Wafer brushing device, wafer processing apparatus, and wafer brushing control method

Abstract

The application provides a wafer brushing device, a wafer processing equipment and a wafer brushing control method. The wafer brushing device comprises: a brushing component, which is used for contacting a wafer surface to brush the wafer surface; a driving component, which is drivingly connected with the brushing component, and at least part of the driving component is movably arranged along a preset direction to drive the brushing component to move along the preset direction; and a pressure detection component, which cooperates with the brushing component and the driving component to detect the acting force between the brushing component and the driving component through the pressure detection component. The wafer brushing device solves the problem of poor brushing effect of the wafer brushing device in the prior art.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, and more specifically, to a wafer brushing device, wafer processing equipment, and wafer brushing control method. Background Technology

[0002] In semiconductor manufacturing processes, dirt often accumulates on the back side of wafers due to process or environmental factors, requiring cleaning and planarization of the back side of the wafer.

[0003] In existing technology, track cleaning machines use a BST unit to clean and planarize the back side of wafers. During the back-side cleaning process, the physical height of the brush head is a constant hardware parameter of the machine. However, wafers deform due to their own stress and chuck adhesion, resulting in inconsistent physical heights across different parts. The fixed brush head height of the BST leads to inconsistent pressure between the brush head and the wafer in different areas, resulting in varying cleaning effects across the entire wafer. Even adjusting the brush head offset for different units and wafers cannot guarantee uniform cleaning across all areas of the wafer surface, leading to poor cleaning results. Summary of the Invention

[0004] The main objective of this invention is to provide a wafer brushing device, wafer processing equipment, and wafer brushing control method to solve the problem of poor wafer brushing effect in the prior art.

[0005] To achieve the above objectives, according to a first aspect of the present invention, a wafer cleaning apparatus is provided, comprising: a cleaning component for contacting a wafer surface to clean the wafer surface; a driving component drivenly connected to the cleaning component, at least a portion of the driving component being movably disposed along a preset direction to drive the cleaning component to move along the preset direction; and a pressure detection component, both the cleaning component and the driving component cooperating with the pressure detection component to detect the force between the cleaning component and the driving component.

[0006] Furthermore, the pressure detection component is communicatively connected to the drive component, and the drive component performs actions based on the detection results of the pressure detection component.

[0007] Furthermore, the drive components include a motor and a controller. Both the motor and the pressure detection component are communicatively connected to the controller, which controls the motor's movement based on the detection results from the pressure detection component.

[0008] Furthermore, the pressure detection component includes a cylinder, which includes a cylinder body and a cylinder rod, a portion of which is telescopically mounted in the cylinder body; wherein the cylinder body is connected to the drive component and the cylinder rod is connected to the brushing component; or, the cylinder body is connected to the brushing component and the cylinder rod is connected to the drive component.

[0009] Furthermore, the pressure detection component also includes a pneumatic pressure sensor, whose pressure detection probe is installed inside the cylinder to detect the pneumatic pressure inside the cylinder.

[0010] According to a second aspect of the present invention, a wafer processing apparatus is provided, which includes the wafer brushing device described above.

[0011] According to a third aspect of the present invention, a wafer brushing control method is provided for the aforementioned wafer brushing apparatus or for the aforementioned wafer processing equipment. The wafer brushing control method includes: acquiring force data obtained by a pressure detection component of the wafer brushing apparatus; and controlling the operation of a drive component of the wafer brushing apparatus based on the force data.

[0012] Furthermore, based on the force data, the operation of the drive component of the wafer brushing device is controlled, including: based on the force data, the operation of the drive component is controlled using a negative feedback control method.

[0013] According to a fourth aspect of the present invention, a wafer brushing control device is provided for use in the aforementioned wafer brushing device or for use in the aforementioned wafer processing equipment. The wafer brushing control device includes: an acquisition unit for acquiring force data acquired by a pressure detection component of the wafer brushing device; and a control unit for controlling the operation of a drive component of the wafer brushing device based on the force data.

[0014] According to a fifth aspect of the present invention, a non-volatile storage medium is provided, the non-volatile storage medium including a stored program, wherein, when the program is running, the device where the non-volatile storage medium is located is controlled to perform the above-described wafer brushing control method.

[0015] According to a sixth aspect of the present invention, a processor is provided, wherein a program is stored within the processor, and the program executes the above-described wafer brushing control method when it is run.

[0016] According to a seventh aspect of the present invention, a wafer processing system is provided, comprising: the wafer brushing apparatus described above, or the wafer processing equipment described above; and the processor described above.

[0017] The wafer cleaning apparatus using the technical solution of the present invention includes a cleaning component, a driving component, and a pressure detection component. The cleaning component is used to contact the wafer surface to clean the wafer surface. The driving component is drivenly connected to the cleaning component, and at least a portion of the driving component is movably arranged along a preset direction to drive the cleaning component to move along the preset direction. Both the cleaning component and the driving component cooperate with the pressure detection component to detect the force between the cleaning component and the driving component. When the wafer brushing device is in use, the driving component drives the brushing component to move in a preset direction, thereby squeezing the brushing component into contact with the wafer to achieve the brushing of the wafer. The force between the brushing component and the wafer is transmitted between the brushing component and the driving component, and is then captured by the pressure detection component. The force detected by the pressure detection component directly reflects the pressure applied by the brushing component to the wafer. Based on this, the operation of the driving component can be more targeted to ensure that there is appropriate pressure between the contact point between the brushing component and the wafer when the wafer brushing device is working. This helps to ensure the brushing effect of the wafer and solves the problem of poor wafer brushing effect in the existing wafer brushing device. Attached Figure Description

[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0019] Figure 1 A schematic diagram of an embodiment of the wafer brushing apparatus according to the present invention is shown;

[0020] Figure 2 A schematic diagram of an embodiment of the wafer brushing control method according to the present invention is shown;

[0021] Figure 3 A schematic diagram of an embodiment of the wafer brushing control device according to the present invention is shown.

[0022] The above figures include the following reference numerals:

[0023] 1. Brushing component; 2. Drive component; 3. Pressure detection component; 31. Cylinder; 311. Cylinder body; 312. Cylinder rod; 32. Pressure sensor. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] Please refer to Figure 1An embodiment of the present invention provides a wafer cleaning apparatus, comprising: a cleaning component 1, which is used to contact the wafer surface to clean the wafer surface; a driving component 2, which is drivenly connected to the cleaning component 1, and at least a portion of the driving component 2 is movably disposed along a preset direction to drive the cleaning component 1 to move along the preset direction; and a pressure detection component 3, which cooperates with both the cleaning component 1 and the driving component 2 to detect the force between the cleaning component 1 and the driving component 2.

[0026] The wafer cleaning apparatus of an embodiment of the present invention includes a cleaning component 1, a driving component 2, and a pressure detection component 3. The cleaning component 1 is used to contact the wafer surface to clean the wafer surface. The driving component 2 is drivenly connected to the cleaning component 1, and at least a portion of the driving component 2 is movably arranged along a preset direction to drive the cleaning component 1 to move along the preset direction. Both the cleaning component 1 and the driving component 2 cooperate with the pressure detection component 3 to detect the force between the cleaning component 1 and the driving component 2. When the wafer cleaning device is in use, the driving component 2 drives the cleaning component 1 to move in a preset direction, so that the cleaning component 1 presses against the wafer to achieve cleaning of the wafer. The force between the cleaning component 1 and the wafer is transmitted between the cleaning component 1 and the driving component 2, and is then captured by the pressure detection component 3. The force between the cleaning component 1 and the driving component 2 detected by the pressure detection component 3 directly reflects the pressure applied by the cleaning component 1 to the wafer. Based on this, the operation of the driving component 2 can be controlled more effectively, ensuring that there is appropriate pressure between the contact point between the cleaning component 1 and the wafer when the wafer cleaning device is working. This helps to ensure the cleaning effect of the wafer and solves the problem of poor cleaning effect of the wafer cleaning device in the prior art.

[0027] The so-called drive connection means that the drive component 2 can drive the brushing component 1 to move in a preset direction. Specifically, the two can be directly connected or indirectly connected through other transition components. As the name suggests, the brushing component 1 is a component used to brush the wafer. In a specific embodiment, it includes a brush head. After the brush head contacts the wafer, it brushes the wafer. Of course, the brushing component 1 can also be in other forms, as long as it can achieve the purpose of brushing the wafer.

[0028] It should be noted that the so-called brushing mentioned above refers to cleaning and / or planarizing the wafer surface.

[0029] Specifically, the pressure detection component 3 is communicatively connected to the drive component 2, and the drive component 2 performs actions based on the detection results of the pressure detection component 3.

[0030] In another embodiment, the pressure detection component 3 is a pressure sensor. One end of the pressure sensor is connected to the drive component 2, and the other end of the pressure sensor is connected to the scrubbing component 1. In this way, the force between the scrubbing component 1 and the drive component 2 can be directly detected by the pressure sensor, which facilitates the subsequent control of the scrubbing pressure.

[0031] Specifically, the drive component 2 includes a motor and a controller. Both the motor and the pressure detection component 3 are communicatively connected to the controller, which controls the motor's operation based on the detection results of the pressure detection component 3.

[0032] Specifically, the pressure detection component 3 includes a cylinder 31, which includes a cylinder body 311 and a cylinder rod 312. A portion of the cylinder rod 312 is telescopically mounted in the cylinder body 311. The cylinder body 311 is connected to the drive component 2, and the cylinder rod 312 is connected to the brushing component 1. Alternatively, the cylinder body 311 is connected to the brushing component 1, and the cylinder rod 312 is connected to the drive component 2.

[0033] By setting up cylinder 31, which is connected to the brushing component 1 and the driving component 2, the gas in cylinder 31 can be compressed when subjected to force, which can buffer the brushing component 1, thereby making the contact effect between the brushing component 1 and the wafer surface better, and ultimately ensuring the uniform brushing effect on the wafer.

[0034] Specifically, the pressure detection component 3 also includes a pressure sensor 32, whose pressure detection probe is installed inside the cylinder 31 to detect the air pressure inside the cylinder 31.

[0035] In a preferred embodiment, the pressure detection component 3 includes a pressure sensor 32, which is disposed within the cylinder 31, specifically within the cylinder cavity of the cylinder 31. Thus, as the cylinder 31 extends and retracts, the internal air pressure changes. This change in air pressure objectively reflects the pressure between the brushing component 1 and the wafer surface. The pressure sensor 32 can detect these pressure changes, facilitating the control of the drive component 2 based on the air pressure value. In another optional embodiment, the pressure detection component 3 includes a pressure sensor. One end of the pressure sensor is connected to the drive component 2, and the other end is connected to the brushing component 1. In this case, the pressure sensor can directly detect the force between the brushing component 1 and the drive component 2, facilitating subsequent control of the brushing pressure. In this latter case, the cylinder 31 only serves a buffering function and does not rely on the air pressure within the cylinder 31 for pressure detection.

[0036] Secondly, embodiments of the present invention also provide a wafer processing apparatus, which includes the wafer brushing device described above.

[0037] in addition, Figure 2 This is a wafer brushing control method according to an embodiment of the present invention, which is used in the aforementioned wafer brushing apparatus or in the aforementioned wafer processing equipment, such as... Figure 2 As shown, the method includes the following steps:

[0038] Step S102: Obtain the force data acquired by the pressure detection component 3 of the wafer brushing device;

[0039] Step S104: Control the operation of the drive component 2 of the wafer brushing device according to the force data.

[0040] The force data detected by the pressure detection component 3 can reflect the pressure applied to the wafer by the brushing component 1. Based on this, the operation of the drive component 2 can be controlled more effectively, ensuring that there is appropriate pressure between the contact point between the brushing component 1 and the wafer when the wafer brushing device is working. This helps to ensure the brushing effect on the wafer and solves the problem of poor brushing effect on wafers in the existing wafer brushing device.

[0041] Specifically, the action of the drive component 2 of the wafer brushing device is controlled according to the force data, including: controlling the action of the drive component 2 using a negative feedback control method according to the force data.

[0042] In addition, such as Figure 3 As shown, an embodiment of the present invention also provides a wafer brushing control device for the aforementioned wafer brushing device or for the aforementioned wafer processing equipment. The wafer brushing control device includes: an acquisition unit for acquiring force data acquired by the pressure detection component 3 of the wafer brushing device; and a control unit for controlling the operation of the drive component 2 of the wafer brushing device according to the force data.

[0043] In a preferred embodiment, the control unit is used to control the action of the drive component 2 using a negative feedback control method based on the force data.

[0044] In addition, embodiments of the present invention also provide a non-volatile storage medium, which includes a stored program, wherein the program controls the device where the non-volatile storage medium is located to execute the above-described wafer brushing control method during runtime.

[0045] Furthermore, embodiments of the present invention also provide a processor, which stores a program, wherein the program executes the above-described wafer brushing control method when it runs.

[0046] Finally, embodiments of the present invention also provide a wafer processing system, which includes: the wafer brushing device described above, or the wafer processing equipment described above; and the processor described above.

[0047] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0048] The wafer cleaning apparatus of an embodiment of the present invention includes a cleaning component 1, a driving component 2, and a pressure detection component 3. The cleaning component 1 is used to contact the wafer surface to clean the wafer surface. The driving component 2 is drivenly connected to the cleaning component 1, and at least a portion of the driving component 2 is movably arranged along a preset direction to drive the cleaning component 1 to move along the preset direction. Both the cleaning component 1 and the driving component 2 cooperate with the pressure detection component 3 to detect the force between the cleaning component 1 and the driving component 2. When the wafer cleaning device is in use, the driving component 2 drives the cleaning component 1 to move in a preset direction, so that the cleaning component 1 presses against the wafer to achieve cleaning of the wafer. The force between the cleaning component 1 and the wafer is transmitted between the cleaning component 1 and the driving component 2, and is then captured by the pressure detection component 3. The force between the cleaning component 1 and the driving component 2 detected by the pressure detection component 3 directly reflects the pressure applied by the cleaning component 1 to the wafer. Based on this, the operation of the driving component 2 can be controlled more effectively, ensuring that there is appropriate pressure between the contact point between the cleaning component 1 and the wafer when the wafer cleaning device is working. This helps to ensure the cleaning effect of the wafer and solves the problem of poor cleaning effect of the wafer cleaning device in the prior art.

[0049] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0050] The sequence numbers of the above embodiments of the present invention are merely for descriptive purposes and do not represent the superiority or inferiority of the embodiments. Moreover, the steps shown in the flowcharts of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowcharts, in some cases the steps shown or described may be performed in a different order than that shown here.

[0051] In the above embodiments of the present invention, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0052] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units can be a logical functional division, and in actual implementation, there may be other division methods. For instance, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual coupling, direct coupling, or communication connection may be through some interfaces; the indirect coupling or communication connection between units or modules may be electrical or other forms.

[0053] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0054] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0055] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0056] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer brushing device, characterized in that, include: A brushing component (1) is used to contact the surface of the wafer to brush the surface of the wafer; A driving component (2) is driven to be connected to the brushing component (1). At least a portion of the driving component (2) is movably arranged in a preset direction to drive the brushing component (1) to move in the preset direction. The pressure detection component (3) is used to detect the force between the brushing component (1) and the driving component (2). The brushing component (1) and the driving component (2) are both engaged with the pressure detection component (3) to detect the force between the brushing component (1) and the driving component (2) through the pressure detection component (3). The pressure detection component (3) includes a cylinder (31), the cylinder (31) includes a cylinder body (311) and a cylinder rod (312), a portion of the cylinder rod (312) being telescopically mounted in the cylinder body (311); Wherein, the cylinder body (311) is connected to the drive component (2), and the cylinder rod (312) is connected to the brushing component (1); or, the cylinder body (311) is connected to the brushing component (1), and the cylinder rod (312) is connected to the drive component (2). The pressure detection component (3) also includes a pressure sensor (32), the pressure detection probe of which is installed inside the cylinder (31) to detect the pressure inside the cylinder (31).

2. The wafer brushing apparatus according to claim 1, characterized in that, The pressure detection component (3) is communicatively connected to the drive component (2), and the drive component (2) performs an action based on the detection result of the pressure detection component (3).

3. The wafer brushing apparatus according to claim 2, characterized in that, The drive component (2) includes a motor and a controller. Both the motor and the pressure detection component (3) are communicatively connected to the controller. The controller controls the operation of the motor based on the detection result of the pressure detection component (3).

4. A wafer processing equipment, characterized in that, The wafer processing equipment includes the wafer brushing device according to any one of claims 1 to 3.

5. A wafer brushing control method, characterized in that, The wafer brushing control method, used in any one of claims 1 to 3, or in the wafer processing equipment of claim 4, comprises: Obtain the force data acquired by the pressure detection component (3) of the wafer brushing device; The action of the drive component (2) of the wafer brushing device is controlled according to the force data.

6. The wafer brushing control method according to claim 5, characterized in that, Based on the force data, the operation of the drive component (2) of the wafer brushing device is controlled, including: Based on the force data, the action of the drive component (2) is controlled by a negative feedback control method.

7. A wafer brushing control device, characterized in that, For use in any one of claims 1 to 3, or in the wafer processing equipment of claim 4, the wafer brushing control device comprises: The acquisition unit is used to acquire the force data acquired by the pressure detection component (3) of the wafer brushing device; The control unit is used to control the operation of the drive component (2) of the wafer brushing device according to the force data.

8. A non-volatile storage medium, characterized in that, The non-volatile storage medium includes a stored program, wherein, when the program is executed, it controls the device containing the non-volatile storage medium to perform the wafer brushing control method of claim 5 or 6.

9. A processor, characterized in that, The processor stores a program, which executes the wafer brushing control method according to claim 5 or 6 when the program is run.

10. A wafer fabrication system, characterized in that, The wafer processing system includes: The wafer brushing apparatus according to any one of claims 1 to 3, or the wafer processing equipment according to claim 4; The processor as described in claim 9.

Images