A surface inspection method, apparatus, and storage medium

Abstract

A surface detection method, device and storage medium, the surface detection method comprising: adjusting a background image to a preset color, the preset color including at least one color; adjusting a to-be-detected surface of a to-be-detected object to a preset angle, the preset angle including at least one angle, the preset angle reflecting an included angle between the to-be-detected surface and a horizontal plane; determining the background image as an imaging background of the to-be-detected surface, and collecting a detection image corresponding to the to-be-detected surface, wherein the detection image includes a reflection image formed by part or all of the background image being reflected on the to-be-detected surface; and detecting a preset feature of the to-be-detected surface according to the detection image. It can be seen that the above surface detection method can form detection images corresponding to various spectra and various imaging angles, and a processing terminal can detect defects in the multiple detection images, thereby improving the degree of automation, improving the wafer defect detection rate, and improving the accuracy and consistency of detection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of defect detection, and in particular to a surface detection method, a device and a storage medium. BACKGROUND

[0002] A wafer can be processed to form various circuit element structures, and an integrated circuit product with a specific electrical function is formed. The processing and manufacturing process of a general wafer is complicated, and if there is a defect on the wafer, the integrated circuit product prepared therefrom will fail, the yield of the product will be reduced, and the manufacturing cost will be increased. Not only is it necessary to detect defects on the wafer in real time so as to remove defects or stop the preparation process in time, but it is also necessary to perform macroscopic detection on the whole wafer at the incoming end and the outgoing end. Macroscopic defects generally refer to defects with a size greater than 100 microns, which can be directly observed by the human eye.

[0003] When performing macroscopic detection on a wafer, not only is it necessary to perform macroscopic detection on the defects of the front surface of the wafer, but it is also necessary to perform macroscopic detection on the defects of the back surface and the edge of the wafer to achieve the purpose of comprehensive macroscopic detection of the wafer.

[0004] The traditional macroscopic detection device is manually controlled by a human hand to rotate the wafer and visually inspect the front surface and the back surface of the wafer for defects, manually mark the defects and classify them, and the defect detection efficiency is low. SUMMARY

[0005] The present application mainly solves the technical problem of low automation degree of macroscopic defect detection of the surface to be detected of the wafer.

[0006] According to a first aspect, in an embodiment, a surface detection method is provided, comprising:

[0007] adjusting a background image to a preset color, the preset color including at least one color;

[0008] adjusting a surface to be detected of an object to be detected to a preset angle, the preset angle including at least one angle, the preset angle reflecting an included angle between the surface to be detected and a horizontal plane;

[0009] determining the background image as an imaging background of the surface to be detected, and collecting a detection image corresponding to the surface to be detected, wherein the detection image includes a reflection image formed by part or all of the background image being reflected on the surface to be detected;

[0010] detecting a preset feature of the surface to be detected according to the detection image.

[0011] In a possible implementation manner, when the color of the background image is at least one color other than black, the preset angle includes at least two angles, and each preset angle corresponds to at least one color of the background image.

[0012] acquiring a detection image corresponding to the surface to be measured, comprising:

[0013] adjusting the surface to be measured to a preset angle corresponding to a preset color according to the color of the background image, or adjusting the background image to a preset color corresponding to a preset angle according to the preset angle;

[0014] In the case that the non-black background image is the imaging background of the surface to be measured, a detection image corresponding to the object to be measured is acquired.

[0015] In a possible implementation, when the color of the background image is black, the preset angle includes at least one angle.

[0016] acquiring a detection image corresponding to the surface to be measured, comprising:

[0017] adjusting the surface to be measured to a preset angle;

[0018] In the case that the non-black background image is the imaging background of the surface to be measured, a detection image corresponding to the object to be measured is acquired.

[0019] In a possible implementation, the object to be measured is a wafer, the surface to be measured is the front surface and / or the back surface of the wafer, and the preset feature is a macroscopic defect of the wafer, wherein the macroscopic defect includes a first defect category and a second defect category, the first defect category includes at least one of color difference, water mark and bubble, and the second defect category includes at least one of scratch and process particle.

[0020] In the case that the color of the background image is at least one of the non-black colors, the method is used for detecting the first defect category.

[0021] In the case that the color of the background image is black, the method is used for detecting the second defect category.

[0022] In a possible implementation, the preset angle is 0°-90°, and / or the preset color includes at least one of black, white, green, blue and yellow.

[0023] In a possible implementation, the plurality of cameras are arranged in an array around the circumferential side of the object to be measured; wherein each camera corresponds to a preset angle setting.

[0024] acquiring a detection image corresponding to the surface to be measured, comprising:

[0025] controlling the surface to be measured to rotate to each preset angle corresponding to each camera in a preset order;

[0026] In the case that the surface to be measured rotates to the corresponding preset angle, the camera is controlled to acquire a detection image corresponding to the surface to be measured, to obtain a plurality of detection images corresponding to the plurality of cameras;

[0027] According to the detection image, a preset feature of the to-be-detected surface is detected, including:

[0028] According to the plurality of detection images corresponding to the plurality of cameras, a preset feature of the to-be-detected surface is detected.

[0029] In a possible implementation, the plurality of cameras are arranged in an array around a periphery of the to-be-detected object;

[0030] The detection image corresponding to the to-be-detected surface is acquired, including:

[0031] The to-be-detected surface is controlled to rotate to a preset angle corresponding to each camera in a preset order;

[0032] In a case where the to-be-detected surface rotates to the preset angle corresponding to each camera, the camera is controlled to acquire a sub-detection image corresponding to the to-be-detected surface, to obtain a plurality of sub-detection images corresponding to the plurality of cameras; each sub-detection image includes a reflection image formed by part or all of a background image being reflected on a partial region of the to-be-detected surface;

[0033] The plurality of sub-detection images are spliced to obtain a spliced detection image;

[0034] According to the detection image, a preset feature of the to-be-detected surface is detected, including:

[0035] According to the spliced detection image, a preset feature of the to-be-detected surface is detected.

[0036] In a possible implementation, the plurality of cameras are arranged in an array around a periphery of the to-be-detected object;

[0037] The detection image corresponding to the to-be-detected surface is acquired, including:

[0038] The to-be-detected surface is controlled to rotate to a preset angle corresponding to each camera in a preset order;

[0039] In a case where the to-be-detected surface rotates to each preset angle, the plurality of cameras are controlled to simultaneously acquire a detection image corresponding to the to-be-detected surface, to obtain a plurality of detection images corresponding to each preset angle;

[0040] According to the detection image, a preset feature of the to-be-detected surface is detected, including:

[0041] According to the plurality of detection images corresponding to each preset angle, a preset feature of the to-be-detected surface is detected.

[0042] According to a second aspect, an embodiment provides a surface detection device, including:

[0043] An imaging background system is configured to provide a background image of a preset color, the preset color including at least one color; the background image is an imaging background of the to-be-detected surface;

[0044] The surface inspection camera system is configured to acquire a detection image corresponding to the surface of the object to be inspected; wherein the detection image comprises a reflection image of part or all of the background image reflected on the surface of the object to be inspected.

[0045] The motion mechanism is configured to adjust the surface of the object to be inspected to a preset angle, wherein the preset angle comprises at least one angle.

[0046] The processing terminal is configured to determine the background image as an imaging background of the surface of the object to be inspected, and detect the preset feature of the surface of the object to be inspected according to the detection image.

[0047] According to a third aspect, in an embodiment, a computer readable storage medium is provided, in one possible implementation, the medium stores a program executable by a processor to implement the method as described in the first aspect and any possible implementation of the first aspect.

[0048] According to the surface inspection method, the surface inspection device and the storage medium, the surface inspection method comprises: adjusting a background image to a preset color, wherein the preset color comprises at least one color; adjusting a surface of an object to be inspected to a preset angle, wherein the preset angle comprises at least one angle, and the preset angle reflects an included angle between the surface of the object to be inspected and a horizontal plane; determining the background image as an imaging background of the surface of the object to be inspected; acquiring a detection image corresponding to the surface of the object to be inspected, wherein the detection image comprises a reflection image of part or all of the background image reflected on the surface of the object to be inspected; and detecting a preset feature of the surface of the object to be inspected according to the detection image. It can be seen that, by using the surface inspection method, detection images corresponding to various spectra and various imaging angles can be formed, and a processing terminal is used to detect defects in the multiple detection images, so that the degree of automation is improved, the wafer defect detection rate is improved, and the detection accuracy and consistency are improved. BRIEF DESCRIPTION OF DRAWINGS

[0049] Figure 1 A structural schematic diagram of a surface inspection device according to an embodiment is shown;

[0050] Figure 2 With Figure 3 A schematic diagram of a surface inspection device according to an embodiment is shown;

[0051] Figure 4 A flowchart of a surface inspection method according to an embodiment is shown;

[0052] Figures 5 to 9 A schematic diagram of a detection image according to an embodiment is shown.

[0053] Reference signs: 1-imaging background system; 2-surface inspection camera system; 3-motion mechanism; 4-processing terminal; 10-object to be inspected; 11-multispectral surface light source; 12-black background component; 21-surface inspection camera. DETAILED DESCRIPTION

[0054] The application will be described in further detail below with reference to the drawings. Like elements in different embodiments are denoted by like reference numerals. In the following description, numerous specific details are described to provide a thorough understanding of the application. However, it will be apparent to one skilled in the art that the application can be practiced without these specific details. In other instances, well-known methods have not been described in detail in order not to unnecessarily obscure the application. In the following description, numerous specific details are described to provide a thorough understanding of the application. However, it will be apparent to one skilled in the art that the application can be practiced without these specific details. In some instances, well-known operations and methods have not been described in detail in order not to unnecessarily obscure the application.

[0055] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various embodiments. At the same time, the steps or actions in the method description can also be sequentially adjusted or adjusted in a manner that is obvious to those skilled in the art. Therefore, the order in the specification and drawings is only for the purpose of clearly describing a certain embodiment, and does not mean that it is the necessary order, unless otherwise stated that a certain order must be followed.

[0056] The serial numbers of the components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any order or technical meaning. The "connection" and "coupling" in this application include direct and indirect connection (coupling) unless otherwise specified.

[0057] During the production and transportation of wafers at each process step, there is a possibility of generating macro defects. Macro defects of wafers generally include surface defects to be tested (including front and back surfaces) and edge defects. Common surface defects to be tested include color difference, watermark, bubble, scratch and process particles, and edge defects are generally edge collapse. The existing detection method for the above macro defects is manual visual detection and classification, which is prone to problems such as low detection accuracy, different personal standards, low detection quality, and low automation degree.

[0058] In this application, for the automatic detection of wafer macro defects, a surface detection method and a surface detection device for surface defect detection are proposed. The existing neural network technology is relatively mature in image recognition, for example, using template matching and the like, the wafer image can be matched with the template image of the preset defect to obtain the type of the defect in the wafer image and the number of the corresponding type. Therefore, the present application mainly focuses on improving the acquisition of defect images.

[0059] Embodiment one:

[0060] Please refer to Figure 1 In this embodiment, a surface detection device is provided, which comprises an imaging background system 1, a surface detection camera system 2, a motion mechanism 3 and a processing terminal 4.

[0061] The imaging background system 1 is used to provide a background image of a preset color, the background image is the imaging background of the surface to be detected, and the preset color includes at least one color. The background image is theoretically a pure color image. The background image can be a luminous image, such as a surface light source, or a non-luminous image, such as a frosted blackboard.

[0062] The surface detection camera system 2 is used to collect a detection image corresponding to the surface to be detected. The detection image includes a reflection image formed by part or all of the background image reflected on the surface to be detected. The reflection image formed by the feedback of the background image generally needs to completely cover the surface to be detected of the object to be detected 10, so that the corresponding area of the surface to be detected in the detection image reflected by the background image presents a color as a whole. When the surface to be detected cannot be completely covered, multiple sub-detection images need to be obtained for splicing processing to obtain a spliced detection image.

[0063] The motion mechanism 3 is used to adjust the surface to be detected of the object to be detected 10 to a preset angle, and the preset angle includes at least one angle. The motion mechanism 3 can include multi-axis rotation and clamping functions, and can rotate the surface to be detected to any desired angle. When the object to be detected 10 is a wafer, the front surface and the back surface of the wafer need to be detected. At this time, the motion mechanism 3 can fix the wafer through a clamping assembly, flip the wafer by 180°, and switch the surface to be detected from the front surface to the back surface. The preset angle is the included angle between the front surface or the back surface of the wafer and the horizontal plane.

[0064] The processing terminal 4 is used to determine the background image as the imaging background of the surface to be detected, and detect the preset feature of the surface to be detected according to the detection image. In this embodiment, unless otherwise specified, the object to be detected 10 is a wafer, the surface to be detected can include the front surface and the back surface of the wafer, and the preset feature is the macroscopic defect on the surface of the wafer. For example, the processing terminal 4 is used to detect the macroscopic defect in the detection image of the front surface and the back surface of the wafer obtained by the surface detection camera system 2. The processing terminal 4 can use any existing detection algorithm for detection, and in the embodiment, the specific detection algorithm is not limited. The processing terminal 4 can be realized by using a computer, and the display of the computer can display the detection image collected by the surface detection camera 21 in real time, and the operator can control the imaging background system 1 to observe the reflection effect of the background image of different colors, and can manually select a suitable background image.

[0065] When the surface of the object under test 10 is a mirror or a mirror-like surface, if the surface inspection camera 21 is positioned above the surface, the camera will capture its own reflected image, interfering with defect detection. Therefore, when inspecting the surface, the surface inspection camera 21 and the normal of the surface of the object under test 10 generally form a certain angle. Defect detection is performed by acquiring the detection image reflected from the surface by the imaging background system 1.

[0066] In practical applications, different types of macroscopic defects on the surface of the object under test 10 will form images of varying degrees of clarity under different lighting conditions and / or different angles. For example, defects such as watermarks are easier to observe on the surface of a wafer under white light, while defects such as scratches are easier to observe under the reflection of a frosted blackboard. Therefore, when detecting different types of macroscopic defects, it is not feasible to use only an image with a single angle and a single color background, or an image formed by a single color background. Using only one image will not capture all defects clearly or completely, resulting in low detection accuracy and detection rate.

[0067] In this embodiment, the face inspection camera system 2 may include at least one face inspection camera 21 (or simply a camera), and each face inspection camera 21 corresponds to a preset angle setting.

[0068] For example, such as Figure 2 As shown, the surface inspection camera system 2 may include four surface inspection cameras 21. The non-black background image may include four colors. Each surface inspection camera 21 is set at a fixed angle. The motion mechanism 3 rotates the surface of the object to be tested 10 to the preset angle. Subsequently, the imaging background system 1 provides a background image of the preset color. Each surface inspection camera 21 acquires an image of a defect with high visibility. This enables multi-camera, multi-spectral (multi-color) and multi-angle macroscopic defect (preset feature) detection, thereby improving the detection accuracy of macroscopic defects.

[0069] The four border inspection cameras 21 mentioned above can simultaneously acquire images of the surface to be tested. In other words, under the same preset angle and the same background image, the surface to be tested can have four corresponding detection images.

[0070] Alternatively, the face inspection camera system 2 may include a face inspection camera 21 and a face inspection camera 21 motion system, which is used to move the face inspection camera 21 to multiple preset shooting positions, each preset shooting position corresponding to a preset angle.

[0071] For example, the surface inspection camera 21 movement system can drive the surface inspection camera 21 to perform a circular motion around the center point of the object 10 to be inspected, and can drive the surface inspection camera 21 to any shooting position within a range of -90° to 90°. When a preset type of defect needs to be detected or a background image corresponding to a preset color needs to be obtained, the surface inspection camera 21 is driven to move to a preset shooting position corresponding thereto.

[0072] For different types of macro defects of the object 10 to be inspected, the optical axis angle of the surface inspection camera 21 can be adjusted through experiments, and the angle of the surface to be inspected of the object 10 to be inspected can be adjusted. The image obtained in real time by the surface inspection camera 21 can be displayed on the display to determine the most suitable color of the background image corresponding to a type of defect and the most suitable imaging angle. When batch testing is performed, the image corresponding to the type of defect is obtained at the corresponding preset angle.

[0073] As shown in Figure 2 As shown in Figure 3 In actual applications, the imaging background system 1 can include a multi-spectral surface light source 11 or can include a multi-spectral surface light source 11 and a black background assembly 12. The multi-spectral surface light source 11 is used to provide a non-black background image. The black background assembly 12 is used to provide a black background image. The multi-spectral surface light source 11 is also used to provide an environmental light source. For example, a frosted blackboard is used as the black background assembly 12, and the multi-spectral surface light source 11 is required to provide an environmental light.

[0074] Embodiment Two

[0075] In this embodiment, the surface inspection camera system 2 of the surface inspection device includes a plurality of surface inspection cameras 21, and the background image includes a plurality of colors. The imaging background system 1 provides a background image at a fixed position. The optical axis of each surface inspection camera 21 is fixed. Only the movement mechanism 3 is used to rotate the surface to be inspected of the object 10 to be inspected, so that the surface inspection camera 21 can obtain a detection image corresponding to the surface to be inspected in the case that the background image is determined.

[0076] The specific process of the surface inspection method of the surface inspection device will be described below. As shown in Figure 4 The specific process of the surface inspection method of the surface inspection device will be described below. As shown in

[0077] Step 1: Adjust the background image to a preset color. The preset color can include at least one color. The processing terminal 4 sets the preset parameters of the surface inspection device, for example, sets at least one color of the background image corresponding to one surface inspection camera 21. For example, sets the background image to white, and drives the multi-spectral surface light source 11 to emit white light.

[0078] It should be understood that when a face inspection camera 21 corresponds to a background image of multiple colors, it can be that the face inspection camera 21 switches to a different background image color after acquiring each image, or it can be that multiple face inspection cameras 21 are switched to capture each background image of a different color.

[0079] Step 2: Adjust the test surface of the object 10 to a preset angle. The preset angle may include at least one angle, which reflects the angle between the test surface and the horizontal plane.

[0080] Specifically, the angle of the surface of the object to be tested 10 is determined so that the background image completely covers the surface. Each preset angle is related to the position of the surface inspection camera 21, and each determined position of the surface inspection camera 21 can correspond to a preset angle.

[0081] like Figure 2 As shown, when the wafer is set horizontally, as indicated by the solid line optical path in the figure, the first inspection camera 21, rotating clockwise, acquires an image of the wafer's angle at this time. At this point, the background image color can be switched and adjusted to the next preset background image color.

[0082] After the first inspection camera 21 completes its capture, the motion mechanism 3 drives the wafer to rotate clockwise, thereby rotating it to the preset angle corresponding to each inspection camera 21. For example... Figure 2 As shown by the dashed optical path, the fourth inspection camera 21 rotates clockwise to a preset angle and then acquires an inspection image of the wafer.

[0083] Step 3: Determine the background image as the imaging background of the surface to be tested, and acquire the detection image corresponding to the surface to be tested.

[0084] like Figure 5 As shown, after adjusting the surface of the object to be tested 10 to the preset angle corresponding to the current surface inspection camera 21, the surface inspection camera 21 can be controlled to acquire images, and the imaging background system 1 can be controlled to adjust the color of the background image. Through the above steps, detection images corresponding to multiple preset angles and detection images corresponding to background images of multiple colors can be acquired, highlighting different types of defects using multiple angles and using multispectral (color) methods to highlight different types of defects. Figure 5 The detection image shown is a detection image corresponding to the case where the background image completely covers the surface to be tested; where the shadow represents the color of the background image.

[0085] In order to reduce the interference of the ambient light source, when detecting the surface to be detected of the wafer, the frame of the surface detection device can be set to a sealed state, the inside is dark and light, and only the ambient light is provided by the imaging background system 1. When the background image is not black, the multi-spectrum area light source 11 can provide the background image and also realize the effect of providing the ambient light source. When the background image is black, the black background component 12 is used to provide the black background image, and the multi-spectrum area light source 11 is used to provide the ambient light.

[0086] At the same time, the shooting range of the surface inspection camera 21 is controlled to be slightly larger than the surface to be detected of the wafer, and the corresponding lens can be used for shooting.

[0087] Further, the object to be detected 10 is a wafer, the surface to be detected is the front surface and / or the back surface of the wafer, and the preset feature is a macroscopic defect of the wafer. According to the summary of the actual application, the macroscopic defect generally includes color difference, watermark, bubble, scratch and process particle and the like. Different types of defects show different degrees of obviousness under the reflection of background images of different colors. According to the display effect, in the embodiment, the macroscopic defect can include a first defect category and a second defect category, the first defect category includes at least one of color difference, watermark and bubble, and the second defect category includes at least one of scratch and process particle. That is, each defect category can include multiple defect types.

[0088] When detecting the first defect category, the color of the background image corresponds to at least one color of the non-black color; when detecting the second defect category, the color of the background image corresponds to black. That is, the processing terminal 4 can control the imaging background system 1 to adjust the color of the background image according to the two defect categories, and at the same time, for the detection image corresponding to the defect category, only the defect detection and classification of the category can be performed, so as to reduce the operation amount of detection.

[0089] Therefore, the above step 3 can be divided into two cases according to whether the background image is non-black or black.

[0090] For example, when the color of the background image is at least one color of the non-black color, the preset angle includes at least two angles, and each preset angle corresponds to at least one color of the background image. The imaging effect of the detection image corresponding to the background image of the same color (non-black) under different angles is also different, so at least two preset angles of image shooting are performed to improve the defect detection rate.

[0091] At this time, step 3 can include:

[0092] Step 31: adjusting the surface to be detected to a preset angle corresponding to a preset color according to the color of the background image; or adjusting the background image to a preset color corresponding to the preset angle, for example, white, according to the preset angle.

[0093] For example, the processing terminal 4 controls the motion mechanism 3 to adjust the angle of the measured surface according to the color of the next background image to be displayed, or controls the imaging background system 1 to adjust to the preset color at the next preset angle to be adjusted.

[0094] Step 32: In the case that the non-black background image is the imaging background of the measured surface, the corresponding detection image of the measured surface is collected. At this time, the effect schematic diagram can be seen from Figure 6 .

[0095] For another example, when the color of the background image is black, the imaging effects of the corresponding detection images of the black background image at different angles are basically consistent, so when the color of the background image is black, the preset angle includes at least one angle.

[0096] At this time, step 3 can include:

[0097] Step 33: Adjust the measured surface to the preset angle. The preset angle can be one.

[0098] Step 34: In the case that the black background image is the imaging background of the measured surface, the corresponding detection image of the measured surface is collected. At this time, the effect schematic diagram can be seen from Figure 7 .

[0099] Step 4: Detect the preset feature of the measured surface according to the detection image. The processing terminal 4 can use any existing detection algorithm to detect the preset feature. When the measured object 10 is a wafer, the preset feature is the macroscopic defect of the wafer. The processing terminal 4 can also use template matching algorithm to identify the category and type of the defect, and classify the detected defects.

[0100] In step 4, the processing terminal 4 can also perform corresponding defect detection and classification according to the category and type of the defect corresponding to the detection image.

[0101] Example three:

[0102] In steps 3, 33 and 34 of the above example two, the corresponding relationship between the detection image and the measured object in the collection of the corresponding detection image of the measured object has many kinds, for example, one background image, one preset angle and one camera correspond, or one background image, one preset angle and multiple cameras correspond. Steps 31 to 34 are described in detail for the color of the background image.

[0103] The following describes how multiple cameras acquire images of the measured surface, wherein the multiple cameras are arranged in an array around the circumferential side of the measured object.

[0104] Scenario one: each camera corresponds to a preset angle setting; the camera corresponds to the preset angle setting, so that the optical axis of the camera is perpendicular to the surface to be measured as much as possible, the surface to be measured can be photographed by the camera, and the image is as close to the front view as possible.

[0105] At this time, the above step 3, step 33 or step 34 can include:

[0106] Step 35: control the surface to be measured to rotate to each camera corresponding to the preset angle in a preset order. Generally, it is rotated clockwise or counterclockwise, or it can be rotated in a specific order.

[0107] Step 36: control the camera to collect the detection image corresponding to the surface to be measured under the condition that the surface to be measured is rotated to the corresponding preset angle, and obtain a plurality of detection images corresponding to a plurality of cameras.

[0108] As Figure 8 shown, at this time, the image acquisition of the surface to be measured by one camera corresponding to one preset angle can be performed in the case of one or more background images of one or more colors as imaging background. Each camera respectively acquires the detection image corresponding to the surface to be measured at the corresponding preset angle. One camera at the corresponding preset angle can acquire one or more detection images corresponding to one or more background images. Among them, Figure 8 The detection image shown in the B area of Figure 8 may be represented as the detection image acquired by the same camera at the same preset angle, with the background image of the four colors (represented by shading) as the imaging background.

[0109] Figure 8 The detection image shown in the B area of Figure 8 may also be represented as the detection image acquired by different cameras at the corresponding preset angle, corresponding to the background image of the preset color, that is, one camera corresponds to one color of the background image, and each camera acquires the image at the corresponding preset angle.

[0110] At this time, the above step 4 can include:

[0111] According to the plurality of detection images corresponding to the plurality of cameras, the preset feature of the surface to be measured is detected.

[0112] Scenario two: as Figure 9 shown, due to the size of the imaging background system, there may be a case that the reflection of the background image to form a reflection image cannot completely cover the surface to be measured, at this time, a plurality of cameras can be used to acquire a plurality of sub-detection images, and the detection image of the background image completely covering the surface to be measured is spliced. Any existing possible splicing algorithm can be used to achieve this.

[0113] At this time, the above step 3, step 33 or step 34 can include:

[0114] Step 37: control the measured surface to rotate to each preset angle corresponding to each camera in a preset order.

[0115] Step 38: control the camera to capture a sub-detection image corresponding to the measured surface when the measured surface rotates to the corresponding preset angle, to obtain a plurality of sub-detection images corresponding to the plurality of cameras; wherein each sub-detection image includes a reflection image formed by part or all of the background image reflected on the partial region of the measured surface.

[0116] As shown in FIG. 4, at this time, under the background image of one color, a plurality of sub-detection images related to the background image of the color are obtained through image acquisition by a plurality of preset angles and corresponding cameras. Figure 9 Each of the sub-detection images in FIG. 4 is formed by a corresponding camera at a corresponding preset angle. Figure 9

[0117] Subsequently, the plurality of sub-detection images are spliced to obtain a spliced detection image related to the background image of the color.

[0118] At this time, the above step 4 can include:

[0119] According to the spliced detection image, the preset feature of the measured surface is detected.

[0120] Scenario three: the plurality of cameras can simultaneously capture detection images under each corresponding preset angle.

[0121] At this time, the above step 3, step 33 or step 34 can include:

[0122] Step 39: control the measured surface to rotate to each preset angle corresponding to each camera in a preset order.

[0123] Step 40: control the plurality of cameras to simultaneously capture a detection image corresponding to the measured surface when the measured surface rotates to each preset angle, to obtain a plurality of detection images corresponding to each preset angle.

[0124] As shown in FIG. 6, at this time, corresponding to each preset angle and each background image, the plurality of cameras simultaneously acquire images of the measured surface to form a plurality of corresponding detection images. Figure 8 The detection image shown in the A region of FIG. 6 can be represented as a detection image simultaneously acquired by the plurality of cameras under the same background image and the same preset angle. Figure 8

[0125] At this time, the above step 4 can include:

[0126] According to the plurality of detection images corresponding to each preset angle, the preset feature of the measured surface is detected.

[0127] ​​In the embodiment, the preset angle can be 0°-90°, and the four face inspection cameras 21 can be distributed on the outer periphery of the motion mechanism 3. The preset color can include at least one of black, white, green, blue, and yellow.

[0128] The three scenarios described in the embodiment are not limited to the specific way of acquiring detection images by the face inspection camera system. The focus of the present application is to acquire multiple detection images by using multiple imaging angles (corresponding to multiple preset angles), multiple spectrums (multiple colors of background images), and multiple cameras. The camera, the spectrum, and the imaging angle can be combined in multiple ways, so that different defects can be captured by the camera, thereby ensuring the detection rate and accuracy of the defects.

[0129] Although the embodiment and the first embodiment are described by taking the wafer as the object 10 to be measured as an example, the surface detection method and the surface detection device provided by the present application can be applied to other applicable objects 10 to be measured, such as glass, metal plates, and other objects 10 to be measured that need to be detected for surface defects.

[0130] Those skilled in the art can understand that all or part of the functions of the various methods in the above embodiments can be realized by hardware or by a computer program. When all or part of the functions in the above embodiments are realized by a computer program, the program can be stored in a computer-readable storage medium, which can include read-only memory, random access memory, magnetic disk, optical disk, hard disk, etc. The above functions are realized by executing the program by a computer. For example, the program is stored in the memory of the device, and when the program in the memory is executed by the processor, the above functions are realized. In addition, when all or part of the functions in the above embodiments are realized by a computer program, the program can also be stored in a server, another computer, a storage medium such as a disk, an optical disk, a flash disk, or a mobile hard disk, and is downloaded or copied into the memory of the local device or the system of the local device is updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments are realized.

[0131] The above application of specific examples is used to help understand the present application and does not limit the present application. For those skilled in the art to which the present application belongs, according to the idea of the present application, several simple deductions, deformations, or substitutions can be made.

Claims

1. A surface inspection method, characterized in that, include: Adjust the background image to a preset color, wherein the preset color includes at least one color; Adjust the test surface of the object to be tested to a preset angle, the preset angle including at least one angle, the preset angle reflecting the angle between the test surface and the horizontal plane; The background image is determined as the imaging background of the surface to be tested, and a detection image corresponding to the surface to be tested is acquired. The detection image includes a reflection image formed by part or all of the background image being reflected on the surface to be tested. Based on the detected image, a preset feature of the surface to be tested is detected; wherein: When the background image is at least one color other than black, the preset angle includes at least two angles, each preset angle corresponding to at least one color of the background image; acquiring the detection image corresponding to the surface under test includes: adjusting the surface under test to the preset angle corresponding to the preset color according to the color of the background image; or, adjusting the background image to the preset color corresponding to the preset angle according to the preset angle; when the non-black background image is the imaging background of the surface under test, acquiring the detection image corresponding to the surface under test; When the background image is black, the preset angle includes at least one angle; acquiring the detection image corresponding to the surface to be tested includes: adjusting the surface to be tested to the preset angle; when the black background image is the imaging background of the surface to be tested, acquiring the detection image corresponding to the surface to be tested; The object to be tested is a wafer, the surface to be tested is the front and / or back of the wafer, and the preset feature is a macroscopic defect of the wafer. The macroscopic defect includes a first defect category and a second defect category. The first defect category includes at least one of color difference, watermark, and bubble. The second defect category includes at least one of scratch and process particles. The method is used to detect the first defect category when the background image is at least one color other than black, and to detect the second defect category when the background image is black.

2. The surface detection method as described in claim 1, characterized in that, The preset angle is 0° to 90°, and / or the preset color includes at least one of black, white, green, blue, and yellow.

3. The surface detection method as described in claim 1, characterized in that, Multiple cameras are arranged in an array around the periphery of the object being measured; each camera corresponds to a preset angle setting. The acquisition of the detection image corresponding to the surface to be tested includes: The surface to be tested is controlled to rotate sequentially to the preset angle corresponding to each of the cameras in a preset order; When the surface to be tested is rotated to the corresponding preset angle, the camera is controlled to acquire the detection image corresponding to the surface to be tested, thereby obtaining multiple detection images corresponding to the multiple cameras; The step of detecting preset features of the surface to be tested based on the detected image includes: Based on the multiple detection images corresponding to the multiple cameras, the preset features of the surface to be tested are detected.

4. The surface detection method as described in claim 1, characterized in that, Multiple cameras are arranged in an array around the periphery of the object being measured; The acquisition of the detection image corresponding to the surface to be tested includes: The surface to be tested is controlled to rotate sequentially to the preset angle corresponding to each of the cameras in a preset order; When the surface to be tested is rotated to the corresponding preset angle, the camera is controlled to acquire a sub-detection image corresponding to the surface to be tested, thereby obtaining a plurality of sub-detection images corresponding to the plurality of cameras; wherein, each sub-detection image includes a reflection image formed by part or all of the background image being reflected on a part of the surface to be tested; The multiple sub-detection images are stitched together to obtain the stitched detection image; The step of detecting preset features of the surface to be tested based on the detected image includes: Based on the stitched detection image, preset features of the surface to be tested are detected.

5. The surface detection method as described in claim 1, characterized in that, Multiple cameras are arranged in an array around the periphery of the object being measured; The acquisition of the detection image corresponding to the surface to be tested includes: The surface to be tested is controlled to rotate sequentially to the preset angle corresponding to each of the cameras in a preset order; When the surface to be tested is rotated to each of the preset angles, the multiple cameras are controlled to simultaneously acquire the detection images corresponding to the surface to be tested, thereby obtaining multiple detection images corresponding to each preset angle. The step of detecting preset features of the surface to be tested based on the detected image includes: Based on the multiple detection images corresponding to each preset angle, preset features of the surface to be tested are detected.

6. A surface inspection device, characterized in that, include: An imaging background system is used to provide a background image of a preset color, wherein the preset color includes at least one color; the background image is the imaging background of the surface to be measured. A surface inspection camera system is used to acquire a detection image corresponding to the surface to be tested; wherein, the detection image includes a reflected image formed by part or all of the background image being reflected on the surface to be tested; A motion mechanism is used to adjust the test surface of the object to be tested to a preset angle, the preset angle including at least one angle; A processing terminal is configured to determine the background image as the imaging background of the surface to be tested, and to detect preset features of the surface to be tested based on the detection image; wherein the processing terminal is configured to execute the method as described in any one of claims 1 to 5.

7. A computer-readable storage medium, characterized in that, The medium stores a program that can be executed by a processor to implement the method as described in any one of claims 1-5.

Images