, a source-drain metal layer 20 located on the side of the gate metal layer 10 away from the base substrate 1, and a plurality of binding parts 33 electrically connected to each conductive connection part 22; the binding part 33 is located on the side of the source-drain metal layer 20 away from the base substrate 1; wherein,

[0069] like Figure 7 As shown, the first metal layer 4 and the source-drain metal layer 20 are located in the same film layer, and the second metal layer 5 and the gate metal layer 10 are located in the same film layer; the insulating layer 3 is an interlayer insulating layer;

[0070] or, as Figure 8 As shown, the first metal layer 4 and the binding portion 33 are located in the same film layer, and the second metal layer 5 and the source-drain metal layer 20 are located in the same film layer; the insulating layer 3 is a flat layer;

[0071] or, as Fig. 9As shown, the first metal layer 4 and the binding portion 33 are located in the same film layer, and the second metal layer 5 and the gate metal layer 10 are located in the same film layer; the insulating layer 3 includes an interlayer insulating layer 32 located between the gate metal layer 10 and the source-drain metal layer 20, and a flat layer 34 located between the flat layer source-drain metal layer 20 and the first metal layer 4. That is, the display substrate provided in the embodiment of the present invention can be a driving backplane, so that the original gate metal layer 10 and the source-drain metal layer 20 of the driving backplane can be used to make the first metal layer 4 and the second metal layer 5, without adding a separate process for making the first metal layer 4 and the second metal layer 5, reducing the manufacturing process and reducing the cost.

[0072] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2-Figure 9 As shown, it also includes a passivation layer 6 located between the binding portion 33 and the light emitting chip 2. Figure 2 The passivation layer 6 is not shown, and the conductive connection part 22 of the light emitting chip 2 is electrically connected to the binding part 33 through a via hole penetrating the passivation layer 6. Specifically, the material of the passivation layer 6 can be silicon nitride, silicon oxide, silicon oxynitride, and the like.

[0073] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2-Figure 9 As shown, it also includes: an active layer 30 located between the substrate 1 and the gate metal layer 10, and a gate insulating layer 40 located between the active layer 30 and the gate metal layer 10. The embodiment of the present invention is described by taking the top gate type as an example, and of course, the bottom gate type can also be used.

[0074] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 7 As shown, a flat film layer 50 is also included between the source-drain metal layer 20 and the binding portion 33 .

[0075] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 8 As shown, an interlayer insulating layer 60 is also included between the source / drain metal layer 20 and the gate metal layer 10 .

[0076] Therefore, the existing metal layers in the conventional driving backplane design, such as the gate metal layer, the source-drain metal layer, the binding layer and other metal film layers, can be used to construct a comb-shaped heat dissipation microchannel coated with phase change material.

[0077] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 2-Figure 9 As shown, the through hole 31 is also filled with a photoresist material, and the phase change material is dispersed in the photoresist. Specifically, the phase change material is doped in the photoresist, or directly printed in the through hole 31 by inkjet printing.

[0078] In a specific implementation, in the above display substrate provided by the embodiment of the present invention, the phase change material includes but is not limited to paraffin or polyethylene glycol.

[0079] In a specific implementation, in the above-mentioned display device provided in an embodiment of the present invention, the light-emitting chip can be a mini light-emitting diode (English: Mini Light Emitting Diode, abbreviated as: MiniLED), also known as a sub-millimeter light-emitting diode, or a micro light-emitting diode (English: Micro Light Emitting Diode, abbreviated as: Micro LED).

[0080] Based on the same inventive concept, an embodiment of the present invention further provides a display device, including the above-mentioned display substrate provided by an embodiment of the present invention. The display device can be: a mobile phone, a tablet computer, a television, a display, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function. Other essential components of the display device should be understood by those of ordinary skill in the art, and will not be described in detail here, nor should they be used as limitations on the present invention. The principle of solving the problem by the display device is similar to that of the above-mentioned display substrate, so the implementation of the display device can refer to the implementation of the above-mentioned display substrate, and the repeated parts will not be described here.

[0081] In the display substrate and display device provided by the embodiments of the present invention, each sub-pixel area of ​​the base substrate includes a light-emitting chip, and the insulating layer located between the base substrate and the light-emitting chip is provided with at least one through hole at a position corresponding to at least part of the sub-pixel area. Since the through hole is filled with a phase change material, the phase change material can absorb the heat generated by the light-emitting chip to perform a phase change, and then the operating temperature of the light-emitting chip can be adjusted, thereby improving the heat dissipation effect of the light-emitting chip during high-brightness display, so that the light-emitting chip is maintained within a normal operating temperature and display brightness range, thereby improving the display effect of the display substrate.

[0082] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A display substrate, characterized in that: include: A base substrate, wherein the base substrate has a plurality of sub-pixel regions; A plurality of light-emitting chips are located on one side of the substrate and are respectively located in the sub-pixel regions; an insulating layer, located between the base substrate and the light-emitting chip, wherein the insulating layer is provided with at least one through hole at a position corresponding to at least a portion of the sub-pixel region, wherein the through hole is filled with a phase change material, and the phase change material is configured to absorb heat generated by the light-emitting chip to perform phase change; A first metal layer is located between the light-emitting chip and the insulating layer, the first metal layer comprises a first heat dissipation structure, the first heat dissipation structure comprises a first heat dissipation portion having the same pattern as the through hole, and an orthographic projection of the first heat dissipation portion on the base substrate covers an orthographic projection of the through hole on the base substrate; The light emitting chip includes a light emitting main body and two conductive connecting parts connected to the light emitting main body. The first heat dissipation structure also includes a second heat dissipation part electrically connected to the first heat dissipation part. The second heat dissipation part extends to the gap between the two conductive connecting parts.

2. The display substrate according to claim 1, wherein: The first heat dissipation structure further includes a third heat dissipation portion electrically connected to the first heat dissipation portion and located between the insulating layer and the phase change material.

3. The display substrate according to claim 2, wherein: It also includes a second metal layer located between the base substrate and the insulating layer; the second metal layer includes a second heat dissipation structure with the same pattern as the through hole, and the orthographic projection of the second heat dissipation structure on the base substrate covers the orthographic projection of the through hole on the base substrate.

4. The display substrate according to claim 3, wherein: The third heat dissipation portion is in contact with or not in contact with the second heat dissipation structure.

5. The display substrate according to claim 1, wherein: The structure of the through hole is a comb-shaped structure, and the comb-shaped structure is provided with a main body and a plurality of comb teeth connected to a side of the main body away from the light-emitting chip.

6. The display substrate according to claim 5, wherein: The number of the through holes is two, and the two through holes are symmetrically arranged about the center of the light emitting chip.

7. The display substrate according to claim 4, wherein: It also includes a plurality of binding parts electrically connected to each of the conductive connecting parts, and the binding parts are located in the first metal layer; The materials of the first metal layer and the second metal layer are both molybdenum-niobium alloy / copper / molybdenum-niobium alloy or titanium / aluminum / titanium.

8. The display substrate according to claim 4, wherein: Also includes: A gate metal layer located on the base substrate, a source-drain metal layer located on a side of the gate metal layer away from the base substrate, and a plurality of binding parts electrically connected to each of the conductive connecting parts; The binding portion is located at the first metal layer; wherein, The first metal layer and the source-drain metal layer are located in the same film layer, and the second metal layer and the gate metal layer are located in the same film layer.

9. The display substrate according to claim 4, wherein: Also includes: A gate metal layer located on the base substrate, a source-drain metal layer located on a side of the gate metal layer away from the base substrate, and a plurality of binding parts electrically connected to each of the conductive connecting parts; The binding portion is located on a side of the source / drain metal layer away from the substrate; wherein, The first metal layer and the source / drain metal layer are located in the same film layer, and the second metal layer and the gate metal layer are located in the same film layer; Or, the first metal layer and the binding portion are located in the same film layer, and the second metal layer and the source-drain metal layer are located in the same film layer; Alternatively, the first metal layer and the binding portion are located in the same film layer, and the second metal layer and the gate metal layer are located in the same film layer.

10. The display substrate according to any one of claims 7 to 9, characterized in that: It also includes a passivation layer located between the binding part and the light-emitting chip, and the conductive connection part of the light-emitting chip is electrically connected to the binding part through a via hole penetrating the passivation layer.

11. The display substrate according to any one of claims 1 to 4, characterized in that: The through hole is also filled with a photoresist material, and the phase change material is dispersed in the photoresist.

12. The display substrate according to claim 11, wherein: The phase change material includes paraffin or polyethylene glycol.

13. A display device, characterized in that: Comprising the display substrate as described in any one of claims 1-12.

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