A jamming device

By designing an interference device including a detection module and an interference signal generator, the problem of inability to effectively prevent mobile phone eavesdropping and stealing in the prior art is solved, audio interference and privacy protection of electronic devices are achieved, and power consumption is saved and the service life of the device is extended.

CN114268408BActive Publication Date: 2025-04-08SHENZHEN AWP TECH CO LTD
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Patent Information

Application Number
CN202111678312.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-12-31
Publication Date
2025-04-08
Estimated Expiration
2041-12-31

AI Technical Summary

Technical Problem

The prior art lacks a device that can effectively prevent cell phone eavesdropping and plagiarism, especially in meetings or conversations to protect personal privacy and trade secrets.

Method used

An interference device is designed, which includes a housing, a reflective structure and a plurality of interference signal generators. The detection module detects the existence of the electronic device, and the processing module controls the interference signal generator to emit interference signals of a specific frequency, resulting in the electronic device being unable to record or be eavesdropped.

Benefits of technology

It realizes audio interference to electronic devices, prevents eavesdropping and plagiarism, protects personal privacy and trade secrets, and at the same time, through the use of detection modules, power consumption is saved and the service life of the device is extended.

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Abstract

The present application discloses an interference device. The interference device includes: a shell, the interior of the shell has a receiving space, the outer side of the shell has a first receiving groove, the receiving space of the shell includes a second receiving groove, the number of the second receiving groove is at least one, and it is arranged on the side of the first receiving groove in the length direction, the first receiving groove is connected to the second receiving groove, and the first receiving groove is used to place an electronic device; a reflective structure, located in the second receiving groove; a plurality of interference signal generators, arranged in the receiving space, the plurality of interference signal generators are used to send a first signal to the second receiving groove, and after being reflected by the reflective structure, the first receiving groove is emitted to the first receiving groove to perform audio interference on the electronic device. By adopting the interference device of the structure of the present application, the purpose of anti-eavesdropping and anti-recording processing can be achieved for the electronic device placed in the first receiving groove.
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Description

Technical Field

[0001] The present application belongs to the technical field of interference of electronic equipment, and specifically relates to an ultrasonic interference device. Background Art

[0002] In some important meetings or conversations, someone may use the recording function on their mobile phone to record the content of the meeting or conversation, or the mobile phone may be remotely tapped. However, the speaker does not want his or her speech to be recorded or tapped, and does not want his or her personal privacy or business secrets to be leaked.

[0003] Currently, there is no interference device on the market that can place a mobile phone and prevent the phone from being recorded or eavesdropped on.

[0004] Application Contents

[0005] In order to solve the above problems, the purpose of the present application is to provide an interference device that can place electronic devices and can prevent electronic devices from being recorded or eavesdropped.

[0006] The embodiment of the present application provides an interference device, including:

[0007] A housing, wherein the housing has a receiving space inside, and a first receiving groove is provided on one side of the housing outside. The receiving space of the housing includes a second receiving groove, the number of the second receiving groove is at least one, and the second receiving groove is arranged beside the first receiving groove in the length direction, the first receiving groove is connected with the second receiving groove, and the first receiving groove is used to place the electronic device;

[0008] A reflective structure, located in the second receiving groove;

[0009] A plurality of interference signal generators are arranged in the receiving space, and the plurality of interference signal generators are used to send a first signal to the second receiving groove, which is reflected by the reflection structure and then emitted to the first receiving groove to perform audio interference on the electronic device.

[0010] In some embodiments, the first signal includes at least two first sound wave signals of different frequencies, wherein the at least two first sound wave signals of different frequencies are sound wave signals that are not audible to the human ear, and the at least two first sound wave signals of different frequencies can generate a second sound wave signal audible to the human ear after mixing.

[0011] In some embodiments, the interference device further includes a mainboard, which is disposed in the receiving space, and the multiple interference signal generators are disposed on the mainboard, and the multiple interference signal generators are driven by the mainboard to emit a first signal toward the second receiving groove.

[0012] In some embodiments, the shell includes an upper shell and a lower shell, and the upper shell and the lower shell cooperate to form the accommodating space. The first accommodating groove is formed on the upper side of the upper shell facing away from the lower shell, and the second accommodating groove is formed at the opposite ends of the upper shell and facing the inner side of the lower shell. The first accommodating groove is located between the oppositely arranged second accommodating grooves.

[0013] In some embodiments, the reflective structure has an inclined portion, and the inclined portion enables the first signal incident thereon to be emitted toward the first receiving groove.

[0014] In some embodiments, a plurality of through holes are disposed between the first accommodating groove and the second accommodating groove, and the plurality of through holes are used to pass the first signal.

[0015] In some embodiments, the mainboard includes a detection module and a processing module, the detection module is used to detect whether an electronic device is placed in the first receiving slot, and the processing module controls whether the multiple interference signal generators start to emit a first signal according to the detection result of the detection module.

[0016] In some embodiments, when the detection module detects that an electronic device is placed in the first receiving groove, it outputs a corresponding detection signal to the processing module, and the processing module correspondingly controls the multiple interference signal generators to start sending the first signal.

[0017] In some embodiments, the detection module includes a capacitive detection module, the capacitive detection module includes a capacitive detection circuit and a detection electrode, the detection electrode is used to form a detection capacitance with the electronic device, and the capacitive detection circuit is provided on the mainboard to drive the detection electrode to perform capacitive sensing; or

[0018] The detection module includes an infrared detection module, and the infrared detection module includes an infrared transmitting device and an infrared receiving device. The infrared transmitting device is used to transmit infrared rays to the first receiving groove, and the infrared receiving device is used to receive infrared rays returned by the first receiving groove, and detect whether an electronic device is placed in the first receiving groove based on the received infrared rays.

[0019] In some embodiments, the upper shell includes a base plate, a top plate, an inner wall, and an outer wall, the inner wall extends from the edge of the base plate in a direction away from the lower shell, the outer wall is located at the periphery of the inner wall, the top plate is higher than the base plate in a height direction away from the lower shell, and is located on opposite sides of the base plate and connected between the inner wall and the outer wall, the top plate forms the second accommodating groove in the lower space facing the lower shell, and the base plate forms the first accommodating groove in the upper space facing the lower shell.

[0020] In some embodiments, the jammer is used to jam the audio signal of the electronic device being a mobile phone, and the jammer is capable of performing audio jamming on a single mobile phone, and the first signal is an ultrasonic signal.

[0021] The jammer of the present application is a jammer of a new structure, which can not only be used to place electronic devices, but also can realize the functions of preventing eavesdropping and recording for the electronic devices placed therein. In addition, by setting the detection module, when it is detected that an electronic device is placed on the jammer, the jammer will start to work, thus saving power consumption and increasing the service life of related product components. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the three-dimensional structure of the first embodiment of the interference device provided in this application.

[0023] Figure 2 for Figure 1 An exploded view of the jammer is shown.

[0024] Figure 3 for Figure 2 Schematic diagram of the outer structure of the upper shell of the interference device shown.

[0025] Figure 4 for Figure 2 Schematic diagram of the inner structure of the upper shell of the interference device shown.

[0026] Figure 5 for Figure 2 Schematic diagram of the back structure of the lower shell of the interference device shown.

[0027] Figure 6 for Figure 2 A schematic diagram of the three-dimensional structure of the interference signal generating module of the interference device shown.

[0028] Figure 7 for Figure 2 An exploded view of the interference signal generating module of the interference device shown.

[0029] Figure 8 for Figure 2 A schematic diagram of the three-dimensional structure of the interference signal generating module of the interference device shown in another angle.

[0030] Fig. 9 for Figure 2 A schematic diagram showing an angle of a partial structure of the interference device shown.

[0031] Fig.10 for Figure 2 A schematic diagram showing a partial structure of the interference device from another angle.

[0032] Fig.11 for Figure 1 A schematic diagram showing an electronic device being placed in the first receiving groove of the interference device.

[0033] Fig.12 It is a structural block diagram of an implementation mode of the interference device 1 of the present application.

[0034] Fig.13 It is a structural block diagram of another implementation manner of the interference device 1.

[0035] Fig.14 It is a schematic diagram of the three-dimensional structure of the second embodiment of the interference device of the present application.

[0036] Fig.15 for Fig.14 Schematic diagram of the explosion structure of the interference device. Fig.16 It is a schematic diagram of the three-dimensional structure of the upper shell of the interference device.

[0037] Fig.16 It is a schematic diagram of the three-dimensional structure of the upper shell of the interference device.

[0038] Fig.17 This is a partial structural diagram of the interference signal generation module.

[0039] Fig.18 It is a schematic diagram of the three-dimensional structure of the third embodiment of the interference device of the present application.

[0040] Fig.19 for Fig.18 Schematic diagram of the explosion structure of the interference device shown.

[0041] Fig. 20 for Fig.18 A schematic diagram of the three-dimensional structure of the upper shell of the interference device shown.

[0042] Fig.21 for Fig.18 A schematic structural diagram of the pressure assist plate of the interference device shown.

[0043] Fig. 22 for Fig.18 A schematic structural diagram of the support pad of the interference device shown.

[0044] Fig.23 It is a schematic diagram of the three-dimensional structure of the fourth embodiment of the interference device of the present application.

[0045] Fig.24 for Fig. 22 Schematic diagram of the explosion structure of the interference device shown.

[0046] Fig.25 for Fig.23 A schematic diagram of the three-dimensional structure of the upper shell of the interference device shown.

[0047] Fig.26 It is an exploded view of the fifth embodiment of the interference device of the present application. DETAILED DESCRIPTION

[0048] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limitations on the present application. In the description of the present application, it should be understood that the terms "first" and "second" are only used for description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number or arrangement order of the indicated technical features. Thus, the technical features defined as "first" and "second" may explicitly or implicitly include one or more of the technical features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0049] In the description of the present application, it should be noted that, unless otherwise clearly specified or limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. In addition, the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal", etc., which indicate orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application, and do not mean that the device or element referred to must have a specific orientation or position, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0050] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, only the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the present application. In addition, the present application may reuse reference numbers and / or reference letters in different examples, and such reuse is for the purpose of simplifying and clearly describing the present application, which itself does not indicate the specific relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and materials provided in the description below are only examples for realizing the technical solutions of the present application, but those of ordinary skill in the art should appreciate that the technical solutions of the present application may also be realized by other processes and / or other materials not described below.

[0051] Further, the described features and structures may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided so that the embodiments of the present application can be fully understood. However, those skilled in the art will appreciate that, even without one or more of the specific details, or by adopting other structures, components, etc., the technical scheme of the present application may also be put into practice. In other cases, known structures or operations are not shown or described in detail to avoid blurring the key points of the present application.

[0052] First, the present application mainly provides an interference device of a new structure, wherein the interference device of the new structure has a first receiving groove on one side of the outer shell, wherein the first receiving groove is used to place an electronic device therein, and the shell of the interference device has a receiving space inside, wherein the receiving space is used to receive the electronic components of the interference device. For example, the receiving space has a second receiving groove, wherein the second receiving groove is located beside the first receiving groove and is connected to the first receiving groove. The interference signal generating module of the interference device is placed in the second receiving groove. The interference signal generating module is used to emit a first signal toward the first receiving groove to interfere with the electronic device. The electronic device is, for example but not limited to, a mobile phone.

[0053] For example, but not limited to, the first signal includes at least two first sound wave signals with different frequencies, and the at least two first sound wave signals with different frequencies can generate a second sound wave signal that can be heard by the human ear after mixing, so that the electronic device placed in the first receiving groove can be audio-interfered. The first sound wave signal is, for example, a sound wave signal that cannot be heard by the human ear.

[0054] The above-mentioned new structure of the jamming device can not only meet the customized needs, but also interfere with specific electronic devices to achieve the functions of preventing recording and eavesdropping.

[0055] Secondly, the present application also provides an interference device having a detection module, wherein the detection module is used to detect whether an electronic device is placed in a first receiving groove of the interference device. When it is detected that an electronic device is placed in the first receiving groove, the processing module of the interference device controls the interference information generating module to send a first signal according to the detection result of the detection module.

[0056] Since the interference device has the detection module, the interference information generating module starts to transmit the first signal only when the detection module detects that an electronic device is placed in the first receiving groove. Therefore, the power consumption of the interference device can be reduced. In addition, the life of the interference information generating module can also be extended.

[0057] For the above-mentioned interference device with a new structure and the interference device with a detection module, this application records the implementation methods of multiple products respectively. The various specific implementation methods of the interference device of this application are described below.

[0058] Please also read Figures 1 to 11 , Figure 1 This is a schematic diagram of the three-dimensional structure of the first embodiment of the interference device provided by the present application. Figure 2 for Figure 1 An exploded view of the jammer is shown. Figure 3 for Figure 2 A schematic diagram of the outer structure of the upper shell of the interference device shown in FIG. Figure 4 for Figure 2 The schematic diagram of the inner structure of the upper shell of the interference device shown in FIG. Figure 5 for Figure 2 The schematic diagram of the back structure of the lower shell of the interference device shown in FIG. Figure 6 for Figure 2 The three-dimensional structural diagram of the interference signal generating module of the interference device shown in FIG. Figure 7 for Figure 2 The exploded diagram of the interference signal generating module of the interference device shown, Figure 8 for Figure 2 A schematic diagram of the three-dimensional structure of the interference signal generating module of the interference device shown in FIG. Fig. 9 for Figure 2 A schematic diagram showing a partial structure of the interference device at an angle, Fig.10 for Figure 2 A schematic diagram of a partial structure of the interference device from another angle, Fig.11 for Figure 1Schematic diagram of an interference device in which an electronic device is placed in the first receiving groove. The interference device 1 includes a shell 10 and an interference signal generating module 20. The shell 10 has a receiving space 11 inside, and the shell 10 has a first receiving groove 12 on one side outside. The first receiving groove 12 is connected to the receiving space 11, wherein the first receiving groove 12 is used to place the electronic device A. The interference signal generating module 20 is arranged in the receiving space 11. The interference signal generating module 20 is used to send a first signal to the first receiving groove 12 to interfere with the electronic device A. The electronic device A is, for example but not limited to, a mobile phone.

[0059] In some embodiments, the first signal includes, for example, at least two first sound wave signals of different frequencies, and the at least two first sound wave signals of different frequencies can generate a second sound wave signal audible to the human ear after mixing. The second sound wave signal audible to the human ear generated after mixing is used to perform audio interference on the electronic device A. The first sound wave signal is, for example, a sound wave signal that cannot be heard by the human ear. Specifically, the first sound wave signal is, for example but not limited to, a suitable sound wave signal such as ultrasound. However, it is also possible that the first sound wave signal can also be, for example, a sound wave signal audible to the human ear.

[0060] In addition, the first signal generated by the interference signal generating module 20 is not limited to the first sound wave signal, but may also be other suitable signals, such as electromagnetic wave signals, etc. As long as it can interfere with the electronic device A and achieve the functions of anti-eavesdropping and anti-recording, it should fall within the protection scope of this application.

[0061] It should be noted that, in the present application, the first signal is mainly described by taking the first sound wave signal as an example, but this should not be understood as a limitation to the present application.

[0062] Since the shell 10 of the interference device 1 of the present application has the first accommodating groove 12, and the first accommodating groove 12 is connected to the receiving space 11 inside the shell 10, the interference signal generating module 20 located in the receiving space 11 can emit a first signal into the first accommodating groove 12 to perform audio interference on the electronic device A in the first accommodating groove 12, so that the electronic device A records noise when recording, or the voice signal of the on-site conversation cannot be heard when the electronic device A is remotely eavesdropped.

[0063] It should be noted that the interference device 1 does not affect the normal telephone access of the electronic device A in the first receiving slot 12. When the call is connected, the user needs to pick up the electronic device A to make a normal call.

[0064] Optionally, the housing 10 is provided with recessed portions B on the side walls 132 on opposite sides of the first receiving groove 12. The first receiving groove 12 is connected to the outside of the housing 10 through the recessed portions B. However, in some other embodiments, the number of the recessed portions B may also be one, that is, the recessed portion B is provided on one of the side walls 132.

[0065] The side wall 132 can block the electronic device A so that the electronic device A can be accommodated in the first receiving groove 12. The recessed portion B allows the user to observe at any time whether the electronic device A is placed in the first receiving groove 12 for anti-eavesdropping and anti-recording treatment to avoid omissions. In addition, it also allows the user to observe the status of the electronic device A at any time.

[0066] Optionally, the recessed portion B is located in the middle of each side wall 132, and the side walls 132 provided with the recessed portion B are located on opposite sides of the housing 10 in the width direction. Further optionally, the height of the side wall 132 gradually decreases from both ends to the middle.

[0067] In some embodiments, the receiving space 11 of the housing 10 includes a second receiving groove 110, the number of the second receiving groove 110 is at least one, and the second receiving groove 110 is arranged beside the first receiving groove 12 in the length direction. The first receiving groove 12 is connected to the second receiving groove 110. The first signal emitted by the interference signal generating module 20 is emitted from the second receiving groove 110 to the first receiving groove 12.

[0068] Preferably, the second accommodating groove 110 is higher than a bottom surface F1 of the first accommodating groove 12 in a height direction. The bottom surface F1 is a side surface of the housing 10 and is used to carry the electronic device A.

[0069] In this embodiment, the interference signal generating module 20 is disposed in the second containing groove 110 , and a side of the interference signal generating module 20 for emitting the first signal faces the first containing groove 12 .

[0070] Optionally, the receiving space 11 includes two second containing grooves 110, which are respectively arranged on opposite sides of the first containing groove 12 in the length direction, and each of the second containing grooves 110 is respectively provided with an interference signal generating module 20. However, it can be changed that in some embodiments, the interference signal generator 201 for emitting the first signal in the interference signal generating module 20 may not be arranged in the second containing groove 110, for example but not limited to, as described in the technical solution of the fifth embodiment of the present application. For another example, the interference signal generating module 20 is not placed in the second containing groove 110 at all, and the second containing groove 110 is saved, which is also possible.

[0071] Since the second receiving grooves 110 are respectively arranged on opposite sides of the first receiving groove 12, the direction in which the first signal is emitted can be increased, and audio interference can be performed on the electronic device A at multiple angles. In addition, the user is not limited to the direction in which the electronic device A is placed, thereby improving the user experience.

[0072] Specifically, in this embodiment, the housing 10 includes an upper shell 13 and a lower shell 14. The upper shell 13 and the lower shell 14 cooperate to form the receiving space 11. The first receiving groove 12 is formed above the side of the upper shell 13 facing away from the lower shell 14.

[0073] Optionally, the upper shell 13 includes a substrate 131, a side wall 132, and a top plate 133. The substrate 131 includes a first surface F1 and a second surface F2. The first surface F1 is the outer surface of the substrate 131, and the outer surface faces away from the lower shell 14. The second surface F2 is the inner surface of the substrate 131, and the inner surface faces the lower shell 14. The side wall 132 is located at the periphery of the substrate 131 and is higher than the first surface F1 in the direction facing away from the lower shell 14. The top plate 133 is located on at least one side of the substrate 131 and is higher than the first surface F1 in the direction facing away from the lower shell 14, and the top plate 133 is connected to the side wall 132. The first accommodating groove 12 is formed on the side of the substrate 131 facing away from the lower shell 14. The second accommodating groove 110 is formed on the side of the top plate 133 facing the lower shell 14.

[0074] In this embodiment, the base plate 131 , the side wall 132 , and the top plate 133 are an integrated structure.

[0075] Optionally, the side wall 132 of the upper shell 13 includes an inner wall 1321 and an outer wall 1322, and the outer wall 1322 is located at the periphery of the inner wall 1321. The inner wall 1321 extends upward from the base plate 131 in a direction away from the lower shell 14. The first surface F1 of the base plate 131 and the inner wall 1321 form the first receiving groove 12. The top plate 133 is connected between the inner wall 1321 and the outer wall 1322. The top plate 133, the outer wall 1322 and the inner wall 1321 form the second receiving groove 110.

[0076] Optionally, the outer side wall 1322 includes a first portion B1 and a second portion B2 connected to each other. The first portion B1 is a portion that is higher than the first surface F1 in the direction facing away from the lower shell 14, and the second portion B2 is a portion that is higher than the second surface F2 in the direction facing the lower shell 14. The second portion B2 is used to cooperate with the lower shell 14 to form the receiving space 11. The first portion B1 is used to cooperate with the top plate 133 and the base plate 131 to form the first receiving groove 12 and the second receiving groove 110. In this embodiment, further optionally, the lower shell 14 has no corresponding side wall. Of course, the lower shell 14 may also be provided with a corresponding side wall.

[0077] However, in some embodiments, the outer side wall 1322 does not have the second portion B2, and the lower shell 14 is correspondingly provided with a side wall 149 extending toward the upper shell 13 to cooperate with the upper shell 13 to form the receiving space 11. For example, see the technical solution described in the third embodiment.

[0078] Optionally, in this embodiment, an opening K is provided on the inner side wall 1321 disposed between the first accommodating groove 12 and the second accommodating groove 110, so that the first accommodating groove 12 is connected to the second accommodating groove 110. The interference signal generating module 20 is exposed at the opening K, and a partition 202 is provided on the interference signal generating module 20, and the partition 202 includes a plurality of through holes K1 for emitting the first signal. Thus, the first signal emitted by the interference signal generating module 20 can be emitted from the second accommodating groove 110 to the first accommodating groove 12.

[0079] However, it can be changed that in other embodiments, the inner wall 1321 has a plurality of through holes K1, the interference signal generating module 20 is arranged behind the inner wall 1321, and the partition 202 with a plurality of through holes K1 may not be arranged on the interference signal generating module 20, for example, refer to the technical solution described in the third embodiment.

[0080] Optionally, a positioning column 1101 is provided in the second receiving groove 110 for cooperating with the positioning hole 208 on the interference signal generating module 20, and a screw 209 passes through the positioning hole 208 and cooperates with a lock hole in the positioning column 1101, thereby fixing the interference signal generating module 20 in the second receiving groove 110.

[0081] Optionally, the interference signal generating module 20 includes at least two interference signal generators 201 and a partition 202. The interference signal generator 201 is used to emit the first signal, for example but not limited to, the interference signal generator 201 is used to convert the electrical signal into a first sound wave signal, and the first sound wave signal is a sound wave signal with a preset frequency. The preset frequency is, for example but not limited to, any value in the frequency range of 40 to 40.3KHZ. The partition 202 has a plurality of through holes K1. The partition 202 is exposed at the opening K. The first signal is emitted into the first accommodating groove 12 through the plurality of through holes K1 on the partition 202.

[0082] In the present embodiment, each interference signal generating module 20 includes four interference signal generators 201, which are used to respectively emit first sound wave signals of different frequencies. The first sound wave signal is, for example but not limited to, an ultrasonic signal. The interference signal generator 201 is, for example but not limited to, an ultrasonic transducer. However, it can be changed that in other embodiments, the number of the interference signal generators 201 can also be two, three, five, or even more. In addition, the first signal generated by the interference signal generator 201 is not limited to the first sound wave signal, and can also be other suitable signals, such as electromagnetic wave signals, etc., as long as it can interfere with the electronic device A and realize the functions of anti-eavesdropping and anti-recording, it should fall within the protection scope of the present application. In the present application, the first signal is mainly described as the first sound wave signal as an example, but it should not be understood as a limitation of the present application.

[0083] Based on the sound wave mixing technology, first sound wave signals with frequencies of F1, F2, F3, and F4 are sent through four interference signal generators 201. The first sound wave signals with frequencies of F1, F2, F3, and F4 are sound wave signals that are inaudible to the human ear. These four first sound wave signals will produce a mixing effect at the microphone circuit of electronic device A to generate second sound wave signals with frequencies of |F1-F2|, |F1-F3|, |F1-F4|, |F2-F3|, |F2-F4|, and |F3-F4|. The second sound wave signals with frequencies of |F1-F2|, |F1-F3|, |F1-F4|, |F2-F3|, |F2-F4|, and |F3-F4| are sound wave signals that are audible to the human ear. Electronic device A will record the sound wave signal, and the content of the actual voice conversation will be shielded, effectively protecting personal privacy.

[0084] In the present application, two interference signal generating modules 20 are used, and each interference signal generating module 20 includes four interference signal generators 201, which respectively and simultaneously send four first sound wave signals with different frequencies to the first accommodating groove 12. After the mixing effect is generated at the microphone circuit of the electronic device A, multiple second sound wave signals with different frequencies that can be heard by the human ear are generated, which has a better audio interference effect on the electronic device A.

[0085] See also Figures 6 to 8 Optionally, the interference signal generating module 20 further includes a sub-board 205, a positioning frame 203, and a gauze 204. The at least two interference signal generators 201 are arranged on the sub-board 205 and are electrically connected to the sub-board 205. The sub-board 205 is, for example but not limited to, a printed circuit board. The positioning frame 203 includes at least two through holes K2. Each interference signal generator 201 is arranged in the through hole K2 of the positioning frame 203. The positioning frame 203 is located on the side of the partition 202 facing away from the first accommodating groove 12. The gauze 204 is arranged between the partition 202 and the positioning frame 203.

[0086] The interference signal generating module 20 is an independent module structure, which is easy to install and disassemble. The partition plate 202 is made of metal material, and has a good appearance. The positioning frame 203 and the gauze 204 not only prevent the user from directly viewing the internal structure of the interference signal generator 201 and the auxiliary board 205, but also play the role of dust prevention and aesthetics.

[0087] In some embodiments, one or more of the partition 202, the positioning frame 203, and the gauze 204 may be omitted.

[0088] Further optionally, in the present embodiment, a side of the interference signal generator 201 for emitting the first signal is arranged facing the first containing groove 12 .

[0089] However, alternatively, in some other embodiments, the side of the interference signal generator 201 for emitting the first signal may also be directed toward the center line L-L' along the length direction of the first receiving groove 12 (see Fig.17 ) is tilted, and the range of the tilt angle is, for example but not limited to, 15 to 30 degrees. In this way, the radiation range of the first signal can be increased to prevent blind spots. In addition, the first signal superposition can also increase the amplitude of the first signal, and the energy of the first signal is more concentrated. Optionally, the tilt angle is, for example, 15 degrees. That is, the interference signal generator 201 is along the center line L1-L1' in the height direction (see Fig.17 ) and the center line LL' of the first receiving groove 12 along the length direction have an acute angle of 15 degrees. Fig.17 It should be noted that, in order to better illustrate the tilt angle, the center line LL' of the first receiving groove 12 along the length direction is translated accordingly.

[0090] Optionally, the upper shell 13 further comprises a groove 135 on the first surface F1. A support structure 136 is disposed in the groove 135. The support structure 136 is used to support and / or prevent the electronic device A placed in the first receiving groove 12 from slipping.

[0091] The support structure 136 includes a support pad 1361. Optionally, a gap is formed on the support pad 1361. The gap can, for example, allow the first sound wave signal to pass through, thereby achieving audio interference with microphones in all directions of the electronic device A. The support pad 1361 is a wheat awn structure (see Fig. 22 ) or a rubber pad, the gap on the awn structure or the gap on the rubber pad can pass the first signal. The awn structures are arranged in an array, for example, and the passing effect of the first signal will be better, thereby achieving a better interference effect on the electronic device A. The awn structure supports and balances the electronic device A, and is suitable for electronic devices A with different bottom shapes (such as a protruding or non-protruding rear lens). The awn structure has friction and has an auxiliary fixing effect on the recording device.

[0092] Further optionally, there are two grooves 135 , which are respectively disposed at two ends of the first surface F1 .

[0093] For example but not limited to, the thickness of the portion of the middle region of the substrate 131 where the groove 135 is not provided is the same as the thickness of the region of the substrate 131 where the groove 135 is provided.

[0094] Optionally, the interference device 1 further includes a wireless charging module 40 for wirelessly charging the electronic device A.

[0095] Optionally, a third receiving groove 134 is provided on the middle area of ​​the second surface F2 of the substrate 131 where the groove 135 is not provided, for accommodating the coil 401 of the wireless charging module 40. Thus, the interference device 1 has a compact structure and a thinner thickness.

[0096] In this embodiment, a plurality of first positioning columns Z1 and a plurality of second positioning columns Z2 are further formed on the second surface F2 of the substrate 131. The plurality of second positioning columns Z2 are located in the middle area of ​​the second surface F2. The plurality of first positioning columns Z1 are located at the two end areas of the second surface F2. The height of the plurality of first positioning columns Z1 is less than the height of the plurality of second positioning columns Z2. The plurality of first positioning columns Z1 have locking holes K3. The lower shell 14 is provided with a plurality of through holes 142. When the upper shell 13 is installed with the lower shell 14, the screws 145 are inserted into the through holes 142 on the lower shell 14 and are locked and fixed with the locking holes K3.

[0097] Optionally, a protrusion 143 is formed on a surface of the lower shell 14 facing the upper shell 13. When the lower shell 14 and the upper shell 13 are installed together, the plurality of first positioning columns Z1 and the plurality of second positioning columns Z2 are in conflict with the protrusion 143, and a limiting groove 144 is formed above the through hole 142 of the lower shell 14. The opening diameter of the limiting groove 144 is larger than the diameter of the through hole 142 of the lower shell 14. The limiting groove 144 is used to accommodate the end of the first positioning column Z1.

[0098] Further optionally, a groove (not shown) is provided on the side of the lower shell 14 facing away from the upper shell 13. The through hole 142 on the lower shell 14 penetrates the groove. An anti-skid pad 146 is provided in the groove to prevent slipping when the interference device 1 is placed flat on an object such as a desktop.

[0099] In this embodiment, the interference device 1 further includes a main board 30, which is located between the upper shell 13 and the lower shell 14. The main board 30 is electrically connected to the auxiliary board 205 and is used to drive the interference signal generating module 20 to send out a first signal. The edge area of ​​the main board 30 includes a plurality of through holes 300. The plurality of first positioning columns Z1 and the plurality of second positioning columns Z2 are used to pass through the through holes 300 on the main board 30 and to collide with the lower shell 14.

[0100] Optionally, a plurality of latching structures 138 are further formed on the second surface F2 of the substrate 131 and are located at the periphery of the plurality of second positioning pillars Z2 . The latching structures 138 are used to fix the mainboard 30 .

[0101] For example but not limited to, the locking structure 138 is a protruding structure, and a hook G is formed at one end away from the base plate 131 , and the hook G is used to buckle and fix the main board 30 on the base plate 131 .

[0102] In this embodiment, the length of the interference device 1 is, for example, no greater than 22 cm, and the width is, for example, no greater than 12 cm. The interference device 1 can, for example, only interfere with a single mobile phone. In other words, the interference device 1 can only interfere with one mobile phone at a time. However, in other embodiments, the interference device 1 can also be a device of other suitable sizes and can interfere with multiple electronic devices.

[0103] The above-mentioned interference device 1 of the present application is an interference device of a completely new structure, on which electronic device A can be placed, and can interfere with electronic device A to achieve different customized requirements, and can interfere with specific electronic device A to achieve the functions of preventing recording and eavesdropping.

[0104] It should be noted that the interference device 1 of the above-mentioned new structure of the present application is not limited to the forms recorded in the above-mentioned specific implementation modes, and may also have other modified forms. As long as it is easy for a general technician in this field to think of various implementation modes based on the technical content recorded in this application, the technical solutions should fall within the protection scope of this application.

[0105] The inventors have found through a lot of analysis and research that if the interference signal generator 201 of the interference device 1 is in a working state for a long time, it will cause power consumption loss on the one hand, and shorten the life of the interference signal generator 201 on the other hand. Technical problems. Furthermore, the user is not clear whether the electronic device A is performing the interference function after being placed in the first receiving groove 12. Based on this, the inventors creatively proposed a further solution, adding a detection module 50 to the interference device 1. The detection module 50 is arranged in the receiving space 11, and is used to detect whether an electronic device A is placed in the first receiving groove 12. The processing module 302 of the interference device 1 controls whether the interference signal generating module 20 starts working, that is, whether to start emitting the first signal to the first receiving groove 12, according to the detection result of the detection module 50.

[0106] Specifically, when the detection module 50 detects that an electronic device A is placed in the first receiving slot 12, the detection module 50 outputs a corresponding detection signal to the processing module 302, and the interference signal generating module 20 starts to transmit a first signal to the first receiving slot 12 under the driving control of the processing module 302. Optionally, when the detection module 50 does not detect that an electronic device A is placed in the first receiving slot 12, the interference signal generating module 20 does not work. Thus, the interference device 1 not only reduces power consumption, but also extends its life. In addition, an indication module 60 can also be added to the interference device 1. When the detection module 50 detects that an electronic device A is placed in the first receiving slot 12, the processing module 302 correspondingly controls the indication module 60 to issue a corresponding prompt, so that the user can clearly know that the interference device 1 is in an audio interference state.

[0107] Please refer to further Fig.12 , Fig.12 This is a structural block diagram of an embodiment of the interference device 1 of the present application. The processing module 302 includes a processing unit 3021, and the processing unit 3021 is connected to the detection module 50, and is used to send a second signal to the interference signal generating module 20 when receiving the detection signal, so as to control the interference signal generating module 20 to send the first signal. In this embodiment, the processing unit 3021 sends four second signals with frequencies of F1, F2, F3, and F4, respectively, and the second signal is, for example, a square wave signal. The frequencies F1, F2, F3, and F4 are different from each other. However, it is possible to change that in other embodiments, the processing unit 3021 may also send two, three, five, or more second signals with different frequencies. It is possible to change that the second signal may also be a suitable signal such as a sine wave signal, and the present application does not limit this.

[0108] Optionally, the processing unit 3021 includes any one or more of a processor or an oscillating circuit, and the processor or the oscillating circuit is used to generate the four second signals with different frequencies. Regardless of whether it is through software or hardware, or a combination of software and hardware, all technical solutions that can generate multiple second signals with different frequencies should fall within the scope of protection of this application, and are not limited to the processor or oscillating circuit described herein.

[0109] Optionally, the processing module 302 further includes a driving unit 3022, which is connected between the processing unit 3021 and the interference signal generating module 20, and is used to amplify the four second signals with different frequencies and output the amplified second signals to the interference signal generating module 20, so as to drive the interference signal generating module 20 to output the four first signals with different frequencies into the first containing groove 12.

[0110] The main board 30 includes a circuit board 301, a processing module 302, a charging interface 303, a wireless charging drive circuit 304, a capacitance detection circuit 305, and a power management module 306. The charging interface 303 is located on one end of the circuit board 301 facing the upper shell 13. The processing module 302, the wireless charging drive circuit 304, the capacitance detection circuit 305, and the power management module 306 are located on the side surface of the circuit board 301 facing away from the upper shell 13. However, the present application does not limit the position of the components on the circuit board 301. For example, the processing module 302 may also be located on the side surface of the circuit board 301 facing the upper shell 13.

[0111] It should be further explained that the processing module 302, the wireless charging driving circuit 304, the capacitance detection circuit 305, and the power management module 306 are Figure 2 and Fig.10 The diagram only uses boxes to illustrate, and does not represent the actual product form.

[0112] The detection module 50 includes a detection electrode 501 and the capacitance detection circuit 305. The detection electrode 501 is used to form a detection capacitance with the electronic device A. Optionally, the detection electrode 501 is arranged on the inner surface of the upper shell 13. The capacitance detection circuit 305 is used to drive the detection electrode 501 to perform capacitance sensing. For example, but not limited to, the detection module 50 realizes capacitance sensing by self-capacitance or mutual capacitance detection. When the shell of the electronic device A is metal, the metal can interact with the detection electrode 501 to form a detection capacitance. When the shell of the electronic device A is not metal, the conductor in the electronic device A interacts with the detection electrode 501 to form a detection capacitance.

[0113] The detection electrode 501 is arranged on the inner surface of the upper shell 13 by a fixing method such as attachment. The detection electrode 501 is, for example but not limited to, a suitable conductive material such as a copper sheet. The detection electrode 501 is connected to the capacitance detection circuit 305 through a wire.

[0114] By adopting the capacitive detection method, the electronic device A can be detected relatively easily with high detection accuracy. In addition, there is no need to make a special selection of the material of the shell 10, as long as the material of the shell 10 is insulating.

[0115] However, the inventor found through a large number of experiments and research and analysis that the wire is prone to breakage during product installation and product use, causing technical problems such as affecting the quality stability of the product, and then the inventor creatively proposed a new technical solution. The detection electrode 501 is made on a flexible circuit board 502, and one end of the flexible circuit board 502 provided with the detection electrode 501 is arranged on the inner surface of the upper shell 13, and the other end of the flexible circuit board 502 is connected to the capacitance detection circuit 305 on the side of the mainboard 30 facing the lower shell 14. The flexible circuit board 502 is relatively stable during product installation and product use, and is not prone to technical problems such as breakage, thereby improving the quality stability of the interference device 1.

[0116] The wireless charging module 40 includes the coil 401 and the wireless charging driving circuit 304. The wireless charging driving circuit 304 is electrically connected to the coil 401, and the two cooperate to realize wireless charging of the electronic device A. The wireless charging module 40 can also be omitted in the interference device 1.

[0117] The processing module 302 is electrically connected to the interference signal generating module 20, the detection module 50, the power management module 306, and the indication module 60, respectively. The power management module 306 is electrically connected to the charging interface 303, the detection module 50, and the wireless charging module 40, respectively. The power management module 306 receives a power supply voltage from the outside through the charging interface 303, and converts the received external power supply voltage into a first power supply voltage. The power management module 306 provides the first power supply voltage to the processing unit 3021 when working, and starts to provide the second power supply voltage to the driving unit 3022 when the processing unit 3021 receives the detection signal, so that the driving unit 3022 starts working. The first power supply voltage is, for example but not limited to, 3.3V, and the second power supply voltage is, for example but not limited to, 12V.

[0118] When the detection module 50 does not detect that the electronic device A is placed in the first receiving groove 12, the power management module 306 does not output the second power supply voltage to the driving unit 3022. Thus, the purpose of saving power consumption can be achieved.

[0119] The power management module 306 is further configured to provide a third power supply voltage to the wireless charging driving circuit 304. The third power supply voltage is, for example but not limited to, 12V.

[0120] Optionally, the indication module 60 includes a first indication unit 601 and a second indication unit 602. The first indication unit 601 and the second indication unit 602 are, for example but not limited to, suitable indication elements such as LED lights and display screens. In this embodiment, the first indication unit 601 is a power indicator light, and the second indication unit 602 is a working indicator light. When the power management module 306 is connected to an external power supply voltage, the first indication unit 601 is a red light that lights up, and when the wireless charging module 40 is working, the first indication unit 601 switches from a red light to a blue light, that is, switches from a first indication state (for example but not limited to a red light) to a second indication state (for example but not limited to a blue light).

[0121] The second indication unit 602 issues a third indication state, such as but not limited to a green light, after the processing unit 3021 receives the detection signal from the detection module 50. When the detection module 50 does not detect that the electronic device A is placed in the first receiving slot 12, the second indication unit 602 is, for example but not limited to, in a fourth indication state such as an off state or a red light.

[0122] By setting the indication module 60 and controlling the indication module 60 to issue a corresponding indication status according to the detection result of the detection module 50 through the processing module 302, the user can clearly understand the various working states of the interference device 1.

[0123] Optionally, the indication module 60 is disposed on a sub-board 205 of the interference signal generating module 20, and the indication module 60 and the interference signal generator 201 are respectively disposed on opposite sides of the sub-board 205. The indication module 60 is disposed adjacent to the charging interface 303, and the upper shell 13 is respectively provided with openings K10 at positions corresponding to the indication module 60 and the charging interface 303.

[0124] Since the interference device 1 of the present application further adds a detection module 50, and when the detection module 50 detects that the electronic device A is placed in the first receiving groove 12, the interference signal generating module 20 of the interference device 1, for example, starts to emit four first sound wave signals of different frequencies into the first receiving groove 12 to perform audio interference on the electronic device A, thereby realizing the functions of preventing theft and eavesdropping. In this way, not only can power consumption be saved, but also the purpose of extending product life can be achieved.

[0125] The above-mentioned detection technology scheme of adding the detection module 50 is not limited to the application in the above-mentioned new structure interference device 1, and can also be applied to other embodiments or interference devices of other structures. For example, the housing space of the interference device shell does not include a second receiving groove for accommodating the interference signal generating module, and the interference device includes another independent receiving space for accommodating the interference signal generating module. The interference device of such structure can add the detection technology scheme of the detection module 50. Therefore, as long as it is based on the core technical idea of ​​the present application, all the modified implementation methods that can be easily thought of by ordinary technicians in this field should fall within the protection scope of the present application.

[0126] Please continue reading Fig.12 Optionally, the interference device 1 further includes a rechargeable battery 70, which is, for example, disposed between the mainboard 30 and the lower shell 14. The rechargeable battery 70 can store electrical energy, so that when there is no external power supply voltage, the rechargeable battery 70 can be used for power supply.

[0127] See also Fig.13 , Fig.13 FIG. 1 is a structural block diagram of another embodiment of the interference device 1. Fig.12 The main difference between the embodiment of the present invention and the embodiment of the present invention is that in this embodiment, the interference device 1 does not include the detection module 50. Accordingly, when the interference device 1 is working, the power management module 306 continuously provides the first power supply voltage to the processing unit 3201 and continuously provides the second power supply voltage to the driving unit 3022. This is also possible. Fig.13 and Fig.12 The working relationship parts of the same or similar implementation methods will not be repeated here.

[0128] See also Figures 14 to 17 , Fig.14 It is a schematic diagram of the three-dimensional structure of the second embodiment of the interference device of the present application. Fig.15 for Fig.14 Schematic diagram of the explosion structure of the interference device. Fig.16 It is a schematic diagram of the three-dimensional structure of the upper shell of the interference device. Fig.17 The interference device 2 has the same main structure as the interference device 1, and the same or similar parts of the two are not repeated here. The main differences between the two are described below.

[0129] First, the detection module 50 is an infrared detection module. The infrared detection module is arranged in the receiving space 11, and is used to emit infrared rays into the first receiving groove 12, and receive infrared rays returned from the first receiving groove 12, so as to detect whether the electronic device A is placed in the first receiving groove 12. The processing module (not shown) is used to control whether the interference signal generating module 20 sends a first signal to the first receiving groove 12 according to the detection result output by the infrared detection module.

[0130] When the infrared detection module detects that an electronic device A is placed in the first receiving groove 12, the infrared detection module sends a corresponding detection signal to the processing module. The processing module controls the interference signal generating module 20 to start sending the first signal to the first receiving groove 12 according to the detection signal, so as to interfere with the electronic device A in the first receiving groove 12.

[0131] Optionally, an infrared transmission plate 139 is provided on the shell 10 in the area corresponding to the infrared detection module. For example, but not limited to, the infrared transmission plate 139 is provided in the middle area of ​​the upper shell 13. The infrared transmission plate 139 can transmit infrared rays. Optionally, the infrared detection module includes, for example, an infrared emitting device (not marked) and an infrared receiving device (not marked). The infrared rays emitted by the infrared emitting device are emitted into the first receiving groove 12 through the infrared transmission plate 139, and the infrared receiving device receives the infrared rays returned from the first receiving groove 12 through the infrared transmission plate 139, and converts the received infrared rays into corresponding electrical signals to detect whether the electronic device A is placed in the first receiving groove 12.

[0132] Second, the third receiving groove 134 for receiving the coil 401 of the wireless charging module 40 in the interference device 2 is disposed on the main board 30. Optionally, the third receiving groove 134 is directly opposite to the infrared transmission plate 139. However, alternatively, the third receiving groove 134 may also be disposed on one side of the inner surface of the upper shell 13.

[0133] Optionally, the infrared detection module is disposed on a side surface of the coil 401 of the wireless charging module 40 facing the infrared transmission plate 139. For example, the infrared detection module is located at the center of the coil 401 of the wireless charging module 40.

[0134] Third, the interference signal generating module 20 does not have a positioning frame 203 and a gauze 204, and the side of the interference signal generator 201 used to emit the first sound wave signal is inclined toward the center line L-L' of the first receiving groove 12 along the length direction, and the inclination angle range is, for example but not limited to, 15 degrees to 30 degrees. The inclination angle can be, for example, 15 degrees. That is, the acute angle between the center line L1-L1' of the interference signal generator 201 along the height direction and the center line L-L' of the first receiving groove 12 along the length direction is 15 degrees. It should be noted that in order to better illustrate the inclination angle, the center line L-L' of the first receiving groove 12 along the length direction is translated accordingly. However, the structure of the interference signal generating module 20 of the interference device 2 may be exactly the same as the structure of the interference signal generating module 20 of the interference device 1.

[0135] However, alternatively, the interference signal generating module 20 may also adopt the structure of the interference signal generating module 20 in the interference device 1, which is also possible.

[0136] See also Figures 18 to 22 , Fig.18 It is a schematic diagram of the three-dimensional structure of the third embodiment of the interference device of the present application. Fig.19 for Fig.18 Schematic diagram of the explosion structure of the interference device shown. Fig. 20 for Fig.18 A schematic diagram of the three-dimensional structure of the upper shell of the interference device shown. Fig.21 for Fig.18 A schematic structural diagram of the pressure assist plate of the interference device shown. Fig. 22 for Fig.18 The structure diagram of the support pad of the interference device is shown. The structure of the interference device 3 is roughly the same as that of the interference device 1, and the similarities or similarities between the two are not repeated here. The main differences between the two are mainly described below.

[0137] First, in terms of structure, the inner side wall 1321 of the upper shell 13 is not provided with the opening K, but with the plurality of through holes K1. The interference signal generating module 20 is arranged behind the inner side wall 1321. In addition, the outer side wall 1322 does not include the second portion B2 (see Figure 3 The lower shell 14 includes a base 148 and a side wall 149 extending from the base 148 toward the upper shell 13. The side wall 149 of the lower shell 14 matches with the outer side wall 1322 of the upper shell 13 to form the receiving space 11.

[0138] Second, the detection module 50 is a mechanical detection module. The mechanical detection module includes a mechanical switch 505, which is arranged on a side surface of the mainboard 30 facing the upper shell 13. The number of the mechanical switch is at least one. In this embodiment, the number of the mechanical switches 505 is two. Of course, the number of the mechanical switches 505 can also be three, four, or even more.

[0139] Third, an opening K4 penetrating to the receiving space 11 is formed in the groove 135 of the upper shell 13, and a support structure 136 is provided in the groove 135. The support structure 136 is provided with a protrusion T at a position facing the opening K4, and the protrusion T is used to press and trigger the mechanical switch 505 when the electronic device A is placed in the first receiving groove 12. Optionally, the support structure 136 includes a support pad 1361 and a pressure assisting plate 1362, and the protrusion T is provided at a position of the pressure assisting plate 1362 facing the opening K4. Further optionally, the mechanical switch 505 is located in the opening K4 and has a preset interval with the protrusion T.

[0140] Fourth, the auxiliary pressure plate 1362 is further formed with four positioning posts Z5 on a surface of one side facing the lower shell 14, and the groove 135 is formed with positioning holes K5 that match the four positioning posts Z5, and the screws 1363 pass through the positioning holes K5 and are locked with the locking holes in the positioning posts Z5, so as to fix the support structure 136 in the groove 135. Optionally, the support structure 136 can move up and down relative to the groove 135.

[0141] When working, the processing module 302 controls the interference signal generating module 20 to send the first signal to the first receiving groove 12 according to whether the mechanical switch 505 is pressed and triggered by the protrusion T. When the mechanical switch 505 is pressed and triggered by the protrusion T of the auxiliary pressure plate 1362, the detection module 50 detects that the electronic device A is placed in the first receiving groove 12, and sends a corresponding detection signal to the processing module 302. The processing module 302 controls the interference signal generating module 20 to start sending the first signal to the first receiving groove 12 according to the detection signal, so as to interfere with the electronic device A in the first receiving groove 12.

[0142] Preferably, the support pad 1361 is a awn structure, and a channel in the awn structure can transmit the first signal. The awn structure is, for example but not limited to, an awn array structure.

[0143] In this embodiment, when the electronic device A is placed in the first receiving groove 12 , the pressing trigger of the protrusion T on the mechanical switch 505 is a positive pressure trigger.

[0144] See also Figure 23 to Figure 25 , Fig.23 It is a schematic diagram of the three-dimensional structure of the fourth embodiment of the interference device of the present application. Fig.24 for Fig. 22 Schematic diagram of the explosion structure of the interference device shown. Fig.25 for Fig.23 The three-dimensional structure diagram of the upper shell of the interference device is shown. The structure of the interference device 4 is substantially the same as that of the interference device 1, and the similarities or similarities between the two are not repeated here. The main differences between the two are mainly described below.

[0145] First, the detection module 50 is a mechanical detection module. The mechanical detection module includes a mechanical switch 505, which is arranged on a side surface of the mainboard 30 facing the upper shell 13. The number of the mechanical switch 505 is at least one. In this embodiment, the number of the mechanical switches 505 is four. Of course, the number of the mechanical switches 505 can also be two, three, or even more.

[0146] Second, the upper shell 13 is provided with openings K8 at the bottom of both ends of the first receiving groove 12, and a support structure 136 rotatably connected to the upper shell 13 is formed on one side of the opening K8, and the support structure 136 covers the opening K8. The support structure 136 is formed with a protrusion (not shown) on the surface of one side facing the lower shell 14, and the protrusion is used to press and trigger the mechanical switch 505 when the electronic device A is placed in the first receiving groove 12.

[0147] Optionally, the support structure 136 includes a support pad 1361 and a pressure assisting plate 1362. The pressure assisting plate 1362 is located between the opening K8 and the support pad 1361, and is rotatably connected to the upper shell 13. Preferably, the pressure assisting plate 1362 is arranged at the opening K8 and is rotatably connected to the upper shell 13 by a hinge, that is, a rotating shaft connection. The protrusion is provided at the position of the pressure assisting plate 1362 facing the opening K8, and the protrusion is used to press and trigger the mechanical switch 505 when an electronic device A is placed in the first accommodating groove 12. Optionally, the support pad 1361 is used to support and / or prevent the electronic device A from slipping. Preferably, the support pad 1361 is a wheat awn structure, and the gap in the wheat awn structure can transmit a first signal. The wheat awn structure is, for example but not limited to, a wheat awn array structure.

[0148] During operation, the processing module 302 controls the interference signal generating module 20 to send the first signal to the first receiving groove 12 according to whether the mechanical switch 505 is pressed and triggered. When the mechanical switch 505 is pressed and triggered by the protrusion of the auxiliary pressure plate 1362, the detection module 50 detects that the electronic device A is placed in the first receiving groove 12, and sends a corresponding detection signal to the processing module 302. The processing module 302 controls the interference signal generating module 20 to start sending the first signal to the first receiving groove 12 according to the detection signal, so as to interfere with the electronic device A in the first receiving groove 12.

[0149] In this embodiment, when the electronic device A is placed in the first accommodating groove 12, the pressing trigger of the protrusion T on the mechanical switch 505 is an oblique pressure trigger, which is similar to the principle of a guillotine.

[0150] See also Fig.26 , Fig.26 1 is an exploded view of the fifth embodiment of the interference device of the present application. The structure of the interference device 5 is substantially the same as that of the interference device 1, and the similarities or similarities between the two are not repeated here. The main differences between the two are mainly described below.

[0151] First, the interference signal generating module 20 includes an interference signal generator 201, a partition 202, and a reflective structure 206. The partition 202 is exposed at the opening K of the inner wall 1321. The reflective structure 206 is disposed in the second receiving groove 110 and is located behind the partition 202.

[0152] Second, the interference signal generator 201 is disposed on one end surface of the mainboard 30 facing the second receiving groove 110. The interference signal generator 201 sends a first signal to the second receiving groove 110, which is reflected by the reflection structure 206 and then emitted to the first receiving groove 12.

[0153] Optionally, the reflective structure 206 has an inclined portion 2061 , and the inclined portion 2061 enables the first signal incident thereon to be emitted toward the first receiving groove 12 .

[0154] In this embodiment, the reflective structure 206 is provided in the second accommodating groove 110, so that the interference signal generator 201 can be provided on the mainboard 30, and the height of the reflective structure 206 can be smaller than the height of the interference signal generating module 20, and therefore, the height of the second accommodating groove 110 can be reduced accordingly, thereby the overall thickness of the interference device 5 can be thinned.

[0155] In the above-mentioned embodiments of the present application, the described features and structures can be combined in one or more embodiments in any suitable manner. For those skilled in the art, based on the above-mentioned embodiments of the present application, it can be easily thought of that more embodiments can be obtained by combining the technical solutions of different embodiments. For example, the structure of the housing 10 of the interference device 3 of the third embodiment can also be applied to other embodiments.

[0156] It needs to be reiterated that the focus of this application is:

[0157] First, the present application provides a new type of interference device 1, 2, 3, 4, 5, and the overall structure of the interference device 1, 2, 3, 4, 5 of the present application is not available in the prior art;

[0158] Second, the present application also provides an interference device with a detection module 50, and the structure of the interference device with a detection function is not limited to the interference devices 1, 2, 3, 4, 5 of the new structure recorded in this application, and can also be interference devices of other suitable structures. As long as it is possible to detect whether an electronic device A is placed on the interference device, and when it is detected that the electronic device A is placed, the processing module 302 starts to control the interference signal generating module 20 to send a first signal to interfere with the electronic device, all feasible embodiments should fall within the protection scope of the present application.

[0159] In the above embodiments, the interference devices 1, 2, 3, 4, and 5 can not only use sound wave interference to achieve the function of preventing eavesdropping and recording on the electronic device A, but also use any other suitable interference method such as electromagnetic interference to achieve the function of preventing eavesdropping and recording on the electronic device A. Therefore, the first signal is not limited to the first sound wave signal, but can also be any other suitable signal such as electromagnetic wave signal. That is, in addition to using audio interference, the effect of preventing eavesdropping and recording on the electronic device A can also be achieved by using electromagnetic interference and other methods.

[0160] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A jamming device, characterized in that: include: A housing, wherein the housing has a receiving space inside, and a first receiving groove is provided on one side of the housing outside. The receiving space of the housing includes a second receiving groove, the number of the second receiving groove is at least one, and the second receiving groove is arranged beside the first receiving groove in the length direction, the first receiving groove is connected with the second receiving groove, and the first receiving groove is used to place the electronic device; A reflective structure, located in the second containing groove; A plurality of interference signal generators are arranged in the receiving space, and the plurality of interference signal generators are used to send a first signal to the second receiving groove, which is reflected by the reflective structure and then emitted into the first receiving groove to perform audio interference on the electronic device; the first signal includes a sound wave signal.

2. The jamming device according to claim 1, characterized in that: The first signal includes at least two first sound wave signals of different frequencies, wherein the at least two first sound wave signals of different frequencies are sound wave signals that are inaudible to human ears, and the at least two first sound wave signals of different frequencies can generate a second sound wave signal audible to human ears after mixing.

3. The jamming device according to claim 1, characterized in that: The interference device further includes a mainboard, which is arranged in the receiving space. The multiple interference signal generators are arranged on the mainboard. The multiple interference signal generators are driven by the mainboard to send a first signal to the second receiving groove.

4. The jamming device according to claim 3, characterized in that: The shell includes an upper shell and a lower shell, and the upper shell and the lower shell cooperate to form the accommodating space. The first accommodating groove is formed above the side of the upper shell facing away from the lower shell, and the second accommodating groove is formed at the opposite ends of the upper shell and facing the inner side of the lower shell. The first accommodating groove is located between the oppositely arranged second accommodating grooves.

5. The jamming device according to claim 4, characterized in that: The reflective structure has an inclined portion, and the inclined portion enables the first signal incident thereon to be emitted toward the first receiving groove.

6. The jamming device according to claim 4, characterized in that: A plurality of through holes are disposed between the first accommodating groove and the second accommodating groove, and the plurality of through holes are used to pass the first signal.

7. The jamming device according to claim 3, characterized in that: The mainboard includes a detection module and a processing module. The detection module is used to detect whether an electronic device is placed in the first receiving slot. The processing module controls the multiple interference signal generators to start sending the first signal according to the detection result of the detection module.

8. The jamming device according to claim 7, characterized in that: When the detection module detects that an electronic device is placed in the first containing groove, the detection module outputs a corresponding detection signal to the processing module, and the processing module correspondingly controls the multiple interference signal generators to start sending the first signal.

9. The jamming device according to claim 7, characterized in that: The detection module includes a capacitive detection module, the capacitive detection module includes a capacitance detection circuit and a detection electrode, the detection electrode is used to form a detection capacitance with the electronic device, and the capacitance detection circuit is arranged on the mainboard to drive the detection electrode to perform capacitance sensing; or The detection module includes an infrared detection module, and the infrared detection module includes an infrared transmitting device and an infrared receiving device. The infrared transmitting device is used to transmit infrared rays to the first receiving groove, and the infrared receiving device is used to receive infrared rays returned by the first receiving groove, and detect whether an electronic device is placed in the first receiving groove based on the received infrared rays.

10. The interference device according to claim 4, characterized in that: The upper shell includes a base plate, a top plate, an inner wall, and an outer wall, the inner wall extends from the edge of the base plate in a direction away from the lower shell, the outer wall is located at the periphery of the inner wall, the top plate is higher than the base plate in a height direction away from the lower shell, and is located on opposite sides of the base plate and connected between the inner wall and the outer wall, the top plate forms the second accommodating groove in the lower space facing the lower shell, and the base plate forms the first accommodating groove in the upper space facing the lower shell.

11. The jamming device according to claim 1, characterized in that: The interference device is used to interfere with the audio signal of the electronic device, which is a mobile phone, and the interference device can interfere with the audio of a single mobile phone. The first signal is an ultrasonic signal.

Citation Information

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