Detection module for labeling machine and labeling machine

Abstract

The application discloses a detection module for a labeling machine and the labeling machine, and belongs to the technical field of labeling machines. The detection module comprises a detection table, a clamping unit, two image acquisition units and an image analysis unit. The clamping unit is arranged on the detection table and is suitable for clamping a wafer to drive the wafer to move in a first direction. The two image acquisition units are arranged on the detection table and are spaced apart in a second direction. In the second direction, the two image acquisition units are respectively located on two sides of the clamping unit in the second direction. The two image acquisition units respectively acquire image information of different areas of the wafer in the second direction. The first direction is perpendicular to the second direction. According to the detection module for the labeling machine, the detection module has high automation and intelligent control, can realize accurate positioning control of each wafer to be detected, has high response speed and good dynamic performance of the system, and has compact overall structure, high integration, intelligent working process and data.

Description

Technical Field

[0001] This invention relates to the field of labeling equipment, and in particular to a detection module for a labeling machine and a labeling machine. Background Technology

[0002] Fully automatic labeling machines are a technology used in semiconductor projects. They primarily read the unique IDs and conversion IDs on wafers and then apply labels to them. Existing labeling machines are divided into two types: semi-automatic and automatic. Semi-automatic labeling machines require manual operation by the operator to move the wafer ID to the bottom of the detection module, set the parameters, and read the unique ID on the wafer. Other wafers then proceed according to the set ID position. Automatic labeling machines use a camera mounted on a rotating axis to move and locate the ID. However, existing automatic labeling machines have longer camera movement times and more complex camera designs. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a detection module for a labeling machine, wherein the detection module for the labeling machine has a compact overall structure, high integration, high working efficiency, intelligent and data-driven operation, and provides a larger detection space for wafer identification.

[0004] According to an embodiment of the present invention, a detection module for a labeling machine includes: a detection stage, a clamping unit, two image acquisition units, and an image analysis unit; the detection stage provides an identifiable range for image acquisition; the clamping unit is disposed on the detection stage and is adapted to clamp a wafer to move the wafer in a first direction; the image acquisition units are disposed on the detection stage in a second direction, and the image acquisition range of the image acquisition units includes a region on the detection stage, wherein the first direction is perpendicular to the second direction; the two image acquisition units are communicatively connected to the image analysis unit, and the image analysis unit comprehensively analyzes the image information acquired by the two image acquisition units to obtain the ID of the wafer.

[0005] According to an embodiment of the present invention, a detection module for a labeling machine includes a clamping unit and a wafer arranged on a detection table along a straight line in a first direction. The clamping unit moves to hold the wafer, moving it within the image acquisition range of the detection table. The image acquisition unit acquires wafer information when the wafer moves into the acquisition range. The image acquisition units are symmetrically arranged on both sides of the detection table, with the line connecting the image acquisition units perpendicular to the first direction. This arrangement also facilitates expanding the image acquisition range of the wafer. The image acquisition unit sends the acquired information to an image analysis unit, which analyzes the wafer's ID to facilitate subsequent labeling. The detection module of the present invention features high automation and intelligent control, enabling precise positioning control of each wafer to be inspected, with fast response speed and good system dynamic performance. The overall structure of the equipment is compact and highly integrated; the entire detection process is safe and highly stable; the equipment uses a clamping unit to move and acquire data from the wafer, resulting in high work efficiency; the intelligent system performs data statistics, display, and storage, making the work process intelligent and data-driven.

[0006] Furthermore, the control unit is communicatively connected to the image acquisition unit and the clamping unit. When half of the wafer reaches the shooting range of the two image acquisition units, the control unit controls the two image acquisition units to acquire image information of the half of the wafer. When the other half of the wafer reaches the shooting range of the two image acquisition units, the control unit controls the two image acquisition units to acquire image information of the other half of the wafer.

[0007] Furthermore, the clamping unit includes a telescopic mechanism and a gripper portion. One end of the telescopic mechanism is connected to the testing stage; the gripper portion is located at the other end of the telescopic mechanism. Driven by the telescopic mechanism, the gripper portion moves the wafer along the first direction.

[0008] Furthermore, the cassette is used to store multiple wafers, the cassette is located on the side of the detection unit away from the telescopic mechanism, and the cassette has a material picking port disposed opposite to the gripper portion.

[0009] Furthermore, the lifting unit is located at the bottom of the material box to change the position of the material box in the vertical direction.

[0010] Furthermore, the image acquisition unit is a camera, and the shooting areas of the two image acquisition units partially overlap in the second direction.

[0011] Furthermore, in the second direction, the spacing between the two image acquisition units is smaller than the diameter of the wafer.

[0012] Furthermore, the two image acquisition units are arranged in parallel and at the same height.

[0013] Furthermore, the image acquisition unit is detachably connected to the detection stage via the connecting plate.

[0014] According to an embodiment of the present invention, a detection module for a labeling machine is provided. Wafer labeling machines are crucial equipment in the semiconductor manufacturing industry. A high degree of automation not only improves labor productivity and saves costs, but also enhances wafer management through barcodes on the labels. The detection module detects voids in the wafer, i.e., the number of defective dies, ensuring correct grading of the wafer after manual removal of defective dies. It can also count the number of dies on the wafer. A clamping unit and a wafer are arranged on a straight line along a first direction on the detection table. The clamping unit moves to hold the wafer within the image acquisition range of the detection table. The image acquisition unit acquires wafer information when the wafer moves into the acquisition range. The image acquisition units are symmetrically arranged on both sides of the detection table, with the line connecting the image acquisition units perpendicular to the first direction. This arrangement also facilitates expanding the image acquisition range of the wafer. The image acquisition unit sends the acquired information to an image analysis unit, which analyzes the wafer's ID to facilitate subsequent wafer labeling. The detection module of this invention features a high degree of automation and intelligent control, enabling precise positioning control of each wafer to be inspected, with fast response speed and good dynamic performance. The overall structure of the equipment is compact and highly integrated; the entire inspection process is safe and highly stable; the equipment uses a clamping unit to move and collect data from the wafer, resulting in high work efficiency; the intelligent system performs data statistics, display, and storage, making the work process intelligent and data-driven.

[0015] The labeling machine according to an embodiment of the present invention includes: the detection module for the labeling machine described above. The wafer labeling machine is used in conjunction with an automated storage and retrieval system (AS / RS) to retrieve wafers from the warehouse, automatically place them on the labeling machine using an automated robotic arm, and return them to their original position via the AS / RS after labeling. This significantly improves labor productivity, saves labor costs for enterprises, and features a high degree of automation and intelligent control. It can precisely position and control each wafer to be inspected, with fast response speed and good system dynamic performance. The overall structure of the equipment is compact and highly integrated; the entire inspection process is safe and highly stable; the equipment uses a clamping unit to move and collect data from the wafers, resulting in high work efficiency; the intelligent system performs data statistics, display, and storage, making the work process intelligent and data-driven. Ethernet is used to control the wafer machine equipment. With the widespread application of Ethernet in manufacturing systems, there is a growing preference for remotely controlling and monitoring the production and manufacturing process via Ethernet, making the work process more efficient.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of the structure of a detection module for a labeling machine according to an embodiment of the present invention;

[0019] Figure 2 This is a rear view of the detection module for a labeling machine according to an embodiment of the present invention;

[0020] Figure 3 This is a front view of the detection module for a labeling machine according to an embodiment of the present invention;

[0021] Figure 4 yes Figure 3 Sectional view of AA;

[0022] Figure 5 This is a schematic diagram of the structure of the detection station of the detection module for a labeling machine according to an embodiment of the present invention;

[0023] Figure 6 This is a top view of the detection station of the detection module for a labeling machine according to an embodiment of the present invention;

[0024] Figure 7 This is a front view of the detection station of the detection module for a labeling machine according to an embodiment of the present invention;

[0025] Figure 8 This is a side view of the detection station of the detection module for a labeling machine according to an embodiment of the present invention;

[0026] Figure 9 This is a schematic diagram of the clamping unit of the detection module for a labeling machine according to an embodiment of the present invention;

[0027] Figure 10 This is a top view of the clamping unit of the detection module for a labeling machine according to an embodiment of the present invention;

[0028] Figure 11 This is a front view of the clamping unit of the detection module for a labeling machine according to an embodiment of the present invention;

[0029] Figure 12 This is a side view of the clamping unit of the detection module for a labeling machine according to an embodiment of the present invention;

[0030] Figure 13 This is a schematic diagram of the lifting unit of the detection module for a labeling machine according to an embodiment of the present invention;

[0031] Figure 14 This is a top view of the lifting unit of the detection module for a labeling machine according to an embodiment of the present invention;

[0032] Figure 15 This is a front view of the lifting unit of the detection module for a labeling machine according to an embodiment of the present invention;

[0033] Figure 16 This is a side view of the lifting unit of the detection module for a labeling machine according to an embodiment of the present invention;

[0034] Reference numerals: 100-Detection module; 1-Detection table; 2-Clamping unit; 21-Telescopic mechanism; 22-Gripper; 3-Image acquisition unit; 5-Control unit; 7-Lifting unit; 8-Connecting plate. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] The detection module 100 for a labeling machine according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0039] like Figures 1-3 As shown, the detection module 100 for a labeling machine according to an embodiment of the present invention includes: a detection platform 1, a clamping unit 2, an image acquisition unit 3, and an image analysis unit; the clamping unit 2 is disposed on the detection platform 1 and is adapted to clamp the wafer to drive the wafer to move in a first direction; in a specific embodiment, the detection platform 1 has a larger detection range compared to existing detection devices, and the image acquisition unit 3 can identify wafers passing through any position on the detection platform 1, providing a larger detection space and improving detection efficiency compared to existing detection devices; the detection platform 1 can be configured with corresponding structures according to different usage conditions, commonly including vertical detection platforms 1 and horizontal detection platforms 1. The clamping unit 2 is installed at a suitable position on the detection platform 1 and is used to clamp the object to be labeled. In this invention, the object to be labeled is a wafer, which refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single-crystal silicon. After being ground, polished, and sliced, silicon crystal rods are formed into silicon wafers, also known as crystal wafers.

[0040] Domestic wafer production lines primarily use 8-inch and 12-inch wafers, which are very thin. According to the labeling process, the wafers are pre-placed in wafer cassettes during labeling. These cassettes can be placed on the inspection station 1, requiring only space to be reserved on the station. Alternatively, the wafer cassettes can be placed outside the inspection station 1, with a separate device for controlling them, facilitating better coordination between the wafer cassettes and the clamping unit 2. The wafers and clamping unit 2 are aligned in a straight line in the first direction; extending the clamping unit 2 allows the wafer to be clamped onto the inspection station 1.

[0041] like Figures 4-6As shown, the image acquisition unit 3 is set on the inspection station 1 and is used to identify the wafer in the inspection space of the inspection station 1. One or more image acquisition units 3 can be set, and the number of image acquisition units 3 is set according to the size of the inspection station 1. The following is an example of setting two image acquisition units 3. The two image acquisition units 3 are set on the inspection station 1 at a distance in the second direction. In the second direction, the two image acquisition units 3 are respectively located on both sides of the clamping unit 2 in the second direction. The two image acquisition units 3 respectively acquire image information of different areas of the wafer in the second direction. The first direction is perpendicular to the second direction. The image acquisition units 3 are respectively set on both sides of the inspection station 1 to expand the acquisition range. The image acquisition units 3 can be fixedly set on both sides of the inspection station 1, or they can be detachably connected to both sides of the inspection station 1 to facilitate disassembly and replacement during subsequent inspection and maintenance. The acquisition range of the image acquisition unit 3 includes at least part of the movable range of the wafer under the clamping unit 2 to ensure that the wafer can be captured by the image acquisition unit 3 when it moves under the clamping unit 2.

[0042] Two image acquisition units 3 are connected to an image analysis unit. The image analysis unit comprehensively analyzes the image information acquired by the two image acquisition units 3 to obtain the wafer ID. The image analysis unit can identify different wafer IDs so that corresponding labels can be affixed according to the corresponding wafer IDs. The image analysis unit analyzes the wafers acquired by the image acquisition units 3 to obtain the wafer IDs.

[0043] According to an embodiment of the present invention, a detection module 100 for a labeling machine includes a clamping unit 2 and a wafer arranged on a detection table 1 along a straight line in a first direction. The wafer is clamped by the movement of the clamping unit 2, moving it to the image acquisition range of the detection table 1. An image acquisition unit 3 acquires wafer information when the wafer moves to the acquisition range. The image acquisition units 3 are symmetrically arranged on both sides of the detection table 1, with the line connecting the image acquisition units 3 perpendicular to the first direction. This arrangement also facilitates expanding the image acquisition range of the wafer. The image acquisition units 3 send the acquired information to an image analysis unit, which analyzes the wafer's ID to facilitate subsequent labeling. The detection module 100 of the present invention features a high degree of automation and intelligent control, enabling precise positioning control of each wafer to be detected, with fast response speed and good system dynamic performance. The equipment has a compact overall structure and a high degree of integration; the entire testing process is safe and highly stable; the equipment uses clamping unit 2 to move and collect data from the wafer, resulting in high work efficiency; the intelligent system performs data statistics, display, and storage, making the work process intelligent and data-driven.

[0044] like Figure 4As shown, the control unit 5 is communicatively connected to the image acquisition unit 3 and the clamping unit 2. When half of the wafer reaches the shooting range of the two image acquisition units 3, the control unit 5 controls the two image acquisition units 3 to acquire image information of half of the wafer. When the other half of the wafer reaches the shooting range of the two image acquisition units 3, the control unit 5 controls the two image acquisition units 3 to acquire image information of the other half of the wafer. In a specific embodiment, the acquisition of wafer information by the image acquisition unit 3 is a dynamic process. When the wafer is clamped within the acquisition range of the image acquisition unit 3, the image acquisition unit 3 can start scanning and acquiring the wafer. When the wafer is completely moved within the acquisition range of the image acquisition unit 3 by the clamping unit 2, the image acquisition unit 3 re-acquires the other part of the wafer that was not acquired. This acquisition method is beneficial to improve acquisition efficiency, as partial acquisition can be performed without waiting for the wafer to be completely moved within the acquisition range.

[0045] like Figure 7 , Figure 8 As shown, achieving continuous operation of automatic wafer labeling and detection is a crucial aspect of the control unit 5. The control unit 5 must not only ensure the continuous and reliable operation of the system's mechanical actions but also continuously monitor these actions, allowing the operator to easily view the system's operating status. In a specific embodiment, the PLC control program ensures the continuous and reliable operation of the system's mechanical actions, such as the accurate control program for wafer handling by the clamping unit 2, the correct timing of the pneumatic solenoid valve's on / off operation, and the display of system fault status. The PLC control operates using a cyclic scanning, centralized input and output mode. This mode is characterized by high reliability and strong anti-interference capabilities. While this mode introduces a certain delay, the PLC's scanning speed is very fast, generally meeting the system's real-time requirements. The PLC's detected status is then fed back to the computer to coordinate the printing and labeling detection actions, monitor internal processing, including hardware initialization, I / O module configuration checks, power outage retention range settings, and other initialization tasks. Communication services and self-diagnostic checks should also be completed before executing the user program. During the communication service phase, the PLC should communicate with some intelligent modules with processors and other peripherals, complete tasks such as receiving and sending data, responding to commands entered by the programmer, updating the content displayed by the programmer, and updating the clock and special register contents.

[0046] like Figures 9-12As shown, the clamping unit 2 further includes a telescopic mechanism 21 and a gripper portion 22. One end of the telescopic mechanism 21 is connected to the detection stage 1. The gripper portion 22 is located at the other end of the telescopic mechanism 21. Driven by the telescopic mechanism 21, the gripper portion 22 moves the wafer along the first direction. The telescopic mechanism 21 moves the gripper portion 22 closer to the wafer. When the gripper portion 22 moves to the wafer, the clamping unit 2 controls the gripper portion 22 to clamp the wafer and move it. The telescopic mechanism 21 retracts, causing the gripper portion 22 to retract. During the retraction process, the gripper portion 22 moves the wafer to the range that the image acquisition unit 3 can acquire. The image acquisition unit 3 acquires images of the portion of the wafer that can be acquired. When the telescopic mechanism 21 drives the gripper portion 22 to retract further, the wafer is completely within the range that the image acquisition unit 3 can acquire. At this time, the image acquisition unit 3 acquires the portion of the wafer that was not acquired in the first acquisition. After the image acquisition unit 3 completes the acquisition, the entire movement process is completed, and the next round of wafer clamping and acquisition continues.

[0047] In a specific embodiment, the telescopic mechanism 21 can adopt a combination of a stepper motor and a ball screw. The combination of the stepper motor and the ball screw is related to the positional accuracy of each wafer transfer. When selecting a stepper motor, the step angle and the maximum static torque should be fully considered. The larger the static torque, the better the system's torque resistance to disturbances and the less likely it is to lose steps when the load changes. Similarly, the smaller the step angle of the stepper motor, the smaller the steady-state error of the system. Therefore, a stepper motor with a larger static torque can be selected here to facilitate more stable wafer movement. For the stepper motor control system, it has the advantages of simple control method, low control cost, and easy implementation.

[0048] like Figures 13-16 As shown, the cassette is used to store multiple wafers. The cassette is located on the side of the detection unit away from the telescopic mechanism 21. The cassette has a pick-up port that is opposite to the gripper 22. During operation, the clamping unit 2 continuously grabs and clamps wafers from the cassette and moves them to the detection unit for detection, forming a work cycle. After the detection of a wafer is completed, the clamping unit 2 repeats the above work process, that is, clamps the wafer for detection under the drive of the telescopic mechanism 21, so as to improve work efficiency.

[0049] Furthermore, the lifting unit 7 is located at the bottom of the material box to change the position of the material box in the vertical direction; the lifting unit 7 drives the material box to move up and down, and the lifting unit 7 works in conjunction with the telescopic structure to facilitate the clamping and image acquisition of the wafers in the material box. After all the wafers in the material box have been acquired, the lifting unit 7 drives the material box to move downward to continue loading the next batch of wafers. In a specific embodiment, the material box filled with wafers can also be directly replaced, and the material box filled with wafers can be raised under the action of the lifting unit 7 to detect the undetected wafers in the material box.

[0050] Furthermore, the image acquisition unit 3 is a camera. The imaging areas of the two image acquisition units 3 partially overlap in the second direction. The camera scans the wafer. During the scanning process, the camera sensor generates a detection signal based on the wafer and transmits the detected signal to the control system for calculation and analysis to determine the storage status of the wafer in the wafer cassette. Furthermore, in the second direction, the distance between the two image acquisition units 3 is less than the diameter of the wafer; this facilitates the detection of wafers moved between the image acquisition units 3. The two image acquisition units 3 are arranged parallel to each other and at the same height. Furthermore, the image acquisition unit 3 is detachably connected to the inspection station 1 via a connecting plate 8. This detachable connection facilitates subsequent inspection and maintenance.

[0051] According to the present invention, the detection module 100 for a labeling machine is provided. Wafer labeling machines are very important equipment in the semiconductor manufacturing industry. The degree of automation of the labeling machine can not only improve labor productivity and save costs, but also improve the management level of wafers through the barcode on the label. The detection module 100 is used to detect voids in the wafer, i.e., the number of vacant dies, to ensure correct grading of the wafer after manual removal of defective dies. It can also count the number of dies on the wafer. A clamping unit 2 and a wafer are positioned on the detection stage 1 along a straight line in the first direction. The wafer is clamped by the movement of the clamping unit 2, moving it within the image acquisition range of the detection stage 1. The image acquisition unit 3 acquires wafer information when the wafer moves into the acquisition range. The image acquisition units 3 are symmetrically arranged on both sides of the detection stage 1, with the line connecting the image acquisition units 3 perpendicular to the first direction. This arrangement also facilitates expanding the image acquisition range of the wafer. The image acquisition units 3 send the acquired information to the image analysis unit, which analyzes the wafer's ID for subsequent labeling. The detection module 100 of this invention features a high degree of automation and intelligent control, enabling precise positioning control of each wafer to be inspected, with fast response speed and good system dynamic performance. The equipment has a compact overall structure and a high degree of integration; the entire testing process is safe and highly stable; the equipment uses clamping unit 2 to move and collect data from the wafer, resulting in high work efficiency; the intelligent system performs data statistics, display, and storage, making the work process intelligent and data-driven.

[0052] The labeling machine according to an embodiment of the present invention includes: the detection module 100 for the labeling machine described above. The wafer labeling machine is used in conjunction with an automated storage and retrieval system (AS / RS) to retrieve wafers from the warehouse, automatically place them on the labeling machine using an automated robotic arm, and return them to their original position via the AS / RS after labeling. This significantly improves labor productivity, saves labor costs for enterprises, and features a high degree of automation and intelligent control. It can precisely position and control each wafer to be inspected, with fast response speed and good system dynamic performance. The overall structure of the equipment is compact and highly integrated; the entire inspection process is safe and highly stable; the equipment uses a clamping unit 2 to move and collect data from the wafers, resulting in high work efficiency; the intelligent system performs data statistics, display, and storage, making the work process intelligent and data-driven. Ethernet is used to control the wafer machine equipment. With the widespread application of Ethernet in manufacturing systems, there is a preference for remotely controlling and monitoring the production and manufacturing process via Ethernet, making the work process more efficient.

[0053] Other components and operations of the detection module 100 and labeling machine according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0054] In the description of this specification, references to terms such as "some embodiments," "optionally," "furthermore," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A detection module (100) for a labeling machine, characterized in that, include: A detection station (1) provides an identifiable range for image acquisition; A clamping unit (2) is provided on the detection stage (1) and is adapted to clamp the wafer to drive the wafer to move in a first direction; Image acquisition unit (3) is disposed on the detection table (1) in the second direction. The image acquisition range of the image acquisition unit (3) includes the area on the detection table (1). The first direction is perpendicular to the second direction. An image analysis unit is provided, in which two image acquisition units (3) are communicatively connected. The image analysis unit comprehensively analyzes the image information acquired by the two image acquisition units (3) to obtain the ID of the wafer. Control unit (5), which is communicatively connected to image acquisition unit (3) and clamping unit (2), when half of the wafer reaches the shooting range of the two image acquisition units (3), the control unit (5) controls the two image acquisition units (3) to acquire image information of half of the wafer; when the other half of the wafer reaches the shooting range of the two image acquisition units (3), the control unit (5) controls the two image acquisition units (3) to acquire image information of the other half of the wafer; The clamping unit (2) includes: Telescopic mechanism (21), one end of which is connected to the testing table (1); The gripper (22) is located at the other end of the telescopic mechanism (21). Under the drive of the telescopic mechanism (21), the gripper (22) moves the wafer along the first direction. A material box for storing multiple wafers, the material box being located on the side of the inspection station (1) away from the telescopic mechanism (21), the material box having a material picking port disposed opposite to the gripper portion (22); Lifting unit (7) is located at the bottom of the material box to change the position of the material box in the vertical direction.

2. The detection module (100) for a labeling machine according to claim 1, characterized in that, The image acquisition unit (3) is a camera, and the shooting areas of the two image acquisition units (3) partially overlap in the second direction.

3. The detection module (100) for a labeling machine according to claim 1, characterized in that, In the second direction, the spacing between the two image acquisition units (3) is smaller than the diameter of the wafer.

4. The detection module (100) for a labeling machine according to claim 1, characterized in that, The two image acquisition units (3) are arranged in parallel and at the same height.

5. The detection module (100) for a labeling machine according to claim 1, characterized in that, Also includes: The image acquisition unit (3) is detachably connected to the detection stage (1) via the connecting plate (8).

6. A labeling machine, characterized in that, include: The detection module (100) for a labeling machine according to any one of claims 1-5.

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