Pressure sensing component, pressure sensing method and device

Abstract

A pressure sensing component, a pressure sensing method and a device, wherein in the pressure sensing component, a rigid structure (10) includes rigid blocks (11) arranged at intervals, and a strain amplification area (12) is formed between two adjacent rigid blocks (11). A detection unit (1) and a matching unit (2) are connected to a signal processing circuit, and the detection unit (1) includes a first bridge circuit formed by connecting at least four force sensors (R1, R2, R3, R4), and two of the force sensors (R1, R2) of the first bridge circuit are respectively arranged on two opposite mounting surfaces of the strain amplification area (12). When in use, the rigid structure (10) is attached to a measured object, and the measured object is deformed by force, and the detection unit (1) and the matching unit (2) cooperate to generate different output signals, which are passed through the signal processing circuit to identify the direction and magnitude of the applied force. The pressure sensing component is an integrated structure, easy to install, simple circuit, and low cost. The pressure sensing component, the pressure sensing method and the device having the pressure sensing component can sensitively detect the tiny deformation of the measured object in multi-dimensional directions, so as to accurately identify the multi-directional pressure exerted on the measured object.

Description

Technical Field

[0001] The present application relates to the field of pressure sensing technology, and in particular to a pressure sensing component, a pressure sensing method using the pressure sensing component, and a device having the pressure sensing component. Background Art

[0002] Pressure sensing technology has been widely used in various fields. In addition to the traditional detection of air pressure, water pressure, gravity and other indicators, the installation of pressure sensing components in various electronic devices has enriched the level of human-computer interaction and user experience. This also has more stringent requirements on the size, sensitivity, noise level, accurate identification of pressure position and reliability of pressure sensing components.

[0003] At present, common pressure sensing technologies include resistance strain gauge technology, pressure capacitor technology, pressure inductance technology, piezoelectric ceramic technology, MEMS (micro-electromechanical system) pressure sensor technology and other different types of technologies. For example, pressure capacitor technology and pressure inductance technology detect the capacitance or inductance between the surfaces, which requires very high assembly accuracy and structural space, and has a low drop resistance coefficient; piezoelectric ceramic technology impacts piezoelectric ceramics and detects the voltage change of the piezoelectric ceramics themselves, which has certain requirements for installation and is not suitable for some places that need to detect weak strains; resistance strain gauge technology requires the selection of sensors with equivalent resistance values, and then assembles them to a specific structure. This technology requires a large space and has low sensitivity. MEMS (micro-electromechanical system) pressure sensor technology detects a certain degree of pressure by squeezing the MEMS to change the resistance of the internal sensor. Because MEMS itself is relatively fragile, it has serious deficiencies in drop resistance coefficient and consistency. The common disadvantages of these technologies are that they have high requirements for assembly structure and can only accurately detect deformation in one-dimensional direction. When the pressure sensing component is subjected to force from another dimension, the pressure will be distributed to the dimension where the force needs to be detected, causing misidentification and seriously affecting the reliability of the pressure device. Summary of the invention

[0004] One of the purposes of the embodiments of the present application is to provide a pressure sensing component, a pressure sensing method and a device, aiming to solve the problem that the existing pressure sensing components have high assembly requirements and can only detect deformation in one-dimensional direction.

[0005] The technical solution adopted in the embodiment of the present application is:

[0006] In a first aspect, a pressure sensing component is provided, comprising:

[0007] A rigid structure, used to fit with the object to be measured and deform along with the object to be measured, the rigid structure comprising rigid blocks spaced apart along the X-axis, a strain amplification area formed between two adjacent rigid blocks, and four mounting surfaces formed around the rigid structure;

[0008] A detection unit, comprising a first bridge circuit formed by connecting at least four force sensors, wherein two groups of opposite bridge arms in the first bridge circuit are respectively arranged on two opposite mounting surfaces, and wherein two of the force sensors are respectively arranged on two opposite mounting surfaces of the strain amplification region; and

[0009] The matching unit is used to cooperate with the detection unit to generate different output signals when the rigid structure is deformed by force. The detection unit and the matching unit are electrically connected to a signal processing circuit to identify the direction and magnitude of the force.

[0010] In a second aspect, a pressure sensing method is provided, which uses the above-mentioned pressure sensing component and includes the following steps:

[0011] Fitting the rigid structure onto the object to be measured;

[0012] When the matching unit is the second bridge circuit, the first bridge circuit and the second bridge circuit are electrically connected to a signal processing circuit, and the direction and magnitude of the force are identified by detecting signal changes of the first bridge circuit and the second bridge circuit;

[0013] When the matching unit includes the second bridge circuit and the second single bridge, the first bridge circuit, the second bridge circuit, the first single bridge and the second single bridge are electrically connected to a signal processing circuit, and the direction and magnitude of the force are identified by detecting signal changes of the first bridge circuit, the second bridge circuit, the first single bridge and the second single bridge;

[0014] When the matching unit is at the fixed voltage, the first bridge circuit and the first single bridge are electrically connected to a signal processing circuit, and the direction and magnitude of the force are identified by detecting signal changes of the first bridge circuit and the first single bridge.

[0015] In a third aspect, a device is provided, comprising the above-mentioned pressure sensing component. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or exemplary technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the assembly of a pressure sensing component provided in one embodiment of the present application;

[0018] Figure 2 for Figure 1 A top view of a pressure sensing component;

[0019] Figure 3 for Figure 2 A three-dimensional structural diagram of a pressure sensing component;

[0020] Figure 4 A bridge circuit diagram of a pressure sensing component provided in one embodiment of the present application;

[0021] Figure 5 A three-dimensional structural diagram of a pressure sensing component provided in another embodiment of the present application;

[0022] Figure 6 A three-dimensional structural diagram of a pressure sensing component provided in another embodiment of the present application;

[0023] Figure 7 A three-dimensional structural diagram of a pressure sensing component provided in another embodiment of the present application;

[0024] Figure 8 A three-dimensional structural diagram of a pressure sensing component provided in another embodiment of the present application;

[0025] Fig. 9 A three-dimensional structural diagram of a pressure sensing component provided in another embodiment of the present application;

[0026] Fig.10 A bridge circuit diagram provided for another embodiment of the present application;

[0027] Fig.11 A three-dimensional structural diagram of a pressure sensing component provided in one embodiment of the present application;

[0028] Fig.12 A bridge circuit diagram provided for an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] In the description of the embodiments of the present application, it needs to be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0033] In order to illustrate the technical solution of the present application, a detailed description is given below in conjunction with specific drawings and embodiments.

[0034] Some embodiments of the present application provide a pressure sensing component, see Figures 1 to 4 The pressure sensing component includes a rigid structure 10, a detection unit 1, and a matching unit 2. The rigid structure 10 is used to fit with the object to be measured (not shown) and deform with the object to be measured. The rigid structure 10 includes rigid blocks 11 arranged at intervals along the X-axis, and a strain amplification area 12 is formed between two adjacent rigid blocks 11. The rigid structure 10 forms four mounting surfaces around the X-axis. The detection unit 1 includes a first bridge circuit formed by connecting at least four force sensors R1, R2, R3, and R4. Two groups of relative bridge arms R1, R4 (R2, R3) in the first bridge circuit are respectively arranged on two relative mounting surfaces 10a, 10b, and two force sensors R1, R2 are respectively arranged on two relative mounting surfaces 10a, 10b of the strain amplification area 12. The matching unit 2 is used to cooperate with the detection unit 1 to generate different output signals when the rigid structure 10 is deformed by force. The detection unit 1 and the matching unit 2 are electrically connected to the signal processing circuit to identify the direction and magnitude of the force.

[0035] When in use, the rigid structure 10 is attached to the object to be measured. The object to be measured is deformed by force, and the rigid structure 10 follows the deformation. The strain of the rigid structure 10 is concentrated in the strain amplification area 12. The force sensor at the strain amplification area 12 obtains a pressure signal. The detection unit 1 cooperates with the matching unit 2 to generate different output signals, which are processed by the signal processing circuit to identify the direction and magnitude of the force. The pressure sensing component is an integrated structure, which is easy to install, has a simple circuit and low cost. The pressure sensing component, the pressure sensing method and the device with the pressure sensing component can very sensitively detect the tiny deformation of the object to be measured in multi-dimensional directions, so as to accurately identify the multi-directional pressure on the object to be measured, and improve the reliability and stability of the pressure sensing component.

[0036] It should be noted that the signal processing circuit is electrically connected to the bridge circuit and the single bridge, analyzes and processes the electrical signal of the force sensor, and converts the force analog signal into a force digital signal, which belongs to the prior art.

[0037] In one embodiment, the rigid structure 10 has a certain rigidity, and the strain amplification area 12 is a hollow area. When the object to be measured is subjected to a force, the rigid structure 10 deforms along with the object to be measured, the deformation of the strain amplification area 12 is amplified, and the force sensor disposed in the strain amplification area 12 is deformed and amplified, so that the first bridge circuit detects the deformation of the rigid structure 10. Specifically, the rigid structure 10 can be a steel sheet, an aluminum sheet, a glass sheet, an FR4 sheet, or other composite rigid materials, which can be selected as needed.

[0038] In one embodiment, a flexible substrate 21 is provided on the mounting surface where the force sensor R1 (R2, R3, R4) is provided, and the force sensor R1 (R2, R3, R4) is respectively installed on the corresponding flexible substrate 21. The flexible substrate 21 with the force sensor is pressed onto a discrete rigid block 11 of a certain size through a colloid 30. Some force sensors are arranged opposite or adjacent to the strain amplification area 12, and some force sensors are arranged opposite to the rigid block 11 to form a pressure sensing component. The structure is easy to form. Specifically, the flexible substrate 21 can be FPC (flexible circuit board), PET (high temperature resistant polyester film), PI film (polyimide film) or other flexible substrates 21 with good flatness, which can be selected as needed.

[0039] In one embodiment, all the flexible substrates 21 are formed by bending a mother substrate 20. The force sensor R1 (R2, R3, R4) is attached to a mother substrate 20, and then the center of the mother substrate 20 is folded and its inner surface is bonded to each mounting surface, which is simple to process and low in cost.

[0040] In one embodiment, the flexible substrate 21 is bonded to the mounting surface by a colloid 30. This structure facilitates the connection between the rigid structure 10 and the flexible substrate 21, and allows the flexible substrate 21 and the rigid structure 10 to deform along with the object being measured when the object being measured is deformed by a force. The colloid 30 can be made of epoxy film, 502 glue, thermosetting glue, silicone, etc., and can be selected as needed.

[0041] In one embodiment, the force sensor R1 (R2, R3, R4) is a strain sensing resistor, and the strain sensing resistor is made of at least one of polycrystalline semiconductor materials, amorphous semiconductor materials, polycrystalline silicon, graphene, copper-nickel alloy, carbon nanotubes, metal fine wires, and conductor-insulator composite materials. The above solutions can all achieve pressure sensing and can be selected as needed.

[0042] There are three matching modes between the detection unit 1 and the matching unit 2. These three matching modes can all match with the detection unit 1 to generate different output signals when the rigid structure 10 is deformed by force, and pass through the signal processing circuit to identify the direction and magnitude of the force, and one matching mode can be selected.

[0043] The first cooperation method: see Figures 3 to 9 , the matching unit 2 is a second bridge circuit formed by connecting at least four force sensors R5, R6, R7, and R8, and two groups of relative bridge arms R5, R8 (R6, R7) in the second bridge circuit are respectively arranged on two opposite mounting surfaces; when the rigid structure 10 is deformed by force, the first bridge circuit and the second bridge circuit can generate different output signals;

[0044] The second cooperation method: Figure 3 , Figures 5 to 10 , the detection unit 1 also includes a first single bridge Vp3 formed by connecting the two detection terminals Vp1 and Vn1 of the first bridge circuit, that is, R1 and R3 are connected in parallel, R2 and R4 are connected in parallel, and then connected in series to form the first single bridge Vp3, and the potential of the first single bridge Vp3 is used as an output signal; the matching unit 2 includes a second bridge circuit formed by connecting at least four force sensors, and a second single bridge Vn3 formed by connecting the two detection terminals Vp2 and Vn2 of the second bridge circuit, that is, R5 and R7 are connected in parallel, R6 and R8 are connected in parallel, and then connected in series to form a second single bridge Vn3, and the potential of the second single bridge Vn3 is used as an output signal; the first single bridge Vp3 and the second single bridge Vn3 form a differential pair, and the two groups of relative bridge arms R5 and R8 (R6, R7) in the second bridge circuit are respectively arranged on two relative mounting surfaces; when the rigid structure 10 is deformed by force, the first bridge circuit, the second bridge circuit, the first single bridge Vp3 and the second single bridge Vn3 can generate different output signals;

[0045] The third way to cooperate: Fig.11 , Fig.12The detection unit 1 also includes a first single bridge Vp3 formed by connecting the two detection terminals Vp1 and Vn1 of the first bridge circuit, that is, R1 and R3 are connected in parallel, R2 and R4 are connected in parallel, and then connected in series to form the first single bridge Vp3, and the potential of the first single bridge Vp3 is used as an output signal; the matching unit is a fixed voltage, and the first single bridge Vp3 and the fixed voltage form a differential pair; when the rigid structure 10 is deformed by force, the first bridge circuit and the first single bridge Vp3 can generate different output signals.

[0046] In one embodiment, using Fig.10 The second combination or Fig.12 In the third coordination mode, the two detection terminals Vp1 and Vn1 of the first bridge circuit are connected through an analog switch S1; the two detection terminals Vp2 and Vn2 of the second bridge circuit are connected through an analog switch S2. In this way, it is convenient to switch between a bridge circuit or a single bridge. Specifically, the single-pole single-throw analog switch can use TS3A4751, which is a bidirectional, 4-channel, normally open (NO) single-pole single-throw (SPST) analog switch. The analog switch can be used to connect the two detection terminals Vp1 and Vn1 of the first bridge circuit to form a first single bridge Vp3, and the two detection terminals Vp2 and Vn2 of the second bridge circuit can be connected to form a second single bridge Vn3, and the switching between the bridge circuit and the single bridge can be controlled.

[0047] In one embodiment, see Figures 1 to 3 , the length direction of force sensors R1 to R8 is parallel to the X-axis; this structure is easy to assemble force sensors, and the force sensors deform more when pressing the object to be measured, and output pressure signals better. The four mounting surfaces are divided into a first surface 10a and a second surface 10b spaced apart on the Z-axis, and a third surface 10c and a fourth surface 10d spaced apart on the Y-axis. The first surface 10a serves as the fitting surface with the object to be measured, and the X-axis, Y-axis and Z-axis are perpendicular to each other. This structure is easy to assemble force sensors, and detects forces in different directions through force sensors. Specifically, the first surface 10a and the second surface 10b of the rigid structure 10 are parallel to the XY plane, and the third surface 10c and the fourth surface 10d are parallel to the XZ plane.

[0048] In one embodiment, a force sensor is provided on the mounting surface of one or more strain amplification regions 12 to form a first bridge circuit to detect the pressure corresponding to the strain amplification region 12. The number of strain amplification regions 12 where the force sensor is provided is determined according to the size of the pressure sensing area.

[0049] When using the first method, refer to Figures 3 to 9, a first bridge circuit and a second bridge circuit will be configured. The force sensors of the first bridge circuit and the second bridge circuit have a variety of layout methods. The common point is that the two groups of relative bridge arms R1, R4 (R2, R3) in the first bridge circuit are respectively arranged on two relative mounting surfaces, and the two groups of relative bridge arms R5, R8 (R6, R7) in the second bridge circuit are respectively arranged on two relative mounting surfaces.

[0050] In the first matching mode, when the rigid structure 10 is deformed by force, the force sensor located in the strain amplification area 12 will be deformed and the corresponding bridge circuit will output a signal. The two bridge circuits output signals, and the direction and magnitude of the force can be identified through the signal processing circuit. A number of embodiments are provided below for illustration.

[0051] Example 1

[0052] See also Figure 3 , Figure 4 , configure the first bridge circuit and the second bridge circuit, for the same first bridge circuit, two groups of relative bridge arms R1, R4 (R2, R3) are respectively arranged on the first surface 10a and the second surface 10b of one strain amplification area 12; for the same second bridge circuit, two groups of relative bridge arms R5, R8 (R6, R7) are respectively arranged on the first surface 10a and the second surface 10b of another strain amplification area 12. From the Z axis (up and down) direction, R1, R4, R5 and R8 are in the same plane, and R2, R3, R6 and R7 are in the same plane. From the Y axis (front and back) direction, R1, R3, R8 and R6 are in the same plane, and R4, R2, R5 and R7 are in the same plane.

[0053] Assume VCC = Ui, then:

[0054] Vp1=R2Ui / (R1+R2); Vn1=R4Ui / (R3+R4);

[0055] Vp2=R6Ui / (R5+R6); Vn2=R8Ui / (R7+R8);

[0056] Let U1=Vp1-Vn1=(R2R3-R1R4)Ui / [(R1+R2)(R3+R4)];

[0057] U2=Vp2-Vn2=(R6R7-R5R8)Ui / [(R5+R6)(R7+R8)];

[0058] U3=Vp1-Vp2; U4=Vn1-Vn2; Ua=U3+U4;

[0059] It can be obtained that: Ua=(Vp1+Vn1)-(Vp2+Vn2);

[0060] When the object under test is subjected to a force from the first surface 10a to the second surface 10b: the pressure sensing component will bend from top to bottom following the object under test. Affected by the curvature, force sensors R2 and R3 will be stretched to lengthen the force sensors, and R1 and R4 will be squeezed to reduce the length of the force sensors. The following uses the force sensor with the characteristic of increasing resistance as the length increases as an example. R2 and R3 will increase and have a similar resistance change rate, while R1 and R4 will decrease and have a similar resistance change rate; similarly, R6 and R7 will increase and have a similar resistance change rate, while R5 and R8 will decrease and have a similar resistance change rate.

[0061] ∴When pressing from top to bottom, △Vp1>0, △Vn1<0, △Vp1≈-△Vn1; △Vp2>0, △Vn2<0, △Vp2≈-△Vn2.

[0062] ∴△Vp1-ΔVn1>0; △Vp2-△Vn2>0; △Vp1+△Vn1≈0, △Vp2+△Vn2≈0.

[0063] ∴△U1>0;△U2>0;△Ua≈0.

[0064] When the object under test is subjected to a force from the second surface 10b toward the first surface 10a, the pressure sensing component will bend from bottom to top following the object under test. Affected by the curvature, R2 and R3 will be squeezed to reduce the length of the sensor, and the force sensors R1 and R4 will be stretched to lengthen the length of the sensor. Taking the force sensor whose characteristic is that the resistance increases with the lengthening as an example, R2 and R3 will decrease and have a similar resistance change rate, while R1 and R4 will increase and have a similar resistance change rate. Similarly, R6 and R7 will decrease and have a similar resistance change rate, while R5 and R8 will increase and have a similar resistance change rate.

[0065] ∴When pressing from bottom to top, △Vp1<0, ΔVn1>0, ΔVp1≈-ΔVn1; ΔVp2<0, ΔVn2>0, ΔVp2≈-ΔVn2.

[0066] ∴ΔVp1-ΔVn1<0; ΔVp2-ΔVn2<0; ΔVp1+ΔVn1≈0, ΔVp2+ΔVn2≈0.

[0067] ∴△U1<0;△U2<0;△Ua≈0.

[0068] When the object under test exerts force from the third surface 10c toward the fourth surface 10d: the pressure sensing component will undergo a bending deformation from front to back, R4 and R2 will undergo approximately the same stretching to lengthen the length of the sensor, and R1 and R3 will undergo approximately the same squeezing to reduce the length of the sensor, that is, R4 and R2 will increase at the same time and the resistance change rate will be close, R1 and R3 will decrease at the same time and the resistance change rate will be close, similarly, R5 and R7 will increase at the same time and the resistance change rate will be close, and R6 and R8 will decrease at the same time and the resistance change rate will be close.

[0069] ∴When pressing from front to back, △Vp1>0, △Vn1>0, △Vp1≈△Vn1; △Vp2<0, △Vn2<0, △Vp2≈△Vn2.

[0070] ∴△Vp1-△Vn1≈0;△Vp2-△Vn2≈0;△Vp1+△Vn1>0,△Vp2+△Vn2<0. ∴△U1≈0;△U2≈0;△Ua>0.

[0071] When the object under test exerts force from the fourth surface 10d to the third surface 10c: the pressure sensing component will bend from the front to the back, R4 and R2 will be squeezed in the same way to reduce the length of the sensor, and R1 and R3 will be stretched in the same way to lengthen the length of the sensor, that is, R4 and R2 will decrease at the same time and the resistance change rate will be close, while R1 and R3 will increase at the same time and the resistance change rate will be close. Similarly, R8 and R6 will increase at the same time and the resistance change rate will be close, while R5 and R7 will decrease at the same time and the resistance change rate will be close.

[0072] ∴When pressing from back to front, △Vp1<0, △Vn1<0, △Vp1≈△Vn1; △Vp2>0, △Vn2>0, △Vp2≈△Vn2.

[0073] ∴△Vp1-ΔVn1≈0; △Vp2-△Vn2≈0; △Vp1+ΔVn1<0, △Vp2+△Vn2>0.

[0074] ∴ΔU1≈0; ΔU2≈0; ΔUa<0.

[0075] In summary, in the pressure sensing component and the pressure sensing method thereof of Embodiment 1, when the matching unit 2 is the second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the first surface 10a and the second surface 10b, and the output signal of the first bridge circuit is assumed to be U1, the output signal of the second bridge circuit is assumed to be U2, the potential difference between one detection end Vp1 of the first bridge circuit and one detection end Vp2 of the second bridge circuit is assumed to be U3, the potential difference between another detection end Vn1 of the first bridge circuit and another detection end Vn2 of the second bridge circuit is assumed to be U4, and the judgment parameter is assumed to be Ua, so that the judgment parameter satisfies the following relationship:

[0076] Ua=U3+U4, then:

[0077] When U1 and U2 increase, the object under test is subjected to a force in the direction from the first surface 10a to the second surface 10b;

[0078] When U1 and U2 decrease, the object under test is subjected to a force in the direction from the second surface 10b to the first surface 10a;

[0079] When Ua increases, the object under test is subjected to a force in the direction from the third surface 10c to the fourth surface 10d;

[0080] When Ua decreases, the object under measurement is subjected to a force in a direction from the fourth surface 10d to the third surface 10c.

[0081] Therefore, according to the pressure sensing component of Example 1, it only needs to collect signals from four channels (U1 to U4) and convert them into signal features of U1, U2 and Ua, so as to identify whether the object under test is under pressure in the Z-axis or Y-axis direction and obtain the pressure magnitude, thereby completing multi-dimensional detection with simple calculation. In addition to being able to detect multi-dimensional deformation, the pressure sensing component also has the advantages of low noise, small temperature and humidity drift, high sensitivity, and easy installation.

[0082] Example 2

[0083] See also Figure 2 , Figure 4 The pressure sensing components of Example 2 and Example 1 are identical in structure, and the difference lies in the different methods of obtaining the judgment parameters.

[0084] Referring to the above, let U1 = Vp1 - Vn1 = (R2R3 - R1R4)Ui / [(R1 + R2)(R3 + R4)];

[0085] U2=Vp2-Vn2=(R6R7-R5R8)Ui / [(R5+R6)(R7+R8)]; U3=Vp1-Vp2;

[0086] Ua=2U3+U2-U1;

[0087] It can be obtained that: Ua=(Vp1+Vn1)-(Vp2+Vn2);

[0088] The judgment parameter Ua in Example 2 is numerically equal to the judgment parameter Ua in Example 1. Using the pressure sensing component of Example 2, the change of signals U1 to U3 caused by the deformation of the object under test is the same as that of Example 1, which will not be repeated.

[0089] In the pressure sensing component and pressure sensing method of Example 2, when the matching unit 2 is a second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the first surface 10a and the second surface 10b, and the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, the potential difference between a detection end Vp1 of the first bridge circuit and a detection end Vp2 of the second bridge circuit is U3, and the judgment parameter is Ua, so that the judgment parameter satisfies the following relationship:

[0090] Ua=2U3+U2-U1, then:

[0091] When U1 and U2 increase, the object under test is subjected to a force in the direction from the first surface 10a to the second surface 10b;

[0092] When U1 and U2 decrease, the object under test is subjected to a force in the direction from the second surface 10b to the first surface 10a;

[0093] When Ua increases, the object under test is subjected to a force in the direction from the third surface 10c to the fourth surface 10d;

[0094] When Ua decreases, the object under measurement is subjected to a force in a direction from the fourth surface 10d to the third surface 10c.

[0095] Therefore, according to the pressure sensing component of Example 2, it only needs to collect signals from three channels (U1 to U3) and convert them into signal characteristics of U1, U2 and Ua, so as to identify whether the object being measured is subjected to pressure in the Z-axis or Y-axis direction and obtain the pressure magnitude, thereby completing multi-dimensional detection with simple calculations.

[0096] Example 3

[0097] See also Figure 4 , Figure 5 The difference between the pressure sensing component of Example 3 and Example 1 is that the force sensors R5, R8 (R6, R7) of the second bridge circuit are arranged on the first surface 10a and the second surface 10b of the same rigid block 11, and the rigid block 11 is adjacent to the strain amplification area 12 where the force sensors R1, R4 (R2, R3) of the first bridge circuit are arranged. Any rigid block 11 on both sides can be used, and the force sensors R1, R4 (R2, R3) of the first bridge circuit and the force sensors R8, R5 (R7, R6) of the second bridge circuit are located on different straight lines in a one-to-one correspondence.

[0098] The pressure sensing method used in Example 3 can refer to the pressure sensing method of Example 1 or 2, and will not be described in detail. The pressure sensing component of Example 3 places the force sensors R5, R8 (R6, R7) of the second bridge circuit on the rigid block 11, optimizes the size of the pressure sensing component, and makes the structure occupy a smaller space.

[0099] Example 4

[0100] See also Figure 4 , Figure 6 The difference between the pressure sensing component of Example 4 and Example 3 is that the force sensors R5, R6 (R7, R8) of the second bridge circuit are arranged on the first surface 10a and the second surface 10b of the two rigid blocks 11, the strain amplification area 12 of the force sensors R1, R4 (R2, R3) of the first bridge circuit is located between the two rigid blocks 11, and the force sensors R1, R4 (R2, R3) of the first bridge circuit and the force sensors R5, R8 (R6, R7) of the second bridge circuit are located on different straight lines in a one-to-one correspondence.

[0101] Referring to the above, let U1 = Vp1-Vp2; U2 = Vn1-Vn2;

[0102] Uz=U1–U3=(Vp1-Vn1)-(Vp2-Vn2);

[0103] Uy=U1+U3=(Vp1+Vn1)-(Vp2+Vn2);

[0104] When the object under test is subjected to a force from the first surface 10a toward the second surface 10b: R2 and R3 will increase and have similar resistance change rates, R1 and R4 will decrease and have similar resistance change rates; R5, R6, R7 and R8 remain almost unchanged.

[0105] ∴△Vp1>0,△Vn1<0,△Vp1≈-△Vn1;△Vp2≈△Vn2≈0

[0106] ∴△Vp1-△Vn1>0;△Vp1+△Vn1≈0;△Vp2-△Vn2≈0

[0107] ∴△Uz>0;△Uy≈0.

[0108] When the object under test is subjected to a force from the second surface 10b toward the first surface 10a: R2 and R3 will decrease and have similar resistance change rates, R1 and R4 will increase and have similar resistance change rates; R5, R6, R7 and R8 remain almost unchanged.

[0109] ∴△Vp1<0,△Vn1>0,△Vp1≈-△Vn1;△Vp2≈△Vn2≈0

[0110] ∴△Vp1-△Vn1<0;△Vp1+△Vn1≈0;△Vp2-△Vn2≈0

[0111] ∴△Uz<0;△Uy≈0.

[0112] When the object under test is subjected to a force from the third surface 10c toward the fourth surface 10d: R1 and R3 decrease simultaneously and the resistance change rates are close, R2 and R4 increase simultaneously and the resistance change rates are close; R5, R6, R7 and R8 remain almost unchanged.

[0113] ∴△Vp1>0,△Vn1>0,△Vp1≈△Vn1;△Vp2≈△Vn2≈0

[0114] ∴△Vp1-△Vn1≈0;△Vp1+△Vn1>0;△Vp2-△Vn2≈0

[0115] ∴△Uz≈0;△Uy>0.

[0116] When the object under test is subjected to a force from the fourth surface 10d toward the third surface 10c: R1 and R3 increase simultaneously and the resistance change rates are close, R2 and R4 decrease simultaneously and the resistance change rates are close; R5, R6, R7 and R8 remain almost unchanged.

[0117] ∴△Vp1<0,△Vn1<0,△Vp1≈△Vn1;△Vp2≈△Vn2≈0

[0118] ∴△Vp1-△Vn1≈0;△Vp1+△Vn1<0;△Vp2-△Vn2≈0

[0119] ∴△Uz≈0;△Uy<0.

[0120] In the pressure sensing component and pressure sensing method of Example 4, when the matching unit 2 is a second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the first surface 10a and the second surface 10b, and the output signal of the first bridge circuit is U1, and the output signal of the second bridge circuit is U2. The two judgment parameters are respectively Uz and Uy, so that the two judgment parameters satisfy the following relationship:

[0121] Uz=U1-U3;Uy=U1+U3,then:

[0122] When Uz increases, the object under test is subjected to a force from the first surface 10a toward the second surface 10b;

[0123] When Uz decreases, the object under test is subjected to a force from the second surface 10b toward the first surface 10a;

[0124] When Uy increases, the object under test is subjected to a force from the third surface 10c toward the fourth surface 10d;

[0125] When Uy decreases, the object under test is subjected to a force from the fourth surface 10d toward the third surface 10c;

[0126] Therefore, the pressure sensing component according to Example 4 only needs to collect signals from two channels (U1 and U3) and convert them into signal characteristics of Uz and Uy, so as to identify whether the object being measured is subjected to pressure in the Z-axis or Y-axis direction and obtain the pressure magnitude, thereby completing multi-dimensional detection with simple calculation.

[0127] Example 5

[0128] See also Figure 4 , Figure 7 The difference between the pressure sensing component of Example 5 and Example 1 is that for the same first bridge circuit, the two sets of relative bridge arms R1, R4 (R2, R3) are respectively arranged on the third surface 10c and the fourth surface 10d of one strain amplification region 12; for the same second bridge circuit, the two sets of relative bridge arms R5, R8 (R6, R7) are respectively arranged on the third surface 10c and the fourth surface 10d of another strain amplification region 12.

[0129] Assume VCC = Ui, then:

[0130] Vp1=R2Ui / (R1+R2); Vn1=R4Ui / (R3+R4);

[0131] Vp2=R6Ui / (R5+R6); Vn2=R8Ui / (R7+R8);

[0132] Let U1=Vp1-Vn1=(R2R3-R1R4)Ui / [(R1+R2)(R3+R4)];

[0133] U2=Vp2-Vn2=(R6R7-R5R8)Ui / [(R5+R6)(R7+R8)];

[0134] U3=Vp1-Vp2; U4=Vn1-Vn2; Ua=U3+U4;

[0135] It can be obtained that: Ua=(Vp1+Vn1)-(Vp2+Vn2);

[0136] Referring to the above, when the force of the measured object is directed from the third surface 10c to the fourth surface 10d: R2 and R3 will increase and the resistance change rate will be similar, R1 and R4 will decrease and the resistance change rate will be similar; R6 and R7 will increase and the resistance change rate will be similar, R5 and R8 will decrease and the resistance change rate will be similar.

[0137] ∴When pressing from front to back, ΔVp1>0, ΔVn1<0, ΔVp1≈-ΔVn1; ΔVp2>0, ΔVn2<0, ΔVp2≈-ΔVn2.

[0138] ∴ΔVp1-ΔVn1>0; ΔVp2-ΔVn2>0; ΔVp1+ΔVn1≈0, ΔVp2+ΔVn2≈0.

[0139] ∴ΔU1>0; ΔU2>0; ΔUa≈0.

[0140] When the object under test exerts a force from the fourth surface 10d toward the third surface 10c: R2 and R3 will decrease and their resistance change rates will be similar, R1 and R4 will increase and their resistance change rates will be similar; R6 and R7 will decrease and their resistance change rates will be similar, and R5 and R8 will increase and their resistance change rates will be similar.

[0141] ∴When pressing from back to front, ΔVp1<0, ΔVn1>0, ΔVp1≈-ΔVn1; ΔVp2<0, ΔVn2>0, ΔVp2≈-ΔVn2.

[0142] ∴ΔVp1-ΔVn1<0; ΔVp2-ΔVn2<0; ΔVp1+ΔVn1≈0, ΔVp2+ΔVn2≈0.

[0143] ∴ΔU1<0; ΔU2<0; ΔUa≈0.

[0144] When the object under test is subjected to a force from the first surface 10a to the second surface 10b: R4 and R2 decrease at the same time and the resistance change rate is close, R1 and R3 increase at the same time and the resistance change rate is close; R5 and R7 decrease at the same time and the resistance change rate is close, R6 and R8 will increase at the same time and the resistance change rate is close.

[0145] ∴When pressing from top to bottom, ΔVp1<0, ΔVn1<0, ΔVp1≈ΔVn1; ΔVp2>0, ΔVn2>0, ΔVp2≈ΔVn2.

[0146] ∴ΔVp1-ΔVn1≈0; ΔVp2-ΔVn2≈0; ΔVp1+ΔVn1<0, ΔVp2+ΔVn2>0.

[0147] ΔU1≈0; ΔU2≈0; ΔUa<0.

[0148] When the object under test is subjected to a force from the second surface 10b toward the first surface 10a: R4 and R2 increase at the same time and the resistance change rate is close, R1 and R3 decrease at the same time and the resistance change rate is close; R5 and R7 increase at the same time and the resistance change rate is close, R6 and R8 will decrease at the same time and the resistance change rate is close.

[0149] ∴When pressing from bottom to top, ΔVp1>0, ΔVn1>0, ΔVp1≈ΔVn1; ΔVp2<0, ΔVn2<0, ΔVp2≈ΔVn2.

[0150] ∴ΔVp1-ΔVn1≈0; ΔVp2-ΔVn2≈0; ΔVp1+ΔVn1>0, ΔVp2+ΔVn2<0.

[0151] ∴△U1≈0;△U2≈0;△Ua>0.

[0152] In summary, in the pressure sensing component and the pressure sensing method thereof of Example 5, when the matching unit 2 is the second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the third surface 10c and the fourth surface 10d, and the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, the potential difference between one detection end Vp1 of the first bridge circuit and one detection end Vp2 of the second bridge circuit is U3, the potential difference between another detection end Vn1 of the first bridge circuit and another detection end Vn2 of the second bridge circuit is U4, and the judgment parameter is Ua, so that the judgment parameter satisfies the following relationship:

[0153] Ua=U3+U4, then:

[0154] When U1 and U2 increase, the object under test is subjected to a force in the direction from the third surface 10c to the fourth surface 10d;

[0155] When U1 and U2 decrease, the object under test is subjected to a force in the direction from the fourth surface 10d to the third surface 10c;

[0156] When Ua decreases, the object under test is subjected to a force in the direction from the first surface 10a to the second surface 10b;

[0157] When Ua increases, the object under test is subjected to a force in the direction from the second surface 10b to the first surface 10a;

[0158] Therefore, according to the pressure sensing component of Example 5, it only needs to collect signals from four channels (U1 to U4) and convert them into signal characteristics of U1, U2 and Ua, so as to identify whether the object being measured is subjected to pressure in the Z-axis or Y-axis direction and obtain the pressure magnitude, thereby completing multi-dimensional detection with simple calculations.

[0159] Example 6

[0160] See also Figure 4 , Figure 7 The pressure sensing components of Example 6 and Example 5 are identical in structure, and the difference lies in the different methods of obtaining the judgment parameters.

[0161] Referring to the above, U1 = Vp1 - Vn1 = (R2R3 - R1R4)Ui / [(R1+R2)(R3+R4)];

[0162] U2=Vp2-Vn2=(R6R7-R5R8)Ui / [(R5+R6)(R7+R8)]; U3=Vp1-Vp2;

[0163] Ua=2U3+U2-U1;

[0164] It can be obtained that: Ua=(Vp1+Vn1)-(Vp2+Vn2);

[0165] The judgment parameter Ua in Example 6 is numerically equal to the judgment parameter Ua in Example 5. Using the pressure sensing component of Example 6, the changes in signals U1 to U3 caused by the deformation of the object under test are the same as those in Example 5, and will not be repeated.

[0166] In the pressure sensing component and the pressure sensing method of Example 6, when the matching unit 2 is the second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the third surface 10c and the fourth surface 10d, the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, the potential difference between a detection end Vp1 of the first bridge circuit and a detection end Vp2 of the second bridge circuit is U3, and the judgment parameter is Ua, so that the judgment parameter satisfies the following relationship:

[0167] Ua=2U3+U2-U1, then:

[0168] When U1 and U2 increase, the object under test is subjected to a force in the direction from the third surface 10c to the fourth surface 10d;

[0169] When U1 and U2 decrease, the object under test is subjected to a force in the direction from the fourth surface 10d to the third surface 10c;

[0170] When Ua decreases, the object under test is subjected to a force in the direction from the first surface 10a to the second surface 10b;

[0171] When Ua increases, the object under test is subjected to a force in the direction from the second surface 10b to the first surface 10a;

[0172] Therefore, the pressure sensing component according to Example 6 only needs to collect signals from three channels (U1 to U3) and convert them into signal characteristics of U1, U2 and Ua, so as to identify whether the object being measured is subjected to pressure in the Z-axis or Y-axis direction and obtain the pressure magnitude, thereby completing multi-dimensional detection with simple calculations.

[0173] Example 7

[0174] See also Figure 4 , Figure 8The difference between the pressure sensing component of Example 7 and Example 5 is that the force sensors R5, R8 (R6, R7) of the second bridge circuit are arranged on the third surface 10c and the fourth surface 10d of the rigid block 11, and the rigid block 11 is adjacent to the strain amplification area 12 where the force sensors R1, R4 (R2, R3) of the first bridge circuit are arranged. Any rigid block 11 on both sides can be used, and the force sensors R1, R4 (R2, R3) of the first bridge circuit and the force sensors R8, R5 (R7, R6) of the second bridge circuit are located on different straight lines in a one-to-one correspondence.

[0175] The pressure sensing method used in Example 7 can refer to the pressure sensing method of Example 5 or 6, and will not be described in detail. The pressure sensing component of Example 7 places the force sensors R5, R8 (R6, R7) of the second bridge circuit on the rigid block 11, optimizes the size of the pressure sensing component, and makes the structure occupy a smaller space.

[0176] Example 8

[0177] See also Figure 4 , Fig. 9 , configuring a first bridge circuit and a second bridge circuit, for the same first bridge circuit, one group of relative bridge arms R1, R4 are respectively arranged at the center position of the first surface 10a of a strain amplification region 12 and the first surface 10a of the rigid block 11 adjacent to the strain amplification region 12, and another group of relative bridge arms R2, R3 are respectively arranged at the center position of the second surface 10b of the strain amplification region 12 and the second surface 10b of the rigid block 11; for the same second bridge circuit, one group of relative bridge arms R5, R8 are respectively arranged at the center position of the third surface 10c of the strain amplification region 12 and the third surface 10c of the rigid block 11 adjacent to the strain amplification region 12, and another group of relative bridge arms R6, R7 are respectively arranged at the center position of the fourth surface 10d of the strain amplification region 12 and the fourth surface 10d of the rigid block 11.

[0178] Assume VCC = Ui, then:

[0179] Vp1=R2Ui / (R1+R2); Vn1=R4Ui / (R3+R4);

[0180] Vp2=R6Ui / (R5+R6); Vn2=R8Ui / (R7+R8);

[0181] Let U1=Vp1-Vn1=(R2R3-R1R4)Ui / [(R1+R2)(R3+R4)];

[0182] U2=Vp2-Vn2=(R6R7-R5R8)Ui / [(R5+R6)(R7+R8)];

[0183] Referring to the above, when the object under test is subjected to a force from the first surface 10a to the second surface 10b: the pressure sensing component bends downward, the first surface 10a is the inner surface of the bend, R1 will be squeezed and the resistance value will decrease; the second surface 10b is the outer surface of the bend, R2 will be stretched and the resistance value will increase; R5 and R6 are at the center surface of the bend, R5 and R6≈0. R3, R4, R7, and R8 are on the surface of the rigid block 11, and the rigid block 11 has a small deformation, so the resistance value is almost unchanged.

[0184] ∴ΔVp1>0, △Vn1≈0; △Vp2≈0, △Vn2≈0.

[0185] ∴△U1>0;△U2≈0.

[0186] When the object under test is subjected to a force from the second surface 10b to the first surface 10a: the pressure sensing component bends upward, the first surface 10a is the curved outer surface, R1 will be stretched, resulting in an increase in resistance; the second surface 10b is the curved inner surface, R2 will be squeezed, resulting in a decrease in resistance; R5 and R6 are at the center of the curve, R5 and R6≈0. R3, R4, R7, and R8 are on the surface of the rigid block 11, and the rigid block 11 has a small deformation, so the resistance value remains almost unchanged.

[0187] ∴△Vp1<0,△Vn1≈0;△Vp2≈0,△Vn2≈0.

[0188] ∴△U1<0;△U2≈0.

[0189] When the object under test exerts force from the third surface 10c to the fourth surface 10d: the pressure sensing component bends backward, the third surface 10c is the inner surface of the bend, R5 will be squeezed and the resistance value will decrease; the fourth surface 10d is the outer surface of the bend, R6 will be stretched and the resistance value will increase; R1 and R2 are at the center surface of the bend, R1 and R2≈0. R3, R4, R7, and R8 are on the surface of the rigid block 11, and the rigid block 11 has a small deformation, so the resistance value is almost unchanged.

[0190] ∴△Vp1≈0,△Vn1≈0;△Vp2>0,△Vn2≈0.

[0191] ∴ΔU1≈0;△U2>0.

[0192] When the object under test exerts force from the fourth surface 10d to the third surface 10c: the pressure sensing component bends forward, the third surface 10c is the outer surface of the bend, R5 will be stretched, resulting in an increase in resistance; the fourth surface 10d is the inner surface of the bend, R6 will be squeezed, resulting in a decrease in resistance; R1 and R2 are at the center of the bend, R1 and R2≈0. R3, R4, R7, and R8 are on the surface of the rigid block 11, and the rigid block 11 has a small deformation, so the resistance value remains almost unchanged.

[0193] ∴△Vp1≈0,△Vn1≈0;△Vp2<0,△Vn2≈0.

[0194] ∴△U1≈0;△U2<0.

[0195] In summary, in the pressure sensing component and the pressure sensing method thereof of Example 8, when the matching unit 2 is the second bridge circuit, the force sensors R1 and R4 (R2 and R3) of the first bridge circuit are distributed at the center of the first surface 10a and the center of the second surface 10b, and the force sensors R5 and R8 (R6 and R7) of the second bridge circuit are distributed at the center of the third surface 10c and the center of the fourth surface 10d. Assuming that the output signal of the first bridge circuit is U1 and the output signal of the second bridge circuit is U2, then:

[0196] When U1 increases, the object under test is subjected to a force in the direction from the first surface 10a to the second surface 10b;

[0197] When U1 decreases, the object under test is subjected to a force in the direction from the second surface 10b to the first surface 10a;

[0198] When U2 increases, the object under test is subjected to a force in the direction from the third surface 10c to the fourth surface 10d;

[0199] When U2 decreases, the object under test is subjected to a force in a direction from the fourth surface 10d to the third surface 10c.

[0200] Therefore, the pressure sensing component according to Example 8 only needs to collect signals from two channels (U1, U2) to identify whether the object being measured is subjected to pressure in the Z-axis or Y-axis direction and obtain the pressure magnitude, thereby completing multi-dimensional detection with simple calculations.

[0201] It can be understood that when the first coordination method is adopted, the force sensors of the first bridge circuit and the second bridge circuit can also adopt other arrangements, as long as the first bridge circuit and the second bridge circuit can generate different output signals when the rigid structure 10 is deformed by force, and no further details will be given.

[0202] When using the second method, refer to Figure 3 , Figures 5 to 10 , a first bridge circuit and a second bridge circuit will be configured, and the force sensors of the first bridge circuit and the second bridge circuit have various arrangements, and you can refer to the various arrangements of the force sensors of the first matching mode. Fig.10The common points are: the two detection terminals Vp1 and Vn1 of the first bridge circuit are connected to form a first single bridge Vp3, the two detection terminals Vp2 and Vn2 of the second bridge circuit are connected to form a second single bridge Vn3, the first single bridge Vp3 and the second single bridge Vn3 form a differential pair, and the two groups of relative bridge arms R5 and R8 (R6 and R7) in the second bridge circuit are respectively arranged on two relative mounting surfaces.

[0203] With the second matching mode, when the rigid structure 10 is deformed by force, the force sensor located in the strain amplification area 12 will be deformed, and the first bridge circuit and the second bridge circuit will output signals, and the first single bridge Vp3 and the second single bridge Vn3 will output signals. The direction and magnitude of the force can be identified by the signal processing circuit. An embodiment is provided below for illustration.

[0204] Example 9

[0205] See also Figure 3 , Fig.10 , configuring a first bridge circuit and a second bridge circuit, for the same first bridge circuit, two sets of relative bridge arms R1, R4 (R2, R3) are respectively arranged on the first surface 10a and the second surface 10b of one strain amplification region 12; for the same second bridge circuit, two sets of relative bridge arms R5, R8 (R6, R7) are respectively arranged on the first surface 10a and the second surface 10b of another strain amplification region 12.

[0206] Assume VCC = Ui, then:

[0207] Vp1=R2Ui / (R1+R2); Vn1=R4Ui / (R3+R4);

[0208] U1=Vp1-Vn1=(R2R3-R1R4)Ui / [(R1+R2)(R3+R4)];

[0209] When the two detection terminals Vp1 and Vn1 of the first bridge circuit are separated, the derivatives of R1, R2, R3 and R4 are respectively derived. It can be seen that U1 increases with the increase of R2 and R3, and decreases with the increase of R1 and R4.

[0210] Vp2=R6Ui / (R5+R6); Vn2=R8Ui / (R7+R8);

[0211] U2=Vp2-Vn2=(R6R7-R5R8)Ui / [(R5+R6)(R7+R8)];

[0212] When the two detection terminals Vp2 and Vn2 of the second bridge circuit are separated, the derivatives of R1, R2, R3 and R4 are respectively derived. It can be seen that U2 increases with the increase of R6 and R7, and decreases with the increase of R5 and R8.

[0213] Let U3 = Vp3 - Vn3;

[0214] When the two detection terminals Vp1 and Vn1 of the first bridge circuit are connected, R1 and R3 are connected in parallel, R2 and R4 are connected in parallel, and then connected in series to form a first single bridge Vp3. When the two detection terminals Vp2 and Vn2 of the second bridge circuit are connected, R5 and R7 are connected in parallel, R6 and R8 are connected in parallel, and then connected in series to form a second single bridge Vn3.

[0215] Referring to the above, when the object under test is subjected to a force from the first surface 10a to the second surface 10b: R2 and R3 will increase and have similar resistance change rates, R1 and R4 will decrease and have similar resistance change rates. R6 and R7 will increase and have similar resistance change rates, and R5 and R8 will decrease and have similar resistance change rates.

[0216] ∴When pressing from top to bottom, △Vp1>0, △Vn1<0, △Vp1≈-△Vn1, △Vp2>0, △Vn2<0, ΔV21≈-ΔVn2. ∴U1=△Vp1-△Vn1>0; U2=△Vp2-△Vn2>0.

[0217] Assuming that the on-resistance of switches S1 and S2 is close to 0, we have:

[0218] ΔVp3=(ΔVp1+ΔVn1) / 2≈0; ΔVn3=(ΔVp2+ΔVn2) / 2≈0; ∴U3=ΔVp3-ΔVn3≈0.

[0219] When the object under test is subjected to a force from the second surface 10b to the first surface 10a: R2 and R3 will decrease and have similar resistance change rates, R1 and R4 will increase and have similar resistance change rates. R6 and R7 will decrease and have similar resistance change rates, and R5 and R8 will increase and have similar resistance change rates.

[0220] ∴When pressing from bottom to top, △Vp1<0, △Vn1>0, △Vp1≈-△Vn1, △Vp2<0, △Vn2>0, △V21≈-△Vn. ∴U1=△Vp1-ΔVn1<0; U2=△Vp2-△Vn2<0.

[0221] Assuming that the on-resistance of switches S1 and S2 is close to 0, we have:

[0222] ΔVp3=(ΔVp1+ΔVn1) / 2≈0; ΔVn3=(ΔVp2+ΔVn2) / 2≈0; ∴U3=ΔVp3-ΔVn3≈0.

[0223] When the force of the measured object is applied from the third surface 10c to the fourth surface 10d: R4 and R2 increase at the same time and the resistance change rate is close, R1 and R3 decrease at the same time and the resistance change rate is close, R5 and R7 increase at the same time and the resistance change rate is close, and R6 and R8 will decrease at the same time and the resistance change rate is close.

[0224] ∴When pressing from front to back, △Vp1>0, △Vn1>0, △Vp1≈△Vn1, △Vp2<0, ΔVn2<0, △V21≈ΔVn2. ∴U1=△Vp1-ΔVn1≈0; U2=△Vp2-△Vn2≈0.

[0225] Assuming that the on-resistance of switches S1 and S2 is close to 0, we have:

[0226] ΔVp3=(ΔVp1+ΔVn1) / 2>0; ΔVn3=(ΔVp2+ΔVn2) / 2<0; ∴U3=ΔVp3-ΔVn3>0.

[0227] When the object under test is subjected to force from the fourth surface 10d to the third surface 10c: R4 and R2 decrease at the same time and the resistance change rate is close, R1 and R3 increase at the same time and the resistance change rate is close. R8 and R6 increase at the same time and the resistance change rate is close, R5 and R7 decrease at the same time and the resistance change rate is close.

[0228] ∴When pressing from back to front, ΔVp1<0, ΔVn1<0, ΔVp1≈ΔVn1, ΔVp2>0, ΔVn2>0, ΔV21≈ΔVn2; ∴U1=ΔVp1-ΔVn1≈0; U2=ΔVp2-ΔVn2≈0.

[0229] Assuming that the on-resistance of switches S1 and S2 is close to 0, we have:

[0230] ΔVp3=(ΔVp1+ΔVn1) / 2<0; ΔVn3=(ΔVp2+ΔVn2) / 2>0; ∴U3=ΔVp3-ΔVn3<0.

[0231] In summary, in the pressure sensing component and the pressure sensing method thereof of Example 9, when the matching unit 2 includes the second bridge circuit and the second single bridge Vn3, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the first surface 10a and the second surface 10b. Assuming that the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, and the potential difference between the first single bridge Vp3 and the second single bridge Vn3 is U3, then:

[0232] When U1 and U2 increase, the object under test is subjected to a force in the direction from the first surface 10a to the second surface 10b;

[0233] When U1 and U2 decrease, the object under test is subjected to a force in the direction from the second surface 10b to the first surface 10a;

[0234] When U3 increases, the object under test is subjected to a force in the direction from the third surface 10c to the fourth surface 10d;

[0235] When U3 decreases, the object under test is subjected to a force in the direction from the fourth surface 10d to the third surface 10c;

[0236] Therefore, according to Example 9, the pressure sensing component only needs to collect signals from three channels (U1 to U3) and convert them into signal characteristics of U1, U2 and Ua. It can then identify whether the object being measured is subjected to pressure in the Z-axis or Y-axis direction and derive the pressure magnitude, thereby completing multi-dimensional detection with simple calculations.

[0237] It can be understood that when the second matching method is adopted, the force sensors of the first bridge circuit and the second bridge circuit have multiple arrangements. Various arrangements of the force sensors of the first matching method can also be adopted, which will not be repeated here.

[0238] When using the third method, see Fig.11 , Fig.12 , a first bridge circuit and a fixed voltage are configured, and the force sensor of the first bridge circuit has a variety of arrangements, which can refer to the various arrangements of the force sensor of the first bridge circuit in the first matching mode. The common point is: the two detection terminals Vp1 and Vn1 of the first bridge circuit are connected to form a first single bridge Vp3, and the first single bridge Vp3 and the fixed voltage form a differential pair.

[0239] With the third matching mode, when the rigid structure 10 is deformed by force, the force sensor located in the strain amplification area 12 will be deformed, and the first bridge circuit will output a signal, and the first single bridge Vp3 will output a signal. The direction and magnitude of the force can be identified by the signal processing circuit. An embodiment is provided below for illustration.

[0240] Example 10

[0241] See also Fig.11 , Fig.12 , configuring a first bridge circuit and a fixed voltage, for the same first bridge circuit, two sets of relative bridge arms R1, R4 (R2, R3) are respectively arranged on the first surface 10a and the second surface 10b of a strain amplification region 12.

[0242] The difference between the pressure sensing method of embodiment 10 and embodiment 9 is that no second bridge circuit is provided, so the output signal of the second bridge circuit is U2. The pressure sensing method of embodiment 10 can refer to embodiment 9, and the output signal U2 is not considered, and will not be described in detail.

[0243] In the pressure sensing component and pressure sensing method of Example 10, when the matching unit is a fixed voltage, the force sensors R1, R4 (R2, R3) of the first bridge circuit are distributed on the first surface 10a and the second surface 10b. Assuming that the output signal of the first bridge circuit is U1, and the potential difference between the first single bridge Vp3 and the fixed voltage is U3, then:

[0244] When U1 increases, the object under test is subjected to a force in the direction from the first surface 10a to the second surface 10b;

[0245] When U1 decreases, the object under test is subjected to a force in the direction from the second surface 10b to the first surface 10a;

[0246] When U3 increases, the object under test is subjected to a force in the direction from the third surface 10c to the fourth surface 10d;

[0247] When U3 decreases, the object under test is subjected to a force in the direction from the fourth surface 10d to the third surface 10c;

[0248] Therefore, the pressure sensing component according to Example 10 only needs to collect signals from two channels (U1 and U3) to identify whether the object being measured is subjected to pressure in the Z-axis or Y-axis direction and obtain the pressure magnitude, thereby completing multi-dimensional detection with simple calculations.

[0249] It can be understood that when the third matching method is adopted, the force sensor of the first bridge circuit has a variety of arrangements. The various arrangements of the force sensor of the first bridge circuit in the first matching method can also be adopted, which will not be repeated.

[0250] Some embodiments of the present application provide a pressure sensing method, which uses the above-mentioned pressure sensing component, including the following steps: attaching a rigid structure 10 to an object to be measured;

[0251] See also Figures 3 to 9 , when the matching unit 2 is a second bridge circuit, the first bridge circuit and the second bridge circuit are electrically connected to the signal processing circuit, and the direction and magnitude of the force are identified by detecting the signal changes of the first bridge circuit and the second bridge circuit;

[0252] See also Figure 3 , Figures 5 to 10 , when the matching unit 2 includes the second bridge circuit and the second single bridge Vn3, the first bridge circuit, the second bridge circuit, the first single bridge Vp3 and the second single bridge Vn3 are electrically connected to the signal processing circuit, and the direction and magnitude of the force are identified by detecting the signal changes of the first bridge circuit, the second bridge circuit, the first single bridge Vp3 and the second single bridge Vn3;

[0253] See also Fig.11 , Fig.12When the matching unit is at a fixed voltage, the first bridge circuit and the first single bridge Vp3 are electrically connected to the signal processing circuit, and the direction and magnitude of the force are identified by detecting the signal changes of the first bridge circuit and the first single bridge Vp3.

[0254] When in use, the rigid structure 10 is attached to the object to be measured. The object to be measured is deformed by force, and the rigid structure 10 follows the deformation. The strain of the rigid structure 10 is concentrated in the strain amplification area 12. The force sensor at the strain amplification area 12 obtains a pressure signal. The detection unit 1 cooperates with the matching unit 2 to generate different output signals, which are processed by the signal processing circuit to identify the direction and magnitude of the force. The pressure sensing component is an integrated structure, which is easy to install, simple in circuit, and low in cost. The pressure sensing method can very sensitively detect the tiny deformation of the object to be measured in multi-dimensional directions, so as to accurately identify the multi-directional pressure on the object to be measured, and improve the reliability and stability of the pressure sensing component.

[0255] Some embodiments of the present application provide a device including the pressure sensing component described above. Since the device adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0256] In another embodiment of the present invention, the object to be measured is a panel or a frame. Force sensing of the panel or the frame is realized. The panel or the frame can be made of non-metallic materials such as glass, plastic, ceramic, etc. The panel can be a touch screen, a display or other electronic terminal with a rigid structure 10. The frame can be a frame of various electronic terminals. By connecting the force sensor to the panel or the frame, it is possible to accurately identify the size of the touch pressure, thereby expanding the application space for electronic terminals in product applications, human-computer interaction and consumer experience. The user can directly obtain the precise force level and quantity by touching the touch screen, display or electronic terminal. After calibration, the precise force can be obtained.

[0257] The above are only optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. Pressure sensing components, It is characterized in that include: A rigid structure, used to fit with the object to be measured and deform along with the object to be measured, the rigid structure comprising rigid blocks spaced apart along the X-axis, a strain amplification area formed between two adjacent rigid blocks, and four mounting surfaces formed around the rigid structure; A detection unit, comprising a first bridge circuit formed by connecting at least four force sensors, wherein two groups of opposite bridge arms in the first bridge circuit are respectively arranged on two opposite mounting surfaces, and wherein two of the force sensors are respectively arranged on two opposite mounting surfaces of the strain amplification region; as well as A matching unit, used to match with the detection unit to generate different output signals when the rigid structure is deformed by force, and the detection unit and the matching unit are electrically connected to a signal processing circuit to identify the direction and magnitude of the force; The matching unit is a second bridge circuit formed by connecting at least four force sensors, and two groups of opposite bridge arms in the second bridge circuit are respectively arranged on two opposite mounting surfaces; When the rigid structure is deformed by force, the first bridge circuit and the second bridge circuit can generate different output signals; Alternatively, the detection unit further comprises a first single bridge formed by connecting two detection ends of the first bridge circuit, the matching unit comprises a second bridge circuit formed by connecting at least four force sensors, and a second single bridge formed by connecting two detection ends of the second bridge circuit, the first single bridge and the second single bridge form a differential pair, and two groups of relative bridge arms in the second bridge circuit are respectively arranged on two relative mounting surfaces; when the rigid structure is deformed by force, the first bridge circuit, the second bridge circuit, the first single bridge and the second single bridge can generate different output signals; Alternatively, the detection unit also includes a first single bridge formed by connecting the two detection ends of the first bridge circuit, the matching unit is a fixed voltage, and the first single bridge and the fixed voltage form a differential pair; when the rigid structure is deformed under force, the first bridge circuit and the first single bridge can generate different output signals.

2. The pressure sensing component according to claim 1, It is characterized in that The length direction of the force sensor is parallel to the X-axis; the four mounting surfaces are divided into a first surface and a second surface spaced apart on the Z-axis, and a third surface and a fourth surface spaced apart on the Y-axis, the first surface serves as a fitting surface with the object to be measured, and the X-axis, Y-axis and Z-axis are perpendicular to each other.

3. The pressure sensing assembly as claimed in claim 2, It is characterized in that When the matching unit includes the second bridge circuit, for the same first bridge circuit, two groups of opposite bridge arms are respectively arranged on the first surface and the second surface of one strain amplification region; for the same second bridge circuit, two groups of opposite bridge arms are respectively arranged on the first surface and the second surface of another strain amplification region; Alternatively, when the matching unit includes the second bridge circuit, for the same first bridge circuit, two groups of relative bridge arms are respectively arranged on the first surface and the second surface of one strain amplification region; for the same second bridge circuit, two groups of relative bridge arms are respectively arranged on the first surface and the second surface of the rigid block adjacent to the strain amplification region, and the force sensors of the first bridge circuit and the force sensors of the second bridge circuit are located on different straight lines in a one-to-one correspondence; Alternatively, when the matching unit includes the second bridge circuit, for the same first bridge circuit, two groups of relative bridge arms are respectively arranged on the third surface and the fourth surface of one strain amplification region; for the same second bridge circuit, two groups of relative bridge arms are respectively arranged on the third surface and the fourth surface of another strain amplification region; Alternatively, when the matching unit includes the second bridge circuit, for the same first bridge circuit, two groups of relative bridge arms are respectively arranged on the third surface and the fourth surface of one strain amplification region; for the same second bridge circuit, two groups of relative bridge arms are respectively arranged on the third surface and the fourth surface of the rigid block adjacent to the strain amplification region, and the force sensors of the first bridge circuit and the force sensors of the second bridge circuit are located on different straight lines in a one-to-one correspondence; Alternatively, when the matching unit includes the second bridge circuit, for the same first bridge circuit, one group of relative bridge arms is respectively arranged at the center position of the first surface of one strain amplification region and the first surface of the rigid block adjacent to the strain amplification region, and another group of relative bridge arms is respectively arranged at the center position of the second surface of the strain amplification region and the second surface of the rigid block; for the same second bridge circuit, one group of relative bridge arms is respectively arranged at the center position of the third surface of the strain amplification region and the third surface of the rigid block adjacent to the strain amplification region, and another group of relative bridge arms is respectively arranged at the center position of the fourth surface of the strain amplification region and the fourth surface of the rigid block; Alternatively, when the matching unit is a fixed voltage, for the same first bridge circuit, two groups of opposite bridge arms are respectively arranged on the first surface and the second surface of one strain amplification region; Alternatively, when the matching unit is a fixed voltage, for the same first bridge circuit, two sets of opposite bridge arms are respectively arranged on the third surface and the fourth surface of one strain amplification region; Alternatively, when the matching unit is a fixed voltage, for the same first bridge circuit, one group of relative bridge arms is respectively arranged at the center position of the first surface of one of the strain amplification regions and the first surface of the rigid block adjacent to the strain amplification region, and another group of relative bridge arms is respectively arranged at the center position of the second surface of the strain amplification region and the second surface of the rigid block; Alternatively, when the matching unit is a fixed voltage, for the same first bridge circuit, one group of relative bridge arms are respectively arranged at the center position of the third surface of one of the strain amplification regions and the third surface of the rigid block adjacent to the strain amplification region, and another group of relative bridge arms are respectively arranged at the center position of the fourth surface of the strain amplification region and the fourth surface of the rigid block.

4. The pressure sensing component according to claim 1, It is characterized in that The two detection ends of the first bridge circuit are connected via an analog switch; and / or the two detection ends of the second bridge circuit are connected via an analog switch.

5. The pressure sensing component according to claim 1, It is characterized in that The mounting surfaces on which the force sensors are mounted are each provided with a flexible substrate, and the force sensors are respectively mounted on the corresponding flexible substrates.

6. The pressure sensing component according to claim 5, It is characterized in that All the flexible substrates are formed by bending a mother substrate.

7. The pressure sensing assembly as claimed in claim 5, It is characterized in that The flexible substrate is bonded to the mounting surface via colloid.

8. The pressure sensing component according to claim 1, It is characterized in that The force sensor is a strain sensing resistor, and the strain sensing resistor is made of at least one material selected from polycrystalline semiconductor materials, amorphous semiconductor materials, polycrystalline silicon, graphene, copper-nickel alloy, carbon nanotubes, metal fine wires, and conductor-insulator composite materials.

9. The pressure sensing assembly as claimed in claim 1, It is characterized in that The rigid structure is a steel sheet, an aluminum sheet, a glass sheet or a FR4 sheet.

10. Pressure sensing method, It is characterized in that The pressure sensing component according to claim 2 is used, comprising the following steps: Fitting the rigid structure onto the object to be measured; When the matching unit is the second bridge circuit, the first bridge circuit and the second bridge circuit are electrically connected to a signal processing circuit, and the direction and magnitude of the force are identified by detecting signal changes of the first bridge circuit and the second bridge circuit; When the matching unit includes the second bridge circuit and the second single bridge, the first bridge circuit, the second bridge circuit, the first single bridge and the second single bridge are electrically connected to a signal processing circuit, and the direction and magnitude of the force are identified by detecting signal changes of the first bridge circuit, the second bridge circuit, the first single bridge and the second single bridge; When the matching unit is at the fixed voltage, the first bridge circuit and the first single bridge are electrically connected to a signal processing circuit, and the direction and magnitude of the force are identified by detecting signal changes of the first bridge circuit and the first single bridge.

11. The pressure sensing method according to claim 10, It is characterized in that When the matching unit is the second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the first surface and the second surface, and the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, the potential difference between one detection end of the first bridge circuit and one detection end of the second bridge circuit is U3, the potential difference between the other detection end of the first bridge circuit and the other detection end of the second bridge circuit is U4, and the judgment parameter is Ua, so that the judgment parameter satisfies the following relationship: Ua= U3+U4, then: When U1 and U2 increase, the object under test is subjected to a force in the direction from the first surface to the second surface; When U1 and U2 decrease, the object under test is subjected to a force in the direction from the second surface to the first surface; When Ua increases, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When Ua decreases, the object under test is subjected to a force in a direction from the fourth surface to the third surface; Alternatively, when the matching unit is the second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the first surface and the second surface, the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, the potential difference between one detection end of the first bridge circuit and one detection end of the second bridge circuit is U3, and the judgment parameter is Ua, so that the judgment parameter satisfies the following relationship: Ua=2U3+U2-U1, then: When U1 and U2 increase, the object under test is subjected to a force in the direction from the first surface to the second surface; When U1 and U2 decrease, the object under test is subjected to a force in the direction from the second surface to the first surface; When Ua increases, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When Ua decreases, the object under test is subjected to a force in a direction from the fourth surface to the third surface; Alternatively, when the matching unit is the second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the first surface and the second surface, and the output signal of the first bridge circuit is assumed to be U1, the output signal of the second bridge circuit is assumed to be U2, and the two judgment parameters are assumed to be Uz and Uy, respectively, so that the two judgment parameters satisfy the following relationship: Uz= U1-U3; Uy= U1+U3, then: When Uz increases, the object under test is subjected to a force in a direction from the first surface to the second surface; When Uz decreases, the object under test is subjected to a force in a direction from the second surface to the first surface; When Uy increases, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When Uy decreases, the object under test is subjected to a force in a direction from the fourth surface to the third surface; Alternatively, when the matching unit is the second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the third surface and the fourth surface, and the output signal of the first bridge circuit is assumed to be U1, the output signal of the second bridge circuit is assumed to be U2, the potential difference between one detection end of the first bridge circuit and one detection end of the second bridge circuit is assumed to be U3, the potential difference between the other detection end of the first bridge circuit and the other detection end of the second bridge circuit is assumed to be U4, and the judgment parameter is assumed to be Ua, so that the judgment parameter satisfies the following relationship: Ua= U3+U4, then: When U1 and U2 increase, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When U1 and U2 decrease, the object under test is subjected to a force in a direction from the fourth surface to the third surface; When Ua decreases, the object under test is subjected to a force in a direction from the first surface to the second surface; When Ua increases, the object under test is subjected to a force in the direction from the second surface to the first surface; Alternatively, when the matching unit is the second bridge circuit, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the third surface and the fourth surface, the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, the potential difference between one detection end of the first bridge circuit and one detection end of the second bridge circuit is U3, and the judgment parameter is Ua, so that the judgment parameter satisfies the following relationship: Ua=2U3+U2-U1, then: When U1 and U2 increase, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When U1 and U2 decrease, the object under test is subjected to a force in a direction from the fourth surface to the third surface; When Ua decreases, the object under test is subjected to a force in a direction from the first surface to the second surface; When Ua increases, the object under test is subjected to a force in the direction from the second surface to the first surface; Alternatively, when the matching unit is the second bridge circuit, the force sensors of the first bridge circuit are distributed at the center of the first surface and the center of the second surface, and the force sensors of the second bridge circuit are distributed at the center of the third surface and the center of the fourth surface. Assuming that the output signal of the first bridge circuit is U1 and the output signal of the second bridge circuit is U2, then: When U1 increases, the object under test is subjected to a force in the direction from the first surface to the second surface; When U1 decreases, the object under test is subjected to a force in the direction from the second surface to the first surface; When U2 increases, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When U2 decreases, the object under test is subjected to a force in a direction from the fourth surface to the third surface.

12. The pressure sensing method according to claim 10, It is characterized in that When the matching unit includes a second bridge circuit and the second single bridge, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the first surface and the second surface. Assuming that the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, and the potential difference between the first single bridge and the second single bridge is U3, then: When U1 and U2 increase, the object under test is subjected to a force in the direction from the first surface to the second surface; When U1 and U2 decrease, the object under test is subjected to a force in the direction from the second surface to the first surface; When U3 increases, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When U3 decreases, the object under test is subjected to a force in a direction from the fourth surface to the third surface; Alternatively, when the matching unit includes a second bridge circuit and the second single bridge, the force sensors of the first bridge circuit and the second bridge circuit are distributed on the third surface and the fourth surface, assuming that the output signal of the first bridge circuit is U1, the output signal of the second bridge circuit is U2, and the potential difference between the first single bridge and the second single bridge is U3, then: When U1 and U2 increase, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When U1 and U2 decrease, the object under test is subjected to a force in a direction from the fourth surface to the third surface; When U3 increases, the object under test is subjected to a force in the direction from the first surface to the second surface; When U3 decreases, the object under test is subjected to a force in a direction from the second surface to the first surface.

13. The pressure sensing method according to claim 10, It is characterized in that When the matching unit is the fixed voltage, the force sensors of the first bridge circuit are distributed on the first surface and the second surface. Assuming that the output signal of the first bridge circuit is U1 and the potential difference between the first single bridge and the fixed voltage is U3, then: When U1 increases, the object under test is subjected to a force in the direction from the first surface to the second surface; When U1 decreases, the object under test is subjected to a force in the direction from the second surface to the first surface; When U3 increases, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When U3 decreases, the object under test is subjected to a force in a direction from the fourth surface to the third surface; Alternatively, when the matching unit is the fixed voltage, the force sensors of the first bridge circuit are distributed on the third surface and the fourth surface, and the output signal of the first bridge circuit is assumed to be U1, and the potential difference between the first single bridge and the fixed voltage is U3, then: When U1 increases, the object under test is subjected to a force in a direction from the third surface to the fourth surface; When U1 decreases, the object under test is subjected to a force in a direction from the fourth surface to the third surface; When U3 increases, the object under test is subjected to a force in the direction from the first surface to the second surface; When U3 decreases, the object under test is subjected to a force in a direction from the second surface to the first surface.

14. Equipment, It is characterized in that Comprising the pressure sensing component as claimed in claim 1.

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