Storage device and method for calculating its operating temperature

Abstract

A method for calculating the operating temperature of a storage device includes the following steps: calculating n (n is a positive integer greater than 1) detected temperatures into n converted temperatures according to a comprehensive temperature algorithm; when all n converted temperatures are lower than the heat dissipation enhancement trigger temperature of the server's heat dissipation mechanism, the lowest temperature among the n converted temperatures is set as the operating temperature; when at least one of the n converted temperatures is higher than the heat dissipation enhancement trigger temperature, the highest temperature among the n converted temperatures is set as the operating temperature; and when the storage device receives a temperature reading instruction sent by the host, the operating temperature is returned to the host, and the host controls the heat dissipation mode of the heat dissipation mechanism according to the operating temperature.

Description

Technical Field

[0001] The present invention relates to an operation method of a storage device, and more particularly to a storage device applied to a server and a related working temperature calculation method. Background Art

[0002] Please refer to Figure 1 , which is a schematic diagram of a server. The server 100 includes a host 110, at least one solid-state storage device 120, a chassis 130, and a plurality of fans 132, 134. Among them, the host 110 and the solid-state storage device 120 are disposed inside the chassis 130. The host 110 is connected to the solid-state storage device 120 via an external bus 112, and the external bus 112 can be an M.2 bus, a USB bus, a SATA bus, a PCIe bus, etc. In addition, the host 110 is further connected to the fans 132, 134 to control the rotation speeds of the fans 132, 134. The solid-state storage device 120 is taken as an example of a solid-state storage device in Figure 1 , however, the solid-state storage device 120 can also be other devices such as a hard disk, a magnetic tape, an optical disc drive, etc.

[0003] Of course, the server 100 further includes a plurality of electronic devices, and the solid-state storage device 120 is only one of the plurality of electronic devices in the server 100. The electronic devices further include: dynamic random access memory (DRAM), a power supply, etc., which will not be elaborated here.

[0004] When the server 100 operates normally, the host 110 can access the data in the solid-state storage device 120 and control other electronic devices. Since the host 110, the solid-state storage device 120, and other electronic devices inside the chassis 130 generate heat during the operation of the server 100, the host 110 can appropriately adjust the rotation speeds of the fans 132, 134 to remove the heat inside the chassis 130, so that the host 110, the solid-state storage device 120, and other electronic devices can operate normally.

[0005] Generally speaking, for the solid-state storage device 120 applied to the server 100, a temperature sensor (not shown in the figure) is disposed inside to detect the working temperature inside the solid-state storage device 120. During the operation of the server 100, the host 110 will send a temperature reading instruction to the solid-state storage device 120 at fixed time intervals, and the solid-state storage device 120 will return the working temperature to the host 110 according to the temperature reading instruction.

[0006] Furthermore, the host 110 in the server 100 collects the operating temperatures of all the electronic devices inside the chassis 130, and determines whether the temperature inside the chassis 130 is too high. When the temperature is too high, the host 110 controls the fans 132 and 134 to increase their rotational speeds to accelerate the removal of heat inside the chassis 130. When the temperature inside the chassis 130 decreases, the host 110 can control the fans 132 and 134 to decrease their rotational speeds. In other words, the host 110 of the server 100 activates the corresponding heat dissipation mechanism according to the operating temperatures reported by each electronic device.

[0007] However, in actual operation, when the operating temperature of the solid-state storage device 120 rises and it reports the operating temperature to the host 110 according to the temperature reading instruction, the host 110 does not control the fans 132 and 134 to increase their rotational speeds as expected, resulting in the solid-state storage device 120 still operating in a high-temperature environment.

[0008] At this time, the solid-state storage device 120 can only reduce the data access speed by itself to prevent the operating temperature from continuing to rise. However, the above actions of the solid-state storage device 120 will slow down the operation speed of the server 100 and reduce the performance of the server 100. Summary of the Invention

[0009] The present invention provides a method for calculating the operating temperature of a storage device. The storage device is connected to a host of a server. The storage device includes n (n is a positive integer greater than 1) temperature sensors for detecting n components and generating n detected temperatures. The method includes the following steps: calculating the n detected temperatures into n converted temperatures according to a comprehensive temperature algorithm; when all the n converted temperatures are less than a heat dissipation enhancement trigger temperature of a heat dissipation mechanism of the server, setting the lowest temperature among the n converted temperatures as the operating temperature of the storage device; and when at least one of the n converted temperatures is greater than the heat dissipation enhancement trigger temperature, setting the highest temperature among the n converted temperatures as the operating temperature; wherein, when the storage device receives a temperature reading instruction sent by the host, it reports the operating temperature to the host, and the host controls the heat dissipation mode of the heat dissipation mechanism according to the operating temperature.

[0010] The present invention provides a storage device, which is connected to a host of a server. The server has a heat dissipation mechanism. The storage device includes: n (n is a positive integer greater than 1) temperature sensors for detecting n components of the storage device and generating n detected temperatures; and a control circuit for receiving the n detected temperatures and executing a working temperature calculation method, the method comprising the following steps: calculating the n detected temperatures into n converted temperatures according to a comprehensive temperature algorithm; when all the n converted temperatures are less than a heat dissipation enhancement trigger temperature of the heat dissipation mechanism, setting a lowest temperature among the n converted temperatures as a working temperature of the storage device; and when at least one of the n converted temperatures is greater than the heat dissipation enhancement trigger temperature, setting a highest temperature among the n converted temperatures as the working temperature; wherein, when the storage device receives a temperature reading instruction sent by the host, the working temperature is sent back to the host, and the host controls a heat dissipation mode of the heat dissipation mechanism according to the working temperature.

[0011] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but it is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram of a server;

[0013] Figure 2 is a schematic diagram of a solid-state storage device;

[0014] Figure 3 is a flowchart of a working temperature calculation method; and

[0015] Figures 4A to 4C illustrates a working temperature calculation example of the solid-state storage device. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The structural principle and working principle of the present invention will be specifically described below with reference to the accompanying drawings:

[0017] In order to enable the host of the server to immediately activate the heat dissipation mechanism, the present invention proposes a method for calculating the operating temperature of a storage device applied to a server. A plurality of temperature sensors are provided inside the storage device, and according to the composite temperature algorithm, the detected temperature of each temperature sensor is further calculated as the transformed temperature. Furthermore, the storage device selects one of the plurality of transformed temperatures as the operating temperature. When the host of the server issues a temperature reading instruction to the storage device, the storage device immediately returns the operating temperature to the host, and the host controls the heat dissipation mode of the heat dissipation mechanism according to the operating temperature. The present invention is described in detail below. Although the storage device is described with a solid-state storage device, the storage device can also be other devices such as hard disks, magnetic tapes, and optical disc drives; although the heat dissipation mechanism is described with a fan that uses air as a medium to cool the storage device, other heat dissipation mechanisms can also be used, such as a liquid radiator that uses liquid as a medium (such as water, oil, and other heat-conducting liquids).

[0018] Please refer to Figure 2 , which is a schematic diagram of the solid-state storage device 220. The solid-state storage device 220 can be installed in Figure 1 the server 100 shown. Furthermore, the solid-state storage device 220 includes a control circuit 222, a memory die module 224, a printed circuit board (PCB) 226, and a plurality of temperature sensors 232, 234, 236. Among them, the control circuit 222 and the memory die module 224 are arranged on the printed circuit board (PCB) 226. Furthermore, the control circuit 222 is connected to the host of the server (not shown in the figure) via the external bus 112.

[0019] Inside the solid-state storage device 220, the control circuit 222 is connected to the memory die module 224 via an internal bus 228. The temperature sensors 232, 234, 236 are respectively in contact with the control circuit 222, the memory die module 224, and the printed circuit board (PCB) 226 to detect the temperatures of the control circuit 222, the memory die module 224, and the printed circuit board (PCB) 226. In addition, the memory die module 224 is composed of a plurality of memory dies (not shown in the figure), such as NAND dies.

[0020] Of course, in addition to respectively contacting the temperature sensors 232, 234, and 236 with the control circuit 222, the memory die module 224, and the printed circuit board (PCB) 226, the solid-state storage device 220 of the present invention may also include more temperature sensors (not shown in the figure) disposed within the solid-state storage device 220 and contacting other elements. For example, a temperature sensor contacts a DRAM (not shown in the figure) in the solid-state storage device 220 to detect the temperature of the DRAM.

[0021] According to an embodiment of the present invention, a comprehensive temperature algorithm is designed in the firmware of the control circuit 222 to further calculate a conversion temperature from the detected temperatures output by the temperature sensors 232, 234, and 236. Furthermore, when the host of the server issues a temperature reading instruction to the solid-state storage device 220, the solid-state storage device 220 selects one of the multiple conversion temperatures as the operating temperature and returns the operating temperature to the host.

[0022] In addition, the comprehensive temperature algorithm executed in the present invention is designed according to the strengthen heat dissipation trigger temperature provided by the server manufacturer. Basically, the strengthen heat dissipation trigger temperature is the temperature at which the server starts to enhance its heat dissipation capacity. For example, when the heat dissipation mechanism is cooling by a fan, assuming the fan heat dissipation strengthen trigger temperature is 70°C, it means that when the internal temperature of the server chassis is greater than 70°C, the host of the server must change the heat dissipation mode of the fan, such as starting to increase the rotation speed of the fan to enhance the heat dissipation capacity of the server. On the contrary, if the internal temperature of the server chassis is less than 70°C, the host of the server does not change the heat dissipation mode of the fan and controls the fan at a normal rotation speed. When the heat dissipation mechanism is cooling by a liquid radiator, assuming the liquid heat dissipation strengthen trigger temperature is 70°C, it means that when the internal temperature of the server chassis is greater than 70°C, the host of the server must change the heat dissipation mode of the liquid radiator, such as starting to increase the liquid flow speed or flow rate to enhance the heat dissipation capacity of the server. On the contrary, if the internal temperature of the server chassis is less than 70°C, the host of the server does not change the heat dissipation mode of the liquid radiator and controls the liquid radiator at a normal liquid flow speed or flow rate.

[0023] In addition, in addition to being provided by the server manufacturer, the above-mentioned strengthen heat dissipation trigger temperature of the server can also be obtained by the manufacturer of the solid-state storage device 220 after actually testing the server.

[0024] Please refer to Figure 3, which is a flowchart of the working temperature calculation method. Assume that n temperature sensors are arranged inside the solid-state storage device 220 in contact with n components, and n is a positive integer greater than 1. Furthermore, the control circuit 222 starts a Figure 3 calculation process at regular time intervals. For example, the control circuit 222 starts the calculation process once every minute.

[0025] When starting the calculation process, first set i equal to 1 (step S302). Then, the control circuit 222 receives the i-th detected temperature output by the i-th temperature sensor and calculates the i-th converted temperature according to the comprehensive temperature algorithm (step S304).

[0026] Next, determine whether i is equal to n (step S306). That is, determine whether the n detected temperatures output by the n temperature sensors have all been converted into n converted temperatures. When i is not equal to n, increment i by 1 (step S308) and return to step S304.

[0027] Conversely, when i is equal to n, it means that the n detected temperatures have all been converted into n converted temperatures. At this time, determine whether all n converted temperatures are less than the fan heat dissipation enhancement trigger temperature (step S310).

[0028] When all n converted temperatures are less than the fan heat dissipation enhancement trigger temperature, set the lowest temperature among the n converted temperatures as the working temperature (step S312). Therefore, when the control circuit 222 of the solid-state storage device 220 receives a temperature reading instruction sent by the host, the control circuit 222 immediately returns the working temperature to the host. Since the working temperature is less than the fan heat dissipation enhancement trigger temperature of the server, when the host of the server receives the working temperature returned by the solid-state storage device 220, it will not change the heat dissipation mode of the fan and will maintain the fan speed.

[0029] When at least one of the n converted temperatures is greater than the fan heat dissipation enhancement trigger temperature, set the highest temperature among the n converted temperatures as the working temperature (step S314). Therefore, when the control circuit 222 of the solid-state storage device 220 receives a temperature reading instruction sent by the host, the control circuit 222 immediately returns the working temperature to the host. Since the working temperature is greater than the fan heat dissipation enhancement trigger temperature of the server, when the host of the server receives the working temperature returned by the solid-state storage device 220, it will change the heat dissipation mode of the fan to increase the fan speed and enhance the heat dissipation ability of the server.

[0030] Although in Figure 3The heat dissipation mechanism in [it] is illustrated by taking a fan as an example. However, when the heat dissipation mechanism is a liquid radiator, when the operating temperature is lower than the liquid heat dissipation enhancement trigger temperature of the server, the liquid flow rate or flow volume will not be increased. When the operating temperature is higher than the liquid heat dissipation enhancement trigger temperature of the server, the heat dissipation mode of the liquid radiator is changed to increase the liquid flow rate or flow volume and enhance the heat dissipation capacity of the server.

[0031] The following takes Figure 2 the solid-state storage device 220 and the heat dissipation mechanism being a fan as an example to illustrate calculating the conversion temperature from the detected temperature using the comprehensive temperature algorithm.

[0032] According to an embodiment of the present invention, when designing the solid-state storage device 220, the manufacturer sets corresponding warning temperatures and pre-warning temperatures for multiple components in the solid-state storage device 220. For example, the first pre-warning temperature (Temp preT1 ) corresponding to the control circuit 222 is 85°C, and the first warning temperature (Temp wT1 ) is 95°C. The second pre-warning temperature (Temp preT2 ) corresponding to the memory die module 224 is 60°C, and the second warning temperature (Temp wT2 ) is 70°C. The third pre-warning temperature (Temp preT3 ) corresponding to the printed circuit board 226 is 50°C, and the third warning temperature (Temp wT3 ) is 60°C.

[0033] Basically, in the solid-state storage device 220, when a specific component operates at the pre-warning temperature, it means that the performance of the specific component begins to decline. When a specific component operates at the warning temperature, it means that the performance of the specific component is very poor and cooling needs to be carried out immediately.

[0034] For example, when the control circuit 222 operates below the first pre-warning temperature (Temp preT1 ), the control circuit 222 can maintain better performance. When the control circuit 222 operates between the first pre-warning temperature (Temp preT1 ) and the first warning temperature (Temp wT1 ), the performance of the control circuit 222 begins to decline. When the control circuit 222 operates above the first warning temperature (Temp wT1 ), the performance of the control circuit 222 is very poor and immediate cooling is required. Similarly, the operating performance of other components is similar and will not be elaborated here.

[0035] Furthermore, since the temperature sensors 232, 234, and 236 of the solid-state storage device 220 are respectively in contact with the control circuit 222, the memory die module 224, and the printed circuit board (PCB) 226. Therefore, when the solid-state storage device 220 operates, the temperature sensor 232 can detect the control circuit 222 and generate a first detected temperature (Temp dT1 ); the temperature sensor 234 can detect the memory die module 224 and generate a second detected temperature (Temp dT2 ); the temperature sensor 236 can detect the printed circuit board (PCB) 226 and generate a third detected temperature (Temp dT3 ).

[0036] According to the above temperature relationship, a comprehensive temperature algorithm can be designed. That is:

[0037]

[0038] In the comprehensive temperature algorithm, the conversion temperature (Temp tranTi ) and the detected temperature (Temp dTi ) are non-linearly mapped. Other algorithms can also be designed according to the firmware of different storage devices. This comprehensive temperature algorithm converts the temperatures of each temperature sensor into temperatures with similar ratios and enables the host to react early to the corresponding heat dissipation mode types. Among them, the fan heat dissipation enhancement trigger temperature of the server is Temp trigger , and the server's fan has multiple different heat dissipation modes, such as super, enhanced, medium, weak, normal, etc. The fan switches between different heat dissipation modes to respectively correspond to different rotational speeds and heat dissipation capabilities of the fan. Among them, the maximum number of fan switching segments is Level fanmax , for example, the fan has 6 heat dissipation modes, and the server can control the fan to operate in one of the 1st to 6th segments. Each segment corresponds to a different heat dissipation mode and fan rotational speed. Therefore, the maximum number of fan switching segments Level fanmax of the server is 6. Furthermore, when the number of temperature sensors is n, then i can be any value between 1 and n, and i is a positive integer.

[0039] In other words, substituting the detected temperature (Temp dTi ), the warning temperature (Temp preTi ), and the warning temperature (Temp wTi ) of a specific component, as well as the maximum number of fan switching segments Level fanmax and the fan heat dissipation enhancement trigger temperature (Temp trigger ) of the server into the above comprehensive temperature algorithm, the conversion temperature (Temp tranTi ) of the specific component can be calculated.

[0040] The following takesFigures 4A to 4C To illustrate an example of calculating the operating temperature of a solid-state storage device. Among them, the fan heat dissipation enhancement trigger temperature (Temp trigger ) of the server is 70 °C, and the maximum switching stage number (Level fanmax ) of the server's fan is 6.

[0041] As Figure 4A shown, when the control circuit 222 starts the calculation process, the temperature sensor 232 detects that the first detected temperature (Temp dT1 ) of the control circuit 222 is 70 °C; the temperature sensor 234 detects that the second detected temperature (Temp dT2 ) of the memory die module 224 is 40 °C; the temperature sensor 236 detects that the third detected temperature (Temp dT3 ) of the printed circuit board (PCB) 226 is 33 °C.

[0042] Furthermore, using the comprehensive temperature algorithm, the first conversion temperature (Temp tranT1 ) can be calculated as 61 °C; the second conversion temperature (Temp tranT2 ) is 58 °C; the third conversion temperature (Temp tranT3 ) is 59.8 °C. Since all the conversion temperatures are less than the fan heat dissipation enhancement trigger temperature (Temp trigger ) of 70 °C, the control circuit 222 thus sets the lowest conversion temperature, that is, 58 °C of the second conversion temperature (Temp tranT2 ), as the operating temperature (Temp workT ) of the solid-state storage device 220.

[0043] When the control circuit 222 of the solid-state storage device 220 receives a temperature reading instruction sent by the host, the control circuit 222 returns the operating temperature of 58 °C (Temp workT ) to the host. Since the operating temperature (Temp workT ) of the solid-state storage device 220, which is 58 °C, is less than the fan heat dissipation enhancement trigger temperature (Temp trigger ) of the server, which is 70 °C, the server will not increase the fan speed.

[0044] From Figure 4A it can be seen that when the components in the solid-state storage device 220 all operate below the corresponding warning temperature, the detected temperature minus the warning temperature in the comprehensive temperature algorithm will be negative. Therefore, the calculated conversion temperatures will all be less than the fan heat dissipation enhancement trigger temperature (Temp trigger ) of the server.

[0045] From Figure 4BAs shown, when the control circuit 222 starts the calculation process, the temperature sensor 232 detects the first detected temperature (Temp dT1 ) of the control circuit 222 to be 88 °C; the temperature sensor 234 detects the second detected temperature (Temp dT2 ) of the memory die module 224 to be 55 °C; the temperature sensor 236 detects the third detected temperature (Temp dT3 ) of the printed circuit board (PCB) 226 to be 40 °C.

[0046] Furthermore, using the comprehensive temperature algorithm, the first converted temperature (Temp tranT1 ) can be calculated to be 71.8 °C; the second converted temperature (Temp tranT2 ) is 67 °C; the third converted temperature (Temp tranT3 ) is 64 °C.

[0047] Since the control circuit 222 operates above the first warning temperature (Temp preT1 ) of 85 °C, therefore, the first detected temperature (Temp dT1 ) minus the first warning temperature (Temp preT1 ) will be a positive value. So, using the comprehensive temperature algorithm, a first converted temperature (Temp trigger ) greater than the fan heat dissipation enhancement trigger temperature (Temp tranT1 ) of 70 °C, which is 71.8 °C, will be calculated. Furthermore, since other components operate below their corresponding warning temperatures, the converted temperatures will be less than the fan heat dissipation enhancement trigger temperature (Temp trigger ) of 70 °C for the server.

[0048] In Figure 4B , since the first converted temperature (Temp tranT1 ) of 71.8 °C is greater than the fan heat dissipation enhancement trigger temperature (Temp trigger ) of 70 °C for the server, the control circuit 222 sets the first converted temperature (Temp tranT1 ) of 71.8 °C as the operating temperature (Temp workT ). Furthermore, when the control circuit 222 of the solid-state storage device 220 receives a temperature reading instruction sent by the host, the control circuit 222 immediately returns the operating temperature (Temp workT ) of 71.8 °C to the host. Since the operating temperature (Temp workT ) of the solid-state storage device 220 is 71.8 °C, which is greater than the fan heat dissipation enhancement trigger temperature (Temp trigger ) of 70 °C for the server, the server will change the fan's heat dissipation mode to increase the fan speed, for example, increasing the switching stage from 1 stage to 2 stages. However, it can be based on the operating temperature (Temp workT)The difference from the fan heat dissipation enhancement trigger temperature (Temp trigger ) determines how many switching segments are adjusted to enter different heat dissipation modes. For example, when the difference is 5°C, the switching segment (rotation speed) of the fan is increased by 1 segment, and when the difference is 10°C, the switching segment (rotation speed) of the fan is increased by 2 segments. However, the present invention is not limited thereto.

[0049] As can be seen from the above description, when any component in the solid-state storage device 220 operates above the corresponding warning temperature, the control circuit 222 will calculate a working temperature (Temp trigger ) that is greater than the fan heat dissipation enhancement trigger temperature (Temp work ) of the server, and according to the temperature reading instruction, reply the working temperature (Temp work ) to the host, so that the server changes the heat dissipation mode of the fan, such as increasing the rotation speed of the fan to accelerate the removal of heat inside the chassis.

[0050] From Figure 4C As shown, when the control circuit 222 starts the calculation process, the temperature sensor 232 detects that the first detection temperature (Temp dT1 ) of the control circuit 222 is 96°C; the temperature sensor 234 detects that the second detection temperature (Temp dT2 ) of the memory die module 224 is 66°C; the temperature sensor 236 detects that the third detection temperature (Temp dT3 ) of the printed circuit board (PCB) 226 is 51°C.

[0051] Furthermore, using the comprehensive temperature algorithm, the first conversion temperature (Temp tranT1 ) can be calculated as 76.6°C; the second conversion temperature (Temp tranT2 ) is 73.6°C; the third conversion temperature (Temp tranT3 ) is 70.6°C. Therefore, the control circuit 222 sets the highest conversion temperature, that is, the first conversion temperature (Temp tranT1 ) 76.6°C, as the working temperature (Temp workT ) of the solid-state storage device 220.

[0052] Furthermore, when the control circuit 222 of the solid-state storage device 220 receives the temperature reading instruction sent by the host, the control circuit 222 replies the working temperature (Temp workT ) 76.6°C to the host. Since the working temperature (Temp workT ) 76.6°C of the solid-state storage device 220 is greater than the fan heat dissipation enhancement trigger temperature (Temp trigger)70 °C, so the server will change the cooling mode of the fan to increase the fan speed. For example, the switching stage (speed) will be increased from 1 stage to 2 stages. However, the amount of adjustment of the switching stage can be determined according to the difference between the operating temperature (Temp workT ) and the fan cooling enhancement trigger temperature (Temp trigger ) to enter different cooling modes. For example, when the difference is 5 °C, the switching stage (speed) of the fan is increased by 1 stage; when the difference is 10 °C, the switching stage (speed) of the fan is increased by 2 stages. However, the present invention is not limited thereto.

[0053] Furthermore, the above-mentioned comprehensive temperature algorithm is only one embodiment of the present invention. Those skilled in the art can also modify the comprehensive temperature algorithm so that when the component operates above the warning temperature, the operating temperature (Temp trigger ) greater than the fan cooling enhancement trigger temperature (Temp workT ) can be calculated. For example, the comprehensive temperature algorithm can be modified to Temp tranTi = C · (Temp dTi - Temp preTi ) + Temp trigger , where C is a constant and C is a positive value. In this comprehensive temperature algorithm, the conversion temperature (Temp tranTi ) and the detected temperature (Temp dTi ) are non-linearly mapped, and other algorithms can also be designed according to the firmware of different storage devices. This comprehensive temperature algorithm converts the temperatures of each temperature sensor into temperatures with similar proportions and enables the host to react early to the corresponding types of cooling modes.

[0054] In the above embodiments, the cooling mechanism is taken as an example of a fan for illustration. However, when the cooling mechanism is a liquid radiator, the liquid radiator has a maximum switching stage of liquid flow velocity or flow rate and a liquid cooling enhancement trigger temperature (Temp trigger ). The liquid radiator of the server has multiple different cooling modes, such as super, enhanced, medium, weak, normal, etc. The liquid radiator switches among different cooling modes to correspond to different liquid flow velocities or flow rates and cooling capabilities respectively. Other operation methods or characteristics are similar to those described in the above embodiments and will not be elaborated here.

[0055] As can be seen from the above description, the present invention proposes a storage device and a related operating temperature calculation method applied to a server. A plurality of temperature sensors are arranged inside the storage device to detect the temperatures of corresponding components. Furthermore, a corresponding warning temperature is set for each component. When the detected temperature of any component exceeds the warning temperature, the control circuit calculates the corresponding conversion temperature according to the comprehensive temperature algorithm, and the conversion temperature will be greater than the cooling enhancement trigger temperature (Temptrigger ), and set the conversion temperature of the highest temperature as the operating temperature (Temp work ). Therefore, the control circuit will, according to the temperature reading instruction, report the operating temperature (Temp work ) back to the host of the server, so that the server switches the heat dissipation mode of the heat dissipation mechanism, such as increasing the rotation speed of the fan, increasing the liquid flow speed or flow rate, etc., to accelerate the removal of heat inside the chassis.

[0056] Furthermore, Figure 2 Take the solid-state storage device 220 in as an example to illustrate with three temperature sensors 232, 234, and 236. However, the present invention is not limited thereto. Those skilled in the art can also use two temperature sensors, or more than three temperature sensors to detect the temperature of the corresponding components, and even can use multiple temperature sensors to detect the temperature of the same component.

[0057] Certainly, the present invention can also have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformations should all fall within the protection scope of the appended claims of the present invention.

Claims

1. A method for calculating the operating temperature of a storage device, the storage device being connected to a host of a server, the storage device including n temperature sensors for detecting n components and generating n detected temperatures, characterized in that, The method includes the following steps: Calculating the n detected temperatures into n converted temperatures according to a comprehensive temperature algorithm; the comprehensive temperature algorithm is , Temp tranTi is the conversion temperature, Temp dTi is the detected temperature, Temp preTi is the warning temperature, Temp wTi is the warning temperature, Level max is the maximum number of switching segments of the heat dissipation mechanism of this server, Temp trigger is the heat dissipation enhancement trigger temperature of the heat dissipation mechanism of this server; when all of the n conversion temperatures are less than the heat dissipation enhancement trigger temperature of the heat dissipation mechanism of this server, the lowest temperature among the n conversion temperatures is set as an operating temperature of the storage device; And When at least one of the n converted temperatures is greater than the heat dissipation enhancement trigger temperature, the highest temperature among the n converted temperatures is set as the operating temperature; Wherein, when the storage device receives a temperature reading instruction sent by the host, the operating temperature is returned to the host, and the host controls the heat dissipation mode of the heat dissipation mechanism according to the operating temperature, Wherein, a first temperature sensor among the n temperature sensors contacts a first component among the n components to generate a first detected temperature. When the first detected temperature is greater than a first warning temperature of the first component, the first detected temperature is calculated into a first converted temperature according to the comprehensive temperature algorithm, and the first converted temperature is greater than the heat dissipation enhancement trigger temperature, Wherein, the first converted temperature is equal to the heat dissipation enhancement trigger temperature plus a constant multiplied by a first difference, and the first difference is equal to the first detected temperature minus the first warning temperature; Wherein, n is a positive integer greater than 1.

2. The working temperature calculation method according to claim 1, characterized in that The storage device starts the comprehensive temperature algorithm after a time interval.

3. The working temperature calculation method according to claim 1, characterized in that, The heat dissipation mechanism of the server is a fan, the fan has a fan heat dissipation enhancement trigger temperature and M fan switching segments corresponding to different heat dissipation modes respectively, the first component has a first warning temperature, and the first converted temperature is equal to the fan heat dissipation enhancement trigger temperature plus a first calculated value, the first calculated value is equal to the maximum fan switching segment number M multiplied by a first difference divided by a second difference, the first difference is equal to the first detected temperature minus the first warning temperature, and the second difference is equal to the first warning temperature minus the first warning temperature; Wherein, M is a positive integer greater than 1.

4. The working temperature calculation method according to claim 3, wherein When the operating temperature is greater than the fan heat dissipation enhancement trigger temperature, the host determines how to adjust the fan switching segment number according to the difference between the operating temperature and the fan heat dissipation enhancement trigger temperature.

5. The working temperature calculation method according to claim 1, characterized in that The heat dissipation mechanism of the server is a liquid radiator, the liquid radiator has a liquid heat dissipation enhancement trigger temperature and M liquid flow velocity or flow rate switching segments corresponding to different heat dissipation modes respectively, the first component has a first warning temperature, and the first converted temperature is equal to the liquid heat dissipation enhancement trigger temperature plus a first calculated value, the first calculated value is equal to the maximum liquid flow velocity or flow rate switching segment number M multiplied by a first difference divided by a second difference, the first difference is equal to the first detected temperature minus the first warning temperature, and the second difference is equal to the first warning temperature minus the first warning temperature; wherein, M is a positive integer greater than 1.

6. The working temperature calculation method according to claim 5, characterized in that, When the operating temperature is greater than the liquid heat dissipation enhancement trigger temperature, the host determines how to adjust the liquid flow velocity or flow rate switching segment number according to the difference between the operating temperature and the liquid heat dissipation enhancement trigger temperature.

7. A storage device, the storage device being connected to a host of a server, the server having a heat dissipation mechanism, characterized in that, The storage device includes: n temperature sensors for detecting n components of the storage device and generating n detected temperatures; and A control circuit for receiving the n detected temperatures and executing a method for calculating the operating temperature, the method including the following steps: Calculating the n detected temperatures into n converted temperatures according to a comprehensive temperature algorithm; the comprehensive temperature algorithm is , Temp tranTi is the conversion temperature, Temp dTi is the detected temperature, Temp preTi is the warning temperature, Temp wTi is the warning temperature, Level max is the maximum number of switching segments of the heat dissipation mechanism of this server, Temp trigger is the heat dissipation enhancement trigger temperature of the heat dissipation mechanism of this server; When all of the n converted temperatures are less than the heat dissipation enhancement trigger temperature of the heat dissipation mechanism, a lowest temperature among the n converted temperatures is set as an operating temperature of the storage device; and When at least one of the n converted temperatures is greater than the heat dissipation enhancement trigger temperature, a highest temperature among the n converted temperatures is set as the operating temperature; Wherein, when the storage device receives a temperature reading instruction sent by the host, the operating temperature is returned to the host, and the host controls the heat dissipation mode of the heat dissipation mechanism according to the operating temperature, Wherein, a first temperature sensor among the n temperature sensors contacts a first component among the n components to generate a first detected temperature. When the first detected temperature is greater than a first warning temperature of the first component, the first detected temperature is calculated into a first converted temperature according to the comprehensive temperature algorithm, and the first converted temperature is greater than the heat dissipation enhancement trigger temperature, Wherein, the first converted temperature is equal to the heat dissipation enhancement trigger temperature plus a constant multiplied by a first difference, and the first difference is equal to the first detected temperature minus the first warning temperature; Wherein, n is a positive integer greater than 1.

8. The storage device according to claim 7, wherein The heat dissipation mechanism of the server is a fan, the fan has a fan heat dissipation enhancement trigger temperature and M fan switching segments corresponding to different heat dissipation modes respectively, the first component has a first warning temperature, and the first converted temperature is equal to the fan heat dissipation enhancement trigger temperature plus a first calculated value, the first calculated value is equal to the maximum fan switching segment number M multiplied by a first difference divided by a second difference, the first difference is equal to the first detected temperature minus the first warning temperature, the second difference is equal to the first warning temperature minus the first warning temperature; wherein, M is a positive integer greater than 1.

9. The storage device according to claim 8, wherein, When the operating temperature is greater than the fan heat dissipation enhancement trigger temperature, the host determines how to adjust the fan switching segment number according to the difference between the operating temperature and the fan heat dissipation enhancement trigger temperature.

10. The storage device according to claim 7, characterized in that, The heat dissipation mechanism of the server is a liquid radiator, the liquid radiator has a liquid heat dissipation enhancement trigger temperature and M liquid flow speed or flow rate switching segments corresponding to different heat dissipation modes respectively, the first component has a first warning temperature, and the first converted temperature is equal to the liquid heat dissipation enhancement trigger temperature plus a first calculated value, the first calculated value is equal to the maximum liquid flow speed or flow rate switching segment number M multiplied by a first difference divided by a second difference, the first difference is equal to the first detected temperature minus the first warning temperature, the second difference is equal to the first warning temperature minus the first warning temperature; wherein, M is a positive integer greater than 1.

11. The storage device according to claim 10, wherein, When the operating temperature is greater than the liquid heat dissipation enhancement trigger temperature, the host determines how to adjust the liquid flow speed or flow rate switching segment number according to the difference between the operating temperature and the liquid heat dissipation enhancement trigger temperature.

12. A method for calculating the operating temperature of a storage device, the storage device being connected to a host of a server, the storage device including n temperature sensors for detecting n components and generating n detected temperatures, characterized in that, The method includes the following steps: Calculating the n detected temperatures into n converted temperatures according to a comprehensive temperature algorithm; the comprehensive temperature algorithm is , Temp tranTi is the conversion temperature, C is a constant and is positive, Temp dTi is the detected temperature, Temp preTi is the warning temperature, Temp trigger is the heat dissipation enhancement trigger temperature of the heat dissipation mechanism of this server; When all of the n conversion temperatures are lower than the heat dissipation enhancement trigger temperature of the server's heat dissipation mechanism, the lowest one of the n conversion temperatures is set as an operating temperature of the storage device; and when at least one of the n conversion temperatures is higher than the heat dissipation enhancement trigger temperature, the highest one of the n conversion temperatures is set as the operating temperature; wherein, when the storage device receives a temperature reading instruction sent by the host, the operating temperature is sent back to the host, and the host controls the heat dissipation mode of the heat dissipation mechanism according to the operating temperature, wherein, a first temperature sensor among the n temperature sensors contacts a first component among the n components to generate a first detected temperature. When the first detected temperature is higher than a first warning temperature of the first component, the first detected temperature is calculated as a first conversion temperature according to the comprehensive temperature algorithm, and the first conversion temperature is higher than the heat dissipation enhancement trigger temperature, wherein, the first conversion temperature is equal to the heat dissipation enhancement trigger temperature plus a constant multiplied by a first difference value, and the first difference value is equal to the first detected temperature minus the first warning temperature; wherein, n is a positive integer greater than 1.

13. A storage device, the storage device being connected to a host of a server, the server having a heat dissipation mechanism, characterized in that, The storage device includes: n temperature sensors for detecting n components of the storage device and generating n detected temperatures; and a control circuit for receiving the n detected temperatures and executing an operating temperature calculation method, the method including the following steps: calculating the n detected temperatures as n conversion temperatures according to a comprehensive temperature algorithm; the comprehensive temperature algorithm is , Temp tranTi is the conversion temperature, C is a constant and a positive value, Temp dTi is the detected temperature, Temp preTi is the warning temperature, Temp trigger is the heat dissipation enhancement trigger temperature of the heat dissipation mechanism of this server; when all of the n conversion temperatures are lower than the heat dissipation enhancement trigger temperature of the heat dissipation mechanism, the lowest one of the n conversion temperatures is set as an operating temperature of the storage device; and when at least one of the n conversion temperatures is higher than the heat dissipation enhancement trigger temperature, the highest one of the n conversion temperatures is set as the operating temperature; wherein, when the storage device receives a temperature reading instruction sent by the host, the operating temperature is sent back to the host, and the host controls the heat dissipation mode of the heat dissipation mechanism according to the operating temperature, wherein, a first temperature sensor among the n temperature sensors contacts a first component among the n components to generate a first detected temperature. When the first detected temperature is higher than a first warning temperature of the first component, the first detected temperature is calculated as a first conversion temperature according to the comprehensive temperature algorithm, and the first conversion temperature is higher than the heat dissipation enhancement trigger temperature, wherein, the first conversion temperature is equal to the heat dissipation enhancement trigger temperature plus a constant multiplied by a first difference value, and the first difference value is equal to the first detected temperature minus the first warning temperature; wherein, n is a positive integer greater than 1.

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