Semiconductor cooling system for mobile magnetic resonance equipment

Abstract

A semiconductor cooling system for a mobile magnetic resonance device includes a gradient power amplifier, a radio frequency power amplifier, and a spectrometer. The system is characterized in that it comprises a semiconductor refrigeration unit, a temperature control unit, and a cold air duct unit. The cold air duct unit comprises a main cold air duct and a first air outlet and a second air outlet. The first air outlet leads to the gradient power amplifier, and the second air outlet leads to the radio frequency power amplifier and the spectrometer. The temperature control unit is disposed on one side of the semiconductor refrigeration unit. A semiconductor refrigeration unit is disposed at the other end of the main cold air duct. The semiconductor refrigeration unit comprises a heat dissipation component for discharging hot air and a cold air component for supplying cold air. A semiconductor cooling fin is disposed between the heat dissipation component and the cold air component. The two sides of the semiconductor cooling fin are connected to the heat dissipation component and the cold air component, respectively, via thermally conductive silicone grease. The present invention enables precise temperature control, has a compact structure, and high heat dissipation efficiency, effectively improving the operating stability of small portable equipment.

Description

Technical field

[0001] The present invention relates to the field of magnetic resonance technology for medical diagnosis, and in particular to a semiconductor heat dissipation system for mobile magnetic resonance equipment. [Background Technology]

[0002] An MRI system primarily consists of a magnet, circuitry, and data processing and image reconstruction components. The circuitry includes a magnetic resonance spectrometer, radio frequency power amplifier, and gradient power amplifier. The spectrometer is the brain of the MRI system, transmitting and modulating radio frequency and gradient signals according to a sequence, receiving and demodulating the magnetic resonance signals from each channel. Due to the high volume and speed of data processing, the internal processing units generate significant heat. Similarly, the radio frequency power amplifier and gradient power amplifier, as energy amplification components, have output powers ranging from hundreds of watts to thousands of watts, and similarly generate significant heat.

[0003] Existing magnetic resonance imaging systems place each circuit module in an electronic equipment cabinet outside a shielded room. This offers advantages such as ample space, improved heat dissipation between devices, and long-term stable operation. In this larger space, when the circuit modules are placed separately, their mutual heat generation is minimal, and the gaps between components can also achieve good cooling effects through natural cooling. However, in low-field mobile magnetic resonance imaging systems, each electronic device needs to be placed below the magnet system, which has limited space and requires all circuit components to be concentrated in a smaller chassis. When the circuit modules are concentrated in the same chassis, their heat will radiate to nearby devices. The combined heat from each device causes a higher temperature rise in the overall electronic equipment, thus affecting the device's operational stability. [Summary of the invention]

[0004] The present invention aims to solve the above problems and provide a semiconductor heat dissipation system for mobile magnetic resonance equipment, which can accurately control temperature, has a compact structure, high heat dissipation efficiency, and can effectively improve the working stability of small movable equipment.

[0005] To achieve the above-mentioned purpose, the present invention provides a semiconductor heat dissipation system for a mobile magnetic resonance device, which includes a gradient power amplifier, a radio frequency power amplifier and a spectrometer, and is characterized in that the system is provided with a semiconductor refrigeration unit, a temperature control unit and a cold air duct unit, the cold air duct unit including a main cold air duct and a first air outlet and a second air outlet arranged on the side and end of the main cold air duct, the first air outlet leading to the gradient power amplifier, the second air outlet leading to the radio frequency power amplifier and the spectrometer, the temperature control unit being arranged on one side of the semiconductor refrigeration unit (40), and the semiconductor refrigeration unit being arranged at the other end of the main cold air duct, the semiconductor refrigeration unit including a heat dissipation component for sending out hot air and a cold air component for sending in cold air, a semiconductor refrigeration plate being arranged between the heat dissipation component and the cold air component, and the two sides of the semiconductor refrigeration plate being connected to the heat dissipation component and the cold air component respectively through thermal grease.

[0006] The main cold air duct is a flat square tubular shell, and the first air outlet and the second air outlet arranged on the main cold air duct are separated by an arc-shaped partition located therebetween.

[0007] The first air outlet is arranged on one side of the main cold air duct, and is formed by a side frame arranged on one side of the main cold air duct; the second air outlet is arranged at one end of the main cold air duct away from the temperature control unit, and is formed by a frame arranged at the end.

[0008] The arc-shaped partition is provided with a main cold air duct connecting the first air outlet and the second air outlet.

[0009] The heat dissipation component of the semiconductor refrigeration unit includes a heat dissipation fan and a first heat sink. The first heat sink is arranged on the opposite side of the air outlet end of the heat dissipation fan and is connected to the semiconductor refrigeration fin through thermal grease.

[0010] The cold air component of the semiconductor refrigeration unit includes a cold fan and a second heat sink. The second heat sink is arranged on the opposite side of the air outlet end of the cold fan. The second heat sink is connected to the semiconductor refrigeration fin through thermal grease.

[0011] The exposed parts around the semiconductor refrigeration plate are covered with heat insulation cotton.

[0012] The semiconductor refrigeration plate, temperature control unit, heat dissipation fan and cooling fan of the semiconductor refrigeration unit are respectively connected to an external power supply through wires.

[0013] The temperature control unit includes multiple temperature sensors, a power switching module, an acquisition controller MCU, a controllable constant current source and a fan speed control module. The multiple temperature sensors are arranged at the first air outlet and the second air outlet. The multiple temperature sensors and the power switching module are respectively connected to the acquisition controller MCU. The power switching module is also respectively connected to the controllable constant current source and the fan speed control module. The controllable constant current source is connected to the semiconductor refrigeration plate, and the fan speed control module is respectively connected to the cooling fan and the cooling fan.

[0014] The present invention contributes by effectively solving the heat dissipation problem of various electronic devices within the confined space of a low-field mobile magnetic resonance system. By incorporating a temperature control unit capable of collecting temperature data and a compact semiconductor refrigeration unit that combines both cooling and heat dissipation, the present invention precisely controls the outlet temperature to the heat-generating device. This effectively reduces the temperature of the device and rapidly dissipates the heat generated by the device. This highly efficient heat dissipation significantly improves the operational stability of small mobile devices.

Brief Description of the Drawings

[0015] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the present invention.

[0016] Figure 2 It is a schematic exploded perspective view of the components of the present invention.

[0017] Figure 3 It is a structural sectional view of the present invention.

[0018] Figure 4 It is the overall structural diagram of the present invention.

[0019] Figure 5 It is a schematic structural diagram of the semiconductor refrigeration unit of the present invention. [Specific implementation method]

[0020] The following examples are provided to further explain and illustrate the present invention and do not constitute any limitation to the present invention.

[0021] See Figures 1 to 4 The semiconductor heat dissipation system of the mobile magnetic resonance device of the present invention includes a gradient power amplifier 10, a radio frequency power amplifier 20, a spectrometer 30, a semiconductor refrigeration unit 40, a temperature control unit 50 and a cold air duct unit 60.

[0022] The gradient power amplifier 10, radio frequency power amplifier 20, and spectrometer 30 are the same as the gradient power amplifier, radio frequency power amplifier, and spectrometer recorded in the application number 2021114293309, entitled "Mobile non-electromagnetic shielding magnetic resonance imaging device".

[0023] like Figures 1 to 4As shown, the semiconductor refrigeration unit 40 includes a heat dissipation assembly 41 for discharging hot air and a cooling air assembly 42 for discharging cold air. The heat dissipation assembly 41 is used to discharge heat generated by the heating element to the outside space. It includes a cooling fan 411 and a first heat sink 412. The first heat sink 412 is located on the side opposite the air outlet of the cooling fan 411 and is connected to the semiconductor cooling element 43 via thermal grease 44. The air outlet of the cooling fan 411 faces outward. The cooling air assembly 42 is used to cool and deliver cold air to the heating element to reduce its temperature. The cooling air assembly 42 includes a cooling fan 421 and a second heat sink 422. The second heat sink 422 is located on the side opposite the air outlet of the cooling fan 421 and is connected to the semiconductor cooling element 43 via thermal grease 44. The air outlet of the cooling fan 421 faces inward. A cooling and temperature-reducing semiconductor fin 43 is installed between the heat dissipation assembly 41 and the cold air assembly 42. Both sides of the semiconductor fin 43 are connected to the heat dissipation assembly 41 and the cold air assembly 42, respectively, via thermally conductive silicone grease 44. The exposed portion of the semiconductor fin 43 is covered with thermal insulation 45. Heat generated by the hot end of the semiconductor fin 43 is dissipated to the outside through the heat dissipation assembly 41. Cold air generated by the cold end of the semiconductor fin 43 is delivered to the heating device through the cold air assembly 42, thereby cooling the heating device.

[0024] like Figure 1 、 Figure 5 The semiconductor refrigeration unit 40 is provided at one end of the cold air duct unit 60. Its structure is as follows Figure 2 、 Figure 3 As shown, the cold air duct unit 60 includes a main cold air duct 61 and a first air outlet 62 and a second air outlet 63 located on the side and end of the main cold air duct. The main cold air duct 61 is a flat, rectangular tubular housing. The first air outlet 62 and the second air outlet 63 located on the main cold air duct 61 are separated by a curved partition 64 located therebetween. The curved partition 64 is provided with an air grille 641 connecting the main cold air duct 61 with the first air outlet 62 and the second air outlet 63. The first air outlet 62 is located on one side of the main cold air duct 61 and is formed by a side frame located thereon. It leads to the gradient power amplifier 10. The second air outlet 63 is located at the end of the main cold air duct 61 away from the temperature control unit 50 and is formed by a frame located thereon. It leads to the RF power amplifier 20 and the spectrometer 30. The cold air sent out through the main cold air duct 61 cools the gradient power amplifier 10 , the radio frequency power amplifier 20 and the spectrometer 30 through the first air outlet 62 and the second air outlet 63 .

[0025] like Figure 1 、 Figure 4As shown, a temperature control unit 50 is provided on one side of the semiconductor refrigeration unit 40, and its structure is as follows Figure 4 As shown, the temperature control unit 50 includes multiple temperature sensors 51, a power switching module 52, an acquisition controller MCU, a controllable constant current source 53, and a fan speed control module 54. The multiple temperature sensors 51 are located at the first air outlet 62 and the second air outlet 63 and are connected to the acquisition controller MCU to collect temperature data from each air outlet. This temperature data can be an analog or digital signal, and the collected temperature data is transmitted to the acquisition controller MCU for processing. The power switching module 52 is respectively connected to the acquisition controller MCU, the controllable constant current source 53, and the fan speed control module 54. It is used to switch the power supply of the semiconductor cooling chip to preheat the device when the ambient temperature is too low and when the device is first turned on. The controllable constant current source 53 is connected to the semiconductor cooling chip 43. The fan speed control module 54 is respectively connected to the cooling fan 411 and the cooling fan 421 to adjust the speed of the cooling fan 411 and the cooling fan 421. When the temperature control unit 50 is working, the temperature sensor 51 collects the temperature data of each air outlet and transmits the data to the acquisition controller MCU. The acquisition controller MCU compares the collected data with the set value to control the output current of the controllable constant current source 53 and adjusts the fan speed through the fan speed control module 54.

[0026] The semiconductor refrigeration plate 43 of the semiconductor refrigeration unit 40 , the temperature control unit 50 , the heat dissipation fan 411 and the cooling fan 421 are respectively connected to an external power source through wires.

[0027] Thus, the present invention, by providing a semiconductor refrigeration unit 40 and a temperature control unit 50, effectively controls the heat dissipation of various electronic devices in a low-field mobile magnetic resonance system. This invention not only effectively reduces the temperature of heat-generating devices but also rapidly dissipates the heat generated by these devices with high heat dissipation efficiency, thereby effectively improving the operational stability of small mobile devices.

[0028] Although the present invention is disclosed through the above embodiments, the protection scope of the present invention is not limited thereto. Without departing from the concept of the present invention, any deformation or replacement of the above components shall fall within the scope of the claims of the present invention.

Claims

1. A semiconductor heat dissipation system for a mobile magnetic resonance device, comprising a gradient power amplifier (10), a radio frequency power amplifier (20) and a spectrometer (30), characterized in that: The system is provided with a semiconductor refrigeration unit (40), a temperature control unit (50) and a cold air duct unit (60). The cold air duct unit (60) comprises a main cold air duct (61) and a first air outlet (62) and a second air outlet (63) provided on the side and end of the main cold air duct. The first air outlet (62) leads to the gradient power amplifier (10), and the second air outlet (63) leads to the radio frequency power amplifier (20) and the spectrometer (30). The temperature control unit is provided on one side of the semiconductor refrigeration unit (40). The semiconductor refrigeration unit (40) is provided at the other end of the main cold air duct (61). The semiconductor refrigeration unit (40) includes a heat dissipation component (41) for sending out hot air and a cold air component (42) for sending in cold air. A semiconductor refrigeration fin (43) is provided between the heat dissipation component (41) and the cold air component (42). Both sides of the semiconductor refrigeration fin (43) are connected to the heat dissipation component (41) and the cold air component (42) respectively through thermal conductive silicone grease (44). The heat dissipation component (41) of the semiconductor refrigeration unit includes a heat dissipation fan (411) and a first heat dissipation fin (412). The first heat dissipation fin (412) is provided on the opposite side of the air outlet end of the heat dissipation fan (411). The first heat dissipation fin (412) is connected to the semiconductor refrigeration fin (43) through thermal conductive silicone grease (44). The cold air component (42) of the semiconductor refrigeration unit includes a cold air fan (421) and a second heat sink (422), the second heat sink (422) is arranged on the opposite side of the air outlet end of the cold air fan (421), and the second heat sink (422) is connected to the semiconductor refrigeration fin (43) through thermal grease (44); the main cold air duct (61) is a flat square tubular shell, the first air outlet (62) and the second air outlet (63) arranged on the main cold air duct (61) are separated by an arc-shaped partition (64) located therebetween, and the arc-shaped partition (64) is provided with an air grille (641) connecting the main cold air duct (61) with the first air outlet (62) and the second air outlet (63); the first air outlet (62) is arranged on one side of the main cold air duct (61), and is formed by a side frame arranged on one side of the main cold air duct (61);The second air outlet (63) is provided at one end of the main cold air duct (61) away from the temperature control unit (50), and is formed by a frame provided at the end. The temperature control unit (50) comprises a plurality of temperature sensors (51), a power switching module (52), an acquisition controller MCU, a controllable constant current source (53) and a fan speed control module (54). The plurality of temperature sensors (51) are provided at the first air outlet (62) and the second air outlet (63). The plurality of temperature sensors (51) and the power switching module (52) are respectively connected to the first air outlet (62) and the second air outlet (63). The acquisition controller MCU is connected, the power switching module (52) is also connected to the controllable constant current source (53) and the fan speed control module (54), the controllable constant current source (53) is connected to the semiconductor refrigeration plate (43), the fan speed control module (54) is connected to the heat dissipation fan (411) and the cooling fan (421), the semiconductor refrigeration unit (40) and the temperature control unit (50) are integrated with the cold air duct unit (60), forming a semiconductor heat dissipation system for a small mobile magnetic resonance device.

2. The semiconductor heat dissipation system for a mobile magnetic resonance device according to claim 1, wherein: The exposed parts around the semiconductor refrigeration plate (43) are covered with heat insulation cotton (45).

3. The semiconductor heat dissipation system for a mobile magnetic resonance device according to claim 1, wherein: The semiconductor refrigeration plate (43), the temperature control unit (50), the heat dissipation fan (411) and the cooling fan (421) of the semiconductor refrigeration unit (40) are respectively connected to an external power source via wires.

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