Method of manufacturing integrated circuit and electrostatic discharge test system

Abstract

In a method of manufacturing an integrated circuit involving performing an electrostatic discharge (ESD) test, a weak frequency band is detected by sequentially radiating a plurality of first electromagnetic waves on a first test board including the integrated circuit. A first peak-to-peak voltage signal is detected by sequentially radiating the plurality of first electromagnetic waves on a second test board including an electromagnetic wave receiving module. A frequency spectrum is detected by radiating a second electromagnetic wave on a housing including a third test board having the electromagnetic wave receiving module. A second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signal, and the frequency spectrum. An ESD characteristic associated with an electronic system including the integrated circuit is predicted based on the second peak-to-peak voltage signal.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0122530, filed on September 22, 2020 with the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The example embodiments generally relate to semiconductor integrated circuits, and more specifically to a method for performing electrostatic discharge (ESD) testing and an ESD testing system for performing the method. Background Technology

[0004] After wafer-level, package-level, and post-package-level processes, semiconductor integrated circuits are shipped as products. These circuits are delivered to customers and installed within electronic systems, such as semiconductor systems, to perform their functions. Before being shipped as products, semiconductor integrated circuits undergo various performance tests. Electrostatic discharge (ESD) testing is one such performance test used to assess the electromagnetic susceptibility of semiconductor integrated circuits manufactured in semiconductor packages. Therefore, ESD testing is an integral part of the semiconductor integrated circuit manufacturing process. Although the results of ESD testing may indicate that a semiconductor integrated circuit is good, defects may arise within the electronic system when it is actually installed and operated. This is because the electromagnetic characteristics applied to the semiconductor integrated circuit can vary depending on the layout or housing of the circuit board that constitutes the electronic system. These variations in electromagnetic characteristics can affect the semiconductor integrated circuit installed within the electronic system. As a result, when installed within an electronic system, the semiconductor integrated circuit may now be susceptible to the effects of electrostatic discharge. Summary of the Invention

[0005] Some example embodiments may provide methods and electrostatic discharge test systems for performing electrostatic discharge tests that are capable of predicting the electrostatic discharge characteristics associated with an electronic system including the device under test.

[0006] According to an example embodiment, in a method of manufacturing an integrated circuit involving performing electrostatic discharge (ESD) testing, a weak frequency band is detected by sequentially radiating a plurality of first electromagnetic waves onto a first test board including the integrated circuit. A first peak-to-peak voltage signal is detected by sequentially radiating the plurality of first electromagnetic waves onto a second test board including an electromagnetic wave receiving module. A spectrum is detected by radiating a second electromagnetic wave onto a housing including a third test board having the electromagnetic wave receiving module. A second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signal, and the spectrum. ESD characteristics associated with an electronic system including the integrated circuit are predicted based on the second peak-to-peak voltage signal.

[0007] According to an example embodiment, an ESD testing system includes: a first tester, a second tester, and an automated testing device. The first tester sequentially radiates a plurality of first electromagnetic waves onto a first test board including a device under test (DUT), and sequentially radiates the plurality of first electromagnetic waves onto a second test board including an electromagnetic wave receiving module. The second tester radiates second electromagnetic waves onto a housing including a third test board having the electromagnetic wave receiving module. The automated testing device detects a weak frequency band associated with the DUT based on the sequential radiating of the plurality of first electromagnetic waves onto the first test board, detects a first peak-to-peak voltage signal associated with the DUT based on the sequential radiating of the plurality of first electromagnetic waves onto the second test board, detects a spectrum based on the radiating of the second electromagnetic waves onto the housing, generates a second peak-to-peak voltage signal based on the weak frequency band, the first peak-to-peak voltage signal, and the spectrum, and predicts ESD characteristics associated with the electronic system including the DUT based on the second peak-to-peak voltage signal.

[0008] In the method and electrostatic discharge (ESD) testing disclosed herein, multiple tests are performed on the device under development (DUT) including the integrated circuit package after the packaging-level process is completed and before the integrated circuit package is shipped as a finished product. Furthermore, based on the results of these multiple tests, the ESD characteristics associated with the electronic system including the DUT can be predicted in advance. Attached Figure Description

[0009] Exemplary embodiments of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings.

[0010] Figure 1 This is a block diagram illustrating an electrostatic discharge test system according to an example embodiment.

[0011] Figure 2 This is a flowchart illustrating a method for performing an electrostatic discharge test according to an example embodiment.

[0012] Figure 3A , Figure 3B and Figure 3C It is shown that it is used for Figure 2 An illustration of an example device for detecting weak frequency bands.

[0013] Figure 4 and Figure 5 It is shown Figure 2 A flowchart illustrating an example of the process for detecting weak frequency bands.

[0014] Figure 6 It is shown Figure 2 A diagram illustrating the process of detecting weak frequency bands.

[0015] Figure 7A and Figure 7B It is shown that it is used for Figure 2 An illustration of an example of a device for detecting the first peak-to-peak voltage signal.

[0016] Figure 8 and Figure 9 It is shown Figure 2 The flowchart illustrates an example of the process for detecting the first peak voltage signal.

[0017] Figure 10 This is a diagram illustrating an example of the first peak-to-peak voltage signal.

[0018] Figure 11A and Figure 11B It is shown that it is used for Figure 2 An illustration of an example device for detecting the spectrum.

[0019] Figure 12 It is shown Figure 2 The flowchart is an example of the process of detecting the spectrum.

[0020] Figure 13 This is a graph showing an example of a spectrum.

[0021] Figure 14 It is shown Figure 2 The flowchart illustrates an example of the process of generating the second peak-to-peak voltage signal.

[0022] Figure 15 It is shown Figure 14 The flowchart illustrates an example of the process of generating compensation factors.

[0023] Figure 16 This is a diagram illustrating an example of a compensation factor.

[0024] Figure 17 This is a diagram illustrating an example of amplitude values ​​before spectral compensation.

[0025] Figure 18 This is a diagram illustrating an example of the amplitude value after spectral compensation.

[0026] Figure 19 This is a diagram illustrating an example of the second peak-to-peak voltage signal.

[0027] Figure 20 This is a flowchart illustrating an example of a process for predicting the electrostatic discharge (ESD) characteristics associated with an electronic system including a device under test (DUT).

[0028] Figure 21 This is a graph showing an example of a reference peak-to-peak voltage signal and a second peak-to-peak voltage signal.

[0029] Figure 22A It is used to describe Figure 2 A diagram illustrating the components that make up the database of the DUT. Figure 22B It is shown Figure 2 An illustration of an example database of the DUT.

[0030] Figure 23A It is used to describe Figure 2 A diagram illustrating the components that make up the database of the DUT. Figure 23B It is shown Figure 2 An illustration of an example database of the DUT.

[0031] Figure 24A It is used to describe Figure 2 A diagram illustrating the components that make up the database of the DUT. Figure 24B It is shown Figure 2 An illustration of an example database of the DUT. Detailed Implementation

[0032] Various exemplary embodiments will be described more fully below with reference to the accompanying drawings, which illustrate some exemplary embodiments. In the drawings, similar reference numerals always refer to similar elements. Repeated descriptions may be omitted.

[0033] Figure 1 This is a block diagram illustrating an electrostatic discharge test system according to an example embodiment.

[0034] Reference Figure 1 The electrostatic discharge (ESD) testing system 1000 includes an automated test equipment (ATE) 1100 and a tester 1500. The ATE 1100 includes a controller 1110 and a monitoring device 1130, and the tester 1500 includes a first tester (TESTER1) 1510 and a second tester (TESTER2) ​​1530.

[0035] The ATE 1100 controls multiple tests associated with the device under test (DUT). In some embodiments, the DUT may be a semiconductor integrated circuit manufactured as a semiconductor package, i.e., an integrated circuit package.

[0036] In some embodiments, the multiple tests may include a series of test procedures, and each of the multiple tests may be performed based on the International Electrotechnical Commission (IEC) 61000-4-2 standard.

[0037] In some embodiments, the multiple tests may include a first test, a second test, and a third test. A test board may be used to perform each of the first and second tests, and a housing may be used to perform the third test. In the first test, the test board may include a device under test (DUT). In the second test, the test board may include an electromagnetic wave receiving module. In the third test, the housing may include the test board. In the third test, the test board included in the housing may include an electromagnetic wave receiving module.

[0038] ATE 1100 generates control signals CTL1 and CTL2 for controlling multiple tests and provides control signals CTL1 and CTL2 to tester 1500. In some embodiments, control signals CTL1 and CTL2 may be generated by controller 1110.

[0039] Tester 1500 performs multiple tests on the DUT under the control of ATE 1100 and provides ATE 1100 with various result signals TRS generated by performing the multiple tests. The result signals TRS may be referred to as "test result data" or "test result signals". In some embodiments, the multiple tests may be performed by a first tester 1510 or a second tester 1530. More specifically, the first tester 1510 may perform a first test and a second test, and the second tester 1530 may perform a third test. The result signals TRS may be provided to monitoring device 1130. Monitoring device 1130 may generate test result information based on the result signals TRS. Test result information may be generated for each of the first, second, and third tests.

[0040] The ATE 1100 can predict the ESD characteristics associated with an electronic system including a DUT based on test result information. That is, the ESD test system 1000 performs multiple tests after the packaging-level process is completed and before the integrated circuit package is shipped as a finished product, and can predict the ESD characteristics of the electronic system before its manufacturing is complete. The ESD characteristics of the electronic system can include, for example, the ESD level that can be applied to the electronic system before the DUT (e.g., a semiconductor integrated circuit manufactured as a semiconductor package, i.e., the integrated circuit package) encounters a soft failure. As discussed in further detail below, the ESD characteristics of the electronic system can vary depending on the type of DUT, the type of housing surrounding the DUT, and the mounting location of the DUT within the housing.

[0041] Figure 2 This is a flowchart illustrating a method for performing an electrostatic discharge test according to an example embodiment.

[0042] Reference Figure 1 and Figure 2 The weak frequency band of the device under test (DUT) is detected by sequentially radiating multiple first electromagnetic waves onto a first test board including the DUT (S1000). As used herein, "weak frequency band" refers to the range of electromagnetic wave frequencies that, when applied to the DUT, would cause a soft fault (i.e., "band range"). As used herein, "soft fault" refers to a DUT fault caused by an ESD event that does not cause physical damage to the DUT or leave a physical trace within the DUT. For example, a soft fault could be the result of an ESD event that introduces an external signal into the DUT, which could cause the DUT to enter a state where it cannot function as expected. Soft faults can be corrected by error correction software or by restarting the DUT. During the testing of the DUT, multiple first electromagnetic waves can be used to simulate an ESD event.

[0043] Step S1000 is referred to above. Figure 1 The first tester 1510 described is performed. The first tester 1510 includes a noise signal generator. The first tester 1510 uses the noise signal generator to sequentially radiate multiple first electromagnetic waves.

[0044] The DUT is mounted at a first position on a first test plate and connected to the monitoring device 1130 via a pattern formed on the first test plate. In some embodiments, the first tester 1510 can sequentially radiate a plurality of first electromagnetic waves toward the DUT from above. Each of the plurality of first electromagnetic waves may have a different frequency band.

[0045] When multiple first electromagnetic waves are sequentially radiated onto the DUT, the monitoring device 1130 receives a result signal TRS corresponding to each of the multiple first electromagnetic waves, and determines whether a soft fault has occurred on the DUT based on the result signal TRS. As described above, a soft fault means that there is no physical damage to the DUT, but the DUT is in a state where the DUT is not fully or properly operating (or performing) its expected function.

[0046] In some embodiments, the monitoring device 1130 can detect weak frequency bands of the DUT based on the frequency bands of multiple first electromagnetic waves that cause soft faults. (Refer to...) Figure 3A , Figure 3B , Figure 3C , Figure 4 , Figure 5 and Figure 6 Detailed description of step S1000.

[0047] The first peak-to-peak voltage signal is detected by sequentially radiating multiple first electromagnetic waves onto a second test board including an electromagnetic wave receiving module (S2000).

[0048] Step S2000 is referred to above. Figure 1 The first tester 1510 described is performed. The first tester 1510 includes a noise signal generator. The first tester 1510 uses the noise signal generator to sequentially radiate multiple first electromagnetic waves.

[0049] An electromagnetic wave receiving module is mounted at a second position on a second test plate and connected to a monitoring device 1130 via a pattern formed on the second test plate. In some embodiments, a first tester 1510 may sequentially radiate a plurality of first electromagnetic waves from above the electromagnetic wave receiving module toward the electromagnetic wave receiving module. The plurality of first electromagnetic waves may be substantially the same as the plurality of first electromagnetic waves radiated onto the DUT on the first test plate in step S1000.

[0050] When multiple first electromagnetic waves are sequentially radiated onto the electromagnetic wave receiving module, the monitoring device 1130 receives the result signal TRS corresponding to each of the multiple first electromagnetic waves, and detects the voltage signal in the time domain corresponding to the electromagnetic wave radiated onto the electromagnetic wave receiving module based on the result signal TRS.

[0051] In some embodiments, the monitoring device 1130 can detect a first peak-to-peak voltage signal based on a voltage signal in the time domain. (Refer to...) Figure 7A , Figure 7B , Figure 8 , Figure 9 and Figure 10 Detailed description of step S2000.

[0052] The spectrum is detected by radiating a second electromagnetic wave onto a housing that includes a third test board with an electromagnetic wave receiving module (S3000).

[0053] Step S3000 is referred to above. Figure 1 The second tester 1530 described performs the operation. Unlike the first tester 1510, the second tester 1530 includes an electrostatic generator. The second tester 1530 uses the electrostatic generator to radiate a second electromagnetic wave. An electromagnetic wave receiving module is installed at a specific location on a third test plate, hereinafter referred to as the "test location". That is, the first location and the second location can be any location on the first and second test plates, and the test location can be a specific location on the third test plate. The third test plate can be disposed inside a housing.

[0054] In some embodiments, the test location may differ from the first location in step S1000 where the DUT is mounted on the first test board or the second location in step S2000 where the electromagnetic wave receiving module is mounted on the second test board. The test location is the location where the DUT is shipped as a finished product and then installed in the electronic system. The test location can be determined based on the hardware specifications of the electronic system including the DUT.

[0055] In some embodiments, the housing may be defined as a means for effectively arranging the circuit board including the DUT and protecting the DUT from external influences, based on the hardware specifications used to manufacture the electronic system. The hardware specifications may be provided in advance by the electronic system manufacturer that purchases the DUT and manufactures the electronic system.

[0056] The electromagnetic wave receiving module is connected to the monitoring device 1130 via a pattern formed on the third test plate. In some embodiments, the second tester 1530 can radiate a second electromagnetic wave from the outside of the housing including the third test plate toward the outer surface of the housing. The second electromagnetic wave may have a frequency band that includes the entire frequency band of the plurality of first electromagnetic waves according to steps S1000 and S2000.

[0057] When the second electromagnetic wave radiates to the housing, the monitoring device 1130 receives the result signal TRS generated corresponding to the second electromagnetic wave, and detects the voltage signal in the frequency domain corresponding to the electromagnetic wave radiated to the electromagnetic wave receiving module based on the result signal TRS.

[0058] In some embodiments, the monitoring device 1130 can detect the spectrum based on the voltage signal in the frequency domain. (See reference...) Figure 11A , Figure 11B , Figure 12 and Figure 13 Detailed description of step S3000.

[0059] The second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signal, and the spectrum (S4000).

[0060] Step S4000 is referenced above. Figure 1 The ATE 1100 described is executed as follows: weak frequency bands are detected by executing step S1000, the first peak-to-peak voltage signal is detected by executing step S2000, and the spectrum is detected by executing step S3000.

[0061] In some embodiments, a compensation factor can be generated based on the weak frequency band and the first peak-to-peak voltage signal, and the amplitude value can be compensated based on the compensation factor. A second peak-to-peak voltage signal can be generated based on the compensated amplitude value.

[0062] In some embodiments, the compensation factor can be pre-generated after step S2000, and the compensated amplitude value can be pre-generated after step S3000. In another embodiment, the compensation factor and the compensated amplitude value can be generated after step S3000 or during step S4000. (Refer to...) Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 Describe step S4000 in detail.

[0063] ESD characteristics associated with electronic systems including the DUT are predicted based on the second peak-to-peak voltage signal (S5000).

[0064] Step S5000 is referred to above. Figure 1 The ATE 1100 described is executed. In some embodiments, a reference peak-to-peak voltage signal may be provided during the execution of step S5000. In this case, ESD characteristics can be predicted by comparing the reference peak-to-peak voltage signal with a second peak-to-peak voltage signal. Figure 20 and Figure 21 Detailed description of step S5000.

[0065] In step S6000, a database about the DUT is generated. Step S6000 is based on the above reference. Figure 1 The ATE 1100 described is executed.

[0066] In some embodiments, the database may include information about the DUT and information about the housing. Information about the DUT may include the DUT's model name, the DUT's mounting location, the DUT's weak frequency band, and the peak-to-peak voltage signal within the weak frequency band. Information about the housing may include the housing's model name. In some embodiments, the database may also include information about the hardware specifications corresponding to each of the DUT and the housing. (Refer to...) Figure 22A , Figure 22B , Figure 23A , Figure 23B , Figure 24A and Figure 24B Detailed description of step S6000.

[0067] Figure 3A , Figure 3B and Figure 3C It is shown that it is used for Figure 2 An illustration of an example device for detecting weak frequency bands.

[0068] Reference Figure 3A , Figure 3B and Figure 3C It can detect weak frequency bands and perform... Figure 2 The apparatus in step S1000 includes a host 100, a first transmission line 150, a first test board 200, an electromagnetic wave radiation module 310, a second transmission line 350, and a noise signal generator 300. The noise signal generator 300 includes an electrostatic generation device 301, a receiving antenna 303, and a filtering circuit 305. The first test board 200 includes a DUT 210.

[0069] In some embodiments, host 100 may correspond to Figure 1 The monitoring device 1130, the first test board 200, the electromagnetic wave radiation module 310, and the noise signal generator 300 can correspond to Figure 1 The first tester in the series is 1510.

[0070] The electrostatic discharge (ESD) generating device 301 receives a test voltage VTEST and generates an electromagnetic wave based on the test voltage VTEST. In some embodiments, the output voltage of the ESD generating device 301 is the open-circuit voltage measured at the discharge electrode of the ESD generating device 301, and can be between approximately 1 kV and approximately 15 kV according to IEC 61000-4-2. The ESD generating device 301 can adjust the level of the output voltage based on the test voltage VTEST. The test voltage VTEST can be included in the control signal CTL1 provided from the host 100 and supplied to the ESD generating device 301.

[0071] The receiving antenna 303 receives electromagnetic waves generated by the electrostatic generator 301 and provides them to the filtering circuit 305. The filtering circuit 305 filters the electromagnetic waves based on the control signal CTL1 provided from the host 100. The electromagnetic waves are provided to the electromagnetic wave radiation module 310 through the second transmission line 350, and as a result of the filtering, the electromagnetic wave radiation module 310 can radiate electromagnetic waves with a specific frequency band.

[0072] The electromagnetic wave radiation module 310 can radiate electromagnetic waves from above the DUT 210 toward the DUT 210, which can be mounted at any position on the first test board 200. In some embodiments, the electromagnetic wave radiation module 310 can be implemented as a near-field probe. The end of the near-field probe can be formed in a square shape, but this shape is only exemplary.

[0073] The host 100 drives the DUT 210 via the first transmission line 150. In some embodiments, the host 100 provides test pattern data to the DUT 210, and when electromagnetic waves are radiated onto the DUT 210, the host 100 can determine whether a soft fault has occurred on the DUT 210 based on the resulting signal generated by the DUT 210 corresponding to the electromagnetic waves. For example, a soft fault is determined based on the resulting signal generated by the DUT 210 during the period when the DUT 210 is radiated by electromagnetic waves.

[0074] Figure 4 and Figure 5 It is shown Figure 2 A flowchart illustrating an example of the process for detecting weak frequency bands.

[0075] Reference Figure 3A , Figure 3B , Figure 3C and Figure 4 The filter band of the filter circuit 305 is adjusted (S1100). The first detection preparation operation is performed (S1300). In the first detection preparation operation, multiple first electromagnetic waves are radiated onto the first test plate 200 by increasing the output voltage of the electrostatic generating device 301 from a first voltage to a second voltage.

[0076] In some embodiments, the first voltage may be the minimum allowable voltage at which the output voltage of the electrostatic generating device 301 can be adjusted, and the second voltage may be the maximum allowable voltage at which the output voltage can be adjusted.

[0077] In some embodiments, the filter bandwidth and output voltage can be adjusted based on the control signal CTL1 provided from the host 100.

[0078] In some embodiments, after adjusting the filter band to radiate electromagnetic waves with a specific frequency band, electromagnetic waves with various intensities can be radiated by adjusting the output voltage of the electrostatic generating device 301.

[0079] Perform the second detection preparation operation (S1500). In this second detection preparation operation, determine whether a soft fault has occurred on the DUT 210. When a soft fault occurs on the DUT 210, a reference output voltage can be set. The reference output voltage is a voltage between the minimum allowable voltage and the maximum allowable voltage, and can be set to the minimum voltage from the output voltage of the electrostatic generator 301 corresponding to a specific frequency band that causes a soft fault on the DUT 210. Figure 8 and Figure 9 Describe the reference output voltage in detail.

[0080] Reference Figure 3A , Figure 3B , Figure 3C , Figure 4 and Figure 5 The filter band of the filter circuit 305 is set to a first frequency band with a first center frequency (S1110). A first detection preparation operation is performed (S1310). A second detection preparation operation is performed (S1510). In some embodiments, the first detection preparation operation and the second detection preparation operation may be performed sequentially based on the first frequency band.

[0081] The filter band of the filter circuit 305 is set to a second frequency band with a second center frequency (S1120). A first detection preparation operation is performed (S1320). A second detection preparation operation is performed (S1520). In some embodiments, the first detection preparation operation and the second detection preparation operation may be performed sequentially based on the second frequency band.

[0082] The filter band of the filter circuit 305 is set to the Xth frequency band with the Xth center frequency, where X is a natural number greater than or equal to 3 (S1130). A first detection preparation operation is performed (S1330). A second detection preparation operation is performed (S1530). In some embodiments, the first and second detection preparation operations can be performed sequentially based on the Xth frequency band.

[0083] The filter frequency bands, which can be adjusted via the control filter circuit 305, are adjusted sequentially from the minimum to the maximum frequency band. The frequency band of each of the plurality of first electromagnetic waves is determined based on the filter frequency band. In some embodiments, the frequency band and filter frequency band of each of the plurality of first electromagnetic waves may be substantially the same as each other.

[0084] In some embodiments, the first frequency band and the second frequency band adjacent to the first frequency band may partially overlap with each other.

[0085] In some embodiments, the filter band can be adjusted based on whether a soft fault occurs on the DUT 210. For example, each of the first band and the Xth band can be a filter band corresponding to a band on the DUT 210 where no soft fault occurs. On the other hand, the second band can be a filter band corresponding to a band on the DUT 210 where a soft fault occurs. That is, it can be determined that no soft fault occurs on the DUT when the second detection preparation operation is performed based on the first band and the Xth band, and it can be determined that a soft fault occurs on the DUT when the second detection preparation operation is performed based on the second band. In this case, a weak band is detected between the center frequency of the first band and the center frequency of the Xth band (S1700).

[0086] Figure 6 It is shown Figure 2 A diagram illustrating the process of detecting weak frequency bands.

[0087] exist Figure 6 The diagram shows examples of frequencies (e.g., approximately 1.96 GHz to 2.48 GHz) and the results of soft fault tests corresponding to these frequencies.

[0088] Each frequency represents the center frequency of the filter band of filter circuit 305 or the center frequency of the frequency band of each of the multiple first electromagnetic waves corresponding to the filter band. The result of the soft fault test indicates whether a soft fault occurs in DUT 210 when multiple first electromagnetic waves radiate to the first test board.

[0089] Reference Figure 6 When multiple first electromagnetic waves with center frequencies of 1.96 GHz, 2.44 GHz, and 2.48 GHz radiate onto the first test board, no soft fault occurs on the DUT, i.e., it passes. On the other hand, when multiple first electromagnetic waves with center frequencies of 2.00 GHz, 2.04 GHz, 2.08 GHz, 2.12 GHz, 2.16 GHz, 2.20 GHz, 2.24 GHz, 2.28 GHz, 2.32 GHz, 2.36 GHz, and 2.40 GHz radiate onto the first test board, a soft fault occurs on the DUT, i.e., it fails. In this case, based on the filter band where the soft fault occurs, the weak frequency band of the DUT 210 can be detected as the band from approximately 2.00 GHz to approximately 2.40 GHz. In the following, an example embodiment will be described based on the weak frequency band corresponding to the band from 2.00 GHz to 2.40 GHz.

[0090] Figure 7A and Figure 7B It is shown that it is used for Figure 2 An illustration of an example of a device for detecting the first peak-to-peak voltage signal.

[0091] Reference Figure 3A , Figure 3B , Figure 3C , Figure 7A and Figure 7B The apparatus for detecting the first peak-to-peak voltage signal includes an oscilloscope 110, a third transmission line 151, a second test board 201, an electromagnetic wave radiation module 310, a fourth transmission line 350, and a noise signal generator 300. The noise signal generator 300 includes an electrostatic generation device 301, a receiving antenna 303, and a filter circuit 305. It has the characteristics of... Figure 3A , Figure 3B and Figure 3C The parts whose reference numerals are the same as those of the parts that perform the same or similar functions will be omitted from the description.

[0092] In some embodiments, the oscilloscope 110 may be included Figure 1 In the monitoring device 1130, the second test board 201, the electromagnetic wave radiation module 310, and the noise signal generator 300 can be included. Figure 1 The first tester in the series is 1510.

[0093] The noise signal generator 300 and the electromagnetic wave radiation module 310 perform the following operations: Figure 3A , Figure 3B and Figure 3C The noise signal generator 300 and the electromagnetic wave radiation module 310 shown have the same function. That is, the noise signal generator 300 can provide electromagnetic waves with a specific frequency band to the electromagnetic wave radiation module 310, and the electromagnetic wave radiation module 310 can radiate electromagnetic waves from a position above the electromagnetic wave receiving module 230 toward the electromagnetic wave receiving module 230, which can be formed at any position on the second test board 201.

[0094] and Figure 3A and Figure 3C Unlike the first test board 200 shown, the second test board 201 includes an electromagnetic wave receiving module 230 instead of the DUT 210. In one embodiment, the second test board 201 can be compared with the one shown above. Figure 3A , Figure 3B and Figure 3C The first test plate 200 described is prepared separately. In another embodiment, the second test plate 201 can be prepared by reusing the first test plate 200.

[0095] The electromagnetic wave receiving module 230 includes a conductive pattern 231, a transmission line 233, and a shielding member 235. The conductive pattern 231 is formed on the upper surface of the second test plate 201 to receive electromagnetic waves radiated from the electromagnetic wave radiation module 310. The transmission line 233 transmits the electromagnetic waves to the oscilloscope 110 via a third transmission line 151. The shielding member 235 shields the electromagnetic waves from flowing out to the external environment, so that the electromagnetic waves are effectively transmitted to the oscilloscope 110.

[0096] The oscilloscope 110 detects the voltage signal in the time domain of the electromagnetic wave received by the electromagnetic wave receiving module 230 through the third transmission line 151. The monitoring device 1130 can detect the first peak-to-peak voltage signal based on the voltage signal in the time domain.

[0097] Figure 8 and Figure 9 It is shown Figure 2 The flowchart illustrates an example of the process for detecting the first peak voltage signal.

[0098] Reference Figure 7A , Figure 7B and Figure 8 A second test board is prepared by installing an electromagnetic wave receiving module (S2100). The filter band of the filter circuit is adjusted (S2200).

[0099] Reference Figure 7A , Figure 7B and Figure 8 A second test board is prepared by installing an electromagnetic wave receiving module (S2100). The filter band of the filter circuit is adjusted (S2200). A third detection preparation operation is performed (S2300). In the third detection preparation operation, multiple first electromagnetic waves are radiated onto the second test board by setting the output voltage of the electrostatic generating device to be higher than the reference output voltage. A fourth detection preparation operation is performed (S2400). In the fourth detection preparation operation, a first result signal generated by sequentially radiating multiple first electromagnetic waves onto the second test board is received. A first peak-to-peak voltage signal is generated based on the first result signal (S2500).

[0100] Steps S2200 and S2300 correspond to the above reference. Figure 4 The described steps S1100 and S1300 correspond to the above reference. Figure 5 Steps S1110, S1120, S1130, S1310, S1320, and S1330 are described. Therefore, the filter frequency band can be adjusted to be the same as the filter frequency band of the filter circuit 305 adjusted in steps S1100, S1110, S1120, S1130, S1300, S1310, S1320, and S1330.

[0101] The reference output voltage can be based on the above reference. Figure 4 and Figure 5 The minimum voltage among the output voltages of the electrostatic generation device 301 that cause a soft fault on the DUT in steps S1500, S1510, S1520 and S1530 described.

[0102] The first result signal is detected by oscilloscope 110. In some embodiments, the first result signal can be detected as a voltage signal in the time domain, and can be detected for each filtered frequency band according to steps S2200 and S2300. Therefore, a first peak-to-peak voltage signal can be generated for each filtered frequency band based on the first result signal.

[0103] Reference Figure 7A , Figure 7B and Figure 9 The DUT 210 is removed from the first test board 200 (S2110). The second test board 201 is then fabricated by installing the electromagnetic wave receiving module 230 at the location where the DUT 210 has been removed on the first test board 200 (S2120). (Refer to the above...) Figure 7A and Figure 7B As described, in some embodiments, the second test plate 201 may be prepared separately from the first test plate 200, but in some embodiments, the second test plate 201 may be prepared by reusing the first test plate 200.

[0104] The filtering frequency band of the filter circuit 305 is set to a first frequency band having a first center frequency (S2210). A third detection preparation operation is performed (S2310). A fourth detection preparation operation is performed (S2410). In some embodiments, the third and fourth detection preparation operations can be performed sequentially based on the first frequency band.

[0105] The filtering frequency band of the filter circuit 305 is set to a second frequency band with a second center frequency (S2220). A third detection preparation operation is performed (S2320). A fourth detection preparation operation is performed (S2420). In some embodiments, the third and fourth detection preparation operations can be performed sequentially based on the second frequency band.

[0106] The filter band of the filter circuit 305 is set to the Xth frequency band with the Xth center frequency, where X is a natural number greater than or equal to 3 (S2230). A third detection preparation operation is performed (S2330). A fourth detection preparation operation is performed (S2430). In some embodiments, the third and fourth detection preparation operations can be performed sequentially based on the Xth frequency band.

[0107] Within the filter frequency band that can be adjusted via the control filter circuit 305, the filter frequency band is adjusted sequentially from the minimum frequency band to the maximum frequency band. The adjustment method of the filter frequency band is the same as described above. Figure 5 The methods described are the same.

[0108] The frequency band of each of the plurality of first electromagnetic waves is determined based on the filtering frequency band. In some embodiments, the frequency band of each of the plurality of first electromagnetic waves and the filtering frequency band may be substantially the same as each other.

[0109] A first peak-to-peak voltage signal is generated based on the first result signal (S2500).

[0110] Figure 10 This is a diagram illustrating an example of the first peak-to-peak voltage signal.

[0111] exist Figure 10 Examples of frequencies (e.g., from approximately 1.96 GHz to approximately 2.48 GHz) and first peak-to-peak voltage signals VPP1 corresponding to these frequencies are shown.

[0112] Each frequency represents the center frequency of the filter band of the filter circuit 305 or the center frequency of the frequency band of each of the multiple first electromagnetic waves corresponding to the filter band. The first peak-to-peak voltage signal VPP1 represents the peak-to-peak voltage signal detected by the monitoring device 1130 based on the voltage signal in the time domain detected by the oscilloscope 110 when the multiple first electromagnetic waves are radiated onto the second test board.

[0113] Reference Figure 10 When multiple first electromagnetic waves with center frequencies of 1.96GHz, 2.00GHz, 2.04GHz, 2.08GHz, 2.12GHz, 2.16GHz, and 2.20GHz radiate onto the second test board including the electromagnetic wave receiving module 230, the peak-to-peak voltage signals can be expressed as 5.5V, 4.4V, 4.6V, 4.3V, 4.2V, 4.1V, and 3.8V, respectively. When multiple first electromagnetic waves with center frequencies of 2.24GHz, 2.28GHz, 2.32GHz, 2.36GHz, 2.40GHz, 2.44GHz, and 2.48GHz radiate onto the second test board including the electromagnetic wave receiving module 230, the peak-to-peak voltage signals can be expressed as 3.5V, 3.9V, 5.4V, 6.5V, 8.5V, 9V, and 9.5V, respectively.

[0114] Figure 11A and Figure 11B It is shown that it is used for Figure 2 An illustration of an example device for detecting the spectrum.

[0115] Reference Figure 11A and Figure 11BThe device for detecting the spectrum performs Figure 2 Step S3000 includes an oscilloscope 110, a third transmission line 151, a housing 250, and an electrostatic generator 301. Figure 3A , Figure 3B , Figure 3C , Figure 7A and Figure 7B Components with the same reference numerals perform the same or similar functions, so redundant descriptions will be omitted.

[0116] In some embodiments, the oscilloscope 110 may be included Figure 1 The monitoring device 1130 is included, and the housing 250 and the static electricity generating device 301 can be included. Figure 1 The second tester 1530 is in the middle.

[0117] Static electricity generating device 301 performs and Figure 3A , Figure 3B , Figure 3C , Figure 7A and Figure 7B The electrostatic generator 301 shown has the same function. That is, the electrostatic generator 301 receives the test voltage VTEST and radiates electromagnetic waves from the outside of the housing 250 toward the outer surface of the housing 250 based on the test voltage VTEST.

[0118] Unlike the reference above Figure 3A , Figure 3B and Figure 3C The device described for detecting weak frequency bands, or the above reference Figure 7A and Figure 7B The described apparatus for detecting the first peak-to-peak voltage signal does not include a filter circuit in the spectrum detection apparatus. Therefore, the electromagnetic waves radiated from the electrostatic generating device 301 to the housing 250 can have the following frequency band: this frequency band includes the entire frequency band of the plurality of first electromagnetic waves according to steps S1000 and S2000.

[0119] The housing 250 includes a third test plate 203, and the third test plate 203 is disposed inside the housing 250. An electromagnetic wave receiving module 230 is installed at the test position on the third test plate 203. The electromagnetic wave receiving module 230 has the same characteristics as described above. Figure 7A and Figure 7B The electromagnetic wave receiving module 230 described has the same structure and performs the same function.

[0120] The oscilloscope 110 receives the test result signal TRS corresponding to the electromagnetic wave received by the electromagnetic wave receiving module 230 through the third transmission line 151. The monitoring device 1130 detects the voltage signal in the frequency domain corresponding to the electromagnetic wave based on the test result signal TRS, and detects the spectrum based on the voltage signal in the frequency domain.

[0121] Figure 12 It is shown Figure 2 The flowchart is an example of the process of detecting the spectrum. Figure 13 This is a graph showing an example of a spectrum.

[0122] Reference Figure 11A , Figure 11B , Figure 12 and Figure 13 An electromagnetic wave receiving module 230 is installed at the test position on the third test board 203 (S3100). The third test board 203 is located inside the housing 250 (S3200).

[0123] Perform the fifth detection preparation operation (S3300). In the fifth detection preparation operation, by setting the output voltage of the electrostatic generator to be higher than the reference output voltage, a second electromagnetic wave is radiated onto the housing 250. The reference output voltage can be based on the above reference... Figure 4 and Figure 5 The minimum voltage among the output voltages of the electrostatic generation device 301 that cause a soft fault on the DUT in steps S1500, S1510, S1520, and S1530. The second electromagnetic wave is an unfiltered electromagnetic wave and may have the following frequency band: this frequency band includes the entire frequency band of the plurality of first electromagnetic waves according to steps S1000 and S2000.

[0124] The sixth detection preparation operation is performed (S3400). In the sixth detection preparation operation, a second result signal generated by radiating a second electromagnetic wave onto the housing 250 is received.

[0125] Detecting the spectrum based on the second result signal (S3500). In some embodiments, the monitoring device 1130 can detect the voltage signal in the frequency domain of the electromagnetic wave based on the second result signal, and can detect the spectrum based on the voltage signal in the frequency domain.

[0126] exist Figure 13 The example shown is a spectrum 3000a. (See reference...) Figure 13 The X-axis represents frequency, and the Y-axis represents the voltage signal in the frequency domain.

[0127] Figure 14 It is shown Figure 2 The flowchart illustrates an example of the process of generating the second peak-to-peak voltage signal. Figure 15 It is shown Figure 14 The flowchart illustrates an example of the process of generating compensation factors. Figure 16 This is a diagram illustrating an example of a compensation factor.

[0128] Reference Figure 14A compensation factor is generated based on the weak frequency band and the first peak-to-peak voltage signal (S4100). The weak frequency band is generated according to step S1000 or step S1700. The first peak-to-peak voltage signal is generated according to step S2000 or step S2500. The process of generating the compensation factor will be described in detail.

[0129] Reference Figure 15 The first voltage signal corresponding to the frequency band outside the weak frequency band in the first peak-to-peak voltage signal is removed (S4110). A compensation factor is generated by performing a compensation operation on the second voltage signal corresponding to the weak frequency band in the first peak-to-peak voltage signal (excluding the first voltage signal) (S4120). The weak frequency band corresponds to the frequency band referred to above. Figure 6 The described frequency band is from 2.00 GHz to 2.40 GHz. The compensation operation can be an operation of returning the reciprocal for each first peak-to-peak voltage signal corresponding to a weak frequency band in the first peak-to-peak voltage signal.

[0130] Reference Figure 16 The first voltage signal corresponding to frequency bands outside the weak frequency band (e.g., frequency bands less than 2.00 GHz or greater than 2.40 GHz) in the first peak-to-peak voltage signal VPP1 can be removed. For example, the first voltage signal corresponding to the frequency band represented by the center frequency of 1.96 GHz can be removed, the first voltage signal corresponding to the frequency band represented by the center frequency of 2.44 GHz can be removed, and the first voltage signal corresponding to the frequency band represented by the center frequency of 2.48 GHz can be removed.

[0131] A compensation factor VPP-1 can be generated by performing a compensation operation on a second voltage signal (excluding the first voltage signal) corresponding to a weak frequency band (e.g., a band greater than or equal to 2.00 GHz and less than or equal to 2.40 GHz) within the first peak-to-peak voltage signal. For example, for the second voltage signal corresponding to a band with a center frequency of 2.00 GHz (i.e., 4.4 V), a reciprocal value (i.e., 0.23 V = 1 / 4.4 V) can be generated as the compensation factor VPP-1. For the second voltage signal corresponding to a band with a center frequency of 2.04 GHz (i.e., 4.6 V), a reciprocal value (i.e., 0.22 V = 1 / 4.6 V) can be generated as the compensation factor VPP-1. Furthermore, for other frequency bands included in the weak frequency bands (e.g., frequency bands with center frequencies of 2.08 GHz, 2.12 GHz, 2.16 GHz, 2.20 GHz, 2.24 GHz, 2.28 GHz, 2.32 GHz, 2.36 GHz, and 2.48 GHz), the compensation factor VPP-1 is generated by performing a compensation operation in the same manner as generating the compensation factor VPP-1 corresponding to the frequency band with a center frequency of 2.00 GHz or 2.04 GHz.

[0132] As a result of the compensation operation, a compensation factor VPP-1 corresponding to the weak frequency band of the DUT 210 can be generated.

[0133] Return to reference Figure 14 The compensated amplitude value is generated by compensating the spectral amplitude value based on the compensation factor VPP-1 (S4200). The spectrum is detected according to step S3500. Figure 13 Example 3000a of the spectrum is shown in the figure.

[0134] Figure 17 This is a diagram illustrating an example of amplitude values ​​before spectral compensation. Figure 18 This is a diagram illustrating an example of the amplitude value after spectral compensation.

[0135] Reference Figure 17 ,about Figure 13 The amplitude value of spectrum 3000a can be selected only from the amplitude values ​​3000b of the spectrum corresponding to weak frequency bands (e.g., frequency bands greater than or equal to 2.00 GHz and less than or equal to 2.40 GHz). In some embodiments, the amplitude values ​​of the spectrum corresponding to frequency bands other than weak frequency bands can be removed.

[0136] Reference Figure 18 Each amplitude value 3000b of the spectrum corresponding to the weak frequency band can be multiplied by the corresponding compensation factor VPP-1 in the frequency domain. For example, the amplitude value 3000b of the spectrum can be multiplied by the compensation factor VPP-1 to obtain the amplitude value 3000c of the spectrum as the compensated amplitude value.

[0137] The compensated amplitude value is converted into a second peak-to-peak voltage signal (S4300). In some embodiments, the compensated amplitude value is a value in the frequency domain, and the second peak-to-peak voltage signal VPP2 can be generated by converting the compensated amplitude value to the time domain and measuring the peak-to-peak voltage of the converted signal.

[0138] Figure 19 This is a diagram illustrating an example of the second peak-to-peak voltage signal.

[0139] Reference Figure 19 It can be done by Figure 18 The compensated amplitude value shown is converted to the time domain, and a second peak-to-peak voltage signal VPP2 is generated based on the peak-to-peak voltage of the converted measurement signal. In some embodiments, an inverse fast Fourier transform (IFTT) can be performed during the conversion of the compensated amplitude value to the time domain. IFTT can be derived from the above reference. Figure 1 The ATE1100 described is used for execution.

[0140] Figure 20This is a flowchart illustrating an example of a process for predicting the electrostatic discharge (ESD) characteristics associated with an electronic system including a device under test (DUT).

[0141] Reference Figure 20 The system receives a reference peak-to-peak voltage signal corresponding to the DUT (S5100). The reference peak-to-peak voltage signal represents the peak-to-peak voltage in the time domain of the electromagnetic wave that caused the soft fault in the DUT.

[0142] In some embodiments, a reference peak-to-peak voltage signal can be generated by generating a voltage signal in the time domain based solely on the first peak-to-peak voltage signal corresponding to a weak frequency band in the first peak-to-peak voltage signal, and then measuring or calculating the peak-to-peak voltage of the voltage signal generated in the time domain. In this case, the reference peak-to-peak voltage signal can use the reference mentioned above. Figure 7A and Figure 7B The device described is used to generate the first peak voltage signal.

[0143] In some embodiments, a reference peak-to-peak voltage signal can be generated by generating a voltage signal in the time domain based on all first peak-to-peak voltage signals and measuring or calculating the peak-to-peak voltage of the generated voltage signal in the time domain. In this case, the reference peak-to-peak voltage signal can use the reference mentioned above. Figure 7A and Figure 7B The described device generates the first peak-to-peak voltage signal. Additionally, a reference peak-to-peak voltage signal can be generated using... Figure 3C , Figure 11A and Figure 11B The static electricity is generated by the static electricity generating device 301, rather than... Figure 7A and Figure 7B The noise signal generator 300 in the middle.

[0144] The ESD characteristics associated with an electronic system including a device under test (DUT) are predicted by comparing a reference peak-to-peak voltage signal with a second peak-to-peak voltage signal (S5200). Each of the reference peak-to-peak voltage signal and the second peak-to-peak voltage signal varies depending on the type of DUT, the type of housing, or the mounting location of the DUT within the housing. The type of housing can vary depending on the material or shape of the housing, and the mounting location can be referenced to the test location.

[0145] Once the DUT, housing, and mounting location are determined, follow the steps outlined above. Figure 2 The described steps S1000, S2000, S3000, and S4000 are used to determine a reference peak-to-peak voltage signal and a second peak-to-peak voltage signal.

[0146] Figure 21 This is a graph showing an example of a reference peak-to-peak voltage signal and a second peak-to-peak voltage signal.

[0147] exist Figure 21 In the diagram, the X-axis represents multiple trials TRIAL1, TRIAL2, TRIAL3, TRIAL4, and TRIAL5, and the Y-axis represents the peak-to-peak voltage signal values. Each of the reference peak-to-peak voltage signal and the second peak-to-peak voltage signal can be normalized by dividing by the value of the reference peak-to-peak voltage signal. The reference peak-to-peak voltage value can be represented as "1," and the value of the second peak-to-peak voltage signal (hereinafter referred to as the "normalized second peak-to-peak voltage signal") can be represented as the ratio to the value of the reference peak-to-peak voltage signal.

[0148] Reference Figure 21 At least one of the DUT, housing, and mounting location can vary in each of the multiple tests TRIAL1, TRIAL2, TRIAL3, TRIAL4, and TRIAL5. Therefore, the value of the normalized second peak-to-peak voltage signal can vary in each of the multiple tests TRIAL1, TRIAL2, TRIAL3, TRIAL4, and TRIAL5.

[0149] In some embodiments, the normalized second peak-to-peak voltage signal value in the first test TRIAL1 can be 0.6, the normalized second peak-to-peak voltage signal value in the second test TRIAL2 can be 0.8, the normalized second peak-to-peak voltage signal value in the third test TRIAL3 can be 1, the normalized second peak-to-peak voltage signal value in the fourth test TRIAL4 can be 1.2, and the normalized second peak-to-peak voltage signal value in the fifth test TRIAL5 can be 1.4.

[0150] Since the value of the normalized second peak-to-peak voltage signal in the first test TRIAL1 is 0.6, it has a margin of approximately 67% compared to the reference peak-to-peak voltage signal. On the other hand, in the first test TRIAL1, steps S1000, S2000, S3000, and S4000 were performed assuming the first DUT was mounted at a first mounting position in the first housing to configure the electronic system. In this case, based on the value of the normalized second peak-to-peak voltage signal, the following conclusion is drawn: That is, compared to the case where the first DUT is exposed to the integrated circuit package, when the first DUT is mounted in the first mounting position of the first housing, the first DUT can operate normally without causing soft failures against electromagnetic waves with an intensity increase of approximately 67%.

[0151] Since the normalized second peak-to-peak voltage signal in the second test TRIAL2 has a value of 0.8, it has a margin of approximately 25% compared to the reference peak-to-peak voltage signal. On the other hand, in the second test TRIAL2, steps S1000, S2000, S3000, and S4000 were performed assuming the second DUT was mounted at a first mounting position in the first housing to configure the electronic system. In this case, compared to the situation where the second DUT is exposed to the integrated circuit package, the second DUT can operate normally without causing soft faults against electromagnetic waves with an intensity increase of approximately 25%.

[0152] Trials 3 through 5 can be analyzed in the same manner as Trial 1 or Trial 2. In Trial 3, there is no difference compared to the case where the DUT is exposed to the integrated circuit package. In Trials 4 and 5, soft faults are more likely to occur on the DUT compared to the case where the DUT is exposed to the integrated circuit package.

[0153] Figure 22A It is used to describe Figure 2 A diagram illustrating the components that make up the database of the DUT. Figure 22B It is shown Figure 2 An illustration of an example database of the DUT.

[0154] exist Figure 22A The diagram shows a circuit board 205 and a housing 255, and shows a test position TP inside the circuit board 205 and reference positions REFP1 and REFP2 for defining the test position TP.

[0155] Reference Figure 22A The circuit board 205 and the housing 255 may correspond to the components configured in the electronic system, and the test position TP may be represented by the height PH and width PW based on the first reference position REFP1, or by the height CH and width CW based on the second reference position REFP2.

[0156] exist Figure 22B In the first electronic system SYSTEM1, which includes circuit board 205 and housing 255, a database generated when the first integrated circuit package IC1 is mounted at test position TP, which is separated from the first reference position REFP1 by a first height PH1 and a first width PW1.

[0157] Reference Figure 22BThe weak frequency band BW1 and the second peak-to-peak voltage Vpp1 can be recorded with respect to the first integrated circuit package IC1. In this case, the output voltage VREF1 of the electrostatic generator 301, which corresponds to the second peak-to-peak voltage Vpp1 and is used to detect the spectrum in step S3000, or the test voltage VTEST1 provided to the electrostatic generator 301, can be recorded together in the database.

[0158] Figure 23A It is used to describe Figure 2 A diagram illustrating the components that make up the database of the DUT. Figure 23B It is shown Figure 2 An illustration of an example database of the DUT.

[0159] exist Figure 23A The diagram shows circuit board 205a and housing 255a, and also shows multiple test locations TP11, TP12, TP13, TP14, TP21, TP22, TP23, TP24, TP31, TP32, TP33, TP34, TP41, TP42, TP43, and TP44 inside circuit board 205a. For ease of description, [details omitted]. Figure 23A Reference position in.

[0160] Reference Figure 23A The circuit board 205a and the housing 255a may correspond to the components configured in the electronic system, and each of the plurality of test positions may be represented by a height PH and a width PW based on a first reference position REFP1, or by a height CH and a width CW based on a second reference position REFP2.

[0161] exist Figure 23B In the first electronic system SYSTEM1, which includes a circuit board 205a and a housing 255a, a database is shown that is generated when the first integrated circuit package IC1 is installed at a first test position TP1 (e.g., TP11) which is separated from the first reference position REFP1 by a first height PH1 and a first width PW1, a second test position TP2 (e.g., TP24) which is separated from the first reference position REFP1 by a second height PH2 and a second width PW2, and a third test position TP3 (e.g., TP42) which is separated from the first reference position REFP1 by a third height PH3 and a third width PW3.

[0162] Reference Figure 23BThe weak frequency band BW1 and the second peak-to-peak voltages Vpp1, Vpp2, and Vpp3 can be recorded with respect to the first integrated circuit package IC1. In this case, the output voltage VREF1 of the electrostatic generator 301, which corresponds to the second peak-to-peak voltages Vpp1, Vpp2, and Vpp3 and is used to detect the spectrum in step S3000, or the test voltage VTEST1 provided to the electrostatic generator 301, can be recorded together in the database.

[0163] Figure 24A It is used to describe Figure 2 A diagram illustrating the components that make up the database of the DUT. Figure 24B It is shown Figure 2 An illustration of an example database of the DUT.

[0164] exist Figure 24A The diagram shows a first integrated circuit package IC1 and a second integrated circuit package IC2, as well as a first housing HOUSING 1 and a second housing HOUSING 2. In some embodiments, one of the first integrated circuit package IC1 and the second integrated circuit package IC2 is mounted on one of the first housing HOUSING 1 and the second housing HOUSING 2 to configure one of a plurality of electronic systems SYSTEM1, SYSTEM2, SYSTEM3, and SYSTEM4. For ease of description, [details omitted]. Figure 22A and Figure 22B Circuit board 205 in the middle.

[0165] Reference Figure 24B When the first integrated circuit package IC1 is configured with the first electronic system SYSTEM1, it can record the weak frequency band BW1 and the second peak-to-peak voltages Vpp1, Vpp2, and Vpp3. When the first integrated circuit package IC1 is configured with the second electronic system SYSTEM2, it can record the weak frequency band BW1 and the second peak-to-peak voltages Vpp4, Vpp5, and Vpp6.

[0166] Since the DUT is identical to the first integrated circuit package IC1 in both the first electronic system SYSTEM1 and the second electronic system SYSTEM2, the weak frequency band remains unchanged. However, when the electronic system changes from the first electronic system SYSTEM1 to the second electronic system SYSTEM2, the value of the second peak-to-peak voltage may change.

[0167] When the second integrated circuit package IC2 is configured with the third electronic system SYSTEM3, it can record the weak frequency band BW2 and the second peak-to-peak voltages Vpp7, Vpp8, and Vpp9. When the second integrated circuit package IC2 is configured with the fourth electronic system SYSTEM4, it can record the weak frequency band BW2 and the second peak-to-peak voltages Vpp10, Vpp11, and Vpp12.

[0168] Since the DUT is identical to the second integrated circuit package IC2 in both the third electronic system SYSTEM3 and the fourth electronic system SYSTEM4, the weak frequency band remains unchanged. However, when the electronic system changes from the third electronic system SYSTEM3 to the fourth electronic system SYSTEM4, the value of the second peak-to-peak voltage may change.

[0169] As described above, in the method and electrostatic discharge (ESD) testing disclosed herein, multiple tests are performed on the device under test (DUT) including the integrated circuit package after the packaging-level process is completed and before the integrated circuit package is shipped as a finished product. Furthermore, based on the results of performing these multiple tests, the ESD characteristics associated with the electronic system including the DUT can be predicted in advance.

[0170] Embodiments of this disclosure can be implemented in the form of products, methods, or systems including computer-readable program code stored in a computer-readable medium. The computer-readable program code can be provided by a processor of a variety of computers or other data processing means. The computer-readable medium can be a computer-readable signal medium or a computer-readable recording medium. A computer-readable recording medium can be any tangible medium capable of storing or containing a program in an instruction execution system, device, or apparatus, or any tangible medium connected to an instruction execution system, device, or apparatus.

[0171] The foregoing is a description of exemplary embodiments and should not be construed as limiting the exemplary embodiments. Although some exemplary embodiments have been described, those skilled in the art will readily understand that many modifications can be made to the exemplary embodiments without substantially departing from the novel teachings and advantages of the exemplary embodiments. Therefore, all such modifications are intended to be included within the scope of the exemplary embodiments defined in the claims. It should therefore be understood that the foregoing is a description of various exemplary embodiments and should not be construed as limiting oneself to the specific exemplary embodiments disclosed, and modifications to the disclosed exemplary embodiments and other exemplary embodiments are intended to be included within the scope of the appended claims.

Claims

1. A method for manufacturing an integrated circuit, the method relating to performing an electrostatic discharge test, the method comprising: Weak frequency bands are detected by sequentially radiating multiple first electromagnetic waves onto a first test board including the integrated circuit. The first peak-to-peak voltage signal is detected by sequentially radiating the plurality of first electromagnetic waves onto a second test board including an electromagnetic wave receiving module. The spectrum is detected by radiating a second electromagnetic wave onto a housing that includes a third test board having the electromagnetic wave receiving module. A second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signal, and the spectrum; and The electrostatic discharge characteristics associated with the electronic system including the integrated circuit are predicted based on the second peak-to-peak voltage signal.

2. The method of claim 1, wherein, The weak frequency bands to be detected include: Adjust the filter bandwidth of the filter circuit; Perform a first detection preparation operation, in which the output voltage of the electrostatic generator is increased from a first voltage to a second voltage, and the plurality of first electromagnetic waves are radiated onto the first test plate; and Perform a second detection preparation operation to determine whether a soft fault has occurred on the integrated circuit.

3. The method of claim 2, wherein, The filtering frequency band includes a first frequency band, a second frequency band, and up to the Xth frequency band, where X is a natural number greater than or equal to 3. The weak frequency band to be detected further includes: Set the filter frequency band to the first frequency band; The first detection preparation operation and the second detection preparation operation are executed sequentially based on the first frequency band; Set the filter frequency band to the second frequency band; The first detection preparation operation and the second detection preparation operation are executed sequentially based on the second frequency band; Set the filter frequency band to the Xth frequency band; and The first detection preparation operation and the second detection preparation operation are executed sequentially based on the Xth frequency band.

4. The method according to claim 3, wherein: When the second detection preparation operation is performed based on the first frequency band and the Xth frequency band, no soft fault occurs on the integrated circuit, and The soft fault occurs on the integrated circuit when the second detection preparation operation is performed based on the second frequency band.

5. The method of claim 3, wherein, The center frequency of the second frequency band is higher than the center frequency of the first frequency band, and the center frequency of the Xth frequency band is higher than the center frequency of the second frequency band. The weak frequency band to be detected further includes: The weak frequency band is detected as the frequency band between the center frequency of the first frequency band and the center frequency of the Xth frequency band.

6. The method of claim 1, wherein, The detection of the first peak-to-peak voltage signal includes: Remove the integrated circuit from the first test board; and The second test board is prepared by installing the electromagnetic wave receiving module on the first test board at the position corresponding to the location where the integrated circuit was removed.

7. The method of claim 1, wherein, The electromagnetic wave receiving module includes: A conductive pattern is formed on the upper surface of the second test plate and is configured to receive the plurality of first electromagnetic waves; A transmission line configured to transmit the plurality of first electromagnetic waves; and A shielding member configured to shield the plurality of first electromagnetic waves.

8. The method of claim 2, wherein, The detection of the first peak-to-peak voltage signal includes: Adjust the filter bandwidth of the filter circuit; A third test preparation operation is performed, in which the output voltage of the electrostatic generating device is set higher than a reference output voltage, and the plurality of first electromagnetic waves are radiated onto the second test plate; and A fourth test preparation operation is performed, in which a first result signal generated by sequentially radiating the plurality of first electromagnetic waves onto the second test plate is received.

9. The method of claim 8, wherein, The filtering frequency band includes a first frequency band, a second frequency band, and up to the Xth frequency band, where X is a natural number greater than or equal to 3. The detection of the first peak-to-peak voltage signal further includes: Set the filter frequency band to the first frequency band; The third detection preparation operation and the fourth detection preparation operation are performed sequentially based on the first frequency band; Set the filter frequency band to the second frequency band; The third detection preparation operation and the fourth detection preparation operation are performed sequentially based on the second frequency band; Set the filter frequency band to the Xth frequency band; and The third detection preparation operation and the fourth detection preparation operation are performed sequentially based on the Xth frequency band.

10. The method of claim 8, wherein, The detection of the first peak-to-peak voltage signal further includes: The first peak-to-peak voltage signal is generated based on the first result signal.

11. The method of claim 8, wherein, The reference output voltage is determined based on the first output voltage of the electrostatic generating device, which is obtained when a soft fault is determined to have occurred on the integrated circuit based on the second detection preparation operation.

12. The method of claim 8, wherein, The detection spectrum includes: The electromagnetic wave receiving module is installed at the test position on the third test board; The third test plate is placed inside the housing; The fifth detection preparation operation is performed, in which the output voltage of the electrostatic generating device is set to be higher than the reference output voltage, and the second electromagnetic wave is radiated onto the housing. Perform a sixth detection preparation operation, in which a second result signal generated by radiating the second electromagnetic wave onto the housing is received; and The spectrum is detected based on the second result signal.

13. The method of claim 12, wherein, The test location is determined based on the design of the electronic system including the integrated circuit.

14. The method of claim 1, wherein, The generation of the second peak-to-peak voltage signal includes: A compensation factor is generated based on the weak frequency band and the first peak-to-peak voltage signal. A compensated amplitude value is generated by compensating the amplitude value of the spectrum based on the compensation factor; and The compensated amplitude value is converted into the second peak-to-peak voltage signal.

15. The method of claim 14, wherein, The aforementioned compensation factors include: Remove the first voltage signal from the first peak-to-peak voltage signal that corresponds to the frequency band outside the weak frequency band; and The compensation factor is generated by performing a compensation operation on the second voltage signal corresponding to the weak frequency band in the first peak-to-peak voltage signal, excluding the first voltage signal.

16. The method of claim 1, wherein, The predicted electrostatic discharge characteristics include: Receive a reference peak-to-peak voltage signal corresponding to the integrated circuit; and Electrostatic discharge characteristics associated with the electronic system including the integrated circuit are predicted by comparing the reference peak-to-peak voltage signal with the second peak-to-peak voltage signal.

17. The method of claim 1, wherein, The plurality of first electromagnetic waves are generated by a noise signal generator and radiated onto the first test board or the second test board via a near-field probe. The noise signal generator includes: An electrostatic generating device, the electrostatic generating device being configured to generate source electromagnetic waves; A receiving antenna configured to receive the source electromagnetic wave; and A filtering circuit configured to filter the frequency band of the source electromagnetic wave to generate the plurality of first electromagnetic waves and the second electromagnetic wave.

18. An electrostatic discharge testing system, the electrostatic discharge testing system comprising: A first tester is configured to sequentially radiate a plurality of first electromagnetic waves onto a first test board including a device under test, and is also configured to sequentially radiate the plurality of first electromagnetic waves onto a second test board including an electromagnetic wave receiving module. A second tester is configured to radiate a second electromagnetic wave onto a housing including a third test plate having the electromagnetic wave receiving module. as well as An automated testing device, wherein the automated testing device is configured to: Weak frequency bands associated with the device under test are detected by sequentially radiating the plurality of first electromagnetic waves onto the first test board. The first peak-to-peak voltage signal associated with the device under test is detected by sequentially radiating the plurality of first electromagnetic waves onto the second test board. The spectrum is detected based on the second electromagnetic wave being radiated onto the housing. The second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signal, and the spectrum. The electrostatic discharge characteristics associated with the electronic system including the device under test are predicted based on the second peak-to-peak voltage signal.

19. The electrostatic discharge test system of claim 18, wherein, The plurality of first electromagnetic waves are generated by a noise signal generator and radiated onto the first test board or the second test board through a near-field probe, and The noise signal generator includes: An electrostatic generating device, the electrostatic generating device being configured to generate source electromagnetic waves; A receiving antenna configured to receive the source electromagnetic wave; and A filtering circuit configured to filter the frequency band of the source electromagnetic wave to generate the plurality of first electromagnetic waves and the second electromagnetic wave.

20. A method for performing an electrostatic discharge test, the method comprising: Weak frequency bands are detected by sequentially radiating multiple first electromagnetic waves onto a first test board including the device under test. The first peak-to-peak voltage signal is detected by sequentially radiating the plurality of first electromagnetic waves onto a second test board including an electromagnetic wave receiving module. The spectrum is detected by radiating a second electromagnetic wave onto a housing that includes a third test board having the electromagnetic wave receiving module. The second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signal, and the spectrum. The electrostatic discharge characteristics associated with the electronic system including the device under test are predicted based on the second peak-to-peak voltage signal. as well as generating a database about the device under test, wherein the device under test is mounted at a first location on the first test board, the electromagnetic wave receiving module is mounted at a second location on the second test board, the electromagnetic wave receiving module is mounted at a test location on the third test board, and wherein the test location is determined based on a design of the electronic system comprising the device under test.

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