Electronic device

Abstract

An electronic device is disclosed. The electronic device includes a display panel including a folding area and a non-folding area adjacent to the folding area in a first direction, and a support member facing the display panel. The support member includes, in order from the display panel, an upper plate facing the folding area and the non-folding area, having a thickness, and defining a plurality of openings corresponding to the folding area in the upper plate, and a lower plate having a thickness greater than the thickness of the upper plate and including a first lower plate and a second lower plate each corresponding to the folding area and the non-folding area. At the folding area, the second lower plate is spaced apart from the first lower plate by a gap in the first direction.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to and all rights arising therefrom of Korean Patent Application No. 10-2020-0130931, filed on October 12, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This invention relates to electronic devices, and more specifically, to electronic devices that reduce or effectively prevent the introduction of foreign substances while ensuring foldability, portability, and impact resistance. Background Technology

[0004] Electronic devices include an active area activated by electrical signals. This active area can be used to detect externally applied input and to display various images to provide information to the user. With the development of electronic devices in various shapes, the active area has taken on various forms.

[0005] Flexible electronic devices have been developed, including foldable flexible display panels. Unlike rigid electronic devices, flexible electronic devices can be foldable, rollable, or bendable. Regardless of existing screen sizes, flexible electronic devices can be made to be shaped into various forms, thereby improving user convenience. Summary of the Invention

[0006] One or more embodiments provide an electronic device that reduces or effectively prevents the introduction of foreign substances while ensuring foldability, portability, and impact resistance.

[0007] According to one or more embodiments, an electronic device includes: a display surface including a first non-foldable region, a foldable region, and a second non-foldable region sequentially defined along one direction; a window; a display panel located below the window; and a support member located below the display panel. The support member may include an upper plate and a lower plate, the upper plate defining a plurality of openings overlapping the foldable regions, and the lower plate located below the upper plate and having a thickness greater than that of the upper plate. The lower plate may include a first lower plate and a second lower plate spaced apart from the first lower plate. The gap between the first lower plate and the second lower plate may be defined to overlap with the foldable regions.

[0008] In this embodiment, the thickness of the upper plate can be in the range of about 15 micrometers to about 50 micrometers. The thickness of the lower plate can be in the range of about 150 micrometers to about 300 micrometers.

[0009] In this embodiment, the specific strength of the upper plate can be equal to or greater than about 60 kN·m / kg.

[0010] In an embodiment, the upper plate may include at least one selected from stainless steel, titanium alloy, nickel alloy, beryllium alloy, and nickel-titanium alloy.

[0011] In an embodiment, the lower plate may include at least one selected from aluminum alloys, nickel alloys, magnesium alloys, aluminum-magnesium alloys, and glass fiber reinforced plastics (“GFRP”).

[0012] In one implementation, at least one folding area may be defined on the upper plate. Multiple openings may be defined within the folding area.

[0013] In an implementation, the width of each of the plurality of openings may be equal to or less than about 50 micrometers.

[0014] In one embodiment, the upper plate may include a first plate non-folded area, a plate folded area, and a second plate non-folded area arranged sequentially along a first direction.

[0015] In one embodiment, the electronic device may further include a lower pad located below the lower plate.

[0016] In one embodiment, the electronic device may also include a padding layer between the support member and the display panel.

[0017] In an embodiment, the support member may also include a planarization layer on the upper plate.

[0018] In this embodiment, the planarization layer may include polyurethane or thermoplastic polyurethane.

[0019] In one embodiment, the upper plate may include polyimide.

[0020] In one embodiment, the electronic device may further include a lower pad located below the lower plate.

[0021] In some embodiments, the support member may also include a covering membrane between the upper plate and the lower plate.

[0022] In some embodiments, the electronic device may also include an anti-reflective component between the display panel and the window.

[0023] According to one embodiment, the electronic device includes a window, a display panel located below the window, and a support member located below the display panel. The support member may include an upper plate and a lower plate, the upper plate defining a plurality of openings, the upper plate comprising at least one selected from stainless steel, titanium alloy, nickel alloy, beryllium alloy, and nickel-titanium alloy, and the lower plate located below the upper plate, the lower plate comprising at least one selected from aluminum alloy, nickel alloy, magnesium alloy, aluminum-magnesium alloy, and glass fiber reinforced plastic (“GFRP”).

[0024] In one embodiment, the upper plate may have a thickness of about 15 micrometers to about 50 micrometers.

[0025] In an embodiment, the lower plate may have a thickness of about 150 micrometers to about 300 micrometers.

[0026] According to one embodiment, the electronic device includes a window, a display panel located below the window, and a support member located below the display panel. The support member may include an upper plate and a lower plate located below the upper plate, wherein at least one plate folding region is defined in the upper plate, and the upper plate has a thickness of about 15 micrometers to about 50 micrometers. Multiple openings may be defined in the plate folding region.

[0027] In one embodiment, the upper plate may include at least one selected from stainless steel, titanium alloy, nickel alloy, beryllium alloy, and nickel-titanium alloy. The lower plate may include at least one selected from aluminum alloy, nickel alloy, magnesium alloy, aluminum-magnesium alloy, and glass fiber reinforced plastic (“GFRP”).

[0028] In an embodiment, the lower plate may have a thickness of about 150 micrometers to about 300 micrometers. Attached Figure Description

[0029] The above and other advantages and features of this disclosure will become more apparent from a more detailed description of its embodiments with reference to the accompanying drawings, in which:

[0030] Figure 1A A perspective view showing an embodiment of the electronic device is shown.

[0031] Figure 1B The diagram shows the folding. Figure 1A A perspective view of an embodiment of an electronic device depicted in the figure.

[0032] Figure 2A A perspective view showing an embodiment of the electronic device is shown.

[0033] Figure 2B The diagram shows the folding. Figure 2A A three-dimensional diagram of an electronic device depicted in the image.

[0034] Figure 3 A cross-sectional view illustrating an embodiment of the electronic device is shown.

[0035] Figure 4 A cross-sectional view showing an embodiment of the display panel is shown.

[0036] Figure 5A A perspective view showing an embodiment of components of an electronic device is shown.

[0037] Figure 5B It shows Figure 5AA plan view of the implementation method of part A depicted in the figure.

[0038] Figure 5C It shows Figure 5A A perspective view of the implementation method of part A depicted in the figure.

[0039] Figures 6A to 6C A cross-sectional view illustrating an embodiment of the electronic device is shown. Detailed Implementation

[0040] Embodiments of the invention will now be described in conjunction with the accompanying drawings. However, the invention can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same numerals denote the same parts.

[0041] In this specification, when a component (or area, layer, part, etc.) is referred to as being associated with another component, such as being “on”, “connected to”, or “linked to” other components (multiple components), the component may be directly disposed on, directly connected to, or directly linked to other components (multiple components), or at least one intermediate component may exist between them.

[0042] Furthermore, in order to effectively explain the technical content, the thickness, ratio, and size of the components are exaggerated in the accompanying drawings.

[0043] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. For example, “element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a” or “an.” “Or” means “and / or.” The term “and / or” includes one or more combinations defined by the related components.

[0044] It should be understood that while the terms first, second, etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another. For example, without departing from the scope of the invention, a first component may be referred to as a second component, and conversely, a second component may be referred to as a first component. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well.

[0045] Furthermore, the terms "below," "lower part," "above," "upper part," etc., are used herein to describe the relationship between one component and other components (multiple components) shown in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, the related terms are intended to encompass different orientations.

[0046] It should be understood that the terms “comprise,” “include,” “have,” etc., are used to specify the presence of the stated features, integers, steps, operations, components, elements, or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, elements, or combinations thereof.

[0047] In this specification, the phrase "directly set" can mean that there are no additional elements such as layers, films, regions, plates, etc., between one part and other parts. For example, the phrase "directly set" can mean that no additional components such as adhesive members are placed between two layers or components.

[0048] As used herein, “about” or “approximately” includes the value as well as the average of the values ​​within an acceptable range of deviations of a particular value, as determined by a person skilled in the art in taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the value.

[0049] Unless otherwise specified, all terms used herein, including technical and scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms defined in commonly used dictionaries shall be construed as having the same meaning or the meaning defined in the context of the art, and shall not be construed as having an ideal or overly formal meaning unless expressly defined herein.

[0050] Embodiments are described herein with reference to cross-sectional views as schematic representations of idealized embodiments. Similarly, variations in the shapes shown in the figures should be anticipated, for example, due to manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but should include, for example, deviations in shape due to manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to represent the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0051] Embodiments of the present invention will now be described in conjunction with the accompanying drawings.

[0052] Figure 1A A perspective view showing an embodiment of the electronic device 1000 is shown. Figure 1B The diagram shows the folding. Figure 1A A three-dimensional view of the electronic device 1000 depicted in the image.

[0053] Reference Figure 1A and Figure 1B The electronic device 1000 can be a foldable display device. The electronic device 1000 can be applied not only to large electronic products such as televisions and monitors, but also to small and medium-sized electronic products such as mobile phones, tablet PCs (“PCs”), car navigation systems, game consoles, and smartwatches.

[0054] The electronic device 1000 may have a top surface defined as a display surface DS, and when the electronic device 1000 is folded or unfolded (e.g., flat), the display surface DS may lie in a plane parallel to the plane defined by the intersecting first direction DR1 and second direction DR2.

[0055] The display surface DS may include a display area DA and a non-display area NDA adjacent to the display area DA. In an embodiment, the non-display area NDA may surround the display area DA. The display area DA may be a planar area for displaying an image IM, and the non-display area NDA may be a planar area for not displaying an image IM. Figure 1A The example shown is an application icon used as an image IM.

[0056] The display area DA can have a quadrilateral shape in a plan view. In an embodiment, the non-display area NDA can surround the display area DA. However, the invention is not limited to this, and the display area DA and the non-display area NDA can be designed relative to each other in shape.

[0057] Electronic device 1000 may include a first non-folding region NFA1, a folding region FA, and a second non-folding region NFA2 sequentially defined along a second direction DR2 between non-folding regions NFA1 and NFA2. The folding region FA may be a planar region where the electronic device 1000 and its components are foldable. The non-folding region may be a planar region where the electronic device 1000 and its components are not foldable and / or remain flat even when the electronic device 1000 is folded.

[0058] Various components or layers of the electronic device 1000 may include folded regions FA and non-folded regions corresponding to those folded regions FA and non-folded regions described above for the electronic device 1000. The various components or layers of the electronic device 1000 may be folded together with each other.

[0059] In an implementation, for example, a folded region FA may be defined between a first non-folded region NFA1 and a second non-folded region NFA2. Although Figure 1A and Figure 1B A folded region FA and two non-folded regions NFA1 and NFA2 are shown, but the number of folded regions FA or the number of non-folded regions NFA1 and NFA2 are not limited. In an embodiment, for example, electronic device 1000 may include more than two non-folded regions and a plurality of folded regions, each of the plurality of folded regions being disposed between adjacent non-folded regions.

[0060] The electronic device 1000 may be foldable about a folding axis FX. In an embodiment, for example, the folding region FA may be flexible about the folding axis FX. The folding axis FX may extend along a first direction DR1. The folding axis FX may be defined as a short axis of the electronic device 1000 parallel to the short side of the electronic device 1000.

[0061] When the electronic device 1000 is folded, portions of the display surface DS at the first non-folded region NFA1 and the second non-folded region NFA2 can face each other. Therefore, in a folded electronic device 1000, the display surface DS may not be exposed to the outside or facing the outside of the electronic device 1000. However, this is merely an example, and the invention is not limited thereto. In an embodiment, when the electronic device 1000 is folded, portions of the display surface DS at the first non-folded region NFA1 and the second non-folded region NFA2 can face opposite directions. Therefore, the display surface DS can be exposed to the outside to face the outside of the electronic device 1000.

[0062] Figure 2A A perspective view showing an embodiment of the electronic device 1000-a is shown. Figure 2B The diagram shows the folding. Figure 2A A three-dimensional view of the electronic device 1000-a depicted in the image.

[0063] Reference Figure 2A and Figure 2B The electronic device 1000-a may include a first non-folding region NFA1-1, a folding region FA-1, and a second non-folding region NFA2-1, which are sequentially defined along a first direction DR1. The folding region FA-1 may be defined between the first non-folding region NFA1-1 and the second non-folding region NFA2-1.

[0064] Electronic device 1000-a can be foldable about folding axis FX-1. In an embodiment, for example, the folding region FA-1 can be flexible about folding axis FX-1. Folding axis FX-1 can extend along a second direction DR2. Folding axis FX-1 can be defined as the major axis of electronic device 1000-a parallel to its long side.

[0065] The structure of the electronic device 1000 that can be folded around the short axis will be discussed below, but the invention is not limited thereto, and the structure described thereafter can also be applied to the electronic device 1000-a that can be folded around the long axis.

[0066] Figure 3 A cross-sectional view showing an embodiment of the electronic device 1000 is shown. Figure 3 Depicting the meaning along Figure 1A A cross-sectional view of electronic device 1000 taken by line I-I'. Figure 4 A cross-sectional view showing an embodiment of the display panel 100 is shown. Figure 5A A perspective view showing an embodiment of the components of the electronic device 1000 is shown. Figure 5B It shows Figure 5A The plan view of part A depicted in the figure partially shows the components of the electronic device 1000. Figure 5C It shows Figure 5A The perspective view depicting part A of the embodiment partially shows the components of the electronic device 1000.

[0067] Figure 3 and Figure 4 The example illustrates this. Figure 1A The electronic device 1000 shown is not limited to this invention, and the description of the electronic device 1000 can be similarly applied to other devices. Figure 2A and Figure 2B The electronic device 1000-a shown is illustrated. Figure 5A A perspective view depicting an embodiment of the upper plate 600 of the electronic device 1000 is shown. Figure 5B Depicting the representation and Figure 5A A plan view of the implementation of the overlapping portion A of the upper plate 600. Figure 5C Depicting the representation and Figure 5A A perspective view of the embodiment of the overlapping portion A of the upper plate 600.

[0068] Reference Figure 3 The electronic device 1000 may include a display panel 100, an upper functional layer, and a lower functional layer. One or more of the display panel 100, the upper functional layer, and the lower functional layer may be foldable and unfoldable together, but are not limited thereto.

[0069] Reference Figure 4 The display panel 100 can be a component that generates an image IM and detects externally applied input. In an embodiment, for example, the display panel 100 may include a display layer 110 and a sensor layer 120 facing the display layer 110. The display panel 100 may have a thickness of about 25 micrometers to about 45 micrometers, for example, about 35 micrometers, but the thickness of the display panel 100 is not limited.

[0070] Display layer 110 can be a component that essentially generates an image IM. Display layer 110 can be an emitting display layer, such as an organic light-emitting display layer, a quantum dot display layer, or a micro-LED display layer. Based on the configuration of display layer 110, display panel 100 can be an organic light-emitting display panel, a quantum dot display panel, or a micro-LED display panel.

[0071] The display layer 110 may include a base layer 111, a circuit layer 112, a light-emitting element layer 113, and an encapsulation layer 114 arranged in sequence toward the sensor layer 120.

[0072] The base layer 111 may include a synthetic resin layer. The synthetic resin layer may include a thermosetting resin. In embodiments, for example, the synthetic resin layer may be a polyimide-based resin layer, but the material of the synthetic resin layer is not limited. The synthetic resin layer may include at least one selected from acrylic-based resins, methacrylic-based resins, polyisoprene, vinyl-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and dinaphthalene-based resins. The base layer 111 may include a glass substrate or an organic / inorganic composite substrate.

[0073] The base layer 111 may have a multilayer structure. In an embodiment, for example, the base layer 111 may include a first synthetic resin layer and silicon dioxide (SiO2) disposed on the first synthetic resin layer. x The system comprises a silicon oxide layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer can be referred to as the base barrier layer.

[0074] Each of the first and second synthetic resin layers may comprise a polyimide-based resin. Alternatively or additionally, each of the first and second synthetic resin layers may comprise at least one selected from acrylate-based resins, methacrylate-based resins, polyisoprene-based resins, vinyl-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and dinoflagellated resins. In this specification, the term "reinforced resin based on X" may refer to a resin comprising the X functional group.

[0075] The base layer 111 may have a thickness of about 10 micrometers to about 30 micrometers. In an embodiment, for example, the base layer 111 may have a thickness of about 20 micrometers.

[0076] Circuit layer 112 can be disposed on base layer 111. Circuit layer 112 may include dielectric layers, semiconductor patterns, conductive patterns, signal lines, etc. Coating and deposition processes can be used to deposit or form dielectric layers, semiconductor layers, and conductive layers on base layer 111, and then photolithography processes can be performed multiple times to selectively pattern the dielectric layers, semiconductor layers, and conductive layers. Then, semiconductor patterns, conductive patterns, and signal lines included in circuit layer 112 can be deposited or formed.

[0077] The light-emitting element layer 113 may be disposed on the circuit layer 112. The light-emitting element layer 113 may include a light-emitting element. In an embodiment, for example, the light-emitting element layer 113 may include an organic light-emitting material, a quantum dot, a quantum rod, or a micro LED.

[0078] The combined thickness of the circuit layer 112 and the light-emitting element layer 113 can range from about 1 micrometer to about 5 micrometers. In one embodiment, for example, the circuit layer 112 and the light-emitting element layer 113 can have a total thickness of about 3 micrometers.

[0079] The encapsulation layer 114 may be disposed on the light-emitting element layer 113. The encapsulation layer 114 may include inorganic layers, organic layers and inorganic layers stacked in sequence, but does not limit the constituent layers of the encapsulation layer 114.

[0080] The inorganic layer protects the light-emitting element layer 113 from moisture and oxygen, while the organic layer protects the light-emitting element layer 113 from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but the invention is not limited thereto.

[0081] The encapsulation layer 114 may have a thickness of about 3 micrometers to about 10 micrometers. In an embodiment, for example, the encapsulation layer 114 may have a thickness of about 6 micrometers.

[0082] Sensor layer 120 may be disposed on display layer 110. Sensor layer 120 may detect externally applied external input TC. External input TC may include light, heat, pressure, or contact from an input tool such as a body part, pen, etc.

[0083] A continuous process can be used to deposit or form the sensor layer 120 on the display layer 110. In this case, the sensor layer 120 can be directly deposited on the display layer 110. In an embodiment, for example, the sensor layer 120 and the display layer 110 can be in contact with each other without a third component between them. In this case, a separate adhesive member may not be required between the sensor layer 120 and the display layer 110. Since a separate component is omitted between the components, the components can form an interface with each other upon contact. When the sensor layer 120 is directly deposited on the display layer 110, the sensor layer 120 can have a thickness of approximately 2 micrometers.

[0084] Alternatively, the sensor layer 120 may be attached to the display layer 110 via a third component such as an adhesive member. The adhesive member may include a common adhesive or glue. In embodiments, for example, the adhesive member may include a pressure-sensitive adhesive (“PSA”) film (or layer), an optically clear adhesive (“OCA”) film (or layer), or an optically clear resin (“OCR”).

[0085] Refer to the return Figure 3 The upper functional layer can be disposed on the display panel 100. In an embodiment, for example, the upper functional layer may include an anti-reflective member 200 and an upper member 300.

[0086] The anti-reflective member 200 may be referred to as an anti-reflective layer. The anti-reflective member 200 can reduce the reflectivity of external light incident on the electronic device 1000. The anti-reflective member 200 may include a stretchable synthetic resin film. In embodiments, for example, the anti-reflective member 200 may be a polyvinyl alcohol (“PVA”) film dyed with an iodine compound. However, this is merely exemplary and does not limit the material of the anti-reflective member 200. The anti-reflective member 200 may have a thickness of about 3 micrometers to about 35 micrometers, but the thickness of the anti-reflective member 200 is not limited.

[0087] The antireflective member 200 may include color filters. The color filters may be arranged in a pattern. For the antireflective member 200, the color filters may be arranged to reflect colors emitted from pixels included or defined in the display layer 110. Furthermore, the antireflective member 200 may also include light-blocking members adjacent to the color filters.

[0088] The anti-reflection member 200 may include a destructive interference structure. In an embodiment, for example, the destructive interference structure may include a first reflective layer and a second reflective layer, which are located at different levels or distances relative to the display panel 100. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, can interfere destructively with each other, and thus the reflectivity of external light can be reduced.

[0089] The anti-reflective component 200 can be bonded to the display panel 100 via a first adhesive layer 1010. The first adhesive layer 1010 can be a transparent adhesive, such as a pressure-sensitive adhesive (“PSA”) film, an optically clear adhesive (“OCA”) film, or an optically clear resin (“OCR”). The adhesive layer described below can include common adhesives or glues. The first adhesive layer 1010 can have a thickness of about 20 micrometers to about 30 micrometers, for example, about 25 micrometers, but is not limited to a specific thickness.

[0090] In this embodiment, the first adhesive layer 1010 can be omitted, and the anti-reflective member 200 can be directly disposed on the display panel 100. In this case, a separate adhesive layer may not be required between the anti-reflective member 200 and the display panel 100. When the anti-reflective member 200 is directly disposed on the display panel 100, the anti-reflective member 200 may have a thickness of approximately 4.8 micrometers.

[0091] The upper component 300 may be disposed on the anti-reflective component 200. The upper component 300 may face the display panel 100 and has the anti-reflective component 200 therebetween. The upper component 300 may include a first hard coating layer 310, a protective layer 320, a first upper adhesive layer 330, a window 340, a second upper adhesive layer 350, a black matrix 360, a damping layer 370, and a second hard coating layer 380. The components included in the upper component 300 are not limited to the above-mentioned components. At least one of the above-mentioned components may be omitted, and other components may be added.

[0092] The first hard coating layer 310 may be disposed on the outermost surface of the electronic device 1000. The first hard coating layer 310 may define the display surface DS. The first hard coating layer 310 may be a functional layer for improving the practical characteristics of the electronic device 1000 and may be coated on the protective layer 320. In embodiments, for example, the first hard coating layer 310 may improve fingerprint resistance, stain resistance, and / or scratch resistance. The first hard coating layer 310 may have a thickness of about 1 micrometer to about 5 micrometers, for example, about 3 micrometers.

[0093] A protective layer 320 may be disposed beneath the first hard coating layer 310. The protective layer 320 protects components disposed beneath it. To improve chemical resistance and / or abrasion resistance, the first hard coating layer 310, an anti-fingerprint layer, etc., may be additionally disposed on the protective layer 320. The protective layer 320 may comprise a film with an elastic modulus equal to or less than about 15 gigapascals (GPa) at room temperature. The protective layer 320 may have a thickness of about 30 micrometers to about 200 micrometers, but the thickness is not limited. In some embodiments, the protective layer 320 may be omitted.

[0094] The protective layer 320 may have a multilayer structure. In one embodiment, for example, the protective layer 320 may include multiple synthetic resin films bonded together by an adhesive. The protective layer 320 may include a first protective layer 321, a second protective layer 322 facing the first protective layer 321, and a protective adhesive layer 323 bonding the first protective layer 321 and the second protective layer 322 together. For the protective layer 320, each of the first protective layer 321 and the second protective layer 322 may have a thickness of about 30 micrometers to about 120 micrometers. In one embodiment, for example, the first protective layer 321 may have a thickness of about 100 micrometers, and the second protective layer 322 may have a thickness of about 40 micrometers.

[0095] The first upper adhesive layer 330 may be disposed below the protective layer 320. The first upper adhesive layer 330 can bond the protective layer 320 to the window 340. The first upper adhesive layer 330 may have a thickness of about 20 micrometers to about 60 micrometers, for example, about 50 micrometers, but the thickness of the first upper adhesive layer 330 is not limited.

[0096] Window 340 may be disposed below the first upper adhesive layer 330. Window 340 may include an optically transparent dielectric material. In embodiments, for example, window 340 may include a glass substrate or a synthetic resin film. When window 340 is a glass substrate, window 340 may have a thickness equal to or less than about 80 micrometers, for example, a thickness of about 40 micrometers, but the thickness of window 340 is not limited.

[0097] When window 340 is a synthetic resin film, window 340 may include a polyimide (“PI”) film or a polyethylene terephthalate (“PET”) film.

[0098] Window 340 may have a single-layer or multi-layer structure. In an embodiment, for example, window 340 may include a plurality of synthetic resin films bonded to each other by an adhesive or a glass substrate having a plastic film bonded thereto by an adhesive.

[0099] The second hard coating layer 380 can be disposed on the top surface of the window 340 furthest from the display panel 100. The second hard coating layer 380 can be a functional layer for improving the practical characteristics of the electronic device 1000, and can be coated on the top surface of the window 340. In embodiments, for example, the second hard coating layer 380 can improve stain-free properties, scratch resistance, and / or impact resistance. The second hard coating layer 380 can have a thickness of about 1 micrometer to about 5 micrometers, for example, about 1.5 micrometers.

[0100] The second upper adhesive layer 350 can be disposed below the window 340. The second upper adhesive layer 350 can bond the window 340 to the damping layer 370. The second upper adhesive layer 350 can have a thickness of about 30 micrometers to about 40 micrometers, for example, about 35 micrometers, but the thickness of the second upper adhesive layer 350 is not limited.

[0101] In an embodiment, the sidewall 340S of the window 340 and the sidewall 350S of the second upper adhesive layer 350 may be positioned more inwardly than the sidewalls of other layers, for example, more inwardly than the sidewall 100S of the display panel 100 and the sidewall 320S of the protective layer 320. The phrase "positioned more inwardly than" may mean "closer to the display area DA than other comparison components".

[0102] The folding operation of the electronic device 1000 can change the positional relationship between the layers. According to the embodiment, since the sidewall 340S of the window 340 is positioned further inward than each of the sidewalls 100S of the display panel 100 and the sidewalls 320S of the protective layer 320, it is unlikely that the sidewall 340S of the window 340 will protrude further than the sidewall 320S of the protective layer 320 in the direction along the display panel 100, even when the positional relationship between the layers changes. Therefore, the transmission of external impacts through the sidewalls 340S of the window 340 is reduced. As a result, cracking of the window 340 due to external impacts can be reduced.

[0103] The first distance 340W can be set between the sidewall 340S of the window 340 and the sidewall 320S of the protective layer 320. In this specification, the first distance 340W can be shown as a distance in a direction parallel to the first direction DR1 and / or the second direction DR2. Furthermore, when viewed in a plane (e.g., in a plan view along a third direction DR3 (e.g., the thickness direction)), the first distance 340W can correspond to the distance between the sidewall 340S and the sidewall 320S.

[0104] The first distance 340W can be in the range of about 180 micrometers to about 205 micrometers, for example, it can be about 196 micrometers, but is not limited thereto. In embodiments, for example, the first distance 340W can be equal to or greater than about 50 micrometers, for example, it can be about 300 micrometers. Increasing the first distance 340W can cause the protective layer 320 to protrude further than the sidewall 340S of the window 340 and have a curved portion that can be attached to another component (e.g., a housing). In addition, increasing the planar area of ​​the protective layer 320 can reduce the introduction of foreign matter from above the protective layer 320 to below the protective layer 320 and to the layers below the protective layer 320.

[0105] Furthermore, the lamination process allows the window 340 and the second upper adhesive layer 350 to be attached to the damping layer 370. Taking into account the allowance of the lamination process, each of the window 340 and the second upper adhesive layer 350 can have a smaller planar area than the planar area of ​​the damping layer 370. Additionally, the planar area of ​​the second upper adhesive layer 350 can be smaller than the planar area of ​​the window 340 (e.g., the relative planar area is, for example, determined by the area along...). Figure 3 (The dimensions of the second direction DR2 are shown in the diagram). In an embodiment, for example, pressure may be supplied to the second upper adhesive layer 350 during the process of attaching the window 340. The second upper adhesive layer 350 may be pressurized to expand in a direction parallel to the first direction DR1 and the second direction DR2 (i.e., in the direction along the display panel 100). In this case, the planar area of ​​the second upper adhesive layer 350 may be smaller than the planar area of ​​the window 340, thereby preventing the second upper adhesive layer 350 from protruding further than the edge of the window 340 defined by its sidewalls 340S.

[0106] When the first upper adhesive layer 330 is attached to the second upper adhesive layer 350, the window 340 may be non-sliding when the electronic device 1000 is folded, and therefore may experience buckling. However, according to an embodiment, the planar area of ​​the second upper adhesive layer 350 may be smaller than the planar area of ​​the window 340. Therefore, the first upper adhesive layer 330 may remain unattached to the second upper adhesive layer 350, and foreign matter may be less likely to adhere to the second upper adhesive layer 350.

[0107] A second distance 350W may be provided between the sidewall 350S of the second upper adhesive layer 350 and the sidewall 320S of the protective layer 320. In this specification, the second distance 350W may be a distance in a direction parallel to the second direction DR2 and / or the first direction DR1. Furthermore, when viewed in a plane, the second distance 350W may correspond to the distance between the sidewall 350S and the sidewall 320S.

[0108] The second distance 350W can be approximately 392 micrometers, but is not limited to this. In implementations, for example, the second distance 350W can be in the range of approximately 292 micrometers to approximately 492 micrometers, but is not limited to this range.

[0109] The black matrix 360 can be disposed between the damping layer 370 and the second upper adhesive layer 350. The black matrix 360 can be printed on the top surface of the damping layer 370. The black matrix 360 can overlap with or correspond to the non-display area NDA. The black matrix 360 can be a coated decorative layer. The black matrix 360 can include colored organic materials or opaque metallic materials, but is not limited to any particular material.

[0110] Figure 3An embodiment in which the black matrix 360 is disposed on the top surface of the damping layer 370 is illustrated by way of example, but the location of the black matrix 360 is not limited. In an embodiment, for example, the black matrix 360 may be disposed on the top surface of the protective layer 320, the bottom surface of the protective layer 320, the top surface of the window 340, or the bottom surface of the window 340. Furthermore, the black matrix 360 may include multiple layers. In this case, a portion of the black matrix 360 may be disposed on the top surface of the damping layer 370, and another portion of the black matrix 360 may be disposed on the top surface of the protective layer 320, the bottom surface of the protective layer 320, the top surface of the window 340, or the bottom surface of the window 340.

[0111] The damping layer 370 can be a functional layer that protects the display panel 100 from external impacts. The damping layer 370 can include a film having an elastic modulus equal to or greater than about 1 gigapascal (GPa) at room temperature. The damping layer 370 can be a stretchable film with optical functions. In one embodiment, for example, the damping layer 370 can be an optical axis control film. The damping layer 370 can have a thickness of about 35 micrometers to about 45 micrometers, for example, about 41 micrometers, but the thickness of the damping layer 370 is not limited. In one embodiment, the damping layer 370 can be omitted.

[0112] When the damping layer 370 is omitted, the anti-reflective member 200 can be attached to the window 340 using an adhesive (e.g., the second adhesive layer 1020). When the damping layer 370 is omitted, the anti-reflective member 200 can contact the bottom surface of the second adhesive layer 1020, and the window 340 can contact the top surface of the second adhesive layer 1020. When the damping layer 370 is omitted, the black matrix 360 can be disposed on the top surface of the protective layer 320, the bottom surface of the protective layer 320, the top surface of the window 340, or the bottom surface of the window 340.

[0113] Although not shown, a planarization member may be provided on the surface of the damping layer 370. In an embodiment, the damping layer 370 may have an uneven surface, and the planarization member may be provided on one or both of the top and bottom surfaces of the damping layer 370 to planarize the uneven surface. Therefore, fogging can be reduced or effectively prevented at the uneven surface of the damping layer 370.

[0114] The upper component 300 can be bonded to the anti-reflective component 200 via the second adhesive layer 1020. The second adhesive layer 1020 may include a common adhesive or glue. The second adhesive layer 1020 may have a thickness of about 20 micrometers to about 60 micrometers, for example, about 50 micrometers, but is not limited in thickness.

[0115] The lower functional layer may be disposed below the display panel 100. In an embodiment, for example, the lower functional layer may include a lower protective film 400, a pad member 500, and a lower support member (e.g., a support member). That is, the window 340, the display panel 100, and the support member may be arranged sequentially along the thickness direction. The components included in the lower functional layer are not limited to the above-described components. At least one of the above-described components may be omitted, and other components may be added.

[0116] The lower protective film 400 can be bonded to the rear surface of the display panel 100 via the third adhesive layer 1030. The lower protective film 400 can reduce or effectively prevent scratches on the rear surface of the display panel 100 during the manufacturing process of the display panel 100. The lower protective film 400 can be a colored polyimide film. In embodiments, for example, the lower protective film 400 can be an opaque yellow film, but is not limited thereto.

[0117] The lower protective film 400 may have a thickness of about 20 micrometers to about 50 micrometers, for example, about 32 micrometers. The third adhesive layer 1030 may have a thickness of about 13 micrometers to about 40 micrometers, for example, about 25 micrometers. However, the thickness of the lower protective film 400 or the thickness of the third adhesive layer 1030 are not limited.

[0118] The padding member 500 can be disposed below the display panel 100. The padding member 500 can be located below the lower protective film 400. The padding member 500 can protect the display panel 100 from upward-moving impacts. The padding member 500 can give the electronic device 1000 improved impact resistance.

[0119] The pad member 500 may include a barrier film 520 and a pad layer 530. That is, the support member also includes, sequentially from the display panel 100, a pad layer 530, an upper plate 600, and a lower plate 700. The pad member 500 may also include a first pad adhesive layer 510 and a second pad adhesive layer 540. The components included in the pad member 500 are not limited to the above-mentioned components, and other components may be added.

[0120] The first pad adhesive layer 510 and the second pad adhesive layer 540 may comprise common adhesives or glues. The pad member 500 may be attached to the lower protective film 400 at the first pad adhesive layer 510 and to the upper plate 600 at the second pad adhesive layer 540. The first pad adhesive layer 510 may have a thickness of approximately 25 micrometers, and the second pad adhesive layer 540 may have a thickness of approximately 8 micrometers. However, the thickness of the first pad adhesive layer 510 or the second pad adhesive layer 540 is not limited.

[0121] The barrier film 520 may be a synthetic resin film, such as a polyimide (“PI”) film, but is not limited thereto. The barrier film 520 may include, for example, at least one selected from polyimide, polyamide (“PA”), polyetheretherketone and polyethylene terephthalate (“PET”).

[0122] The barrier film 520 may have a thickness of about 8 micrometers to about 40 micrometers. In an embodiment, for example, the barrier film 520 may have a thickness of about 20 micrometers.

[0123] The barrier film 520 may have a high modulus. The barrier film 520 may be configured to improve the impact resistance of the electronic device 1000. The barrier film 520 may reduce or effectively prevent deformation of the display panel 100 to improve the impact resistance of the display panel 100.

[0124] The padding layer 530 may include foam or sponge. The padding layer 530 may exhibit elasticity and have a porous structure.

[0125] The padding layer 530 may include polyurethane or thermoplastic polyurethane, but is not limited to this, and the padding layer 530 may include any material as long as the material can absorb impact.

[0126] The padding layer 530 can be provided or formed by using the barrier membrane 520 as a base component. In an embodiment, for example, the padding layer 530 can be provided or formed by coating the barrier membrane 520 with a mixture comprising polyurethane resin and a foaming agent, and then foaming the foaming agent. The padding layer 530 can be directly disposed on the bottom surface of the barrier membrane 520. The padding layer 530 can be in contact with the bottom surface of the barrier membrane 520. Alternatively, the padding layer 530 can be attached to the bottom surface of the barrier membrane 520 by means of an adhesive member.

[0127] The padding layer 530 may have a thickness of about 80 micrometers to about 120 micrometers. In an embodiment, for example, the padding layer 530 may have a thickness of about 100 micrometers.

[0128] One or both of the barrier film 520 and the pad 530 may be colored to absorb light. In an embodiment, for example, one or both of the barrier film 520 and the pad 530 may be black. One or both of the barrier film 520 and the pad 530 may include a black material. Therefore, external identification of components disposed below the pad member 500 can be reduced or effectively prevented. In an embodiment, for example, since one or both of the barrier film 520 and the pad 530 include a black material, external identification of the upper plate 600, which includes metal, can be reduced or effectively prevented.

[0129] The lower support member can be disposed below the pad member 500. The second pad adhesive layer 540 can attach the pad member 500 to the top surface of the upper plate 600 included in the lower support member. The lower support member can support the components disposed thereon on the third-party DR3.

[0130] The lower support member may include an upper plate 600 and a lower plate 700. The components included in the lower support member are not limited to those described above. Other components may be added. The lower support member may also include a support adhesive layer 1040 disposed between the upper plate 600 and the lower plate 700 and connecting the upper plate 600 and the lower plate 700 to each other. The support adhesive layer 1040 may include a plurality of support adhesive patterns spaced apart from each other at the folded region FA. That is, the support adhesive layer 1040 is interrupted at the folded region FA.

[0131] The upper plate 600 can support components disposed thereon. In addition, the upper plate 600 can improve the thermal radiation performance of the electronic device 1000 (e.g., a heat dissipation layer).

[0132] The upper plate 600 may be defined with a plurality of openings 601. The openings 601 may be located on the upper plate 600 at positions corresponding to the folded region FA. In embodiments, for example, when viewed in a plane along a first direction DR1, the openings 601 may overlap or align with the folded region FA. The openings 601 may facilitate partial deformation of the upper plate 600 at the folded region FA.

[0133] For electronic device 1000, upper plate 600 may have a first thickness d1 that is less than the second thickness d2 of lower plate 700. The first thickness d1 of upper plate 600 may be equal to or less than about 50 micrometers. The first thickness d1 of upper plate 600 may be in the range of about 15 micrometers to about 50 micrometers. The thickness may be the maximum thickness of the component or the total thickness, but is not limited thereto.

[0134] The upper plate 600 may include a material with high rigidity. The upper plate 600 may include a metallic material with a specific strength or strength-to-weight ratio equal to or greater than about 60 kN·m / kg. In this specification, specific strength is the strength of a material (force per unit area at failure) divided by its density, and it is known that a material with high specific strength has a high strength-to-weight ratio. The metallic material included in the upper plate 600 may have a specific strength equal to or greater than about 60 kN·m / kg, such as equal to or greater than about 100 kN·m / kg, or equal to or greater than about 150 kN·m / kg. That is, within the support member, the upper plate 600, which is closer to the display panel 100 than the lower plate 700, has a specific strength equal to or greater than about 60 kN·m / kg.

[0135] The upper plate 600 may include at least one selected from stainless steel, titanium alloy, nickel alloy, beryllium alloy, and nickel-titanium alloy (commercially known as nitinol). In embodiments, for example, the upper plate 600 may include at least one selected from SUS304, SUS316, titanium copper, nickel copper, beryllium copper, and nitinol. That is, within the support member, the upper plate 600, which is closer to the display panel 100 than the lower plate 700, includes stainless steel, titanium alloy, nickel alloy, beryllium alloy, or nickel-titanium alloy.

[0136] Reference Figure 3 and Figures 5A to 5C The upper plate 600 included in the electronic device 1000 may include a first non-folded region 600A1, a folded region 600A2, and a second non-folded region 600A3 arranged along a second direction DR2. The folded region 600A2 of the upper plate 600 may overlap with or correspond to the folded region FA of the electronic device 1000. That is, within the support member, the upper plate 600 includes the folded region 600A2, which corresponds to the folded region FA of the display panel 100, and at the folded region 600A2, the upper plate 600 may be folded together with the display panel 100.

[0137] The upper panel 600 may include a first non-folding region 600A1 and a second non-folding region 600A3 respectively connected to the panel folding region 600A2. At least a portion of the first non-folding region 600A1 overlaps with or corresponds to the first non-folding region NFA1 of the electronic device 1000, and at least a portion of the second non-folding region 600A3 overlaps with or corresponds to the second non-folding region NFA2 of the electronic device 1000. That is, the upper panel 600 also includes a non-folding region corresponding to the non-folding region of the display panel 100 and adjacent to the panel folding region 600A2.

[0138] At least a portion of one or more of the first plate non-folding area 600A1 and the second plate non-folding area 600A3 may overlap with the non-display area NDA of the electronic device 1000. The upper plate 600 may include a first portion 600-1 that overlaps with or corresponds to the first plate non-folding area 600A1, a second portion 600-2 that overlaps with or corresponds to the plate folding area 600A2, and a third portion 600-3 that overlaps with or corresponds to the second plate non-folding area 600A3. Each of the first portion 600-1, the second portion 600-2, and the third portion 600-3 may include a solid portion of the upper plate 600.

[0139] The upper plate 600 may define a plurality of openings 601 in a second portion 600-2 corresponding to the plate folding region 600A2. In the second portion 600-2, the solid portions of the upper plate 600 may be spaced apart to define the openings 601. The openings 601 may overlap with the folding region FA of the electronic device 1000. The openings 601 may be arranged in multiple rows. The openings 601 in the multiple rows may be staggered along multiple columns.

[0140] In one embodiment, the plurality of openings 601 may include a plurality of first openings 6011 arranged in a first row, and a plurality of second openings 6012 arranged in a second row. The row of openings may extend along a first direction DR1, i.e., parallel to the folding axis FX. The first row and the second row may alternate with each other within the second portion 600-2.

[0141] The plurality of first openings 6011 in the first row can extend longitudinally along the first direction DR1 and can be spaced apart from each other along the first direction DR1. The plurality of second openings 6012 can extend longitudinally along the first direction DR1 and can be spaced apart from each other along the first direction DR1, and spaced apart from the plurality of first openings 6011 along the second direction DR2. The plurality of first openings 6011 and the plurality of second openings 6012 can be alternately defined along the second direction DR2. The positions of the plurality of first openings 6011 and the plurality of second openings 6012 can be staggered along the second direction DR2.

[0142] The upper panel 600 may include a top surface closest to the display panel 100 and a bottom surface opposite to the top surface. Each of the openings 601 may have an inner surface defined by a side surface of the upper panel 600. The inner surface includes a first side surface 601-S1 and a second side surface 601-S2 extending from the first side surface 601-S1. The first side surface 601-S1 may be a surface of the upper panel 600 defining each of the plurality of openings 601. The second side surface 601-S2 may be a surface of the upper panel 600 that is inclined (e.g., has a ramp) relative to the first side surface 601-S1 and connects the first side surface 601-S1 to the top surface of the upper panel 600. The second side surface 601-S2 may be a chamfered edge surface extending between the first side surface 601-S1 and the top surface of the upper panel 600.

[0143] Each of the openings 601 may have a primary dimension (e.g., length) and a secondary dimension (e.g., width). Each of the plurality of openings 601 defined in the upper plate 600 may have a width equal to or less than about 50 micrometers. (See reference...) Figures 5A to 5CFor example, each of the plurality of openings 601 defined in the upper plate 600 may have a width equal to or less than about 50 micrometers along the second direction DR2.

[0144] When viewed along the thickness direction (e.g., along the third direction DR3), a plurality of openings 601 may be provided or formed to completely penetrate the thickness of the upper plate 600. The penetration depth of the openings 601 may be defined by, but is not limited to, the depth of the openings relative to the total thickness of the upper plate 600. In an embodiment, for example, the plurality of openings 601 may have a penetration depth substantially the same as the first thickness d1 of the upper plate 600. However, the invention is not limited thereto, and the plurality of openings 601 may be provided or formed to partially penetrate the first thickness d1 of the upper plate 600. In an embodiment, for example, the plurality of openings 601 may be provided or formed by half-etching a portion of the thickness of the upper plate 600, and thus each of the plurality of openings 601 may have a groove shape provided by etching to half of the first thickness d1 of the upper plate 600. The groove shape may define a recess that opens at the top or bottom surface of the upper plate 600.

[0145] The lower plate 700 may be disposed facing the upper plate 600. The lower plate 700 may include a plurality of plate portions (e.g., a lower plate), and the plurality of plate portions may be arranged spaced apart from each other. That is, the lower plate 700 may be disconnected at the folding region FA. In an embodiment, for example, one plate portion may be positioned corresponding to a first non-folding region NFA1, and another plate portion may be positioned corresponding to a second non-folding region NFA2.

[0146] The plurality of plate portions may include a first lower plate 701 corresponding to a first non-folding region NFA1 and a second lower plate 702 corresponding to a second non-folding region NFA2. Each of the first lower plate 701 and the second lower plate 702 may extend from the respective non-folding region and into the folding region FA. In an embodiment, a support member (e.g., a lower support member) sequentially includes, starting from the display panel 100: an upper plate 600 facing the folding region FA and the non-folding region of the display panel 100, having a thickness, and defining a plurality of openings 601 in the upper plate 600 corresponding to the folding region FA; and a lower plate 700 having a thickness greater than that of the upper plate 600, the lower plate 700 including a first lower plate 701 and a second lower plate 702 respectively corresponding to the folding region FA and the non-folding region of the display panel 100.

[0147] The first lower plate 701 and the second lower plate 702 may be spaced apart from each other by a gap G1 at the folding region FA. The gap G1 between the first lower plate 701 and the second lower plate 702 may be defined to overlap with the folding region FA. Although the first lower plate 701 and the second lower plate 702 are spaced apart from each other at the folding region FA, they may be positioned as close as possible to each other to support the area of ​​the upper plate 600 including the opening 601. In embodiments, for example, the first lower plate 701 and the second lower plate 702 may reduce or effectively prevent the upper plate 600 from deforming due to downward pressure at the area with the opening 601.

[0148] Each of the first lower plate 701 and the second lower plate 702 can be attached to the upper plate 600 via the support adhesive layer 1040. In an embodiment, for example, the upper plate 600 may be provided with a support adhesive pattern corresponding to the first non-folded region NFA1, and may also be provided with another support adhesive pattern corresponding to the second non-folded region NFA2. In an embodiment, for example, a portion or pattern of the support adhesive layer 1040 may not overlap with the folded region FA. That is, the support adhesive layer 1040 is spaced apart from the folded region FA. Each portion or pattern of the support adhesive layer 1040 may have a thickness of about 8 micrometers to about 15 micrometers, for example, about 8 micrometers, but the thickness of the portion or pattern of the support adhesive layer 1040 is not limited.

[0149] For the electronic device 1000, the second thickness d2 of the lower plate 700 can be greater than the first thickness d1 of the upper plate 600. The second thickness d2 of the lower plate 700 can be equal to or greater than about 150 micrometers. The second thickness d2 of the lower plate 700 can be in the range of about 150 micrometers to about 300 micrometers. That is, within the support member, the thickness of the upper plate 600 is in the range of about 15 micrometers to about 50 micrometers, and together with the thickness of the lower plate 700, it is in the range of about 150 micrometers to about 300 micrometers.

[0150] The lower plate 700 may include a metal alloy. Each of the first lower plate 701 and the second lower plate 702 may include a metal alloy. The lower plate 700 may include a lightweight material with sufficiently high thermal conductivity to ensure heat radiation performance (e.g., a heat dissipation component). The lower plate 700 may include materials with a density equal to or less than about 3 milligrams per cubic centimeter (mg / cm³). 3The material of the lower plate 700 may be selected from aluminum alloys, nickel alloys, aluminum-magnesium alloys, and magnesium alloys. In this specification, aluminum-magnesium alloy may refer to an alloy in which magnesium is added to aluminum. Alternatively, the lower plate 700 may comprise a material other than a metal alloy having fixed lightness and thermal radiation properties. In an embodiment, the lower plate 700 may comprise glass fiber reinforced plastic (“GFRP”). ​​That is, within the support member, the lower plate 700, located further away from the display panel 100 than the upper plate 600, comprises aluminum alloys, nickel alloys, magnesium alloys, aluminum-magnesium alloys, or glass fiber reinforced plastic.

[0151] Although not shown, a step compensation film may be further disposed between the upper plate 600 and each of the first lower plate 701 and the second lower plate 702. In an embodiment, for example, the step compensation film may be disposed on the region overlapping with the folded region FA. The step compensation film may have adhesion at one of its surfaces, which is less than its adhesion at its other surface (e.g., the opposing surface). In an embodiment, for example, one surface may have no adhesion. The surface without adhesion may face the upper plate 600.

[0152] Alternatively, the step compensation film can be attached below the upper plate 600. In an embodiment, for example, the lower plate 700 can be attached to a lower portion of the upper plate 600 via a lower adhesive layer, and the step compensation film can be attached to another lower portion of the upper plate 600. The step compensation film can be attached to the bottom surface of the upper plate 600 via a compensating adhesive layer. The step compensation film can be a synthetic resin film. Another compensation film can be disposed on the bottom surface of the step compensation film, and thus can be attached to a lower assembly (not shown).

[0153] Although not shown, the electronic device 1000 may also include a heat-radiating sheet and a dielectric sheet disposed below the lower plate 700. The heat-radiating sheet may be a heat-conducting sheet with high thermal conductivity. In embodiments, for example, the heat-radiating sheet may include a heat-radiating layer, a heat-radiating adhesive layer, and a gap strip.

[0154] The thermally radiating layer can be attached to the lower plate 700 via a thermally radiating adhesive layer. The thermally radiating layer can be encapsulated by the thermally radiating adhesive layer and a spacer band. The thermally radiating layer can be a graphite polymer film. In an embodiment, for example, the thermally radiating layer can be a graphite polyimide film. The spacer band can be attached across the thermally radiating layer through two thermally radiating layers spaced apart from each other. The thermally radiating adhesive layer can have a thickness of about 3 micrometers to about 8 micrometers, for example, about 5 micrometers. Each of the thermally radiating layer and the spacer band can have a thickness of about 10 micrometers to about 25 micrometers, for example, about 17 micrometers.

[0155] The dielectric film can be attached below the heat-radiating sheet. In one embodiment, for example, the dielectric film can be attached to the lower portion of the heat-radiating sheet via a heat-radiating adhesive layer. The dielectric film can prevent the electronic device 1000 from emitting a rattling sound. The dielectric film can have a thickness of about 15 micrometers, but is not limited to this.

[0156] Although not shown, the lower plate 700 may also have a lower pad film 500-1 including a lower pad layer provided below it (see below). Figure 6A The lower pad can absorb external impacts applied to the electronic device 1000. That is, the support members also include, sequentially from the display panel 100, an upper plate 600, a lower plate 700, and a lower pad.

[0157] Electronic device 1000 may include a display panel 100 with a lower support member disposed below it. The lower support member includes a thin upper plate and a thick lower plate disposed below the thin upper plate. The thin upper plate has a plurality of plate openings defining a folding area. The thin upper plate may include high-rigidity materials such as stainless steel, titanium alloys, nickel alloys, beryllium alloys, and nickel-titanium alloys commercially known as nitinol, while the thick lower plate may include lightweight materials such as aluminum alloys, nickel alloys, magnesium alloys, aluminum-magnesium alloys, and glass fiber reinforced plastics (“GFRP”). ​​Therefore, one or more embodiments of electronic device 1000 can reduce or effectively prevent the introduction of foreign matter while ensuring foldability, portability, and impact resistance.

[0158] In one embodiment, for example, the electronic device 1000 may include a thin and rigid upper plate 600. Therefore, not only are components such as the display panel 100 disposed on the upper plate 600 supported, but the reduced size of the plurality of openings 601 in the plate folding region 600A2 also reduces or effectively prevents the introduction of foreign matter into the display panel 100 through the upper plate 600. Furthermore, the lower plate 700 may be thicker than the upper plate 600 and may comprise a lightweight material, thereby reducing or effectively preventing sagging of upper-side components such as the upper plate 600, and ensuring thermal radiation performance and impact resistance. Therefore, one or more embodiments of the electronic device 1000 can reduce or effectively prevent the introduction of foreign matter and ensure foldability, portability, and impact resistance.

[0159] Figures 6A to 6C Cross-sectional views illustrating embodiments of electronic devices 1000-1, 1000-2, and 1000-3 are shown. (Refer to...) Figures 6A to 6C When explaining electronic devices 1000-1, 1000-2, and 1000-3, the above... Figure 3 Components that are the same as those discussed in the figures will be assigned the same reference numerals, and their detailed descriptions will be omitted.

[0160] Reference Figure 6A Electronic equipment 1000-1 may not include Figure 3 The pad member 500 of the electronic device 1000 shown is omitted. Since the pad member 500 is omitted, a fourth adhesive layer 1050 for attaching the planarization layer 800 to the lower protective film 400 can be provided.

[0161] The electronic device 1000-1 may further include a planarization layer 800 disposed on the upper plate 600. That is, the support members also sequentially include the planarization layer 800, the upper plate 600, and the lower plate 700 from the display panel 100. The planarization layer 800 can be attached to the upper plate 600 via an additional adhesive layer 1060. Although not shown, the planarization layer 800 may be applied to the top surface of the upper plate 600 without a separate adhesive layer between them. In an embodiment, for example, the planarization layer 800 may be in contact with the top surface of the upper plate 600.

[0162] A planarization layer 800 may be disposed on the top surface of the upper plate 600 to reduce the surface roughness of the upper plate 600. The planarization layer 800 may also be disposed on the top surface of the upper plate 600 to improve the surface quality of the upper plate 600. The planarization layer 800 may include a colored material such as a black material, and thus may reduce or effectively prevent external identification of components disposed beneath the planarization layer 800. In embodiments, for example, external identification of components such as the upper plate 600 comprising metal may be reduced or effectively prevented.

[0163] When the planarization layer 800 is a component coated on the top surface of the upper plate 600, the planarization layer 800 may be a polymeric resin in which a black pigment, such as carbon black, is distributed. In embodiments, for example, the planarization layer 800 may include carbon black distributed in a polymeric material such as acrylic resin, melamine resin, epoxy resin, or polyurethane resin. The planarization layer 800 may be a monolayer film in which carbon black is distributed in a polymeric resin. Alternatively, the planarization layer 800 may be configured as a polyurethane or thermoplastic polyurethane film and may be attached to the upper plate 600 by an additional adhesive layer 1060.

[0164] The planarization layer 800 may have a thickness of about 5 micrometers to about 10 micrometers. In an embodiment, for example, the planarization layer 800 may have a thickness of about 8 micrometers. The additional adhesive layer 1060 may have a thickness of about 5 micrometers to about 15 micrometers. In an embodiment, for example, the additional adhesive layer 1060 may have a thickness of about 10 micrometers.

[0165] Although not shown, the planarization layer 800 may have a plurality of planarization layer openings defined at the folding region FA. The plurality of planarization layer openings defined in the planarization layer 800 may be provided or formed to correspond to the opening 601 defined in the upper plate 600. Therefore, when viewed in a plane, the opening 601 defined in the upper plate 600 may remain open to the outside of the electronic device 1000-1 without being covered by the planarization layer 800. Thus, during the folding operation of the electronic device 1000-1, the folding region 600A2 of the upper plate 600 can be easily deformed without reducing folding performance.

[0166] A lower pad film 500-1, including a lower pad layer, can be provided below the lower plate 700. The lower pad film 500-1 may include a first lower pad film 501-1 disposed below the first lower plate 701, and may also include a second lower pad film 502-1 disposed below the second lower plate 702. The lower pad film 500-1 may include a lower pad layer and an adhesive layer attached to the bottom surface of the lower plate 700 through the lower pad layer. The lower pad layer can absorb external impacts applied to the electronic device 1000-1.

[0167] Reference Figure 6B Electronic equipment 1000-2 may not include Figure 3 The pad member 500 of the electronic device 1000 shown.

[0168] Electronic device 1000-2 may omit the pad member 500 and instead include an upper plate 600-1 comprising a polymeric material instead of a metallic material. The polymeric material included in the upper plate 600-1 may be a material that is easily etched to form the opening 601 and has high stiffness while ensuring folding performance. The upper plate 600-1 may include, for example, polyimide. The upper plate 600-1 may be a polyimide film with high stiffness. The upper plate 600-1 may be a high-stiffness polyimide film with a modulus in the range of about 1 GPa to about 15 GPa. Because the upper plate 600-1 comprises a polymeric material with high stiffness, electronic device 1000-2 can ensure folding performance, can have improved surface quality sufficient to reduce or effectively prevent external identification of the underlying components, and can prevent buckling.

[0169] Reference Figure 6CThe electronic device 1000-3 may further include a cover film 900 disposed between the upper plate 600 and the lower plate 700. In one embodiment, a plurality of openings 601 of the upper plate 600 are exposed to the outside of the lower plate 700 through a gap G1, at which a second lower plate 702 is spaced apart from the first lower plate 701. Here, the support member also includes, in sequence from the display panel 100, the upper plate 600, the cover film 900, and the lower plate 700, and the cover film 900 extends across the gap G1.

[0170] The cover film 900 can be attached to the bottom surface of the upper plate 600 via the first support adhesive layer 1040-1. The first support adhesive layer 1040-1 may include a common adhesive or glue. Figure 6C As shown, the first support adhesive layer 1040-1 may not be disposed in the area overlapping with the folded area FA on the upper plate 600 (e.g., it may be spaced apart from the folded area FA). The cover film 900 may cover the opening 601 of the upper plate 600. Therefore, the introduction of foreign matter into the opening 601 can be additionally reduced or effectively prevented. The cover film 900 may be attached to the top surface of the lower plate 700 via the second support adhesive layer 1040-2.

[0171] The cover film 900 may include a material whose elastic modulus is less than that of the upper plate 600. The cover film 900 may include a material whose elastic modulus is equal to or less than about 30 MPa and whose elongation is equal to or greater than about 100%. In embodiments, for example, the cover film 900 may include at least one selected from acrylic-based resins, methacrylic-based resins, polyisoprene, vinyl-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyimide-based resins, polyamide-based resins, and dinoflagellated resins. In embodiments, for example, the cover film 900 may include, but is not limited to, thermoplastic polyurethane. The cover film 900 may be a thermoplastic polyurethane film in which a mesh pattern is disposed or formed.

[0172] According to the embodiment, a lower support member comprising a thin upper plate with high rigidity and a thick lower plate comprising lightweight material can be disposed below the display panel 100. Therefore, it is possible to provide an electronic device 1000 that reduces or effectively prevents foreign matter from entering the display panel 100 after passing through the lower support member, while ensuring its foldability, portability, and impact resistance, which can lead to improved reliability of the electronic device 1000.

[0173] Although embodiments have been described with reference to several illustrative examples, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the invention as set forth in the appended claims. Therefore, the scope of the invention is not limited to the foregoing embodiments and examples, but rather to the appended claims.

Claims

1. Electronic devices, including: The display panel includes a foldable region and a non-foldable region adjacent to the foldable region along a first direction, wherein the electronic device is foldable in the foldable region; as well as Support member, facing the display panel, The supporting components, starting from the display panel, sequentially include: An upper plate, facing the folded and non-folded areas of the display panel, has a thickness and defines a plurality of openings in the upper plate corresponding to the folded areas; and The lower plate has a thickness greater than that of the upper plate, and the lower plate includes a first lower plate and a second lower plate, each corresponding to the folded area and the non-folded area of ​​the display panel. In the folded area, the second lower plate and the first lower plate are spaced apart by a gap along the first direction. The support member, starting from the display panel, sequentially includes the upper plate, the cover film, and the lower plate, and the cover film extends across the gap. The covering film is attached to the bottom surface of the upper plate via a first support adhesive layer, which is spaced apart from the folded area.

2. The electronic device according to claim 1, wherein, Within the support member, the thickness of the upper plate is in the range of 15 micrometers to 50 micrometers, and the thickness of the upper plate together with the lower plate is in the range of 150 micrometers to 300 micrometers.

3. The electronic device according to claim 1, wherein, Within the support member, the upper plate, which is closer to the display panel than the lower plate, has a strength equal to or greater than 60 kN. Specific strength in m / kg.

4. The electronic device according to claim 1, wherein, Within the support member, the upper plate, which is closer to the display panel than the lower plate, is made of stainless steel, titanium alloy, nickel alloy, or beryllium alloy.

5. The electronic device according to claim 1, wherein, Within the support member, the lower plate, which is further away from the display panel than the upper plate, comprises aluminum alloy, nickel alloy, magnesium alloy, or glass fiber reinforced plastic.

6. The electronic device according to claim 1, wherein, Within the support member, the upper plate includes a plate folding area corresponding to the folding area of ​​the display panel, and at the plate folding area, the upper plate, together with the display panel, is foldable. The plurality of openings in the upper plate are defined in the folded area of ​​the plate.

7. The electronic device according to claim 6, wherein, Within the folding area of ​​the upper plate, Each of the plurality of openings has a width along the first direction, and The width of each of the plurality of openings is equal to or less than 50 micrometers.

8. The electronic device according to claim 6, wherein, The upper panel also includes a non-folding area, which corresponds to the non-folding area of ​​the display panel and is adjacent to the folding area along the first direction.

9. The electronic device according to claim 1, wherein, The support member further includes a planarization layer disposed on the upper plate, and The planarization layer comprises polyurethane.

10. The electronic device according to claim 1, wherein, Within the support member, the upper plate, which is closer to the display panel than the lower plate, comprises polyimide.

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