A method for manufacturing a display panel and a display panel

Abstract

Embodiments of the present application disclose a method for manufacturing a display panel and a display panel. The method for manufacturing the display panel includes the following manufacturing steps: providing an LED backplane, on one side surface of which there is a circuit structure; spraying a printing material on the side of the LED backplane close to the circuit structure, and forming a first reflective layer after curing; printing a screen printing material on the first reflective layer, and forming a second reflective layer after curing. The beneficial effects of the embodiments of the present application are as follows. In the method for manufacturing a display panel and the display panel in the embodiments of the present application, the first reflective layer is first sprayed by an inkjet printing method on the LED backplane, avoiding direct contact between the manufacturing device and the LED backplane. While the first reflective layer improves the reflectivity of the display panel, it also serves as a protective layer for the LED backplane. The second reflective layer is printed by screen printing on the first reflective layer, and the reflectivity of the second reflective layer is higher than that of the first reflective layer, thereby further improving the light emission brightness of the display panel.

Description

Technical Field

[0001] This application relates to the field of displays, and particularly to a method for manufacturing a display panel and a display panel. Background Art

[0002] AM Mini LED displays have the characteristics of high brightness, strong gray-scale performance, high color saturation, and high-definition dynamic picture quality. Coupled with the unique advantages of being easy to store and install, they can replace traditional displays and projectors. Since the mini process requires applying solder paste, the current solder paste application process mainly uses the stencil printing method. In this printing method, since the stencil and the backplane are in direct contact during the printing process and there is a certain pressure, it is easy to cause the circuit on the substrate to be damaged by pressure, ultimately resulting in electrical NG. Summary of the Invention

[0003] Embodiments of this application provide a method for manufacturing a display panel and a display panel, which can solve the technical problem that the substrate of the display panel is easily damaged during the manufacturing process in the prior art.

[0004] Embodiments of this application provide a method for manufacturing a display panel, including the following manufacturing steps:

[0005] Provide an LED backplane, one side surface of which is provided with a circuit structure; spray a printing material on the side of the LED backplane close to the circuit structure, and form a first reflective layer after curing; print a screen printing material on the first reflective layer, and form a second reflective layer after curing.

[0006] Optionally, in some embodiments of this application, after the step of manufacturing the second reflective layer, the following manufacturing steps are further included:

[0007] Solder LED lamp beads on the second reflective layer, and the LED lamp beads are connected to the circuit structure.

[0008] Optionally, in some embodiments of this application, the circuit structure includes:

[0009] A first metal layer;

[0010] A first insulating layer, provided on the side surface of the first metal layer away from the LED backplane;

[0011] A second metal layer, provided on the side surface of the first insulating layer away from the first metal layer;

[0012] A second insulating layer, provided on the side surface of the second metal layer away from the first insulating layer.

[0013] Optionally, in some embodiments of this application, the printing material is white oil, and its reflectivity is 60% - 80%.

[0014] Optionally, in some embodiments of the present application, the thickness of the first reflective layer is 5 μm to 15 μm.

[0015] Optionally, in some embodiments of the present application, the screen printing material is a mixture of white oil and titanium dioxide, and its reflectivity is 92% to 99%.

[0016] Optionally, in some embodiments of the present application, the thickness of the second reflective layer is 30 μm to 60 μm.

[0017] Optionally, in some embodiments of the present application, the hardness of the first reflective layer and the second reflective layer is 5H to 25H.

[0018] Optionally, in some embodiments of the present application, the printing material and / or the screen printing material is cured by exposure and development.

[0019] Correspondingly, an embodiment of the present application further provides a display panel, which is prepared by the preparation method of the above-mentioned display panel.

[0020] The beneficial effect of the embodiment of the present application is that in the preparation method of a display panel and the display panel in the embodiment of the present application, a first reflective layer is first sprayed on the LED backplane by printing, avoiding direct contact between the preparation device and the LED backplane. While improving the reflectivity of the display panel, the first reflective layer also serves as a protective layer for the LED backplane. A second reflective layer is screen-printed on the first reflective layer, and the reflectivity of the second reflective layer is higher than that of the first reflective layer, thereby further improving the light output brightness of the display panel. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a schematic structural diagram of the display panel provided by the embodiment of the present application;

[0023] Figure 2 It is a schematic diagram of the circuit structure provided by the embodiment of the present application;

[0024] Figure 3 It is a schematic diagram of the circuit structure, the first reflective layer and the second reflective layer provided by the embodiment of the present application;

[0025] Figure 4 It is a flowchart of the preparation method of the display panel provided by the embodiment of the present application.

[0026] Description of reference numerals:

[0027] LED back plate 100; first reflective layer 200;

[0028] The second reflective layer 300; LED lamp beads 400;

[0029] Circuit structure 110; First metal layer 111;

[0030] A first insulating layer 112; A second metal layer 113;

[0031] The second insulating layer 114 . DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0033] Example

[0034] In this embodiment, the display panel of the present invention is an active matrix (AM) mini LED display panel, that is, a display panel that drives the LED lamp bead switch through a thin film transistor unit, and has the technical effects of high brightness, strong grayscale performance, high color saturation, and high-definition dynamic image quality, and at the same time has the advantages of being small and easy to store and install, such as Figure 1 As shown, the display panel in this embodiment includes an LED backplane 100 , a first reflective layer 200 , a second reflective layer 300 and LED lamp beads 400 .

[0035] like Figure 2 and Figure 3As shown in the figure, specifically, the LED backplane 100 is an array substrate, and a number of independently controlled thin film transistor units are provided inside it. The thin film transistor units include a circuit structure 110 provided inside the LED backplane 100. The circuit structure 110 includes a first metal layer 111, a first insulating layer 112, a second metal layer 113, and a second insulating layer 114. Among them, the first metal layer 111 and the second metal layer 113 are insulated by the first insulating layer 112. The first insulating layer 112 is mainly used to prevent the first metal layer 111 and the second metal layer 113 from being connected, reducing the probability of short circuit in the above display panel.

[0036] The first reflective layer 200 is provided on the side of the LED backplane 100 close to the circuit structure 110. The first reflective layer 200 is made of white oil material. The white oil material is a high-reflectivity material with a white appearance, which can reflect all colors of light, thereby improving the light output brightness of the display panel. In this embodiment, the first reflective layer 200 is prepared by spraying. Its reflectivity is 60% - 80%, the thickness is 5μm - 15μm, and the material hardness is greater than 5H.

[0037] In order to further increase the light output brightness of the above display panel, in this embodiment, a second reflective layer 300 is also prepared on the first reflective layer 200. The second reflective layer 300 is provided on the surface of the first reflective layer 200 away from the LED backplane 100. The material of the second reflective layer 300 is also white oil material. The difference from the first reflective layer 200 is that a large amount of titanium dioxide is mixed in the second reflective layer 300, thereby improving the reflectivity of the second reflective layer 300. In this embodiment, the reflectivity of the second reflective layer 300 is 92% - 99%, the thickness is 30μm - 60μm, and the material hardness is greater than 5H. Since the particles of titanium dioxide are too large, it will cause nozzle blockage. Therefore, the second reflective layer 300 is prepared by screen printing. During the preparation process of screen printing, since the first reflective layer 200 is "padded" on the LED backplane 100, the screen printing equipment will not leave scratches on the surface of the LED backplane 100, nor will it cause the first insulating layer 112 of the circuit structure 110 to crack, avoiding the risk of short circuit between the first metal layer 111 and the second metal layer 113.

[0038] The LED lamp beads 400 are provided on the surface of the second reflective layer 300 away from the LED backplane 100. Specifically, a layer of solder paste is also coated between the LED lamp beads 400 and the second reflective layer 300. The solder paste is used to weld the LED lamp beads 400 and the LED backplane 100. During the coating process of the solder paste, the solder paste is printed on the second reflective layer 300 by means of stencil printing, avoiding the direct contact of the stencil with the LED backplane 100 and avoiding the damage of the circuit structure 110 inside the LED backplane 100 caused by the pressure of the stencil on the LED backplane 100.

[0039] Specifically, for better explaining the present invention, in this embodiment, a method for manufacturing the above display panel is further provided, as Figure 4 shown, and the specific steps are as follows:

[0040] S1) Provide an LED backplane 100, on one side surface of which there is a circuit structure 110. The circuit structure 110 includes a first metal layer 111, a first insulating layer 112, a second metal layer 113, and a second insulating layer 114 that are stacked.

[0041] S2) Spray and print white oil on the side of the LED backplane 100 close to the circuit structure 110. After curing, a first reflective layer 200 is formed. The nozzle for spraying the white oil does not need to contact the LED backplane 100, thereby avoiding scratching the surface of the LED backplane 100. The first reflective layer 200 serves as a protective layer for the LED backplane 100 while improving the reflectivity, preventing it from being scratched when preparing the second reflective layer 300 subsequently.

[0042] S3) Screen-print white oil on the first reflective layer 200. After curing, a second reflective layer 300 is formed. A large amount of titanium dioxide material is mixed in the screen-printed white oil, thereby greatly improving the reflection efficiency of the second reflective layer 300, which can meet the high reflectivity requirements of the display panel. Screen-printing on the first reflective layer 200 avoids scratching the LED backplane 100 by the equipment used for screen printing.

[0043] S4) Solder LED lamp beads 400 on the second reflective layer 300, and the LED lamp beads 400 are connected to the circuit structure 100.

[0044] The beneficial effect of this embodiment is that in the method for manufacturing a display panel and the display panel in this embodiment, the first reflective layer is first sprayed on the LED backplane by a spraying method, avoiding direct contact between the manufacturing device and the LED backplane. The first reflective layer serves as a protective layer for the LED backplane while improving the reflectivity of the display panel. The second reflective layer is screen-printed on the first reflective layer, and the reflectivity of the second reflective layer is higher than that of the first reflective layer, thereby further improving the light-emitting brightness of the display panel.

[0045] The above has introduced in detail a method for manufacturing a display panel and the display panel provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A method for manufacturing a display panel, characterized in that, Comprising the following preparation steps: Provide an LED backplane, on one side surface of which there is a circuit structure; Spray and print a printing material on the side of the LED backplane close to the circuit structure, and form a first reflective layer after curing, the printing material being white oil; Print a screen printing material on the first reflective layer, and form a second reflective layer after curing, the screen printing material being a mixture of white oil and titanium dioxide, and the reflectivity of the second reflective layer being higher than that of the first reflective layer.

2. The manufacturing method of the display panel according to claim 1, wherein, After the preparation step of the second reflective layer, the following preparation steps are further included: Weld LED lamp beads on the second reflective layer, and the LED lamp beads are connected to the circuit structure.

3. The method for preparing a display panel according to claim 1, wherein The circuit structure includes A first metal layer; A first insulating layer provided on the side surface of the first metal layer away from the LED backplane; A second metal layer provided on the side surface of the first insulating layer away from the first metal layer; A second insulating layer provided on the side surface of the second metal layer away from the first insulating layer.

4. The method for preparing a display panel according to claim 1, wherein The reflectivity of the printing material is 60% - 80%.

5. The method for preparing a display panel according to claim 1, wherein The thickness of the first reflective layer is 5μm - 15μm.

6. The method for preparing a display panel according to claim 1, wherein The reflectivity of the screen printing material is 92% - 99%.

7. The method for preparing a display panel according to claim 1, wherein The thickness of the second reflective layer is 30μm - 60μm.

8. The method for preparing a display panel according to claim 1, wherein The hardness of the first reflective layer and the second reflective layer is 5H - 25H.

9. The method for preparing a display panel according to claim 1, wherein The printing material and / or the screen printing material is cured by means of exposure and development.

10. A display panel, characterized in that, Prepared by the method for preparing a display panel according to any one of claims 1 - 9.

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