Aging test system for high power chips

Abstract

The present invention discloses an aging test system for high-power chips, comprising a plurality of workbenches stacked and installed on a rack, a cooling plate arranged on each workbench, a plurality of TEC modules arranged at intervals on the upper surface of the cooling plate, a temperature averaging plate whose lower surface contacts the TEC module, and a clamping fixture movably installed on the workbench and located directly above the temperature averaging plate; the clamping fixture comprises a support plate, a test PCB board with a plurality of test seats welded at intervals, and a heat-conducting cover plate, and a light-splitting component is also arranged above the clamping fixture, and the light-splitting component comprises a carrier board, a plurality of mounting seats installed at intervals on the upper surface of the carrier board, and a plurality of PCB boards connected to the mounting seats, and a light-emitting device to be tested is arranged below the carrier board. The present invention realizes the aging and testing of multiple chips, which not only improves the efficiency of the test, but also improves the precision, accuracy and consistency of the tested data.

Description

Technical Field

[0001] The invention relates to an aging test system for a high-power chip, belonging to the technical field of optical communications. Background Art

[0002] The fixture design for laser chip aging test has always been a difficult point, especially the aging test of high-power TO. Due to the high power of the product, the temperature is more difficult to control. At present, the aging and testing of high-power TO in the industry are carried out separately, and the industry lacks an integrated aging and testing system. At present, most of the current solutions are normal temperature test systems, and aging and testing are carried out separately, with low test efficiency and poor accuracy. Summary of the invention

[0003] The purpose of the present invention is to provide an aging test system for high-power chips, which realizes the aging and testing of multiple chips without moving the chips, that is, multiple parameters of the chips before and after aging and during the aging process can be measured, which not only improves the test efficiency, but also improves the test precision, accuracy and data consistency.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an aging test system for high-power chips, comprising a plurality of workbenches stacked and installed on a rack, a cooling plate arranged on each workbench, a plurality of TEC modules arranged at intervals on the upper surface of the cooling plate, a temperature averaging plate whose lower surface contacts the TEC module, and a clamping fixture movably installed on the workbench and located directly above the temperature averaging plate;

[0005] The clamping fixture comprises a support plate, a test PCB board with a plurality of test sockets welded at intervals, and a heat-conducting cover plate, wherein the support plate, the test PCB board, and the heat-conducting cover plate are stacked from bottom to top, and the pin ends of the plurality of devices to be tested are electrically connected to the test sockets on the test PCB board through the heat-conducting cover plate;

[0006] A plurality of protrusions are arranged at intervals on the lower surface of the heat-conducting cover plate, and through holes corresponding to the protrusions are opened on the test PCB board and the support plate, and the plurality of protrusions pass through the through holes on the test PCB board and the support plate respectively and are exposed from the bottom surface of the support plate;

[0007] A plurality of mutually parallel first strip grooves are provided at intervals on the upper surface of the heat-conducting cover plate, and a plurality of mutually parallel second strip grooves are provided at intervals on the lower surface of the heat-conducting cover plate, the first strip grooves and the second strip grooves are vertically arranged, and a heat-spreading pipe is embedded in each of the first strip grooves and the second strip grooves;

[0008] A frame is arranged on the outer sides of the test PCB board and the heat-conducting cover plate, the left and right ends of the support plate are located directly below the frame, a first groove in which a first support rod is embedded is arranged on the lower surface of the left and right ends of the support plate, two second grooves corresponding to the first grooves at the left and right ends of the support plate are arranged on the upper surface of the frame, a second support rod is embedded in the second groove, and the first support rod and the second support rod are connected by a plurality of springs arranged at intervals;

[0009] The left and right end surfaces of the frame are respectively provided with a convex strip extending outward, and the workbench is provided with two first mounting seats at intervals, and the two first mounting seats are provided with a groove on the opposite surfaces for the convex strip of the frame to be embedded;

[0010] A light splitting component is also arranged above the clamping fixture, and the light splitting component includes a carrier board, a plurality of mounting seats installed at intervals on the upper surface of the carrier board, and a plurality of PCB boards connected to the mounting seats, and a light emitting device to be tested is arranged below the carrier board;

[0011] Each of the mounting seats is provided with a plurality of first through holes extending vertically therethrough at intervals, the carrier is provided with a second through hole extending therethrough and intersecting the first through hole, the light emitting device is located directly below the second through hole, a plurality of mounting holes extending therethrough and intersecting the first through hole are provided at intervals on the side surface of the mounting seat, the PCB board is welded to the side surface of the mounting seat, and a photoelectric conversion device is embedded in the mounting hole and welded to the PCB board;

[0012] A semi-reflective and semi-mirror is installed at the intersection of the first through hole and the mounting hole, and an optical fiber flange connected to an optical fiber is installed at the upper end of the first through hole;

[0013] A pressing block is respectively arranged at both ends of the upper surface of the carrier plate, the bottom of the pressing block is installed on the carrier plate, the upper part of the pressing block is used to connect with the driving mechanism, and a plurality of strip grooves are staggeredly arranged in the middle of the pressing block.

[0014] The further improved scheme in the above technical scheme is as follows:

[0015] 1. In the above scheme, when the spring is in a naturally stretched state, the bottom surface of the support plate is spaced apart from the temperature equalizing plate; when the spring is in an extended state due to an external force, the bottom surface of the support plate contacts the temperature equalizing plate.

[0016] 2. In the above solution, a cover plate is provided above the heat equalizing pipe located in the first strip groove.

[0017] 3. In the above scheme, a plurality of strip grooves are arranged in parallel.

[0018] 4. In the above scheme, each of the workbenches is also provided with at least one power supply.

[0019] 5. In the above solution, a cylinder is installed on each of the two first mounting seats, and the piston rod of the cylinder is connected to the upper surface of the pressure block.

[0020] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0021] 1. The aging test system of a high-power chip of the present invention realizes the aging and testing of multiple chips without moving the chips, that is, multiple parameters of the chips before and after aging and during the aging process can be measured, which not only improves the efficiency of the test, but also improves the precision, accuracy and consistency of the test data; in addition, a plurality of mutually parallel first strip grooves are arranged at intervals on the upper surface of the heat-conducting cover plate, and a plurality of mutually parallel second strip grooves are arranged at intervals on the lower surface of the heat-conducting cover plate, the first strip grooves and the second strip grooves are arranged vertically, and a heat spreader is embedded in each of the first strip grooves and the second strip grooves, and the combination of the heat spreader and the heat-conducting cover plate realizes uniform temperature conduction, thereby ensuring the accuracy of testing multiple high-power heat-generating chips and the uniformity of test data.

[0022] 2. The aging test system for high-power chips of the present invention has a first groove embedded in the lower surface of the left and right ends of the support plate, and the upper surface of the frame has two second grooves corresponding to the first grooves on the left and right ends of the support plate, and the second support rods are embedded in the second grooves. The first support rod and the second support rod are connected by a plurality of springs arranged at intervals, thereby realizing a floating design for the support plate and the test PCB board and the heat-conducting cover plate above the support plate, which can not only protect the support plate from being worn during long-term use, but also ensure the surface contact between the fixture and its upper and lower components, so that the device is heated more evenly, thereby improving the efficiency and accuracy of the test.

[0023] 3. In the aging test system for high-power chips of the present invention, a pressure block is respectively arranged at both ends of the upper surface of the carrier, the bottom of the pressure block is installed on the carrier, the upper part of the pressure block is used to connect with the driving mechanism, and the middle part of the pressure block is staggered with a plurality of strip grooves. Through the arrangement of the strip grooves, the force of the driving mechanism to push the carrier downward can be buffered and balanced, which can ensure the surface contact between the bottom surface of the carrier and the device fixture to avoid leakage of device light and ensure the consistency of the test, and can also avoid damage to the device due to excessive force, further ensuring the test accuracy and efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Attached Figure 1 It is a schematic diagram of the structure of the aging test system of the high-power chip of the present invention;

[0025] Attached Figure 2 It is a partial structural schematic diagram of the aging test system of the high-power chip of the present invention;

[0026] Attached Figure 3 A partial structural cross-sectional view of an aging test system for a high-power chip according to the present invention;

[0027] Attached Figure 4 It is a structural schematic diagram of a fixture in the aging test system of a high-power chip of the present invention;

[0028] Attached Figure 5 It is a schematic diagram of the partial structural decomposition of the fixture in the aging test system of the high-power chip of the present invention;

[0029] Attached Figure 6 The local structure section of the fixture in the aging test system of the high-power chip of the present invention Figure 1 ;

[0030] Attached Figure 7 The local structure section of the fixture in the aging test system of the high-power chip of the present invention Figure 2 ;

[0031] Attached Figure 8 It is a structural schematic diagram of the light splitting component in the aging test system of the high-power chip of the present invention;

[0032] Attached Fig. 9 It is a partial structural cross-sectional view of the light splitting component in the aging test system of the high-power chip of the present invention.

[0033] In the above figures: 1, support plate; 2, test PCB board; 3, heat conductive cover plate; 4, bump; 5, first strip groove; 6, second strip groove; 7, heat spreader; 11, frame; 12, first support rod; 13, second support rod; 14, spring; 21, workbench; 22, cooling plate; 23, TEC module; 24, temperature spreader; 25, clamping fixture; 26, first mounting seat; 27, cylinder; 31, carrier board; 32, mounting seat; 33, PCB board; 34, first through hole; 35, second through hole; 36, mounting hole; 37, photoelectric conversion device; 38, half-reflective half-mirror; 39, optical fiber flange; 41, pressing block; 42, strip groove. DETAILED DESCRIPTION

[0034] In the description of this patent, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0035] Embodiment 1: A high-power chip aging test system comprises a plurality of workbenches 21 stacked and mounted on a rack, a cooling plate 22 disposed on each workbenches 21, a plurality of TEC modules 23 disposed at intervals on the upper surface of the cooling plate 22, a temperature balancing plate 24 whose lower surface contacts the TEC module 23, and a clamping fixture 25 movably mounted on the workbenches 21 and located directly above the temperature balancing plate 24;

[0036] The clamping fixture 25 comprises a support plate 1, a test PCB board 2 with a plurality of test sockets welded at intervals, and a heat-conducting cover plate 3. The support plate 1, the test PCB board 2, and the heat-conducting cover plate 3 are stacked from bottom to top, and the pin ends of the plurality of devices to be tested pass through the heat-conducting cover plate 3 and are electrically connected to the test sockets on the test PCB board 2.

[0037] A plurality of protrusions 4 are arranged at intervals on the lower surface of the heat-conducting cover plate 3, and through holes corresponding to the protrusions 4 are opened on the test PCB board 2 and the support plate 1, and the plurality of protrusions 4 pass through the through holes on the test PCB board 2 and the support plate 1, respectively, and are exposed from the bottom surface of the support plate 1;

[0038] A plurality of mutually parallel first strip grooves 5 are provided at intervals on the upper surface of the heat-conducting cover plate 3, and a plurality of mutually parallel second strip grooves 6 are provided at intervals on the lower surface of the heat-conducting cover plate 3. The first strip grooves 5 and the second strip grooves 6 are vertically arranged, and a heat-spreading tube 7 is embedded in each of the first strip grooves 5 and the second strip grooves 6;

[0039] A frame 11 is arranged on the outer sides of the test PCB board 2 and the heat-conducting cover plate 3. The left and right ends of the support plate 1 are located directly below the frame 11. A first groove in which a first support rod 12 is embedded is provided on the lower surface of the left and right ends of the support plate 1. Two second grooves corresponding to the first grooves at the left and right ends of the support plate 1 are provided on the upper surface of the frame 11. A second support rod 13 is embedded in the second groove. The first support rod 12 and the second support rod 13 are connected by a plurality of springs 14 arranged at intervals.

[0040] The left and right end surfaces of the frame 11 are respectively provided with a convex strip 15 extending outwards, and two first mounting seats 26 are arranged on the workbench 21 at intervals, and the two first mounting seats 26 have a groove on the opposite surfaces for the convex strip 15 of the frame 11 to be embedded;

[0041] A light splitter assembly is also arranged above the clamping fixture 25, and the light splitter assembly includes a carrier board 31, a plurality of mounting seats 32 installed at intervals on the upper surface of the carrier board 31, and a plurality of PCB boards 33 connected to the mounting seats 32, and a light emitting device to be tested is arranged below the carrier board 31;

[0042] Each of the mounting seats 32 is provided with a plurality of first through holes 34 extending vertically therethrough at intervals, the carrier board 31 is provided with a second through hole 35 extending therethrough and communicating with the first through hole 34, the light emitting device is located directly below the second through hole 35, a plurality of mounting holes 36 extending therethrough and communicating with the first through hole 34 are provided at intervals on the side surface of the mounting seat 32, the PCB board 33 is welded to the side surface of the mounting seat 32, a photoelectric conversion device 37 is embedded in the mounting hole 36 and is welded to the PCB board 33;

[0043] A semi-reflective half-mirror 38 is installed at the intersection of the first through hole 34 and the mounting hole 36, and an optical fiber flange 39 connected to an optical fiber is installed at the upper end of the first through hole 34;

[0044] A pressing block 41 is disposed at both ends of the upper surface of the carrier plate 31. The bottom of the pressing block 41 is mounted on the carrier plate 31. The upper portion of the pressing block 41 is used to connect with the driving mechanism. A plurality of strip grooves 42 are staggeredly formed in the middle of the pressing block 41.

[0045] When the spring 14 is in a naturally stretched state, the bottom surface of the above-mentioned support plate 1 is spaced apart from the temperature equalizing plate 24. When the spring 14 is in an extended state under external force, the bottom surface of the above-mentioned support plate 1 contacts the temperature equalizing plate 24. A cover plate is arranged above the heat equalizing pipe 7 in the first strip groove 5. Several strip grooves 42 are arranged in parallel.

[0046] Embodiment 2: A high-power chip aging test system, comprising a plurality of workbenches 21 stacked and mounted on a rack, a cooling plate 22 disposed on each workbench 21, a plurality of TEC modules 23 disposed at intervals on the upper surface of the cooling plate 22, a temperature balancing plate 24 whose lower surface contacts the TEC module 23, and a clamping fixture 25 movably mounted on the workbench 21 and located directly above the temperature balancing plate 24;

[0047] The clamping fixture 25 comprises a support plate 1, a test PCB board 2 with a plurality of test sockets welded at intervals, and a heat-conducting cover plate 3. The support plate 1, the test PCB board 2, and the heat-conducting cover plate 3 are stacked from bottom to top, and the pin ends of the plurality of devices to be tested pass through the heat-conducting cover plate 3 and are electrically connected to the test sockets on the test PCB board 2.

[0048] A plurality of protrusions 4 are arranged at intervals on the lower surface of the heat-conducting cover plate 3, and through holes corresponding to the protrusions 4 are opened on the test PCB board 2 and the support plate 1, and the plurality of protrusions 4 pass through the through holes on the test PCB board 2 and the support plate 1, respectively, and are exposed from the bottom surface of the support plate 1;

[0049] A plurality of mutually parallel first strip grooves 5 are provided at intervals on the upper surface of the heat-conducting cover plate 3, and a plurality of mutually parallel second strip grooves 6 are provided at intervals on the lower surface of the heat-conducting cover plate 3. The first strip grooves 5 and the second strip grooves 6 are vertically arranged, and a heat-spreading tube 7 is embedded in each of the first strip grooves 5 and the second strip grooves 6;

[0050] A frame 11 is arranged on the outer sides of the test PCB board 2 and the heat-conducting cover plate 3. The left and right ends of the support plate 1 are located directly below the frame 11. A first groove in which a first support rod 12 is embedded is provided on the lower surface of the left and right ends of the support plate 1. Two second grooves corresponding to the first grooves at the left and right ends of the support plate 1 are provided on the upper surface of the frame 11. A second support rod 13 is embedded in the second groove. The first support rod 12 and the second support rod 13 are connected by a plurality of springs 14 arranged at intervals.

[0051] The left and right end surfaces of the frame 11 are respectively provided with a convex strip 15 extending outwards, and two first mounting seats 26 are arranged on the workbench 21 at intervals, and the two first mounting seats 26 have a groove on the opposite surfaces for the convex strip 15 of the frame 11 to be embedded;

[0052] A light splitter assembly is also arranged above the clamping fixture 25, and the light splitter assembly includes a carrier board 31, a plurality of mounting seats 32 installed at intervals on the upper surface of the carrier board 31, and a plurality of PCB boards 33 connected to the mounting seats 32, and a light emitting device to be tested is arranged below the carrier board 31;

[0053] Each of the mounting seats 32 is provided with a plurality of first through holes 34 extending vertically therethrough at intervals, the carrier board 31 is provided with a second through hole 35 extending therethrough and communicating with the first through hole 34, the light emitting device is located directly below the second through hole 35, a plurality of mounting holes 36 extending therethrough and communicating with the first through hole 34 are provided at intervals on the side surface of the mounting seat 32, the PCB board 33 is welded to the side surface of the mounting seat 32, a photoelectric conversion device 37 is embedded in the mounting hole 36 and is welded to the PCB board 33;

[0054] A semi-reflective half-mirror 38 is installed at the intersection of the first through hole 34 and the mounting hole 36, and an optical fiber flange 39 connected to an optical fiber is installed at the upper end of the first through hole 34;

[0055] A pressing block 41 is disposed at both ends of the upper surface of the carrier plate 31. The bottom of the pressing block 41 is mounted on the carrier plate 31. The upper portion of the pressing block 41 is used to connect with the driving mechanism. A plurality of strip grooves 42 are staggeredly formed in the middle of the pressing block 41.

[0056] Each of the above-mentioned workbenches 21 is also provided with at least one power supply; each of the two above-mentioned first mounting seats 26 is provided with a cylinder 27, the piston rod of the above-mentioned cylinder 27 is connected to the upper surface of the pressure block 41, and the cylinder 27 drives the carrier plate 31 to press down through the pressure block 41, so that the carrier plate 31 of the light splitting component is in contact with the heat conductive cover plate 3 of the clamping fixture 25, and the support plate 1 of the clamping fixture 25 is in contact with the temperature uniform plate 24 on the workbench 21.

[0057] When the aging test system of the above-mentioned high-power chip is used, the aging and testing of multiple chips are realized without moving the chips, that is, multiple parameters of the chips before and after aging and during the aging process can be measured, which not only improves the efficiency of the test, but also improves the precision, accuracy and consistency of the test data;

[0058] In addition, the combination of the heat-saturating pipe and the heat-conducting cover plate achieves uniform temperature conduction, thereby ensuring the accuracy of testing multiple high-power heating devices and the uniformity of test data;

[0059] In addition, the floating design of the pallet and the test PCB board and heat-conducting cover plate above it can not only protect the pallet from wear during long-term use, but also ensure the surface contact between the fixture and its upper and lower components, so that the device is heated more evenly and the test efficiency and accuracy are improved;

[0060] In addition, by setting the strip grooves, the force of the driving mechanism to push the carrier downward can be buffered and balanced, which can ensure the surface contact between the bottom surface of the carrier and the device fixture to avoid leakage of device light and ensure the consistency of the test, and avoid damage to the device due to excessive force, further ensuring the test accuracy and efficiency of the device.

[0061] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-power chip aging test system, characterized in that: It comprises a plurality of workbenches (21) stacked and mounted on a rack, a cooling plate (22) arranged on each workbench (21), a plurality of TEC modules (23) arranged at intervals on the upper surface of the cooling plate (22), a temperature averaging plate (24) whose lower surface contacts the TEC module (23), and a clamping fixture (25) movably mounted on the workbench (21) and located directly above the temperature averaging plate (24); The clamping fixture (25) comprises a support plate (1), a test PCB board (2) with a plurality of test sockets welded at intervals, and a heat-conducting cover plate (3); the support plate (1), the test PCB board (2), and the heat-conducting cover plate (3) are stacked from bottom to top, and the pin ends of a plurality of devices to be tested pass through the heat-conducting cover plate (3) and are electrically connected to the test sockets on the test PCB board (2); A plurality of protrusions (4) are arranged at intervals on the lower surface of the heat-conducting cover plate (3); through holes corresponding to the protrusions (4) are provided on the test PCB board (2) and the support plate (1); and the plurality of protrusions (4) pass through the through holes on the test PCB board (2) and the support plate (1) respectively and are exposed from the bottom surface of the support plate (1); A plurality of mutually parallel first strip grooves (5) are provided at intervals on the upper surface of the heat-conducting cover plate (3); a plurality of mutually parallel second strip grooves (6) are provided at intervals on the lower surface of the heat-conducting cover plate (3); the first strip grooves (5) and the second strip grooves (6) are arranged vertically; and a heat-spreading pipe (7) is embedded in each of the first strip grooves (5) and the second strip grooves (6); A frame (11) is arranged on the outer sides of the test PCB board (2) and the heat-conducting cover plate (3); the left and right ends of the support plate (1) are located directly below the frame (11); the lower surfaces of the left and right ends of the support plate (1) are provided with a first groove in which a first support rod (12) is embedded; the upper surface of the frame (11) is provided with two second grooves corresponding to the first grooves at the left and right ends of the support plate (1); a second support rod (13) is embedded in the second groove; and the first support rod (12) and the second support rod (13) are connected by a plurality of springs (14) arranged at intervals; The left and right end surfaces of the frame (11) are respectively provided with a convex strip (15) extending outwards, and two first mounting seats (26) are arranged on the workbench (21) at intervals, and the two first mounting seats (26) have a groove on the opposite surfaces for the convex strip (15) of the frame (11) to be embedded; A light splitting component is also arranged above the clamping fixture (25), the light splitting component comprising a carrier board (31), a plurality of mounting seats (32) installed at intervals on the upper surface of the carrier board (31), and a plurality of PCB boards (33) connected to the mounting seats (32), and a light emitting device to be tested is arranged below the carrier board (31); Each of the mounting seats (32) is provided with a plurality of first through holes (34) extending vertically at intervals, the carrier board (31) is provided with a second through hole (35) extending through the first through hole (34), the light-emitting device is located directly below the second through hole (35), a plurality of mounting holes (36) extending through the first through hole (34) are provided at intervals on the side surface of the mounting seat (32), the PCB board (33) is welded to the side surface of the mounting seat (32), and a photoelectric conversion device (37) is embedded in the mounting hole (36) and welded to the PCB board (33); A semi-reflective semi-mirror (38) is installed at the intersection of the first through hole (34) and the mounting hole (36), and an optical fiber flange (39) connected to an optical fiber is installed at the upper end of the first through hole (34); A pressing block (41) is respectively provided at both ends of the upper surface of the carrier plate (31); the bottom of the pressing block (41) is mounted on the carrier plate (31); the upper portion of the pressing block (41) is used to connect with a driving mechanism; and a plurality of strip grooves (42) are staggeredly provided in the middle of the pressing block (41).

2. The high-power chip aging test system according to claim 1, characterized in that: When the spring (14) is in a naturally stretched state, the bottom surface of the support plate (1) is spaced apart from the temperature equalizing plate (24); when the spring (14) is subjected to an external force and is in an extended state, the bottom surface of the support plate (1) is in contact with the temperature equalizing plate (24).

3. The high-power chip aging test system according to claim 1, characterized in that: A cover plate is provided above the heat equalizing pipe (7) located in the first strip-shaped groove (5).

4. The high-power chip aging test system according to claim 1, characterized in that: A plurality of strip-shaped grooves (42) are arranged in parallel.

5. The high-power chip aging test system according to claim 1, characterized in that: Each of the workbenches (21) is also provided with at least one power supply.

6. The high-power chip aging test system according to claim 1, characterized in that: A cylinder (27) is mounted on each of the two first mounting seats (26), and a piston rod of the cylinder (27) is connected to the upper surface of the pressing block (41).

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