Display panel, manufacturing method thereof, and display device

Abstract

The present invention discloses a display panel, a manufacturing method thereof, and a display device. The display panel includes: a substrate; a pixel circuit layer disposed on the substrate; a first insulating layer disposed on a side of the pixel circuit layer away from the substrate; a display panel including a plurality of spherical grooves; a plurality of film layers of the display panel matching to form the inner walls of the spherical grooves; a reflective metal layer disposed on a side of the spherical grooves away from the substrate; the reflective metal layer including a spherical reflective layer bonded to the inner walls of the spherical grooves; a plurality of light-emitting chips disposed on a side of the reflective metal layer away from the substrate; and corresponding light-emitting chips disposed in the spherical grooves. By matching the plurality of film layers of the display panel to form spherical grooves and disposing the spherical reflective layers in the spherical grooves, light beams emitted by the light-emitting chips in the spherical grooves are converged and emitted by the spherical reflective layers, thereby improving the luminous efficiency of the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Micro Light Emitting Diode (Micro-LED) or sub-millimeter light-emitting diode display (Mini-LED) is a display that uses micron-sized LEDs. It has been widely studied due to its characteristics such as independent pixel control, independent light emission control, high brightness, low power consumption, ultra-high resolution and high color.

[0003] However, the performance of Micro-LED or Mini-LED is significantly reduced after packaging, resulting in high power loss and low luminous efficiency at this stage. Summary of the Invention

[0004] Embodiments of the present invention provide a display panel and a manufacturing method thereof, and a display device to improve the luminous efficiency of Micro-LEDs.

[0005] In a first aspect, an embodiment of the present invention provides a display panel, comprising: a substrate;

[0006] A pixel circuit layer is provided on the substrate;

[0007] A first insulating layer is provided on a side of the pixel circuit layer away from the substrate; the display panel includes a plurality of spherical grooves; and the plurality of film layers of the display panel match to form inner walls of the spherical grooves;

[0008] a reflective metal layer, disposed on a side of the spherical groove away from the substrate; the reflective metal layer comprises a spherical reflective layer adhered to an inner wall of the spherical groove;

[0009] A plurality of light-emitting chips are arranged on a side of the reflective metal layer away from the substrate; and corresponding light-emitting chips are arranged in the spherical grooves.

[0010] In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, comprising: forming a substrate;

[0011] A pixel circuit layer and a first insulating layer are sequentially formed on a substrate; a plurality of spherical grooves are formed on the display panel; and the inner walls of the spherical grooves are formed by matching the plurality of film layers of the display panel;

[0012] forming a reflective metal layer on the first insulating layer; the reflective metal layer comprises a spherical reflective layer adhered to the inner wall of the spherical groove;

[0013] A plurality of light-emitting chips are arranged on a side of the reflective metal layer away from the substrate; and corresponding light-emitting chips are arranged in the spherical grooves.

[0014] In a third aspect, an embodiment of the present invention further provides a display device, comprising the display panel according to any one of the first aspects.

[0015] The present invention provides a display panel comprising: a substrate; a pixel circuit layer disposed on the substrate for providing a drive signal; and a first insulating layer disposed on a side of the pixel circuit layer away from the substrate to provide protection for the pixel circuit layer. The display panel includes multiple spherical recesses for accommodating light-emitting chips. Multiple film layers of the display panel match to form the inner walls of the spherical recesses, which are in contact with spherical reflective layers. The light-emitting chips are disposed on a side of the reflective metal layer away from the substrate, so that the light beams emitted by the light-emitting chips are adjusted in their optical path by the spherical reflective layers on the inner walls of the spherical recesses, converging the light and improving the light extraction efficiency of the light-emitting chips, thereby ensuring the display quality of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0017] Figure 2 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0018] Figure 3 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0019] Figure 4 A schematic diagram of a top view of a spherical groove provided in an embodiment of the present invention;

[0020] Figure 5 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0021] Figure 6 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0022] Figure 7 A schematic diagram of a preparation process of a spherical groove provided in an embodiment of the present invention;

[0023] Figure 8 A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0024] Figure 9 A simulation diagram of the luminous brightness of a display panel provided by an embodiment of the present invention;

[0025] Figure 10A schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0026] Figure 11 A schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0027] Figure 12 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention;

[0028] Figure 13 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention;

[0029] Figure 14 A schematic diagram of a structure after film etching provided by an embodiment of the present invention,

[0030] Figure 15 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention;

[0031] Figure 16 A schematic structural diagram of a display panel provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0032] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0033] Figure 1 A schematic structural diagram of a display panel provided by an embodiment of the present invention is shown in FIG. Figure 2 A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 1 and Figure 2 As shown, the display panel 100 includes: a substrate 101; a pixel circuit layer 102, arranged on the substrate 101; a first insulating layer 103, arranged on the side of the pixel circuit layer 102 away from the substrate 101; the display panel 100 includes a plurality of spherical grooves 104; a plurality of film layers of the display panel 100 match to form the inner wall of the spherical groove 104; a reflective metal layer 105, arranged on the side of the spherical groove 104 away from the substrate 101; the reflective metal layer 105 includes a spherical reflective layer 1051 adhered to the inner wall of the spherical groove 104; a plurality of light-emitting chips 106, arranged on the side of the reflective metal layer 105 away from the substrate 101; and corresponding light-emitting chips 106 are arranged in the spherical groove 104.

[0034] Among them, the substrate 101 can be a rigid material such as glass or silicon wafer, or a polymer material such as polyimide, polyvinyl alcohol, polyethylene terephthalate, etc. The pixel circuit layer 102 can include film layers such as an active layer, a gate insulating layer, a gate layer, an intermediate metal layer, an interlayer insulating layer, and a source-drain electrode layer located on one side of the substrate 101 in sequence. The gate layer can form the gate, the scan line, and the first level of the storage capacitor in the driving circuit, the intermediate metal layer can form the second pole of the storage capacitor, and the source-drain electrode layer can form the source, drain, data line, and power signal line in the driving circuit. The first insulating layer 103 is used to cover the pixel circuit layer 102 to avoid the level difference caused by the setting of the thin film transistor in the pixel circuit. The first insulating layer 103 can be a single layer or multiple layers of organic material, or a composite stacking body of an inorganic insulating layer and an organic insulating layer. A plurality of spherical grooves 104 are etched on one side of the display panel 100 away from the substrate 101. The plurality of spherical grooves 104 can be formed by etching a plurality of film layers. The edges and / or sidewalls of the plurality of film layers on the display panel 100 match to form the inner wall of the spherical groove 104. The plurality of film layers may include a first insulating layer 103, a pixel circuit layer 102, a substrate 101 and other film layer structures. The specific film layer to be etched needs to be set according to the size of the spherical groove 104. For example, Figure 1 As shown, if the radius of the spherical groove 104 is larger than the thickness of the first insulating layer 103 and the pixel circuit layer 102, it is necessary to etch the film layers of the substrate 101, the pixel circuit layer 102 and the first insulating layer 103 to realize the structure of the spherical groove 104, or add other filling layers between the substrate 101 and the pixel circuit layer 102 for etching to realize the structure of the spherical groove 104. If the radius of the spherical groove 104 is smaller than the thickness of the first insulating layer 103 and the pixel circuit layer 102, then Figure 2 As shown, the substrate 101 does not need to be etched, and only the first insulating layer 103 and the pixel circuit layer 102 need to be etched.

[0035] The sizes of the spherical grooves 104 provided on the same display panel 100 can be the same or different, and can be selected based on design requirements, which are not limited in the embodiments of the present invention. A reflective metal layer 105 is provided on the inner wall of the spherical groove 104. The material of the reflective metal layer 105 can be a metal material with high reflectivity, such as silver. The thickness of the reflective metal layer 105 is set to about 100 nm, so that the reflective metal layer 105 and the inner wall of the spherical groove 104 are designed to fit together to form a spherical reflective layer 1051. A plurality of light-emitting chips 106 are provided on the side of the reflective metal layer 105 away from the substrate 101. The light-emitting chips 106 can be Mirco LEDs, Mini LEDs, and other light-emitting chips 106 with the same size as Mirco LEDs and Mini LEDs. The selection can be based on actual design requirements, which are not specifically limited in the embodiments of the present invention. Corresponding light-emitting chips 106 are provided in the spherical grooves 104. Different light-emitting chips 106 can be provided in different spherical grooves 104 to meet the color display requirements of the display panel 100. The light emitted by the light emitting chip 106 located in the spherical groove 104 can be reflected toward the light emitting surface in the spherical groove 104, adjusting the light path so that the more divergent light emitted by the light emitting chip 106 to the lateral edge of the chip is converged and gathered to the middle area of ​​the spherical groove 104 for emission, thereby improving the light extraction efficiency of the light emitting chip 106 and ensuring the display effect of the display panel 100. For example, taking a micro-LED panel with a size of 30um*15um as an example, after using the spherical groove 104 structure in this embodiment, the luminous brightness of the light emitting chip in the range of 0-1° is increased by 5 to 8 times. It should be noted that in any embodiment of the present invention, the angle parallel to the substrate 101 is 0°, and the angle perpendicular to the substrate 101 is 90°.

[0036] In an embodiment of the present invention, a plurality of spherical grooves are provided on the display panel, a reflective metal layer is provided inside the spherical grooves, and the light-emitting chip is provided corresponding to the spherical grooves, so that the light emitted by the light-emitting chip is adjusted in the spherical grooves, so that the light emitted by the light-emitting chip to the surroundings can be converged and emitted in a direction perpendicular to the substrate, effectively improving the light extraction efficiency of the light-emitting chip, thereby improving the display effect of the display panel. It is worth noting that the spherical grooves in this embodiment can be a standard spherical hemispherical shape (including a standard hemispherical shape, a multi-hemispherical shape or a less-hemispherical shape), that is, an ellipsoidal or spherical-like hemispherical shape. This is not limited in this embodiment, but the spherical grooves in this embodiment are preferably a standard hemispherical hemispherical shape. A standard spherical shape is a sphere whose projection on any plane is circular, and a standard hemispherical shape is 1 / 2 of a standard spherical shape.

[0037] Optional, continue to refer to Figure 1The spherical reflective layer 1051 may include a first reflective portion 1052 and a second reflective portion 1053 that are insulated from each other; the display panel 100 also includes: an anode 107 and a cathode 108 that are insulated and arranged on the side of the reflective metal layer 105 away from the substrate 101; the anode 107 overlaps the first reflective portion 1052; the cathode 108 overlaps the second reflective portion 1053; the side of the spherical reflective layer 1051 away from the substrate 101 includes a first connecting electrode 1054 and a second connecting electrode 1055 that are insulated; the first connecting electrode 1054 overlaps the first reflective portion 1052; the second connecting electrode 1055 overlaps the second reflective portion 1053; the light-emitting chip 106 includes a first electrode 1061 and a second electrode 1062; the first connecting electrode 1054 is bonded to the first electrode 1061 of the corresponding light-emitting chip 106, and the second connecting electrode 1055 is bonded to the second electrode 1062 of the corresponding light-emitting chip 106.

[0038] The display panel 100 includes an anode 107 and a cathode 108 located on both sides of the spherical groove 104 and insulated. The spherical reflective layer 1051 in the spherical groove 104 includes a first reflective portion 1052 and a second reflective portion 1053 that are insulated from each other to avoid short circuits caused by short metal overlaps that affect the display effect. To ensure the connection between the anode 107 and the cathode 108 and the light-emitting chip 106, the anode 107 overlaps the first reflective portion 1052; the cathode 108 overlaps the second reflective portion 1053; the spherical reflective layer 1051 also includes a first connecting electrode 1054 and a second connecting electrode 1055 located at the bottom of the spherical groove 104. The first connecting electrode 1054 overlaps the first reflective portion 1052; the second connecting electrode 1055 overlaps the second reflective portion 1053; the light-emitting chip 106 includes a first electrode 1061 and a second electrode 1062; the ... The first electrode 1061 of the corresponding light-emitting chip 106 is bonded to the second electrode 1062 of the corresponding light-emitting chip 106. The bonding method can be achieved by laser transfer. This allows the first electrode 1061 of the light-emitting chip 106 to receive the anode drive signal output by the pixel driving circuit transmitted by the first reflective portion 1052 and the first connection electrode 1054, and the second electrode 1062 of the light-emitting chip 106 to receive the cathode drive signal transmitted by the second reflective portion 1053 and the second connection electrode 1055, thereby ensuring normal light emission of the light-emitting chip 106. The planar first reflective portion 1052 and the second reflective portion 1053 can both reflect the light output by the light-emitting chip 106 and provide strong current transmission, thereby reducing the loss of the anode drive signal and the cathode drive signal, thereby improving the display brightness and display efficiency of the light-emitting chip 106.

[0039] Optional, Figure 3A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 3 As shown, the spherical reflective layer 1051 may include a first reflective portion 1052 and a second reflective portion 1053 insulated from each other; the first reflective portion 1052 is reused as the anode 107; the second reflective portion 1053 is reused as the cathode 108; the side of the spherical reflective layer 1051 away from the substrate 101 includes a first connecting electrode 1054 and a second connecting electrode 1055 insulated from each other; the first connecting electrode 1054 overlaps the first reflective portion 1052; the second connecting electrode 1055 overlaps the second reflective portion 1053; the light-emitting chip 106 includes a first electrode 1061 and a second electrode 1062; the first connecting electrode 1054 is bonded to the first electrode 1061 of the corresponding light-emitting chip 106, and the second connecting electrode 1055 is bonded to the second electrode 1062 of the corresponding light-emitting chip 106.

[0040] A spherical reflective layer 1051 is disposed within the spherical recess 104. The spherical reflective layer 1051 includes a first reflective portion 1052 and a second reflective portion 1053, which are insulated from each other. The first reflective portion 1052 can be fabricated on the same layer as the anode 107, serving as the anode 107. The second reflective portion 1053 can be fabricated on the same layer as the cathode 108, serving as the cathode 108. The side of the spherical reflective layer 1051 facing away from the substrate 101 includes an insulated first connecting electrode 1054 and a second connecting electrode 1055. First and second electrodes 1061 and 1062 are located at the bottom of the spherical recess 104 to facilitate subsequent connection to the light-emitting chip 106. The first connecting electrode 1054 overlaps the first reflective portion 1052, while the second connecting electrode 1055 overlaps the second reflective portion 1053. The light-emitting chip 106 includes a first electrode 1061 and a second electrode 1062. The first connecting electrode 1054 is bonded to the first electrode 1061 of the corresponding light-emitting chip 106, and the second connecting electrode 1055 is bonded to the second electrode 1062 of the corresponding light-emitting chip 106. This allows the first electrode 1061 of the light-emitting chip 106 to receive an anode drive signal output by the pixel driving circuit, transmitted by the first reflective portion 1052, and the second electrode 1062 of the light-emitting chip 106 to receive a cathode drive signal output by the pixel driving circuit, transmitted by the second reflective portion 1053, to ensure normal light emission from the light-emitting chip 106. In this embodiment, the first reflective portion 1052 is multiplexed as the anode 107, and the second reflective portion 1053 is multiplexed as the cathode 108. Therefore, the anode 107, cathode 108, first reflective portion 1052, and second reflective portion 1053 can be simultaneously formed through a single etching process, effectively reducing the manufacturing process and cost of the display panel, thereby improving the production efficiency of the display panel.

[0041] Optional, continue to refer to Figure 1 、 Figure 2 and Figure 3 , may further include: a pad 109 ; the pad 109 is arranged on a side of the spherical reflective layer 1051 away from the substrate 101 , and is used to provide a bearing plane for the first connecting electrode 1054 and the second connecting electrode 1055 .

[0042] Among them, after the spherical reflective layer 1051 is set on the inner wall of the spherical groove 104, a pad 109 is prepared on the side of the spherical reflective layer 1051 away from the substrate 101. The pad 109 can be made of resin material, so that the resin material flows to a completely horizontal state in an uncured state, and is thermally cured or light-cured to form a pad 109 for supporting the first connecting electrode 1054 and the second connecting electrode 1055 of the spherical reflective layer 1051, so that the first connecting electrode 1054 and the second connecting electrode 1055 are placed parallel to the substrate 101, thereby improving the stability of the connection with the first electrode 1061 and the second electrode 1062 of the light-emitting chip 106 placed in the spherical groove 104, thereby ensuring the light-emitting effect of the light-emitting chip 106.

[0043] Optional, Figure 4 A schematic diagram of a top view of a spherical groove provided in an embodiment of the present invention is shown in FIG. Figure 4 As shown, continue to refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , the surface areas of the first reflective portion 1052 and the second reflective portion 1053 are both less than πR 2 ; R is the radius of the spherical groove 104.

[0044] Figure 3 The spherical groove 104 is shown as a hemispherical spherical groove as an example. The spherical groove 104 can be a standard hemispherical sphere, an ellipsoidal sphere, or a spherical shape to ensure the convergence of the light emitted by the light-emitting chip 106. The reflective metal layer 105 located on the inner wall of the spherical groove 104 includes a first reflective portion 1052 and a second reflective portion 1053 that are insulated from each other. There is a gap at the bottom of the inner wall of the spherical groove 104 so that the first reflective portion 1052 and the second reflective portion 1053 do not contact each other. Therefore, the surface area of ​​the first reflective portion 1052 and the second reflective portion 1053 are both less than one-quarter of the surface area πR of the sphere. 2 , to ensure the normal light emission of the light emitting chip 106. In this embodiment, under the premise of ensuring that the first reflective portion 1052 and the second reflective portion 1053 do not contact each other, the areas of the first reflective portion 1052 and the second reflective portion 1053 are as close to πR as possible. 2 , so as to enhance the reflection area of ​​the spherical reflection layer, thereby improving the reflection efficiency of the spherical reflection layer.

[0045] Optional, continue to refer to Figure 1and Figure 2 The middle spherical groove 104 may be a hemispherical groove; the center A of the hemispherical groove is located in the same plane as the anode 107 and the cathode 108 .

[0046] Among them, the spherical groove 104 is a hemispherical groove, and the center A of the hemispherical groove is located in the same plane as the anode 107 and the cathode 108, thereby ensuring that the spherical groove 104 is a standard hemispherical sphere, that is, the spherical groove 104 is 1 / 2 of the standard sphere. When the spherical groove 104 is 1 / 2 of the standard sphere, the spherical groove 104 has the best reflection efficiency, effectively improving the display efficiency of the light-emitting chip.

[0047] Optional, continue to refer to Figure 1 The substrate 101 may include a first bottom groove 1011 ; the pixel circuit layer 102 and the first insulating layer 103 form a first groove sidewall 1012 ; the first bottom groove 1011 and the first groove sidewall 1012 constitute an inner wall of the spherical groove 104 .

[0048] In order to ensure that the spherical groove 104 is formed in each film layer of the display panel 100, the radius of the spherical groove 104 in the direction from the substrate 101 to the first insulating layer 103 is greater than the overall thickness of the pixel circuit layer 102 and the first insulating layer 103 in the display panel 100. For example, if the radius of the spherical groove 104 in the direction perpendicular to the substrate 101 is 10 to 40 μm, the overall thickness of the pixel circuit layer 102 is about 3 to 4 μm. It is not feasible to simply dig a pit on the pixel circuit layer 102. A pit with a depth of 7 to 37 μm needs to be etched on the glass substrate in advance to accommodate the spherical reflective layer. In turn, a portion of the spherical groove 104 needs to be formed by etching on the substrate 101. Figure 1 As shown, a first bottom groove 1011 is etched on the substrate 101, and a first groove sidewall 1012 is etched on the pixel circuit layer 102 and the first insulating layer 103. The first bottom groove 1011 and the first groove sidewall 1012 constitute the sidewall of the spherical groove 104 to meet the design requirements, thereby ensuring the subsequent light adjustment of the light-emitting chip 106 and improving the light extraction efficiency of the light-emitting chip 106.

[0049] Alternatively, as another possible implementation method, a buffer layer is added between the substrate 101 and the pixel circuit layer 102 for etching to realize the structure of the spherical groove 104, thereby eliminating the need to etch the substrate 101. Figure 5 A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 5As shown, it may also include: a buffer layer 110, arranged between the substrate 101 and the pixel circuit layer 102; the buffer layer 110 includes a second bottom groove 1013; the pixel circuit layer 102 and the first insulating layer 103 form a second groove sidewall 1014; the second bottom groove 1013 and the second groove sidewall 1014 constitute the inner wall of the spherical groove 104.

[0050] Among them, in order to avoid etching of multiple substrates 101, a buffer layer 110 with a certain thickness can be set between the substrate 101 and the pixel circuit layer 102. The material of the buffer layer 110 may include any one or any two or more of silicon oxide, silicon nitride and silicon oxynitride. The buffer layer 110 is etched to form a second bottom groove 1013, and the pixel circuit layer 102 and the first insulating layer 103 are etched to form a second groove sidewall 1014. The second bottom groove 1013 and the second groove sidewall 1014 constitute the inner wall of the spherical groove 104, meeting the design requirements of the spherical groove 104. In addition, compared with the substrate 101, the buffer layer 110 can be etched using the same etching process as the pixel circuit and the first insulating layer 103, effectively reducing the difficulty of etching.

[0051] Optionally, as another possible implementation method, Figure 6 A schematic structural diagram of another display panel provided by an embodiment of the present invention, Figure 7 A schematic diagram of a preparation process of a spherical groove provided by an embodiment of the present invention is shown in FIG. Figure 6 and Figure 7 As shown, it may further include: a filling resin 111 ; a plurality of film layers of the display panel 100 forming an inverted trapezoidal quadrangular pyramid 112 ; and the filling resin 111 located in the quadrangular pyramid 112 to form an inner wall of the spherical groove 104 .

[0052] Among them, the substrate 101, the pixel circuit layer 102 and the first insulating layer 103 of the display panel 100 are etched to form an inverted trapezoidal quadrilateral prism 112. The size of the quadrilateral prism 112 is larger than the size of the spherical groove 104. The quadrilateral prism 111 is printed and filled with resin 111. The nanoimprint process is used to nanoimprint the filling resin 111 using a spherical nanoimprint head 1101 to form the shape of the spherical groove 104. At the same time, the filling resin 111 is thermally cured or photocured to form the inner wall of the spherical groove 104, which meets the design requirements and ensures the subsequent light adjustment of the light-emitting chip 106. In this embodiment, the spherical groove 104 is formed by a nanoimprinting process. Therefore, when etching multiple film layers of the display panel 100, the etching accuracy requirement is reduced. It is sufficient to form a spherical nanoimprint head 1101 to reduce the process difficulty of the display panel. The spherical nanoimprint head 1101 can be used to obtain a spherical groove 104 with precise dimensions, thereby improving the process accuracy of the spherical groove 104 and improving the light reflection efficiency of the subsequent spherical reflective layer.

[0053] Optional, Figure 8 A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 8 As shown, the light emitting chip 106 may include at least a red light emitting chip 1063, a green light emitting chip 1064 and a blue light emitting chip 1065; the radius R1 of the spherical groove 104 where the red light emitting chip 1063 is located is greater than the radius of the spherical groove 104 where the green light emitting chip 1064 and the blue light emitting chip 1065 are located.

[0054] In this embodiment, the light emitting chips in the display panel 100 may include a red light emitting chip 1063, a green light emitting chip 1064 and a blue light emitting chip 1065. Figure 9 A simulation diagram of the luminous brightness of a display panel provided by an embodiment of the present invention is shown in FIG. Figure 9 As shown, the horizontal axis is the different light-emitting positions of the light-emitting chip, the vertical axis is the luminous brightness, Curve 1 is a simulation curve of the luminous brightness of the green light-emitting chip 1064 and the blue light-emitting chip 1065 in the display panel of the prior art, Curve 2 is a simulation curve of the luminous brightness of the red light-emitting chip 1063 in the display panel of the prior art, and Curve 3 is a simulation curve of the luminous brightness of the red light-emitting chip 1063 in the display panel of the prior art. Figure 8 The luminous brightness simulation curve of the green light emitting chip 1064 and the blue light emitting chip 1065 in the display panel is shown in FIG4 . Figure 8 The simulation curve of the luminous brightness of the red light-emitting chip 1063 in the display panel shows that if the size of the spherical groove 104 of each color light-emitting chip 106 is the same, after simulating the light-emitting process using the spherical groove 104 in this embodiment, the brightness of the green light-emitting chip 1064 and the blue light-emitting chip 1065 is increased by 8.3 times, and the brightness of the red light-emitting chip 1063 is increased by 5.31 times (estimated at 0-1°). Therefore, different sizes of spherical grooves 104 can be designed for different color light-emitting chips 106, such as Figure 8 As shown, Figure 8In this example, the radius R1 of the spherical recess where the red light-emitting chip 1063 resides is greater than the radius R2 of the spherical recess 104 where the green light-emitting chip 1064 resides, and the radius R1 of the spherical recess where the red light-emitting chip 1063 resides is greater than the radius R3 of the spherical recess 104 where the blue light-emitting chip 1065 resides. The specific radius of the spherical recess 104 can be selected based on actual design requirements and is not specifically limited in this embodiment of the present invention. To improve the luminous efficiency of the red light-emitting chip 1063 and thereby enhance the performance of the display panel 100, the radius R1 of the spherical recess 104 where the red light-emitting chip 1063 resides can be controlled to be greater than the radius R2 of the spherical recess 104 where the green light-emitting chip 1064 resides, and the radius R1 of the spherical recess 104 where the red light-emitting chip 1063 resides can be controlled to be greater than the radius R2 of the spherical recess 104 where the blue light-emitting chip 1065 resides. The larger the radius of the spherical groove 104, the stronger the reflection ability of the light emitted by the light-emitting chip 106 in the spherical groove 104, and thus the higher the luminous efficiency of the emitted light. In this embodiment, the radius R1 of the spherical groove 104 where the red light-emitting chip 1063 is located is increased, so that the light reflection efficiency of the red light-emitting chip 1063 is better than that of the green light-emitting chip 1064 and the blue light-emitting chip 1065, and the luminous efficiency of the green light-emitting chip 1064 and the blue light-emitting chip 1065 themselves is higher than that of the red light-emitting chip 1063. In this embodiment, through the neutralizing effect of the radius R1 of the spherical groove 104, while enhancing the luminous efficiency of the light-emitting chip, the brightness improvement effect of the red light-emitting chip 1063, the green light-emitting chip 1064 and the blue light-emitting chip 1065 tends to be the same, thereby enhancing the display uniformity of the display panel and improving the overall picture display effect. Optionally, since the luminous efficiencies of the green light-emitting chip 1064 and the blue light-emitting chip 1065 are substantially the same, the radius R2 of the spherical groove 104 where the green light-emitting chip 1064 is located can be controlled to be the same as the radius R3 of the spherical groove 104 where the blue light-emitting chip 1065 is located.

[0055] Optional, continue to refer to Figure 8 In a plane parallel to the substrate 101, a distance A1 between the orthographic projection of the edge of the red light-emitting chip 1063 and the orthographic projection of the edge of the corresponding spherical reflective layer 1051 is greater than a distance between the orthographic projection of the edge of the green light-emitting chip 1064 and the orthographic projection of the edge of the blue light-emitting chip 1065 and the orthographic projection of the edge of the corresponding spherical reflective layer 1051.

[0056] Among them, since the radius R1 of the spherical groove 104 where the red light-emitting chip 1063 is located is greater than the radius R2 of the spherical groove 104 where the green light-emitting chip 1064 is located, and the radius R1 of the spherical groove 104 where the red light-emitting chip 1063 is located is greater than the radius R3 of the spherical groove 104 where the blue light-emitting chip 1065 is located, for the red light-emitting chip 1063, the green light-emitting chip 1064, and the blue light-emitting chip 1065 of the same size, the distance A1 between the orthographic projection of the edge of the red light-emitting chip 1063 and the orthographic projection of the edge of the corresponding spherical reflective layer 1051 is greater than the orthographic projection of the edge of the green light-emitting chip 1064. The distance A2 between the orthographic projection of the edge of the red light-emitting chip 1063 and the orthographic projection of the edge of the corresponding spherical reflective layer 1051, and the distance A1 between the orthographic projection of the edge of the red light-emitting chip 1063 and the orthographic projection of the edge of the corresponding spherical reflective layer 1051 are greater than the distance A3 between the orthographic projection of the edge of the blue light-emitting chip 1065 and the orthographic projection of the edge of the corresponding spherical reflective layer 1051. As a result, the reflection ability of the light emitted by the red light-emitting chip 1063 in the spherical groove 104 is the strongest, thereby improving the luminous efficiency of the red light-emitting chip 1063, coordinating the luminous efficiency of the green light-emitting chip 1064 and the blue light-emitting chip 1065, and thus ensuring the overall display effect of the display panel 100.

[0057] Optional, Figure 10 A structural diagram of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 10 As shown, the light-emitting chip 106 may include at least a red light-emitting chip 1063, a green light-emitting chip 1064 and a blue light-emitting chip 1065; the size B1 of the red light-emitting chip 1063 in a plane parallel to the substrate 101 is larger than the sizes of the green light-emitting chip 1064 and the blue light-emitting chip 1065 in a plane parallel to the substrate 101.

[0058] The light-emitting chip 106 in the display panel 100 may include a red light-emitting chip 1063, a green light-emitting chip 1064, and a blue light-emitting chip 1065. To improve the luminous efficiency of the red light-emitting chip 1063, the size of the red light-emitting chip 1063 may be increased, such that a size B1 of the red light-emitting chip 1063 in a plane parallel to the substrate 101 is larger than a size B2 of the green light-emitting chip 1064 in a plane parallel to the substrate 101, and a size B1 of the red light-emitting chip 1063 in a plane parallel to the substrate 101 is larger than a size B3 of the blue light-emitting chip 1065 in a plane parallel to the substrate 101, thereby ensuring the display effect of the display panel 100. Figure 10For exemplary purposes only, dimension B1 of the red light-emitting chip 1063 in a plane parallel to the substrate 101 is shown as being larger than dimension B2 of the green light-emitting chip 1064 in a plane parallel to the substrate 101, and dimension B3 of the blue light-emitting chip 1065 in a plane parallel to the substrate 101. This further enhances the luminous efficiency of the red light-emitting chip 1063, maintaining the brightness enhancement factor of the red light-emitting chip 1063 as similar as that of the green light-emitting chip 1064 and the blue light-emitting chip 1065, thereby improving the display quality of the display panel. Optionally, dimension B2 of the green light-emitting chip 1064 in a plane parallel to the substrate 101 and dimension B3 of the blue light-emitting chip 1065 in a plane parallel to the substrate 101 can be the same. The specific dimensions of the light-emitting chip 106 can be selected based on actual design requirements and are not specifically limited in this embodiment of the present invention.

[0059] Optional, continue to refer to Figure 1 The display panel 100 may further include: a second insulating layer 113, which is arranged on the side of the anode 107 and the cathode 108 away from the substrate 101; the second insulating layer 113 does not overlap with the spherical groove 104 in a plane parallel to the substrate 101; a planarization layer 114, which is arranged on the side of the light-emitting chip 106 and the second insulating layer 113 away from the substrate 101; the planarization layer 114 is used to fill the spherical groove 104 and form a light emitting plane parallel to the substrate 101 on the side of the display panel 100 away from the substrate 101.

[0060] A second insulating layer 113 is provided on the side of the anode 107 and cathode 108 away from the substrate 101. The second insulating layer 113 does not overlap with the spherical groove 104 in a plane parallel to the substrate 101. The second insulating layer 113 is used to reduce the reflection of ambient light on the anode 107 and cathode 108, reducing stray light, ensuring that the light emitted by the display panel 100 is primarily emitted by the light-emitting chip 106 within the spherical groove 104, preventing light mixing, and improving the display effect of the display panel 100. At the same time, a planarization layer 114 is formed on the side of the light-emitting chip 106 and the second insulating layer 113 away from the substrate 101. The planarization layer 114 is used to fill the spherical groove 104 and form a light-emitting plane parallel to the substrate 101 on the side of the display panel 100 away from the substrate 101. The material of the planarization layer 114 can include any one or any two or more of silicon oxide, silicon nitride, and silicon oxynitride. The planarization layer 114 is used to protect the various film layers and the light-emitting chip 106 in the display panel 100 to prevent corrosion by external water and oxygen, and at the same time provide a light output plane for the light emitted by the light-emitting chip 106 to emit light evenly, thereby ensuring the display effect of the display panel 100.

[0061] Based on the same concept, an embodiment of the present invention further provides a method for manufacturing a display panel. Figure 11A schematic diagram of a method for manufacturing a display panel according to an embodiment of the present invention is shown in FIG. Figure 1 As shown, the method of this embodiment includes the following steps:

[0062] S101, forming a substrate.

[0063] The substrate may be a rigid material such as glass or silicon wafer, or a polymer material such as polyimide, polyvinyl alcohol, polyethylene terephthalate, etc.

[0064] S102, forming a pixel circuit layer and a first insulating layer in sequence on the substrate; and forming a plurality of spherical grooves on the display panel; and matching the plurality of film layers of the display panel to form inner walls of the spherical grooves.

[0065] A pixel circuit layer and a first insulating layer are sequentially formed on the substrate to provide drive signals for normal display. Etching is performed on the pixel circuit layer and the first insulating layer to form spherical grooves in the film layer where the pixel drive circuit is not laid. This does not affect the driving effect of the pixel drive circuit and also facilitates subsequent process preparation.

[0066] S103 , forming a reflective metal layer on the first insulating layer; the reflective metal layer includes a spherical reflective layer in contact with the inner wall of the spherical groove.

[0067] A reflective metal layer is prepared on the first insulating layer, and a reflective metal layer is also formed on the inner wall of the spherical groove. The reflective metal layer and the inner wall of the spherical groove are bonded to form a spherical reflective layer, so that the reflective metal layer and the inner wall of the spherical groove are well bonded.

[0068] S104 , disposing a plurality of light-emitting chips on a side of the reflective metal layer away from the substrate; and disposing corresponding light-emitting chips in the spherical grooves.

[0069] Among them, a light-emitting chip is arranged on the side of the reflective metal layer away from the substrate in the spherical groove. The light-emitting chip can be a micro light-emitting diode or a sub-millimeter light-emitting diode. The light-emitting chip receives the driving signal output by the pixel driving circuit to emit light. The light emitted by the light-emitting chip is reflected by the spherical reflective layer, and the optical path is changed, so that the light emitted by the light-emitting chip is converged, thereby improving the light output efficiency of the light-emitting chip and thereby improving the display effect of the display panel.

[0070] In an embodiment of the present invention, a spherical groove is formed on a display panel, and the inner wall of the spherical groove is formed by matching the pixel circuit and the various film layers of the first insulating layer, and a spherical reflective layer is attached to the inner wall of the spherical groove to ensure the regulation of the light emitted by the light-emitting chip built into the spherical groove, thereby improving the light extraction efficiency.

[0071] As another possible implementation, Figure 12A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention is shown in FIG. Figure 12 As shown, the method of this embodiment includes the following steps:

[0072] S201 , etching a plurality of first bottom grooves on a substrate material to form a substrate.

[0073] Among them, the substrate material is etched using a photoresist etching process, and the shape and size of the etched first bottom groove are reasonably selected according to actual design requirements. The size of the first bottom groove is between 3-37μm to ensure the subsequent formation of a spherical groove and the display effect of the display panel.

[0074] S202, forming a pixel circuit layer and a first insulating layer in sequence on the substrate; etching the pixel circuit layer and the first insulating layer to form a first groove sidewall; the first bottom groove and the first groove sidewall constitute the inner wall of the spherical groove.

[0075] Among them, the pixel circuit layer and the first insulating layer can be etched by a layer-by-layer etching process or a one-time forming etching process to form the first groove sidewall, and the shape and size of the first groove sidewall are matched with the shape and size of the first bottom groove, so that the first bottom groove and the first groove sidewall constitute the inner wall of the spherical groove, ensuring the integrity of the structure and thus ensuring the display effect of the display panel.

[0076] S203 , forming a reflective metal layer on the first insulating layer; the reflective metal layer includes a spherical reflective layer in contact with the inner wall of the spherical groove.

[0077] S204 , disposing a plurality of light-emitting chips on a side of the reflective metal layer away from the substrate; and disposing corresponding light-emitting chips in the spherical grooves.

[0078] In an embodiment of the present invention, the pixel circuit and the first insulating layer in the display panel are etched to form the sidewalls of the first groove, and the sidewalls of the first bottom groove are formed in cooperation with the first bottom groove etched on the substrate material to form the inner wall of the spherical groove. A spherical reflective layer is attached to the inner wall of the spherical groove to ensure the regulation of the light emitted by the light-emitting chip built into the spherical groove, thereby improving the light extraction efficiency.

[0079] Optionally, as another possible implementation method, Figure 13 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention is shown in FIG. Figure 13 As shown, the pixel circuit layer includes multiple film layers; the first insulating layer includes at least one film layer; and the following steps are included:

[0080] S301 , etching a plurality of first bottom grooves on a substrate material to form a substrate.

[0081] S302, after forming each film layer in the pixel circuit layer and the first insulating layer, etching the film layer; in the direction away from the substrate, each film layer decreases in sequence to form a stepped structure, and the stepped structure forms the inner wall of the spherical groove.

[0082] in, Figure 14 A schematic diagram of a structure after etching of a film layer provided in an embodiment of the present invention is shown in FIG. Figure 14 As shown, each film layer in the pixel circuit layer 102 and the first insulating layer 103 is etched separately, and the substrate 101 and the buffer layer 110 are also etched so that a gradually decreasing step shape is formed between each film layer layer by layer, and the extension length difference between the steps of each film layer is less than 10um, so as to achieve a stepped structure to the greatest extent to form the inner wall of the spherical groove.

[0083] S303 , forming a reflective metal layer on the first insulating layer; the reflective metal layer includes a spherical reflective layer in contact with the inner wall of the spherical groove.

[0084] S304 , disposing a plurality of light-emitting chips on a side of the reflective metal layer away from the substrate; and disposing corresponding light-emitting chips in the spherical grooves.

[0085] The embodiment of the present invention etches the pixel circuit and the first insulating layer in the display panel layer by layer, reasonably controls the etching size of each film layer, so that each film layer gradually decreases to form a stepped structure, and the stepped structure forms the inner wall of the spherical groove. A spherical reflective layer is attached to the inner wall of the spherical groove to ensure the regulation of the light emitted by the light-emitting chip built into the spherical groove, thereby improving the light extraction efficiency.

[0086] Optionally, as another possible implementation method, Figure 15 A schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present invention is shown in FIG. Figure 15 As shown, the pixel circuit layer includes multiple film layers; the first insulating layer includes at least one film layer; and the following steps are included:

[0087] S401 , etching a plurality of first bottom grooves on a substrate material to form a substrate.

[0088] S402 , after sequentially forming a pixel circuit layer and a first insulating layer on the substrate, etching multiple film layers of the display panel to form inverted trapezoidal quadrilateral pyramids.

[0089] Wherein, each film layer in the display panel is etched once to form an inverted trapezoidal quadrilateral pyramid.

[0090] S403, printing filling resin in the quadrilateral pyramid.

[0091] Among them, the filling resin is printed in the prepared inverted trapezoidal quadrilateral pyramid to facilitate the subsequent shaping of the resin to form a spherical structure.

[0092] S404, using a nano-printing head to form the inner wall of the spherical groove with a filling resin.

[0093] Among them, a spherical nano-print head is used to imprint the resin filled in the quadrilateral prism, and the resin is light-cured or heat-cured at the same time. After the filled resin is cured, the nano-print head is removed to form the inner wall of the spherical groove.

[0094] S405 , forming a reflective metal layer on the first insulating layer; the reflective metal layer includes a spherical reflective layer in contact with the inner wall of the spherical groove.

[0095] S406 , disposing a plurality of light-emitting chips on a side of the reflective metal layer away from the substrate; and disposing corresponding light-emitting chips in the spherical grooves.

[0096] In an embodiment of the present invention, the pixel circuit and the first insulating layer in the display panel are etched to form an inverted trapezoidal quadrilateral pyramid, and a filling resin is printed in the quadrilateral pyramid. A nanoimprinting process is used to form the inner wall of a spherical groove with precise dimensions, and a spherical reflective layer is attached to the inner wall of the spherical groove to ensure the regulation of the light emitted by the light-emitting chip built into the spherical groove, thereby improving the light extraction efficiency and reducing the process difficulty.

[0097] An embodiment of the present invention further provides a display device, which includes any one of the display panels provided in the above embodiments. Figure 16 As shown, the display device 200 includes the display panel 100 provided by any embodiment of the present invention. Therefore, the display device also has the beneficial effects of the display panel in the above embodiment. The similarities can be understood by referring to the above explanation of the display panel, which will not be repeated below.

[0098] The display device 200 provided by the embodiment of the present invention can be Figure 16 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc. The embodiments of the present invention do not specifically limit this.

[0099] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; A pixel circuit layer is provided on the substrate; A first insulating layer is provided on a side of the pixel circuit layer away from the substrate; the display panel includes a plurality of spherical grooves; and the plurality of film layers of the display panel match to form inner walls of the spherical grooves; a reflective metal layer, disposed on a side of the spherical groove away from the substrate; the reflective metal layer comprises a spherical reflective layer adhered to an inner wall of the spherical groove; A plurality of light-emitting chips are arranged on a side of the reflective metal layer away from the substrate; corresponding light-emitting chips are arranged in the spherical grooves; The light-emitting chips include at least a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip; The radius of the spherical groove where the red light-emitting chip is located is greater than the radius of the spherical grooves where the green light-emitting chip and the blue light-emitting chip are located.

2. The display panel according to claim 1, wherein: The spherical reflective layer includes a first reflective portion and a second reflective portion that are insulated from each other; The display panel further includes: an anode and a cathode, both of which are insulated and disposed on a side of the reflective metal layer away from the substrate; the anode overlaps the first reflective portion; and the cathode overlaps the second reflective portion. The spherical reflective layer includes a first connecting electrode and a second connecting electrode on a side away from the substrate. The first connecting electrode overlaps the first reflecting portion. The second connecting electrode overlaps the second reflecting portion. The light emitting chip includes a first electrode and a second electrode; the first connecting electrode is bonded to the first electrode of the corresponding light emitting chip, and the second connecting electrode is bonded to the second electrode of the corresponding light emitting chip.

3. The display panel according to claim 1, wherein: The spherical reflective layer includes a first reflective portion and a second reflective portion that are insulated from each other; The first reflective portion is multiplexed as an anode; the second reflective portion is multiplexed as a cathode; The spherical reflective layer includes a first connecting electrode and a second connecting electrode on a side away from the substrate. The first connecting electrode overlaps the first reflecting portion. The second connecting electrode overlaps the second reflecting portion. The light emitting chip includes a first electrode and a second electrode; the first connecting electrode is bonded to the first electrode of the corresponding light emitting chip, and the second connecting electrode is bonded to the second electrode of the corresponding light emitting chip.

4. The display panel according to claim 2 or 3, wherein: Also includes: Pads; The pad is arranged on a side of the spherical reflective layer away from the substrate, and is used to provide a bearing plane for the first connecting electrode and the second connecting electrode.

5. The display panel according to claim 2 or 3, wherein: The surface areas of the first reflecting portion and the second reflecting portion are both smaller than πR 2 ; R is the radius of the spherical groove.

6. The display panel according to claim 2, wherein: The spherical groove is a hemispherical groove; the center of the hemispherical groove is located in the same plane as the anode and the cathode.

7. The display panel according to claim 1, wherein: The substrate includes a first bottom groove; the pixel circuit layer and the first insulating layer form side walls of the first groove; the first bottom groove and the first groove side walls constitute the inner wall of the spherical groove.

8. The display panel according to claim 1, wherein: Also includes: a buffer layer, disposed between the substrate and the pixel circuit layer; The buffer layer includes a second bottom groove; the pixel circuit layer and the first insulating layer form sidewalls of the second groove; the second bottom groove and the second groove sidewalls constitute the inner wall of the spherical groove.

9. The display panel according to claim 1, wherein: Also includes: Filling resin; The multiple film layers of the display panel form an inverted trapezoidal quadrangular pyramid; The filling resin is located on the inner wall of the spherical groove formed in the quadrangular pyramid.

10. The display panel according to claim 9, wherein: In a plane parallel to the substrate, the distance between the orthographic projection of the edge of the red light-emitting chip and the orthographic projection of the edge of the corresponding spherical reflective layer is greater than the distance between the orthographic projection of the edge of the green light-emitting chip and the blue light-emitting chip and the orthographic projection of the edge of the corresponding spherical reflective layer.

11. The display panel according to claim 9, wherein The light-emitting chips include at least a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip; the size of the red light-emitting chip in a plane parallel to the substrate is larger than the size of the green light-emitting chip and the blue light-emitting chip in a plane parallel to the substrate.

12. The display panel according to claim 2, wherein: Also includes: a second insulating layer, disposed on a side of the anode and cathode away from the substrate; the second insulating layer does not overlap with the spherical groove in a plane parallel to the substrate; A planarization layer is provided on a side of the light emitting chip and the second insulating layer away from the substrate; the planarization layer is used to fill the spherical groove and form a light emitting plane parallel to the substrate on a side of the display panel away from the substrate.

13. A method for manufacturing a display panel, characterized in that: include: forming a substrate; forming a pixel circuit layer and a first insulating layer in sequence on the substrate; and forming a plurality of spherical grooves on the display panel; The multiple film layers of the display panel match to form the inner wall of the spherical groove; forming a reflective metal layer on the first insulating layer; the reflective metal layer comprises a spherical reflective layer adhered to the inner wall of the spherical groove; A plurality of light-emitting chips are arranged on a side of the reflective metal layer away from the substrate; the corresponding light-emitting chips are arranged in the spherical groove; the light-emitting chips include at least a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip; the radius of the spherical groove where the red light-emitting chip is located is greater than the radius of the spherical grooves where the green light-emitting chip and the blue light-emitting chip are located.

14. The method for manufacturing a display panel according to claim 13, wherein: Forming a substrate includes: Etching a plurality of first bottom grooves on the substrate material to form a substrate; A plurality of spherical grooves are formed on the display panel, including: A first groove sidewall is formed by etching the pixel circuit layer and the first insulating layer; the first bottom groove and the first groove sidewall constitute the inner wall of the spherical groove.

15. The method for manufacturing a display panel according to claim 13, wherein: The pixel circuit layer includes a plurality of film layers; the first insulating layer includes at least one film layer; A pixel circuit layer and a first insulating layer are sequentially formed on a substrate, and a plurality of spherical grooves are formed on the display panel, including: After forming each film layer in the pixel circuit layer and the first insulating layer, etching the film layer; In a direction away from the substrate, each film layer decreases in sequence to form a stepped structure, and the stepped structure forms the inner wall of the spherical groove.

16. The method for manufacturing a display panel according to claim 13, wherein: The pixel circuit layer includes a plurality of film layers; the first insulating layer includes at least one film layer; A pixel circuit layer and a first insulating layer are sequentially formed on a substrate, and a plurality of spherical grooves are formed on the display panel, including: After sequentially forming a pixel circuit layer and a first insulating layer on a substrate, etching multiple film layers of the display panel to form inverted trapezoidal quadrilateral pyramids; Printing filling resin in the quadrilateral pyramid; The filling resin is formed into the inner wall of the spherical groove by a nano-printing head.

17. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 12.

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