Fluid cooling device

Abstract

A fluid heat dissipation device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by the adhesive layer. The spray cooling cover includes a fluid inlet and multiple fluid outlets to directly cool the chip by using a working fluid.

Description

Technical Field

[0001] The present invention relates to a fluid cooling device, and in particular to a fluid cooling device for a chip. Background Art

[0002] With the advancement of technology, electronic products are becoming more and more popular, and gradually changing the way many people live or work. As computer computing power increases, the temperature control of electronic components such as CPUs becomes more and more important.

[0003] Electronic components such as CPUs generate heat when running and require proper cooling to achieve optimal performance. In order to keep CPUs and other electronic components running at an ideal temperature, liquid cooling or air cooling is currently commonly used.

[0004] In the current water cooling method, the working fluid flows into the water cooling plate through the pipe, and the water cooling plate contacts the surface metal cover of the electronic components such as the central processing unit to take away the heat generated by the operation of the electronic components such as the central processing unit, thereby reducing the operating temperature of the electronic components such as the central processing unit and improving the working efficiency of the electronic components.

[0005] However, since the CPU and the working fluid are separated by a metal cover that protects the CPU, also known as an integrated heat spreader (IHS), and a water cooling plate, the cooling efficiency is reduced. How to further improve the cooling efficiency of the heat sink will help improve the performance and efficiency of electronic components, which is eagerly anticipated by relevant personnel in the relevant technical field. Summary of the invention

[0006] The invention summary is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This invention summary is not a complete overview of the present disclosure, and it is not intended to point out the important / critical elements of the embodiments of the present invention or to define the scope of the present invention.

[0007] An object of the present invention is to provide a fluid heat dissipation device to effectively improve the heat dissipation efficiency of the heat dissipation device and reduce the operating temperature of electronic components.

[0008] To achieve the above-mentioned purpose, a technical aspect of the present invention is a fluid heat dissipation device including a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by the adhesive layer. The spray cooling cover includes a fluid inlet and a plurality of fluid outlets to directly cool the chip using a working fluid.

[0009] In some implementations, the spray cooling cover includes a cooling cavity and a fluid spray array. The chip is accommodated in the cooling cavity, and the fluid spray array is disposed above the cooling cavity to spray the working fluid onto the surface of the chip.

[0010] In some implementations, the spray cooling cover further includes a plurality of buffer chambers respectively disposed on sides of the cooling chamber.

[0011] In some implementations, the height of the buffer cavity is higher than the height of the cooling cavity.

[0012] In some implementations, the spray cooling cover further includes a plurality of discharge channels, each of which connects the buffer cavity with a corresponding fluid outlet.

[0013] In some implementations, each buffer cavity further includes a buffer cavity outlet to connect to the corresponding discharge channel, wherein the buffer cavity outlet is a rectangular opening.

[0014] In some implementations, the fluid ejection array includes a plurality of nozzles arranged in a row and disposed above the chip.

[0015] In some implementations, each nozzle includes a jet hole and a diffuser nozzle.

[0016] In some implementations, the working fluid directly contacts the surface of the chip, and the working fluid is a two-phase working fluid.

[0017] Therefore, the fluid cooling device can directly spray the working fluid onto the surface of the heat source, such as the surface of a chip such as a central processing unit, to cool it down, thereby effectively controlling the working temperature of the chip and improving the working efficiency of the chip and the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0019] Figure 1 FIG. 4 is an exploded schematic diagram of a fluid heat dissipation device according to an embodiment of the present invention.

[0020] Figure 2 for Figure 1 A three-dimensional perspective schematic diagram of a fluid heat dissipation device.

[0021] Figure 3 for Figure 1 Schematic diagram of the right side of the fluid cooling device.

[0022] Figure 4 for Figure 1 Schematic diagram of a front view of a fluid cooling device.

[0023] Figure 5Schematic diagram of the nozzle of the fluid cooling device.

[0024] The reference numerals are described as follows:

[0025] 100: Fluid cooling device

[0026] 110: Base plate

[0027] 112: Substrate

[0028] 114: Chip

[0029] 120: Adhesive layer

[0030] 122: Opening

[0031] 130: Spray cooling cover

[0032] 132: Fluid inlet

[0033] 134: Fluid outlet

[0034] 201, 202, 203, 204, 205: Fluid flow direction

[0035] 210: Fluid Jet Array

[0036] 212: Nozzle

[0037] 220: Cooling chamber

[0038] 230: Buffer cavity

[0039] 240: Buffer chamber outlet

[0040] 250: Exhaust channel

[0041] 501: Injection fluid direction

[0042] 510: Jet hole

[0043] 520: Diffusion nozzle DETAILED DESCRIPTION

[0044] The following is a detailed description of the embodiments with the accompanying drawings, but the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structural operation is not intended to limit the order of its execution. Any device with equal functions produced by the re-combination of components is within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only and are not drawn in original size. For ease of understanding, the same or similar components in the following description will be described with the same symbols.

[0045] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise noted. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art on the description of the present disclosure.

[0046] In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to one or more. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation methods.

[0047] Secondly, the words "include", "including", "have", "contain", etc. used in this article are all open terms, which mean including but not limited to.

[0048] Figure 1 FIG. 1 is an exploded schematic diagram of a fluid heat dissipation device according to an embodiment of the present invention. Figure 2 A three-dimensional perspective diagram is shown below. Figure 3 As shown in the schematic diagram on the right, Figure 4 is a front view schematic diagram, and Figure 5 A schematic diagram of the nozzle is shown below.

[0049] See also Figure 1 As shown in the figure, the fluid cooling device 100 includes a bottom plate 110, an adhesive layer 120 and a spray cooling cover 130. The bottom plate 110 includes a substrate 112 and a chip 114, and the spray cooling cover 130 is fixed on the bottom plate 110 by the adhesive layer 120. In addition, the spray cooling cover 130 includes a fluid inlet 132 and a plurality of fluid outlets 134, so as to use a working fluid to cool the chip 114.

[0050] The chip 114 is, for example, a central processing unit, or any other electronic component that requires heat dissipation.

[0051] Further reading Figures 2 to 4 As shown in the figure, the spray cooling cover 130 includes a cooling cavity 220, a fluid spray array 210, a plurality of buffer cavities 230, and a plurality of exhaust channels 250. The chip 114 is accommodated in the cooling cavity 220, and the fluid spray array 210 is disposed above the cooling cavity 220 to spray the working fluid onto the surface of the chip 114 for direct cooling.

[0052] In some embodiments, the adhesive layer 120 includes an opening 122 to accommodate the chip 114 in the cooling cavity 220. The adhesive layer 120 is, for example, a packaging material, which may be an epoxy resin, which not only fixes and seals the base plate 110 and the spray cooling cover 130, but also preferably makes the adhesive layer 120 close to the four sides of the chip 114, and can also form a coplanar surface between the surface of the adhesive layer 120 and the upper surface of the chip 114, so that when the working fluid flows through the upper surface of the chip 114, it can more effectively avoid the problem of short circuit caused by the working fluid contacting the circuit on the substrate 112.

[0053] The fluid ejection array 210 includes a plurality of nozzles 212 disposed above the chip 114. The fluid ejection array 210 may be a one-dimensional array of nozzles 212 or a two-dimensional array of nozzles 212, such as one row of nozzles 212 or more than two rows of nozzles 212, without departing from the spirit and scope of the present invention.

[0054] In some embodiments, see also Figure 5 Each nozzle 212 includes a jet hole 510 and a diffuser nozzle 520, so that the working fluid expands in volume after passing through the nozzle 212, so as to reduce the temperature of the working fluid entering the cooling chamber 220. The working fluid disclosed in the present invention is pressurized through the jet hole 510 and then sprayed into the cooling chamber 220. Since the pressure of the diffuser nozzle 520 and the cooling chamber 220 is much lower than that of the jet hole 510, the working fluid enters the low-pressure area of ​​the cooling chamber 220 from the high-pressure area of ​​the fluid inlet 132 to the fluid injection array 210, and the working fluid expands instantly, so that the internal energy of the working fluid decreases, the temperature decreases, and the working fluid diffuses in a trumpet shape along the injection direction 501, and is sprayed toward the surface of the chip 114, so that the working fluid directly contacts the surface of the chip 114, thereby achieving a better cooling effect.

[0055] In some embodiments, the working fluid is a single-phase cooling fluid, such as water or oil. In other embodiments, the working fluid is a two-phase cooling fluid, such as a refrigerant, which can absorb the heat of the chip 114 through phase change, further improving the cooling efficiency of the fluid cooling device 100.

[0056] The buffer chambers 230 are respectively arranged on the sides of the cooling chamber 220, for example, on the two sides of the cooling chamber 220, and the height of the buffer chamber 230 is higher than the height of the cooling chamber 220, which is conducive to the flow of the working fluid from the high-pressure area to the low-pressure area, so as to discharge the working fluid from the discharge channels 250 on both sides and the fluid outlet 134.

[0057] The discharge channel 250 is used to connect the buffer chamber 230 and the corresponding fluid outlet 134, and is located above the buffer chamber 230. In some embodiments, the buffer chamber 230 further includes a buffer chamber outlet 240 connected to the discharge channel 250, and the buffer chamber outlet 240 facilitates the flow of the working fluid and discharges the fluid heat dissipation device 100. In some embodiments, the buffer chamber outlet 240 is a rectangular opening, but the present invention is not limited thereto.

[0058] Specifically, the fluid injection array 210 is connected to the fluid inlet 132, so that the working fluid enters the fluid injection array 210 from the fluid inlet 132 along the fluid flow direction 201. The working fluid is then ejected downward from the nozzle 212 of the fluid injection array 210 along the fluid flow direction 202 to directly contact the chip 114, and then the working fluid further flows along the fluid flow direction 203 to both sides of the cooling cavity 220 to enter the buffer cavity 230. Then, the working fluid flows upward along the fluid flow direction 204 through the buffer cavity outlet 240 and enters the exhaust channel 250 to be discharged from the corresponding fluid outlet 134 along the flow direction 205.

[0059] In view of this, the fluid cooling device can directly spray the working fluid onto the surface of the heat source, such as the surface of a chip such as a central processing unit, to cool it down, thereby effectively controlling the operating temperature of the chip and improving the working efficiency of the chip and the electronic device.

[0060] The above is only the preferred embodiment of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. That is, all simple equivalent changes and modifications made according to the claims of the present invention and the content of the invention description are still within the scope of the patent of the present invention. In addition, any embodiment or claim of the present invention is not required to achieve all the purposes, advantages or features disclosed by the present invention. In addition, the abstract and the title are only used to assist in searching patent documents, and are not used to limit the scope of rights of the present invention. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name the name of the element or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

[0061] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.

Claims

1. A fluid heat dissipation device, characterized in that: Include: A bottom plate, comprising a substrate and a chip; an adhesive layer; as well as A spray cooling cover is fixed on the base plate by the adhesive layer, wherein the spray cooling cover comprises a fluid inlet and a plurality of fluid outlets to directly cool the chip by a working fluid, wherein the spray cooling cover further comprises: a cooling chamber, wherein the chip is accommodated in the cooling chamber; a fluid spray array, disposed above the cooling chamber to spray the working fluid onto the chip surface; A plurality of buffer chambers are respectively arranged on the sides of the cooling chamber; as well as A plurality of discharge channels are respectively connected to the plurality of buffer chambers and the corresponding plurality of fluid outlets, wherein the fluid outlets are arranged opposite to the fluid inlets, and the buffer chambers and the discharge channels are respectively arranged parallel to the fluid jet arrays.

2. The fluid heat dissipation device according to claim 1, characterized in that: The heights of the plurality of buffer chambers are higher than that of the cooling chamber.

3. The fluid heat dissipation device according to claim 2, characterized in that: Each of the plurality of buffer chambers further comprises a buffer chamber outlet to connect to the corresponding plurality of discharge channels.

4. The fluid heat dissipation device according to claim 3, characterized in that: The buffer chamber outlet is a rectangular opening.

5. The fluid heat dissipation device according to claim 1, characterized in that: The fluid ejection array comprises a plurality of nozzles arranged in a row and disposed above the chip.

6. The fluid heat dissipation device according to claim 5, characterized in that: Each of the plurality of nozzles includes a jet hole and a diffusion nozzle.

7. The fluid heat dissipation device according to claim 1, characterized in that: The working fluid directly contacts the surface of the chip, and the working fluid is a two-phase working fluid.

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