Display chip and display device

Abstract

The present application discloses a display chip and a display device, including a substrate and a plurality of pixel units, each pixel unit includes a light-emitting device, an anode, and a cathode, and the display chip also includes a plurality of N-lines and a plurality of P-lines, wherein the N-line connects the cathodes of the plurality of pixel units in the same row, and the P-line connects the anodes of the plurality of pixel units in the same column; each pixel unit forms an island protruding from the surface of the substrate on the substrate, each island has two ends, the N-line covers part of the side surface and the step surface of the island, and forms a coating on the cathode of the island in two directions or more. The present application can increase the contact area between the N-line and the island and reduce the line breakage rate.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor display devices, and in particular, relates to a micro light emitting diode display chip. Background Art

[0002] In the field of display technology, displays made using semiconductor processing methods, such as OLED, Mini-LED, and Micro-LED, have received increasing research and attention in recent years due to their many advantages such as low power consumption, high resolution, high contrast, and zero latency. They also represent the development of the latest generation of display technology.

[0003] For semiconductor display devices, the driving modes are generally divided into two types: passive matrix (PM) and active matrix (AM). In the PM driving mode, and the common electrode AM driving mode, the anode of each column of LED pixels is connected through a column scan line (P-line), and the cathode of each row of LED pixels is connected through a row scan line (N-line). When a column scan line and a row scan line are selected, the LED pixels at their intersections will be lit, and through high-speed point-by-point scanning, a continuously changing picture can be displayed.

[0004] See also Figure 1 , 2 As shown in FIG. 3 , in the prior art, the row scan line and the column scan line are connected to the cathode and the anode of each pixel respectively through the contact metal. However, due to the process of each pixel, an undulating island structure (ISO island) is formed, in which the metal connection line covers the Figure 2 In the island structure shown in the figure, since the deposition and climbing of the metal are directional, the metal coverage thickness on the horizontal and vertical planes is often different, and metal disconnection in a certain direction is prone to occur, affecting the stability and reliability of the display chip. Therefore, how to overcome the problem of metal disconnection is an urgent problem to be solved in order to improve the yield of semiconductor display device products. Summary of the invention

[0005] In order to solve the technical problem of metal disconnection, the present application provides a display device capable of avoiding metal disconnection.

[0006] In order to achieve the purpose of the above application, the present application adopts the following technical scheme: a display chip, including a substrate and a plurality of pixel units arranged in rows and columns on the substrate, each of the pixel units respectively including a light-emitting device, an anode and a cathode respectively forming contact with the light-emitting device, the display chip also includes multiple N-lines and multiple P-lines, the N-lines connect the cathodes of multiple pixel units located in the same row, and the P-lines connect the anodes of multiple pixel units located in the same column; the cathodes of each of the pixel units respectively form islands protruding from the surface of the substrate on the substrate, the islands have flat step surfaces and side surfaces connecting the step surfaces and the substrate, the N-lines cover part of the side surfaces and step surfaces of the islands, and form a coating on the island cathodes in more than or equal to two directions.

[0007] In one embodiment of the present application, each of the islands has two ends respectively, and the N-line includes a slender portion extending along the row direction and a covering portion covering the ends of each of the islands, the width of the covering portion is greater than the width of the slender portion, and the covering portion covers the ends.

[0008] In one embodiment of the present application, the N-line forms a cover on the island cathode in two directions perpendicular to each other.

[0009] In one embodiment of the present application, three side surfaces of the end of the island are all wrapped by the N-line.

[0010] In one embodiment of the present application, on the plane where the substrate is located, the projection of the island is in a concave shape, an oblong shape, or a dumbbell shape, and the light-emitting device is located between two ends of the island.

[0011] Another embodiment of the present application is to provide a display device having the above-mentioned display chip.

[0012] In order to achieve the invention purpose of the present application, the present application also provides a second technical solution: a display chip, comprising a substrate and a plurality of pixel units arranged in rows and columns on the substrate, each of the pixel units respectively comprising a light-emitting device, an anode and a cathode respectively contacting the light-emitting device, a plurality of the pixel units are connected in pairs along the row direction, and form an island protruding from the surface of the substrate on the substrate, the display chip also comprises a plurality of N-lines and a plurality of P-lines, the N-lines connect the cathodes of a plurality of pixel units in the same row, the P-lines connect the anodes of a plurality of pixel units in the same column, and the cathodes of a pair of pixel units on the same island are flush with each other.

[0013] In an embodiment corresponding to this technical solution, the island is in the shape of an elongated strip or ribbon.

[0014] In an embodiment corresponding to the technical solution, each of the islands has two ends, and the N-line includes a slender portion extending along the row direction and a covering portion covering each of the island ends, and the width of the covering portion is greater than the width of the slender portion.

[0015] The present application also provides another solution: providing a display device having the above-mentioned display chip.

[0016] Compared with the prior art, the present application achieves the following beneficial effects: by means of designing special patterns for pixel units and metal conductor layers, the present application achieves the effect of maintaining electrical conduction at other positions even if the metal wire is broken in a certain direction. Therefore, the present application can improve the yield and stability of display chip devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a cross-sectional view of a display chip in the prior art;

[0018] Figure 2 It is a schematic diagram of the 3D structure of a display chip in the prior art;

[0019] Figure 3 It is a schematic diagram of the planar structure of a display chip in the prior art;

[0020] Figure 4 is a schematic diagram of a planar structural layout of a display chip in the first embodiment of the present application;

[0021] Figure 5 is a schematic diagram of the planar structural layout of a display chip in the second embodiment of the present application;

[0022] Figure 6 is a schematic diagram of the planar structural layout of a display chip in Embodiment 3 of the present application;

[0023] Figure 7 is a schematic diagram of the planar structural layout of a display chip in the fourth embodiment of the present application;

[0024] Figure 8 It is a schematic diagram of the planar structural layout of the display chip in the fifth embodiment of the present application.

[0025] Among them: 10, substrate; 20, pixel unit; 21, light-emitting device; 22, anode; 23, cathode; 30, insulating layer; 40, N-line; 41, slender portion; 42, covering portion; 50, P-line; 60, island; 61, end portion; 62, step surface; 63, side surface. DETAILED DESCRIPTION

[0026] In order to describe the technical content, structural features, achieved purposes and effects of the application in detail, the following will be described in detail in conjunction with the embodiments and with the accompanying drawings. In the following description, for the purpose of explanation, many specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the application. However, various exemplary embodiments may also be implemented without these specific details or in the case of one or more equivalent arrangements. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the concept of the application, the specific shape, structure and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0027] Unless otherwise specified, the exemplary embodiments shown will be understood as providing exemplary features of different details of some ways in which the application concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of different embodiments can be further combined, separated, interchanged and / or rearranged without departing from the application concept.

[0028] For descriptive purposes, spatially relative terms such as "under," "below," "under," "down," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein to describe the relationship of one element to another (other) element as shown in the accompanying drawings. Spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as "under" or "beneath" other elements or features will subsequently be positioned as "above" the other elements or features. Thus, the exemplary term "under" can include both above and below orientations. In addition, the device can be positioned otherwise (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptors used herein are interpreted accordingly.

[0029] The present application discloses an LED display chip, which belongs to the field of semiconductor solid-state display technology, and may specifically be a Micro-LED or Mini-LED.

[0030] See also Figure 1The display chip is a vertical LED structure, which includes a substrate 10 and a plurality of pixel units 20 arranged in rows and columns on the substrate 10, each pixel unit 20 includes a light emitting device 21, an anode 22 and a cathode 23 respectively in contact with the light emitting device 21. The anode 22 and the cathode 23 are respectively in electrical contact with the light emitting device 21. The pixel units 20 are separated from each other by negative structures such as grooves, so that each pixel unit can form a relatively protruding island structure.

[0031] Each layer of the cathode 23, the light emitting device 21, and the anode 22 is grown according to a semiconductor epitaxial process, and conventional materials and structures can be used.

[0032] Figure 4 The structure shown is the first embodiment provided by the present application, and the display chip also includes multiple N-lines 40 and multiple P-lines 50. N-line 40 connects the cathodes 23 of multiple pixel units 20 located in the same row. P-line 50 connects the anodes 22 of multiple pixel units 20 located in the same column. N-line 40 and P-line 50 are respectively in two upper and lower metal layers and are not connected to each other. The cathodes of each pixel unit 20 form islands 60 protruding from the surface of the substrate 10 on the substrate 10. N-line 40 and P-line 50 overlap above the island 60.

[0033] Each island 60 has a flat step surface and a side surface connecting the step surface and the substrate, and the N-line is attached to the surface of the substrate and the island by metal deposition. Different from the traditional solution, the present application aims to increase the direction of metal material covering the cathode, that is, to make the N-line metal cover the cathode material from multiple directions as much as possible, so as to overcome the problems of uneven metal material in various parts of the wire and metal breakage caused by different deposition speeds and deposition efficiencies in various directions during the metal deposition process. The multiple directions mentioned here refer to the directions of any two straight lines on the same plane, preferably two or three mutually perpendicular directions.

[0034] To ensure that the N-line conductor can cover the cathode material in more directions, in one embodiment of the present application, each island 60 is designed to have two ends 61. The two ends may be protruding from other parts of the island (e.g. Figure 4 ), or it can be formed by extending from the main part of the island to both sides (such as Figure 5 ).

[0035] In one embodiment of the present application, N-line 40 includes an elongated portion 41 extending in the row direction and a covering portion 42 covering the end 61 of each island 60. The width of the elongated portion 41 is similar to the width of the existing wire, and the elongated portion is mainly distributed on a flat surface, so there is no risk of wire breakage. The covering portion 42 is a larger portion extending from the elongated portion 41, mainly distributed around the island portion, and the width of the covering portion is greater than the width of the elongated portion 41, and is used to cover the side surfaces of the end 61 in multiple directions. In particular, the covering portion has the best effect of covering the three side surfaces of the end 61, so that even if there is a metal wire breakage in some areas, it will not affect the good electrical contact between the cathode and N-line 40.

[0036] In the first embodiment of the present application, the projection of the island 60 on the plane where the substrate 10 is located is in a concave shape. Figure 5 In the second embodiment shown, the projection of the island 60 is an oblong. In other embodiments of the present application, the island 60 may also be in a dumbbell shape or other shapes with multiple sides, and the light emitting device 21 is located between the two ends 61 of the island. The shape of the ISO island 60 is configured to have sides in multiple directions, so that the metal can climb the slope from multiple directions, and when the metal deposition climbs and breaks in one direction, it can still be ensured that the metal will not break.

[0037] The shapes of the above pixel units, N-line and P-line can be made by a graphical method. By designing special patterns for the island structure and N-line, the contact area between the coating and the cathode is increased, forming a more complete contact, thereby achieving a good electrical conduction.

[0038] exist Figure 6 , 7 In the third, fourth and fifth embodiments shown in FIG. 8 , the display chip includes a substrate 10 and a plurality of pixel units 20 arranged in rows and columns on the substrate 10. Each pixel unit 20 includes a light emitting device 21, an anode 22 and a cathode 23 respectively in contact with the light emitting device 21. The pixel units are paired to share an island structure. A pair of pixel units 20 adjacent to each other in the row direction are connected to form an island 60 protruding from the surface of the substrate 10 on the substrate 10. The display chip also includes a plurality of N-lines 40 and a plurality of P-lines 50. The N-line 40 connects the cathodes of the plurality of pixel units 20 in the same row, and the P-line 50 connects the anodes 23 of the plurality of pixel units 20 in the same column. The cathodes of a pair of pixel units 20 located on the same island 60 are flush in height, that is, a highly uniform flat surface is formed on the island 60. Therefore, when the N-line connects the cathodes of the two pixel units on the island, no metal climbing is required, thereby reducing the risk of metal disconnection.

[0039] Please continue to see, Figure 6 In the third embodiment shown, the island 60 is in the shape of a long strip, and both the N-line 40 and the P-line 50 are wires with uniform width.

[0040] Figure 7 In the fourth embodiment shown, the island 60 is in a concave shape, and the two ends of the island 60 have ends 61 protruding from the main part of the island, respectively. The N-line 40 includes a slender portion 41 extending in the row direction and a covering portion 42 covering the ends 61 of each island 60. The covering portion 42 is roughly rectangular, and its width is greater than the width of the slender portion 41, so as to cover the side surface of the end 61 in multiple directions. In this way, only the P-line 50 needs to climb at point a and go downhill at point b, and the N-line can significantly reduce the disconnection rate. In some embodiments, a flattening layer (organic glue) is also made before making the second conductor 50 to further ensure that the second conductor is not disconnected.

[0041] Figure 8 In the embodiment shown, the island 60 is in an oblong shape. Both ends 61 of the island 60 are in an arc shape. The N-line 40 includes an elongated portion 41 extending along the row direction and a covering portion 42 covering the ends 61 of each island 60. The covering portion 42 is generally circular and completely covers the ends 61 of the island 60.

[0042] The present application further discloses a display device, which is manufactured using the display chip in any one of the aforementioned embodiments.

[0043] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present application. Without departing from the spirit and scope of the present application, the present application may have various changes and improvements, and the scope of protection required by the present application is defined by the attached claims, description and their equivalents.

Claims

1. A display chip, comprising a substrate (10) and a plurality of pixel units (20) arranged in rows and columns on the substrate (10), each of the pixel units (20) comprising a light emitting device (21), an anode (22) and a cathode (23) respectively contacting the light emitting device (21), the display chip further comprising a plurality of N-lines (40) and a plurality of P-lines (50), the N-lines (40) connecting the cathodes (23) of the plurality of pixel units (20) located in the same row, and the P-lines (50) connecting the anodes (22) of the plurality of pixel units (20) located in the same column; the cathodes of the plurality of pixel units (20) respectively form islands (60) protruding from the surface of the substrate (10) on the substrate (10), the islands (60) having a flat step surface (62) and a side surface (63) connecting the step surface and the substrate (10), characterized in that: The N-line (40) covers part of the side surface and the step surface of the island (60), and forms a sheath around the cathode of the island (60) in two or more directions.

2. The display chip according to claim 1, characterized in that: Each of the islands (60) has two ends (61), and the N-line (40) includes a slender portion (41) extending along the row direction and a covering portion (42) covering the end portion (61) of each of the islands (60), wherein the width of the covering portion (42) is greater than the width of the slender portion (41), and the covering portion (42) covers the end portion (61).

3. The cathode of the display chip according to claim 1, characterized in that: The N-line (40) forms a cover on the cathode of the island (60) in two directions perpendicular to each other.

4. The display chip according to claim 1, characterized in that: The end (61) of the island (60) has three side surfaces all wrapped by the N-line (40).

5. The display chip according to claim 1, characterized in that: On the plane where the substrate (10) is located, the projection of the island (60) is in the shape of a concave letter, an oblong, or a dumbbell, and the light-emitting device (21) is located between two ends (61) of the island.

6. A display device, characterized in that: Comprising the display chip as described in any one of claims 1-5.

7. A display chip, characterized in that: The display chip comprises a substrate (10) and a plurality of pixel units (20) arranged in rows and columns on the substrate (10), wherein each of the pixel units (20) comprises a light-emitting device (21), an anode (22) and a cathode (23) respectively contacting the light-emitting device (21), wherein the plurality of pixel units (20) are connected in pairs along a row direction and form an island (60) protruding from the surface of the substrate (10) on the substrate (10), and the display chip further comprises a plurality of N-lines (40) and a plurality of P-lines (50), wherein the N-lines (40 ) connects cathodes of a plurality of pixel units (20) located in the same row, the P-line (50) connects anodes (23) of a plurality of pixel units (20) located in the same column, the cathodes of a pair of pixel units (20) located on the same island (60) are flush with each other, each of the islands (60) has two ends (61), the N-line (40) comprises an elongated portion (41) extending in the row direction and a covering portion (42) covering the ends (61) of each of the islands (60), and the width of the covering portion (42) is greater than the width of the elongated portion (41).

8. The display chip according to claim 7, characterized in that: The island (60) is in the shape of an elongated strip or a ribbon.

9. A display device, characterized in that: Comprising a display chip as described in any one of claims 7-8.

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