Wafer processing apparatus and semiconductor manufacturing equipment

Abstract

The application discloses a wafer processing device and a semiconductor manufacturing equipment, and belongs to the technical field of semiconductor manufacturing, and aims to solve the problem that particles generated by a transfer chamber flow into a process chamber in the prior art. The wafer processing device comprises a process chamber, a transfer chamber and an isolation valve. The process chamber is connected with the transfer chamber, the isolation valve is arranged at a connecting position of the process chamber and the transfer chamber, and the isolation valve controls opening and closing of a transmission channel between the process chamber and the transfer chamber. The isolation valve comprises an inner plate, a filter, an outer plate and a driving unit. The filter is arranged between the inner plate and the outer plate. Before wafer loading or unloading, the driving unit drives the inner plate and the outer plate to open, and the filter filters air flow entering the process chamber. When the wafer is loaded or unloaded, the driving unit drives the filter to open, and the transmission channel between the process chamber and the transfer chamber is opened. The application can reduce wafer defects and improve yield.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, and specifically relates to a wafer processing apparatus and semiconductor manufacturing equipment. Background Technology

[0002] In semiconductor equipment, isolation valves are installed to separate the process chamber from the transfer chamber. These valves open during wafer loading before the process begins and during wafer unloading after the process ends. However, particles generated by the transfer module or transfer robot can still flow into the process chamber along with the airflow drawn in.

[0003] Current isolation valves consist of a plate, such as Figure 1 , Figure 2 As shown, the simple up / down movement serves to isolate the process chamber from the transfer chamber, but it cannot control or resolve the impact of particles flowing into the chamber when the isolation valve is opened.

[0004] Particles flowing into the process chamber can lead to wafer defects and low yield. Simultaneously, contamination of the process chamber and electrostatic chuck (ESC) can cause back-side helium leakage, altering process conditions or reducing wafer pick-up capacity, thereby causing equipment malfunctions or process problems and increasing the frequency of unscheduled equipment maintenance (PM). Therefore, to address the problem of particles introduced when the isolation valve is open, this invention improves the isolation valve that effectively separates the process chamber from the transfer chamber. Summary of the Invention

[0005] Based on the above analysis, the present invention aims to provide a wafer processing apparatus and semiconductor manufacturing equipment to solve the problem of particles generated by transfer modules or transfer robots flowing into the process chamber in the prior art.

[0006] The objective of this invention is mainly achieved through the following technical solutions:

[0007] The present invention provides a wafer processing apparatus, including a process chamber, a transfer chamber, and an isolation valve;

[0008] The process chamber is connected to the transfer chamber, and an isolation valve is installed at the connection between the process chamber and the transfer chamber to control the opening and closing of the transfer channel between the process chamber and the transfer chamber;

[0009] The isolation valve includes an inner plate, a filter, an outer plate, and a drive unit;

[0010] The filter is installed between the inner and outer panels;

[0011] Before wafer loading or unloading, the drive unit drives the inner and outer boards to open, and the filter filters the airflow entering the process chamber.

[0012] During wafer loading or unloading, the drive unit drives the filter to turn on, and the transfer channel between the process chamber and the transfer chamber is opened.

[0013] In one possible design, the drive unit includes a first shaft and a first drive unit;

[0014] The first shaft is connected to the first drive unit. Both the inner plate and the outer plate are connected to the first shaft, and the inner plate and the outer plate are arranged in parallel. The first shaft drives the inner plate and the outer plate to move.

[0015] In one possible design, the drive unit also includes a second shaft and a second drive unit;

[0016] The first shaft is provided with an axial through hole, and the second shaft is coaxially disposed in the axial through hole of the first shaft;

[0017] The second shaft is connected to the second drive unit, and the filter is connected to the second shaft. The second drive unit drives the second shaft to move relative to the first shaft along the through hole axis, thereby moving the filter.

[0018] In one possible design, both the inner and outer panels are made of aluminum alloy.

[0019] In one possible design, the chemical composition of the aluminum alloy, by mass percentage, is: Mg 2.2%–2.8%; Cr 0.15%–0.35%; Cu ≤0.10%; Zn ≤0.10%; Mn ≤0.10%; Fe ≤0.40%; with the balance being Al.

[0020] In one possible design, the filter is an electrostatic filter.

[0021] In one possible design, the electrostatic filter is a high-efficiency filter treated with an ultra-high voltage current of 25,000V or higher.

[0022] In one possible design, the filter's filtration class is H13 to U17.

[0023] Furthermore, the first drive unit is a cylinder, and the second drive unit is an AC servo motor. The cylinder drives the inner plate and the outer plate to move up and down reciprocally, and the AC servo motor drives the filter to move up and down according to the set time.

[0024] Furthermore, the cylinder and the AC servo motor each have their own separate control unit. The cylinder box, as the control unit of the cylinder, is connected to the main system, and the AC servo motor box, as the control unit of the AC servo motor, is connected to the main system.

[0025] Furthermore, a position sensor and a communication module are installed inside the cylinder box. The position signal sensor detects the position of the inner plate and the outer plate, and the resulting position signal is transmitted to the main system through the communication module.

[0026] Furthermore, the AC servo motor box is also equipped with a position sensor and a communication module. The position signal sensor detects the position of the filter and generates a position signal, which is then transmitted to the main system through the communication module.

[0027] The present invention also provides a semiconductor manufacturing apparatus, including a process chamber, a transfer chamber, and isolation valves;

[0028] The process chamber is connected to the transfer chamber, and an isolation valve is installed at the connection between the process chamber and the transfer chamber; it controls the opening and closing of the transfer channel between the process chamber and the transfer chamber.

[0029] The process chamber is equipped with electrostatic chucks and a vacuum pump;

[0030] The transfer chamber is equipped with a transfer robot, which completes the transfer of wafers between the process chamber and the transfer chamber.

[0031] The isolation valve includes an inner plate, a filter, an outer plate, and a drive unit;

[0032] The filter is installed between the inner and outer panels;

[0033] Before wafer loading or unloading, the drive unit drives the inner and outer boards to open, and the filter filters the airflow entering the process chamber.

[0034] During wafer loading or unloading, the drive unit drives the filter to turn on, and the transfer channel between the process chamber and the transfer chamber is opened.

[0035] In one possible design, there is one transfer chamber, and multiple process chambers are arranged around the transfer chamber. Multiple isolation valves are arranged at the connection points between the transfer chamber and the multiple process chambers.

[0036] Compared with the prior art, the present invention can achieve at least one of the following technical effects:

[0037] 1) This invention features an innovative design for the isolation valve, which includes an inner plate, a filter, and an outer plate. This design effectively addresses the issue of particles introduced when the isolation valve is opened, improves the isolation effect between the process chamber and the transfer chamber, and can reduce wafer defects and increase yield.

[0038] 2) Before wafer loading or unloading, the isolation valve of this invention opens the inner and outer plates, filters the airflow entering the process chamber, and then opens the filter after a certain delay time to load or unload the wafer. This invention reduces the initial particles generated when the isolation valve is opened, thus reducing wafer defects and improving yield; it also reduces unscheduled equipment maintenance (PM) caused by wafer back-side helium leakage.

[0039] 3) The particles generated in the semiconductor manufacturing process are at the micron or even nanometer level. This invention uses an ultra-electrostatic filter for filtration. It uses the principle of electrostatic adsorption to filter the airflow entering the process chamber. The filtration level is higher and it can filter smaller particles, thereby achieving a very good filtration effect, while having low airflow resistance.

[0040] 4) The cylinder and the AC servo motor each have their own control unit, thereby realizing separate control of the up and down movement of the outer plate, inner plate and filter.

[0041] 5) The first axis and the second axis are coaxially arranged, and the second axis is located in the through hole in the center of the first axis. The length of the second axis is greater than the length of the first axis, and the bottom end of the second axis extends beyond the first axis. The AC servo motor is located below the cylinder. The bottom end of the first axis has a protrusion arranged radially outward. The protrusion is connected to the push rod of the cylinder, so that the first axis and the second axis do not interfere with each other when they move up and down respectively.

[0042] 6) When the filter includes a positive high-voltage electrode mesh, a polarized fiber mesh, and a negative high-voltage electrode mesh, the fine fibers of the polarized fiber mesh become charged, thereby adsorbing particles through Coulomb forces and enhancing filtration capacity. When the electrode mesh discharges, it generates electrons, charging particles passing through the electrode mesh and making them more easily adsorbed by the polarized fiber mesh.

[0043] 7) A primary filter is installed at the very front end of the direction from the transfer chamber to the process chamber to perform primary filtration of the airflow, filter out large particles, and prevent large particles from clogging the polarized fiber mesh and affecting the filter efficiency.

[0044] Other features and advantages of the invention will be set forth in the following description, and in part will be obvious from the description or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings. Attached Figure Description

[0045] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0046] Figure 1 This is a schematic diagram of an existing isolation valve wafer before loading.

[0047] Figure 2 This is a schematic diagram of an existing isolation valve wafer after loading.

[0048] Figure 3 This is a schematic diagram of the isolation valve wafer before loading in Example 1;

[0049] Figure 4 This is a schematic diagram of the isolation valve wafer after loading in Example 1;

[0050] Figure 5 This is a schematic diagram of the closed state of the isolation valve in Example 1;

[0051] Figure 6 This is a schematic diagram of the inner and outer panels in the downward movement state of Example 1;

[0052] Figure 7 This is a schematic diagram of the isolation valve in the open state of Example 1;

[0053] Figure 8 A particle diagram showing particles entering the process chamber when an existing isolation valve is opened;

[0054] Figure 9 This is a particle diagram of particles entering the process chamber when the isolation valve of Example 1 is opened;

[0055] Figure 10 This is a schematic diagram of the overall device in Example 1.

[0056] Figure label:

[0057] 1-Inner plate; 2-Outer plate; 3-Filter; 4-First shaft; 5-Second shaft; 6-Cylinder box; 7-AC servo motor box; 8-Process chamber; 9-Transfer chamber; 10-Electrostatic chuck; 11-Transfer robot arm; 12-Pump; 13-Particles. Detailed Implementation

[0058] Embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0059] The accompanying drawings illustrate various structural schematics according to embodiments of the present disclosure. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0060] In the context of this disclosure, when a layer / element is referred to as being "above" another layer / element, the layer / element may be directly above the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "above" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0061] Example 1

[0062] A wafer processing apparatus, such as Figures 3-7 As shown, it includes a process chamber 8, a transfer chamber 9, and an isolation valve; the process chamber 8 is connected to the transfer chamber 9, and the isolation valve is located at the connection between the process chamber 8 and the transfer chamber 9; the isolation valve serves to isolate and connect the process chamber 8 and the transfer chamber 9, and the opening and closing of the isolation valve can control the opening and closing of the transfer channel between the process chamber and the transfer chamber.

[0063] like Figure 10 As shown, the wafer processing apparatus with filtration function has a transfer chamber 9, and multiple process chambers 8 are arranged around the transfer chamber 9. Each process chamber 8 is equipped with the aforementioned isolation valve at its connection point with the transfer chamber 9. The isolation valves are used to isolate the process chambers 8 and the transfer chamber 9, allowing the wafers to be stably loaded or unloaded within the process chambers 8. An electrostatic chuck 10 (ESC) for fixing the wafers is installed inside the process chambers 8. The process chambers 8 are connected to a vacuum pump 12, which controls the air pressure within the process chambers 8. A transfer robot 11 for moving the wafers is installed inside the transfer chambers 9.

[0064] The isolation valve must be opened when loading a wafer from the transfer chamber 9 into the process chamber 8, or when unloading a processed wafer from the process chamber 8 into the transfer chamber 9.

[0065] To address the issue of particulate matter introduced when the isolation valve is opened, in one possible design, the isolation valve includes an inner plate 1, a filter 3, and an outer plate 2. The filter 3 is positioned between the inner plate 1 and the outer plate 2. The placement and selection of the filter improves the isolation effect between the process chamber and the transfer chamber. Particulate matter or byproducts generated during the process in the process chamber 8 can contaminate the filter 3. The inner plate 1 protects the filter 3 during the process. Without the outer plate 2, cross-contamination between the transfer chamber 9 and the filter 3 would occur. Therefore, the outer plate 2 better protects both the filter 3 and the process chamber 8, effectively preventing cross-contamination. Considering that the presence of the filter 3 might alter the plasma distribution in the process chamber and affect the process performance, the inner plate 1 and the outer plate 2 simultaneously prevent the filter 3 from affecting the process chamber.

[0066] Before wafer loading or unloading, the drive unit drives the inner and outer plates to open, and the filter filters the airflow entering the process chamber. During wafer loading or unloading, the drive unit drives the filter to open, and the transfer channel between the process chamber and the transfer chamber opens. Particulate matter is mainly generated at the moment the isolation valve opens, when the pressure difference between process chamber 8 and transfer chamber 9 is at its maximum, resulting in the most particulate matter. After the airflow stabilizes and a period of filtration, the generated particulate matter is significantly smaller. This invention reduces the initial particles generated when the isolation valve opens, which can reduce wafer defects and improve yield. The isolation valve can also reduce unscheduled equipment maintenance (PM) caused by wafer back-side helium leakage.

[0067] like Figures 4-7 As shown, before the wafer is loaded or unloaded, the isolation valve of the present invention first opens the inner plate 1 and the outer plate 2, and the filter 3 filters the airflow entering the process chamber 8. After a certain delay time, the filter 3 is opened to load or unload the wafer.

[0068] like Figure 8 , Figure 9 As shown, the isolation valve of the present invention reduces the initial particles 13 generated when the isolation valve is opened, which can reduce wafer defects and improve yield; and reduce non-periodic PM (Productive Maintenance) caused by wafer back helium leakage.

[0069] Considering that before wafer loading or unloading, the inner and outer plates are opened first, the filter filters the airflow entering the process chamber, and the filter is opened after a certain delay time to load or unload the wafer, in one possible design, the motion drive device of the inner plate 1 and the outer plate 2 and the motion drive device of the filter can operate or be controlled relatively independently.

[0070] For example, the inner plate 1 and the outer plate 2 are arranged in parallel, and both the inner plate 1 and the outer plate 2 are connected to the first shaft 4; the first shaft 4 is connected to the first drive unit, which drives the inner plate 1 and the outer plate 2 to move up and down, and the movement of the inner plate 1 and the outer plate 2 is synchronous.

[0071] The first shaft 4 has an axial through hole, and a second shaft 5 is disposed within the through hole. The second shaft 5 can move up and down relative to the first shaft 4. The filter 3 is connected to the top end of the second shaft 5, and the bottom end of the second shaft 5 is connected to a second drive unit. The second shaft 5 drives the filter 3 to move up and down. The filter 3 can move independently relative to the inner plate 1 and the outer plate 2.

[0072] For example, the first drive unit is a cylinder or a servo motor, and the second drive unit is an AC servo motor. The cylinder drives the inner plate 1 and the outer plate 2 to move up and down reciprocally. The filter 3 in the middle is set with a delay time (the delay time can be input into the device software). The AC servo motor moves up and down according to the set time. When a cylinder is used for driving, the movement is very fast, which will generate more particles. Preferably, the filter 3 of the present invention is driven by a motor instead of a cylinder. Under the drive of the motor, the movement of the filter is slow and less particles are generated. The reduction of particles can achieve better process results, reduce wafer defects, and improve yield.

[0073] Each cylinder and AC servo motor has its own independent control unit. Cylinder housing 6 serves as the cylinder's control unit and is connected to the main system, while AC servo motor housing 7 serves as the AC servo motor's control unit and is also connected to the main system. Cylinder housing 6 contains a position sensor and a communication module. The position signal sensor detects the positions of the inner plate 1 and outer plate 2, and the resulting position signal is transmitted to the main system via the communication module. AC servo motor housing 7 also contains a position sensor and a communication module. The position signal sensor detects the position of the filter 3, and the resulting position signal is transmitted to the main system via the communication module. The main system monitors the positions of the inner plate 1, outer plate 2, and filter 3 in real time and controls their movement.

[0074] In one possible design, the isolation valve can move up and down, and be in an open or closed state.

[0075] Specifically, when the isolation valve is open, the inner plate 1 and the outer plate 2 move downwards, and after a set delay time, the filter 3 moves downwards; when the isolation valve is closed, the filter 3 moves upwards, and after a set delay time, the inner plate 1 and the outer plate 2 move upwards.

[0076] Considering the process requirements of semiconductor manufacturing, the filter 3 of this invention can be an electrostatic filter, which is a high-efficiency filter (HEPA filter) treated with an ultra-high voltage current of 25,000V or higher. The filter 3 is a high-efficiency (HEPA) or ultra-high-efficiency (ULPA) filter device with a filtration class of H13 (99.75%, >0.3um) to U17 (99.9999%, >0.3um).

[0077] The particles 13 generated during semiconductor manufacturing are at the micron or even nanometer level. This invention utilizes the principle of electrostatic adsorption to filter the airflow entering the process chamber 8. The ultra-electrostatic filter 3 has a higher filtration level and can filter even smaller particles 13, thus achieving a good filtration effect while having low airflow resistance.

[0078] Considering its application in semiconductor equipment, the inner plate 1 and outer plate 2 can be made of aluminum alloy. Specifically, it is an aluminum alloy with added magnesium (Mg). The chemical composition, by mass percentage, is: Mg 2.2%–2.8%; Cr 0.15%–0.35%; Cu ≤0.10%; Zn ≤0.10%; Mn ≤0.10%; Fe ≤0.40%; Al is the balance. This material is lightweight, has good formability, strong corrosion resistance, and excellent weldability.

[0079] Example 2

[0080] This embodiment provides a wafer processing device with a filtering function, the structure of which is basically the same as the wafer processing device with a filtering function provided in Embodiment 1. The difference is that this embodiment describes in detail the specific structure of an electrostatic filter 3.

[0081] The electrostatic filter 3 includes a positive high-voltage electrode mesh, a polarized fiber mesh, and a negative high-voltage electrode mesh. The positive and negative high-voltage electrode meshes are connected to a high-voltage power supply, generating corona discharge between them. This charges the fine fibers of the polarized fiber mesh between the positive and negative high-voltage electrode meshes, allowing them to adsorb particles 13 via Coulomb forces, thus enhancing filtration capacity. The discharge of the electrode mesh generates electrons, charging the particles 13 that pass through it, making them more easily adsorbed by the polarized fiber mesh.

[0082] For example, the polarized fiber web can be made of fluffy glass fiber.

[0083] To prevent large particles 13 from clogging the polarized fiber mesh and affecting the efficiency of the filter 3, a primary filter can be installed at the very front end of the direction from the transfer chamber to the process chamber 8 to perform primary filtration of the airflow and remove large particles 13. For example, the primary filter can be a nylon mesh.

[0084] Considering that the positive and negative high-voltage electrode networks need to be connected to a high-voltage power supply, in order to avoid the wires taking up too much space and affecting the up-and-down movement of the isolation valve, a through hole is set at the axial center of the second shaft 5, and two wires are set in the through hole. One end of the two wires is connected to the bottom of the positive and negative high-voltage electrode networks respectively, and the other end passes through the second shaft 5 and is connected to the output end of the high-voltage power supply respectively.

[0085] Example 3

[0086] This embodiment provides a wafer processing device with a filtering function. Its structure is basically the same as that of the wafer processing device with a filtering function provided in Embodiment 1. The difference is that this embodiment describes in detail the connection structure between the first shaft 4 and the cylinder, and the second shaft 5 and the AC servo motor.

[0087] The first axis 4 and the second axis 5 are coaxially arranged, with the second axis 5 located inside a through hole at the center of the first axis 4. To ensure that the first axis 4 and the second axis 5 do not interfere with each other when moving up and down, the length of the second axis 5 is greater than the length of the first axis 4, and the bottom end of the second axis 5 extends beyond the first axis 4; the AC servo motor is located below the cylinder.

[0088] The bottom end of the first shaft 4 has a protrusion that extends radially outward. The protrusion is connected to the push rod of the cylinder. For example, it can be welded or threaded. The cylinder push rod drives the first shaft 4 to move up and down, thereby driving the inner plate 1 and the outer plate 2 to move.

[0089] The second shaft 5 is connected to the AC servo motor via a linear slide. The linear slide includes a lead screw and a slide. The AC servo motor drives the lead screw to rotate, realizing the linear reciprocating motion of the slide on the lead screw. The second shaft 5 is fixed on the slide. The up and down movement of the slide drives the second shaft 5 to move up and down, thereby realizing the up and down movement of the filter 3.

[0090] The second shaft 5 can also be connected to the AC servo motor via gear transmission to realize the up and down movement of the filter 3. A gear is set on the drive shaft of the AC servo motor, and a tooth is set axially at the bottom end of the second shaft 5 or a rack is fixed axially at the bottom end of the second shaft 5. The gear meshes with the tooth or rack on the second shaft 5, and the AC servo motor drives the second shaft 5 to move.

[0091] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0092] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. The scope of this disclosure is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. A wafer processing apparatus, characterized in that, This includes process chambers, transfer chambers, and isolation valves; The process chamber is connected to the transfer chamber, and an isolation valve is installed at the connection between the process chamber and the transfer chamber to control the opening and closing of the transfer channel between the process chamber and the transfer chamber. The isolation valve includes an inner plate, a filter, an outer plate, and a drive unit; The filter is disposed between the inner plate and the outer plate; Before wafer loading or unloading, the drive unit drives the inner and outer boards to open, and the filter filters the airflow entering the process chamber; During wafer loading or unloading, the drive unit drives the filter to turn on, and the transfer channel between the process chamber and the transfer chamber is opened. The drive unit includes a first shaft and a first drive unit; The first shaft is connected to the first drive unit, and both the inner plate and the outer plate are connected to the first shaft, with the inner plate and the outer plate arranged in parallel; the first shaft drives the inner plate and the outer plate to move. The drive unit further includes a second shaft and a second drive unit; The first shaft is provided with an axial through hole, and the second shaft is coaxially disposed in the axial through hole of the first shaft; The second shaft is connected to the second drive unit, and the filter is connected to the second shaft. The second drive unit drives the second shaft to move relative to the first shaft along the through hole axis, thereby moving the filter.

2. The wafer processing apparatus according to claim 1, characterized in that, Both the inner and outer panels are made of aluminum alloy.

3. The wafer processing apparatus according to claim 2, characterized in that, The chemical composition of the aluminum alloy, by mass percentage, is: Mg 2.2%~2.8%; Cr 0.15%~0.35%; Cu ≤0.10%; Zn ≤0.10%; Mn ≤0.10%; Fe ≤0.40%; with the balance being Al.

4. The wafer processing apparatus according to claim 1, characterized in that, The filter is an electrostatic filter.

5. The wafer processing apparatus according to claim 4, characterized in that, The electrostatic filter is a high-efficiency filter treated with an ultra-high voltage current of 25,000V or higher.

6. The wafer processing apparatus according to claim 5, characterized in that, The filter has a filtration rating of H13 to U17.

7. A semiconductor manufacturing apparatus, characterized in that, This includes process chambers, transfer chambers, and isolation valves; The process chamber is connected to the transfer chamber, and an isolation valve is installed at the connection between the process chamber and the transfer chamber to control the opening and closing of the transfer channel between the process chamber and the transfer chamber. The process chamber is equipped with an electrostatic chuck and a vacuum pumping device. The transfer chamber is equipped with a transfer robot arm, which completes the transfer of wafers between the process chamber and the transfer chamber. The isolation valve includes an inner plate, a filter, an outer plate, and a drive unit; The filter is disposed between the inner plate and the outer plate; Before wafer loading or unloading, the drive unit drives the inner and outer plates to open, and the filter filters the airflow entering the process chamber. During wafer loading or unloading, the drive unit drives the filter to turn on, and the transfer channel between the process chamber and the transfer chamber is opened. The drive unit includes a first shaft and a first drive unit; The first shaft is connected to the first drive unit, and both the inner plate and the outer plate are connected to the first shaft, with the inner plate and the outer plate arranged in parallel; the first shaft drives the inner plate and the outer plate to move. The drive unit further includes a second shaft and a second drive unit; The first shaft is provided with an axial through hole, and the second shaft is coaxially disposed in the axial through hole of the first shaft; The second shaft is connected to the second drive unit, and the filter is connected to the second shaft. The second drive unit drives the second shaft to move relative to the first shaft along the through hole axis, thereby moving the filter.

8. The semiconductor manufacturing equipment according to claim 7, characterized in that, The transfer chamber is provided in one way, and multiple process chambers are arranged around the transfer chamber. Multiple isolation valves are arranged at the connection points between the transfer chamber and the multiple process chambers.

Images