An LED light source board and an LED lamp

Abstract

The LED light source plate provided by the application comprises a circular aluminum plate, the side surface of the aluminum plate is covered with an insulating film, the insulating film is covered with a copper soldering pad, and the soldering pad is welded with an LED lamp bead; a recessed groove area with one or more recessed grooves is arranged on the soldering pad, the bottom of the recessed groove is recessed downward to pierce the insulating film, the soldering pad is extended and connected with the aluminum plate, a through hole is not needed to be arranged, stress concentration and sharp-point discharge phenomenon are not caused, and safety is good; the LED lamp provided by the application comprises the LED light source plate, the LED light source plate is arranged in a lamp cup with a conductive function, one end of the LED lamp bead is connected with one pole of a power supply through the lamp cup, the other end of the LED lamp bead is connected with the other pole of the power supply through the recessed groove and the aluminum plate, the power supply can be conveniently led from the back light surface of the light source plate to the light emitting surface, the design of the through hole is abandoned, operation is simple, processing is convenient, consistency is good, the service life is long, and the automatic production demand can be met.

Description

Technical Field

[0001] This invention relates to the field of lighting technology, specifically to an LED light source board and an LED lamp. Background Technology

[0002] In the field of lighting fixtures, regardless of the design of the LED light source board, the issue of how to lead the power from the backlight side of the light source board to the light-emitting side is always involved. To solve this problem, most existing technologies use through holes in the light source board to allow power lines to be threaded or screws to be installed for power transmission. However, the opening of through holes reduces the strength of the light source board. When it bends and deforms after being heated, stress concentration is easily caused at the through holes, affecting the firmness of the soldering of electrical components such as LED beads, resulting in phenomena such as desoldering and cold solder joints. This leads to poor consistency and short lifespan of LED lights. If screws are installed in the through holes, it is also easy to cause point discharge, which is not safe. Opening through holes requires multiple processes such as drilling, deburring, and dust removal, which is complicated and difficult to automate, making it unable to meet market demands. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide an LED light source board that does not require through holes and has good safety. This invention also provides an LED lamp made using this light source board, which has good consistency, long service life and can adapt to the needs of automated production.

[0004] To achieve the above objectives, the technical solution provided by the present invention is an LED light source board, comprising: a circular aluminum plate, one side of which is covered with an insulating film, and copper pads are covered on the insulating film, on which LED beads are soldered; the pads are provided with a groove area, and one or more grooves are provided in the groove area, the bottom of the groove is recessed downward to pierce the insulating film, so that the pads extend and are connected to the aluminum plate.

[0005] Preferably, the groove has a V-shaped cross-section.

[0006] Preferably, the groove is formed by a toothed punch in one step.

[0007] Preferably, the surface of the pad away from the insulating film is provided with a reflective insulating varnish layer.

[0008] To achieve the above objectives, the technical solution provided by the present invention further includes an LED lamp, comprising any of the above-mentioned LED lamp light source boards, wherein the LED lamp light source board is disposed in a lamp cup with conductive function, one end of the LED lamp bead is connected to one pole of the power supply through the lamp cup, and the other end is connected to the other pole of the power supply through the groove and the aluminum plate.

[0009] Preferably, the lamp cup includes an insulating body and a first conductive layer disposed on the outside of the body. The first conductive layer is in communication with the solder pad and is used to lead one pole of the power supply to one end of the LED lamp bead.

[0010] More preferably, the lamp cup further includes a second conductive layer disposed on the inner side of the main body, the second conductive layer being in communication with the aluminum plate, for leading the other pole of the power supply to the other end of the LED lamp bead through the groove.

[0011] More preferably, the main body is provided with a boss structure for locking the LED light source board in the vertical direction. The boss structure includes a lower boss and an upper boss that are insulated from each other. The first conductive layer extends to the lower boss, and the second conductive layer extends to the upper boss. When the LED light source board is locked into the boss structure, the first conductive layer is connected to the pad through the lower boss, and the second conductive layer is connected to the aluminum plate through the upper boss.

[0012] More preferably, the lower boss and the upper boss are staggered along the circumferential direction of the lamp cup.

[0013] Preferably, the lamp cup further includes an insulating protective layer disposed outside the first conductive layer.

[0014] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0015] The LED light source board provided by this invention includes a circular aluminum plate. One side of the aluminum plate is covered with an insulating film, and copper pads are covered on the insulating film. LED beads are soldered onto the pads. By setting a groove area with one or more grooves on the pads, and using the bottom of the groove to pierce the insulating film, the pads are extended and connected to the aluminum plate. This eliminates the need for through holes, avoids stress concentration and tip discharge, and provides good safety. The LED lamp provided by this invention includes this LED light source board. By placing the LED light source board in a conductive lamp cup, one end of the LED bead is connected to one pole of the power supply through the lamp cup, and the other end of the LED bead is connected to the other pole of the power supply through the grooves and the aluminum plate. This allows the power to be easily led from the backlight side of the light source board to the light-emitting side, eliminating the need for through holes. This design is simple to operate, easy to process, has good consistency, long service life, and can adapt to the needs of automated production. Attached Figure Description

[0016] Figure 1 This is a bottom view schematic diagram of a preferred embodiment of the LED light source board in this invention.

[0017] Figure 2 yes Figure 1The cross-sectional view along the AA direction is shown in the diagram. The thickness of the thin layer region has been enlarged for easier observation.

[0018] Figure 3 This is a cross-sectional schematic diagram of a preferred embodiment of the LED lamp in this invention. The electrical components such as LED beads, resistors, and capacitors soldered on the pads are hidden. The thickness of the thin layer area has been enlarged for easier observation.

[0019] Among them: 10. Light source board; 11. Aluminum plate; 12. Insulating film; 13. Solder pad; 131. Groove area; 132. Groove; 14. LED lamp bead; 15. Reflective insulating paint layer; 20. LED lamp; 21. Lamp cup; 211. Insulating body; 212. First conductive layer; 213. Second conductive layer; 215. Upper boss; 216. Lower boss; 217. Insulating protective layer. Detailed Implementation

[0020] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0021] The vertical direction described in this invention is Figure 2 The top and bottom directions.

[0022] like Figure 1 and Figure 2 As shown, the LED light source board 10 provided by the present invention includes: a circular aluminum plate 11 with a thickness of about 1 mm; an insulating film 12 covering the lower side of the aluminum plate 11; the insulating film 12 is an insulating film with a thickness of about 0.1 mm; due to its thinness, the elastic deformation during stretching is small, making it relatively easy to puncture; a solder pad 13 is covered on the insulating film 12; the solder pad 13 is a copper foil with a thickness of about 0.02 mm; the solder pad 13 is used to solder LED beads 14, resistors, capacitors and other electrical components; the solder pad 13 has a groove area 131; the groove area 131 has multiple grooves 132; the cross-section of the groove 132 is V-shaped; the bottom of the groove 132 is concave downwards, causing the solder pad 13 to extend and puncture the insulating film 12, thereby making the solder pad 13 and the aluminum plate 11 conductive, forming a channel for power to flow from the aluminum plate side (backlight side) of the light source board to the solder pad side (light-emitting side), without the need for through holes, without causing stress concentration and point discharge, and with good safety.

[0023] To facilitate processing, after the aluminum plate 11, insulating film 12, and pad 13 are set up, the groove area 131 can be punched out on the pad 13 in one go by a toothed punch. Since copper has excellent ductility and the copper foil is thin, the technical effect of punching out the groove area 131 can be achieved under a small punching pressure (such as below 50N). Such a punching pressure will not cause deformation of the back surface of the aluminum plate 11.

[0024] To protect the pads 13 and facilitate the identification of the soldering positions of each electrical component, the surface of the pads 13 away from the insulating film 12 (i.e., the lower surface of the pads 13) is coated with reflective insulating varnish, and a reflective insulating varnish layer 15 is formed after the reflective insulating varnish has cured.

[0025] like Figure 3 As shown, the LED lamp 20 provided by the present invention includes the aforementioned LED lamp light source board 10, wherein the LED lamp light source board 10 is disposed in a lamp cup 21 with conductive function, one end of the LED lamp bead 14 is connected to one pole of the power supply through the lamp cup 21, and the other end is connected to the other pole of the power supply through the groove 132 and the aluminum plate 11. Specifically, the lamp cup 21 includes an insulating body 211 and a first conductive layer 212 disposed on the outside of the body 211. The first conductive layer 212 is connected to the pad 13 and is used to lead one pole of the power supply to one end of the LED lamp bead 14. The lamp cup 21 also includes a second conductive layer 213 disposed on the inside of the body 211. The second conductive layer 213 is connected to the aluminum plate 11 and is used to lead the other pole of the power supply to the other end of the LED lamp bead 14 through the groove 132.

[0026] The advantage of this setup is that it allows power to be easily drawn from the backlight side of the light source board to the light-emitting side, eliminating the need for through-hole design. It is simple to operate, easy to process, has good consistency, long service life, and can adapt to the needs of automated production.

[0027] To facilitate the fixing of the light source board 10, in this embodiment, the main body 211 is provided with a boss structure for locking the LED light source board 10 in the vertical direction. The boss structure includes a lower boss 216 and an upper boss 215 that are insulated from each other. The first conductive layer 212 extends downward past the lower edge of the main body 21 and then extends upward in the opposite direction to cover the lower boss 216. The second conductive layer 213 extends downward and covers the upper boss 215. When the LED light source board 10 is locked into the boss structure, the first conductive layer 212 is connected to the pad 13 through the lower boss 216 (in order to avoid interference from the reflective insulating varnish layer 15, a window can be opened on the reflective insulating varnish layer 15 to expose the pad 13 or its edge can not cover the pad 13). The second conductive layer 213 is connected to the aluminum plate 11 through the upper boss 215, so as to achieve the technical effect of leading both poles of the power supply to the light-emitting surface of the light source board 10.

[0028] The first conductive layer 212 and the second conductive layer 213 can be applied to the inner and outer sides of the main body 211 by means of brushing, spraying, or dipping. They are preferably made of inexpensive, readily available, and easy-to-operate metal materials such as copper and aluminum, or non-metallic materials with good conductivity such as carbon. The first conductive layer 212 and the second conductive layer 213 can also be conductive cups (such as aluminum cups) fitted on the inner and outer sides of the main body 211.

[0029] To facilitate the conductive connection between the boss structure and the conductive layer, the lower boss 216 and the upper boss 215 are staggered along the circumferential direction of the lamp cup.

[0030] To achieve insulation on the outermost side of the lamp cup 21 and meet safety standards, the lamp cup 21 also includes an insulating protective layer 217 disposed on the outside of the first conductive layer 212. The insulating protective layer 217 can be made of plastic materials such as PU.

[0031] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. An LED light source board, comprising: A circular aluminum plate, one side of which is covered with an insulating film, and copper pads are covered on the insulating film, with LED beads soldered onto the pads; Its features are: The pad has a groove area, and the groove area has one or more grooves. The bottom of the groove is recessed downwards and pierces the insulating film, so that the pad extends and becomes connected to the aluminum plate.

2. The LED light source board according to claim 1, characterized in that: The groove has a V-shaped cross-section.

3. The LED light source board according to claim 1, characterized in that: The groove is formed by a toothed punch in one go.

4. The LED light source board according to claim 1, characterized in that: The surface of the pads away from the insulating film is provided with a reflective insulating varnish layer.

5. An LED light, characterized in that: The LED light source board includes any one of claims 1-4, wherein the LED light source board is disposed in a lamp cup with conductive function, one end of the LED lamp bead is connected to one pole of the power supply through the lamp cup, and the other end is connected to the other pole of the power supply through the groove and the aluminum plate.

6. The LED lamp according to claim 5, characterized in that: The lamp cup includes an insulating body and a first conductive layer disposed on the outside of the body. The first conductive layer is in communication with the solder pad and is used to lead one pole of the power supply to one end of the LED lamp bead.

7. The LED lamp according to claim 6, characterized in that: The lamp cup also includes a second conductive layer disposed on the inner side of the main body. The second conductive layer is in communication with the aluminum plate and is used to lead the other pole of the power supply to the other end of the LED lamp bead through the groove.

8. The LED lamp according to claim 7, characterized in that: The main body is provided with a boss structure for locking the LED light source board in the vertical direction. The boss structure includes a lower boss and an upper boss that are insulated from each other. The first conductive layer extends to the lower boss and the second conductive layer extends to the upper boss. When the LED light source board is locked into the boss structure, the first conductive layer is connected to the pad through the lower boss and the second conductive layer is connected to the aluminum plate through the upper boss.

9. The LED lamp according to claim 8, characterized in that: The lower boss and the upper boss are staggered along the circumferential direction of the lamp cup.

10. The LED lamp according to claim 5, characterized in that: The lamp cup also includes an insulating protective layer disposed outside the first conductive layer.

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