A substrate for preparing a display device and a method for preparing a display device

Abstract

Embodiments of the present invention disclose a substrate for preparing a display device and a method for preparing a display device. The method for preparing a display device includes the following steps: providing a glass substrate having a first surface and a first side surface, and providing a first metal contact pad on the first surface near the first side surface; preparing a first covering film on the glass substrate and the first metal contact pad, and forming a groove between the first covering film and the first metal contact pad; coating the first side surface of the glass substrate to form a side metal film layer; separating the first covering film from the glass substrate. According to the present invention, by preparing a covering film with protrusions, a groove is formed between the covering film and the metal contact film, so that when coating, the metal material is deposited on the covering film and the metal contact film in the groove. Therefore, when the covering film is peeled off subsequently, the side metal film layer will not have problems such as tearing or disconnection.

Description

Technical Field

[0001] The present invention relates to the field of display panels, and particularly to a substrate for preparing a display device and a method for preparing a display device. Background Art

[0002] Currently, due to the requirements of splicing and borderless display technologies, a side metal wiring process for the glass double-sided manufacturing process needs to be developed. The side metal wiring process mainly uses a side PVD (Physical Vapor Deposition) coating process. Currently, the side PVD coating of the glass double-sided manufacturing process mainly adopts a method of rotating the substrate for coating, and the metal film is likely to accumulate at the edge of the PI film (masking film).

[0003] Please refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 are respectively schematic structural diagrams of a display panel before and after coating in the prior art. Before coating, first, a glass substrate 10 is provided. The glass substrate 10 has a first surface 11, a second surface 12, and a first side surface 13. A first metal contact pad 20 is provided on the first surface 11 near the first side surface 13, and a second metal contact pad 30 is provided on the second surface 12 near the first side surface 13. A first masking film 40 is prepared on the glass substrate 10 and the first metal contact pad 20, and a second masking film 50 is prepared on the glass substrate 10 and the second metal contact pad 30. The first side surface 12 of the glass substrate 10 is coated to form a side metal film layer 60. After coating, the side metal film layer 60 is likely to accumulate at the edges of the first masking film 40 and the second masking film 50. The first masking film 40 and the second masking film 50 will be removed during the subsequent peeling process, which may cause abnormalities such as tearing or disconnection of the side metal film layer 60 when the masking film is removed.

[0004] In view of this, it is necessary to develop a new method for preparing a display device to solve the problem of tearing or disconnection of the side metal film layer when removing the masking film. Summary of the Invention

[0005] An embodiment of the present invention provides a method for preparing a display device to solve the problem of tearing or disconnection of the side metal film layer when removing the masking film.

[0006] To solve the above technical problems, the embodiments of the present invention disclose the following technical solutions:

[0007] On the one hand, a substrate for preparing a display device is provided, including a glass substrate having a first surface and a first side surface, and a first metal contact pad is provided on the first surface near the first side surface; a first covering film is disposed on the glass substrate and the first metal contact pad, and a groove is formed between the first covering film and the first metal contact pad.

[0008] In addition to one or more of the above-disclosed features, or as an alternative, the groove has a bottom, a first side wall, and a second side wall. The first side wall is the surface of the first metal contact pad, and the second side wall is the surface of the first covering film. The second side wall forms a depression, so that when coating, the metal material can be deposited on the first side wall of the groove.

[0009] On the other hand, a method for preparing a display device is provided, including the following steps: providing a glass substrate having a first surface and a first side surface, and a first metal contact pad is provided on the first surface near the first side surface; preparing a first covering film on the glass substrate and the first metal contact pad, and a groove is formed between the first covering film and the first metal contact pad; coating the first side surface of the glass substrate to form a side metal film layer; separating the first covering film from the glass substrate; patterning the side metal film layer to form side wires; and coating a protective glue layer on the side wires.

[0010] The preparation method is applied to the technical fields of substrate splicing and narrow bezel display, and can also be used in the technical fields of Micro LED and Mini LED display.

[0011] In addition to one or more of the above-disclosed features, or as an alternative, the groove has a bottom, a first side wall, and a second side wall. The first side wall is the surface of the first metal contact pad, and the second side wall is the surface of the first covering film. The second side wall forms a depression, so that when coating, the metal material can be deposited on the first side wall of the groove. Because there is a groove between the first covering film and the first metal contact film, when coating, the metal material is deposited on the first side wall of the groove and the first covering film. Therefore, when the first covering film is peeled off subsequently, the side metal film layer will not have problems such as tearing or disconnection.

[0012] In addition to one or more of the above-disclosed features, or as an alternative, the cross-sectional shape of the depression includes one or more of a triangle, a rectangle, a semi-circle, and a trapezoid.

[0013] In addition to one or more of the features disclosed above, or as an alternative, the material of the first covering film includes one or more of polyimide, polyethylene, polyethylene naphthalate, polyethylene terephthalate, and cellophane.

[0014] In addition to one or more of the features disclosed above, or as an alternative, the thickness of the first covering film ranges from 1 μm to 10 μm. The thickness of the first covering film can be 3 μm, 5 μm, 6 μm, or 8 μm. Since the first covering film will be removed during subsequent peeling, the first covering film is set to be thinner to facilitate removal in subsequent processes.

[0015] In addition to one or more of the features disclosed above, or as an alternative, the equipment used for coating the first side of the glass substrate includes one or more of a magnetron sputtering device, a vacuum evaporation coating device, and a vacuum ion coating device.

[0016] In addition to one or more of the features disclosed above, or as an alternative, the metal materials used for coating the first side of the glass substrate include chromium, copper, aluminum, titanium metal, or a combination or alloy thereof.

[0017] In addition to one or more of the features disclosed above, or as an alternative, in the step of patterning the side metal film layer to form side conductors, the methods used for patterning the side metal film layer include one or more of laser, dry etching, and wet etching.

[0018] In addition to one or more of the features disclosed above, or as an alternative, the methods used for separating the first covering film from the glass substrate include one or more of laser peeling and mechanical peeling.

[0019] In addition to one or more of the features disclosed above, or as an alternative, the glass substrate further includes a second surface opposite to the first surface, and a second metal contact pad is provided on the second surface close to the first side; in the step of preparing the first covering film, a second covering film is further prepared on the second surface of the glass cover plate and the second metal contact pad, and a groove is also formed between the second covering film and the second metal contact pad; after separating the first covering film from the glass substrate, the side metal film layer connects the first metal contact pad and the second metal contact pad.

[0020] In addition to one or more of the features disclosed above, or as an alternative, the first surface is the front pixel area of the glass substrate, and the second surface is the back circuit area of the glass substrate.

[0021] In the present invention, the side conductors are arranged on the back of the display device, so that the width of the frame of the display device can be reduced, achieving a borderless display device.

[0022] One of the above technical solutions has the following advantages or beneficial effects: By preparing a masking film with protrusions, a groove is formed between the masking film and the metal contact film. Then, when coating, the metal material is deposited on the masking film and the metal contact film in the groove, and the metal film layers cannot be connected. Therefore, when the masking film is peeled off subsequently, the side metal film layer will not have problems such as tearing or disconnection. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The technical solutions and other beneficial effects of the present invention will become obvious by specifically describing the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0024] Figure 1 is a schematic structural diagram of a display panel before coating in the prior art;

[0025] Figure 2 is a schematic structural diagram of a display panel after coating in the prior art;

[0026] Figure 3 is a schematic structural diagram of a substrate for preparing a display device provided in Embodiment 1 of the present invention;

[0027] Figure 4 is a flowchart of a method for manufacturing a display device provided in Embodiment 1 of the present invention;

[0028] Figure 5 is a schematic cross-sectional structural diagram of Step 1 of the method for manufacturing a display device provided in Embodiment 1 of the present invention;

[0029] Figure 6 is a schematic cross-sectional structural diagram of Step 2 of the method for manufacturing a display device provided in Embodiment 1 of the present invention;

[0030] Figure 7 is a schematic cross-sectional structural diagram of Step 3 of the method for manufacturing a display device provided in Embodiment 1 of the present invention;

[0031] Figure 8 is a schematic overall structural diagram of Step 3 of the method for manufacturing a display device provided in Embodiment 1 of the present invention;

[0032] Figure 9 is a schematic overall structural diagram of Step 4 of the method for manufacturing a display device provided in Embodiment 1 of the present invention;

[0033] Figure 10 is a schematic overall structural diagram of Step 5 of the method for manufacturing a display device provided in Embodiment 1 of the present invention;

[0034] Figure 11 Schematic diagram of the overall structure of step 6 of the manufacturing method of the display device provided in Embodiment 1 of the present invention;

[0035] Figure 12 Cross-sectional structure diagram of step 2 of the manufacturing method of the display device provided in Embodiment 2 of the present invention;

[0036] Figure 13 Cross-sectional structure diagram of step 3 of the manufacturing method of the display device provided in Embodiment 2 of the present invention.

[0037] Reference numerals:

[0038] Glass substrate - 10; First surface - 11;

[0039] Second surface - 12; First side - 13;

[0040] First metal contact pad - 20; Second metal contact pad - 30;

[0041] First covering film - 40; Second covering film - 50;

[0042] Side metal film layer 60; Side wire - 70;

[0043] Protective glue layer - 80; Groove - 90;

[0044] Bottom - 91; First side wall - 92;

[0045] Second side wall - 93; Depression - 931. Detailed implementation manners

[0046] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0047] Embodiment 1

[0048] Please refer to Figure 3 , Figure 3Schematic structural diagram of a substrate for manufacturing a display device provided in this embodiment. The substrate for manufacturing a display device includes providing a glass substrate 10, a first covering film 40, and a second covering film 50.

[0049] The glass substrate 10 has a first surface 11 and a first side surface 13. A first metal contact pad 20 is provided on the first surface 11 close to the first side surface 13. The glass substrate 10 further includes a second surface 12 opposite to the first surface 11. A second metal contact pad 30 is provided on the second surface 12 close to the first side surface 13.

[0050] The first covering film 40 is on the glass substrate 10 and the first metal contact pad 20. A groove 90 is formed between the first covering film 40 and the first metal contact pad 20.

[0051] The second covering film 50 is on the second surface 12 of the glass cover plate and the second metal contact pad 30. A groove 90 is also formed between the second covering film 50 and the second metal contact pad 30.

[0052] The groove 90 has a bottom 91, a first side wall 92, and a second side wall 93. The first side wall 92 is the surface of the first metal contact pad 20, and the second side wall 93 is the surface of the first covering film 40. The second side wall 93 forms a depression 931.

[0053] Please refer to Figure 4 , Figure 4 Flow chart of the manufacturing method of the display device provided in this embodiment. The manufacturing method of the display device includes Step 1 - Step 6.

[0054] Step 1: Provide a glass substrate 10. The glass substrate 10 has a first surface 11 and a first side surface 13. A first metal contact pad 20 is provided on the first surface 11 close to the first side surface 13.

[0055] Please refer to Figure 5 , Figure 5 Cross-sectional structural schematic diagram of Step 1 of the manufacturing method. The glass substrate 10 further includes a second surface 12 opposite to the first surface 11. A second metal contact pad 30 is provided on the second surface 12 close to the first side surface 13.

[0056] The first surface 11 is the front pixel area of the glass substrate 10, and the second surface 12 is the back circuit area of the glass substrate 10.

[0057] Step 2: Prepare the first covering film 40 on the glass substrate 10 and the first metal contact pad 20. A groove 90 is formed between the first covering film 40 and the first metal contact pad 20.

[0058] Please refer to Figure 6 , Figure 6It is a schematic cross-sectional structure diagram of step 2 of the preparation method. While preparing the first cover film 40, a second cover film 50 is also prepared on the second surface 12 of the glass cover plate and the second metal contact pad 30, and a groove 90 is also formed between the second cover film 50 and the second metal contact pad 30.

[0059] The groove 90 has a bottom 91, a first side wall 92 and a second side wall 93. The first side wall 92 is the surface of the first metal contact pad 20, and the second side wall 93 is the surface of the first cover film 40. The second side wall 93 forms a depression 931. In this embodiment, the cross-sectional shape of the depression 931 is triangular.

[0060] In this embodiment, the material of the first cover film 40 is polyimide (PI). In other embodiments, the material of the first cover film 40 can also be high-temperature resistant materials such as polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and glassine paper (PT).

[0061] Since the first cover film 40 will be removed during the subsequent peeling process, the thickness of the first cover film 40 is relatively thin. The thickness range of this first cover film 40 is 1μm to 10μm. In this embodiment, the thickness of the first cover film 40 is 3μm. In other embodiments, the thickness of the first cover film 40 can also be 5μm or 6μm or 8μm. The relatively thin thickness of the first cover film 40 facilitates its removal in the subsequent process.

[0062] Step 3: Coat the first side 13 of the glass substrate 10 to form a side metal film layer 60.

[0063] Please refer to Figure 7 and Figure 8 , Figure 7 and Figure 8 They are respectively the schematic cross-sectional structure diagram and the overall structure diagram of step 3 of the preparation method. In this embodiment, the equipment used for coating the first side 13 of the glass substrate 10 is a magnetron sputtering device. In other embodiments, vacuum evaporation coating and vacuum ion coating equipment can also be used for coating the first side 13 of the glass substrate 10.

[0064] The metal materials used for coating the first side 13 of the glass substrate 10 include chromium, copper, aluminum, and titanium metals, or combinations or alloys of these metals.

[0065] Step 4: Separate the first cover film 40 from the glass substrate 10.

[0066] Please refer to Figure 9 , Figure 9It is a schematic diagram of the overall structure of step 4 of the preparation method, and it further includes separating the second cover film 50 from the glass substrate 10. In this embodiment, the method used to separate the first cover film 40 from the glass substrate 10 and the second cover film 50 from the glass substrate 10 is laser lift-off. In other embodiments, mechanical lift-off can also be used as the method to separate the first cover film 40 from the glass substrate 10 and the second cover film 50 from the glass substrate 10.

[0067] After separating the first cover film 40 from the glass substrate 10, the side metal film layer 60 connects the first metal contact pad 20 and the second metal contact pad 30.

[0068] Because there is a groove 90 between the first cover film 40 and the first metal contact pad 20, the first cover film 40 forms a depression 931 in the groove 90, so that when coating, the metal material is deposited on the first metal contact pad 20 and the first cover film 40 in the groove 90, and the side metal film layer 60 cannot be connected. Therefore, when the first cover film 40 is peeled off, the side metal film layer 60 will not have problems such as tearing or disconnection.

[0069] Step 5: Pattern the side metal film layer 60 to form side conductors 70.

[0070] Please refer to Figure 10 , Figure 10 It is a schematic diagram of the overall structure of step 5 of the preparation method. In this embodiment, the method used to pattern the side metal film layer 60 is the laser method. In other embodiments, the method used to pattern the side metal film layer 60 can also be the dry etching or wet etching method.

[0071] Step 6: Coat a protective glue layer 80 on the side conductors 70.

[0072] Please refer to Figure 11 , Figure 11 It is a schematic diagram of the overall structure of step 6 of the preparation method. The side conductors 70 in the present invention are arranged on the back of the display device, so as to be able to reduce the width of the display device frame and achieve a borderless display device.

[0073] The preparation method provided in this embodiment is applied to the technical fields of substrate splicing and narrow border display, and can also be used in the technical fields of Micro LED and Mini LED display.

[0074] In the preparation method provided in this embodiment, a cover film with a protrusion is prepared, so that there is a groove 90 between the cover film and the metal contact film, and then when coating, the metal material is deposited on the cover film and the metal contact film in the groove 90. Therefore, when the cover film is peeled off subsequently, the side metal film layer 60 will not have problems such as tearing or disconnection.

[0075] Example 2

[0076] The manufacturing method of the display device in this example is substantially the same as the corresponding steps in Example 1. The same steps can be referred to the corresponding descriptions in Example 1 and will not be elaborated here. The main difference between the two is that the shape of the groove 90 formed between the first cover film 40 and the first metal contact pad 20 is different from that of the groove 90 in Example 1.

[0077] Please refer to Figure 12 and Figure 13 , Figure 12 and Figure 13 which are respectively the cross-sectional structure diagrams of Steps 2 and 3 of the manufacturing method. The cross-sectional shape of the depression 931 formed by the first cover film 40 in the groove 90 is rectangular.

[0078] In other embodiments, the cross-sectional shape of the depression 931 can also be semicircular or trapezoidal. When coating, the metal material is deposited on the first metal contact pad 20 and the first cover film 40 in the groove 90. Therefore, when the first cover film 40 is peeled off subsequently, the side metal film layer 60 will not have problems such as tearing or disconnection.

[0079] The above has introduced in detail a manufacturing method of a display device provided by an embodiment of the present invention. Specific examples are used herein to elaborate the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present invention; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A substrate applied to the preparation of a display device, characterized in that, Comprising a glass substrate having a first surface and a first side surface, and a first metal contact pad is provided on the first surface close to the first side surface; a first cover film is disposed on the glass substrate and the first metal contact pad, and a groove is formed between the first cover film and the first metal contact pad; wherein, the opening of the groove faces the first side surface, the groove exposes the surface of the first metal contact pad away from the glass substrate and the side surface close to the first side surface, and the groove is used to disconnect the side metal film layer formed on the first side surface and the first metal contact pad from the side metal film layer formed on the first cover film.

2. The substrate according to claim 1, characterized in that, The groove has a bottom, a first side wall and a second side wall, the first side wall is the surface of the first metal contact pad, the second side wall is the surface of the first cover film, and the second side wall forms a depression so that the metal material can be deposited on the first side wall of the groove during film coating.

3. A method for preparing a display device, characterized in that, Including the following steps: providing a glass substrate having a first surface and a first side surface, and a first metal contact pad is provided on the first surface close to the first side surface; preparing a first cover film on the glass substrate and the first metal contact pad, a groove is formed between the first cover film and the first metal contact pad, the opening of the groove faces the first side surface, and the groove exposes the surface of the first metal contact pad away from the glass substrate and the side surface close to the first side surface; coating the first side surface of the glass substrate to form a side metal film layer, and the side metal film layer formed on the first side surface and the first metal contact pad is disconnected from the side metal film layer formed on the first cover film; separating the first cover film from the glass substrate; patterning the side metal film layer to form side conductors; coating a protective glue layer on the side conductors.

4. The preparation method according to claim 3, characterized in that, The groove has a bottom, a first side wall and a second side wall, the first side wall is the surface of the first metal contact pad, the second side wall is the surface of the first cover film, and the second side wall forms a depression so that the metal material can be deposited on the first side wall of the groove during film coating.

5. The preparation method according to claim 4, characterized in that, The cross-sectional shape of the depression includes one or more of triangle, rectangle, semi-circle and trapezoid.

6. The preparation method according to claim 3, characterized in that, The equipment used for coating the first side surface of the glass substrate includes one or more of magnetron sputtering equipment, vacuum evaporation coating, and vacuum ion coating equipment.

7. The preparation method according to claim 3, characterized in that, The metal material used for coating the first side surface of the glass substrate includes chromium, copper, aluminum, titanium metal or a combination or alloy thereof.

8. The preparation method according to claim 3, characterized in that, In the step of patterning the side metal film layer to form side conductors, the method used for patterning the side metal film layer includes one or more of laser, dry etching, and wet etching.

9. The preparation method according to claim 3, characterized in that, The method used for separating the first cover film from the glass substrate includes one or more of laser peeling and mechanical peeling.

10. The preparation method according to claim 3, characterized in that, The glass substrate further includes a second surface opposite to the first surface, and a second metal contact pad is disposed on the second surface close to the first side surface; in the step of preparing the first covering film, a second covering film is further prepared on the second surface of the glass substrate and the second metal contact pad, and a groove is also formed between the second covering film and the second metal contact pad; after separating the first covering film from the glass substrate, the side metal film layer connects the first metal contact pad and the second metal contact pad.

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