LGA socket

Abstract

The present invention provides an LGA socket that can prevent crosstalk during high-speed transmission and can prevent damage to contact members caused by warping of a semiconductor package. The LGA socket includes: a first insulator; a second insulator; a center substrate sandwiched between the first insulator and the second insulator from above and below, which is composed of a multi-layer structure including a ground layer and is formed with a plurality of through holes penetrating between one side of a first opening and one side of a second opening; a plurality of pairs of contact members inserted into the through holes from one side of the first opening and one side of the second opening and electrically connected to each other by soldering; and a first resin member disposed on one side of the first opening of the center substrate. The first resin member has a first base portion that supports the contact members and a first stopper that extends upward from the first base portion and abuts against a package fitted into the first opening.

Description

Technical Field

[0001] The present invention relates to a socket for a semiconductor package of the LGA (Land Grid Array) type. Background Art

[0002] As a document disclosing a technology related to such a socket, there is Patent Document 1. The socket described in Patent Document 1 is used for centering and adjusting signal transmission between a semiconductor package and a circuit board. The socket has a rectangular plate-shaped housing, a frame, contacts, and conductive pads. The housing has a plurality of through holes arranged two-dimensionally, and the inner wall surfaces of these through holes are plated with a conductive material. The frame is fixed to the peripheral portion of the upper surface of the housing. The contacts are two-dimensionally arranged on the upper surface of the housing. The conductive pads are electrically connected to the conductive material on the inner wall surface of the through holes and extend from the through holes. Among the contacts of this socket, the width of the press-in portion pushed into the through hole is slightly larger than the inner diameter of the through hole. When the press-in portion is pressed into the through hole, it is elastically deformed by being squeezed by the inner wall surface of the through hole, so that the position or posture of the contact in the contact is temporarily fixed.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2018 - 174017 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In addition, among such sockets, there are sockets with a signal transmission speed of several Gbps to several hundred Gbps or sockets with several hundred to several thousand contacts. However, since the socket of Patent Document 1 is formed of an insulating plate material for the housing, it is difficult to suppress crosstalk generated during high-speed transmission. In addition, the socket of Patent Document 1 has a structure in which the semiconductor package is supported only by the frame at the peripheral portion of the housing. Therefore, the central portion of the semiconductor package is warped downward, and it is possible to press the contacts below it and break them.

[0008] The present invention has been completed in view of such problems, and an object thereof is to provide an LGA socket that can prevent crosstalk from occurring during high-speed transmission and can prevent damage to contacts caused by warping of a semiconductor package.

[0009] Means for Solving the Problems

[0010] To solve the above problems, an LGA socket as a preferred embodiment of the present invention includes: a first insulator having a wall portion surrounding a first opening; a second insulator having a wall portion surrounding a second opening; a center substrate sandwiched between the first insulator and the second insulator from above and below, the center substrate being composed of a multi-layer structure including a ground layer and formed with a plurality of through holes penetrating between one side of the first opening and one side of the second opening; a plurality of pairs of contacts inserted into the through holes from one side of the first opening and one side of the second opening and welded via the through holes to be electrically connected to each other; and a first resin member disposed on the first opening side of the center substrate, the first resin member having a first base portion supporting the contacts and a first stopper extending upward from the first base portion and abutting against a package fitted into the first opening.

[0011] In this embodiment, it may also be that the plurality of pairs of contacts are arranged in i rows and j columns, the contacts in each row on the first opening side are supported by the first resin member, and a plurality of the first stoppers are provided in the first resin member side by side along the rows or columns of the contacts.

[0012] Alternatively, the plurality of contacts in each row and the first resin member may be integrally formed by insert molding.

[0013] Alternatively, the contact has an extension portion extending vertically and partially inserted into the through hole and an inclined portion inclinedly extending from one end of the extension portion, the first resin member has a support surface facing the same side as the inclined side of the inclined portion, and the extension portion is fixed to the support surface.

[0014] Alternatively, the upper end of the first stopper is located above the upper end of the extension portion and below the upper end of the wall portion surrounding the first opening.

[0015] Alternatively, convex portions are provided on both sides of the support surface of the first base portion, and slits are provided in the convex portions, and the extension portion of the contact is fitted into the slits.

[0016] Alternatively, protrusions are provided on the support surface, holes are provided in the extension portion, and the protrusions are fitted into the holes.

[0017] Alternatively, a second resin member is provided, the second resin member is disposed on the second opening side of the center substrate and supports the contacts on the second opening side, the second resin member has a second base portion supporting the contacts and a second stopper extending downward from the second base portion and abutting against a circuit board on which the LGA socket is mounted.

[0018] Alternatively, it may be that each of the contact members on one side of the second opening portion is supported by the second resin member, and a plurality of the second stoppers are provided in the second resin member and arranged side by side along the rows or columns of the contact members.

[0019] Advantages of the Invention

[0020] The LGA socket of the present invention includes: a first insulator having a wall portion surrounding a first opening; a second insulator having a wall portion surrounding a second opening; a center substrate sandwiched between the first insulator and the second insulator from above and below, the center substrate being composed of a multi-layer structure including a ground layer and having a plurality of through holes formed therethrough between one side of the first opening and one side of the second opening; a plurality of pairs of contact members inserted into the through holes from one side of the first opening and one side of the second opening and welded via the through holes to be electrically connected to each other; and a first resin member disposed on one side of the first opening of the center substrate, the first resin member having a first base portion supporting the contact members and a first stopper extending upward from the first base portion and abutting against a package fitted into the first opening. Thus, when the semiconductor package is fitted into the first opening, the first stopper contacts the lower surface of the package to restrict its tilting, and it is difficult for the vertical portions of the contact members to topple over. Therefore, an LGA socket can be provided that can prevent crosstalk from occurring during high-speed transmission and can prevent damage to the contact members caused by tilting of the semiconductor package. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. 1 is a perspective view of a socket 100 according to an embodiment of the present invention.

[0022] Figure 2 FIG. 2 is Figure 1 a cross-sectional view of a YZ cross-section after the socket 100 is mounted on a circuit board 106 and a semiconductor package 105 is mounted in a first opening 10 of the socket 100.

[0023] FIG. 3(A) is a view of a first resin member 81-i and contact members 71-i-j (j = 1 to 13) of Figure 2 viewed from the +Z side, FIG. 3(B) is an enlarged view of the area within the frame of FIG. 3(A), and FIG. 3(C) is a view of FIG. 3(A) viewed from the -X side.

[0024] Figure 4 FIG. 4 is a perspective view of FIG. 3(A) viewed from another aspect. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] An LGA socket 100 as an embodiment of the present invention will be described. The LGA socket 100 is used by being mounted on a circuit board 106. A semiconductor package 105 is fitted into a first opening 10 of the LGA socket 100. When the package 105 is fitted into the first opening 10 of the LGA socket 100, signals can be transmitted at high speed between the circuit board 106 and the package 105.

[0026] In the following description, the fitting direction of the LGA socket 100 and the package 105 is appropriately referred to as the Z direction, one direction orthogonal to the Z direction is appropriately referred to as the X direction, and the direction orthogonal to both the Z direction and the X direction is appropriately referred to as the Y direction. In addition, the +Z side on the package 105 side in the Z direction is referred to as the upper side, and the -Z side on the LGA socket 100 side is referred to as the lower side. Further, the +X side in the X direction is referred to as the left side, the -X side is referred to as the right side, the +Y side in the Y direction is referred to as the front side, and the -Y side is referred to as the rear side.

[0027] The LGA socket 100 includes: a first insulator 1 having a first opening 10; a second insulator 2 having a second opening 20; a center substrate 3 sandwiched between the first insulator 1 and the second insulator 2 from above and below; pins 6 screwed into screw holes at six positions on the peripheral portions of the first insulator 1, the center substrate 3, and the second insulator 2; metal springs 5 held at four corners of the first insulator 1; 195 pairs of contacts 71 - i (i = 1 to 15) - j (j = 1 to 13) and contacts 72 - i (i = 1 to 15) - j (j = 1 to 13), these contacts being inserted into through holes 30 - i (i = 1 to 15) - j (j = 1 to 13) of the center substrate 3 from the first opening 10 side and the second opening 20 side (i and j are natural numbers of 2 or more), and being welded via the through holes 30 - i (i = 1 to 15) - j (j = 1 to 13) to be electrically connected to each other; and first resin members 81 - i (j = 1 to 13) and second resin members 82 - i (j = 1 to 13) disposed on the first opening 10 side and the second opening 20 side of the center substrate 3.

[0028] The first insulator 1 is in a square frame shape. The first insulator 1 has two pairs of wall portions 13 and 14 surrounding the first opening 10. There is a holding portion 50 at the corner where the wall portion 13 and the wall portion 14 intersect, and a metal spring 5 is held in the holding portion 50. The metal spring 5 applies an inward force to the package 105 when the package 105 is fitted into the first opening 10 to support the adjustment of the fitting position.

[0029] As Figure 1 shown, portions of the inner surfaces of the wall portions 13 and 14 that are slightly lower than the bottom of the holding portion 50 protrude inward as inner edge portions 17. As Figure 2As shown, the package 105 fitted into the first opening 10 abuts against the upper surface of the inner edge portion 17.

[0030] The second insulator 2 has a rectangular frame shape with a width thinner than that of the first insulator 1. The second insulator 2 has two pairs of wall portions 23 and 24 surrounding the second opening 20. As Figure 1 shown, a part of the lower side of the pin 6 screwed into the screw holes at the +X−Y side corners and the −X+Y side corners of the first insulator 1, the center substrate 3, and the second insulator 2 protrudes downward from the second insulator 2. No screw groove is provided on the outer periphery of the protruding portions on the lower sides of these two pins 6. As Figure 2 shown, the lower surfaces of the wall portions 23 and 24 of the second insulator 2 are fixed to the upper surface of the circuit board 106, and the protruding portions on the lower sides of the pins 6 are inserted into the positioning holes on the upper surface of the circuit board 106.

[0031] The center substrate 3 is a multi-layer substrate composed of a multi-layer structure such as a ground layer, a power supply layer, and a signal layer. The center substrate 3 has a rectangular plate shape with substantially the same thickness as the second insulator 2. 195 through holes 30−i (i = 1 to 15)−j (j = 1 to 13) for soldering the contacts 71−i (i = 1 to 15)−j (j = 1 to 13) and 72−i (i = 1 to 15)−j (j = 1 to 13) are provided in the center substrate 3.

[0032] The through holes 30−i (i = 1 to 15)−j (j = 1 to 13) are arranged in a staggered grid pattern of 15 rows and 13 columns. The through holes 30−i (i = 1 to 15)−j (j = 1 to 13) penetrate between the upper surface facing the first opening 10 and the lower surface facing the second opening 20 in the center substrate 3.

[0033] On the upper surface of the center substrate 3, the first resin members 81−i are arranged behind the through holes 30−i−j (j = 1 to 13) in each row. As shown in Fig. 3(A), 13 contacts 71−i−j (j = 1 to 13) inserted into the through holes 30−i−j (j = 1 to 13) in each row are supported by one first resin member 81−i.

[0034] As shown in Fig. 3(B), Fig. 3(C) and Figure 4 shown, the contact 71−i−j has: an extension portion 714 extending vertically; an inclined portion 715 extending obliquely forward from one end of the extension portion 714 at an obtuse angle; a terminal portion 716 bent forward at the lower end of the inclined portion 715; and a contact portion 717 bent in a hook shape at the front end of the inclined portion 715. The extension portion 714 has an elliptical annular portion 718 and a plate portion 719 having the same thickness as the annular portion 718.

[0035] A circular hole is provided at the center of the plate portion 719 . The inclined portion 715 is substantially U-shaped. Two base ends of the inclined portion 715 on the side opposite to the side where the contact portion 717 is located are connected to the left and right sides of the plate portion 719 .

[0036] The first resin member 81-i has a first base 810 and a first stopper 811 extending upward from the first base 810. The first stopper 811 is arranged side by side along each row of the contact members 71-i-j. The first base 810 is in the shape of a thin plate having upper and lower end surfaces parallel to the XY plane. The first stopper 811 has a shape in which a triangular prism having the same thickness as the quadrangular prism and approximately half the height is connected to the lower side of the rear side of the quadrangular prism. A protrusion 817 is provided on the lower side of the first stopper 811 on the front side of the first base 810.

[0037] The front of the first base 810 of the first resin member 81-i and the front of the first stopper 811 connected thereto in a coplanar manner form a support surface 815 for supporting the contact 71-i-j. The support surface 815 faces the same side as the inclination direction of the inclined portion 715 of the contact 71-i-j. The support surface 815 is parallel to the XZ plane. The extension portion 714 of the contact 71-i-j is fixed to the support surface 815.

[0038] A convex portion 818 is provided on both sides of a support surface 815 supporting each contact 71-i-j (j=1 to 13) in the first base 810. The convex portion 818 protrudes forward in a convex shape. A slit 819 is provided in the convex portion 818, which is concave in a "匚" shape toward the outside in the X direction, toward the inner wall of the support surface 815 and at the corner intersecting with the support surface 815.

[0039] The 13 contacts 71-i-j (j=1 to 13) of each row and the first resin member 81-i are integrated by insert molding. The first stopper 811 of the first resin member 81-i is provided at the rear side of each contact 71-i-j (j=1 to 13). The rear side of the plate portion 719 of each contact 71-i-j (j=1 to 13) is in contact with the support surface 815.

[0040] The left and right ends of the plate portion 719 in the extension portion 714 of each contact 71-i-j (j=1 to 13) are inserted into the slit 819 and supported from both sides by the convex portion 818. The protrusion 817 is inserted into the circular hole of the plate portion 719 of each contact 71-i-j (j=1 to 13). The upper end surface of the first stopper 811 of the first resin member 81-i is located above the upper edge of the extension portion 714 of the contact 71-i-j (j=1 to 13).

[0041] On the rear side of each row of through-holes 30-i-j (j = 1 to 13) in the lower surface of the central substrate 3, a second resin member 82-i is disposed. Thirteen contacts 72-i-j (j = 1 to 13) inserted into each row of through-holes 30-i-j (j = 1 to 13) are supported by one second resin member 82-i.

[0042] The second resin member 82-i has a second base portion 820 and a second stopper 821. The second stoppers 821 are arranged side by side along each row of the contacts 71-i-j. The second resin member 82-i has a structure that is mirror-symmetrical to the first resin member 81-i. The contacts 72-i-j have the same structure as the contacts 71-i-j.

[0043] The width of the short axis direction of the ellipse of the outer edge of the annular portion 718 of the contacts 71-i-j and 72-i-j is greater than the inner diameter of the inner circumference of the through-holes 30-i-j. The annular portions 718 of the contacts 71-i-j and 72-i-j are inserted into a substantially central position in the Z direction within the through-holes 30-i-j and are supported by the inner circumference of the through-holes 30-i-j at this position.

[0044] The contacts 71-i-j and 72-i-j are in contact with each other. In addition, the terminal portions 716 of the lower contacts 72-i-j are in contact with the pads of the circuit board 106, and the contact portions 717 of the upper contacts 71-i-j are in contact with the pads of the package 105.

[0045] As Figure 2 shown, the upper end surfaces of the first stoppers 811 of the first resin members 81-i (i = 1 to 15) are located lower than the upper end surfaces of the wall portions 13 and 14. The upper end surfaces of the first stoppers 811 are at substantially the same height as the upper surfaces of the inner edge portions 17 of the wall portions 13 and 14. In addition, the lower end surfaces of the second stoppers 821 of the second resin members 82-i (i = 1 to 15) are at substantially the same height as the lower end surfaces of the wall portions 23 and 24. The upper end surfaces of the first stoppers 811 abut against the lower surface of the package 105. The lower end surfaces of the second stoppers 821 abut against the mounting surface of the circuit board 106.

[0046] The above is the detailed content of the structure of this embodiment. The LGA socket 100 in this embodiment comprises: a first insulator 1 having walls 13 and 14 surrounding a first opening 10; a second insulator 2 having walls 23 and 24 surrounding a second opening 20; a center substrate 3 sandwiched from above and below by the first insulator 1 and the second insulator 2, which is composed of a multi-layer structure including a ground layer and has a plurality of through holes 30-i (i=1 to 15)-j (j=1 to 13) penetrating between one side of the first opening 10 and one side of the second opening 20; A plurality of pairs of contacts 71-i (i=1-15)-j (j=1-13) and 72-i (i=1-15)-j (j=1-13) are inserted into the through holes 30-i (i=1-15)-j (j=1-13) on the opening 10 side and the second opening 20 side and are electrically connected to each other by welding through the through holes 30-i (i=1-15)-j (j=1-13); and a first resin member 81-i (i=1-15) is arranged on the first opening 10 side of the center substrate 3. The first resin member 81-i (i=1-15) has a first base 810 that supports the contacts 71-i (i=1-15)-j (j=1-13) and a first stopper 811 that extends upward from the first base 810 and abuts against the package 105 that is fitted with the first opening 10. Therefore, when the package 105 is fitted into the first opening 10, the first stopper 811 contacts the lower surface of the package, making it difficult for the vertical portions of the contacts 71-i-j and 72-i-j, i.e., the extensions 714, to fall over. Therefore, it is possible to provide an LGA socket 100 that can prevent crosstalk from occurring during high-speed transmission and that can prevent the contacts 71-i (i=1 to 15)-j (j=1 to 13) from being damaged due to the warping of the conductor package 105.

[0047] As mentioned above, although embodiment of this invention is demonstrated, the following deformation|transformation can be added to this embodiment.

[0048] (1) In the above embodiment, the number of pairs of contacts 71 - i - j and 72 - i - j may be 2 to 194 or more than 196. The number of rows may be 2 to 14 or more than 16, and the number of columns may be 2 to 12 or more than 14.

[0049] (2) In the above-described embodiment, a configuration may be adopted in which only the first resin member 81 - i is provided on the center substrate 3 , and the second resin member 82 - i is not provided.

[0050] (3) In the above embodiment, the slits 819 may not be provided in the first resin member 81 - i and the second resin member 82 - i , and the contacts 71 - ij and 72 - ij may be supported only by the protrusions 817 .

[0051] (4) In the above-described embodiment, the first stoppers 811 and the second stoppers 821 may be provided only at the rear sides of a part of the contacts 71-i (i = 1 to 15)-j (j = 1 to 13) and the contacts 72-i (i = 1 to 15)-j (j = 1 to 13). For example, the first stoppers 811 and the second stoppers 821 may be provided at the rear sides of a part of the contacts 71-i-j and 72-i-j at intervals of every two or three.

[0052] (5) In the above-described embodiment, the contacts 71-i (i = 1 to 15)-j (j = 1 to 13) and the contacts 72-i (i = 1 to 15)-j (j = 1 to 13) may be arranged side by side in a checkerboard pattern instead of in a staggered grid pattern.

[0053] (6) In the above-described embodiment, the plurality of first stoppers 811 of the first resin member 81-i may also be arranged side by side along each column of the contacts 71-i-j. In addition, the first stopper 811 may be provided on the lateral side rather than the rear side of each contact 71-i-j (j = 1 to 13).

[0054] (7) In the above-described embodiment, the plurality of second stoppers 821 of the second resin member 82-i may also be arranged side by side along each column of the contacts 71-i-j. In addition, the second stopper 821 may be provided on the lateral side rather than the rear side of each contact 71-i-j (j = 1 to 13).

[0055] Reference Numeral Explanation

[0056] 1 First insulator; 2 Second insulator; 3 Central substrate; 5 Metal spring; 6 Pin; 10 First opening; 13 Wall portion; 14 Wall portion; 17 Inner edge portion; 20 Second opening; 23 Wall portion; 24 Wall portion; 30 Through hole; 50 Holding portion; 71 Contact; 72 Contact; 81 First resin member; 82 Second resin member; 100 Socket; 105 Package; 106 Circuit board; 714 Extension portion; 715 Tilted portion; 716 Terminal portion; 717 Contact portion; 718 Annular portion; 719 Plate portion; 810 First base portion; 811 First stopper; 815 Support surface; 817 Protrusion; 818 Convex portion; 819 Slit; 820 Second base portion; 821 Second stopper.

Claims

1. An LGA socket, characterized in that Comprising: A first insulator having a wall portion surrounding a first opening; A second insulator having a wall portion surrounding a second opening; A center substrate sandwiched between the first insulator and the second insulator from above and below, the center substrate being composed of a multi-layer structure including a ground layer and having a plurality of through holes formed therethrough between one side of the first opening and one side of the second opening; A plurality of pairs of contacts inserted into the through holes from one side of the first opening and one side of the second opening and welded via the through holes to be electrically connected to each other; And A first resin member disposed on the first opening side of the center substrate, The first resin member having a first base portion and a first stopper, The first base portion supporting the plurality of contacts, The first stopper being provided to extend upward from the first base portion and abut against a package fitted into the first opening, The contact having a contact portion in contact with a pad of the package, and in a state before the package is fitted into the first opening, the contact portion is located above the first stopper.

2. The LGA socket according to claim 1, wherein: The plurality of pairs of contacts are arranged in i rows and j columns, The contacts in each row on the first opening side are supported by the first resin member, and a plurality of the first stoppers are provided in the first resin member side by side along the rows or columns of the contacts.

3. The LGA socket according to claim 2, wherein: The plurality of contacts in each row and the first resin member are integrally formed by insert molding.

4. The LGA socket according to claim 1, wherein: The contact has an extension portion extending vertically and partially inserted into the through hole and an inclined portion inclinedly extending from one end of the extension portion, The first resin member has a support surface facing the same side as the inclined side of the inclined portion, The extension portion is fixed to the support surface.

5. The LGA socket according to claim 4, wherein: The upper end of the first stopper is located above the upper end of the extension portion and below the upper end of the wall portion surrounding the first opening.

6. The LGA socket according to claim 4, wherein: Protrusions are provided on both sides of the support surface of the first base portion, and slits are provided in the protrusions, The extension portion of the contact is fitted into the slits.

7. The LGA socket according to claim 4, wherein: Protrusions are provided on the support surface, Holes are provided in the extension portion, The protrusions are fitted into the holes.

8. The LGA socket according to claim 1, wherein Comprising: A second resin member disposed on the second opening side of the center substrate and supporting the contacts on the second opening side, The second resin member having a second base portion supporting the contacts and a second stopper extending downward from the second base portion and abutting against a circuit board on which the LGA socket is mounted.

9. The LGA socket according to claim 8, wherein Comprising: The contacts in each row on the second opening side are supported by the second resin member, A plurality of the second stoppers are provided in the second resin member and arranged side by side along rows or columns of the contact members.

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